JPH06336310A - Electronic part supplier - Google Patents

Abstract

PURPOSE:To decrease arranging space, while a stock amount can be increased, by providing a part take out means and a tray removing means. CONSTITUTION:A device has a base material 4 having a take out area S1 for loading a plurality of sheets of trays 5 of storing electronic parts in a stacked condition and a collecting area S2 for loading an unnecessary tray 5 in a stacked condition, storage units CA, CB for storing a plurality of steps of the base materials 4, lift tables T1, T2 liftably supported relatively relating to these storage units CA, CB and lift means 35, 36 for relatively lifting these lift tables T1, T2 relating to the storage units CA, CB. The device has a drawing out means provided in the lift tables T1, T2 to further draw out the base material 4 from the storage units CA, CB, part take out means 17 positioned in a part supply area to further pick up an electronic part from the tray 5 in the take out area S1 and a tray removing means 18 for transfer loading an unnecessary tray 4 from the take out area S1 to the collecting area S2 of the base material 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component supply device capable of stocking many trays in a small arrangement space.

[0002]

2. Description of the Related Art As a device for supplying electronic components to an electronic component mounting device such as a chip mounter, base materials for holding trays are stored in a storage rack in multiple stages, and a desired tray is supplied from the storage rack. It is often used to draw out the electronic component in the tray, pick up the electronic component in the tray with the suction head, and deliver it to the transfer head of the electronic component mounting apparatus.

Now, FIG. 18 is a perspective view showing a state in which a tray is held in a conventional electronic component supply apparatus. In FIG. 18, reference numeral 1 is a plate-shaped base material, and trays 2a, 2b, 2 for accommodating electronic components of the same type on the base material 1
c and 2d are placed and held.

[0004]

However, in the conventional electronic component supplying apparatus, the trays 2a to 2d are placed on the base material 1 one by one in plan view. Therefore, there is a problem that the number of trays that can be placed is limited depending on the area of the upper surface of the base material 1, and as a result, the stock amount of electronic components is limited. On the other hand, if the area of the base material is increased and the stock amount is increased, the scale of the electronic component supply device for accommodating the base material increases,
There is a problem that a large arrangement space is required.

In order to increase the stock amount of electronic components, it is conceivable to hold trays for storing electronic components of the same type on a plurality of base materials and store them in a storage rack, but they can be stored in a storage rack. Since the number of base materials is limited, the number of types of electronic components that can be handled is small, and it is difficult to supply many types of electronic components.

Therefore, an object of the present invention is to provide an electronic component supply device which can stock many types of electronic components even in a small arrangement space and can increase the stock amount per one type. To do.

[0007]

In the electronic component supply apparatus of the present invention, a plurality of trays for housing electronic components are placed in a stacking state and an unnecessary tray is placed in a stacked state. A base material having a collection area, a storage body for storing the base material in a plurality of stages, a lifting table supported so as to be able to move up and down relatively to the storage body, and the lifting table relative to the storage body. Lifting means for lifting up and down, pulling means for pulling out the base material from the storage body, which is provided on the lifting table, and component removing means for picking up electronic components from the tray located in the component supply area and in the removal area, And a tray removing means for transferring the unnecessary tray from the area to the collecting area of the base material.

[0008]

With the above construction, since the trays are stacked and placed on the base material, the stock amount can be increased even with a smaller base material. In addition, a take-out area and a collection area are provided in the base material, trays containing electronic components are stacked in the take-out area, unnecessary trays are stacked in the collection area, and unnecessary trays are taken out by the tray removing means. Since it was transferred to the collection area from
There is no need to install equipment for stocking unnecessary trays, and the installation space can be further reduced.

[0009]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a perspective view showing a state in which an electronic component supply device TF according to an embodiment of the present invention is set in an electronic component mounting device CM. CV of the electronic component mounting equipment CM
Is a conveyor that is provided in the horizontal direction in the X direction and that conveys and positions the substrate A, and H is a transfer head that mounts electronic components at a predetermined position on the substrate A. In addition to the electronic component supply device TF of this embodiment, a tape feeder F is provided in parallel in the electronic component mounting device CM as a means for supplying electronic components to the transfer head H.

Next, with reference to FIG. 2, the structure of the electronic component supply apparatus TF of this embodiment will be described.

Reference numeral B denotes a vertically long main body box, and storage shelves CA and CB as storage bodies are arranged in upper and lower two stages on the inner side of the inner space of the main body box B. The base material 4 can be stored in each of the horizontal stages of the storage shelves CA and CB. Then, on one base material 4, a plurality of trays for accommodating electronic components of the same type in a matrix are placed in a stacked state. See also FIG.
As shown in FIG.
1 and B2 are hinged so that they can be opened and closed freely.
When the opening 2 is opened, the base material 4 on each stage of the storage shelves CA and CB can be put in and taken out.

Next, the base material 4 and the like will be described with reference to FIGS. FIG. 3 is a perspective view of the base member 4 and the tray 5 of the electronic component supplying apparatus according to the embodiment of the present invention, and FIG. 4A is a plan view of the base member of the electronic component supplying apparatus according to the embodiment of the present invention. 4 (b) is the same base material 4
FIG. 4 is a front view showing a state in which a plurality of trays 5 are placed in a stacked state in FIG. In FIG. 3, among the side edges of the base material 4, the side edge 4a on the front left side of FIG. 3 and the side edge 4b facing the side edge 4a are greatly bent downward to enhance the strength of the base material 4. . Thereby, even if a plurality of trays 5 are placed, the tray 5 is formed so as not to bend. The side edges 4a and 4b are slidably guided by guide rails of a table described later. Also, FIG.
The side edge 4c on the front right side is bent slightly so that it can be engaged with an engaging claw of a table described later.

The base material 4 has a take-out area S1 on which a plurality of trays 5 for accommodating electronic parts are placed in a stacked state,
A recovery area S2 on which the unnecessary trays 5 are placed in a stacked state is provided. Of these, in the vicinity of the take-out area S1, the base material 4 is provided with positioning pins 6, 7, 9, 10, 11 which penetrate the base material 4 upward and stand upright. , 10, 11
The tray 5 is positioned at a predetermined position on the base material 4 by coming into contact with the side portion of the tray 5. Of these, the positioning pins 6 and 7 are fixed to the base member 4,
The positioning pins 8, 9, 10, 11 slidably pass through the slits 4e, 4f, 4g, 4h formed in the base material 4, respectively, and the positioning pins 8, 9, 10,
Magnet plates 12 and 1 to which the lower end of 11 is fixed
The positions of the slits 4e, 4f, 4g, and 4h are maintained by magnetically adhering the base materials 4 and 3 and 14 to each other. When the size of the tray 5 changes, the positions of the positioning pins 8, 9, 10, 11 are changed for convenience, and the tray 5 is positioned at a predetermined position on the base material 4. In this example, the magnet plate 12,
Positioning pins 8, 9, 10, 1 due to magnetic forces of 13, 14
Although the position of No. 1 is determined, various changes such as the determination of these positions with screws or the like may be made. The recovery area S2 has the same structure as the extraction area S1, and the positioning pins 96, 97, 99, 100, 1
01 corresponds to the positioning pins 6, 7, 9, 10, and 11. The slits 4i to 4l are the slits 4e to 4e.
4h, the magnet plates 102 to 104 correspond to the magnet plates 12 to 14, respectively.

In FIG. 2, 16 is an electronic component supply device T.
In the component supply area of F (area having an intermediate height between the storage shelves CA and CB), it is a moving body that moves in the XY directions, and electronic components are sandwiched on the conveyor CV side of this moving body 16. A component take-out head 17 that is a component take-out means having a chuck 17a and a nozzle 17b for sucking an electronic component at the bottom is provided, and the unnecessary trays 5 (in the present specification, unnecessary trays are referred to as unnecessary trays 5 on the storage shelves CA and CB side. , Including trays that have been emptied after the supply of electronic components has been completed, and trays that have been identified as defective electronic components by the camera stage 23, which will be described later, and that have returned these defective electronic components. A tray transfer head 18 is provided as a tray removing means for transferring and transferring to the recovery area S2. That is, the tray transfer head 18 and the component pickup head 17 are
6 and 6 are integrally provided to move the component supply area in the XY directions. Further, 19 is an X-axis arm that holds the moving body 16 so as to be movable in the X direction, and 20 is an X-axis arm 1.
An X motor 21 for moving the moving body 16 in the X direction by driving a feed screw (not shown) incorporated in the device 9.
Is a Y-axis arm that holds the X-axis arm 19 so as to be movable in the Y-direction, and 22 is a drive screw (not shown) built in the Y-axis arm 21 that drives the X-axis arm 19 to move.
Is a Y motor that moves the Y direction. Therefore, X
By driving the motor 20 and the Y motor 22, the component take-out head 17 and the tray transfer head 18 can be moved in the XY directions within the component supply area. In this embodiment, the tray transfer head 18 is provided separately from the chuck 17a, but the chuck 17a may be used as the tray removing means.

Further, 23 is arranged in the vicinity of the conveyor CV, and the chuck 17a of the component take-out head 17 or the nozzle 1 is provided.
The camera stage has a built-in camera for observing the position, posture, etc. of the electronic parts taken out from the tray 5 by 7b, etc., and 24 is for mounting the electronic parts taken out from the tray 5 and for correcting misalignment and the like. It is a component positioning unit of. The camera stage 23 and the component positioning unit 24 are selectively used according to the type of electronic component. For example, one having a fine lead such as QFP is to the camera stage 23, and odd-shaped components are to the component positioning unit 24. It is designed to be transferred by the component take-out head 17. Then, the electronic component observed on the camera stage 23 and the electronic component whose position is corrected by the component positioning unit 24 are adsorbed by the transfer head H (see FIG. 1) of the electronic component mounting apparatus CM, and on the substrate A. Mounted in place. In addition, 25 is a component positioning unit 2
4 is a height adjusting motor, and 26 is a nozzle holder for holding a replacement nozzle 27.

Next, a delivery means for delivering the base material 4 from the storage shelves CA, CB to the elevating means and an elevating means for bringing the base material 4 to the component supply area will be described. In FIG. 2, 30 is a frame vertically provided in the internal space of the main body box B, 31 and 32 are vertical feed screws rotatably supported by the frame 30, and 35 and 36 are these feed screws 31. , 32 are motors for driving the table up and down independently of each other. Further, 33 and 34 are guide rods which are vertically supported by the frame 30, and two upper and lower elevating tables T1 and T2 are guided by the guide rods 33 and 34 so as to be vertically movable.

FIG. 5 is a perspective view showing a state in which the base material 4 is removed from the lifting table T1. Since the lifting table T2 has the same configuration as the lifting table T1, only the lifting table T1 will be described. Reference numeral 40 denotes a table frame of the elevating table T1. The table frame 40 is horizontal and has a substantially U shape.
A notch 40a is provided to allow entry and exit of 46.
Reference numerals 37 and 38 denote sliders provided on the back of the table frame 40. These sliders 37 and 38 are the guide rods 3.
It is slidably engaged with 3, 34. Reference numeral 39 denotes a nut portion provided on the back of the table frame 40, and the nut portion 39 is screwed onto the feed screw 31. Therefore, by driving the motor 35 and rotating the feed screw 31, the elevating table T1 can be moved up and down in the Z direction. When the elevating table T2 is moved up and down, the motor 36
Is driven to rotate the feed screw 32. 41 is axially mounted on the table frame 40 and faces the Y direction in a horizontal plane,
The guide shafts 41 are a pair of guide shafts, and the guide shafts 41 have sliders 43, 44 provided under the reciprocating plate 42.
Is slidably inserted. Reference numerals 45 and 46 are engagement claws fixed to the upper surface of the reciprocating plate 42 with a space therebetween, and the tip ends of these engagement claws 45 and 46 are bent upward in a key shape, and the base member 4 described above is provided. It is formed so that it can be engaged with the side edge 4c (see FIG. 3). 47 is the table frame 4
This is a shaft support provided near the center of 0, and this shaft support 4
7 pivotally supports one end of the swing arm 48 so as to swing in a horizontal plane. A bearing 48b is attached to the upper surface of the other end of the swing arm 48, and the bearing 48b is slidably engaged with an elongated hole 42a formed in the reciprocating plate 42. A long hole 48a is formed in the middle of the swing arm 48, and a bearing 49a mounted on the upper surface of the peripheral portion of a rotating plate 49 rotating in a horizontal plane is slidable in the long hole 48a. Is engaged with. Reference numeral 50 is a motor for rotating the rotary plate 49 via the gear box 51. The gear box 51, the motor 50, and the like are supported by a long plate 53 provided under the table frame 40. 52,
Reference numeral 53 is a guide rail that slidably engages the side edges 4a and 4b of the base material 4 on the upper surface of the table frame 40 and guides the movement of the base material 4.

Therefore, as shown in FIG.
0 to drive the rotating plate 49 to rotate the reciprocating plate 42
6 to the left from the position indicated by the solid line in FIG. 6 so that the engaging claws 45, 46 project through the notches 40a as shown by the dashed line in the figure, and engage with the side edge 4c of the base material 4 in the storage shelf CA. Can be combined. Then, the rotary plate 49 is rotated in the opposite direction to the above, and is pulled up to the position indicated by the chain double-dashed line in FIG. 6 to guide the base material 4 by the guide rails 52 and 53, and pull out the base material 4 onto the lifting table T1. be able to. Then, by driving the motor 35 as an elevating means to elevate the elevating table T1, the moving member 16 (see FIG. 2) is moved to the component supply area where the base member 4 and the base member 4 move in the XY directions. The tray 5 placed on the can be moved.

In FIG. 2, reference numerals 57 and 58 denote tray sensors as tray height detecting portions. The tray sensors 57 and 58 are arranged in the component supply area and indicate the position of the upper surface of the tray 5 in the height direction. It is detected whether or not the tray 5 is at a height at which the component take-out head 17 can pick up an electronic component from the tray 5.

FIG. 7 is a block diagram showing the control means 70 of the electronic component supply apparatus of this embodiment. 71 is the ROM 7
CP that controls other elements by the control program in 2
U and 73 are RAMs for storing component stock information for each storage stage of the storage shelves CA and CB shown in FIG. 8 and component supply information for each board type shown in FIG. 9, and 74 is a lifting mechanism unit 7.
5, drawer mechanism 76, pick and place mechanism 7
7, an interface for connecting to the CPU 71,
The interface 74 includes an electronic component mounting device CM.
The control unit 80 is also connected. Here, as shown in FIG. 9, the component supply information of the RAM 73 is provided for each of a plurality of board types, and can be adapted to a plurality of types. When the CPU 71 receives a command from the control unit 80 of the electronic component mounting apparatus to take out a component of a certain type, the CPU 71 confirms the type and stores it in the storage shelf CA,
Among the CB storage stages, the storage stage for storing the parts of this type is confirmed by referring to the parts stock information. Then, the elevating mechanism 75 is controlled so that the base material of the storage stage reaches the component supply stage or the standby stage (described later).

The electronic component supply apparatus according to this embodiment has the above-mentioned structure. Next, the operation of the electronic component supply apparatus according to this embodiment will be described with reference to FIGS. In FIG. 10, the base materials 4P, 4Q, 4R and 4S on which the tray 5 is placed in a stacked state are stored in each storage stage of the storage shelf CA, and the base materials 4T, 4U and 4V are stored in the storage shelf CB. At the same time, the lowermost base material 4W of the storage shelf CB is pulled out onto the second lifting table T2.
Shows the state of being located in the component supply area A2. The nozzle 17b of the component take-out head 17 is
The electronic component P is picked up from the uppermost tray 5 stacked on the U and is about to be transferred to the camera stage 23. Further, the first elevating table T1 is located slightly below the base material 4P stored in the uppermost stage of the storage shelf CA, and the engaging claw 46 is projected. When the motor 35 is driven from this state to raise the lifting table T1 by a small distance, the engaging claw 46 can be engaged with the side edge 4c of the base member 4P. In addition, in FIGS. 10 to 17,
For simplicity, each of the storage shelves CA and CB is shown as storing four base materials, but it goes without saying that they may be stored in multiple stages.

46x is an engaging claw of the second lifting table T2, A1 is a standby area of the first lifting table T1 immediately above the component supply area A2, and A2 is immediately below the component supply area A2. It is a waiting area for the second lifting table T2.

Then, as shown in FIG. 11, in the component supply area A2, the component take-out head 17 reciprocates in the direction of arrow N1 to take out the take-out area S1 of the second lifting table T2.
The electronic components P are taken out from the uppermost tray 5 in FIG. 1 and sequentially mounted on the camera stage 23 or the component positioning unit 24 by the nozzles 17b. Further, the motor 50 of the first elevating table T1 operates, and the uppermost base material 4P of the storage cabinet CA is pulled out onto the elevating table T1 as shown by an arrow N2. The electronic component P placed on the camera stage 23 or the component positioning unit 24 is picked up by the transfer head H (see FIG. 1) of the electronic component mounting apparatus CM.

Next, as shown in FIG. 12, the electronic component P placed on the camera stage 23 or the component positioning unit 24 is picked up by the nozzle N of the transfer head H (see FIG. 1) of the electronic component mounting apparatus CM. To be done. Also,
While the transfer operation of the electronic component P by the nozzle 17b is repeated in the component supply area A2, the motor 35 operates,
The first lifting table T1 is lowered to the waiting area A1.

Then, the uppermost tray 5 of the base material 4U
When the tray is empty, the empty tray 5 is transferred to the recovery area S2 by the tray transfer head 18 as shown by an arrow N4 in FIG. In this way, since the collection area S2 of the empty tray 5 is arranged on the same base material 4 adjacent to the take-out area S1, the loss time required for removing the empty tray 5 is minimized. Can be suppressed to

Next, as shown by the arrow N6 in FIG. 14, the second lifting table T2 located in the parts supply area A2 is
The first lifting table T1 in the waiting area A1 is indicated by an arrow N8 after the base material 4W of the storage shelf CB is lowered to the lowest stage to be stored and the moving body 16 is retracted to the camera stage 23 side. So as to descend to the parts supply area A2. In this way, the lifting table holding the base material to be transferred to the next supply area is made to stand by in the standby area immediately near the component supply area A2, so that the lifting tables can be switched extremely quickly. it can.

Then, the engaging claw 46x is moved in the direction of arrow N7 to store the base material 4U on the second lifting table T2 in the lowermost stage of the storage shelf CB.

Next, as shown in FIG. 15, from the uppermost tray 5 in the take-out area S1 on the base material 4P which has newly reached the part supply area A2, the electronic parts are picked up by the parts take-out head 17 as shown by an arrow N9. At the same time as the part P is taken out, as shown by an arrow N10, the lifting table T2 is raised to the height of the base material 4V on which the tray where the parts should be taken out next is placed.

Then, as shown in FIG. 16, the engaging claws 46x of the elevating table T2 are pulled in, and the base material 4V on which the tray for taking out the next component is placed is pulled out onto the elevating table T2. Further, as shown in FIG. 17, the motor 36 is operated to raise the second elevating table T2 to the standby area A3 in order to take out components from the tray 5 on the base material 4P. Then, when the electronic components are taken out from the tray 5 on the first elevating table T1, the first elevating table T1 is moved up to store the base material 4P in the storage shelf CA, and at the same time, the second elevating table T2.
The table switching operation for moving the parts to the parts supply area A2 is performed.

The electronic component supply apparatus of the present embodiment is provided with two lifting tables, and when one lifting table is in the component supply area, the other lifting table is made to stand by in the standby area, and when the tables are switched, it waits. The elevating table in the area can be immediately brought to the component supply area, and the loss time when switching the tray for supplying electronic components to another type can be reduced. In addition, for example, a base material holding a tray that stores electronic components to be delivered to the component supply area in an even number is placed on the storage shelf CA, and electronic components to be delivered to the component supply area in an odd number are stored in the storage shelf CB. If the base material holding the tray is placed, the first elevating table and the second elevating table can be alternately positioned in the component supply area, and the effect can be further enhanced.

[0032]

Since the present invention is configured as described above,
By placing the trays on the base material in a laminated state, it is possible to save space and increase the stock amount of each type of electronic component, and it is possible to supply many types of electronic components. Also, since the stock amount per base material increases, the frequency of replenishing parts can be reduced. Further, since the emptied trays are collected in the collection area of each base material, it is not necessary to classify the collected trays for each kind of electronic component.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which an electronic component supply device according to an embodiment of the present invention is set in an electronic component mounting device.

FIG. 2 is a perspective view of an electronic component supply device according to an embodiment of the present invention.

FIG. 3 is a perspective view showing a base material and a tray of an electronic component supply device according to an embodiment of the present invention.

FIG. 4A is a plan view showing a base material of an electronic component supply apparatus according to an embodiment of the present invention. FIG. 4B is a front view showing a base material and a tray of an electronic component supply apparatus according to an embodiment of the present invention.

FIG. 5 is a perspective view showing an elevating table of an electronic component supply device according to an embodiment of the present invention.

FIG. 6 is a plan view showing an elevating table of an electronic component supply device according to an embodiment of the present invention.

FIG. 7 is a block diagram of an electronic component supply device according to an embodiment of the present invention.

FIG. 8 is a data configuration diagram of component stock information of the electronic component supply device according to the embodiment of the present invention.

FIG. 9 is a data configuration diagram of component supply information of the electronic component supply device according to the embodiment of the present invention.

FIG. 10 is an operation explanatory diagram of the electronic component supply device according to the embodiment of the present invention.

FIG. 11 is an operation explanatory diagram of the electronic component supply device according to the embodiment of the present invention.

FIG. 12 is an operation explanatory diagram of the electronic component supply device according to the embodiment of the present invention.

FIG. 13 is an operation explanatory diagram of the electronic component supply device according to the embodiment of the present invention.

FIG. 14 is an operation explanatory diagram of the electronic component supply device according to the embodiment of the present invention.

FIG. 15 is an operation explanatory diagram of the electronic component supply device according to the embodiment of the present invention.

FIG. 16 is an operation explanatory diagram of the electronic component supply device according to the embodiment of the present invention.

FIG. 17 is an operation explanatory diagram of the electronic component supply device according to the embodiment of the present invention.

FIG. 18 is a perspective view showing a base material and a tray used in a conventional electronic component supply device.

[Explanation of symbols]

 4 Base Material 5 Tray 17 Parts Extraction Means 18 Tray Removal Means P Electronic Parts CA Storage Body CB Storage Body T1 Lifting Table T2 Lifting Table A2 Parts Supply Area S1 Extraction Area S2 Recovery Area

Claims (3)

[Claims] 1. A base material having a take-out area where a plurality of trays for accommodating electronic parts are placed in a stacked state and a recovery area where unnecessary trays are placed in a stacked state, and the base material. A storage body that stores a plurality of stages, a lifting table that is supported to be able to move up and down relatively to the storage body, a lifting means that moves the lifting table up and down relatively to the storage body, and the lifting table. And a means for pulling out the base material from the storage body, a means for picking up electronic components from a tray located in the parts supply area and in the pickup area, and an unnecessary tray for picking up an unnecessary tray from the storage area. An electronic component supply device comprising: a tray removing unit that is transferred to a material collecting area. 2. The electronic component supply apparatus according to claim 1, wherein the component take-out means and the tray collecting means move integrally. 3. The electronic component supply apparatus according to claim 1, wherein the tray collecting means is arranged in the vicinity of the component supply area.