JPS5661194A - Method of carrying chip element - Google Patents

Method of carrying chip element

Info

Publication number
JPS5661194A
JPS5661194A JP13701879A JP13701879A JPS5661194A JP S5661194 A JPS5661194 A JP S5661194A JP 13701879 A JP13701879 A JP 13701879A JP 13701879 A JP13701879 A JP 13701879A JP S5661194 A JPS5661194 A JP S5661194A
Authority
JP
Japan
Prior art keywords
chip element
carrying chip
carrying
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13701879A
Other languages
Japanese (ja)
Other versions
JPS6211520B2 (en
Inventor
Hitoshi Hasegawa
Masaaki Gotou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13701879A priority Critical patent/JPS5661194A/en
Priority to GB8034234A priority patent/GB2063227B/en
Priority to FR8022727A priority patent/FR2468285A1/en
Priority to BR8006824A priority patent/BR8006824A/en
Publication of JPS5661194A publication Critical patent/JPS5661194A/en
Priority to MY8400337A priority patent/MY8400337A/en
Publication of JPS6211520B2 publication Critical patent/JPS6211520B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP13701879A 1979-10-25 1979-10-25 Method of carrying chip element Granted JPS5661194A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP13701879A JPS5661194A (en) 1979-10-25 1979-10-25 Method of carrying chip element
GB8034234A GB2063227B (en) 1979-10-25 1980-10-23 Method of mounting tip type circuit elements on a printed circuit board and apparatus for performing the same
FR8022727A FR2468285A1 (en) 1979-10-25 1980-10-23 METHOD AND APPARATUS FOR MOUNTING PIN-TYPE CIRCUIT CIRCUIT ELEMENTS ON A PRINTED CIRCUIT BOARD
BR8006824A BR8006824A (en) 1979-10-25 1980-10-23 PROCESS FOR ASSEMBLING CIRCUIT ELEMENTS IN A PRINTED CIRCUIT PANEL; AND APPLIANCE FOR ITS EXECUTION
MY8400337A MY8400337A (en) 1979-10-25 1984-12-30 Method of mounting chip elements on a printed circuit board and apparatus for performing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13701879A JPS5661194A (en) 1979-10-25 1979-10-25 Method of carrying chip element

Publications (2)

Publication Number Publication Date
JPS5661194A true JPS5661194A (en) 1981-05-26
JPS6211520B2 JPS6211520B2 (en) 1987-03-12

Family

ID=15188897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13701879A Granted JPS5661194A (en) 1979-10-25 1979-10-25 Method of carrying chip element

Country Status (5)

Country Link
JP (1) JPS5661194A (en)
BR (1) BR8006824A (en)
FR (1) FR2468285A1 (en)
GB (1) GB2063227B (en)
MY (1) MY8400337A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020032512A (en) * 2018-08-31 2020-03-05 日本電産株式会社 Conveying jig and conveying device comprising the same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8201653A (en) * 1982-04-21 1983-11-16 Philips Nv METHOD AND APPARATUS FOR PLACING CHIP-SHAPED ELECTRICAL AND / OR ELECTRONIC COMPONENTS ON A SUBSTRATE
US4722135A (en) * 1986-02-07 1988-02-02 General Electric Co. Apparatus for placing surface mounting devices on a printer circuit board
US4670981A (en) * 1986-03-17 1987-06-09 Nitto Kogyo Kabushiki Kaisha Method of mounting electronic parts on the predetermined positions of a printed circuit board
US4868974A (en) * 1987-09-01 1989-09-26 Sumitomo Electric Industries, Ltd. Chip mounting apparatus
US4985107A (en) * 1988-03-01 1991-01-15 Sci Systems, Inc. Component location device and method for surface-mount printed circuit boards

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1249067A (en) * 1969-03-12 1971-10-06 Int Computers Ltd Improvements in or relating to methods of connecting integrated circuit chips to printed circuit boards
JPS5537879B2 (en) * 1973-10-15 1980-09-30
GB2017540B (en) * 1978-02-21 1982-08-18 Toko Inc Electronic component automatic insertion system and apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020032512A (en) * 2018-08-31 2020-03-05 日本電産株式会社 Conveying jig and conveying device comprising the same

Also Published As

Publication number Publication date
FR2468285A1 (en) 1981-04-30
GB2063227B (en) 1983-04-07
GB2063227A (en) 1981-06-03
MY8400337A (en) 1984-12-31
BR8006824A (en) 1981-04-28
JPS6211520B2 (en) 1987-03-12
FR2468285B1 (en) 1984-06-15

Similar Documents

Publication Publication Date Title
JPS5694777A (en) Method of manufacturing semiconductor
JPS564268A (en) Method of forming semiconductor device
YU162080A (en) Method of manufacturing reinforced-concrete-plates
GB2067197B (en) Method of obtaining phtalonitriles
JPS5661194A (en) Method of carrying chip element
JPS52144768A (en) Method of connecting chip
JPS5671996A (en) Method of detecting chip part
JPS5578594A (en) Method of mounting chip element
GB2061243B (en) Method of making semiconductor devices
JPS57111089A (en) Method of sodering chip part
JPS55141794A (en) Method of mounting chip component
JPS5635496A (en) Method of soldering chip part
JPS5593293A (en) Method of soldering
JPS57173118A (en) Method of dividing semiconductor element body
JPS55120101A (en) Method of manufacturing chip resistor
JPS5638895A (en) Method of mounting ceramic chip element
JPS5574105A (en) Method of fabricating chip resistor
JPS5644694A (en) Method of mounting chip of note
JPS5616796A (en) Method of backkfilling
JPS5644693A (en) Method of joining chip of note
JPS5667917A (en) Method of manufacturing chip part
JPS5552291A (en) Method of attaching chip circuit element
JPS5530838A (en) Method of mounting chip part
JPS5637698A (en) Method of mounting chip part
JPS5680198A (en) Method of mounting chip part