TWI317542B - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Electronic component mounting apparatus and electronic component mounting method Download PDF

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Publication number
TWI317542B
TWI317542B TW093132151A TW93132151A TWI317542B TW I317542 B TWI317542 B TW I317542B TW 093132151 A TW093132151 A TW 093132151A TW 93132151 A TW93132151 A TW 93132151A TW I317542 B TWI317542 B TW I317542B
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Taiwan
Prior art keywords
electronic component
moving
component
mounting
camera
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TW093132151A
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Chinese (zh)
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TW200527987A (en
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Yakiyama Hideyuki
Emoto Yasuhiro
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Panasonic Corp
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Priority claimed from JP2003364273A external-priority patent/JP4222179B2/en
Priority claimed from JP2003364274A external-priority patent/JP4222180B2/en
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW200527987A publication Critical patent/TW200527987A/en
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Publication of TWI317542B publication Critical patent/TWI317542B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

1317542 t · 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種用以將一電子組件安裝到一電路 板上的電子組件安裝裝置及電子組件安裝方法。 【先前技術】 在本發明的領域中，一作為半導體晶片等半導體晶圓的 電子組件，係藉由一電子組件安裝裝置來安裝到一導線架 等的電路板，該安裝裝置係包含有一專用供應裝置。黏貼 有半導體晶圓之黏附片係以一晶圓環固持之狀態而被安裝 至該供應裝置，且當所有的半導體晶片由單一個晶圓環取 出時，該空晶圓環係藉由一更替裝置與另一個新的晶圓環 相互更替，該更替裝置係具有抓取與運載功能。例如，曰 本公告專利第 JP-A-10-270532或美國專利第 5,839，187 號。 另外，當半導體晶片由黏附片取出時，必須藉由一安裝 在晶圓環上的電子組件供應部，以高精確的定位方式來精 確地將半導體晶圓吸附及固持，並利用一可動地設置在該 電子組件供應部組件之影像拍攝照相機來確認半導體晶圓 在該黏附片上的位置。例如，曰本專利第 JP-A-2001-267335 號揭示者。 然而，根據現有的電子組件安裝裝置，該獨立設置的更 替裝置連結到該電子組件安裝裝置，這樣的狀態下導致一 個問題，也就是不可避免的龐大設備體積，且，爲了避免 以組件確認照相機來確認一組件的運作及晶圓環更替的運 5 326\專利說明書(補件)\94-02\93132151 1317542 作之間的相互干擾，在整個設備的運作上必定 的延遲狀況，因此，現有設備難以增進運作上 同時，近年來，半導體晶圓體積增加，且 1 體晶圓開始使用。因此，包含有數片半導體晶 尺寸及重量增加，現有設備的手動處理難度增 用一方法，係藉由一運載等之專用處理手段將 到一電子組件安裝裝置上。 然而，根據前述的日本公告專利第 J P - A - 1 0 美國專利第5，8 3 9，1 8 7號，當用以將晶圓環運 進行更替之一機構設置到該電子組件安裝裝置 上述的專用處理手段非常困難，因為該專用處 整體設備的體積增加。 【發明内容】 因此，本發明之目的係提供一種緊密的電子 置，及一具有高操作效率的電子組件安裝方法 供一種電子組件安裝裝置及電子組件安裝方法 施一可更替一晶圓等相關物件的組件固持夾具 裝置。 根據本發明，一電子組件安裝裝置係包含： 供應部，其係用以供應複數個排列成平面狀的 體以被一組件固持夾具所固持；一基板固持部 第一方向而設置在一遠離電子組件供應部的位 裝頭部，其係用以固持自電子組件供應部處取 件，並且安裝該電子組件到一固持在一基板固 326\專利說明書(補件)\94-02\93132151 6 導致一時間 的效率。 2 吋的半導 圓的盒體的 加，因此採 一盒體安裝 -270532 或 出及運入來 時，要使用 理手段造成 組件安裝裝 。尤其是提 ，以能夠實 的緊密構成 一電子組件 電子組件塊 ，其係沿一 置上；一安 出的電子組 持部的基板 1317542 上；一安裝頭部移動機構，其係使得該安裝頭部在電子組 件供應部及基板固持部之間移動；一組件影像拍攝照相 機，其係用以拍攝電子組件供應部上的電子組件之照片； 一組件識別處理部，其係藉由處理被組件影像拍攝照相機 所拍攝的影像而獲得一電子組件供應部上之電子組件的位 置；一移動元件，其係用以固持該組件影像拍攝照相機， 並藉由一組件影像拍攝照相機移動機構而沿第一方向在電 子組供應部上移動；以及一夾具更替機構，其係設置到該 移動元件，並藉由抓取電子組件供應部的組件固持夾具且 沿第一方向移動，來更替組件固持夾具。 根據本發明，一種電子組件安裝裝置係包含：一電子組 件供應部，其係用以供應複數個排列成平面狀的電子組件 塊體以被一組件固持夾具所固持；一基板固持部，其係沿 一第一方向而設置在一遠離電子組件供應部的位置上；一 組件安裝手段，其係用以固持自電子組件供應部處取出的 電子組件，並且安裝該電子組件到一固持在一基板固持部 的基板上；一移動元件，其上設置有一操作頭部，其係受 一操作頭部移動機構所驅動而沿第一方向移動；以及一夾 具更替機構，其係設置到移動元件，並藉由抓取電子組件 供應部的组件固持夾具且沿第一方向移動，來更替組件固 持夾具；其中夾具更替機構係包含有一夾具抓取部，其係 安裝到該可沿第一方向移動的移動元件，以抓取該電子組 件夾具；以及一前後移動手段，其係用以使該夾具抓取部 沿第一方向相對移動元件而前後移動。 326\專利說明書(補件)\94-02\93132151 7 1317542 藉由提供該安裝到該可沿第一方向水平移 桿上，而用以抓取組件固持夾具的夾具抓取部 用以沿第一方向相對設置在夾具更替機構上的 前後移動該夾具抓取部的前後移動手段，以供 組件固持夾具到電子組件供應部或自該處離開 夾具抓取部的衝力可確保不增加沿第一方向移 桿時所造成的衝力，且用以更替組件固持夾具 成緊密構成。 【實施方式】 (具體例1 ) 將參照圖式說明本發明具體例如下： 將參照圖1及圖 2說明一電子組件組裝裝 構。圖2係為圖1沿A-A線段的剖視圖。在圖 子組件併應部2係配置在一基座1上。如圖2 子組件供應部係具有一晶圓固持桌 3，該晶圓 拆卸地固持一晶圓環5，該晶圓環5係為一組讲 一伸展至晶圓環5的片體（圖中未示出）係黏貼 體晶片6 (此後簡稱如「晶片6」），該等晶片6 個個別塊體的狀態，且將晶圓環5固持至該晶 的狀態之電子組件，該電子組件供應部2將呈 之複數塊體之排列方式固持的晶片6供應到該 具。 如圖2所示，一退出器8配置在一被晶圓固 持的晶圓環5下側上，且藉由一退出器XY桌面 326傳利說明書(補件)\94-02\93132151 8 動的移動橫 ，及提供該 移動橫桿來 應及運出一 ，一移動該 動該移動橫 的裝置可達 置的全部結 1中，一電 所示，該電 固持桌係可 固持夾具。 有數個半導 係分開成數 圓固持桌3 現平面形狀 組件固持夾 持桌3所固 7來水平移 1317542 動。該退出器8具有一針抬昇機構，以將一退出針（ 示出）向上抬昇來將晶片向上推，且當該晶片6藉由 頭（稍後會提到）而自晶圓環5處取出時，藉由以退 將晶片6自晶圓環5下側往上推，該晶片6由設置 環5上的片體處片狀剝落脫離。該退出器8構.成一 落機構，以使得晶片6自伸展至晶圓環5的片體上 落。 另外，該片體剝落機構並不侷限在該退出器 8， 顯示一可將晶片自片體上剝落之機構。例如，可利 置自具有晶片的片體的下側處吸取該片體而使得晶 一吸力而自片體上剝落。 如圖1所示，一基板固持部1 0係配置在基座1 面處，在Y方向上（第一方向）且遠離電子組件供應 該基板固持部1 0的上側及下側處，係分別對應在X 的一基板運入輸送帶1 2、一基板分配部1 1、該基板 10、一基板傳遞部13及一基板運出輸送帶14。該 入輸送帶1 2係跨越在一連結到基座1的副基座1 £ 黏附貼設裝置9係設置在該副基座1 a上。該黏附貼 9係利用一黏附頭部9a，來貼附一用以黏附該晶片 劑到一基板1 6，其中該基板1 6以一係自上游側被 基板運入輸送帶1 2。 被貼附黏著劑的基板1 6接著被遞送入基板分配 該基板分配部1 1選擇性地分配自基板運入輸送帶 所得到的基板1 6到將在以下說明之該基板固持部 32 6\專利說明書(補件)\94-〇2\93〗32151 9 :圖中未 一安裝 出針來 在晶圓 片體剝 整片剝 這裡僅 用一裝 片受到 的上表 ;部2。 方向上 固持部 基板運 i，且一 設裝置 的黏著 運入該 部1 1。 1 2之上 1 0的兩 1317542 基板固持機構上。該基板固持部1 〇具有一第一基板固持機 構1 0 Α及一第二基板固持機構1 0 Β，以固持該被基板分配 部1 1所分配的基板1 6來定位到一組裝位置。該基板傳遞 部1 3選擇性接收來自於第一基板固持機構1 0 A及第二基板 固持機構1 0 B之已組裝的基板1 6，以傳遞到該基板運出輸 送帶1 4。該基板運出輸送帶1 4係將被傳遞的已組裝基板 1 6傳遞到下游側。 一晶圓供應部1 7係配置在一該基座1的上表面處，遠 離該電子組件供應部2，且沿Y方向（第一方向）而位於相 對該基板固持部1 0的一側。該晶圓供應部1 7係具有一盒 體固持部 1 7 a及一起重機構 1 8以抬起該盒體固持部 1 7 a 内的盒體，進而固持並抬起收容有數個呈積層狀態之晶圓 環5的盒體。 如圖 2所示，藉由以起重機構 1 8來抬起盒體，該晶圓 環 5 可定位到一運載水平面，以更替介於晶圓供應部 17 及電子組件供應部2之間的晶圓環5。定位在該運載水平 面的晶圓環5被一推抵機構1 9推向一右側方向，接著被將 在以下說明之一夾具更替機構4 9的扔擲部4 9 a所抓取，並 被運載至該電子組件供應部 2。另外，位於電子組件供應 部2上，且因所有晶片6被取出而閒置的晶圓環5，係被 該夾具更替機構4 9自該電子組件供應部2運出到達該晶圓 供應部17，且送回盒體。 圖1中，基座1上表面的兩端部係分別設置有一第一 Y 軸基座20A及一第二Y軸基座20B，各基座20A、20B的長 10 326\專利說明書(補件)\94-02\93132151 1317542 度方向平行γ方向（第一方向）並且垂直基板運載方向（χ方 向）。第一 Υ軸基座2 Ο Α及一第二Υ軸基座2 Ο Β係分別具有 一沿長度方向（Y方向）而延伸於各基座20A、20B全長的第 一方向導引元件2 1，兩第一方向導引元件21係相平行以 供電子組件供應部2及基板固持部1 0插置在兩第一方向導 引元件21之間。 兩第一方向導引元件 2 1上可滑動地設置有一第一橫桿 元件3 1、一中央橫桿元件3 0及一第二橫桿元件3 2等三個 橫桿元件，各橫桿元件係以兩端支撐型式而使兩端部分別 被位於Y方向的第一方向導引元件21上所支撐，一螺母元 件2 3 b係自中央橫桿元件3 0的右側之側端部突伸而出，一 饋送螺桿2 3 a係螺合在該螺母元件2 3 b，且受到一設置在 第一 Y軸基座2 Ο A的Y軸馬達2 2所驅動而沿水平方向轉 動。藉由驅動Y軸馬達2 2，該中央橫桿元件3 0在Y方向 上沿著第一方向導引元件2 1水平移動。 另外，第一及第二橫桿元件 31、3 2的左側側端部上係 分別突伸有螺母元件 2 5 b、2 7 b，且二饋送螺桿 2 5 a、2 7 a 係分別螺合在各螺母元件2 5b、2 7b上，且分別由一設置在 第二Y轴基座2 Ο B上的Y軸馬達2 4、2 6所驅動而沿水平方 向轉動。藉由驅動Y軸馬達24、26，第一及第二橫桿元件 3 1、3 2可在Y方向上沿著第一方向導引元件21水平移動。 該中央橫桿元件3 0上設置有一安裝頭部3 3及一饋送螺 桿4 1 a，饋送螺桿4 1 a係螺合到一連結至該安裝頭部3 3上 的螺母元件4 1 b，並且由一 X軸馬達4 0所驅動而旋轉。藉 11 326\專利說明書(補件)\94-02\93132151 1317542 由驅動該X軸馬達40，該安裝頭部33可被一設置在中央 橫桿元件3 0 —側面並且沿著X方向（第二方向）的第二方向 導引元件4 2 (見圖2 )所導引，而沿X方向（第二方向）移動。 該安裝頭部3 3係具有複數個（本例中為四個）嘴管3 3 a， 各嘴管3 3 a係分別固持晶片6之單一片，且該安裝頭部被 設計成於藉由吸附個別的晶片6方式而固持該等晶片6至 個別咀管3 3 a之狀態而可移動。藉由驅動Y軸馬達2 2及X 軸馬達4 0，該安裝頭部3 3係沿X及Y方向而水平移動， 並撿取而固持電子組件供應部2的晶片6且將該被抓取的 晶片6安裝到該被基板固持部1 0所固持的基板1 6的一電 子組件安裝位置1 6 a上。 另外，一用以撿取該晶片的機構可被獨立設置，且該安 裝頭可自該撿取機構接受並固持晶片。另外，較佳地，當 該撿取機構具有一晶翻轉機構，該晶片翻轉機構係可翻 轉基板上晶片的頭尾來進行覆晶安裝。 該對第一方向導引元件 21、中央橫桿元件 3 0、一用以 將中央橫桿元件3 0沿第一方向導引元件2 1移動之第一方 向驅動機構（Y軸馬達2 2、饋送螺桿2 3 a及螺母元件2 3 b )， 以及一用以將安裝頭部3 3沿第二方向導引元件4 2移動之 第二方向驅動機構（X軸馬達4 0、饋送螺桿4 1 a及螺母元件 4 1 b )係共同構成一安裝頭部移動機構，以使得該安裝頭部 3 3在電子組件供應部2及基板固持部1 0之間移動。 第一橫桿元件3 1上設置有一第一照相機3 4，以及一用 以固持該照相機3 4的托架3 4 a係與一螺母元件4 4 b連結。 12 326\專利說明書(補件)\94-02\93132151 1317542 一饋送螺桿44a螺合到該螺母元件44b且由' 所驅動而旋轉，且藉由驅動該X軸馬達43， 34受一第二方向導引元件45(見圖2)所導引 動，該第二方向導引元件4 5係設置在第一稽 一側面上。 藉由驅動該Y軸馬達24及X軸馬達43， 34係沿X及Y方向而水平移動。因此，該驾 可在基板固持部 1 0上移動以拍攝該固持在 板固持機構1 0 A、1 Ο B上的基板照片，且可被 位於基板固持部1 0上方的位置。 該對第一方向導引元件 21、第一橫桿元科 沿著第一方向導引元件2 1來移動第一橫桿Λ 方向驅動機構（Υ軸馬達2 4、饋送螺桿2 5 a及i 及一第二方向驅動機構（X軸馬達4 3、饋送螺 元件4 4 b )係共同構成一第一照相機移動機構 固持部1 0上移動該第一照相機3 4。 該第二橫桿元件 3 2 (移動橫桿）上係設置 機3 5，及一用以固持該第二照相機3 5的托 螺母元件4 7 b連結。一饋送螺桿4 7 a係螺合 47b且由一 X軸馬達46所驅動而旋轉，且藉 馬達4 6，該第二照相機3 5受一第二方向導引 2 )所導引而沿X方向移動，該第二方向導引；ή 在第二橫桿元件32的一側面上。 藉由驅動該Υ軸馬達26及X軸馬達46， 3M傳利說明書(補件)\94-〇2\93132151 13 —X轴馬達4 3 該第一照相機 而沿X方向移 Μ旱元件3 1的 該第一照相機 (一照相機 34 第一及第二基 移動，以離開 二3 0、一用以 件31之第一 k累母元件2 5 b ) 桿44a及螺母 &gt;以在該基板 有一第二照相 架3 5 a係與一 到該螺母元件 由驅動該X軸 元件4 8 (見圖 件4 8係設置 該第二照相機 1317542 35係沿X及Y方向而水平移動。因此，該第二照相機 35 可在電子組件供應部2上移動以拍攝該固持在電子組件供 應部2上的晶片6影像，且可被移動，以離開位於電子組 件供應部2上方的位置。 該對第一方向導引元件 21、第二橫桿元件 3 2、一第一 方向驅動機構（Υ軸馬達2 6、饋送螺桿2 7 a及螺母元件2 7 b ) 及一用以沿著第二方向導引元件48來移動第二照相機35 之第二方向驅動機構（X軸馬達3 6、饋送螺桿4 7 a及螺母元 件4 7 b)係構成一組件影像拍攝照相機移動機構，以移動其 為組件影像拍攝照相機之該第二照相機3 5。因此，該第二 橫桿元件 3 2以組件影像拍攝照相機移動機構沿著第一方 向在電子組件供應部2上移動。 該夾具更替機構4 9係設置在該具有第二照相機3 5之第 二橫桿元件32的一側表面。該夾具更替機構49係包含該 具有一扔擲爪的扔擲部（夾具抓取部）4 9 a，其中該扔擲爪係 用以捏住並抓取晶圓環5的一側的端部，該夾具更替機構 49 亦包含一扔擲部抬昇機構 49b 以用來抬昇該扔擲部 4 9 a。該扔擲爪係受一扔擲爪開/關機構4 9 c (見圖3 )驅動而 開啟或關閉。 藉由以驅動第二橫桿元件3 2來移動該夾具更替機構4 9 到晶圓環5的端部，該晶圓環5可被該扔擲機構4 9 a所抓 取，又，藉由在此狀態下驅動該第二橫桿元件3 2，該晶圓 環5可被夾具更替機構49所抓取而沿Y方向移動。因此， 在一重複執行電子組件安裝操作的程序下，晶圓環5更替 14 3之6\專利說明書(補件)W-〇2\93132!51 1317542 操作可被執行，以用一在晶圓供應部 1 7内的新晶圓環 5 來替換在電子組供應部2上已被取出晶片6而空閒的舊晶 圓環。 如圖2所示，一第三照相機 1 5係配置在電子組件供應 部2及基板固持部1 0之間。藉由在第三照相機1 5上方沿 X方向移動該已經撿取在電子組件供應部2之晶片6的安 裝頭部3 3，該第三照相機1 5可拍攝該固持在安裝頭部3 3 上的晶片6之影像。 接著，請參照圖 3，將說明電子組件安裝裝置之一控制 系統的構成。在圖4中，一機構驅動部5 0包含複數個馬達 驅動器及控制裝置，該等馬達驅動器以電子驅動各機構的 馬達，及該控制裝置用以控制供應至如下所示的各機構之 空氣瓶之空氣壓力，且藉由一控制部54來控制該裝置驅動 部5 0，下列各驅動元件可被驅動。 該X軸馬達4 0及Y軸馬達2 2驅動該安裝頭部移動機構 以移動該安裝頭部33。分別地，該X轴馬達43及Y軸馬 達24驅動該第一照相機移動機構以移動該第一照相機，而 該X軸馬達4 6及Y軸馬達2 6驅動該第二照相機移動機構 以移動該第二照相機。 另外，該機構驅動部5 0驅動一安裝頭部3 3的抬昇機構 及一具有嘴管 3 3 a (見圖 2 )的組件吸取機構並且驅動退出 器8及退出器XY桌面7之抬昇氣壓缸的驅動馬達。另外， 該機構驅動部5 0驅動該基板運入輸送帶1 2、基板運出輸 送帶1 4、基板分配部1 1、基板傳遞部1 3、第一基板固持 15 326\專利說明書(補件)\94-02\93132151 1317542 機構1 0 A、第二基板固持機構1 Ο B，及夾具更替機構4 9的 扔擲爪抬昇機構4 9 b和扔擲爪開/關機構4 9 c。 一第一識別處理部55，係藉由處理由第一照相機34所 拍攝的影像，來計算被基板固持部1 0所固持的基板1 6之 一電子組件安裝部1 6 a (見圖4 )之位置。該電子組件安裝部 1 6 a顯示基板1 6的一位置以安裝該晶片6，且該位置可藉 由識別影像來偵測。一第二識別處理部5 6，係作為一組件 識別處理部，係藉由處理第二照相機35所拍攝的影像來計 算該電子組件供應部2的晶片6之位置。一第三識別處理 部5 7，係藉由處理第三照相機1 5所拍攝的影像來計算被 安裝頭部33所固持的晶片6位置。 第一、第二及第三識別處理部 5 5、5 6、5 7所識別的結 果被傳送到該控制部5 5。一資料儲存部5 3儲存安裝資料、 組件資料或其他相關等各種不同資料。一操作部5 1係為一 種輸入裝置，如鍵盤、滑鼠或其他類似物，以輸入資料或 輸入控制指令。一顯示部5 2係顯示一由第一、第二或第三 照相機3 4、3 5、1 5所拍攝的影像之一螢幕，以及顯示一由 操作部51所輸入的導引螢幕。 該電子組件安裝手段係如上所述而構成，且一電子組件 安裝方法將會根據圖 4、圖 5、圖6而詳述如下。在圖 4 中，複數個晶片6係貼附在一被電子組件供應部2之晶圓 固持桌面3所固持的晶圓環5上。另外，在該基板固持部 1 0中，基板1 6分別定位在第一及第二基板固持機構1 0 A、 1 0 B。顯示於此的電子組件安裝，複數個晶片 6 (本例中為 16 326\專利說明書(補件)\94-02\93132151 1317542 四個）係相繼地被設置在安裝頭部3 3的吸附嘴管3 3 a所吸 附而固持，且其中四塊晶片 6，在一次的安裝次序中，係 相繼被安裝到數個電子組件安裝位置1 6 a。 首先，如圖4 A所示，該第二照相機3 5係藉由第二照相 機移動機構而在電子組件供應部2上移動以拍攝該等（4個） 晶片6之影像。接著，如圖4B所示，該第二照相機35由 晶片6上方處的一位置離開（照相機離開步驟）。另外，藉 由第二識別處理部 5 6 (組件識別步驟）對於第二照相機 3 5 所拍攝的影像的識別處理，複數個晶片6的位置可被計算 得知。 接著，安裝頭部3 3移動到電子組件供應部2之上。另 外，當該安裝頭部移動機構根據複數個晶片6的計算位置 來執行一定位操作以定位該安裝頭部3 3到晶片6時，複數 個晶&gt;! 6係相繼地由安裝頭部3 3的4個吸附嘴管3 3 a撿出 (組件撿出步驟）。 在平行該撿取部的狀況下，第一照相機 3 4係藉由第一 照相機移動機構而移動到該由基板固持部 1 0 的第一基板 固持機構1 Ο A所固持的基板1 6之上。另外，該第一照相機 3 4係依序移動到位於基板1 6上的多個電子組件安裝位置 1 6 a 之中左側的四個位置之上，以作為一輸入影像的物 件，並且拍攝複數個電子組件安裝位置1 6 a的影像，以輸 入該影像，接著，該第一照相機3 4自一基板1 6上的位置 上方離開。 另外，由第一照相機 3 4所拍攝的照片被第一識別處理 17 326\專利說明書(補件)\94-02\93132151 1317542 部5 5所處理以計算基板1 6上電子組件安裝位置1 6 a的位 置。接著，如圖5A所示，將其中4個晶片6分別固持在個 別吸附嘴管3 3 a的安裝頭部3 3，係執行移動至第三照相機 1 5上方的掃描操作.。因此，分別被各吸附嘴管3 3 a所固持 的晶片6影像係輸入到第三照相機1 5，且藉由第三識別處 理部5 7對影像的識別處理，可偵測晶片6的位置。 接著，該操作係變換到安裝操作。如圖 5 B所示，該安 裝頭部3 3係移動到一在基板固持部1 0上方的位置。另外， 該控制部5 4實施安裝操作，該安裝操作係在於根據由第一 識別處理部5 5所計算得知的電子組件安裝位置1 6 a，及由 第三識別處理部5 7所計算得知的晶片6位置，來利用安裝 頭部移動機構移動該安裝頭部3 3，同時間，相繼地將固持 在安裝頭部3 3上的晶片6安裝到被基板固持部1 0所固持 的基板1 6 (組件安裝步驟）。 另外，在安裝由安裝頭部 33所固持的晶片 6時，第二 照相機3 5係移動至複數個在電子組件供應部2上而相繼被 撿取的晶片6之上，以第二照相機3 5拍攝該複數個晶片6 的影像（相機接近步驟）。另外，之後，類似於前述步驟的 各個步驟係重複實施，且在一執行各個步驟的程序中，執 行更替由電子組件供應部2所固持的晶圓環5的操作。 換言之，當在照相機離開步驟中的一連續時間内，晶圓 環5上所有的晶片6被取出時，空的晶圓環5被夾具更替 機構4 9的扔擲部4 9 a所抓取。另外，藉由驅動第二橫桿元 件3 2，該夾具更替機構4 9與第二照相機3 5 —同移動，且 18 326\專利說明書(補件)\94-02\93132151 1317542 晶圓環5被運出到達該晶圓供應部1 7 (圖1、圖2 )。 另外，在該晶圓供應部1 7，空的晶圓環5被收容到盒體 内，接著，一新的晶圓環5被夾具更替機構4 9所抓取。之 後，藉由驅動第二橫桿元件3 2，如圖6 B所示，該夾具更 替機構4 9係連同該第二照相機3 5移動到該電子組件供應 部2，且該晶圓固持桌面3固持該晶圓環5。 換言之，在重複執行照相機離開步驟中，該夾具更替機 構49將該晶圓環5自電子組件供應部2處運出，且在一重 複執行照相機接近步驟的程序中，該夾具更替機構4 9將晶 圓環5運入至電子組件供應部2。 如上所述，本具體例中的電子組件安裝裝置係用以移動 該夾具更替機構4 9來將晶圓環5供應到電子組件供應部 2，以利用移動該第二照相機3 5之組件影像拍攝照相機移 動機構來進行更替，該第二照相機3 5係在電子組件供應部 2上之該組件影像拍攝照相機。 藉此，與舊有技術中獨立提供該夾具更替裝置以更替在 電子組件供應部2及晶圓供應部1 7之間的晶圓之裝置相 比，本裝置係為一節省空間的精簡電子組件安裝裝置。另 外，該夾具更替機構4 9係用以移動該兩端被支撐的第二橫 桿元件3 2，因此，在抓取及運載晶圓環5之狀態下的夾具 更替機構4 9的操作狀態係穩定化。因此，舊有技術以一側 運載晶圓環的方式來固持晶圓環的裝置中而造成晶圓環不 穩定姿態所引起的缺點，係可避免，且甚至在以大尺寸晶 圓來建構物件的例子中，仍可達到穩定的晶圓更替操作。 19 326\專利說明書(補件)\94-02\93132151 1317542 另外，建構一構成，係共同移動第二照相機 3 5及夾具 更替機構4 9，因此，並不會造成用以拍攝位在電子組件供 應部2之晶片6的第二照相機3 5的影像拍攝操作與以夾具 更替機構4 9來更替晶圓環5的操作之互相干擾。換言之， 即不需要一舊有裝置中，因考慮到獨立的夾具更替機構而 所必須的操作的時間延遲，來避免利用組件識別照相機的 組件識別操作與更替晶圓環的操作之互相干擾，且可增進 操作效率。 另外，雖然根據該具體例，固持該位於晶圓狀態下的半 導體晶片的晶圓環，係用以作為組件固持夾具，以將數片 電子組件排列在一個平面上，該組件固持夾具的模式並非 僅限制在具有晶圓體的晶圓環，只要該組件固持夾具將 電子組件安置在一個平面上來收容，如同一個排列用以安 裝該電子組件的托盤，該組件固持夾具構成實施本發明之 一目的。 (具體例2 ) 接著，將參考圖式詳述本發明之另一具體例。 首先，參考圖7及圖8，一電子組件安裝裝置的所有構 造將詳述如下。圖8顯示一沿圖7之A - A線段的剖視圖。 在圖7中，一基板運載路徑1 0 2係沿X方向設置在一基座 1 0 1上。該基板運載路徑1 0 2係運載一設置有電子組件的 基板1 0 3到一電子組件安裝位置而定位並固持。因此，該 基板運載路徑1 0 2構成一基板固持部，該基本固持部係沿 Y方向（第一方向）設置在遠離電子組件供應部1 0 4的一位 20 326\專利說明書(補件)\94-02\93132151 1317542 置上。 如圖8所示，該電子組件供應部1 Ο 4係具有一夾具固持 器1 0 7，該夾具固持器1 0 7上可拆卸地設有一晶圓環1 0 5 以固持一貼設有半導體晶片1 0 6 (之後簡稱為「晶片1 0 6」） 的片體，該晶片1 0 6係為一電子組件。該晶片1 0 6係以分 開成數個個別的塊體之狀態而貼設，且在安裝該晶圓環 1 0 5到該夾具固持器1 0 7的狀態下，該電子組件供應部1 0 4 係將複數個晶片1 0 6塊體排列成平板狀來供應。該晶圓環 1 0 5構成一組件固持夾具。 如圖8所示，在夾具固持器1 0 7上的晶圓環1 0 5之一下 側，一退出器1 0 9係由一退出器ΧΥ桌面1 0 8所驅動而可水 平移動。該退出器1 0 9係具有一針抬昇機構，以抬昇一退 出針（圖中未示出）以推抵一晶片，及當晶片1 0 6藉由該位 於片體下方的退出針來推抵該晶片1 0 6的方式，被一之後 提到的安裝頭部自&gt;1體處取出時，該晶片 1 0 6自片體剝 落。另外，當一用以將片體自晶片上剝落的機構，不是利 用退出針之方法時，可能構成一種利用吸力吸附片體的下 側以將晶片自片體處剝落的機構。 一晶圓供應部1 1 0係設置在一遠離電子組件供應部1 0 4 處的位置上並位於基座1 0 1的頂面上，沿Υ方向（第一方向） 相對於基板運載路徑1 0 2的一側上。該晶圓供應部1 1 0具 有一盒體固持部1 1 1以固持並抬昇一收容有積層狀態的晶 圓環1 0 5，且包含一用以抬昇該盒體到盒體固持部1 1 1内 的抬昇機構1 1 2。藉由採用此一晶圓供應部1 1 0的配置， 21 326\專利說明書(補件)\94-02\93132151 1317542 甚至當一收容有數個大尺寸晶圓的盒體設置到該盒體固持 部111上，一負載有盒體的運載架等處理裝置可輕鬆的存 取該盒體固持部1 1 1，且可促進操作性。 藉由抬昇機構1 1 2來抬昇盒體，該晶圓環1 0 5可定位在 一運載水平面，以更替介於晶圓供應部1 1 0及電子組件供 應部1 0 4之間的晶圓環1 0 5。定位在該運載水平面的晶圓 環1 0 5係被一推抵機構1 1 3所推抵，接著被一夾具更替機 構1 3 0的夾具抓取部1 3 9所抓取，並被運載至該電子組件 供應部1 0 4。另外，位於電子組件供應部1 0 4上，且因所 有晶片1 0 6被取出而閒置的晶圓環1 0 5，係被該夾具更替 機構1 3 0自該電子組件供應部1 0 4運出到達該晶圓供應部 1 1 0，且送回盒體。 圖7中，基座1 0 1上表面的兩端部係分別配置有一第一 Y軸桌面120A及一第二Y軸桌面120B，各桌面120A、120B 分別具有一第一 Y軸驅動機構及一第二Y軸驅動機構，各 驅動機構的縱向方向沿著Y方向（第一方向）並垂直基板運 載方向（X方向）。第一及第二Y軸桌面120A、120B上懸設 有一第一 X軸桌面121及一第二X軸桌面124，各X軸桌 面1 2 1、1 2 4係分別具有一第一 X軸驅動機構及第二X軸驅 動機構，各X軸驅動機構兩端部係被支撐而可沿Y方向滑 動。藉由分別驅動第一及第二Y軸驅動機構，第一及第二 X軸桌面1 2 1、1 2 4可分別在Y方向移動。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting device and an electronic component mounting method for mounting an electronic component on a circuit board. [Prior Art] In the field of the present invention, an electronic component as a semiconductor wafer such as a semiconductor wafer is mounted to a circuit board of a lead frame or the like by an electronic component mounting device, and the mounting device includes a dedicated supply. Device. The adhesive sheet to which the semiconductor wafer is pasted is mounted to the supply device in a state in which a wafer ring is held, and when all the semiconductor wafers are taken out by a single wafer ring, the empty wafer ring is replaced by a replacement The device is replaced with another new wafer ring that has a gripping and carrying function. For example, 曰Patent Patent No. JP-A-10-270532 or U.S. Patent No. 5,839,187. In addition, when the semiconductor wafer is taken out from the adhesive sheet, the semiconductor wafer must be accurately adsorbed and held by a high-precision positioning method by an electronic component supply portion mounted on the wafer ring, and is movably set by using a movable device. An image capture camera of the electronic component supply unit component confirms the position of the semiconductor wafer on the adhesive sheet. For example, the disclosure of Japanese Patent No. JP-A-2001-267335. However, according to the existing electronic component mounting device, the separately provided replacement device is coupled to the electronic component mounting device, which causes a problem, that is, an inevitable large device volume, and, in order to avoid confirming the camera with the component. Confirm the mutual interference between the operation of a component and the replacement of the wafer ring 5 326 \ patent specification (supplement) \94-02\93132151 1317542, the necessary delay in the operation of the entire device, therefore, the existing equipment At the same time, it is difficult to improve the operation. In recent years, the volume of semiconductor wafers has increased, and one-piece wafers have begun to be used. Therefore, the size and weight of a plurality of semiconductor crystals are increased, and the manual processing difficulty of the prior art is increased by a special processing means such as carrying to an electronic component mounting device. However, according to the aforementioned Japanese Patent Publication No. JP-A-1, U.S. Patent No. 5,8 3,1,8,7, when the wafer is used for the alternate operation of the substrate, the electronic component mounting device is provided. The special handling means is very difficult because the volume of the overall equipment at the dedicated site is increased. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a compact electronic device and an electronic component mounting method with high operational efficiency. An electronic component mounting device and an electronic component mounting method can be used to replace a wafer and the like. The component holds the clamp device. According to the present invention, an electronic component mounting apparatus includes: a supply portion for supplying a plurality of planarly arranged bodies to be held by a component holding jig; a substrate holding portion disposed in a first direction away from the electrons a positioning head of the component supply portion for holding the pickup from the electronic component supply portion, and mounting the electronic component to a substrate 326\patent specification (supplement)\94-02\93132151 6 Lead to efficiency for a time. 2 半 semi-conducting round box is added, so when a box is installed -270532 or when it is shipped in, it is necessary to use the means to install the component. In particular, it is provided that an electronic component electronic component block can be tightly formed, which is placed along a substrate; a mounted electronic mounting unit on the substrate 1137542; and a head moving mechanism is mounted to the mounting head. The part moves between the electronic component supply part and the substrate holding part; a component image capturing camera is used to take a picture of the electronic component on the electronic component supply part; a component identification processing part is processed by the component image Taking a picture taken by the camera to obtain a position of an electronic component on an electronic component supply portion; a moving component for holding the component image capturing camera and photographing the camera moving mechanism in a first direction by a component image Moving on the electronic group supply portion; and a fixture replacement mechanism disposed to the moving member and replacing the assembly holding fixture by grasping the assembly of the electronic component supply portion and holding the clamp and moving in the first direction. According to the present invention, an electronic component mounting apparatus includes: an electronic component supply portion for supplying a plurality of electronic component blocks arranged in a planar shape to be held by a component holding jig; a substrate holding portion Provided in a first direction at a position away from the electronic component supply portion; a component mounting means for holding the electronic component taken out from the electronic component supply portion, and mounting the electronic component to a substrate a moving member on which a moving head is disposed, which is driven by an operating head moving mechanism to move in a first direction; and a clamp replacing mechanism, which is disposed to the moving member, and Replacing the assembly holding fixture by grasping the assembly of the electronic component supply and holding the clamp in the first direction; wherein the clamp replacement mechanism includes a clamp gripping portion mounted to the movement movable in the first direction An element for grasping the electronic component fixture; and a front and rear moving means for causing the gripping portion of the gripper to be in the first direction Move back and forth relative to moving components. 326\Patent Specification (Repair)\94-02\93132151 7 1317542 By providing the mounting to the horizontally movable rod in the first direction, the gripping portion for gripping the component holding fixture is used for The forward and backward movement means for moving the clamp portion of the clamp before and after moving in a direction opposite to the clamp replacement mechanism, so that the force of the component holding clamp to the electronic component supply portion or from the clamp portion of the clamp can ensure that the first step is not increased. The impact caused by the direction of the rod, and used to replace the component holding fixture into a tight structure. [Embodiment] (Specific example 1) The present invention will be specifically described below with reference to the drawings: An electronic component assembly apparatus will be described with reference to Figs. 1 and 2 . Figure 2 is a cross-sectional view taken along line A-A of Figure 1. In the figure sub-assembly, the unit 2 is disposed on a base 1. The sub-assembly supply unit of FIG. 2 has a wafer holding table 3 that detachably holds a wafer ring 5, which is a set of sheets extending to the wafer ring 5 (Fig. The adhesive component wafer 6 (hereinafter simply referred to as "wafer 6"), the state of the six individual blocks of the wafer, and the electronic component holding the wafer ring 5 to the crystalline state, the electronic component The supply unit 2 supplies the wafer 6 held in the arrangement of the plurality of blocks to the device. As shown in FIG. 2, an ejector 8 is disposed on a lower side of the wafer ring 5 held by the wafer, and is transmitted by an exiter XY tabletop 326 (supplement)\94-02\93132151 The movement of the crossbar, and the provision of the moving crossbar, should be carried out, and the movement of the moving cross device can be reached in all the knots 1, as shown by the electric, the electric holding table can hold the clamp. A number of semi-conducting systems are separated into a number of round holding tables. The current planar shape of the assembly holds the table 3 fixed by 7 to move horizontally 1317542. The ejector 8 has a needle lifting mechanism for lifting an exit pin (shown) upward to push the wafer up, and when the wafer 6 is attached to the wafer ring 5 by a head (to be mentioned later) At the time of taking out, the wafer 6 is peeled off from the lower side of the wafer ring 5 by retracting, and the wafer 6 is peeled off by the sheet at the sheet on the set ring 5. The ejector 8 is constructed as a drop mechanism to cause the wafer 6 to self-extend to the wafer of the wafer ring 5. Further, the sheet peeling mechanism is not limited to the ejector 8, and a mechanism for peeling off the wafer from the sheet is shown. For example, the sheet may be sucked from the lower side of the sheet having the wafer so that the crystal is suctioned and peeled off from the sheet. As shown in FIG. 1, a substrate holding portion 10 is disposed at the surface of the susceptor 1 in the Y direction (first direction) and away from the upper and lower sides of the substrate holding portion 10 from the electronic component. A substrate is transported into the conveyor belt 1 , a substrate distribution portion 1 1 , the substrate 10 , a substrate transfer portion 13 , and a substrate transport conveyor 14 . The infeed belt 12 is spanned over a sub-base 1 attached to the base 1 and the attachment means 9 is attached to the sub-base 1a. The adhesive tape 9 is attached to a substrate 16 by means of an adhesive head portion 9a for attaching the wafer to a substrate 16. The substrate 16 is carried by the substrate from the upstream side into the conveyor belt 12 from the upstream side. The substrate 16 to which the adhesive is attached is then delivered into the substrate to distribute the substrate dispensing portion 1 1 to selectively dispense the substrate 16 obtained from the substrate into the conveyor belt to the substrate holding portion 32 6 which will be described below. Patent specification (supplement)\94-〇2\93〗 32151 9: The needle is not attached to the wafer in the figure. The wafer is peeled off and the sheet is received by only one sheet; In the direction of the holding portion, the substrate is transported, and the adhesion of a device is carried into the portion 11. 1 2 above 1 0 of the two 1317542 substrate holding mechanism. The substrate holding portion 1 has a first substrate holding mechanism 10 Α and a second substrate holding mechanism 10 Β to hold the substrate 16 assigned by the substrate distributing portion 1 1 to be positioned at an assembly position. The substrate transfer portion 13 selectively receives the assembled substrate 16 from the first substrate holding mechanism 10A and the second substrate holding mechanism 10B to be transferred to the substrate transporting belt 14. The substrate transporting conveyor 14 transfers the transferred assembled substrate 16 to the downstream side. A wafer supply portion 17 is disposed on the upper surface of the susceptor 1 away from the electronic component supply portion 2, and is located on the side opposite to the substrate holding portion 10 in the Y direction (first direction). The wafer supply unit 17 has a box holding portion 17a and a weight mechanism 18 for lifting the box in the box holding portion 17a, thereby holding and lifting a plurality of stacked states. The casing of the wafer ring 5. As shown in FIG. 2, by lifting the casing with the crane structure 18, the wafer ring 5 can be positioned to a carrying level to replace between the wafer supply portion 17 and the electronic component supply portion 2. Wafer ring 5. The wafer ring 5 positioned at the carrying level is pushed toward a right direction by a pushing mechanism 19, and then is picked up by the throwing portion 49a of one of the jig replacing mechanisms 49 described below, and carried To the electronic component supply unit 2. In addition, the wafer ring 5, which is located on the electronic component supply unit 2 and is vacant due to the removal of all the wafers 6, is transported from the electronic component supply unit 2 to the wafer supply unit 17 by the clamp replacement mechanism 49. And return to the box. In Fig. 1, the two ends of the upper surface of the base 1 are respectively provided with a first Y-axis base 20A and a second Y-axis base 20B, and the lengths of the bases 20A, 20B are 10 326\patent specification (repair) ) \94-02\93132151 1317542 The direction is parallel to the γ direction (first direction) and the vertical substrate carrying direction (χ direction). The first yoke base 2 Ο and the second yoke base 2 Ο respectively have a first direction guiding element 2 1 extending in the longitudinal direction (Y direction) over the entire length of each of the pedestals 20A, 20B The two first direction guiding elements 21 are parallel to each other for the electronic component supply part 2 and the substrate holding part 10 to be interposed between the two first direction guiding elements 21. The two first direction guiding elements 2 1 are slidably provided with three cross bar elements, such as a first cross bar element 31, a central cross bar element 30 and a second cross bar element 3 2 , each cross bar element The two end portions are respectively supported by the first direction guiding member 21 located in the Y direction, and the nut member 2 3 b protrudes from the side end portion of the right side of the center rail member 30. Further, a feed screw 2 3 a is screwed to the nut member 2 3 b and is driven to rotate in the horizontal direction by a Y-axis motor 22 disposed on the first Y-axis base 2 Ο A. By driving the Y-axis motor 2 2, the center rail member 30 moves horizontally along the first direction guiding member 2 1 in the Y direction. Further, nut members 2 5 b, 2 7 b are respectively protruded from the left end portions of the first and second cross bar members 31, 32, and the two feed screws 2 5 a, 2 7 a are respectively screwed Each nut member 2 5b, 2 7b is driven by a Y-axis motor 24, 26 provided on the second Y-axis base 2 Ο B to be rotated in the horizontal direction. By driving the Y-axis motors 24, 26, the first and second rail members 3 1 , 3 2 are horizontally movable along the first direction guiding member 21 in the Y direction. The central cross member 30 is provided with a mounting head 3 3 and a feeding screw 4 1 a, and the feeding screw 4 1 a is screwed to a nut member 4 1 b coupled to the mounting head 33, and Rotated by an X-axis motor 40. By driving the X-axis motor 40, the mounting head 33 can be disposed on the side of the center rail member 30 and along the X direction (p. 11 pp. pp. </ RTI> </ RTI> </ RTI> The second direction guiding member 4 2 (see FIG. 2) of the two directions is guided while moving in the X direction (second direction). The mounting head 3 3 has a plurality of (four in this example) nozzle tubes 3 3 a, each nozzle tube 3 3 a holding a single piece of the wafer 6 respectively, and the mounting head is designed to be The individual wafers 6 are adsorbed to hold the wafers 6 to the individual nozzles 3 3 a to be movable. By driving the Y-axis motor 2 2 and the X-axis motor 40, the mounting head 3 3 is horizontally moved in the X and Y directions, and the wafer 6 of the electronic component supply portion 2 is grasped and held and captured. The wafer 6 is mounted on an electronic component mounting position 16a of the substrate 16 held by the substrate holding portion 10. Additionally, a mechanism for picking up the wafer can be independently disposed and the mounting head can accept and hold the wafer from the picking mechanism. Further, preferably, when the scooping mechanism has a crystal inverting mechanism, the wafer inverting mechanism can flip the head and tail of the wafer on the substrate to perform flip chip mounting. The pair of first direction guiding members 21, the central rail member 30, and a first direction driving mechanism for moving the center rail member 30 along the first direction guiding member 21 (Y-axis motor 2 2. a feed screw 2 3 a and a nut member 2 3 b ), and a second direction drive mechanism for moving the mounting head 3 3 along the second direction guiding member 42 (X-axis motor 40, feed screw 4 1 The a and nut members 4 1 b ) collectively constitute a mounting head moving mechanism for moving the mounting head 3 3 between the electronic component supply portion 2 and the substrate holding portion 10 . A first camera 34 is disposed on the first rail member 31, and a bracket 34a for holding the camera 34 is coupled to a nut member 44b. 12 326\Patent Specification (Repair)\94-02\93132151 1317542 A feed screw 44a is screwed to the nut member 44b and rotated by 'driving', and by driving the X-axis motor 43, 34 is subjected to a second The direction guiding member 45 (see FIG. 2) is guided, and the second direction guiding member 45 is disposed on the first side surface. By driving the Y-axis motor 24 and the X-axis motor 43, the 34 system is horizontally moved in the X and Y directions. Therefore, the driver can move on the substrate holding portion 10 to take a photograph of the substrate held on the board holding mechanisms 10A, 1B, and can be positioned above the substrate holding portion 10. The pair of first direction guiding elements 21, the first crossbar element guides the element 21 in the first direction to move the first crossbar direction driving mechanism (the xenon motor 24, the feeding screw 2 5 a and i And a second direction driving mechanism (the X-axis motor 43 and the feeding screw member 4 4 b ) together constitute a first camera moving mechanism holding portion 10 to move the first camera 34. The second rail member 3 2 (moving crossbar) upper setting device 35, and a nut member 47b for holding the second camera 35. A feeding screw 47a is screwed 47b and is driven by an X-axis motor 46. Driven and rotated, and by the motor 4 6, the second camera 35 is guided by a second direction guide 2) to move in the X direction, the second direction is guided; ή at the second crossbar element 32 On one side. By driving the reel motor 26 and the X-axis motor 46, 3M transfer instruction (supplement) \94-〇2\93132151 13 - X-axis motor 4 3 the first camera moves the dry element 3 in the X direction The first camera (the first and second bases of a camera 34 move to leave the two 30, a first k-tire element 2 5b for the member 31) the rod 44a and the nut &gt; to have a The second photo frame 3 5 a is connected to the nut member by driving the X-axis member 4 8 (see Figure 48 to set the second camera 1375542 35 to move horizontally in the X and Y directions. Therefore, the first The second camera 35 is movable on the electronic component supply portion 2 to capture the image of the wafer 6 held on the electronic component supply portion 2, and is movable to leave the position above the electronic component supply portion 2. The first direction a guiding member 21, a second cross member 3, a first direction driving mechanism (a shaft motor 26, a feeding screw 2a and a nut member 2 7b) and a guiding member for guiding along the second direction 48 to move the second direction driving mechanism of the second camera 35 (X-axis motor 36, feed screw 4 7 a, and screw The component 4 7 b) constitutes a component image capturing camera moving mechanism for moving the second camera 35 which is the component image capturing camera. Therefore, the second rail member 3 2 takes the component image capturing camera moving mechanism along The first direction moves on the electronic component supply portion 2. The clamp replacement mechanism 49 is disposed on a side surface of the second crossbar member 32 having the second camera 35. The clamp replacement mechanism 49 includes the one having the a throwing portion (clamp gripping portion) for throwing a claw, wherein the throwing claw is used to pinch and grip the end of one side of the wafer ring 5, and the jig replacing mechanism 49 also includes a throwing The throwing up mechanism 49b is used to lift the throwing portion 49a. The throwing claw is driven to be turned on or off by a throwing claw opening/closing mechanism 4 9 c (see Fig. 3). Driving the second crossbar member 3 2 to move the clamp replacement mechanism 49 to the end of the wafer ring 5, the wafer ring 5 can be grasped by the throwing mechanism 49a, and, by this state The second crossbar element 3 2 is driven down, and the wafer ring 5 can be grasped by the clamp replacing mechanism 49 along the Y side. Therefore, under the procedure of repeatedly performing the electronic component mounting operation, the wafer ring 5 is replaced by the 14 3 6 patent specification (supplement) W-〇2\93132! 51 1317542 operation can be performed to use one The new wafer ring 5 in the wafer supply portion 17 replaces the old wafer ring that has been taken out of the wafer group 6 on the electronic group supply portion 2. As shown in Fig. 2, a third camera 15 is disposed in The electronic component supply unit 2 and the substrate holding unit 10 are interposed. By moving the mounting head 3 3 of the wafer 6 that has been captured in the electronic component supply portion 2 in the X direction above the third camera 15, the third camera 15 can capture the holding on the mounting head 3 3 The image of the wafer 6 . Next, referring to Fig. 3, the configuration of a control system of one of the electronic component mounting devices will be described. In FIG. 4, a mechanism driving unit 50 includes a plurality of motor drivers and control devices that electronically drive motors of the respective mechanisms, and the control device controls air bottles supplied to the mechanisms shown below. The air pressure is controlled by the control unit 54 to control the device driving unit 50, and the following driving elements can be driven. The X-axis motor 40 and the Y-axis motor 22 drive the mounting head moving mechanism to move the mounting head 33. Separately, the X-axis motor 43 and the Y-axis motor 24 drive the first camera moving mechanism to move the first camera, and the X-axis motor 46 and the Y-axis motor 26 drive the second camera moving mechanism to move the Second camera. Further, the mechanism driving portion 50 drives a lifting mechanism for mounting the head portion 3 3 and a component suction mechanism having a nozzle tube 3 3 a (see FIG. 2) and drives the lifter 8 and the lifter XY tabletop 7 uplifted. The drive motor of the pneumatic cylinder. In addition, the mechanism driving unit 50 drives the substrate to be transported into the conveyor belt 2, the substrate transporting conveyor belt 14, the substrate distributing portion 1 1 , the substrate transmitting portion 13 , and the first substrate holding 15 326 \ patent specification (repair) ) \94-02\93132151 1317542 The mechanism 1 0 A, the second substrate holding mechanism 1 Ο B, and the throwing claw raising mechanism 4 9 b of the jig replacing mechanism 49 and the throwing claw opening/closing mechanism 4 9 c. A first recognition processing unit 55 calculates an electronic component mounting portion 16a (see FIG. 4) of the substrate 16 held by the substrate holding portion 10 by processing the image captured by the first camera 34. The location. The electronic component mounting portion 16 6 a displays a position of the substrate 16 to mount the wafer 6, and the position can be detected by recognizing the image. The second recognition processing unit 526 is a component recognition processing unit that calculates the position of the wafer 6 of the electronic component supply unit 2 by processing the image captured by the second camera 35. The third recognition processing unit 57 calculates the position of the wafer 6 held by the mounting head 33 by processing the image captured by the third camera 15. The results identified by the first, second, and third recognition processing units 5 5, 5 6 , and 5 7 are transmitted to the control unit 55. A data storage unit 5 3 stores various materials such as installation materials, component materials, and other related materials. An operation unit 51 is an input device such as a keyboard, a mouse or the like for inputting data or inputting a control command. A display portion 5 2 displays a screen of an image captured by the first, second or third cameras 34, 35, 15 and displays a guidance screen input by the operation portion 51. The electronic component mounting means is constructed as described above, and an electronic component mounting method will be described in detail below with reference to Figs. 4, 5, and 6. In Fig. 4, a plurality of wafers 6 are attached to a wafer ring 5 held by a wafer holding table 3 of the electronic component supply unit 2. Further, in the substrate holding portion 10, the substrate 16 is positioned at the first and second substrate holding mechanisms 10A, 10B, respectively. The electronic components shown here are mounted, and a plurality of wafers 6 (in this example, 16 326\patent specification (supplement)\94-02\93132151 1317542 four) are successively disposed on the suction nozzle of the mounting head 3 3 The tube 3 3 a is adsorbed and held, and four of the wafers 6 are successively mounted to a plurality of electronic component mounting positions 16 a in a single mounting sequence. First, as shown in Fig. 4A, the second camera 35 is moved on the electronic component supply unit 2 by the second camera moving mechanism to take images of the (four) wafers 6. Next, as shown in Fig. 4B, the second camera 35 is separated from a position above the wafer 6 (camera leaving step). Further, the position of the plurality of wafers 6 can be calculated by the second recognition processing unit 56 (component identification step) for the recognition processing of the image captured by the second camera 35. Next, the mounting head 3 3 is moved over the electronic component supply section 2. Further, when the mounting head moving mechanism performs a positioning operation according to the calculated position of the plurality of wafers 6 to position the mounting head 33 to the wafer 6, a plurality of crystals are successively mounted by the mounting head 3. The three adsorption nozzles of 3 are 3 3 a (the component extraction step). The first camera 34 is moved to the substrate 16 held by the first substrate holding mechanism 1A of the substrate holding portion 10 by the first camera moving mechanism in a state of being parallel to the capturing portion. . In addition, the first camera 34 is sequentially moved over the four positions on the left side among the plurality of electronic component mounting positions 16a on the substrate 16 to serve as an input image object, and a plurality of images are taken. The electronic component mounts an image at a position of 16 a to input the image, and then the first camera 34 exits above the position on a substrate 16. In addition, the photograph taken by the first camera 34 is processed by the first recognition processing 17 326\patent specification (supplement)\94-02\93132151 1317542 section 5 5 to calculate the electronic component mounting position on the substrate 16 The location of a. Next, as shown in Fig. 5A, the mounting heads 3 3 in which the four wafers 6 are respectively held by the respective nozzle tubes 3 3 a are moved to the scanning operation above the third camera 15. Therefore, the image of the wafer 6 held by each of the nozzle tubes 3 3 a is input to the third camera 15 , and the position of the wafer 6 can be detected by the third recognition processing unit 57 for the image recognition processing. The operation then changes to the installation operation. As shown in Fig. 5B, the mounting head portion 3 3 is moved to a position above the substrate holding portion 10. Further, the control unit 54 performs an installation operation based on the electronic component mounting position 16 a calculated by the first recognition processing unit 55 and calculated by the third recognition processing unit 57. The position of the wafer 6 is known to move the mounting head 3 3 by the mounting head moving mechanism, and at the same time, the wafer 6 held on the mounting head 3 3 is successively attached to the substrate held by the substrate holding portion 10 1 6 (Component installation steps). Further, when the wafer 6 held by the mounting head 33 is mounted, the second camera 35 is moved over a plurality of wafers 6 successively picked up on the electronic component supply portion 2, with the second camera 35. The image of the plurality of wafers 6 is taken (camera approach step). Further, thereafter, the respective steps similar to the foregoing steps are repeatedly performed, and in the procedure of executing the respective steps, the operation of replacing the wafer ring 5 held by the electronic component supply portion 2 is performed. In other words, when all of the wafers 6 on the wafer ring 5 are taken out for a continuous time in the camera leaving step, the empty wafer ring 5 is grasped by the throwing portion 49a of the jig replacement mechanism 49. In addition, by driving the second crossbar member 3 2, the clamp replacing mechanism 49 moves with the second camera 35, and 18 326\patent specification (supplement)\94-02\93132151 1317542 wafer ring 5 It is shipped out to the wafer supply unit 17 (Figs. 1 and 2). Further, in the wafer supply portion 17, the empty wafer ring 5 is housed in the casing, and then a new wafer ring 5 is grasped by the jig replacing mechanism 49. Thereafter, by driving the second crossbar member 3 2, as shown in FIG. 6B, the clamp replacing mechanism 49 moves to the electronic component supply portion 2 together with the second camera 35, and the wafer holds the desktop 3 The wafer ring 5 is held. In other words, in the step of repeatedly performing the camera leaving, the jig replacing mechanism 49 transports the wafer ring 5 from the electronic component supply portion 2, and in a procedure of repeatedly performing the camera approaching step, the jig replacing mechanism 49 will The wafer ring 5 is carried into the electronic component supply unit 2. As described above, the electronic component mounting device in this embodiment is for moving the jig replacing mechanism 49 to supply the wafer ring 5 to the electronic component supply portion 2 to capture the component image by moving the second camera 35. The camera moving mechanism is used for replacement, and the second camera 35 is attached to the component image capturing camera on the electronic component supply unit 2. Thereby, the device is a space-saving compact electronic component compared to the device in the prior art that independently provides the fixture replacement device to replace the wafer between the electronic component supply portion 2 and the wafer supply portion 17. Install the device. In addition, the jig replacement mechanism 49 is configured to move the second crossbar member 3 2 supported at both ends, and therefore, the operating state of the jig replacing mechanism 49 in the state of grasping and carrying the wafer ring 5 is Stabilized. Therefore, the old technology can prevent the disadvantages caused by the unstable posture of the wafer ring by holding the wafer ring on one side to hold the wafer ring, and even construct the object with a large-sized wafer. In the example, stable wafer replacement operations can still be achieved. 19 326\Patent Specification (Replenishment)\94-02\93132151 1317542 In addition, the construction of a structure is to jointly move the second camera 35 and the fixture replacement mechanism 4 9, so that it does not cause the camera to be positioned in the electronic component. The image capturing operation of the second camera 35 of the wafer 6 of the supply unit 2 interferes with the operation of replacing the wafer ring 5 with the jig replacement mechanism 49. In other words, there is no need for an old device to avoid the mutual interference of the component recognition operation of the component recognition camera and the operation of replacing the wafer ring, due to the time delay of the operation necessary to take into account the independent fixture replacement mechanism, and Improve operational efficiency. In addition, according to the specific example, the wafer ring holding the semiconductor wafer in the wafer state is used as a component holding jig to arrange a plurality of electronic components on a plane, and the mode of the component holding the fixture is not Restricted only to a wafer ring having a wafer body, as long as the component holding fixture holds the electronic component on a flat surface for accommodation, like a tray arranged to mount the electronic component, the component holding fixture constitutes one of the objects of the present invention. . (Specific example 2) Next, another specific example of the present invention will be described in detail with reference to the drawings. First, referring to Figures 7 and 8, all the configurations of an electronic component mounting device will be described in detail below. Figure 8 shows a cross-sectional view taken along line A - A of Figure 7. In Fig. 7, a substrate carrying path 1 0 2 is disposed on a pedestal 1 0 1 in the X direction. The substrate carrying path 102 is carried and held by a substrate 103 provided with an electronic component to an electronic component mounting position. Therefore, the substrate carrying path 102 constitutes a substrate holding portion which is disposed in the Y direction (first direction) away from the electronic component supply portion 104. 20 326\patent specification (supplement) \94-02\93132151 1317542 Set. As shown in FIG. 8 , the electronic component supply unit Ο 4 has a clamp holder 10 7 , and the clamp holder 110 is detachably provided with a wafer ring 1 0 5 to hold a semiconductor attached thereto. A wafer of a wafer 1 0 6 (hereinafter simply referred to as "wafer 1 0 6"), which is an electronic component. The wafer 1 0 6 is attached in a state of being divided into a plurality of individual blocks, and the electronic component supply unit 1 0 4 is mounted in a state where the wafer ring 105 is mounted to the holder holder 107. A plurality of wafers of 106 cells are arranged in a flat shape for supply. The wafer ring 105 constitutes a component holding fixture. As shown in Fig. 8, on the lower side of one of the wafer rings 205 on the clamp holder 107, an ejector 109 is driven by a ejector ΧΥ table top 108 to be horizontally movable. The ejector 1 0 9 has a needle lifting mechanism for raising an exit pin (not shown) to push a wafer, and when the wafer 106 is pushed by the exit pin located below the body The wafer 106 is peeled off from the wafer when it is taken out from the &gt; 1 body by a mounting head mentioned later. Further, when a mechanism for peeling the sheet from the wafer is not a method of withdrawing the needle, it may constitute a mechanism for absorbing the lower side of the sheet by suction to peel the wafer from the sheet. A wafer supply portion 110 is disposed at a position away from the electronic component supply portion 104 and on a top surface of the base 110, in a meandering direction (first direction) with respect to the substrate carrying path 1 0 on one side. The wafer supply unit 110 has a case holding portion 1 1 1 for holding and lifting a wafer ring 105 that accommodates a laminated state, and includes a case for lifting the case to the case holding portion 1 Lifting mechanism 1 1 2 in 1 1 . By adopting the configuration of the wafer supply unit 110, 21 326\patent specification (supplement)\94-02\93132151 1317542 even when a box containing a plurality of large-sized wafers is set to the box holding In the portion 111, a processing device such as a carrier carrying a cartridge can easily access the cartridge holding portion 111 and can improve operability. The housing is lifted by the lifting mechanism 1 1 2, and the wafer ring 105 can be positioned at a carrying level to replace between the wafer supply portion 110 and the electronic component supply portion 104. Wafer ring 1 0 5 . The wafer ring 105 positioned at the carrying level is pushed by a pushing mechanism 1 1 3 , and then grasped by a jig gripping unit 1 3 0 of a jig replacing mechanism 1 3 0 and carried to The electronic component supply unit 104. In addition, the wafer ring 105 which is located on the electronic component supply unit 104 and is idle due to the removal of all the wafers 106 is transported from the electronic component supply unit 104 by the clamp replacement mechanism 1 300. The wafer supply unit 1 10 is reached and returned to the cassette. In FIG. 7 , a first Y-axis table top 120A and a second Y-axis table top 120B are respectively disposed at two ends of the upper surface of the base 110, and each of the table tops 120A and 120B has a first Y-axis driving mechanism and a first The second Y-axis driving mechanism has a longitudinal direction of each driving mechanism along the Y direction (first direction) and a vertical substrate carrying direction (X direction). A first X-axis table top 121 and a second X-axis table top 124 are suspended from the first and second Y-axis table tops 120A, 120B, and each of the X-axis table tops 1 2 1 and 1 2 4 has a first X-axis drive The mechanism and the second X-axis driving mechanism are supported at both ends of each X-axis driving mechanism to be slidable in the Y direction. The first and second X-axis table tops 1 2 1 and 1 2 4 are respectively movable in the Y direction by driving the first and second Y-axis drive mechanisms, respectively.

第一 X軸桌面121上設置有一安裝頭部122及一基板識 別照相機1 2 3，安裝頭部1 2 2及照相機1 2 3共同被第一 X 326\專利說明書(補件)\94-02\93132151 22 1317542 軸驅動機構所移動。該安裝頭部 1 2 2係具有一嘴管 1 2 2 a 以固持晶片1 0 6，及被製成在吸附以固持晶片1 0 6在嘴管 1 2 2 a上之狀態而可移動。藉由驅動第一 X軸及第一 Y軸驅 動機構，安裝頭部1 2 2及基板識別照相機可沿X及Y方向 而水平移動。 該安裝頭部1 2 2撿起電子組件供應部1 0 4的晶片1 0 6以 固持並安裝該被固持之晶片1 0 6到該固持在基板運載路徑 1 0 2的基板 1 0 3的一電子組件安裝位置上。因此，第一 Y 軸桌面120A、第一 X軸桌面121及安裝頭部122共同構成 一組件安裝手段，以將電子組件自電子組件供應部1 0 4上 撿起，並且將被固持的電子組件安裝到該固持在基板固持 部上的基板1 0 3上。 另外，一用以自電子組件供應部1 0 4上取出晶片1 0 6的 撿取機構，且該安裝頭部可自該撿取機構上接受並固持晶 片。另外，較佳地，當該撿取機構具有一晶片翻轉機構， 該晶片翻轉機構係可翻轉基板上晶片的頭尾來進行覆晶安 裝。 該移動到基板1 0 3之上的基板識別照相機1 2 3拍攝該基 板1 0 3的影像，且藉由一基板識別手段（圖中未示出）來處 理並識別所拍攝的影像之結果，可識別基板1 0 3上的電子 組件安裝位置。在利用安裝頭部1 2 2來安裝晶片1 0 6之中， 根據該識別結果，晶片1 0 6被定位到電子組件安裝位置。 電子組件供應部1 0 4 —側的第二X軸桌面1 2 4的一側面 上設置有一組件識別照相機1 2 5，該照相機1 2 5為一利用 23 326\專利說明書(補件)\94-02\93132151 1317542 一導引軌1 2 7及一滑件1 2 8的操作頭部（見圖9 )。藉由驅 動第二X軸驅動機構及第二Y軸驅動機構，第一識別照相 機1 2 5可沿X及Y方向而水平移動，藉此，該第一識別照 相機1 2 5可在電子組件供應部1 0 4上移動以拍攝位於晶圓 環之上的晶片1 0 6影像，且可自電子組件供應部1 0 4之上 的位置處離開。該組件識別照相機1 2 5在接近該電子組件 供應部 1 0 4的狀態時拍攝固持在晶圓環上的晶片 1 0 6影 像。另外，藉由一基板識別手段（圖中未示出）來處理並識 別所拍攝的影像，可識別被取出的構成一物件之晶片106 之位置。當安裝頭部1 2 2取出晶片1 0 6時，嘴管1 2 2 a根據 識別結果而定位到該晶片106。 第二Y軸驅動機構及第二X軸驅動機構構成一操作頭部 移動機構，且該第二X軸桌面1 2 4成為移動橫桿，該移動 橫桿上設置有操作頭部，並且被操作頭部移動機構所驅動 而沿第一方向移動。另外，雖然作為移動橫桿，可使用一 懸臂樑式之移動橫桿，僅其之一側被支撐，以用來在更替 晶圓環時，穩定地移動該晶圓環，較佳地，可以利用一所 謂的兩側支撐式的移動橫桿，橫桿兩端部分別被本具體例 中的第二X軸桌面124上的第一及第二Y軸桌面120A、120B 所支撐。 該夾具更替機構1 3 0係設置在第二X軸桌面1 2 4的下侧 上。該夾具更替機構1 3 0係以抓取晶圓環1 0 5並且沿Y方 向在電子組件供應部1 0 4及晶圓供應部1 1 0之間移動該晶 圓環105的方式來更替晶圓環105。將參考圖9A及圖9B， 24 326\專利說明書(補件)\94-02\93132151 1317542 說明夾具更替機構1 3 0之結構。圖9 A中，第二X軸桌面 1 2 4的下面上設置有一夾具抓取部1 3 9，該夾具抓取部1 3 9 具有一用來抓取晶圓環 1 0 5而沿 Y方向水平移動的扔擲 爪。該夾具抓取部1 3 9係受一前後移動手段所驅動（之後敘 述），而相對第二X軸桌面1 2 4而沿Y方向做前後移動。 該第二X轴桌面1 2 4的下面係配置有一可相對X軸桌面 1 2 4而沿 Y方向作水平往復運動的水平移動部1 3 1。如圖 9 B所示，該水平移動部1 3 1係經由一連結元件1 3 2連結到 一氣壓缸133的桿件133a上。藉由驅動氣壓缸133，該水 平移動部1 3 1可相對X軸桌面1 2 4作水平往復運動。 水平移動部 1 3 1的兩端部上係分別配置有一第一滑輪 1 3 4及一第二滑輪1 3 5，一傳動帶1 3 6係為一環狀的彈性元 件纏繞在滑輪1 3 4 ' 1 3 5上，並被製成藉由分別以水平姿態 相對的傳動帶頂部1 3 6 a及傳動帶底部1 3 6 b而纏繞在滑輪 134、135上。當傳動帶136在滑輪134、135轉動時，傳 動帶頂部及底部1 3 6 a、1 3 6 b係彼此相對而分別朝反方向移 動。 換言之，傳動帶1 3 6係可移動地設置於水平移動部1 3 1， 而形成一對水平運轉部（傳動帶頂部 1 3 6 a及傳動帶底部 1 3 6 b )之模式。該傳動帶頂部及底部1 3 6 a、1 3 6 b係透過一 第一連結部1 3 7及一第二連結部1 3 8而分別連接固持到第 二X軸桌面1 2 4及夾具抓取部1 3 9。因此，藉由驅動氣壓 缸1 3 3，該夾具抓取部1 3 9係相對於第二X軸桌面1 2 4前 後運動。 25 326\專利說明書(補件)\94-02\93132151 1317542 接著，將參照圖9及圖1 Ο，說明以夾具更替機構1 3 0來 更替晶圓環的操作。該晶圓更替操作係在一電子組件供應 部1 0 4的晶圓環1 0 5於一操作時段之外執行，其中該時段 中的操作係包含：在安裝該電子組件的操作中，反覆執行 一移動第二X軸桌面1 2 4以帶領組件識別照相機1 2 5到電 子組件供應部 1 0 4，並藉由一物件在取出該部份時來識別 該部份的步驟，及反覆執行一使組件識別照相機1 2 5在拍 攝完影像後自電子組件供應部1 0 4之上的位置處離開的步 驟。 圖9 Α及圖9 Β顯示以夾具更替機構1 3 0自晶圓供應部1 1 0 處取出晶圓環1 0 5的操作。換言之，在氣壓缸1 3 3的桿件 1 3 3 a縮回的狀態下，第二X軸桌面1 2 4係移動接近晶圓供 應部1 1 0，且一夾具抓取部1 3 9的扔擲爪係抓取一新的晶 圓環1 0 5。當抓取晶圓環1 0 5的動作結束時，第二X軸桌 面1 2 4係沿Y方向移動到組件供應部1 0 4。 另外，如圖10A及圖10B所示，第二X軸桌面124移動 的同時，該電子組件安裝裝置係執行一將抓取該晶圓環 1 〇 5的夾具抓取部1 3 9自第二X軸桌面1 2 4處帶走移動到 電子組件供應部1 0 4的操作。換言之，在組件識別照相機 1 2 5沿X方向離開以避免組件識別照相機1 2 5及水平移動 部1 3 1的相互干擾後，藉由氣壓缸1 3 3桿件1 3 3 a的縮回， 水平移動部1 3 1因為桿件1 3 3 a的一衝力S而向前移動。 在此狀況下，水平移動部1 3 1係在傳動帶頂部 1 3 6 a透 過第一連結部1 3 7而連結固持到第二X軸桌面1 2 4的狀態 326\專利說明書(補件)\94-02\93132151 26 1317542 下，向前移動，之後，透過第二連結部1 3 8而連結固持到 傳動帶底部1 3 6 b的夾具抓取部1 3 9，係藉由一兩倍於桿件 133a衝力S的衝力2S，自第二X軸桌面124處向前移動。 另外，藉由移動第二X軸桌面1 2 4及夾具抓取部1 3 9，被 夾具抓取部1 3 9抓取的晶圓環1 0 5移動到電子組件供應部 1 0 4以被安裝到夾具固持器 1 0 7。另外，在上述的操作之 前，係先執行一晶圓環恢復操作：係用以將該位於電子組 件供應部1 0 4上，因所有晶片1 0 6被取出而閒置的晶圓環 1 0 5送回該晶圓供應部1 1 0。晶圓環恢復操作係以相反於上 述操作之順序而執行。 換言之，一具有上述晶圓環更替操作的電子組件安裝方 法，係在一模式：利用設置在晶圓環更替機構1 3 0的前後 移動手段，使夾具抓取部1 3 9沿著Y方向相對第二X軸桌 面1 2 4作前後移動，其中該晶圓環更替機構1 3 0係在一程 序中，該程序包含一操作頭部接近步驟：係移動第二X軸 桌面 1 2 4 (移動橫桿）以將組件識別照相機 1 2 5 (操作頭部） 移動到電子組件供應部 1 0 4，以及一操作頭部離開步驟： 係在操作頭部的運作完畢後，將操作頭部自電子組件供應 部1 0 4上方位置處移走，最後反覆執行操作頭部接近步驟 及操作頭部離開步驟。 另外，利用第二X軸桌面1 2 4及夾具更替機構1 3 0的晶 圓環更替操作中，沿Y方向移動第二X軸桌面1 2 4的操作 及相對於第二X軸桌面1 2 4而前後移動夾具抓取部1 3 9的 操作係相重疊，且因此，前後移動夾具抓取部1 3 9可減少 326\專利說明書(補件)\94-02\93132151 27 1317542 第二X軸桌面1 2 4在Y方向上必要的移動衝力。 藉此，在考慮到裝卸收容有晶圓環的盒體之操作性，而 採用一具有位在Υ方向的晶圓供應部1 1 〇的裝置佈局時， 藉由盡可能縮短電子組件安裝手段在Υ方向的長度，可達 到一具有小巧外觀的裝置。另外，藉由採用上述前後移動 的夾具抓取部1 3 9，該夾具抓取部1 3 9可前後移動以造成 一衝力，該衝力可兩倍於氣壓缸1 3 3所造成的衝力，且夾 具更替機構1 3 0在Υ方向上的尺寸可縮短。 另外，雖然上述的具體例顯示該安裝頭部1 2 2安裝在第 一 X軸桌面1 2 1，且作為操作頭部的組件識別照相機1 2 5 係設置到作為一移動橫桿的第二X軸桌面1 2 4，該安裝頭 部1 2 2亦可為操作頭部，而該夾具更替機構1 3 0可設置到 第一 X軸桌面1 21以作為移動橫桿。 另外，上述具體例1及2中的組成元件在不違反本發明 主旨的情況下可隨意組合。 本發明電子組件安裝手段及電子組件安裝方法可達成 縮小電子組件安裝裝置及增進電子組件安裝方法的操作效 率之功效，且可應用到安裝電子組件的領域中，其中電子 組件可以半導體晶片或其他相似物品之半導體晶圓的狀態 供應之電子組件構成之物件。 藉由確保移動失具抓取部所造1成的衝力而不增加移動 該移動橫桿時所造成的衝力的狀況下，本發明電子組件安 裝裝置可達到晶圓環更替機構的緊密構成，對於由晶圓環 等組件固持夾具處取出電子組件以安裝到基板上的電子組 28 326\專利說明書(補件)\94-02\93132151 1317542 件安裝裝置係極為有用的。 【圖式簡單說明】 圖1係為本發明一具體例中一電子組件安裝裝置的平面 圖； 圖2係為本發明電子組件安裝裝置的一側面剖視圖； 圖3係為一控制系統構成的方塊圖； 圖4A、圖4B、圖5A、圖5B、圖6A及圖6B係為本發明 一具體例的電子組件安裝方法之步驟說明圖； 圖7係為本發明另外一具體例之電子組件安裝裝置的平 面圖； 圖8係為本發明另一具體例之電子組件安裝裝置的側面 剖視圖， 圖9 A及9 B係為本發明另一具體例之電子組件安裝部之 夾具更替機構的說明圖；以及 圖1 Ο A及1 Ο B係為本發明另一具體例之電子組件安裝部 之夾具更替機構的操作說明圖。 【主要元件符號說明】 1 基座 1 Ά 副基座 2 電子組件供應部 3 晶圓固持桌 5 晶圓壤 6 晶片 7 退出器XY桌面 29 326\專利說明書(補件)\94-02\93132151 1317542 8 退出器 9 黏附貼設裝置 10 基板固持部 1 0 A 第一基板固持機構 1 0B 第二基板固持機構 11 基板分配部 12 基板運入輸送帶 13 基板傳遞部 14 基板運出輸送帶 15 第三照相機 16 基板 16a 電子組件安裝部 17 晶圓供應部 17a 盒體固持部 1 8 起重機構 19 推抵機構 2 0 A 第一 Y軸基座 2 0 B 第二Y軸基座 2 1 第一方向導引元件 2 2 Y軸馬達 23a 饋送螺桿 2 3b 螺母元件 24 Y軸馬達 2 5a 饋送螺桿 30 326\專利說明書(補件)\94-02\93132151 1317542 2 5b 螺 母 元 件 2 6 Y 軸 馬 達 27a 饋 送 螺 桿 27b 螺 母 元 件 3 0 中 央 橫 桿 元 件 3 1 第 一 橫 桿 元 件 32 第 二 橫 桿 元 件 33 安 裝 頭 部 33a 吸 附 嘴 管 34 第 一 昭 i *\\ 相 機 34a 托 架 35 第 二 昭 ί *»&gt; 相 機 40 X 軸 馬 達 4 1a 饋 送 螺 桿 4 1b 螺 母 元 件 42 第 二 方 向 導 引 43 X 軸 馬 達 44a 饋 送 螺 桿 44b 螺 母 元 件 45 第 二 方 向 導 引 46 X 轴 馬 達 47a 饋 送 螺 桿 47b 螺 母 元 件 49 夾 具 更 替 機 構 326\專利說明書(補件)\94-02\93132151The first X-axis table top 121 is provided with a mounting head 122 and a substrate recognition camera 1 2 3, and the mounting head 1 2 2 and the camera 1 2 3 are commonly used by the first X 326\patent specification (supplement)\94-02 \93132151 22 1317542 The shaft drive mechanism is moved. The mounting head 1 2 2 has a nozzle tube 1 2 2 a for holding the wafer 106, and is made movable in a state of being adsorbed to hold the wafer 106 on the nozzle tube 1 2 2 a. By driving the first X-axis and the first Y-axis driving mechanism, the mounting head 1 2 2 and the substrate recognition camera are horizontally movable in the X and Y directions. The mounting head 1 2 2 picks up the wafer 106 of the electronic component supply portion 104 to hold and mount the held wafer 160 to the substrate 10 0 held by the substrate carrying path 1 0 2 The electronic components are installed at the location. Therefore, the first Y-axis table top 120A, the first X-axis table top 121, and the mounting head portion 122 collectively constitute a component mounting means for picking up the electronic component from the electronic component supply portion 104 and holding the held electronic component It is mounted on the substrate 103 that is held on the substrate holding portion. Further, a pick-up mechanism for taking out the wafer 160 from the electronic component supply portion 104, and the mounting head can receive and hold the wafer from the pick-up mechanism. Further, preferably, when the picking mechanism has a wafer turning mechanism, the wafer turning mechanism can flip the head and tail of the wafer on the substrate to perform flip chip mounting. The substrate recognition camera 1 2 3 moves the image of the substrate 103, and processes and recognizes the result of the captured image by a substrate recognition means (not shown). The electronic component mounting position on the substrate 103 can be identified. In mounting the wafer 160 using the mounting head 12 2, according to the recognition result, the wafer 106 is positioned to the electronic component mounting position. A component recognition camera 1 2 5 is disposed on one side of the second X-axis tabletop 1 2 4 of the electronic component supply unit 1 0 4 - the camera 1 2 5 is a 23 326\patent specification (supplement)\94 -02\93132151 1317542 A guide rail 1 2 7 and a slider 1 2 8 operating head (see Figure 9). By driving the second X-axis driving mechanism and the second Y-axis driving mechanism, the first identification camera 1 25 can be horizontally moved in the X and Y directions, whereby the first identification camera 1 2 5 can be supplied in the electronic component The portion 1 0 4 is moved to capture a 160 image of the wafer above the wafer ring and is detachable from a position above the electronic component supply portion 104. The component recognizes that the camera 1 2 5 captures the wafer 16 image held on the wafer ring while approaching the state of the electronic component supply portion 104. Further, by processing and recognizing the captured image by a substrate identifying means (not shown), the position of the wafer 106 constituting an object which is taken out can be identified. When the head 1 2 2 is attached to the wafer 1 0 6 , the nozzle tube 1 2 2 a is positioned to the wafer 106 in accordance with the recognition result. The second Y-axis driving mechanism and the second X-axis driving mechanism constitute an operating head moving mechanism, and the second X-axis table top 1 24 becomes a moving crossbar, the moving crossbar is provided with an operating head, and is operated The head moving mechanism is driven to move in the first direction. In addition, although as a moving crossbar, a cantilever beam type moving crossbar can be used, and only one side thereof is supported for stably moving the wafer ring when replacing the wafer ring, preferably, With a so-called two-sided supported moving crossbar, the ends of the crossbar are respectively supported by the first and second Y-axis table tops 120A, 120B on the second X-axis table top 124 in this embodiment. The jig replacement mechanism 130 is disposed on the lower side of the second X-axis table top 1 2 4 . The jig replacement mechanism 130 is configured to capture the wafer ring 105 and move the wafer ring 105 between the electronic component supply portion 104 and the wafer supply portion 110 in the Y direction. Ring 105. The structure of the jig replacement mechanism 130 will be described with reference to FIGS. 9A and 9B, 24 326\patent specification (supplement)\94-02\93132151 1317542. In FIG. 9A, a clamp gripping portion 1 3 9 is disposed on the lower surface of the second X-axis table top 1 2 4 , and the gripping portion 1 3 9 has a gripping wafer ring 1 0 5 in the Y direction. Throw the claws horizontally. The gripper gripping portion 139 is driven by a front-rear moving means (described later), and is moved back and forth in the Y direction with respect to the second X-axis table top 1 2 4 . The lower surface of the second X-axis table top 1 2 4 is provided with a horizontal moving portion 13 1 which is horizontally reciprocable in the Y direction with respect to the X-axis table top 1 2 4 . As shown in Fig. 9B, the horizontal moving portion 133 is coupled to the rod member 133a of a pneumatic cylinder 133 via a coupling member 132. By driving the pneumatic cylinder 133, the horizontal moving portion 131 can be horizontally reciprocated relative to the X-axis table top 1 2 4 . A first pulley 134 and a second pulley 135 are respectively disposed on both ends of the horizontal moving portion 136. One transmission belt 136 is an annular elastic member wound around the pulley 1 3 4 ' 1 3 5 is formed and wound on the pulleys 134, 135 by the top of the belt 1 1 6 a and the bottom 1 3 6 b of the belt, respectively, in a horizontal position. When the belt 136 is rotated by the pulleys 134, 135, the top and bottom portions of the belt 1 3 6 a, 1 3 6 b are moved relative to each other and moved in opposite directions, respectively. In other words, the belt 136 is movably disposed in the horizontal moving portion 133 to form a pair of horizontal running portions (the top of the belt 1 3 6 a and the bottom of the belt 1 3 6 b ). The top and bottom portions of the belt 1 3 6 a, 1 3 6 b are respectively connected and held to the second X-axis table top 1 2 4 and the gripper by a first joint portion 1 37 and a second joint portion 1 3 8 Department 1 3 9. Therefore, by driving the air cylinder 1 3 3, the gripper gripping portion 1 3 9 moves forward and backward with respect to the second X-axis table top 1 2 4 . 25 326\Patent Specification (Supplement)\94-02\93132151 1317542 Next, an operation of replacing the wafer ring with the jig replacing mechanism 130 will be described with reference to FIGS. 9 and 1B. The wafer replacement operation is performed outside the wafer ring 105 of an electronic component supply portion 104 in an operation period, wherein the operation in the time period includes: repeatedly performing the operation of installing the electronic component Moving the second X-axis tabletop 1 2 4 to lead the component to recognize the camera 1 2 5 to the electronic component supply unit 104, and to identify the portion by taking an object when the part is taken out, and repeatedly executing one The component recognition camera 1 2 5 is separated from the position above the electronic component supply portion 104 after the image is taken. Fig. 9 and Fig. 9 show the operation of taking out the wafer ring 105 from the wafer supply unit 1 1 0 by the jig replacement mechanism 130. In other words, in a state where the rod 1 3 3 a of the pneumatic cylinder 13 3 is retracted, the second X-axis table 1 2 4 moves closer to the wafer supply portion 1 1 0, and a jig grip portion 1 3 9 Throw the claws to grab a new wafer ring 1 0 5. When the action of grasping the wafer ring 105 is completed, the second X-axis table 1 2 4 is moved in the Y direction to the component supply portion 104. In addition, as shown in FIG. 10A and FIG. 10B, while the second X-axis table top 124 is moving, the electronic component mounting device performs a gripping portion 1 3 9 that will grab the wafer ring 1 〇 5 from the second The X-axis tabletop 1 2 4 takes away the operation of moving to the electronic component supply unit 104. In other words, after the component recognition camera 1 2 5 is separated in the X direction to avoid mutual interference of the component recognition camera 1 25 and the horizontal moving portion 13 3 , by the retraction of the pneumatic cylinder 13 3 3 1 3 3 a , The horizontal moving portion 1 3 1 moves forward due to a momentum S of the rod 1 3 3 a. In this case, the horizontal moving portion 131 is connected to the state of the second X-axis table top 1 2 4 by the first connecting portion 1 3 6 a through the first connecting portion 1 3 7 and the patent specification (supplement)\ 94-02\93132151 26 1317542, moving forward, and then, through the second joint portion 138, the clamp gripping portion 138, which is held to the bottom of the belt 136b, is doubled by the rod The momentum 2S of the force S of the piece 133a moves forward from the second X-axis table 124. In addition, by moving the second X-axis table top 1 2 4 and the gripping portion 1 3 9, the wafer ring 1 0 5 grasped by the gripping portion 1 3 9 is moved to the electronic component supply unit 1 0 4 to be Install to the clamp holder 1 0 7. In addition, before the above operation, a wafer ring recovery operation is performed first: the wafer ring 1 0 5 which is placed on the electronic component supply portion 104 and is idle because all the wafers 16 are taken out. The wafer supply unit 1 10 is returned. The wafer ring recovery operation is performed in the reverse order of the above operations. In other words, an electronic component mounting method having the above-described wafer ring replacement operation is in a mode in which the clamp grasping portion 1 3 9 is opposed to the Y direction by using a back and forth moving means provided in the wafer ring replacing mechanism 130 The second X-axis tabletop 1 2 4 is moved back and forth, wherein the wafer ring replacement mechanism 130 is in a program, and the program includes an operation head approaching step: moving the second X-axis tabletop 1 2 4 (moving The crossbar) moves the component recognition camera 1 2 5 (operation head) to the electronic component supply unit 104, and an operation head departure step: after the operation of the operation head is completed, the operation head is self-electronic The component supply portion 1 0 4 is removed at the upper position, and finally the operation head approaching step and the operation head leaving step are repeatedly performed. In addition, in the wafer ring replacement operation using the second X-axis tabletop 1 2 4 and the jig replacement mechanism 130, the operation of moving the second X-axis tabletop 1 2 4 in the Y direction and the desktop relative to the second X-axis tabletop 1 2 4, while the operating system of the front and rear moving jig gripping portions 1 3 9 overlaps, and therefore, the front and rear moving jig gripping portions 1 3 9 can be reduced 326\patent specification (supplement)\94-02\93132151 27 1317542 second X The necessary movement momentum of the shaft tabletop 1 2 4 in the Y direction. Therefore, in consideration of the operability of loading and unloading the cartridge in which the wafer ring is housed, a device layout having the wafer supply portion 1 1 位 in the Υ direction is employed, by shortening the electronic component mounting means as much as possible The length of the Υ direction can reach a device with a small appearance. In addition, by adopting the above-mentioned moving-forward moving gripper portion 13 9 , the gripping portion 1 3 9 can be moved back and forth to generate a momentum which can be twice the impulse caused by the pneumatic cylinder 13 3 , and The size of the jig replacement mechanism 130 in the Υ direction can be shortened. In addition, although the above specific example shows that the mounting head 1 2 2 is mounted on the first X-axis table top 1 2 1, and the component recognition camera 1 2 5 as an operation head is set to the second X as a moving crossbar The shaft table 1 2 4, the mounting head 1 2 2 may also be an operating head, and the jig replacing mechanism 1 30 may be set to the first X-axis table top 1 21 as a moving crossbar. Further, the constituent elements in the above Specific Examples 1 and 2 can be freely combined without departing from the gist of the present invention. The electronic component mounting method and the electronic component mounting method of the invention can achieve the effects of reducing the operation efficiency of the electronic component mounting device and the electronic component mounting method, and can be applied to the field of mounting electronic components, wherein the electronic component can be a semiconductor wafer or the like. An object made up of electronic components that supply the state of the semiconductor wafer of the article. The electronic component mounting device of the present invention can achieve the tight structure of the wafer ring replacement mechanism by ensuring the momentum generated by the moving clutch gripping portion without increasing the momentum caused by moving the moving crossbar. The electronic assembly 28 326\patent specification (supplement)\94-02\93132151 1317542 mounting device is very useful for removing the electronic component from the assembly holding member such as the wafer ring to be mounted on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing an electronic component mounting device according to an embodiment of the present invention; FIG. 2 is a side cross-sectional view showing the electronic component mounting device of the present invention; FIG. 3 is a block diagram showing a control system. 4A, FIG. 4B, FIG. 5A, FIG. 5B, FIG. 6A and FIG. 6B are explanatory diagrams of steps of an electronic component mounting method according to an embodiment of the present invention; FIG. 7 is an electronic component mounting device according to another specific example of the present invention; Figure 8 is a side cross-sectional view showing an electronic component mounting device according to another embodiment of the present invention, and Figures 9A and 9B are explanatory views of a jig replacing mechanism of an electronic component mounting portion according to another specific example of the present invention; Fig. 1 Ο A and 1 Ο B is an operation explanatory diagram of a jig replacing mechanism of an electronic component mounting portion according to another specific example of the present invention. [Description of main components] 1 pedestal 1 副 sub pedestal 2 electronic component supply 3 wafer holding table 5 wafer soil 6 wafer 7 ejector XY tabletop 29 326\patent specification (supplement)\94-02\93132151 1317542 8 ejector 9 adhesive attachment device 10 substrate holding portion 1 0 A first substrate holding mechanism 1 0B second substrate holding mechanism 11 substrate distribution portion 12 substrate transporting conveyor 13 substrate transfer portion 14 substrate transporting conveyor belt 15 Three camera 16 Substrate 16a Electronic component mounting portion 17 Wafer supply portion 17a Case holding portion 1 8 Crane mechanism 19 Pushing mechanism 2 0 A First Y-axis base 2 0 B Second Y-axis base 2 1 First Directional guiding element 2 2 Y-axis motor 23a Feeding screw 2 3b Nut element 24 Y-axis motor 2 5a Feeding screw 30 326\Patent specification (supplement)\94-02\93132151 1317542 2 5b Nut element 2 6 Y-axis motor 27a Feed screw 27b nut element 30 central crossbar element 3 1 first crossbar element 32 second crossbar element 33 mounting head 33a suction nozzle tube 34 first show i * \\ camera 34a bracket 35 二昭ί»»&gt; Camera 40 X-axis motor 4 1a Feed screw 4 1b Nut element 42 Second direction guide 43 X-axis motor 44a Feed screw 44b Nut element 45 Second direction guide 46 X-axis motor 47a Feed Screw 47b nut element 49 clamp replacement mechanism 326\patent specification (supplement)\94-02\93132151

31 1317542 4 9a 扔擲部 49b 扔擲部抬昇機構 49c 扔擲爪開/關機構 5 0 機構驅動部 5 1 操作部 5 2 顯示部 53 資料儲存部 5 5 第一識別處理部31 1317542 4 9a Throwing part 49b Throwing part lifting mechanism 49c Throwing claw opening/closing mechanism 5 0 Mechanism driving part 5 1 Operation part 5 2 Display part 53 Data storage part 5 5 First identification processing part

5 6 第二識別處理部 5 7 第三識別處理部 10 1 基座 102 基板運載路徑 103 基板 1 04 電子組件供應部 105 晶圓環5 6 Second recognition processing unit 5 7 Third identification processing unit 10 1 Base 102 Substrate carrying path 103 Substrate 1 04 Electronic component supply unit 105 Wafer ring

10 7 夾具固持器 108 退出器XY桌面 109 退出器 110 晶圓供應部 111 盒體固持部 112 抬昇機構 113 推抵機構 120A 第一 Y軸桌面 32 326傳利說明書(補件)\94-02\93132151 1317542 1 2 0Β 第 二 12 1 第 — 1 22 安 裝 1 22a 嘴 管 1 23 基 板 1 24 第 二 125 組 件 127 導 引 128 滑 件 130 夾 具 131 水 平 132 連 結 133 氣 壓 133a 桿 件 134 第 — 135 第 二 13 6a 傳 動 136b 傳 動 136 傳 動 13 7 第 一 138 第 二 139 夾 具 Y軸桌面 X軸桌面 頭部 識別照相機 X軸桌面 識別照相機 軌 更替機構 移動部 元件 缸 滑輪 滑輪 帶頂部 帶底部 帶 連結部 連結部 抓取部 326\專利說明書(補件)\94-02\9313215110 7 Jig Holder 108 Exiter XY Tabletop 109 Exiter 110 Wafer Supply Section 111 Case Holder 112 Lifting Mechanism 113 Pushing Mechanism 120A First Y-Axis Desktop 32 326 Transfer Instructions (Supplement)\94-02 \93132151 1317542 1 2 0Β 2nd 12 1 1st - 1 22 Installation 1 22a Nozzle tube 1 23 Substrate 1 24 Second 125 component 127 Guide 128 Slide 130 Fixture 131 Horizontal 132 Connection 133 Air pressure 133a Rod 134 - 135 2 13 6a Drive 136b Drive 136 Drive 13 7 First 138 Second 139 Fixture Y-axis Desktop X-axis Desktop Head Recognition Camera X-Axis Desktop Recognition Camera Rail Replacement Mechanism Moving Part Component Cylinder Pulley Pulley with Top with Bottom Belt Connection Portion Grab Department 326\Patent Specification (Repair)\94-02\93132151

Claims (1)

1317542 十、申請專利範圍： 1. 一種電子組件安裝裝置，包含： 一電子組件供應部，其係用以供應複數個排列成平面狀 的電子組件塊體以被一組件固持夾具所固持； 一基板固持部，其係沿一第一方向而設置在一遠離電子 組件供應部的位置上； 一安裝頭部，其係用以固持自電子組件供應部處取出的 電子組件，並且安裝該電子組件到一固持在一基板固持部 的基板上； 一安裝頭部移動機構，其係使得該安裝頭部在電子組件 供應部及基板固持部之間移動； 一組件影像拍攝照相·機，其係用以拍攝電子組件供應部 上的電子組件之照片； 一組件識別處理部，其係藉由處理被組件影像處理照相 機所拍攝的影像而獲得一電子組件供應部上之電子組件的 位置； 一移動元件，其係用以固持該組件影像拍攝照相機，並 藉由一組件影像拍攝照相機移動機構而沿第一方向在電子 組供應部上移動；以及 一夾具更替機構，其係設置到該移動元件，並藉由抓取 電子組件供應部的組件固持夾具且沿第一方向移動，來更 替組件固持夾具。 2 .如申請專利範圍第1項之電子組件安裝裝置，其中該 移動元件係為一橫桿，橫桿兩端係被支撐。 34 326\專利說明書(補件)\94-02\93132151 1317542 頭部移動機構所驅動而沿第一方向移動；以及 一夾具更替機構，其係設置到該移動元件，並藉由抓取 電子組件供應部的組件固持夾具且沿第一方向移動，來更 替組件固持夾具； 其中該夾具更替機構係包含有一夾具抓取部，其係安裝 到該可沿第一方向移動的移動元件，以抓取該電子組件夾 具；以及一前後移動手段，其係用以使該夾具抓取部沿第 一方向相對於該移動元件而前後移動。 6.如申請專利範圍第5項之電子組件安裝裝置，其中該 前後移動手段係包含： 一水平移動部，其係沿第一方向，相對該被水平方向驅 動手段所驅動的移動元件做往復運動； 一環狀彈性元件，其係可動地安裝在水平移動部上，並 於其上形成一對平行的運轉部，各運轉部係彼此相對，且 分別朝彼此相反的方向行進；以及 一第一連結部及一第二連結部，其係用以分別連結到水 平運轉部的兩側上，以固持該移動元件及該夾具抓取部。 7 .如申請專利範圍第5項之電子組件安裝裝置，其中該 操作頭部係為一組件影像拍攝照相機，以拍攝電子組件供 應部上的電子組件之照片。 8 .如申請專利範圍第6項之電子組件安裝裝置，其中該 操作頭部係為一組件影像拍攝照相機，以拍攝電子組件供 應部上的電子組件之照片。 9 . 一種電子組件安裝方法，其係由一電子組件安裝裝置 36 326\專利說明書(補件)\94-02\93132151 1317542 所實施，該電子組件安裝裝置包含：一電子組件供應部， 其係用以供應複數個排列成平面狀的電子組件塊體以被一 組件固持夾具所固持；一基板固持部，其係沿一第一方向 而設置在一遠離電子組件供應部的位置上；一安裝頭部， 其係用以固持自電子組件供應部處取出的電子組件，並且 安裝該電子組件到一固持在一基板固持部的基板上；一安 裝頭部移動機構，其係使得該安裝頭部在電子組件供應部 及基板固持部之間移動；一組件影像拍攝照相機，其係用 以拍攝電子組件供應部上的電子組件之照片：一組件識別 處理部，其係藉由處理被組件影像處理照相機所拍攝的影 像而獲得一電子組件供應部上之電子組件的位置；一移動 元件，其係用以固持該組件影像拍攝照相機，並藉由一組 件影像拍攝照相機移動機構而沿第一方向在電子組供應部 上移動；以及一夾具更替機構，其係設置到該移動元件， 並藉由抓取電子組件供應部的組件固持夾具且沿第一方向 移動，來更替組件固持夾具， 該電子組件安裝方法係包含： 一照相機離開步驟，其係利用一影像拍攝照相機移動機 構來將組件影像拍攝照相機移動到電子組件供應部，並且 拍攝電子組件的影像，且之後使該組件影像拍攝照相機自 電子組件供應部的上方處離開； 一組件識別步驟，其係藉由組件識別處理部來處理由組 件影像拍攝照相機所拍攝的影像來得到複數個電子組件的 位置； 37 326\專利說明書(補件)\94-02\93132151 1317542 一組件取出步驟，其係當該安裝頭部移動機構根據複數 個由組件識別處理部所計算得知的電子組件位置來執行一 定位操作以相繼地定位該安裝頭部到複數個電子組件時， 該安裝頭部相繼地撿取該等電子組件； 一組件安裝步驟，其係當安裝頭部移動機構移動該安裝 頭部時，相繼地安裝該固持在安裝頭部的電子組件到該固 持在基板固持部上的基板；以及 一照相機接近步驟，其係在安裝電子組件之中，將組件 影像拍攝照相機再次移動到電子組件供應部之上的位置 處，並且相繼地對各電子組件拍攝影像； 其中該組件固持夾具，係在一反覆執行照相機離開步驟 的程序下，被夾具更替機構自電子組件供應部處運出，且 該組件固持夾具係在一反覆執行照相機接近步驟的程序 下，被夾具更替機構運入至電子組件供應部。 1 0 .如申請專利範圍第 9項之電子組件安裝方法，其中 該移動元件係為一橫桿，橫桿兩端係被支撐。 1 1 . 一種電子組件安裝方法，其係藉由一電子組件安裝 裝置所實施，該電子組件安裝裝置包含：一電子組件供應 部，其係用以供應複數個排列成平面狀的電子組件塊體以 被一組件固持夾具所固持；一基板固持部，其係沿一第一 方向而設置在一遠離電子組件供應部的位置上；一組件安 裝手段，其係用以固持自電子組件供應部處取出的電子組 件，並且安裝該電子組件到一固持在一基板固持部的基板 上；一移動元件，其上設置有一操作頭部，其係受一操作 38 326\專利說明書(補件)\94-02\93132151 1317542 頭部移動機構所驅動而沿第一方向移動；以及一夾具更替 機構，其係設置到該移動元件，並藉由抓取電子組件供應 部的組件固持夾具且沿第一方向移動，來更替組件固持夾 具；其中夾具更替機構係包含有一夾具抓取部，其係安裝 到該可沿第一方向移動的移動元件，以抓取該電子組件夾 具；以及一前後移動手段，其係用以使該夾具抓取部沿第 一方向相對移動元件前後移動， 該電子組件安裝方法包含： 一操作頭部接近步驟，其係移動該移動元件以將操作頭 部移動到電子組件供應部； 一操作頭部離開步驟，其係在完成操作頭部的操作後， 移動該移動元件以將位在電子組件供應部上方的操作頭部 移開； 其中該夾具抓取部，係在一反覆執行操作頭部接近及離 開步驟的程序下，藉由一設置在該夾具更替機構上的前後 移動手段的驅動而沿第一方向相對移動元件前後移動。 1 2.如申請專利範圍第1 1項之電子組件安裝方法，其中 操作頭部係為一組件影像拍攝照相機，以拍攝電子組件供 應部上的電子組件之照片，且在操作頭部接近步驟中，一 電子組件供應部上電子組件的影像係相繼地被該組件影像 拍攝照相機所拍攝。 39 326\專利說明書(補件)\94-02\931321511317542 X. Patent application scope: 1. An electronic component mounting device comprising: an electronic component supply portion for supplying a plurality of electronic component blocks arranged in a plane to be held by a component holding fixture; a holding portion disposed at a position away from the electronic component supply portion along a first direction; a mounting head for holding the electronic component taken out from the electronic component supply portion and mounting the electronic component to a mounting on the substrate of the substrate holding portion; a mounting head moving mechanism for moving the mounting head between the electronic component supply portion and the substrate holding portion; and a component image capturing camera for Taking a photo of the electronic component on the electronic component supply portion; a component recognition processing portion that obtains the position of the electronic component on the electronic component supply portion by processing the image captured by the component image processing camera; It is used to hold the component image capturing camera and capture the camera moving mechanism by a component image. The first direction moves on the electronic group supply portion; and a fixture replacement mechanism is disposed to the moving element and replaces the assembly holding fixture by grasping the assembly of the electronic component supply portion and holding the clamp and moving in the first direction . 2. The electronic component mounting device of claim 1, wherein the moving component is a crossbar, and both ends of the crossbar are supported. 34 326\Patent Specification (Repair)\94-02\93132151 1317542 The head moving mechanism is driven to move in the first direction; and a fixture replacing mechanism is provided to the moving element and by grasping the electronic component The assembly of the supply portion holds the clamp and moves in the first direction to replace the assembly holding fixture; wherein the clamp replacement mechanism includes a clamp gripping portion that is mounted to the movable component that is movable in the first direction to grasp The electronic component fixture; and a forward and backward moving means for moving the clamp grasping portion back and forth relative to the moving member in the first direction. 6. The electronic component mounting device of claim 5, wherein the front and rear moving means comprises: a horizontal moving portion that reciprocates in a first direction relative to the moving component driven by the horizontal driving means An annular elastic member movably mounted on the horizontal moving portion and forming a pair of parallel running portions thereon, each running portion being opposed to each other and traveling in opposite directions from each other; and a first The connecting portion and the second connecting portion are respectively coupled to the two sides of the horizontal running portion to hold the moving member and the gripping portion. 7. The electronic component mounting device of claim 5, wherein the operating head is a component image capturing camera for taking photographs of electronic components on the electronic component supply portion. 8. The electronic component mounting device of claim 6, wherein the operating head is a component image capturing camera for taking photographs of electronic components on the electronic component supply portion. 9. An electronic component mounting method implemented by an electronic component mounting device 36 326\patent specification (supplement)\94-02\93132151 1317542, the electronic component mounting device comprising: an electronic component supply portion The utility model is configured to supply a plurality of electronic component blocks arranged in a plane shape to be held by a component holding fixture; a substrate holding portion disposed in a first direction at a position away from the electronic component supply portion; a head for holding the electronic component taken out from the electronic component supply portion and mounting the electronic component to a substrate held on a substrate holding portion; a mounting head moving mechanism that causes the mounting head Moving between the electronic component supply portion and the substrate holding portion; a component image capturing camera for taking a photo of the electronic component on the electronic component supply portion: a component recognition processing portion processed by the component image processing The image taken by the camera obtains the position of the electronic component on the electronic component supply portion; a moving component is used to hold the image The image capture camera and moves on the electronic group supply portion in a first direction by a component image capturing camera moving mechanism; and a fixture replacement mechanism is provided to the moving component and is supplied by grasping the electronic component The component holder holds and moves in the first direction to replace the component holding fixture. The electronic component mounting method comprises: a camera leaving step of moving the component image capturing camera to the electronic component by using an image capturing camera moving mechanism a supply unit, and capturing an image of the electronic component, and then causing the component image capturing camera to be separated from an upper portion of the electronic component supply portion; a component identification step of processing the component captured by the component image capturing camera by the component recognition processing portion Image to obtain the position of a plurality of electronic components; 37 326\patent specification (supplement)\94-02\93132151 1317542 a component removal step when the mounting head moving mechanism is based on a plurality of component recognition processing units Calculate the position of the electronic component to perform a positioning operation When the mounting head is successively positioned to the plurality of electronic components, the mounting head sequentially captures the electronic components; a component mounting step is performed when the mounting head moving mechanism moves the mounting head sequentially Mounting the electronic component held on the mounting head to the substrate held on the substrate holding portion; and a camera approaching step of mounting the electronic component to move the component image capturing camera to the electronic component supply portion Positioning, and successively taking images of each electronic component; wherein the component holding fixture is carried out by the fixture replacing mechanism from the electronic component supply part under a program of repeatedly performing the camera leaving step, and the component holding fixture It is carried by the jig replacement mechanism to the electronic component supply unit under a procedure of repeatedly performing the camera approaching step. 10. The electronic component mounting method of claim 9, wherein the moving component is a crossbar, and both ends of the crossbar are supported. 1 1. An electronic component mounting method implemented by an electronic component mounting device, the electronic component mounting device comprising: an electronic component supply portion for supplying a plurality of electronic component blocks arranged in a planar shape Retained by a component holding fixture; a substrate holding portion disposed at a position away from the electronic component supply portion in a first direction; a component mounting means for holding the self-electronic component supply portion Removing the electronic component and mounting the electronic component to a substrate held on a substrate holding portion; a moving component having an operating head disposed thereon, which is subjected to an operation 38 326\patent specification (supplement)\94 -02\93132151 1317542 is driven by the head moving mechanism to move in the first direction; and a clamp replacing mechanism is provided to the moving element, and holds the clamp by grasping the components of the electronic component supply and in the first direction Moving to replace the component holding fixture; wherein the fixture replacing mechanism includes a gripping portion that is mounted to the first direction Moving the component to grasp the electronic component fixture; and a front and rear moving means for moving the clamp grasping portion back and forth relative to the moving component in the first direction, the electronic component mounting method comprising: an operating head approaching step Moving the moving element to move the operating head to the electronic component supply; an operating head leaving step, after completing the operation of the operating head, moving the moving element to position it above the electronic component supply The operation head is removed; wherein the clamp portion is in the first step of performing the operation of the head approaching and leaving step, and is driven along the first and second moving means provided on the fixture replacement mechanism The direction moves relative to the moving element back and forth. 1 2. The electronic component mounting method of claim 1, wherein the operating head is a component image capturing camera for taking a photo of the electronic component on the electronic component supply portion, and in the operating head approaching step The image of the electronic component on the electronic component supply unit is successively captured by the component image capturing camera. 39 326\Patent specification (supplement)\94-02\93132151
TW093132151A 2003-10-24 2004-10-22 Electronic component mounting apparatus and electronic component mounting method TWI317542B (en)

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JP2003364273A JP4222179B2 (en) 2003-10-24 2003-10-24 Electronic component mounting apparatus and electronic component mounting method
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US20050088666A1 (en) 2005-04-28
KR20060093328A (en) 2006-08-24
US6999184B2 (en) 2006-02-14
EP1676475A1 (en) 2006-07-05
MY130679A (en) 2007-07-31
KR101079688B1 (en) 2011-11-04

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