JPWO2021014639A1 - - Google Patents
Info
- Publication number
- JPWO2021014639A1 JPWO2021014639A1 JP2021534509A JP2021534509A JPWO2021014639A1 JP WO2021014639 A1 JPWO2021014639 A1 JP WO2021014639A1 JP 2021534509 A JP2021534509 A JP 2021534509A JP 2021534509 A JP2021534509 A JP 2021534509A JP WO2021014639 A1 JPWO2021014639 A1 JP WO2021014639A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/029202 WO2021014639A1 (en) | 2019-07-25 | 2019-07-25 | Work machine, and method for conveying component |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021014639A1 true JPWO2021014639A1 (en) | 2021-01-28 |
JP7271673B2 JP7271673B2 (en) | 2023-05-11 |
Family
ID=74193285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021534509A Active JP7271673B2 (en) | 2019-07-25 | 2019-07-25 | Work machine and part transportation method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7271673B2 (en) |
CN (1) | CN114208411B (en) |
WO (1) | WO2021014639A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004346398A (en) * | 2003-05-23 | 2004-12-09 | Sekisui Chem Co Ltd | Film deposition device for magnetic-material substrate |
JP2012222186A (en) * | 2011-04-11 | 2012-11-12 | Ulvac Japan Ltd | Transfer system of magnetic sheet, carrier and transfer method of magnetic sheet |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4790258A (en) * | 1987-04-03 | 1988-12-13 | Tegal Corporation | Magnetically coupled wafer lift pins |
JPH09237995A (en) * | 1996-02-29 | 1997-09-09 | Olympus Optical Co Ltd | Separation and recovery equipment of flexible printed circuit board |
JP3825628B2 (en) * | 2000-12-28 | 2006-09-27 | 太陽誘電株式会社 | Flexible circuit board holder and flexible circuit board holding method using the same. |
JP3981259B2 (en) * | 2001-11-01 | 2007-09-26 | 松下電器産業株式会社 | Substrate support jig |
JP3922191B2 (en) * | 2003-03-07 | 2007-05-30 | 松下電器産業株式会社 | Substrate fixing apparatus and substrate fixing method |
JP4454549B2 (en) * | 2005-07-26 | 2010-04-21 | 信越ポリマー株式会社 | Circuit board mounting and joining method |
-
2019
- 2019-07-25 CN CN201980098557.4A patent/CN114208411B/en active Active
- 2019-07-25 WO PCT/JP2019/029202 patent/WO2021014639A1/en active Application Filing
- 2019-07-25 JP JP2021534509A patent/JP7271673B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004346398A (en) * | 2003-05-23 | 2004-12-09 | Sekisui Chem Co Ltd | Film deposition device for magnetic-material substrate |
JP2012222186A (en) * | 2011-04-11 | 2012-11-12 | Ulvac Japan Ltd | Transfer system of magnetic sheet, carrier and transfer method of magnetic sheet |
Also Published As
Publication number | Publication date |
---|---|
CN114208411A (en) | 2022-03-18 |
WO2021014639A1 (en) | 2021-01-28 |
CN114208411B (en) | 2023-12-05 |
JP7271673B2 (en) | 2023-05-11 |
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