JP2017143161A - Device having backing-up tool and backing-up tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To disclose a technique for easily changing an arrangement of a backup pin.SOLUTION: A device comprises: a plurality of backup pins; a backing-up tool which can switch a holding state of holding the plurality of backup pins and a releasing state of releasing the plurality of backup pins; a back-up plate which is detachable the plurality of backup pins; and a switching mechanism which switches a contacting state of being oppositely contacted the backing-up tool and the back-up plate and a separation state of separating them. In the contacting state, the backing-up tool can be switched to the holding state and the releasing state. When the backing-up tool is switched to the releasing state from the holding state, the plurality of backup pins held by the backing-up tool is constructed so as to be attached to the back-up plate. When the backing-up tool is switched to the holding state from the releasing state, the plurality of backup pins attached to the back-up plate is recovered by the backing-up tool.SELECTED DRAWING: Figure 3

Description

  The present specification relates to a device for supporting a supported object by a backup pin, and a backup jig for attaching the backup pin to the backup plate or recovering from the backup plate.

  As an apparatus for supporting an object to be supported by a backup pin, for example, an apparatus for mounting a component on a substrate is known. In an apparatus for mounting a component on a substrate, a backup pin that supports the substrate from the back side may be used to prevent the substrate from bending when the component is mounted on the substrate. Such a backup pin is attached to the backup plate, and the arrangement with respect to the backup plate differs depending on the size and thickness of the substrate to be supported. The placement of the backup pin may be performed manually by an operator or automatically using an apparatus depending on the type of substrate.

  Patent Document 1 discloses a tweezer plate (herein referred to as a backup plate) on which a backup pin is erected, a backup table, and a backup pin lifting / lowering device (herein referred to as a switching mechanism). A component mounting machine is disclosed. In this component mounting machine, a backup pin is erected on the tweezer plate outside the apparatus, and this is mounted on a unit carrier and conveyed inside the component mounting machine. When the tweezer plate on which the backup pin is erected is conveyed to the component mounting position (above the backup table), the backup pin lifting device raises the backup table with respect to the tweezer plate. Thereby, the backup plate receives the tweezers plate from the unit carrier. Thereafter, the back-up pin erecting device makes the back-up pin erected on the tweezer plate abut on the back surface of the substrate, thereby supporting the substrate from the back side.

JP 2001-274600 A

  In the component mounting machine disclosed in Patent Document 1, a tweezer plate with standing backup pins is held inside the apparatus. As described above, the arrangement of the backup pins with respect to the tweezer plate differs depending on the size and thickness of the substrate to be supported. For this reason, when changing the arrangement of the backup pins, the tweezer plate must be conveyed outside the apparatus, the arrangement of the backup pins relative to the tweezer plate must be changed outside the apparatus, and then the tweezer plate must be conveyed into the apparatus. As a result, there is a problem that it takes time to rearrange the backup pins. In order to shorten the time required for rearranging the backup pins, a method of preparing a plurality of tweezer plates can be considered. However, such a method has a problem that a plurality of tweezer plates that require dimensional accuracy must be prepared. The present specification discloses a technique capable of easily changing the arrangement of backup pins in an apparatus that supports a supported object with backup pins.

  An apparatus disclosed in this specification includes a backup jig that can be switched between a plurality of backup pins, a holding state that holds a plurality of backup pins, and a release state that releases a plurality of backup pins, and a plurality of backup pins. A backup plate that can be switched between an attached mounting state and a non-mounting state in which a plurality of backup pins are not attached, a proximity state in which the backup jig and the backup plate face each other, and a backup treatment. And a switching mechanism for switching to a separated state in which the tool and the backup plate are separated from each other. The backup jig can be switched between a holding state and a releasing state when it is brought into the proximity state by the switching mechanism. When the backup jig is changed from the holding state to the released state in the proximity state, a plurality of backup pins held by the backup jig are attached to the backup plate. Further, when the backup jig is changed from the released state to the holding state in the proximity state, a plurality of backup pins attached to the backup plate are collected by the backup jig.

  The apparatus includes a backup jig that can be switched between a holding state for holding the backup pin and a release state for releasing the backup pin. When the backup jig is switched between the holding state and the released state in a state of being close to the backup plate (close state), the backup pin can be attached to and recovered from the backup plate. For this reason, it is not necessary to prepare a plurality of backup plates, and the backup pins can be prepared for rearrangement using the backup jig without transporting the backup plates outside the apparatus. Therefore, it is possible to easily rearrange the backup pins as compared with the conventional case.

  The backup jig disclosed in this specification attaches a plurality of backup pins to a backup plate that supports the substrate from below, and collects the plurality of backup pins from the backup plate to which the plurality of backup pins are attached. The backup jig has a plurality of first holes, and each of the plurality of first holes is inserted into a plurality of first holes and a jig plate from which a plurality of backup pins can be attached and detached. A holding device that switches between a holding state that holds a plurality of backup pins and a release state that releases a plurality of backup pins inserted through the plurality of first holes is provided. The holding device is configured to be able to switch all of the plurality of backup pins inserted through the plurality of first holes between the holding state and the released state in a lump.

  The backup jig includes a jig plate to which the backup pin can be attached and detached, and a holding device that can hold and release the backup pin with respect to the jig plate. And the backup jig | tool can attach and collect | recover the backup pin with respect to a backup plate collectively by providing these. For this reason, it is possible to easily rearrange the backup pins with respect to the backup plate without requiring a plurality of backup plates as in the above-described apparatus.

It is a side view which shows typically the structure of the component mounting machine of Example 1. FIG. In the component mounting machine of Example 1, it is a perspective view which shows the holding state in which the backup jig hold | maintains a backup pin. It is a perspective view which shows typically the structure of the board | substrate backup apparatus of the component mounting machine of Example 1. FIG. In the component mounting machine of Example 1, it is a side view which shows the structure of the proximity | contact state in which the backup jig | tool and the backup plate adjoin. In the component mounting machine of Example 1, it is a side view which shows the structure of the separation state in which the backup jig and the backup plate are separated. 6A is a cross-sectional view showing a state where the backup pin is inserted into the backup jig of Example 1 (holding state), and FIG. 6B is a state where the backup pin is inserted into the backup jig of Example 1 ( It is a top view which shows a holding state. It is sectional drawing which shows the state (release state) by which the backup pin was penetrated by the backup jig | tool of Example 1. FIG.

  The main features of the embodiments described below are listed. The technical elements described below are independent technical elements and exhibit technical usefulness singly or in various combinations, and are limited to the combinations described in the claims at the time of filing. It is not a thing.

(Characteristic 1) The apparatus disclosed in this specification may be a mounting machine that mounts components on a substrate supported by a plurality of backup pins attached to a backup plate. The backup jig holds a plurality of backup pins on the back surface thereof, and the backup plate is disposed at a position facing the back surface of the substrate when the substrate is disposed at a component mounting position for mounting the component on the substrate. May be. According to such a structure, a board | substrate can be appropriately supported from the back surface by the backup plate to which the backup pin was attached.

(Feature 2) The apparatus disclosed in the present specification may further include a transport device that transports the board to the component mounting position. The transfer device can transfer the backup jig to the component mounting position, and the switching mechanism may include a lifting device that raises and lowers the backup plate with respect to the backup jig transferred to the component mounting position. Good. The elevating device may switch the proximity state and the separation state by raising and lowering the backup plate. According to such a configuration, the backup jig can be transported to the component mounting position in the same manner as the substrate. Moreover, the backup pin can be attached to and recovered from the backup plate by moving the backup plate up and down relative to the backup jig.

(Characteristic 3) In the backup jig disclosed in the present specification, the backup plate may be movable between a proximity position facing and close to the jig plate and a separation position separating from the jig plate. Good. The plurality of backup pins attached to the backup plate may be configured to be inserted into the plurality of first holes of the jig plate when the backup plate is located at the close position. The holding device can hold all of the plurality of backup pins inserted into the plurality of first holes when the backup plate to which the plurality of backup pins are attached moves from the separated position to the adjacent position. Good. The holding device is held in the plurality of first holes when the backup plate is moved from the separated position to the close position in a holding state in which the plurality of backup pins are held in the plurality of first holes of the jig plate. Further, it may be possible to release all of the plurality of backup pins at once. According to such a configuration, it is possible to reduce the time required for attaching and collecting the backup pin.

(Feature 4) In the backup jig disclosed in the present specification, the holding device includes a holding plate that contacts the jig plate, and a moving device that moves the holding plate in the first direction along the surface of the jig plate. You may have. The holding plate may have a plurality of second holes having the same shape as the plurality of first holes at positions corresponding to the plurality of first holes of the jig plate. The moving device moves the holding plate in the first direction when the backup plate is in the proximity position, so that the centers of the plurality of second holes are shifted from the centers of the plurality of first holes in plan view. The holding state for holding the plurality of backup pins with respect to the tool plate and the centers of the plurality of second holes coincide with the centers of the plurality of first holes in plan view to release the plurality of backup pins for the jig plate. You may switch to the release state. According to such a configuration, the backup pin can be suitably held on the backup jig by a simple configuration using the jig plate and the holding plate.

  Hereinafter, the component mounter 10 according to the first embodiment will be described. The component mounter 10 is a device for mounting the electronic component 4 on the circuit board 2. The component mounter 10 is also referred to as a surface mounter or a chip mounter. Usually, the component mounting machine 10 is provided together with a solder printer, other component mounting machines, and a board inspection machine, and constitutes a series of mounting lines.

  As shown in FIG. 1, the component mounting machine 10 includes a plurality of component feeders 12, a feeder holding unit 14, a mounting head 16, an imaging unit 20, and a moving mechanism 18 that moves the mounting head 16 and the imaging unit 20. , A transfer device 26, an operation panel 28, a control device 30, and a substrate backup device 32.

  Each component feeder 12 accommodates a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holding portion 14 and supplies the electronic component 4 to the mounting head 16. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 is, for example, a tape feeder that accommodates a plurality of electronic components 4 in a wound tape shape, a tray feeder that accommodates a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. Any of the bulk type feeders that accommodates the ink at random.

  The moving mechanism 18 moves the mounting head 16 and the imaging unit 20 between the component feeder 12 and the circuit board 2. The moving mechanism 18 of the present embodiment is an XY robot that moves the moving base 18a in the X direction and the Y direction. The moving mechanism 18 includes a guide rail that guides the moving base 18a, a moving mechanism that moves the moving base 18a along the guide rail, a motor that drives the moving mechanism, and the like. The moving mechanism 18 is disposed above the component feeder 12 and the circuit board 2. The mounting head 16 and the imaging unit 20 are attached to the moving base 18a. The mounting head 16 and the imaging unit 20 are moved above the component feeder 12 and above the circuit board 2 by the moving mechanism 18.

  The mounting head 16 includes a suction nozzle 6 that sucks the electronic component 4. The suction nozzle 6 can be attached to and detached from the mounting head 16. The suction nozzle 6 is attached to the mounting head 16 so as to be movable in the Z direction (vertical direction in the drawing). The suction nozzle 6 is configured to move up and down in the vertical direction by an actuator (not shown) accommodated in the mounting head 16 and to suck the electronic component 4. In order to mount the electronic component 4 on the circuit board 2 by the mounting head 16, first, the mounting head 16 is moved to the component suction position by the moving mechanism 18. Next, the suction nozzle 6 is moved downward until the lower surface (suction surface) of the suction nozzle 6 contacts the electronic component 4 housed in the component feeder 12. Next, the electronic component 4 is sucked by the suction nozzle 6 and the suction nozzle 6 is moved upward. Next, the mounting mechanism 16 is moved to the component mounting position by the moving mechanism 18 and positioned with respect to the circuit board 2. Next, the electronic component 4 is mounted on the circuit board 2 by lowering the suction nozzle 6 toward the circuit board 2.

  The imaging unit 20 is attached to the moving base 18a. For this reason, when the mounting head 16 moves, the imaging unit 20 also moves together. The imaging unit 20 includes a camera support unit 22 and a camera 24. The camera support 22 is attached to the moving base 18a. A camera 24 is attached to the camera support portion 22. The camera 24 is disposed on the side of the suction nozzle 6 (the Y direction in the drawing). The camera 24 includes a camera control device (not shown) that controls the operation of the camera 24. The operation of the camera 24 is controlled by a camera control device.

  The transport device 26 is a device that carries the circuit board 2 and the backup jig 36 (described later) into the component mounting machine 10, transports them to the component mounting position, positions them, and carries them out of the component mounting machine 10. The transport device 26 of this embodiment drives, for example, a pair of belt conveyors, a support device (not shown) that is attached to the belt conveyor and supports the circuit board 2 and the backup jig 36 from below, and the belt conveyor. It can be configured by a driving device. The circuit board 2 and the backup jig 36 are conveyed in the X direction of the drawing. The operation panel 28 is an input device that receives an instruction from an operator.

  The control device 30 includes a computer having a CPU, a ROM, and a RAM. Although not shown, the component feeder 12, the mounting head 16, the moving mechanism 18, the operation panel 28, and a board backup device 32 (described later) are communicably connected to the control device 30. The control device 30 controls these components (12, 16, 18, 28, 32, etc.) to control the mounting of the electronic component 4 on the circuit board 2 and the substrate backup device 32.

  The substrate backup device 32 includes a plurality of backup pins 34, a backup jig 36, a backup plate 38, and a switching mechanism 40.

  The backup pin 34 is a member for supporting the circuit board 2 from the back surface. The circuit board 2 is supported by the backup pins 34, thereby preventing the circuit board 2 from being bent when components are mounted on the circuit board 2. The backup pin 34 has an upper end 34a that can be brought into contact with the circuit board 2, and a lower end 34b that is detachably attached to the upper surface of the backup plate 38 (see FIGS. 6 and 7). The diameter of the upper end portion 34 a of the backup pin 34 is smaller than the diameter of the lower end portion 34 b of the backup pin 34. The backup pin 34 can be attached to the backup plate 38 using, for example, magnetic force. That is, a magnet is disposed at the lower end 34b of the backup pin 34, and the backup plate 38 is formed of a magnetic material. And you may make it attach both using the magnetic force which acts between both.

  As shown in FIG. 2, the backup jig 36 holds a plurality of backup pins 34 on the back surface thereof. The backup jig 36 is a plate-like member and has a plurality of through holes (described later). The upper end portion 34 a of the backup pin 34 can be inserted into each through hole of the backup jig 36 from the back surface of the backup jig 36. In a state where the backup jig 36 holds the backup pin 34, the upper end portion 34 a of the backup pin 34 is inserted into the through hole, and the lower end portion 34 b of the backup pin 34 contacts the back surface of the backup jig 36. In the backup jig 36, the arrangement of the backup pins 34 can be changed by adjusting the number and position of the through holes. When the backup jig 36 comes close to the backup plate 38 (described later), the backup jig 36 is in a holding state in which the plurality of backup pins 34 are held and in a released state in which the plurality of backup pins 34 are released. It is configured to be switchable. The detailed configuration of the backup jig 36 will be described later.

  As shown in FIG. 3, the backup plate 38 is configured such that upper end portions 34a of the plurality of backup pins 34 can be attached to and detached from the upper surface thereof. That is, the backup plate 38 can be switched between an attachment state in which a plurality of backup pins 34 are attached (a state of the backup plate 38 shown in FIG. 3) and a non-attachment state in which the plurality of backup pins 34 are not attached. It is configured. The backup plate 38 is disposed at a position facing the back surface of the circuit board 2 or the backup jig 36 when the circuit board 2 or the backup jig 36 is positioned at the component mounting position. A number of positions where the backup pins 34 can be attached to and detached from the backup plate 38 are provided, and the backup pins 34 can be appropriately selected according to the circuit board 2 to be supported. The plurality of backup pins 34 can be attached to and detached from the backup plate 38 manually by an operator.

  As shown in FIGS. 4 and 5, the switching mechanism 40 includes a backup jig 36 and a backup plate 38 that are close to each other in a close proximity (state shown in FIG. 4), a backup jig 36 and a backup plate 38. Is switched to a separated state (state shown in FIG. 5) in which the two are separated from each other. The switching mechanism 40 includes a lifting device 42. The lifting device 42 moves the backup plate 38 up and down with respect to the backup jig 36 transported to the component mounting position. Thereby, the distance between the backup jig 36 and the backup plate 38 is adjusted, and the proximity state and the separation state are switched. The elevating device 42 can be constituted by, for example, a table that supports the backup plate 38 and an actuator that elevates and lowers the table.

  As described above, in the substrate backup device 32, when the backup jig 36 is changed from the holding state to the released state in the proximity state, the plurality of backup pins 34 held by the backup jig 36 are attached to the backup plate 38. Mounted. Further, when the backup jig 36 is changed from the released state to the held state in the proximity state, the plurality of backup pins 34 attached to the backup plate 38 are collected by the backup jig 36. Hereinafter, the substrate backup device 32 will be described in more detail.

  As shown in FIG. 6, the backup jig 36 includes a jig plate 44 through which the upper ends 34 a of the plurality of backup pins 34 are inserted, and a holding device 46 that holds or releases the plurality of inserted backup pins 34. It has. The jig plate 44 has a plurality of first holes 44a. In each of the plurality of first holes 44a, the upper end portion 34a of the backup pin 34 is detachable. For example, as illustrated in FIG. 6B, the first hole 44a has a rounded rectangular shape including two parallel lines and two semicircles in plan view. The first hole 44 a is provided at a position where the backup pin 34 is disposed with respect to the backup plate 38. The positions at which the backup pins 34 are arranged differ according to the shape and size of the circuit board 2 on which the electronic component 4 is mounted. For this reason, the jig plate 44 may be prepared for each arrangement pattern of the backup pins 34, or the jig plate 44 corresponding to a plurality of arrangement patterns may be prepared.

  As described above, the backup pin 34 has, in the holding state, the upper end portion 34a that is inserted through the first hole 44a of the jig plate 44 and the lower end portion 34b that abuts and engages with the back surface of the jig plate 44. Have. The upper end portion 34a and the lower end portion 34b are formed in a cylindrical shape and are circular in a plan view. The diameter of the upper end portion 34a is a diameter that can be inserted into the first hole 44a. The diameter of the lower end 34b is a diameter that cannot be inserted into the first hole 44a.

  As shown in FIGS. 6 and 7, the holding device 46 has a holding state (state shown in FIG. 6) for holding the plurality of backup pins 34 inserted into the plurality of first holes 44 a of the jig plate 44, and a healing state. It switches to the release state (state shown in FIG. 7) which releases the plurality of backup pins 34 inserted through the plurality of first holes 44a of the tool plate 44. The holding device 46 is configured to be able to switch all of the plurality of backup pins 34 inserted through the plurality of first holes 44a between a holding state and a releasing state all at once. The holding device 46 includes a holding plate 48 that holds or releases the plurality of backup pins 34 with respect to the jig plate 44, and a moving device (not shown) that moves the holding plate 48 with respect to the jig plate 44. Yes.

  The holding plate 48 holds the plurality of backup pins 34 inserted through the first holes 44 a of the jig plate 44. The holding plate 48 is disposed so as to contact the upper surface of the jig plate 44, and is slidable relative to the jig plate 44. The holding plate 48 has a plurality of second holes 48a. The second holes 48 a are formed at positions corresponding to the plurality of first holes 44 a of the jig plate 44. The second hole 48a has the same shape as the first hole 44a. That is, the upper end 34a of the backup pin 34 can be inserted into the second hole 48a, but the lower end 34b cannot be inserted. The position where the second hole 48a is provided is different according to the shape and size of the circuit board 2 on which the electronic component 4 is mounted, like the first hole 44a of the jig plate 44, and the arrangement pattern of the backup pins 34 It depends on.

  As described above, the backup plate 38 can be moved by the switching mechanism 40 between a proximity position facing and close to the jig plate 44 and a separation position separating from the jig plate 44. When the backup plate 38 is located at the close position, the plurality of backup pins 34 (upper end portions 34 a) attached to the backup plate 38 are inserted into the first holes 44 a of the jig plate 44 and the first of the holding plates 48. It is configured to be inserted through the two holes 48a.

  The moving device includes an actuator (not shown), and when the backup plate 38 is in a close position (that is, when the backup pin 34 is inserted through the first hole 44a and the second hole 48a), the holding plate 48 is moved. It can be slid in the first direction (for example, in the present embodiment, the direction indicated by the arrow M in FIG. 6A). When the holding plate 48 slides with respect to the jig plate 44, the centers of the plurality of second holes 48a change with respect to the centers of the plurality of first holes 44a in plan view. As a result, the center of the plurality of first holes 44a and the center of the plurality of second holes 48a are shifted from each other and the state in which both coincide with each other. The operation of the moving device is controlled by a switch 52 installed in the transport device 26 as shown in FIGS. The switch 52 is pressed by the backup plate 38 when the backup plate 38 moves to the close position. When the switch 52 is pressed by the backup plate 38, the moving device slides the holding plate 48 with respect to the jig plate 44.

  As shown in FIG. 6, in a state where the centers of the plurality of first holes 44a and the centers of the plurality of second holes 48a are shifted, the periphery of the first hole 44a and the periphery of the second hole 48a provide a plurality of backup pins. 34 is clamped. As a result, a plurality of backup pins 34 are held with respect to the backup jig 36. On the other hand, as shown in FIG. 7, in the state where the centers of the plurality of first holes 44a and the centers of the plurality of second holes 48a coincide with each other, a plurality of the edges of the first hole 44a and the periphery of the second hole 48a The holding of the backup pin 34 is released, and the backup jig 34 is released from the plurality of backup pins 34. As a result, all the plurality of backup pins 34 with respect to the jig plate 44 (backup jig 36) can be collectively held or released. The operation method of the moving device is not limited to the above. For example, the position of the backup plate 38 may be detected by a sensor, and the holding plate 48 may be moved based on the detected position.

  In the component mounting machine 10 described above, when mounting the plurality of backup pins 34 to the backup plate 38, first, the backup jig 36 holding the plurality of backup pins 34 is mounted in the same manner as the circuit board 2. 10 is carried to the inside and positioned at the component mounting position. Then, the backup plate 38 is raised (switched from the separated state to the close state) with respect to the backup jig 36 by the switching mechanism 40 (elevating device 42). When the holding device 46 operates in the proximity state, the backup jig 36 is released from the holding state. As a result, the plurality of backup pins 34 are detached from the backup jig 36, and the plurality of backup pins 34 are attached to the backup plate 38 at a time.

  When collecting the plurality of backup pins 34 from the backup plate 38, first, the backup jig 36 that does not hold the backup pins 34 is conveyed into the component mounter 10 and positioned at the component mounting position. Then, the backup plate 38 is raised (switched from the separated state to the close state) with respect to the backup jig 36 by the switching mechanism 40 (elevating device 42). At this time, the plurality of backup pins 34 attached to the backup plate 38 are inserted into the first holes 44 a of the jig plate 44 and the second holes 48 a of the holding plate 48. When the holding device 46 operates in this proximity state, the backup jig 36 is changed from the released state to the held state. As a result, the plurality of backup pins 34 are held by the backup jig 36, and the plurality of backup pins 34 can be collected from the backup plate 38 at a time.

  As described above, in the component mounter 10 according to the first embodiment, it is not necessary to use a plurality of backup plates 38 when mounting and collecting the backup pins 34. Further, since the backup jig 36 can be transported to the component mounting position in the same manner as the circuit board 2, a dedicated tweezer plate for transporting the tweezers with the backup pins upright as in the conventional configuration is used. Does not require a unit carrier. Therefore, the number of component parts can be reduced as compared with the prior art. In this embodiment, the component mounting machine is described as an example of the apparatus using the backup jig. However, for example, the apparatus may be used for an apparatus other than the component mounting machine such as a printing machine.

  As mentioned above, although the specific example of the technique which this specification discloses was demonstrated in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

  The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

2: Circuit board 4: Electronic component 6: Suction nozzle 10: Component mounting machine 12: Component feeder 14: Feeder holding unit 16: Mounting head 18: Moving mechanism 20: Imaging unit 26: Conveying device 28: Operation panel 30: Control device 32: Substrate backup device 34: Backup pin 36: Backup jig 38: Backup plate 40: Switching mechanism 42: Lifting device 44: Jig plate 46: Holding device 48: Holding plate 52: Switch

Claims (6)

Multiple backup pins,
A backup jig that can be switched between a holding state for holding the plurality of backup pins and a release state for releasing the plurality of backup pins;
A backup plate that can be switched between an attachment state in which the plurality of backup pins are attached and a non-attachment state in which the plurality of backup pins are not attached;
A switching mechanism that switches between a proximity state in which the backup jig and the backup plate are opposed to each other and a separated state in which the backup jig and the backup plate are separated from each other;
The backup jig can be switched between the holding state and the released state when being brought into the proximity state by the switching mechanism,
The backup jig is configured to be attached to the backup plate when the backup jig is changed from the held state to the released state in the proximity state. The backup jig is configured to be recovered by the backup jig when the backup jig is changed from the released state to the holding state in the proximity state. Equipment. The apparatus is a mounting machine that mounts components on a substrate supported by the plurality of backup pins attached to the backup plate,
The backup jig holds the plurality of backup pins on the back surface thereof,
The apparatus according to claim 1, wherein the backup plate is disposed at a position facing a back surface of the substrate when the substrate is disposed at a component mounting position where a component is mounted on the substrate. It further comprises a transport device that transports the board to the component mounting position,
The transfer device can transfer the backup jig to the component mounting position,
The switching mechanism includes a lifting device that lifts and lowers the backup plate with respect to the backup jig transported to the component mounting position.
The device according to claim 2, wherein the lifting device lifts and lowers the backup plate to switch between the proximity state and the separation state. A backup jig that attaches a plurality of backup pins to a backup plate that supports the substrate from below and collects the plurality of backup pins from the backup plate to which the plurality of backup pins are attached,
A jig plate having a plurality of first holes, each of the plurality of first holes being capable of detaching the plurality of backup pins;
A holding device that switches between a holding state that holds the plurality of backup pins inserted through the plurality of first holes and a release state that releases the plurality of backup pins inserted through the plurality of first holes; With
The holding device is configured to be capable of switching all of the plurality of backup pins inserted through the plurality of first holes between a holding state and a releasing state in a lump. The backup plate is movable to a proximity position that is close to and opposed to the jig plate, and a separation position that is separated from the jig plate,
The plurality of backup pins attached to the backup plate are configured to be inserted into the plurality of first holes of the jig plate when the backup plate is located at the close position,
The holding device is
When the backup plate to which the plurality of backup pins are attached moves from the separation position to the proximity position, all of the plurality of backup pins inserted into the plurality of first holes can be held together. ,
With the plurality of backup pins held in the plurality of first holes of the jig plate, the backup plates are held in the plurality of first holes when the backup plate moves from the separated position to the proximity position. The backup jig according to claim 4, wherein all of the plurality of backup pins that have been held can be released collectively. The holding device includes a holding plate that contacts the jig plate, and a moving device that moves the holding plate in a first direction along the surface of the jig plate,
The holding plate is
The jig plate has a plurality of second holes having the same shape as the plurality of first holes at positions corresponding to the plurality of first holes.
The moving device moves the holding plate in the first direction when the backup plate is in the proximity position, so that the plurality of second holes with respect to the centers of the plurality of first holes in a plan view. The center of the plurality of second holes coincides with the center of the plurality of first holes in a plan view when the center of the hole is shifted and the plurality of backup pins are held with respect to the jig plate. The backup jig according to claim 5, wherein the backup jig is switched to a release state in which the plurality of backup pins for the jig plate are released.

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