JPS6211520B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip element mounting method for simultaneously mounting a plurality of chip elements on a substrate.

This type of conventional technology has a problem in that there is a possibility that two chip elements may be mounted at one chip element mounting position on the board.
Furthermore, when mounting chip elements on a substrate, there is a problem in that the mounting position is not accurate.

The problems of the prior art will be explained below with reference to FIGS. 1 to 3.

In the prior art, as shown in a plan view in FIG. 1 and as shown in a partially sectional front view in FIG. 2, a plurality of chip elements 1 arranged in this manner are simultaneously vacuum-adsorbed by a vacuum chuck 10 equipped with a plurality of vacuum suction holes 9 as shown in FIG. and place unit 1
1, the chip element 1 is moved to the upper part of the substrate, and the chip element 1 that has been chucked here is mounted on the substrate. In this case, when picking up the chip element 1 with the vacuum chuck 10, the rod 7 of the chip element lifting device 6 is generally used to pick up the chip element 1 in the magazine 3.
At this time, each vacuum suction hole 9
chucks two chip elements 1 by suction, and therefore two chips are placed at one chip element mounting position on the board.
In some cases, more than one chip element 1 is mounted. In addition, in order to store the chip element 1 in the magazine 3 in a vertically movable state, it is necessary to create a gap between the magazine 3 and the chip element 1, and the chip element 1 is moved into the magazine 3 by this clearance. This results in poor mounting accuracy on the board.

Regarding the problems of the prior art shown in Figures 1 to 3,
More details are as follows.

As described above, a plurality of chip elements 1 are stored vertically in the rectangular cylindrical magazine 3 of the multi-magazine 2. A stopper 4 is provided at the lower end of each magazine 3 to prevent the chip element 1 from falling off.
The multi-magazine 2 includes a plurality of such magazines 3, and the upper and lower ends of these magazines 3 are fixed by magazine plates 5. In order to mount a plurality of chip elements 1 on a substrate (not shown) using this multi-magazine 2, first,
As shown in FIG. 3, the multi-magazine 2 is placed on the chip lifting device 6. Next, the motor 8 is driven to raise the rods 7 provided in the chip element lifting device 6 by the number of magazines 3, and the ends of the rods 7 simultaneously raise the stoppers 4 in each magazine 3. The chip elements 1 pushed out from the magazine plate 5 above the multi-magazine 2 by the rise of the multi-magazine 2 are simultaneously vacuum-adsorbed at positions corresponding to the magazines 3 by a vacuum chuck 10 having vacuum suction holes 9 equal in number to the number of magazines 3. The vacuum chuck 10 is moved to a position above the substrate by the pick-and-place unit 11, and here the vacuum suction of the vacuum chuck 10 is released and mounting is performed.

However, in such a conventional mounting method, since the chip element pushing device 6 pushes up the chip elements 1 in each magazine 3 set in the multi-magazine 2, a load is applied to the chip elements 1, and the chips in the magazine 3 are pushed up. There is a drawback that when the chips 1 become clogged or a plurality of chip chips 1 are picked up at the same time by the vacuum chuck 10, two chip chips 1 in the same magazine 3 are picked up in a bonded state and mounted on the board as is. In addition, since the inside dimensions of the magazine 3 have a clearance necessary for the chip element 1 to pass through,
When the chip element 1 is suctioned by the vacuum chuck 10, the chip element 1 moves freely within the clearance of the magazine 3, and there is a drawback that the positional accuracy of the chip element 1 is poor.

As described above, the conventional technology has the problem of double mounting of chip elements on the board and the problem of poor mounting accuracy, and these remain technical problems to be solved.

The present invention aims to solve such technical problems, and its purpose is to separate chip elements one by one from a magazine, mount them on a pallet, and move them from this mounting position to the chuck adsorption position as described above. The pallet is moved in the horizontal direction, and the moving pallet plate is moved by the driving means at the suction position to accurately position a large number of chip elements at once, and these chip elements are placed on the substrate with high precision by the pick-and-place unit. It is an object of the present invention to provide a method for mounting chip elements that allows chip elements to be mounted all at once.

In order to achieve the above object, the present invention constitutes a multi-magazine arranged at predetermined intervals, and horizontally reciprocates chip elements delivered from the bottom of each magazine in which chip elements are stacked and stored. A fixed pallet plate is fixed to the upper side of the pallet body with a large number of rectangular chip element holes for positioning formed at predetermined positions; Each chip element on a pallet is comprised of a movable pallet plate provided between a fixed pallet plate and a movable pallet plate slidably supported diagonally with respect to the side of the rectangular chip element hole for positioning. The pallet is mounted in the hole and moved in the horizontal direction between this mounting position and a suction position where the chip element is suctioned to the chuck of the pick-and-place unit, and the moving pallet is moved by a driving means provided at the suction position. The plate is slightly moved in the above-mentioned diagonal horizontal direction, and by this slight movement of the moving pallet plate, the mounted chip element is pressed against the corner side of the rectangular chip element hole for positioning of the fixed pallet plate, and this positioning is performed. A method for mounting a chip device, which comprises: picking up a large number of chip devices using a large number of suction nozzles constituting the chuck; and picking up and transporting the picked chip devices by the pick-and-place unit and mounting them on a substrate. It is.

Some embodiments of the present invention will be described below with reference to the drawings.

5 to 9 show an embodiment of an apparatus for carrying out the method according to the invention. In this embodiment, the present invention is applied to mounting components on a board assembly (for example, an electronic tuner product, etc.) as illustrated in FIG. As shown in Figure 4, this board assembly is
A rectangular chip element 22 is mounted on the substrate 21.
It is completed by mounting and fixing multiple units perpendicularly to each other. Note that when mounting, the number of chip elements 22 is generally large, so the chip elements 22 are often divided into multiple parts and mounted.
It does not matter whether all the chip elements 22 on one chip are mounted at one time or multiple times.

The chip element mounting in this embodiment is carried out as follows.

In order to mount the chip element, a chip element hole 39 for inserting the chip element is provided at a position corresponding in plan to the chip element mounting position on the board 21 (corresponding to the position where the chip element 22 in FIG. 4 is located). Palette 37 is used. The chip elements 22 are temporarily placed on such a pallet 37 as shown in FIG. The illustrated example uses a magazine 26 in which chip elements 22 are vertically stacked, as in the conventional example, but unlike the conventional example, in this example, the chip elements 22 are dropped downward from the magazine 25, and the chip elements are inserted into each chip element hole 39 of the pallet 37. 23 are arranged.

When arranging the chip elements 22 on the pallet 37 in this way, the chip elements 22 are supplied to each chip element hole 39 of the pallet 37 as shown in FIG. , the chip element 22 is inserted into each chip element hole 39.
Position it by making it come into contact with the inner wall surface of the In this example, this abutment positioning is performed by tilting the pallet 37 as shown in FIG. (The chip element 22 is brought into contact with the two walls of the pallet 37 as described above.)
Thereafter, the chip elements 22 on the pallet 37 are transferred to the chip element mounting position on the substrate 21 using, for example, a vacuum chuck 42 shown in FIG.

Since the chip elements of this embodiment are mounted by the method described above, the chip elements 2 are mounted on the pallet 37 once.
2 (as shown in FIG. 5), and then transfer this chip element 22 to the corresponding position on the substrate 21 as shown in FIG. The problem of being mounted in a mounting position is practically solved. Furthermore, after supplying the chip elements 22 to the pallet 37, the chip elements 22 are positioned in contact with the inner wall surface of each chip element hole 39 of the pallet 37, so that the position of the chip element to be mounted is reliably determined, and the chip elements 22 are positioned in contact with the inner wall of each chip element hole 39 of the pallet 37. The mounting position accuracy is extremely good.

More specifically, this embodiment has the following configuration.

Please refer to FIG. The multi-magazine 23 serving as the chip element feeding means in this embodiment includes a pair of upper and lower magazine plates 25 held at a predetermined distance by support columns 24, and between these magazine plates 25, the substrate 21 of the chip element 22 is mounted. The magazines 26 are arranged at positions corresponding to the positions,
Fixed. In this magazine 26, a large number of chip elements 22 are stored vertically, and a weight 27 is placed on the uppermost chip element 22 of these chip elements 22, applying a light downward load to the chip element 22. It is made to take. Although its own weight alone is sufficient to prevent the object from falling, in this example, a weight is used to ensure the fall. Furthermore, a lid 28 is attached to the upper end of each magazine 26. Further, the multi-magazine 23 includes a stopper plate 29, a spacer 30, a cutting plate 31, and a guide plate 32 in this order below the lower magazine plate 25, which are attached to the lower magazine plate 25. The stopper plate 29 stops and holds the lower end of each magazine 26, and is provided with a chip element hole 33 through which each chip element 22 can be inserted (see FIG. 7). Each chip element 22 moves smoothly in the direction of the middle arrow P, and each chip element 22
This is a plate to prevent each chip element 2 from coming into contact with the lower surface of the chip element 2 as the slotting plate 31 moves.
The chip element hole 34 is large enough not to obstruct the movement of the chip element 2.
It is equipped with The slotting plate 31 serves to ensure that the chip elements 22 are placed on the pallet 37 so that one chip element 22 is placed in each chip element hole 29, thereby ensuring that the chip elements 22 are not mounted twice on the board 21. . That is, this scraping plate 31
In the state shown in FIG. 5, the chip elements 22 can be stored directly below each magazine 26, and the chip element holes 3 are larger than the chip elements 22.
5. The guide plate 32 does not have a hole directly below each magazine 26, and when the slotted plate 31 slides a predetermined distance to the left in FIG. A chip element hole 36 larger than the chip element hole 35 is provided. Furthermore, the stopper plate 29, spacer 30, slotted plate 31, and guide plate 32 are attached to the magazine plate 25 using through bolts, etc., and the slotted plate 31 can be moved inside from the insertion point of the through bolt. It is formed as small as the hole, or has a slotted hole such as a long hole.

The pallet 37 is disposed below the multi-magazine 24 so as to be movable in the direction of arrow Q in FIG. The pallet 37 of this example includes a pallet main body 38 made of a thick flat plate, and a rectangular shape for inserting a chip element at a position that corresponds in plan to the position where the chip element is mounted on the substrate 21, and is fixed onto the pallet main body 38. The pallet plate 40 is formed with a chip element hole 39 and is made of a plate material having approximately the same thickness as the chip element 22. When the pallet 37 faces the guide plate 32 of the multi-magazine 24, the chip element holes 39 of the pallet plate 40 are located so as to correspond exactly to the respective chip element holes 36 of the guide plate 32, and It is formed larger than each chip element hole 35.

In FIG. 9, above the pallet 37 is located a pick-and-plate unit 41 as a chip element transfer means movable in the direction of arrow R. This pick and place unit 41
is equipped with a vacuum chuck 42. This vacuum chuck 42 is provided with vacuum suction holes 43 at positions corresponding to the chip element mounting positions on the substrate 21, respectively.
These vacuum suction holes 43 are communicated with a vacuum pump (not shown) via vacuum piping 44.

In order to ensure that the chip elements 22 in the magazine 26 fall into the respective chip element holes 33, 34, 35, and 36 of the stopper plate 29, spacer 30, slotted plate 31, and guide plate 32, each chip element hole is 33 to 36 are made larger toward the bottom as described above, but since the external dimensions of the current chip element 22 are 1.6 x 3.2 mm, the chip element hole 36 of the guide plate 32 is
It is said to be approximately 2.2 x 3.8 mm. In addition, in order for the chip elements 22 falling from the chip element holes 36 of the guide plate 32 to reliably fall into each chip element hole 39 of the pallet plate 40, the chip element holes 39 of the pallet plate 40 must be It is enlarged to about 4.0mm.

The method of mounting the chip element 22 onto the substrate 21 in this embodiment using the apparatus having such a configuration will be described in more detail below.

In FIG. 5, the chip elements 22 housed in each magazine 26 are moved by the weight of the chip elements 22 themselves and the weight 27, so that the lowermost chip element 2
2 is each chip element hole 33, 3 of the stopper plate 29, spacer 30, and slotted plate 31.
4 and 35 and is supported on the upper surface of the guide plate 32. In this state, the pallet 37 is positioned below the multi-magazine 23, and the pallet 3
Each square chip element hole 39 formed in the pallet plate 40 of No. 7 is opposed to each chip element hole 36 of the guide plate 32.

Then, when the slotting plate 31 is slid in the direction of the arrow in FIG. 6, that is, to the left, the lowermost chip element 22 housed in each chip element hole 35 of the slotting plate 31 also moves in the direction of the arrow. , when each chip element 35 of the cutting plate 31 matches each chip element hole 36 of the guide plate 32, each chip element 22 is inserted into the guide plate 32.
The chips fall into the respective chip element holes 36 of the pallet 37, further fall into the chip element holes 39 formed in the pallet plate 40 of the pallet 37, and are received by the upper surface of the pallet body 38. At this time, the chip element hole 39
Since the chip elements 22 are formed to be larger than the chip elements 22, the chip elements 22 are not in fixed positions in each chip element hole 39, but fall into different positions.

When the chip elements 22 are stored in each chip element hole 39 of the pallet 37 in this way, the pallet 37 is lowered and separated from the multi-magazine 23, and
Then, as shown in FIG. 8, it is tilted so that one side, for example the left side, is downward. As a result, each chip element 22 moves within each chip element hole 39 by its own weight, and is positioned by coming into contact with one side (left side) of the inner wall of the chip element hole 39. At this time, the pallet 37 is not simply tilted with the left side downward, but is tilted at one corner of the left side, for example, the 6th corner.
In the figure, the upper left corner is inclined downward, and each chip element 22 is accurately positioned on two adjacent inner walls of the chip element hole 39.
Further, it is assumed that the upper left corner of each chip element hole 39 of the pallet 37 is manufactured so as to correspond exactly to the mounting position of the chip 22 on the substrate 21. Further, when tilting the pallet 37, if vibration is applied to the pallet 37 in the direction shown by the arrow S in FIG. 8, each chip element 22 can be moved more smoothly and accurately.

When the positioning of the chip elements 22 in each chip element hole 39 of the pallet 37 is completed, the pallet 37
is returned to the horizontal position again, and on this pallet 37, as shown in FIG.
Each vacuum suction hole 43 provided in one vacuum chuck 42 is brought into contact with the chip element 22 in each chip element hole 39 of the pallet 37. In this state, when a vacuum pump (not shown) is driven and the air in the vacuum chuck 42 is sucked from the vacuum piping 44, each chip element 22 is sucked into the vacuum suction hole 43.
Next, the pick-and-place unit 41 is raised, each chip element 22 is moved onto the substrate 21 set at a predetermined position, and the adsorption of the vacuum chuck 42 is released.
are accurately transferred one by one to the chip element mounting position.

According to this embodiment as described above, the chip elements 22 supplied from the multi-magazine 23 serving as the chip element feeding means to the chip element holes 39 of the pallet 37 having an inner dimension larger than the outer diameter of the chip elements 22 are fed into the chip element holes 39 of the pallet 37. Since the chip element 37 is positioned by tilting or applying vibration together with the tilt, and then transferred onto the substrate 21 by the pick-and-place unit 41 serving as a chip element transfer means, the chip element 22 can be positioned with high dimensional accuracy. In addition, it is possible to reliably place them on the substrate 21 one by one. Further, the positioning of the chip element 22 can be easily carried out because it is only necessary to tilt the pallet 37.

In addition, in implementing this example, palette 37
The means for tilting may be performed manually or mechanically, and vibrations applied together with the tilting are not necessarily required. Further, in the pallet 37 in this embodiment, the chip element holes 39 are formed using a pallet plate 40 which is a separate member from the pallet body 38, but the chip element holes 39 may be formed directly in the pallet body 38 in actual implementation. good. However, if they are provided separately as in the above embodiment, each chip element hole 39 of the pallet plate 40
It has the advantage of being easy to manufacture because it can be manufactured by press working or the like.

10 to 14 show other embodiments of the apparatus for carrying out the method of the invention. Here, the same or equivalent components as those in the embodiment shown in FIGS. 5 to 9 are given the same or equivalent symbols, and the description thereof will be omitted or simplified. As the chip element feeding means in this embodiment, a multi-magazine 23 having exactly the same configuration as in the previous embodiment is used, but the configurations of the pallet 37 and the pick-and-place unit 41 as the chip element transfer means are partially changed. It is something.

That is, the palette 37 in this embodiment is
It is equipped with a first pallet plate (fixed pallet plate) 40A and a second pallet plate (movable pallet plate) 40B which are divided into upper and lower parts, and these first pallet plate (fixed pallet plate) The chip element holes 39 are larger than the chip element holes 36 provided in the guide plate 32 of the multi-magazine 23.
A, 39B are formed at positions facing the chip element mounting position on the substrate 21 in plan view, and the first,
The thickness of the second pallet plates 40A and 40B when stacked is approximately the same as the thickness of the chip element 22. In addition, these first pallet plates (fixed pallet plates) 40A and second pallet plates (moving pallet plates) 40A
B, as shown in FIGS. 13 and 14,
A first pallet plate (fixed pallet plate) 40A is screwed and fixed to the pallet plate main body 38 at a predetermined interval, and the first pallet plate (fixed pallet plate) 40A and the pallet main body 38 are In between, a second pallet plate (movable pallet plate) 40B is mounted so as to be obliquely slidable substantially diagonally on the rectangular pallet 37. The protrusion 4 fixed to this second pallet plate 40B and the pallet body 38
A compression coil spring 46 is provided between the second pallet plate 40B and the second pallet plate 40B, and the second pallet plate 40B is always biased in the upper left direction in FIG. Tuto plate 40A
The chip element hole 39A of the second pallet plate 40B is made to exactly match the chip element hole 39B of the second pallet plate 40B. In addition, boss holes 47A and 47B are provided at the upper right and lower left in FIG. 13 of the first pallet plate 40A and the second pallet plate 40B at positions shifted in the diagonal direction of the pallet 37. The boss holes 47A and 47B are the second
When the pallet plate 40B moves in the direction of arrow T in FIG. 13 against the compression coil spring 46, the two pallet plates 40B are arranged in the same direction.

Further, the pick-and-plate unit 41 in this embodiment includes a plate slide boss 48 on the lower surface of the vacuum chuck 42.
are the first and second pallet plates 40A,
Two boss holes 47A and 47 provided in 40B
It is provided at a position opposite to B. Further, the plate slide boss 48 is provided with a diagonal cut portion 49 at the lower end to facilitate insertion into the respective boss holes 47A, 47B.
The second pallet plate 4 is inserted into 7B.
0B is slid in the direction of arrow T. Furthermore, the upper end of the plate slide boss 48 is slidably supported by the casing of the vacuum chuck 42 and is not removed, and a compression spring is provided between the upper end of the plate slide boss 48 and the casing of the vacuum chuck 42. A buffer spring 50 is interposed to absorb the impact when the plate slide boss 48 is inserted into the boss holes 47A, 47B.

Note that, in order to make the structure easier to understand, FIG. 14 is an irregular cross-sectional view that passes through the upper and lower boss portions at the same time, and also passes through the diagonal spring portion at the same time.

A method of mounting a chip element in this embodiment configured as described above will be explained.

The chip elements 22 are fed to the pallet 37 by sliding the slotting plate 31 of the multi-magazine 23 in exactly the same manner as in the previous embodiment.
Then, the pallet 3 supplied with the chip elements 22
7, as shown in FIG. 14, the pick and place unit 41 is positioned and lowered. As the unit 41 descends, the diagonal cut portion 49 of the plate slide boss 48 protruding from the lower surface of the vacuum chuck 52 first enters the boss hole 47A of the first pallet plate 40A, and then the first pallet plate 40A. Boss hole 47B of 2nd pallet plate 40B
go inside. Therefore, the right edge of the boss hole 47B of the second pallet plate 40B in FIG.
The second pallet plate 40B comes into contact with the diagonal cut portion 49 of the boss 48 and receives a horizontal component force, and as the boss 48 advances, the second pallet plate 40B moves toward the right side in FIG. 14 against the compression coil spring 46. That is, it slides in the direction of arrow T in FIG. Due to this sliding movement of the second pallet plate 40B, the first and second pallet plates 40A and 40, which were exactly aligned when stopped,
The chip element holes 39A and 39B of B are the same as the chip element holes 39B of the second pallet plate 40B.
It will move to the position shown by the dotted line in Figure 3. For this reason, chip element holes 39A, 39B
Each chip element 22 housed in the chip element 22 is moved by the movement of the second pallet plate 40B and is pressed against the lower right corner of each chip element hole 39A in the first pallet plate 40A in FIG. will be done. In this way, when each chip element 22 is held and positioned by the upper and lower chip element holes 39A and 39B, the oblique cut portion 49 of the plate boss 48 passes through the lower boss hole 47B, and the straight The part is exactly the boss hole 47
Since the second pallet plate 40B is located within A and 47B, there is no further movement of the second pallet plate 40B. In this state, when the pick-and-place unit 41 is further lowered, each vacuum suction hole 43 of the vacuum chuck 42 comes into contact with the upper surface of each chip element 22, and each chip element 22 is moved through the vacuum suction hole by the action of a vacuum pump (not shown). 43 is adsorbed. Next, the pick-and-place unit 41 is raised and moved onto the substrate 21 in the same manner as in the previous embodiment, and the suction is released here, so that each chip element 22 is placed on the substrate 21 with high precision.
This means that it can be installed on top of 1.

Further, as the pick and place unit 41 is raised, the second pallet plate 40B is
It is returned to its old position by the action of the compression coil spring 46, and is ready for the next supply of chip elements 22 to the pallet 37.

This embodiment also has the effect that the chip element 22 can be mounted at an accurate position, similar to the previous embodiment.

In carrying out this embodiment, the first and second pallet plates 40A and 40B are one pallet plate, and this one pallet plate is diagonally diagonally arranged relative to the pallet main body 38. Alternatively, the chip elements 22 may be made to be slidable, and the chip elements 22 may be aligned at the reference positions by sliding this single pallet plate. Further, in each of the embodiments described above, the chip element feeding means is constituted by the slotted multi-magazine 23, but the present invention is not limited to this. Other supply means may also be used, such as one that supplies the water one by one. Furthermore, in each of the embodiments described above, the chip element transfer means was constructed by the pick-and-place unit 41, but other means may also be used.

As described above, according to the present invention, in a chip element mounting method for simultaneously mounting a plurality of chip elements on a board, a chip element hole for inserting a chip element is provided at a position corresponding to the chip element mounting position on the board in plan view. A method is used in which chip devices are placed on a pallet having a chip structure, and then the chip devices on the pallet are transferred to the chip device mounting position on the substrate. After the chip elements are supplied to the holes, the supplied chip elements are moved and positioned in contact with the inner wall surface of each chip element hole, which eliminates the double mounting of chip elements on the board in the prior art. It is possible to solve both the technical problems of the above problem and the problem of poor mounting accuracy, and it has the effect of being able to reliably mount a plurality of chip elements one by one on a board with good positional accuracy.

It should be noted that, as a matter of course, the present invention is not limited to the illustrated embodiment.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a multi-magazine used in the conventional chip element mounting method, Fig. 2 is a partially cutaway front view of Fig. 1, and Fig. 3 is a conventional multi-magazine using the multi-magazine shown in Fig. 1. FIG. 4 is a plan view of a substrate to which the chip device mounting method according to the present invention is applied, and FIGS. 5 to 9 are a front view of a chip device mounting device with main parts cut away, and FIGS. Fig. 5 is a sectional view showing the overall structure, Fig. 6 is a view taken along the line - - of Fig. 5, and Fig. 7 is an enlarged sectional view of the main part of Fig. 5. Figure 8 is a sectional view showing the tilted state of the pallet, Figure 9 is a sectional view showing the pallet and the pick and place unit, and Figure 1 is a sectional view showing the pallet in a tilted state.
0 to 14 show other embodiments of the apparatus for implementing the method of the present invention, FIG. 10 is a sectional view showing the overall structure, and FIG. 11 is a view taken along the line XI--XI in FIG. 10. 12 is an enlarged sectional view of the main part of FIG. 10, FIG. 13 is a plan view of the pallet, and FIG. 14 is a sectional view of the pallet and the pick-and-place unit. 21...Substrate, 22...Chip element, 37...Pallet, 38...Pallet body, 39, 39A, 39B
...Chip element hole of pallet, 40, 40A, 40
B...Pallet plate.

Claims (1)

[Claims] 1 Chip elements are arranged at predetermined intervals to form a multi-magazine, and chip elements are sent out from the bottom of each magazine in which chip elements are stacked and stored, and are separated one by one by a slotting plate that reciprocates in the horizontal direction. , a pallet body, a fixed pallet plate having a large number of positioning rectangular chip element holes formed at predetermined positions and fixed to the upper side of the pallet body, and a pallet plate provided between the pallet body and the fixed pallet plate, and a movable pallet plate that is slidably supported diagonally with respect to the side of the rectangular chip element hole for positioning, and is mounted in each chip element hole on a pallet,
This pallet is moved in the horizontal direction between this mounting position and a suction position where the chip element is suctioned to the chuck of the pick-and-place unit, and the moving pallet plate is moved to the diagonal horizontal direction by the driving means provided at the suction position. This small movement of the movable pallet plate causes the mounted chip elements to be pressed against the corner side of the rectangular chip element hole for positioning in the stationary pallet plate and positioned. A method for mounting a chip device, which comprises the steps of: adsorbing the chip devices using a large number of suction nozzles constituting the chuck; and lifting and transporting the adsorbed chip devices using the pick-and-place unit and mounting them on a substrate.