JPH0985695A - Parts feeder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the time required for feeding of a substrate to a blanking mechanism and discharging of blank residual parts of the substrate. SOLUTION: A feeding mechanism 34 for feeding a substrate one by one from a magazine 31 is provided and the substrate is directly conveyed to a conveyance position of a conveyer mechanism 35. The conveyer mechanism 35 for conveying the substrate from the conveyance position to a blanking position. A pair of conveyer belts 45 of the conveyer mechanism 35 are so constituted as to be adjusted their width. A raising/lowering cylinder 52 for vertically moving the conveyer mechanism 35 is provided. A blanking mechanism 36 for blanking a unit part from the substrate in a blanking position is provided. A bottom form conveyance mechanism 37 for moving the bottom form 53 of the blanking mechanism 36 to a part feed position is provided. A discharge hole 58 for discharging blank residual parts and a collection box 59 are provided on a mount 33. When the unit part is blanked, the blank residual parts are left in the conveyer belt 45 and the space of the conveyer belt 45 is widened in moving the bottom form 53 so that the blank residual parts are made to fall in the collection box 59.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component supply device that punches a unit component into a predetermined shape and supplies it to a component supply position from a substrate on which a semiconductor chip is mounted.

[0002]

In recent years, in the component mounting technology, a technique has been developed in which a substrate on which a semiconductor chip is mounted is punched into a predetermined shape to obtain a unit component, and the unit component is mounted on a printed circuit board or the like. There is. In this case, as shown in FIG. 2, the unit component 1 is configured by mounting a semiconductor chip 3 such as an IC on a substrate 2, but here, for example, three semiconductor chips are mounted on one substrate 2. 3 are mounted, and three unit parts 1 are obtained by punching.

FIG. 10 shows the structure of a conventional component supply device. That is, a large number of the substrates 2 are accommodated in a vertically long box-shaped magazine 11 having front and rear openings, and the magazine 11 is provided in a magazine lifting device 12 arranged on the front side in the drawing. It is designed to be removable. This magazine elevating device 12 has a uniaxial table 13 for moving the magazine 11 in the Z direction (up and down direction), and a substrate 2 in the magazine 11 to a carry-out table 14.
It is configured to include a pusher 15 and the like for sending out one by one.

Then, in the middle of the figure, the substrate 2 is X-shaped.
A transfer conveyor 16 for transferring in the direction is provided, and two pick & place units 17 and 18 are provided above the transfer conveyor 16 so as to be movable in the Y direction. Of these, the first pick and place unit 17 is
The substrate 2 sent out to the carry-out table 14 is transferred to the conveyer 1
The second pick-and-place unit 18 is carried in to the position before 6, and the second pick-and-place unit 18 carries the substrate 2 carried to the innermost position of the carrying conveyor 16 onto the lower mold 19 in the subsequent stage.

A punching mechanism 20 is provided on the rear side in the drawing, and is composed of the lower die 19 and an upper die 22 which is moved along a guide post 21 fixed to the base surface. The unit component 1 is punched from the substrate 2 supplied on the lower die 19. And the lower mold 1
9 is moved to a component supply position farther from the transfer mechanism 23, and at the component supply position, the unit component 1 is taken out one by one by the component take-out head 24. When the three unit parts 1 are taken out, the punching residual portion 2a of the substrate 2 is removed by the ejection cylinder 25 (see FIG. 2).
Is discharged, and thereafter, the lower mold 19 is returned to the original position and the above operation is repeated.

However, in such a conventional structure, since the substrate 2 is supplied to the lower die 19 by using the second pick and place unit 18, it takes time to deliver the substrate 2 to the punching mechanism 20. It takes more
Since the residual punching portion 2a of the substrate 2 is discharged after all the unit parts 1 are carried out, the residual punching portion 2a is formed.
It took a long time to discharge, and the work efficiency was poor as a whole.

The present invention has been made in view of the above circumstances, and an object thereof is to shorten the time required to supply the substrate to the punching mechanism and discharge the remaining portion of the substrate for punching, thereby improving work efficiency. It is to provide a component supply device capable of performing the above.

[0008]

According to another aspect of the present invention, there is provided a component supply device for punching a unit component into a predetermined shape from a substrate on which a semiconductor chip is mounted and supplying the unit component to a component supply position. A pair of conveyor belts for supporting and feeding both side edge portions, a conveyor mechanism for conveying the substrate from a carry-in position to a punching position, and the punching position without interfering with the conveyor mechanism at the punching position. A punching mechanism for punching the unit component from the substrate conveyed to the punching position, comprising a lower die movable between the component feeding position and an upper die that comes into contact with and separates from the lower die at the punching position. A lower die transfer mechanism for moving the unit parts punched out by the punching mechanism to a component supply position while being supported by the lower die; When the component is moved to the component supply position, by moving the conveyor belts in a mutually opening direction, a residual portion discharging means for dropping and discharging the punching residual portion of the substrate supported by the conveyor belt, The invention is characterized in that it is provided (the invention of claim 1).

In this case, the residual portion discharging means may be configured to drop the punching residual portion of the substrate while the conveyor belt is driven (the invention of claim 2). Further, it is more effective if the punching of the unit parts by the punching mechanism is performed while the substrate is supported by the conveyor belt (the invention of claim 3). Furthermore, a plurality of unit components may be punched simultaneously from one substrate and supplied to the component supply position (the invention of claim 4). The upper die of the punching mechanism is supported on the ceiling portion, and the lower die transfer mechanism is configured to freely move the lower die in the horizontal direction so that unit parts can be supplied to a plurality of component supply positions. It is also possible (the invention of claim 5).

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to FIGS. First, as shown in FIG. 2, the unit component 1 is configured by mounting a semiconductor chip 3 such as an IC on a substrate 2 on which predetermined wiring and the like are formed. For example, 3 on the substrate 2
The semiconductor chips 3 are mounted, and the three unit parts 1 are punched into a predetermined shape to be obtained.

Further, as shown in FIG. 3, the substrate 2 is
A large number of magazines are accommodated and provided at a predetermined pitch in a vertical direction in a magazine 31 having a vertically long box shape with both right and left sides opened. At this time, each of the substrates 2 is slidably supported on both side edge portions in groove portions 31a formed at equal intervals on both front and rear inner side walls of the magazine 31.
The rest of the board 2 on which the unit parts 1 have been punched out is a punching residual portion 2a (see FIG. 2), which is collectively disposed as appropriate.

FIG. 1 shows a component supply device 32 according to this embodiment.
Shows the overall configuration of. The component supply device 32 is roughly divided into a magazine 33 and a magazine 33 on a base 33.
A feeding mechanism 34 for feeding the substrates 2 from 1 to the loading position one by one, a conveyor mechanism 35 for transporting the loaded substrates 2 to the punching position, and a punching mechanism 36 for punching the unit parts 1 from the substrates 2 transported to the punching position. , Punched unit parts 1
It is configured to include a lower mold transfer mechanism 37 that transfers (a lower mold described later) to a component supply position.

The delivery mechanism 34 is provided at the left end side on the pedestal 33, and as shown in FIGS. 4 and 5,
A cradle 38 on which the magazine 31 is placed
The pedestal 38 and the magazine 31 are provided with a uniaxial table 39 for freely moving in the Z direction (vertical direction), and the substrate 2 in the magazine 31 at a predetermined height position on the pedestal 33 will be described later. Conveyor mechanism 3
The pusher 40 for feeding the sheets one by one is provided at the carry-in position of No. 5. As shown in FIG. 5, the pusher 40 is configured so that the driving force of the rotary solenoid 41 is transmitted via a link mechanism 42 and moved in the Y direction (the left and right directions in FIGS. 1 and 5).

The conveyor mechanism 35 is provided on the right side of the delivery mechanism 34, and as shown in FIGS. 6 and 7, is provided with a pair of front and rear conveyor units 43. This conveyor unit 43 is provided with pulleys (not shown) located at both left and right ends on a side plate 44 which is long in the left-right direction, and a conveyor belt 45 is hung between these pulleys and one pulley (left side in the drawing) is rotated. The drive motor 46 is provided. As a result, a pair of front and rear conveyor belts 45 form a conveyance path that supports and feeds both side edge portions of the substrate 2 in the left-right direction, and the left end portion of the conveyance path is the carry-in position and the right end portion. Is the punching position. At this time, a stopper 47 (see FIG. 6) for stopping the substrate 2 is provided at the right end of the one side plate (front side in the drawing) 44.

In this embodiment, a mechanism is provided for adjusting the distance between the pair of conveyor belts 45 (conveyor unit 43) in the front-rear direction (width of the conveying path). That is, as shown in FIG. 7, a width adjusting motor 48 is attached to the conveyor unit 43 (side plate 44) on one side (front side), and the driving force of the motor 48 is the pulley 49,
It is adapted to be transmitted to the ball screw 51 (see FIG. 6) via 50. The other (back side) conveyor unit 4
A nut (not shown) screwed onto the ball screw 51 is attached to the 3 (side plate 44). Thus, the rotation of the ball screw 51 accompanying the driving of the width adjusting motor 48 causes the separation position of the other (back side) conveyor unit 43 from the one (front side) conveyor unit 43, and thus the pair of conveyor belts 45. The spacing is adjusted.

Further, the conveyor mechanism 35 constructed as described above can be moved up and down as a whole by a lifting cylinder 52 (see FIGS. 1 and 7) provided inside the pedestal 33. There is. At this time, the raised position of the conveyor mechanism 35 is the transport height position, and the lowered position is the punching work height position. In this conveyor mechanism 35, the mechanical parts such as a motor are centrally arranged at the left end, and the right part is such that only the transport path part (side plate 44 and conveyor belt 45) is lifted from the upper surface of the pedestal 33. It is located.

As shown in FIG. 1, the punching mechanism 36 is provided at the right side portion (the punching position) of the conveyor mechanism 35 and is provided on the upper surface of the pedestal 33. And a mold driving mechanism 55 including a motor for performing mold matching and mold opening by vertically moving the upper mold 54. At this time, the upper mold 54 is vertically movably supported by a guide post 57, which is provided in a ceiling-like state on a ceiling 56 provided above the pedestal 33, so that the mold driving mechanism 55 is provided. It is designed to be driven up and down by.

The lower die 53 is punched out directly below the upper die 54 by the lower die transfer mechanism 37 composed of, for example, a uniaxial table, and the component supply position at the right end of the gantry 33 (indicated by an imaginary line in FIG. 1). (Indicated by) is to be moved between. In this case, the lower die 53 is located at the lower part of the conveyance path on the right side of the conveyor mechanism 35 at the punching position.
Is at the elevated transfer height position, the transport path is located above the lower die 53, and when the conveyor mechanism 35 is at the lowered punching work height position, the upper surface height of the conveyor belt 45 is lower than the lower die 53. It is configured to match the height of the chase surface. Further, at this time, the conveyor mechanism 35
Are configured so as not to interfere with the lower mold 53.

A discharge hole 58 (shown by a broken line in FIG. 1) is provided in a portion of the upper surface of the pedestal 33 located below the punching position, and the discharge hole is provided inside the pedestal 33. Located below 58, the punching residual portion 2a
A collecting box 59 for collecting the items is arranged so that it can be taken in and out. When the lower die 53 is located at the punching position, the discharge hole 58 is closed by the lower die 53,
The lower die 53 is opened when the lower die 53 moves to the component supply position, and the punching residual portion 2a can be discharged into the collection box 59.

Further, the component supply device thus configured is provided with a control device (not shown) including a microcomputer and the like, and the control device controls each of the above-mentioned mechanisms in accordance with a predetermined program. The operation of punching out the unit component 1 and supplying it to the component supply position is automatically and repeatedly executed.

At this time, as will be described in detail later in the description of the operation, the control device controls the width adjusting motor 48 so that the distance between the pair of conveyor belts 45, 45 can be adjusted when the substrate 2 is conveyed. After the punching of the unit component 1 is completed, the lower die 53 is formed according to the width dimension of the substrate 2.
Is configured to move the conveyor belts 45, 45 in a direction to open each other (actually only one moves) to widen the gap and drop the punching residual portion 2a when the component is moving to the component supply position. Has been done. Further, in this embodiment, the interval between the conveyor belts 45, 45 is widened while the conveyor belts 45 are being driven. Now, from this control device and the width adjusting motor 48,
The residual portion discharging means is configured.

Next, the operation of the above configuration will be described. The above-mentioned mechanisms are controlled by the control device, and the punching work is executed as follows. That is, first, in the delivery mechanism 34, the pusher 40 is operated by the drive of the rotary solenoid 41, and the pusher 40 is positioned at the same height as the pusher 40 in the magazine 31 set on the receiving stand 38.
The substrates 2 are extruded to the right and loaded into the loading position of the conveyor mechanism 35.

At this time, the conveyor mechanism 35 is located at the upper conveyance height position, the interval between the conveyor belts 45, 45 corresponds to the substrate 2, and the substrate pushed out by the pusher 40. 2 slides so as to be in a mounted state in which both side edge portions are supported by the conveyor belts 45, 45 on both sides. When the feeding operation is completed, the pusher 40 returns to the original position and the magazine 31 is moved up (or down) by one pitch by driving the uniaxial table 39.

Next, in the conveyor mechanism 35, the drive motors 46, 46 are driven to convey the conveyor belts 45, 45.
Is moved, and thus the substrate 2 carried into the carry-in position is carried to the punching position. At this time, the front end of the substrate 2 comes into contact with the stopper 47, so that the further rightward movement is restricted and the substrate 2 is stopped at the punching position. When the substrate 2 is conveyed to the punching position, the drive motors 46, 46 are stopped and the lifting cylinder 52 is moved.
Is driven to lower the conveyor mechanism 35 to the punching work height position.

In this state, the lower die 53 is stopped at the punching position, the substrate 2 has both side edges supported by the conveyor belts 45, 45, and the central portion thereof has the lower die 5 at its center.
It becomes the form mounted on 3. Then, from this state, the upper die 54 is lowered by driving the die driving mechanism 58, and the three unit parts 1 are punched. When the punching is completed, the upper mold 54 is raised, and subsequently the lifting cylinder 52 is driven to raise the conveyor mechanism 35 to the conveyance height position.
During the above-described operation, the conveyor mechanism 35 is operated by the lower die 5
3 and the upper mold 54 are not interfered with.

With this, the punched 3 is placed on the lower die 53.
The individual unit parts 1 remain, and only the punching residual portion 2a is lifted together with the conveyor belts 45, 45. Then, by driving the lower die transfer mechanism 37, the lower die 53 on which the three unit components 1 are placed is moved to the component supply position. At the component supply position, the unit heads 1 are picked up by the suction head 60 one by one and transferred to the subsequent component mounting apparatus part. When all three unit parts 1 are transferred, the lower die 53 is moved to the original punching position.

On the other hand, in conjunction with such movement of the lower die 53 to the component supply position, the conveyor mechanism 35 drives the width adjusting motor 48 to convey the conveyor belts 45 and 4.
5 is widened, and the drive motors 46, 46 feed and drive the conveyor belts 45, 45. As a result, the punching residual portion 2a remaining on the conveyor belts 45, 45 falls, passes through the discharge hole 58, and falls into the collecting box 59 to be collected. At this time, if the conveyor belts 45, 45 are not driven to be driven, the punching residual portion 2a may remain on the conveyor belt 45. To be dropped into.
After that, the interval between the conveyor belts 45, 45 is returned to the original state, and a series of operations from the delivery of the substrate 2 by the delivery mechanism 34 is repeated.

According to the present embodiment as described above, the substrate 2 is directly moved to the carry-in position of the conveyor mechanism 35 by the delivery mechanism 34.
Then, the substrate 2 can be supplied to the punching mechanism 36 (lower die 53) while the substrate 2 is held by the conveyor mechanism 35. Thus, unlike the conventional one in which the pick-and-place units 17 and 18 are used to transfer the substrate 2 from the carry-out table 14 to the transfer conveyor 16 and further from the transfer conveyor 16 to the lower mold 19, the substrate 2 The work of delivery can be omitted, and the work time can be shortened accordingly.

Then, unlike the prior art in which the punching residual portion 2a after the punching of the substrate 2 is moved to the component feeding position together with the unit component 1 by the lower die 19, only the unit component 1 is transferred to the component feeding position. Since the punching residual portion 2a is left on the conveyor belt 45 as it is, the punching residual portion 2a can be discharged at the same time as the unit head 1 is carried out by the suction head 60. The time required for discharging can also be shortened. Further, the discharging operation of the punching residual portion 2a may be a very simple operation of widening the interval between the conveyor belts 45, 45, and the configuration therefor may be simply completed.

As a result, the working time can be greatly shortened and the working efficiency can be greatly improved as compared with the conventional one. Moreover, particularly in the present embodiment, the discharging operation of the punching residual portion 2a is performed while the conveyor belts 45, 45 are being driven and driven.
It is also possible to obtain an advantage that the punching residual portion 2a can be surely dropped.

FIGS. 8 and 9 show other embodiments of the present invention which are different from each other. In the embodiment shown in FIG. 8, the suction head 61 has a plurality of suction nozzles, for example, three suction nozzles, and a plurality of (three) unit parts 1 transferred to the component supply position are collectively collected by the suction head 61. I try to carry it out. According to this, the time required to carry out the unit component 1 can be shortened, and the working efficiency can be further improved.

In the embodiment shown in FIG. 9, the lower die transfer mechanism 62 for moving the lower die 53 is composed of an XY table, and the lower die 53 can be freely moved in the horizontal direction. At this time, since the guide post 57 that supports and guides the upper mold 54 is provided in a suspended state, the guide post 57 does not interfere with the movement of the lower mold 53. According to this, the component supply positions can be set at a plurality of locations (arbitrary locations), and the work efficiency can be improved.

[0033]

As is apparent from the above description, according to the component supplying apparatus of the present invention, the substrate is directly carried to the punching position by the conveyor mechanism, and the discharge of the punching residual portion is performed by adjusting the width of the conveyor belt. Since it is performed, it is possible to shorten the time required to supply the substrate to the punching mechanism and discharge the remaining portion of the punching of the substrate, and it is possible to improve work efficiency, which is an excellent practical effect. is there.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention, and is a front view of the entire component supply device.

FIG. 2 is a perspective view showing a punched state (b) of a board (a) and unit parts.

[Figure 3] Side view of the magazine

FIG. 4 is a side view of a delivery mechanism portion.

FIG. 5 is a plan view of a delivery mechanism portion.

FIG. 6 is a plan view of a conveyor mechanism portion.

FIG. 7 is a side view of the conveyor mechanism portion.

FIG. 8 is a view corresponding to FIG. 1 showing another embodiment of the present invention.

FIG. 9 is a view corresponding to FIG. 1 showing another different embodiment.

FIG. 10 is a perspective view of a conventional component supply device.

[Explanation of symbols]

In the drawings, 1 is a unit component, 2 is a substrate, 2a is a punching residual portion, 3 is a semiconductor chip, 31 is a magazine, 32 is a component supply device, 33 is a mount, 34 is a delivery mechanism, 35 is a conveyor mechanism, and 36 is Punching mechanism, 37, 62 lower die transfer mechanism, 40 pusher, 43 conveyor unit, 44
Is a side plate, 45 is a conveyor belt, 46 is a drive motor, 4
7 is a stopper, 48 is a width adjusting motor, 52 is a lifting cylinder, 53 is a lower mold, 54 is an upper mold, 55 is a mold driving mechanism,
56 is a ceiling part, 57 is a guide post, 58 is a discharge hole, 5
9 is a collection box, and 60 and 61 are suction heads.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuhide Inoue, Mie-gun, Mie-gun, Asahi-cho 2121 Nobu Osamu Company Toshiba Mie factory

Claims (5)

[Claims] 1. A substrate on which a semiconductor chip is mounted,
The unit parts are punched into a predetermined shape and supplied to the component supply position, and a pair of conveyor belts for supporting and feeding both side edges of the substrate are provided, and the substrate is conveyed from the carry-in position to the punching position. And a lower die that does not interfere with the conveyor mechanism at the punching position and is movable between the punching position and the component supply position, and contact with and separate from the lower die at the punching position. A punching mechanism that includes an upper die and punches the unit component from the substrate conveyed to the punching position, and moves the unit component punched by the punching mechanism to the component supply position while being supported by the lower die. And a lower die transfer mechanism for moving the conveyor belt in a mutually opening direction when the lower die transfer mechanism moves the lower die to the component supply position. Accordingly, the component supply device is provided with: a residual portion discharging unit that drops and discharges the punching residual portion of the substrate supported by the conveyor belt. 2. The component supply device according to claim 1, wherein the residual portion discharging means is configured to drop the punching residual portion of the substrate while the conveyor belt is driven. 3. The punching of the unit parts by the punching mechanism comprises:
The component supply device according to claim 1, wherein the component supply device is executed while the substrate is being supported by a conveyor belt. 4. A plurality of unit parts are simultaneously punched from a single substrate and supplied to a part supply position, and the plurality of unit parts are simultaneously carried out from the part supply position. The component supply device according to any one of claims 1 to 3, wherein: 5. The upper die of the punching mechanism is supported by the ceiling portion, and the lower die transfer mechanism enables the lower die to move freely in the horizontal direction to supply unit parts to a plurality of parts supply positions. The component supply device according to any one of claims 1 to 4, wherein