JP3119040B2 - Electronic component supply device and electronic component supply method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component supply apparatus and an electronic component supply method that can be made compact.

[0002]

2. Description of the Related Art As a device for supplying electronic components to an electronic component mounting device such as a chip mounter, a base material on which trays are mounted is stored in a magazine in multiple stages, and a base for mounting a desired tray from this magazine is mounted. Materials that pull out materials, take out electronic components from this tray, and deliver them to an electronic component mounting apparatus are often used.

In a tray, electronic components are stored in a matrix. In a conventional electronic component supply device, a take-out head for taking out components moves in the X and Y directions, and necessary electronic components are taken out of a predetermined pocket of the tray. Had to be taken out.

[0004]

However, in such a configuration, the two-way moving means for the take-out head and the moving means for pulling out the base material from the magazine are indispensable. However, there is a problem that the structure is complicated and the scale must be increased in order to secure a moving space for the moving means, and the cost increases.

Accordingly, an object of the present invention is to provide an electronic component supply device and an electronic component supply method that can be configured compactly and at low cost.

[0006]

According to the present invention, there is provided an electronic component supply apparatus comprising: a base material on which a tray for storing electronic components is placed; and an electronic component taken out from the tray on the base material and transferred to an electronic component mounting apparatus. It has a take-out head to be delivered and received, a magazine for accommodating a base material, and a drawer for drawing out the base material so that an electronic component to be taken out of the magazine is located immediately below the take-out head.

[0007]

According to the above construction, the pull-out means can also serve as a relative movement means between the tray and the take-out head, so that the number of movement means can be reduced, and the size and cost can be reduced.

[0008]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an electronic component supply apparatus according to one embodiment of the present invention. 1, 1 is a main body box, 2
Is a magazine supported in the main body box 1 so as to be able to move up and down in the Z direction, 3 is a feed screw that is vertically supported by the main body box 1, 4 is connected to the side of the magazine 2, and is screwed to the feed screw 3. The feed nut portion 5 is a Z motor for driving the feed screw 3. Further, in the magazine 2, a base material 6 on which trays 7 for storing electronic components in a matrix are mounted in a stacked state is stored in multiple stages in the vertical direction.

Reference numeral 8 denotes a collection box for a tray provided at the front of the main body box 1. As shown in FIG. 2, which is a view taken along the line AA of FIG. 6, a feed screw 9 in the X direction as an extraction means, an X motor 10 for driving the feed screw 9, a feed nut portion 11 screwed to the feed screw 9, an arm 12 connected to the feed nut portion 11 and extending in the Y direction. Further, a pinching claw 13 (facing in the X direction) of the base member 6 is provided at the tip of the arm 12. The holding claws 13 are opened and closed by a cylinder (not shown) built in the arm 12.

Here, by driving the Z motor 5 to move the magazine 2 up and down, the tray 7 from which electronic components are to be taken out of the base material 6 stored in the magazine 2 in multiple stages.
Can be moved to the height at which the pinching claws 13 are located, and the edge of the base material 6 is
When the X motor 10 is driven while being sandwiched between the magazines 3, it can be pulled out of the magazine 2 as shown in FIG. 1 or FIG. In the illustrated example, a plurality of trays 7
Is placed, but one tray 7 may be placed on the base material 6.

In FIG. 1, H is a transfer head of an electronic component mounting apparatus installed beside the electronic component supply device of the present means, and N is its nozzle. Here, the take-out head 18 needs to move only in the Y direction. Also,
C is a conveyor of the electronic component mounting apparatus, and the conveyor C transports the substrate D in the X direction.

Further, in the electronic component supply apparatus of the present means, reference numeral 14 denotes a Y-axis arm provided on the upper part of the collection box 8 along the Y direction and immovably in the XZ direction. As shown in FIG. 2, the Y-axis arm 14 is provided with a feed screw 15 in the Y direction, a feed nut 16 screwed to the feed screw 15, and a Y motor 17 for driving the feed screw 15. Reference numeral 18 denotes a take-out head which is connected to the side of the feed nut portion 16 facing the magazine 2 and takes out electronic components from the tray 7 on the base material 6 drawn out as described above. As shown in FIG. 1, a first nozzle 19 for adsorbing electronic components having fine leads such as SOP and QFP, and a second nozzle 20 for adsorbing odd-shaped components and the like are mounted. The nozzle 20 is moved up and down by driving means in the take-out head 18. Reference numeral 21 denotes a nozzle holder for accommodating a nozzle to be replaced or a spare nozzle according to the type of electronic component, 22 a positioning unit for correcting a misalignment of a deformed component or the like with a positioning claw or the like, 23 Is a camera stage having a built-in camera for observing the position and orientation of electronic components having fine leads such as SOP and QFP. Here, the first nozzle 19
The second nozzle 20, the component positioning unit 22, and the camera stage 23 can be used properly depending on the type of component. For example, when taking out the QFP, the Y motor 17
To drive the tray 7 with the first nozzle 19 of the take-out head 18.
, And drives the Y motor 17 to place the picked-up QFP on the camera stage 23. Then, the nozzle N of the transfer head H picks up the QFP from the camera stage 23 as shown by the arrow N1, makes necessary corrections by reflecting the observation result on the camera stage 23, and mounts the QFP on the substrate D. I do. On the other hand, when removing the deformed component, the second nozzle 20 places the picked-up deformed component on the component positioning unit 22 in the same manner as described above. Then, the component positioning unit 22
After the position is corrected, the mounting head H performs the mounting operation as indicated by the arrow N2. A tray collection head 24 is fixed to the Y-axis arm 14 on the side opposite to the take-out head 18, and a tray collection nozzle 25 is moved up and down by a driving unit in the tray collection head. 1 to 3
, The tray collection box 8 is
It is provided below the base material 6 drawn out of the magazine 2
And the tray collection head 24 has a tray collection box.
Provided above the switch 8. And the pinching claw 13 is
X direction between the ray collection box 8 and the tray collection head 24
Move in the direction.

Here, as shown in FIG. 2, in the electronic component supply device of this embodiment, the first nozzle 19 and the second nozzle 20 of the take-out head 18 move on the movement line L, and the nozzle holder 21 , A component positioning unit 22 and a camera stage 23 are arranged on the movement line L. Also,
Nipping claw 13 as means for pulling out base material 6, X motor 1
Numeral 0 draws out the base member 6 so that the pocket 7a (see FIG. 2) of the tray 7 for storing the electronic component P to be taken out is located on the movement line L. in this way,
The extraction means of the base member 6 also serves as a movement means in the X direction relative to the extraction head 18, and the nozzle holder 21, the component positioning unit 22, and the camera stage 23 are arranged on the movement line L of the extraction head 18. As a result, the number of moving axes can be reduced, so that cost reduction and compactness can be achieved at once.

The electronic component supply device of this embodiment has the above-described configuration. Next, the operation of the device will be described with reference to FIG.

First, as shown in FIG.
The X-motor 10 is driven to move the base member 6 in the direction of the arrow N3, and the tray 7 for storing the electronic component P to be taken out is located immediately below the moving line L.
Align the x pocket. At the same time, the Y motor 17 is driven to move the take-out head 18 in the Y direction, and the electronic component P is picked up from the pocket by the first nozzle 19. Then, the electronic component P is transferred to the camera stage 23 as described above, and the electronic component P is transferred to the transfer head H. When picking up a deformed part, it is transferred to the part positioning unit 22 by the second nozzle 20 as described above.
For simplicity, only the case where the first nozzle 19 is used will be described below.

If the electronic components on the tray 7x are out of stock as a result of continuing to take out the electronic components from the uppermost tray 7x in FIG. 3A, FIG.
As shown in the figure, the clamping claw 13 is moved as indicated by an arrow N4, the uppermost tray 7x is sucked and picked up by the tray collection nozzle 25, and the uppermost tray 7x is separated from the next tray 7y and below. Let it.

Next, as shown in FIG.
Is moved as indicated by the arrow N5, and the entire base member 6 is stored in the magazine 2. Then, as shown in FIG. 3D, the suction of the tray collection nozzle 25 is released, and the used tray 7x is freely dropped into the collection box 8 immediately below to collect the used tray 7x.

Next, as shown by an arrow N6 in FIG. 3 (e), the base member 6 is pulled out again to take out the electronic components from the tray 7y which is newly positioned at the uppermost stage. .

As described above, in this embodiment, the tray collection head 24 is located above the collection box 8 as a collection stage.
At the intermediate position between the collecting head 24 and the collecting box 8, the base member 6 is put in and out by a drawing means such as the pinching claw 13, and the base member 6 is stored in the magazine 2. The tray collection nozzle 25 releases the tray 7, and the tray 7 can be collected very easily by simply dropping the tray 7 freely. The collection stage can be variously changed in addition to the illustrated collection box 8 and a collection conveyor.

[0021]

The present invention is constructed as described above.
It is possible to provide a compact and inexpensive electronic component supply device and an electronic component supply method by reducing the number of moving means.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component supply device according to an embodiment of the present invention.

FIG. 2 is a view taken in the direction of arrows in FIG. 1A-A.

FIG. 3A is an explanatory diagram of an operation of an electronic component supply device according to an embodiment of the present invention. FIG. 3B is an explanatory diagram of an operation of an electronic component supply device according to an embodiment of the present invention. Description of the operation of the electronic component supply device according to the example (d) Operational description of the electronic component supply device according to one embodiment of the present invention (e) Operational description of the electronic component supply device according to one embodiment of the present invention

[Explanation of symbols]

 2 Magazine 6 Base material 7 Tray 8 Collection box (collection stage) 10 X motor (drawing means) 13 Clamping claw (drawing means) 18 Pickup head

Claims (6)

(57) [Claims] 1. A base material on which a tray for storing electronic components is mounted, a take-out head for taking out electronic components from the tray on the base material and transferring the electronic components to an electronic component mounting apparatus, and a magazine for storing the base material And a drawer for drawing out a base material so that an electronic component to be taken out of the magazine is located immediately below the take-out head. 2. The magazine is pulled out of the magazine by the pulling means.
A tray collection stage below the base material
A tray collection head above the tray collection stage.
2. The electronic component supply device according to claim 1, wherein
Place. 3. The method according to claim 2, wherein the extracting head is moved by the extracting means.
To the Y direction perpendicular to the X direction, which is the direction in which the base material is pulled out
Providing a Y-axis arm to be moved, and
Also serves as a moving means in the X direction relative to the output head
3. The electronic part according to claim 1, wherein
Goods supply device. 4. The removal head is moved by the Y-axis arm.
The nozzle holder, component positioning unit,
At least one of the last stages must be installed
The electronic component supply device according to claim 3, wherein: 5. A tray which is housed in a magazine and is loaded
The base material from the magazine in the X direction
The tray containing the electronic components to be taken out.
Of aligning the head directly below the Y-direction movement line of the take-out head
Picks up electronic components from pockets
And moving the take-out head in the Y direction
Move parts to the part positioning unit or camera stage
Transferring electronic components to the transfer head after loading.
See If the electronic components in the tray are out of stock,
Is picked up by the tray collection head, and the tray collection
An electronic component supply method, wherein the electronic component is collected on a page. 6. A magazine drawn out of said magazine by said drawing means.
The tray collection stage is located below the base material
Above the tray collection stage, the tray collection head
The tray picked up by the tray collection head
Drop the ray onto the tray collection stage and collect it.
6. The electronic component according to claim 5, wherein Supply method.