JP3545157B2

JP3545157B2 - Electronic component mounting equipment

Info

Publication number: JP3545157B2
Application number: JP03196597A
Authority: JP
Inventors: 尚之北村; 修奥田; 朗壁下; 健武田
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 1997-02-17
Filing date: 1997-02-17
Publication date: 2004-07-21
Anticipated expiration: 2017-02-17
Also published as: JPH10229297A

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品を回路基板上に実装する電子部品実装装置に関するものである。
【０００２】
【従来の技術】
電子部品実装装置の従来構成の例を図４に示す。この電子部品実装装置３０は、回路基板３１を装置内に搬入するローダ３９と、テーピングされた電子部品を供給する部品供給リール３４と、トレイ３８に電子部品を収容して所要の電子部品を供給位置に配置するトレイフィーダを備えた部品供給部４０と、前記部品供給リール３４または部品供給部４０から吸着ノズル３３によって電子部品を吸着して所定の実装位置に位置決めされた回路基板３１に電子部品を装着する装着ヘッド３２と、この装着ヘッド３２をＸＹ平面上で自在移動させるＸＹロボット３７と、実装が終了した回路基板３１を装置外に搬出するアンローダ４１とを備えて構成されている。
【０００３】
上記構成において、装着ヘッド３２はＸＹロボット３７によって自在移動して部品供給リール３４または部品供給部４０から所要の電子部品を吸着ノズル３３に吸着し、所定位置に位置決めされた回路基板３１に電子部品を装着する。前記吸着ノズル３３に吸着された電子部品は、部品認識カメラ３６により吸着姿勢が認識され、姿勢補正がなされることによって正確に所定実装位置に装着される。
【０００４】
この装着ヘッド３２による部品装着動作が繰り返されることによって、回路基板３１に対する所定数の部品実装がなされる。このような電子部品実装装置３０においては、一般的に、部品供給リール３４からはチップ部品等の小型の電子部品、部品供給部４０からはＩＣ、ＬＳＩ等の比較的大型の電子部品が供給される。
【０００５】
【発明が解決しようとする課題】
上記構成になる電子部品実装装置３０では、装着ヘッド３２は１つの吸着ノズル３３しか備えていないので、１個の電子部品の装着毎に、部品供給リール３４または部品供給部４０と、部品認識位置及び実装位置との間を往復することになり、生産性が低いという課題を有していた。
【０００６】
そこで、装着ヘッドに複数の吸着ノズルを設けて、同時に複数の電子部品を吸着し、連続した装着動作を行うようにすると生産性は向上する。しかし、部品供給部から複数の電子部品を同時に吸着させるためには、実装順に吸着させる複数の電子部品を所定位置に移載しておく必要があり、この移載のために電子部品を吸着して少なくとも２軸（Ｘ軸−Ｙ軸平面）方向に移動可能な移載ヘッドと、移載された電子部品を複数個保持する電子部品保持台とを設けることになるため、装置の複雑化、大型化をまねく問題点があった。
【０００７】
本発明は、装着ヘッドに複数の吸着ノズルを設けて複数の電子部品を同時吸着して効率よく実装動作を行なわせるための電子部品移載構造を簡易に構成した電子部品実装装置を提供することを目的とするものである。
【０００８】
【課題を解決するための手段】
本発明は、所定位置に実装順に準備された複数の電子部品を装着ヘッドが備えた複数の吸着ノズルにより吸着保持し、回路基板の所定実装位置に複数の電子部品を順次実装する電子部品実装装置において、前記電子部品を収容したトレイを複数枚収容して所要の電子部品を収容したトレイを供給位置に移動させる電子部品供給手段と、前記トレイを引出しアームで保持して前記供給位置と任意の取り出し位置との間に進退移動させるトレイ引出し手段と、前記取り出し位置から電子部品を吸着して１軸方向に移動して吸着した電子部品を移載する電子部品移載手段と、この電子部品移載手段の移動ライン上に位置して前記電子部品移載手段から移載される電子部品を実装順に複数個保持する電子部品保持手段とを具備してなる基本構成を有している。
【０００９】
上記構成によれば、電子部品供給手段が実装順に供給位置に移動させたトレイは、トレイ引出し手段により電子部品移載手段の１軸移動ライン上の電子部品取り出し位置に所要の電子部品が位置するように引出し量が制御されて引き出される。このトレイから電子部品移載手段は電子部品を吸着して移動し、移動ライン上に位置する電子部品保持手段上に移載する。電子部品保持手段は装着ヘッドが備えた吸着ノズルの数に相当する複数個の電子部品を保持することができるので、前記動作を複数回繰り返すことにより、電子部品保持手段上に実装順に複数の電子部品が移載される。装着ヘッドは電子部品保持手段上の複数の電子部品を吸着して回路基板への実装動作を順次実行する。装着ヘッドが複数の電子部品の実装動作を行っている間に次に実装する電子部品の移載が同様に実行される。この構成では、トレイ引出し手段が電子部品移載手段の移動ライン上に所要の電子部品が位置するようにトレイの引出し量を調整する動作を行い、電子部品保持手段は電子部品移載手段の移動ライン上に配設されるので、電子部品移載手段は１軸移動に構成することができ、装置の構成を小型化、簡略化することができる。
【００１０】
本発明は上記基本構成に加え、トレイ引出し手段の引出しアーム上に電子部品保持手段を設けていることを特徴とする。本発明によると、移動が自在に構成された引出しアームは、電子部品が電子部品移載手段に吸着された後に、電子部品移載手段の移動ライン上に移動することができるので、引出しアーム上に電子部品保持手段を設けることができる。この構成により、電子部品保持手段を配設するためのスペースが不要となり、より小型化、簡略化を実現させることができる。
【００１１】
また本発明は上記基本構成に加え、電子部品供給手段に複数の供給位置を設けると共に、これに対応させてトレイ引出し手段を複数並列に配設し、各トレイ引出し手段の引出しアーム上にそれぞれ電子部品保持手段を設けていることを特徴とする。本発明によると電子部品の移載場所を任意に選択することが可能となり、移載動作の迅速化、融通性を向上させることができる。
【００１２】
更に、上記各発明においては、引出しアームの進退移動方向と交差する方向に電子部品移載手段が移動するように構成することができるので、引出しアームの移動範囲と電子部品移載手段の移動範囲とから決定される２軸平面上での自在移動が可能となり、引出しアーム上に配設した電子部品保持手段への電子部品の移載が２軸移動で行うのと同様の動作ができる。
【００１３】
【発明の実施の形態】
以下、添付図面を参照して本発明の一実施形態について説明し、本発明の理解に供する。尚、以下に示す実施形態は本発明を具体化した一例であって、本発明の技術的範囲を限定するものではない。
【００１４】
図１は本発明の一実施形態に係る電子部品実装装置の構成を示す斜視図、図２は同装置のトレイ引出し機構の構成を示す斜視図、図３は同装置の電子部品移載機構の構成を示す斜視図である。
【００１５】
図１において、電子部品実装装置１は、電子部品を収容したトレイ６を複数収容し、所要の電子部品を収容したトレイ６を選択して供給位置に移動させるトレイフィーダを２基並列に備えた電子部品供給部（電子部品供給手段）２と、この電子部品供給部２の供給位置にあるトレイ６を引出しアーム１１で保持して、前記供給位置と任意の部品取り出し位置との間にトレイ６を進退移動させる２基のトレイ引出し機構（トレイ引出し手段）７ａ、７ｂと、部品取り出し位置に引き出されたトレイ６から電子部品を取り出して前記引出しアーム１１上に配設された電子部品保持台（電子部品保持手段）１７上に移載する電子部品移載機構（電子部品移載手段）８と、前記電子部品保持台１７に移載された複数の電子部品を複数の吸着ノズル４により吸着して回路基板１０の所定位置に装着する装着ヘッド３と、この装着ヘッド３を図示Ｘ−Ｙ平面で自在移動させるＸＹロボット５とを備えて構成されている。尚、回路基板１０の搬入／搬出及び位置決め固定のための構造、テーピングされた電子部品を供給する電子部品供給リール、吸着ノズル４に吸着された電子部品の吸着姿勢の認識構造等の図示は省略している。
【００１６】
前記トレイ引出し機構７は、図２に拡大図示するように構成されている。図２は２基配設されたうちの一方側のトレイ引出し機構７ａのみを抽出図示している。
【００１７】
図２において、トレイ固定プレート１３上に固定されたトレイ６には電子部品９が複数個収容されており、このトレイ６を固定したトレイ固定プレート１３は前記電子部品供給部２に所要数が収容されており、実装プログラムに基づく実装順に所要の電子部品９を収容したトレイ６が供給位置に移動される。前記トレイ固定プレート１３の一辺には嵌合部１３ａが設けられており、トレイ引出し機構７に設けられた嵌合腕１８がシリンダ１９によって駆動されることにより着脱自在に嵌合する。前記嵌合腕１８は引出しアーム１１に連結されており、引出しアーム１１が引出しベルト１６によって移動することにより、嵌合したトレイ固定プレート１３は引出し台１４上の任意位置に引き出される。このトレイ固定プレート１３の引出し台１４上への引出し量は、取り出したい電子部品９が後述する電子部品移載機構８の移載ヘッド１２の移動ライン上に位置するように制御される。トレイ６上から電子部品９が電子部品移載機構８によって取り出された後、引出しアーム１１はトレイ固定プレート１３を供給位置に戻す。即ち、トレイ引出し機構７ａ、７ｂは引出しアーム１１を図示Ｙ軸方向に進退移動させることができる。このＹ軸方向の進退動作によって、電子部品供給部２が実装順に供給位置に移動させてくる所要の電子部品９が前記電子部品移載機構８によって取り出されるように動作する。図２に示す構成は、図１に示すように２基並列させて、電子部品供給部２の正面に配設することができる。
【００１８】
また、前記電子部品移載機構８は、図３に拡大図示するように構成されている。図３において、電子部品移載機構８は、前記トレイ引出し機構７ａ、７ｂの上方に配設され、電子部品吸着ノズル１５を備えた移載ヘッド１２は、２基のトレイ引出し機構７ａ、７ｂの間を図示Ｘ軸方向に移動できるように構成されている。移載ヘッド１２は、トレイ引出し機構７ａまたは７ｂにより引き出されたトレイ６上から電子部品９を電子部品吸着ノズル１５によって吸着し、引出しアーム１１上に配設された電子部品保持台１７に移載する。この移載動作は、一方のトレイ引出し機構７（例えば７ａ）のトレイ６から所定の電子部品９を吸着して、他方のトレイ引出し機構７（例えば７ｂ）の引出しアーム１１上の電子部品保持台１７に電子部品９を移載し、これを交互に行うように制御すると、移載動作の迅速化を図ることができる。前記電子部品保持台１７は、いずれか一方の引出しアーム１１上にのみ設けて構成することもでき、そのときには、電子部品保持台１７が設けられた引出しアーム１１によって引き出されたトレイ６から電子部品移載機構８が電子部品９を取り出すと、引出しアーム１１はトレイ６を戻す動作を行って所定位置に移動するので、電子部品移載機構８から電子部品保持台１７に電子部品９を移載することができる。
【００１９】
前記引出しアーム１１上に設けられた電子部品保持台１７には、移載ヘッド１２によって移載される電子部品９を吸着保持する所定数（装着ヘッド３に設けられた吸着ノズルの数）の吸着パッド２０がＸ軸方向に配列されており、移載された電子部品９を所定数保持する。
【００２０】
上記トレイ引出し機構７及び電子部品移載機構８それぞれの移動方向は、互いに交差する２軸方向（Ｘ軸−Ｙ軸方向）であるため、電子部品９を移載する移載ヘッド１２が１軸方向の移動でも、トレイ６上の任意位置から電子部品９を取り出し、電子部品保持台１７上に移載することができる。従って、電子部品移載機構８は１軸移動の簡単な構成であるため、構造上でも制御上でも簡略化を図ることができる。
【００２１】
また、上記電子部品９の移載動作は、装着ヘッド３が電子部品保持台１７に保持された複数の電子部品９を同時に吸着して回路基板１０に対する実装動作を順次行っている間に実施することができる。装着ヘッド３の実装動作は、電子部品吸着後に図示しない部品認識位置に移動して、各電子部品９の吸着姿勢を認識させ、その認識結果に基づいて姿勢補正動作を行った後、回路基板１０の所定実装位置に複数の電子部品９を順次装着する。
【００２２】
図１に示した電子部品実装装置１においては、従来構成（図４参照）で示したような電子部品供給リールによる部品供給手段は省略しているが、前記電子部品供給リールによる電子部品供給は、装着ヘッド３に複数の電子部品を同時吸着させるための移載手段の必要はなく、装着ヘッド３または電子部品供給リールの１軸上の移動で容易に複数個の同時吸着が可能である。この電子部品供給リールと前記電子部品供給部２との併用により部品供給を行うときにも、装着ヘッド３が電子部品供給リールからの部品実装を実行している間にも、上記構成により電子部品供給部２からの複数個の電子部品の移載を準備することができ、効率的な部品実装を実施させることができる。
【００２３】
尚、上記構成においては、電子部品保持台１７を引出しアーム１１上に配設しているが、トレイ引出し機構７及び電子部品移載機構８のＸ−Ｙ平面上の可動範囲内にＸ軸方向またはＹ軸方向に配設することもできる。
【００２４】
【発明の効果】
以上の説明の通り本発明によれば、電子部品供給手段が実装順に供給位置に移動させたトレイは、トレイ引出し手段により電子部品移載手段の１軸移動ライン上の電子部品取り出し位置に所要の電子部品が位置するように引出し量が制御されて引き出される。このトレイから電子部品移載手段は電子部品を吸着して移動し、移動ライン上に位置する電子部品保持手段上に移載する。電子部品保持手段は装着ヘッドが備えた吸着ノズルの数に相当する複数個の電子部品を保持することができるので、前記動作を複数回繰り返すことにより、電子部品保持手段上に実装順に複数の電子部品が移載される。装着ヘッドは電子部品保持手段上の複数の電子部品を吸着して回路基板への実装動作を順次実行する。装着ヘッドが複数の電子部品の実装動作を行っている間に次に実装する電子部品の移載が同様に実行される。この構成では、トレイ引出し手段が電子部品移載手段の移動ライン上に所要の電子部品が位置するようにトレイの引出し量を調整する動作を行い、電子部品保持手段は電子部品移載手段の移動ライン上に配設されるので、電子部品移載手段は１軸移動に構成することができ、装置の構成を小型化、簡略化することができる。
【００２５】
また本発明は、トレイ引出し手段の引出しアーム上に電子部品保持手段を設けているので、移動が自在に構成された引出しアームは、電子部品が電子部品移載手段に吸着された後に、電子部品移載手段の移動ライン上に移動することができるので、引出しアーム上に電子部品保持手段を設けることができる。この構成により、電子部品保持手段を配設するためのスペースが不要となり、より小型化、簡略化を実現させることができる。
【００２６】
更に本発明は、電子部品供給手段に複数の供給位置を設けると共に、これに対応させてトレイ引出し手段を複数並列に配設し、各トレイ引出し手段の引出しアーム上にそれぞれ電子部品保持手段を設けているので、電子部品の移載場所を任意に選択することが可能となり、移載動作の迅速化、融通性を向上させることができる。
【００２７】
更に、上記各構成においては、引出しアームの進退移動方向と交差する方向に電子部品移載手段が移動するように構成することができるので、引出しアームの移動範囲と電子部品移載手段の移動範囲とから決定される２軸平面上での自在移動が可能となり、引出しアーム上に配設した電子部品保持手段への電子部品の移載が２軸移動で行うのと同様の動作ができる。
【図面の簡単な説明】
【図１】本発明の一実施形態に係る電子部品実装装置の構成を示す斜視図。
【図２】同上装置のトレイ引出し機構の構成を示す斜視図。
【図３】同上装置の電子部品移載機構の構成を示す斜視図。
【図４】従来技術に係る電子部品実装装置の構成を示す斜視図。
【符号の説明】
１電子部品実装装置
２電子部品供給部（電子部品供給手段）
３装着ヘッド
４吸着ノズル
６トレイ
７、７ａ、７ｂトレイ引出し機構（トレイ引出し手段）
８電子部品移載機構（電子部品移載手段）
９電子部品
１０回路基板
１１引出しアーム
１２移載ヘッド
１７電子部品保持台（電子部品保持手段）[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a circuit board.
[0002]
[Prior art]
FIG. 4 shows an example of a conventional configuration of an electronic component mounting apparatus. The electronic component mounting apparatus 30 includes a loader 39 for loading the circuit board 31 into the apparatus, a component supply reel 34 for supplying taped electronic components, and a tray 38 for storing the electronic components and supplying required electronic components. A component supply unit 40 having a tray feeder disposed at a predetermined position, and a circuit board 31 positioned at a predetermined mounting position by sucking electronic components from the component supply reel 34 or the component supply unit 40 by a suction nozzle 33. , A XY robot 37 for freely moving the mounting head 32 on the XY plane, and an unloader 41 for carrying the mounted circuit board 31 out of the apparatus.
[0003]
In the above configuration, the mounting head 32 is freely moved by the XY robot 37 to suck the required electronic component from the component supply reel 34 or the component supply unit 40 to the suction nozzle 33, and the electronic component is mounted on the circuit board 31 positioned at a predetermined position. Attach. The suction posture of the electronic component sucked by the suction nozzle 33 is recognized by the component recognition camera 36, and the electronic component is accurately mounted at a predetermined mounting position by correcting the posture.
[0004]
By repeating the component mounting operation by the mounting head 32, a predetermined number of components are mounted on the circuit board 31. In such an electronic component mounting apparatus 30, generally, small electronic components such as chip components are supplied from the component supply reel 34, and relatively large electronic components such as IC and LSI are supplied from the component supply unit 40. You.
[0005]
[Problems to be solved by the invention]
In the electronic component mounting apparatus 30 having the above-described configuration, the mounting head 32 includes only one suction nozzle 33, and therefore, every time one electronic component is mounted, the component supply reel 34 or the component supply unit 40 and the component recognition position. And reciprocating between the mounting position, and there is a problem that productivity is low.
[0006]
Therefore, productivity is improved by providing a plurality of suction nozzles in the mounting head to simultaneously suction a plurality of electronic components and performing a continuous mounting operation. However, in order to simultaneously suck a plurality of electronic components from the component supply unit, it is necessary to transfer a plurality of electronic components to be sucked in a mounting order to a predetermined position. Therefore, a transfer head movable in at least two axes (X-axis-Y-axis plane) and an electronic component holding table for holding a plurality of transferred electronic components are provided. There was a problem that led to an increase in size.
[0007]
An object of the present invention is to provide an electronic component mounting apparatus in which a mounting head is provided with a plurality of suction nozzles and a plurality of electronic components are simultaneously suctioned to simultaneously perform an electronic component mounting structure for efficiently performing an mounting operation. The purpose is.
[0008]
[Means for Solving the Problems]
The present invention provides an electronic component mounting apparatus that holds a plurality of electronic components prepared in a mounting position at a predetermined position by a plurality of suction nozzles provided in a mounting head and sequentially mounts the plurality of electronic components at a predetermined mounting position on a circuit board. An electronic component supply means for accommodating a plurality of trays accommodating the electronic components and moving the tray accommodating the required electronic components to a supply position; and Tray extraction means for moving forward and backward between the take-out position, electronic component transfer means for sucking electronic components from the take-out position and moving in one axial direction to transfer the sucked electronic components, and electronic component transfer means It has a basic structure formed by including an electronic component holding means for a plurality hold located on the moving line of the mounting means electronic component is transferred from the electronic component transfer device in the mounting order There.
[0009]
According to the above configuration, in the tray moved by the electronic component supply unit to the supply position in the mounting order, the required electronic component is located at the electronic component removal position on the one-axis movement line of the electronic component transfer unit by the tray extraction unit. The amount of withdrawal is controlled as described above. From this tray, the electronic component transfer means sucks and moves the electronic component and transfers it to the electronic component holding means located on the moving line. Since the electronic component holding means can hold a plurality of electronic components corresponding to the number of suction nozzles provided in the mounting head, by repeating the above operation a plurality of times, a plurality of electronic components are placed on the electronic component holding means in the mounting order. Parts are transferred. The mounting head sucks the plurality of electronic components on the electronic component holding means and sequentially executes the mounting operation on the circuit board. While the mounting head is performing the mounting operation of the plurality of electronic components, the transfer of the next electronic component to be mounted is similarly performed. In this configuration, the tray withdrawing means performs an operation of adjusting the tray withdrawal amount so that the required electronic component is located on the moving line of the electronic component transfer means, and the electronic component holding means moves the electronic component transfer means. Since the electronic component transfer means is disposed on the line, the electronic component transfer means can be configured to move in one axis, and the configuration of the apparatus can be reduced in size and simplified.
[0010]
The present invention is characterized in that, in addition to the above basic configuration, electronic component holding means is provided on a drawer arm of the tray drawer means . According to the present invention, the drawer arm that is freely movable can move on the movement line of the electronic component transfer means after the electronic component is sucked by the electronic component transfer means. May be provided with electronic component holding means. According to this configuration, a space for disposing the electronic component holding means is not required, and further downsizing and simplification can be realized.
[0011]
Further, in addition to the above basic structure, the present invention provides a plurality of supply positions on the electronic component supply means, and a plurality of tray drawers arranged in parallel in correspondence with the supply positions , and the electronic parts are respectively provided on the drawer arms of each tray drawer. It is characterized in that a component holding means is provided . According to the present invention, it is possible to arbitrarily select a transfer place of an electronic component, and it is possible to speed up a transfer operation and improve flexibility.
[0012]
Further, in each of the above-mentioned inventions , since the electronic component transfer means can be configured to move in a direction intersecting the direction of movement of the drawer arm, the movement range of the drawer arm and the movement range of the electronic component transfer means Thus, the electronic component can be freely moved on a two-axis plane determined by the above, and the same operation can be performed as when the electronic component is transferred to the electronic component holding means provided on the drawer arm by the two-axis movement.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. The embodiment described below is an example embodying the present invention, and does not limit the technical scope of the present invention.
[0014]
FIG. 1 is a perspective view showing a configuration of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing a configuration of a tray pull-out mechanism of the apparatus, and FIG. FIG. 3 is a perspective view showing a configuration.
[0015]
In FIG. 1, the electronic component mounting apparatus 1 has a plurality of tray feeders that accommodate a plurality of trays 6 accommodating electronic components and select a tray 6 accommodating required electronic components and move the tray 6 to a supply position. An electronic component supply unit (electronic component supply means) 2 and a tray 6 at a supply position of the electronic component supply unit 2 are held by a pull-out arm 11, and a tray 6 is provided between the supply position and an arbitrary component removal position. Tray extraction mechanisms (tray extraction means) 7a and 7b for moving the electronic component forward and backward, and an electronic component holding table provided on the extraction arm 11 by extracting electronic components from the tray 6 extracted to the component extraction position. An electronic component transfer mechanism (electronic component transfer device) 8 for transferring the electronic components onto the electronic component holding table 17, and a plurality of electronic components transferred to the electronic component holding table 17 to the plurality of suction nozzles 4. Ri and mounting head 3 to be mounted on a predetermined position of the suction to the circuit board 10 is configured and an XY robot 5 for freely moving the mounting head 3 in the illustrated XY plane. It should be noted that a structure for carrying in / out and positioning and fixing of the circuit board 10, an electronic component supply reel for supplying a taped electronic component, a structure for recognizing a suction posture of the electronic component sucked by the suction nozzle 4, and the like are omitted. are doing.
[0016]
The tray pull-out mechanism 7 is configured as shown in an enlarged view in FIG. FIG. 2 shows only one of the two tray pull-out mechanisms 7a.
[0017]
In FIG. 2, a plurality of electronic components 9 are accommodated in a tray 6 fixed on a tray fixing plate 13, and a required number of electronic components 9 are accommodated in the electronic component supply unit 2. The tray 6 containing the required electronic components 9 is moved to the supply position in the mounting order based on the mounting program. A fitting portion 13 a is provided on one side of the tray fixing plate 13, and the fitting arm 18 provided on the tray pull-out mechanism 7 is driven by a cylinder 19 to be removably fitted. The fitting arm 18 is connected to the drawer arm 11, and the fitted tray fixing plate 13 is pulled out to an arbitrary position on the drawer table 14 by the movement of the drawer arm 11 by the drawer belt 16. The amount by which the tray fixing plate 13 is pulled out onto the drawer table 14 is controlled so that the electronic component 9 to be taken out is positioned on the movement line of the transfer head 12 of the electronic component transfer mechanism 8 described later. After the electronic component 9 is taken out from the tray 6 by the electronic component transfer mechanism 8, the drawer arm 11 returns the tray fixing plate 13 to the supply position. That is, the tray pull-out mechanisms 7a and 7b can move the pull-out arm 11 forward and backward in the illustrated Y-axis direction. By the forward / backward movement in the Y-axis direction, the electronic component supply unit 2 operates so that the required electronic components 9 that are moved to the supply position in the mounting order are taken out by the electronic component transfer mechanism 8. The configuration shown in FIG. 2 can be disposed in front of the electronic component supply unit 2 by arranging two units in parallel as shown in FIG.
[0018]
The electronic component transfer mechanism 8 is configured as shown in an enlarged view in FIG. In FIG. 3, an electronic component transfer mechanism 8 is disposed above the tray pull-out mechanisms 7a and 7b, and a transfer head 12 having an electronic component suction nozzle 15 is provided with two tray pull-out mechanisms 7a and 7b. It is configured to be movable in the X-axis direction in the drawing. The transfer head 12 sucks the electronic component 9 from the tray 6 pulled out by the tray pullout mechanism 7a or 7b by the electronic component suction nozzle 15, and transfers the electronic component 9 to the electronic component holding table 17 arranged on the pullout arm 11. I do. In this transfer operation, a predetermined electronic component 9 is sucked from the tray 6 of one tray extraction mechanism 7 (for example, 7a), and the electronic component holding table on the extraction arm 11 of the other tray extraction mechanism 7 (for example, 7b). If the electronic components 9 are transferred to 17 and controlled so as to be performed alternately, the transfer operation can be sped up. The electronic component holding table 17 can be provided and provided only on one of the drawer arms 11. In this case, the electronic component holding table 17 is provided on the tray 6 drawn by the extraction arm 11 provided with the electronic component holding table 17. When the transfer mechanism 8 takes out the electronic component 9, the drawer arm 11 performs the operation of returning the tray 6 and moves to a predetermined position, so that the electronic component 9 is transferred from the electronic component transfer mechanism 8 to the electronic component holding table 17. can do.
[0019]
A predetermined number (the number of suction nozzles provided on the mounting head 3) of suction to hold the electronic components 9 transferred by the transfer head 12 on the electronic component holding table 17 provided on the drawer arm 11. Pads 20 are arranged in the X-axis direction, and hold a predetermined number of transferred electronic components 9.
[0020]
Since the moving directions of the tray pull-out mechanism 7 and the electronic component transfer mechanism 8 are in two axial directions (X axis-Y axis direction) that intersect each other, the transfer head 12 that transfers the electronic components 9 is one axis. Even in the movement in the direction, the electronic component 9 can be taken out from an arbitrary position on the tray 6 and transferred to the electronic component holding table 17. Therefore, since the electronic component transfer mechanism 8 has a simple configuration of one-axis movement, it can be simplified in structure and control.
[0021]
The transfer operation of the electronic component 9 is performed while the mounting head 3 simultaneously suctions the plurality of electronic components 9 held on the electronic component holding table 17 and sequentially performs the mounting operation on the circuit board 10. be able to. The mounting operation of the mounting head 3 is performed by moving the electronic component 9 to a component recognition position (not shown) after the electronic component is picked up, and by recognizing the picked-up attitude of each electronic component 9, performing an attitude correction operation based on the recognition result, and then performing A plurality of electronic components 9 are sequentially mounted at a predetermined mounting position.
[0022]
In the electronic component mounting apparatus 1 shown in FIG. 1, the component supply means by the electronic component supply reel as shown in the conventional configuration (see FIG. 4) is omitted, but the electronic component supply by the electronic component supply reel is not performed. There is no need for a transfer means for causing the mounting head 3 to simultaneously suction a plurality of electronic components, and a plurality of simultaneous suction can be easily performed by moving the mounting head 3 or the electronic component supply reel on one axis. The above-described configuration allows the electronic component to be supplied by using the electronic component supply reel in combination with the electronic component supply unit 2 and the mounting head 3 to execute component mounting from the electronic component supply reel. Transfer of a plurality of electronic components from the supply unit 2 can be prepared, and efficient component mounting can be performed.
[0023]
In the above configuration, the electronic component holding table 17 is disposed on the pull-out arm 11. However, the tray pull-out mechanism 7 and the electronic component transfer mechanism 8 are within the movable range on the XY plane in the X-axis direction. Alternatively, they can be arranged in the Y-axis direction.
[0024]
【The invention's effect】
As described above, according to the present invention, the tray moved by the electronic component supply means to the supply position in the mounting order is moved to the electronic component removal position on the one-axis movement line of the electronic component transfer means by the tray extraction means. The withdrawal amount is controlled so that the electronic component is located and is withdrawn. From this tray, the electronic component transfer means sucks and moves the electronic component and transfers it to the electronic component holding means located on the moving line. Since the electronic component holding means can hold a plurality of electronic components corresponding to the number of suction nozzles provided in the mounting head, by repeating the above operation a plurality of times, a plurality of electronic components are placed on the electronic component holding means in the mounting order. Parts are transferred. The mounting head sucks the plurality of electronic components on the electronic component holding means and sequentially executes the mounting operation on the circuit board. While the mounting head is performing the mounting operation of the plurality of electronic components, the transfer of the next electronic component to be mounted is similarly performed. In this configuration, the tray withdrawing means performs an operation of adjusting the tray withdrawal amount so that the required electronic component is located on the moving line of the electronic component transfer means, and the electronic component holding means moves the electronic component transfer means. Since the electronic component transfer means is disposed on the line, the electronic component transfer means can be configured to move in one axis, and the configuration of the apparatus can be reduced in size and simplified.
[0025]
Further, according to the present invention , since the electronic component holding means is provided on the drawer arm of the tray drawer means , the movable drawer arm is provided with the electronic component after the electronic component is attracted to the electronic component transfer means. Since it can move on the movement line of the transfer means, the electronic component holding means can be provided on the drawer arm. According to this configuration, a space for disposing the electronic component holding means is not required, and further downsizing and simplification can be realized.
[0026]
Further, according to the present invention , a plurality of supply positions are provided in the electronic component supply means, a plurality of tray extraction means are arranged in parallel in correspondence with the supply positions, and the electronic component holding means is provided on the extraction arm of each tray extraction means. Therefore, it is possible to arbitrarily select a transfer place of the electronic component, and it is possible to speed up the transfer operation and improve the flexibility.
[0027]
Further, in each of the above configurations, the electronic component transfer means can be configured to move in a direction intersecting the direction of movement of the drawer arm, so that the movement range of the drawer arm and the movement range of the electronic component transfer means can be adjusted. Thus, the electronic component can be freely moved on a two-axis plane determined by the above, and the same operation can be performed as when the electronic component is transferred to the electronic component holding means provided on the drawer arm by the two-axis movement.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a configuration of a tray pull-out mechanism of the device.
FIG. 3 is a perspective view showing a configuration of an electronic component transfer mechanism of the above device.
FIG. 4 is a perspective view showing a configuration of an electronic component mounting apparatus according to the related art.
[Explanation of symbols]
1 electronic component mounting device 2 electronic component supply unit (electronic component supply means)
3 mounting head 4 suction nozzle 6 trays 7, 7a, 7b tray pull-out mechanism (tray pull-out means)
8 Electronic component transfer mechanism (electronic component transfer means)
9 electronic component 10 circuit board 11 drawer arm 12 transfer head 17 electronic component holding table (electronic component holding means)

Claims

In an electronic component mounting apparatus, a plurality of electronic components prepared in a mounting position at a predetermined position are sucked and held by a plurality of suction nozzles provided in a mounting head, and the plurality of electronic components are sequentially mounted at a predetermined mounting position on a circuit board. Electronic component supply means for accommodating a plurality of trays accommodating components and sequentially moving the tray accommodating the required electronic components to a supply position, and holding the tray with a drawer arm and providing the supply position and any take-out position. Tray withdrawal means for moving forward and backward, electronic component transfer means for sucking electronic components from the take-out position and moving in one axial direction to transfer the sucked electronic components, and electronic component transfer means. located on the transfer line becomes and comprises an electronic component holding means for a plurality held on a mounting order of electronic components to be transferred from the electronic component transfer unit, the tray drawer hand An electronic component mounting apparatus characterized by comprising provided an electronic component holding means on the drawer arm.

In an electronic component mounting apparatus, a plurality of electronic components prepared in a mounting position at a predetermined position are sucked and held by a plurality of suction nozzles provided in a mounting head, and the plurality of electronic components are sequentially mounted at a predetermined mounting position on a circuit board. Electronic component supply means for accommodating a plurality of trays accommodating components and sequentially moving the tray accommodating the required electronic components to a supply position, and holding the tray with a drawer arm and providing the supply position and any take-out position. Tray withdrawal means for moving forward and backward, electronic component transfer means for sucking electronic components from the take-out position and moving in one axial direction to transfer the sucked electronic components, and electronic component transfer means. located on the transfer line becomes and comprises an electronic component holding means for a plurality held on a mounting order of electronic components to be transferred from the electronic component transfer device, wherein the electronic component feeding hand Provided with a plurality of supply positions, to which in correspondence disposed tray drawer unit in a plurality of rows, it shall be the said formed by each electronic component holding means on the drawer arm of each tray drawer means is provided electronic component mounting apparatus.

3. The electronic component mounting apparatus according to claim 1 , wherein the electronic component transfer unit is configured to move in a direction intersecting a direction in which the drawer arm moves forward and backward.