CN114208411B

CN114208411B - Work machine and component conveying method

Info

Publication number: CN114208411B
Application number: CN201980098557.4A
Authority: CN
Inventors: 大岛宽之
Original assignee: Fuji Corp
Current assignee: Fuji Corp
Priority date: 2019-07-25
Filing date: 2019-07-25
Publication date: 2023-12-05
Anticipated expiration: 2039-07-25
Also published as: WO2021014639A1; JP7271673B2; JPWO2021014639A1; CN114208411A

Abstract

The working machine is provided with: a carrying device for carrying in a plate-like member in a state where elements not constituting a circuit are mounted; a jack member for jack up the element which does not form the circuit from the lower part of the plate-shaped member carried in by the carrying device, thereby separating the element from the plate-shaped member; and a work head for holding the element which is jacked by the jacking component and does not form a circuit.

Description

Work machine and component conveying method

Technical Field

The present application relates to a work machine or the like that performs work on a plate-like member carried into the work machine.

Background

The following patent documents describe an example of a working machine that works a plate-like member such as a circuit board.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open No. 8-241918

Disclosure of Invention

Problems to be solved by the application

In a work machine, not only a holding operation of an element constituting a circuit but also a holding operation of an element not constituting a circuit may be performed. The present application has been made in view of such a practical situation, and an object of the present application is to appropriately perform a holding operation of an element that does not constitute a circuit.

Means for solving the problems

In order to solve the above problems, the present specification discloses a work machine including: a carrying device for carrying in a plate-like member in a state where elements not constituting a circuit are mounted; a lifting member that lifts the element that does not constitute a circuit from below the plate-like member carried in by the carrying device, thereby separating the element from the plate-like member; and a work head for holding the element which is not formed into a circuit and is lifted by the lifting member.

In order to solve the above-described problems, the present specification discloses an element transporting method for transporting an element that does not constitute a circuit from a plate-like member in a working machine that includes a working head that holds the element and that is loaded with the plate-like member in a state in which the element that does not constitute the circuit is mounted, the element transporting method including: a separation step of lifting the element which does not constitute the circuit by a lifting member from below the plate-like member carried into the working machine, thereby bringing the element into a state of being separated from the plate-like member; and a carrying step of carrying the non-circuit-forming element, which is held by the work head and is separated from the plate-like member in the separating step, from above the plate-like member.

Effects of the application

According to the present disclosure, a plate-like member having elements not constituting a circuit mounted thereon is carried into a working machine, and the elements not constituting a circuit are lifted up by a lifting member from below the plate-like member. The component that does not constitute the circuit and is lifted up by the lifting member is held by the work head. This makes it possible to appropriately perform a holding operation or the like of an element that does not constitute a circuit.

Drawings

Fig. 1 is a perspective view showing an electronic component mounting machine.

Fig. 2 is a perspective view showing the conveyance holder.

Fig. 3 is a plan view showing the conveyance holder.

Fig. 4 is a cross-sectional view taken along line AA of fig. 3.

Fig. 5 is a cross-sectional view taken along line BB of fig. 3.

Fig. 6 is a perspective view showing a carrier.

Fig. 7 is a sectional view showing the suction nozzle.

Fig. 8 is a block diagram showing a control device.

Fig. 9 is a perspective view of the carrier in a state where the element cover is mounted.

Fig. 10 is a working view of the element cover when lifted up by the lift pin.

Fig. 11 is a working view of the element cover when lifted up by the lift pin.

Fig. 12 is a working view of the element cover when lifted up by the lift pin.

Fig. 13 is a working view of the element cover when lifted up by the lift pin.

Fig. 14 is a working view of the element cover when lifted up by the lift pin.

Fig. 15 is a perspective view of a carrier in which an electrical component is mounted.

Fig. 16 is a perspective view of a carrier in which an electric element and an element cover are mounted.

Description of the reference numerals

Electronic component mounter (working machine) 20. Transport holder (transport device) 24. Mounting head (working head) 40. Carrier (plate-like member) 82. Jack pin (jack member) 112. Electric component (component constituting circuit) 122. Component cover (component not constituting circuit) 140. Suction nozzle

Detailed Description

Hereinafter, embodiments of the present application will be described in detail with reference to the drawings as modes for carrying out the present application.

Fig. 1 shows an electronic component assembly machine 10 of an embodiment of the present application. The electronic component mounter 10 is a device for performing a mounting operation of an electric component to a carrier. The electronic component mounting machine 10 includes a conveyance holder 20, a moving device (see fig. 8) 22, a mounting head 24, a supply device 26, a component camera 28, a marking camera (see fig. 8) 30, a cover mounting table 34, and a control device (see fig. 8) 36.

The conveyance and holding device 20 is a device for conveying and holding the carrier 40 described in detail later, and is disposed at a substantially central portion in the Y-axis direction of the base 46 so as to extend in the X-axis direction. As shown in fig. 2 to 5, the conveyance holder 20 includes a conveyor device 50 and a holder 52. Fig. 2 is a view showing the conveyance holder 20 from a perspective obliquely from above, and fig. 3 is a view showing the conveyance holder 20 from a perspective obliquely from above. Fig. 4 is a view from the AA line in fig. 3, and fig. 5 is a view from the BB line in fig. 3.

The conveyor device 50 includes a pair of guide rails 60, 62 and a conveyor belt 66 provided on each of the guide rails 60, 62. The pair of guide rails 60, 62 are disposed parallel to each other, and each guide rail 60, 62 is supported on the upper surface of the support plate 72 via the pair of support legs 70. The guide rails 60 and 62 are disposed to extend in the X-axis direction.

Further, two pulleys 74 and 76 are disposed on the side surfaces of the guide rails 60 and 62 with the Y-axis direction as the axis. The two pulleys 74 and 76 are disposed at both ends of the guide rails 60 and 62. The guide rail 60 and the guide rail 62 are disposed in a state in which the disposed surfaces of the pulleys 74 and 76 face each other. The belt 66 is wound around pulleys 74 and 76 of the guide rails 60 and 62, and the belt 66 is wound by driving an electromagnetic motor 78 (see fig. 8).

The winding direction of the conveyor belt 66 is clockwise in fig. 4. By placing the carrier 40 on the conveyor belt 66, the carrier 40 is conveyed by the conveyor belt 66 from the side where the pulley 74 is disposed toward the side where the pulley 76 is disposed.

The holding device 52 includes a lift table 80, a plurality of jack pins 82, a table lift mechanism 86, and a clamping device 88. The elevating platform 80 is substantially rectangular and is disposed below the guide rails 60 and 62 so as to extend between the pair of support legs 70 of the guide rails 60 and 62. A plurality of jack-up pins 82 are erected on the upper surface of the elevating table 80. As shown in fig. 5, each jack-up pin 82 is composed of a substantially cylindrical main body 90 and a pin 92 extending upward from an upper end surface of the main body 90. The pin 92 has a stepped shape, and is composed of a large diameter pin 94 extending from the upper end surface of the main body 90 and a small diameter pin 96 extending from the upper end surface of the large diameter pin 94. The lift table 80 is disposed on the upper surface of the support plate 72 via a table lift mechanism 86, and the table lift mechanism 86 lifts and lowers the lift table 80 by driving an electromagnetic motor 98 (see fig. 8).

In addition, the clamping device 88 has a pair of clamping bars 100 and a pair of clamping plates 102. The clamping lever 100 is substantially plate-shaped, and the length dimension of the clamping lever 100 is larger than the length dimension of the elevating table 80 in the X-axis direction. The pair of clamping bars 100 are fixed to the upper surfaces of the guide rails 60 and 62 such that the lifting table 80 is positioned between both ends of each clamping bar 100. In other words, the clamp bar 100 is fixed to the upper surfaces of the guide rails 60, 62 such that the lift table 80 extends below the clamp bar 100. The clamp rod 100 is fixed to the upper surfaces of the guide rails 60 and 62 so as to extend above the conveyor belt 66 disposed on the guide rails 60 and 62.

The clamping plate 102 is substantially rectangular plate-shaped, and the longitudinal dimension of the clamping plate 102 in the longitudinal direction is substantially the same as the longitudinal dimension of the clamping rod 100. The clamp plate 102 is held slidably in the up-down direction by the guide rails 60 and 62 in a state of being vertically extended in the same direction as the clamp rod 100 below the clamp rod 100 extending along the upper side of the conveyor belt 66. In other words, the holder 108 is disposed on the side surface of the guide rails 60, 62 on the side where the conveyor belt 66 is disposed. In a state where the side surfaces of the guide rails 60 and 62 face the side surfaces of the clamp plate 102, the clamp plate 102 is held slidably in the up-down direction by the holder 108 below the clamp lever 100.

When the clamp plate 102 held slidably in the up-down direction by the guide rails 60, 62 slides to the lowermost position, the upper end of the clamp plate 102 is positioned below the upper surface of the conveyor 66, and the lower end of the clamp plate 102 is positioned above the upper surface of the elevating table 80 in the state where it is not elevated, as shown in fig. 5.

According to such a configuration, in the conveyance holder 20, the carrier 40 conveyed by the conveyor device 50 is held by the holder 52. The conveyance holder 20 further includes a suction device 110. The suction device 110 is fixed to the side surface of the holding plate 102, and the upper and lower ends of the suction device 110 have the same height as the upper and lower ends of the holding plate 102. The suction device 110 sucks the electrical components mounted on the carrier 40 from the lower surface side of the carrier 40 held by the holding device 52.

Specifically, as shown in fig. 6, the carrier 40 has a substantially rectangular flat plate shape, and a plurality of component mounting portions 116 for mounting the electrical components (see fig. 14) 112 are formed in the carrier 40. A plurality of through holes 118 penetrating in the vertical direction are formed in each of the plurality of component placement portions 116. As will be described in detail later, the lifting table 80 is lifted, so that the suction device 110 is lifted, and the upper surface of the suction device 110 is brought into close contact with the lower surface of the carrier 40. At this time, the suction device 110 is connected to the plurality of through holes 118 of the carrier 40 from the lower surface side of the carrier 40 at the position where the carrier 40 is held by the holding device 52. Thereby, the electric component 112 mounted on the carrier 40 is sucked by the suction device 110 from the lower surface side of the carrier 40.

A plurality of magnets 120 are embedded in the upper surface of the carrier 40 so as to sandwich the plurality of component placement portions 116. Thus, an element cover (see fig. 1) 122, which will be described later in detail, is detachably fixed to the carrier 40 by the magnet 120. A plurality of insertion holes 126 are formed in the carrier 40. The plurality of insertion holes 126 are disposed in correspondence with the jack pins 82 placed on the lift table 80 of the holding device 52, and the inner diameter of the insertion holes 126 is larger than the outer diameter of the large diameter pins 94 of the jack pins 82. Thereby, the large diameter pin 94 of the jack pin 82 can be inserted into the insertion hole 126 of the carrier 40.

In addition, the mobile device 22 has: a slider (not shown) to which the mounting head 24 is attached, an X-axis direction slider mechanism (not shown), and a Y-axis direction slider mechanism (not shown). The X-axis direction slide mechanism moves the slider in the X-axis direction by operation of an electromagnetic motor (see fig. 8) 130, and the Y-axis direction slide mechanism moves the slider in the Y-axis direction by operation of an electromagnetic motor (see fig. 8) 132. Thereby, the mounting head 24 is moved to an arbitrary position on the base 46 by the moving device 22.

The mounting head 24 is a component to which the electrical component 112 is mounted, and has a suction nozzle 140 provided at a lower end surface. Since the suction nozzle 140 is described in japanese patent application 2016-552779, which is filed by the present inventor, the suction pad 144 is held movable in the up-down direction at the lower end portion of the substantially cylindrical housing 142 as shown in fig. 7. The suction pad 144 is formed of an elastically deformable material, and the lower end of the suction pad 144 is formed in a horn shape. The inside of the suction pad 144 is a hollow space, and the inside of the hollow space of the suction pad 144 communicates with a positive and negative pressure supply device (see fig. 8) 148 via an air passage 146. Then, negative pressure is supplied to the air passage 146 by the positive and negative pressure supply device 148, whereby the electric element 112 is sucked and held by the suction pad 144. The suction pad 144 is moved upward by the supply of negative pressure to the air passage 146. At this time, the outer edge portion of the suction pad 144 is supported at the lower end portion of the case 142. This suppresses elastic deformation of the suction pad 144 when the electric component 112 is sucked and held, and ensures suction and holding of the electric component 112 by the suction pad 144. Further, by supplying a slight positive pressure to the air passage 146 by the positive-negative pressure supply device 148, the holding by the suction pad 144 can be released, and the electric element 112 can be separated. The mounting head 24 includes a nozzle lifting device 150 (see fig. 8) for lifting and lowering the nozzle 140, and the mounting head 24 changes the position of the held electrical component 112 in the up-down direction by the nozzle lifting device 150. The suction nozzle 140 can be attached to and detached from the mounting head 24 in a single touch, and can be replaced with a different type of suction nozzle. In addition, the one-touch type disassembly and assembly means that the operator disassembles the suction nozzle without using tools.

As shown in fig. 1, the supply device 26 is arranged at the end of the electronic component mounter 10 in the Y-axis direction, and supplies the electronic components 112 placed on the tray 156 to the electronic component mounter 10. The supply device 26 includes a tray storage (not shown) and a tray moving device 158. A plurality of trays 156 are stored in the tray storage. Then, the tray 156 stored in the tray storage is pulled out to the component supply position (the position of the tray 156 in fig. 1 is shown) by the operation of the tray moving device 158, and the component is supplied from the tray 156 to the mounting head 24 at the component supply position.

The part camera 28 is disposed beside the supply device 26 in an upward state on the base 46. By this, the component camera 28 can capture the electrical component 112 held by the suction nozzle 140 by moving the mounting head 24 to above the component camera 28. The marker camera 30 is fixed in a downward state to a slider of the moving device 22 to which the mounting head 24 is attached, and is moved to an arbitrary position by the operation of the moving device 22. Thus, the marker camera 30 can capture an arbitrary position on the substrate 46.

The cover mounting table 34 is disposed so as to face the supply device 26 with the conveyance holder 20 interposed therebetween. The cover mounting table 34 has a flat plate shape, and its upper surface is a space in which three element covers 122 can be mounted without overlapping.

As shown in fig. 8, the control device 36 includes a controller 160 and a plurality of driving circuits 162. The plurality of driving circuits 162 are connected to the electromagnetic motors 78, 98, 130, 132, the suction device 110, the positive/negative pressure supply device 148, the suction nozzle lifting device 150, and the tray moving device 158. The controller 160 is provided with a computer such as CPU, ROM, RAM, and is connected to a plurality of driving circuits 162. Thus, operations of the conveyance holder 20, the moving device 22, and the like are controlled by the controller 160. The controller 160 is also connected to the image processing device 166. The image processing device 166 is a device for processing the captured data captured by the part camera 28 and the marker camera 30. Thereby, the controller 160 acquires various information from the photographing data.

In the electronic component mounter 10, the carrier 40, on which the electric components 112 are not mounted, is carried in with the component cover 122 mounted by the conveyor device 50 with the above-described configuration. In the electronic component mounter 10, the component cover 122 is removed from the carrier 40 by the suction nozzles 140 of the mounting head 24, and the electrical components 112 are mounted on the carrier 40 from which the component cover 122 is removed by the suction nozzles 140 of the mounting head 24. After that, when the mounting operation of the electric component 112 is completed, the component cover 122 is again placed on the carrier 40 on which the electric component 112 is mounted by the suction nozzle 140 of the mounting head 24, and the carrier 40 is carried out by the conveyor device 50.

Specifically, as shown in fig. 1, the element cover 122 is a substantially square flat plate, and the length dimension of the 1-side of the element cover 122 is slightly shorter than the length dimension of the short side of the carrier 40. In addition, the long side of the carrier 40 has a length dimension slightly longer than 3 times the length dimension of the 1 side of the element cover 122. Thereby, three element covers 122 can be placed on the upper surface of the carrier 40 in the longitudinal direction of the carrier 40. Four square exposure holes 170 are formed in the element cover 122 in a 2×2 array. The exposure hole 170 is slightly smaller than the electrical component 112 intended to be assembled to the carrier 40. Then, three component covers 122 are mounted on the carrier 40 on which the electrical components 112 are not mounted so that the component mounting portions 116 are exposed through the exposure holes 170.

In addition, a plurality of positioning holes 172 are also formed in the element cover 122 at positions corresponding to the plurality of insertion holes 126 formed in the carrier 40 in a state of being placed on the carrier 40. Therefore, as shown in fig. 5, the component cover 122 is positioned and placed on the carrier 40 such that the insertion hole 126 of the carrier 40 communicates with the positioning hole 172 of the component cover 122 in the up-down direction. The inner diameter of the positioning hole 172 is larger than the outer diameter of the small diameter pin 96 of the knock-up pin 82, but smaller than the large diameter pin 94 of the knock-up pin 82. The element cover 122 is molded with a magnetic material such as iron, and is fixed by a magnet 120 embedded in the upper surface of the carrier 40.

In this way, three component covers 122 are mounted on the carrier 40 on which the electric components 112 are not mounted, and the carrier 40 in this state is carried into the electronic component mounter 10. In addition, 12 component mounting portions 116 may be formed in the carrier 40 shown in fig. 1, and three component covers 122 may be mounted thereon. On the other hand, 8 component mounting portions 116 may be formed in the carrier 40 shown in fig. 6, and two component covers 122 may be mounted thereon. Here, fig. 9 shows the carrier 40 in a state where two component covers 122 are mounted on the carrier 40 in which 8 component mounting portions 116 are formed. When the carrier 40 is carried into the electronic component mounter 10, the carrier 40 is carried to the working position by the conveyor device 50 in accordance with an instruction from the controller 160, and is held fixedly by the holding device 52 at the working position.

Specifically, the carrier 40 is carried into the electronic component mounter 10 and conveyed to a predetermined work position by the conveyor device 50. When the carrier 40 is conveyed to the working position, both edges of the carrier 40 placed on the conveyor belt 66 of the conveyor device 50 are located between the gripping lever 100 and the gripping plate 102 in the up-down direction as shown in fig. 10. When the carrier 40 is transported by the conveyor device 50, the lift table 80 is lowered, and therefore, the jack pins 82 mounted on the lift table 80 are also lowered. Accordingly, the upper ends of the jack-up pins 82 are located below the lower surface of the carrier 40 conveyed by the conveyor device 50, thereby ensuring conveyance of the carrier 40.

Next, when the carrier 40 is conveyed to the working position, the lift table 80 is lifted by the operation of the table lift mechanism 86. Further, on the upper surface of the lift table 80, a jack pin 82 is disposed so as to overlap with an insertion hole 126 formed in the carrier 40 in the up-down direction. The component cover 122 is placed on the carrier 40 so that the insertion hole 126 communicates with the positioning hole 172 in the vertical direction. Accordingly, as the lift table 80 is lifted, as shown in fig. 11, the large diameter pins 94 of the lift pins 82 are inserted into the insertion holes 126 of the carrier 40, and the small diameter pins 96 of the lift pins 82 are inserted into the positioning holes 172 of the element cover 122. At this time, since the inner diameter of the positioning hole 172 is smaller than the outer diameter of the large diameter pin 94 of the knock-up pin 82, the element cover 122 is pushed up by the large diameter pin 94 of the knock-up pin 82. As a result, the element cover 122 fixed to the carrier 40 by the magnetic force of the magnet 120 is separated upward from the upper surface of the carrier 40 as shown in fig. 12. A plurality of jack pins 82 are disposed on the upper surface of the lift table 80, and the large diameter pins 94 of the jack pins 82 are simultaneously inserted into the plurality of insertion holes 126 of the carrier 40 in accordance with the lifting of the lift table 80, so that the large diameter pins 94 of the jack pins 82 simultaneously jack the element cover 122. Therefore, the element cover 122 is separated upward from the upper surface of the carrier 40 in a state parallel to the carrier 40.

In addition, as the lift table 80 is lifted, the lower end of the holding plate 102 and the lower end of the suction device 110 are brought into contact with the upper surface of the lift table 80, and the holding plate 102 and the suction device 110 are lifted. Then, as the holding plate 102 and the suction device 110 rise, the upper ends of the holding plate 102 and the suction device 110 come into contact with the lower surface of the carrier 40 supported by the conveyor belt 66. Further, the carrier 40 supported by the conveyor 66 is lifted up from the conveyor 66 by the holding plate 102 and the suction device 110 as shown in fig. 13 by the lifting table 80. At this time, as shown in fig. 13, the lifting table 80 is lifted up to a position where the upper surface of the carrier 40 contacts the lower surface of the holding rod 100, and the carrier 40 is lifted up by the holding plate 102 and the suction device 110. The carrier 40 is thereby clamped at both edges by the clamping bars 100 and the clamping plates 102. At this time, the suction device 110 is closely attached to the lower surface of the carrier 40, and communicates with the plurality of through holes 118 of the carrier 40 as described above. In other words, in the holding device 52, the element cover 122 fixed to the upper surface of the carrier 40 by the magnetic force is lifted up by the lifting pin 82 in accordance with the lifting of the lifting table 80, and the carrier 40 released from the fixation of the element cover 122 by the magnetic force is held by the holding lever 100 and the holding plate 102.

In the above description, as shown in fig. 12, the element cover 122 is lifted up by the large diameter pin 94 of the lift pin 82, and the element cover 122 is separated from the upper surface of the carrier 40. However, when the magnetic force of the magnet 120 embedded in the carrier 40 is strong, as shown in fig. 14, the following may be present: even if the element cover 122 is lifted up by the large diameter pins 94 of the lift-up pins 82, the element cover 122 does not come off the carrier 40, and the element cover 122 and the carrier 40 are lifted up by the lift-up pins 82 in a state fixed by magnetic force. In this case, too, the element cover 122 and the carrier 40 fixed by the magnetic force are lifted, and thereby the upper surface of the carrier 40 is brought into contact with the holding rod 100 as shown in fig. 14. Then, in a state where the upper surface of the carrier 40 is in contact with the clamping lever 100, the lift table 80 is lifted, and the element cover 122 is lifted by the large diameter pin 94 of the lift pin 82. At this time, the lifting of the carrier 40 is restricted by the holding lever 100, and therefore, only the element cover 122 is lifted by the jack pin 82, and as shown in fig. 13, the element cover 122 is separated from the upper surface of the carrier 40. In addition, in a state where the upper surface of the carrier 40 is in contact with the holding rod 100, the lift table 80 is lifted up, and thereby the holding plate 102 is lifted up, and the carrier 40 after the release of the fixation of the element cover 122 by the magnetic force is held by the holding rod 100 and the holding plate 102.

As described above, when the carrier 40 after the fixation of the element cover 122 by the magnetic force is released is held by the holding rod 100 and the holding plate 102, the through hole 118 formed in the carrier 40 communicates with the suction device 110, and air is sucked from the through hole 118 by the operation of the suction device 110. The mounting head 24 is moved to the upper side of the carrier 40 according to the instruction of the controller 160, and the component cover 122 separated from the upper surface of the carrier 40 is sucked and held by the suction nozzles 140. The component cover 122 held by the suction nozzles 140 is transferred from above the carrier 40 to the cover mounting table 34 by the operation of the moving device 22. In other words, the component cover 122 is lifted by the mounting head 24 and carried from above the carrier 40 to the cover mounting table 34.

Next, when three component covers 122 are sequentially transferred from the carrier 40 to the cover mounting table 34, the marking camera 30 moves to a position above the carrier 40 from which the component covers 122 are removed in accordance with an instruction from the controller 160, and photographs the carrier 40. In this way, the controller 160 analyzes the captured data to obtain information on the holding position of the carrier 40 and the like. In addition, the feeding device 26 is configured such that the tray 156 on which the electrical component 112 is mounted is pulled out to the component feeding position by the operation of the tray moving device 158 in accordance with the instruction of the controller 160.

Then, the mounting head 24 moves to above the tray 156 as the component supply position in accordance with an instruction of the controller 160, and suctions and holds the electrical component 112 by the suction nozzle 140. The component cover 122 is held by the suction nozzles 140, and after the component cover is transferred from the carrier 40 to the cover mounting table 34, the suction nozzles 140 mounted on the mounting head 24 are not replaced and hold the electrical components 112. In other words, the electrical component 112 and the component cover 122 are held by the same suction nozzle 140 mounted to the mounting head 24, respectively.

Then, the mounting head 24 moves to the upper side of the component camera 28 according to an instruction of the controller 160, and the component camera 28 captures the electrical component 112 held by the suction nozzle 140. In this way, the controller 160 analyzes the imaging data to obtain information on the holding posture, holding position, and the like of the element. Then, the mounting head 24 moves to the upper side of the carrier 40 in accordance with the instruction of the controller 160, corrects the holding position of the carrier 40, the holding posture of the electric component 112, and the like, and mounts the held electric component 112 on the component mounting portion 116 of the carrier 40 as shown in fig. 15. At this time, since the component mounting portion 116 sucks air from the through hole 118, the electric component 112 mounted on the component mounting portion 116 is fixed by the suction of air, and the positional deviation is prevented.

When the assembly of the electrical component 112 to the carrier 40 is completed, the component cover 122 transferred to the cover mounting table 34 is returned to the carrier 40. In other words, the mounting head 24 moves to above the cap stage 34 according to the instruction of the controller 160, and the component cap 122 mounted on the cap stage 34 is sucked and held by the suction nozzle 140. Next, the component caps 122 held by the suction nozzles 140 are sequentially transferred from the cap stage 34 to the carrier 40 by the operation of the moving device 22. At this time, the component cover 122 is placed on the carrier 40 such that the small diameter pins 96 of the jack pins 82 protruding upward from the insertion holes 126 of the carrier 40 are inserted into the positioning holes 172 of the component cover 122. In a state where the carrier 40 is held by the holding rod 100 and the holding plate 102, as shown in fig. 13, the large diameter pin 94 of the jack pin 82 is located above the upper surface of the carrier 40, and therefore, the element cover 122 is placed above the carrier 40 in a state separated upward from the upper surface of the carrier 40. Thus, the element cover 122 is positioned over the carrier 40 by the small diameter pins 96 of the lift pins 82.

When the three element covers 122 are positioned above the carrier 40 by the jack pins 82, the lift table 80 is lowered by the operation of the table lift mechanism 86. At this time, the holding rod 100 is lowered, and the holding of the carrier 40 by the holding rod 100 and the holding plate 102 is released. Further, since the jack-up pins 82 are also lowered, the element cover 122 is lowered as the jack-up pins 82 are lowered, and the element cover 122 is placed on the upper surface of the carrier 40.

At this time, the element cover 122 is mounted on the carrier 40 on which the electric element 112 is mounted so that a part of the outer periphery of the electric element 112 is covered but exposed through the exposure hole 170 (see fig. 16). Thus, the element cover 122 is fixed to the carrier 40 by the magnet 120, and the outer edge portion of the electric element 112 mounted on the carrier 40 is pressed by the edge portion dividing the exposure hole 170 of the element cover 122. In other words, the electric component 112 mounted on the carrier 40 is held between the carrier 40 and the component cover 122 by the magnetic force of the magnet 120 in response to the lowering of the lift table 80, thereby preventing the positional deviation. Accordingly, the suction of the electric component 112 by the suction device 110 is released as the lift table 80 descends.

In this way, in the electronic component mounter 10, after the component cover 122 is temporarily removed from the carrier 40, the electrical component 112 is mounted on the carrier 40, and the component cover 122 is mounted on the carrier 40 again. In other words, the component cover 122 is attached to and detached from the carrier 40 by the mounting head 24, and the electrical component 112 is mounted to and detached from the carrier 40. Then, the lift table 80 is further lowered, and thereby the carrier 40 is placed on the conveyor 66 as shown in fig. 10. Thus, the carrier 40 on which the electric components 112 and the component covers 122 are mounted is carried out of the electronic component mounter 10 by the operation of the conveyor 66.

The carrier 40 carried out from the electronic component mounter 10 is carried into a different electronic component mounter on the downstream side of the electronic component mounter 10, for example, and another type of electric component 180 is mounted on the electric component 112 through the exposure hole 170 of the component cover 122 mounted on the carrier 40, as shown in fig. 16. Thereby, a product including the electric element 112 is manufactured.

Incidentally, the element cover 122 prevents the positional deviation of the electric element 112 when the carrier 40 is carried or the deviation of the electric element 112 due to the force applied when the electric element 112 is assembled with other electric elements 180, and does not constitute a circuit although it may be conducted with the carrier 40. Thus, the element cover 122 is removed from the carrier 40 after the end of manufacture of the product constituting the circuit including the electric element 112. In addition, in terms of manufacturing a product constituting a circuit, the carrier 40 is used for carrying the electric element 112, and when manufacturing a product including the electric element 112, the product is removed from the carrier 40. Thus, the electrical component 112 alone or together with other electrical components 180 mounted to the electrical component 112 forms an electrical circuit.

In this way, with the electronic component mounter 10, when the carrier 40 is gripped by the holding device 52, the component cover 122 is lifted up by the lift pins 82, thereby being separated from the upper surface of the carrier 40. Therefore, even in the case of the suction nozzle 140 for holding the electric component 112, the component cover 122 can be held appropriately, and the holding operation of the component cover 122 and the holding operation of the electric component 112 can be performed by the suction nozzle 140.

In detail, in the conventional electronic component mounter, the component cover 122 fixed to the upper surface of the carrier 40 by the magnetic force of the magnet 120 is held by the suction nozzle and removed from the upper surface of the carrier 40. However, in order to remove the component cover 122 from the upper surface of the carrier 40 against the magnetic force of the magnet 120, a suction nozzle having a high suction force is required, or a special mechanism for improving the suction force is required. Therefore, this special mechanism has a disadvantage that the cost increases and the structure becomes complicated. In addition, when the holding operation of the component cover 122 is performed by using a suction nozzle having a high suction force and the holding operation of the electrical component 112 is performed by using a suction nozzle having a normal suction force, the replacement operation of the suction nozzle is required, and the cycle time is long. In addition, in the case where the holding operation of the component cover 122 is not performed using the suction nozzle, a dedicated mechanism for performing the holding operation of the component cover 122 is required, and in this case, there are disadvantages that the cost increases and the structure becomes complicated. On the other hand, in the electronic component mounter 10, the component cover 122 is lifted up by the lift pins 82, and thereby, the component cover 122 in a state separated from the carrier 40 is held by the suction nozzles 140, away from the upper surface of the carrier 40. Therefore, the component cover 122 can be properly held by the suction nozzle 140 for holding the electric component 112 without using a special mechanism for improving the suction force. This can prevent an increase in cost and a complication in structure due to a special mechanism, and can also prevent a long cycle time due to replacement of the suction nozzle. Further, since a dedicated mechanism for performing the holding operation of the element cover 122 is not required, an increase in cost and a complication in structure due to the dedicated mechanism can be prevented.

The element cover 122 is lifted up by the lift pins 82 in accordance with the lifting of the lift table 80. The lift table 80 is lifted up while the carrier 40 is held, but the element cover 122 is lifted up by the lift pins 82 by the lifting up of the lift table 80. In other words, the driving source for lifting up the element cover 122 utilizes the driving source for sandwiching the carrier 40. This prevents a new drive source from being mounted to lift up the element cover 122, and can prevent an increase in cost and a complication in structure due to the new drive source.

Further, since the element cover 122 is lifted by the plurality of lift pins 82, it is separated upward from the upper surface of the carrier 40 in a state parallel to the carrier 40. Thereby, the component cover 122 can be properly held by the suction nozzle 140. When the element cover 122 is separated from the upper surface of the carrier 40, the element cover 122 is lifted up by the plurality of lift pins 82, and thus, the load applied to the element cover 122 is distributed to a plurality of positions. Thereby, the element cover 122 can be stably attached to and detached from the carrier 40.

Incidentally, in the above-described embodiment, the electronic component mounting machine 10 is an example of a work machine. The conveyance holder 20 is an example of a conveyance device. The fitting head 24 is an example of a work head. The carrier 40 is an example of a plate-like member. The jack pin 82 is an example of a jack member. The electric element 112 is an example of an element constituting a circuit. The element cover 122 is an example of an element that does not constitute a circuit. The suction nozzle 140 is an example of a suction nozzle.

The present application is not limited to the above-described embodiments, and can be implemented in various ways with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the element cover 122 is lifted by the lifting pins 82 via the insertion holes 126 of the carrier 40, but the element cover 122 may be lifted by the lifting pins 82 without via the insertion holes 126. In this case, for example, the edge of the element cover 122 may protrude from the edge of the carrier 40, and the edge of the element cover 122 may be lifted up by the lift pins 82.

In the above embodiment, the element cover 122 is lifted up from the right under the carrier 40 by the lift-up pins 82, but for example, the element cover 122 may be lifted up from the obliquely under the carrier 40 by the lift-up pins 82. In other words, the element cover 122 may be lifted up by the lift pins 82 from below the carrier 40, in other words, from a position lower than the lower surface of the carrier 40.

In the above-described embodiment, the entire element cover 122 is lifted up by the lift pins 82 and separated from the carrier 40, but only a part of the element cover 122 may be separated from the carrier 40 to such an extent that the influence of the magnetic force of the magnet 120 becomes weak. In other words, by the jack-up of the jack-up pin 82, even if the entire element cover 122 is not lifted from the carrier 40, at least a part of the element cover 122 may be lifted from the carrier 40. In addition, the shape of the jack-up pin 82 is not limited. Any member may be used as long as it can lift the element cover 122 from the carrier 40.

In the above embodiment, the element cover 122 is placed on the carrier 40 so as to cover a part of the electric element 112, thereby preventing the positional deviation of the electric element 112, but the positional deviation of the electric element 112 can be prevented by placing the element cover 122 and other members so as to overlap the electric element 112. For example, a plate-like member having a small mass may be placed so as to cover the entire electric element 112, or a block-like member having a large mass may be placed on a part of the upper surface of the electric element 112. The fixation of the element cover 122 to the carrier 40 is not limited to the magnetic material or the magnet, and may be, for example, a structure using an adhesive substance or a structure in which the element cover 122 is made of a soft material such as rubber. The element cover 122 may be formed using a material having a high specific gravity with respect to the electric element 112.

In the above-described embodiment, the mounting operation of the electric component 112 and the mounting/dismounting operation of the component cover 122 are selectively performed by the same suction nozzle 140 mounted on the mounting head 24, but the mounting operation of the electric component 112 and the mounting/dismounting operation of the component cover 122 may be selectively performed by different kinds of suction nozzles. In other words, for example, the component cover 122 may be held by a nozzle having a large nozzle diameter mounted on the mounting head 24, and the electrical component 112 may be held by a nozzle having a small nozzle diameter, which is another type of holder that is automatically replaced by the mounting head 24, from among a plurality of types of holders provided in the nozzle station. The suction nozzle 140 may be a metallic component suction nozzle used in a case where an electrical component is mounted on a circuit board in a normal mounting machine.

In the above embodiment, one electronic component mounting machine 10 is provided with one mounting head 24, and the electrical component 112 and the component cover 122 are held by the one mounting head 24, but one electronic component mounting machine may be provided with two or more mounting heads, and the electrical component 112 and the component cover 122 may be held by one mounting head of the two or more mounting heads. Further, the electric element 112 and the element cover 122 may be held individually by two or more mounting heads. In the case where the electrical component 112 and the component cover 122 are held by two or more separate mounting heads, the same type of suction nozzle may be mounted on the two or more mounting heads, and the electrical component 112 and the component cover 122 may be held by these same type of suction nozzles. On the other hand, different types of suction nozzles may be mounted on two or more mounting heads, and the electrical component 112 and the component cover 122 may be held by the different types of suction nozzles. Further, the work may be performed by holding the electric component 112 and the component cover 122 simultaneously by two or more mounting heads. By using a plurality of mounting heads, various kinds of electric components and component covers can be held and work can be performed, and further, cycle time can be shortened. In addition, two or more individual mounting heads may be mounted on one moving device and moved simultaneously, or a plurality of moving devices may be provided in one electronic component mounting machine and each mounting head may be moved individually.

In the above embodiment, the electrical component 112 is mounted on the carrier 40, but the electrical component 112 may be mounted on a circuit board or the like. In this way, when the electric element 112 is mounted on a circuit board or the like and the circuit board is electrically connected to the electric element 112, a circuit is formed by the circuit board and the electric element 112. In other words, the component on which the element cover 122 is mounted may be an element that does not constitute a circuit, or may be an element that constitutes a circuit.

Further, for example, in the above-described embodiment, the holding operation of the electric component 112 and the holding operation of the component cover 122 are selectively performed by the suction nozzle 140, but the holding operation of the electric component 112 and the holding operation of the component cover 122 may be selectively performed by holding a holding member of the component, that is, a so-called collet, by two or more claw members. In such a case, it is easy to hold the element cover 122 by forming a projection or the like gripped by the collet.

In addition, a plurality of component covers 122 may be simultaneously transferred by a plurality of holding devices (for example, suction nozzles) provided in one mounting head.

When the transport and holding device transports and holds the circuit board and the circuit board is mounted with the electric components, the lift table 80 is automatically mounted with a plurality of support pins for holding the lower surface of the circuit board.

The electric element 112 and the other electric element 180 used in the above embodiment may be different types of electric elements or the same type of electric elements.

In the above embodiment, the element cover 122 mounted on the carrier 40 is lifted up by the lift pins 82 in a state where the carrier 40 is not held by the holding device 88, but the element cover 122 mounted on the carrier 40 may be lifted up by the lift pins 82 in a state where the carrier 40 is held by the holding device 88 and positioned.

Claims

1. A working machine is provided with:

a carrying device for carrying in a plate-like member in a state where elements not constituting a circuit are mounted;

a jack-up member for jack-up the element which does not constitute a circuit from below the plate-like member carried in by the carrying device, thereby separating the element from the plate-like member; a kind of electronic device with high-pressure air-conditioning system

A work head for holding the element which is jacked up by the jacking component and does not form a circuit,

the work head also holds the elements that make up the circuit.

2. The work machine of claim 1, wherein,

the work head holds the component by the suction nozzle.

3. In a work machine provided with a work head for holding a circuit-constituting element and carrying in a state where a circuit-non-constituting element is mounted thereon, a method for carrying the circuit-non-constituting element from the plate-like element,

the component handling method includes:

a separation step of lifting the element that does not constitute the circuit by a lifting member from below the plate-like member carried into the working machine, thereby bringing the element into a state of being separated from the plate-like member; a kind of electronic device with high-pressure air-conditioning system

And a carrying step of carrying the non-circuit-forming element, which is held by the work head and is separated from the plate-like member in the separating step, from above the plate-like member.