GB2063227A - Method of mounting tip type circuit elements on a printed circuit board and apparatus for performing the same - Google Patents
Method of mounting tip type circuit elements on a printed circuit board and apparatus for performing the same Download PDFInfo
- Publication number
- GB2063227A GB2063227A GB8034234A GB8034234A GB2063227A GB 2063227 A GB2063227 A GB 2063227A GB 8034234 A GB8034234 A GB 8034234A GB 8034234 A GB8034234 A GB 8034234A GB 2063227 A GB2063227 A GB 2063227A
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- United Kingdom
- Prior art keywords
- type circuit
- tip type
- pallet
- circuit element
- plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Tip type circuit elements (22) are fed from magazines into tip type circuit element receiving holes (39) which are formed in a pallet (37) in positions corresponding to the predetermined tip type circuit element mounting positions on a printed circuit board and are dimensioned such that each element is received in one of the holes in a loose condition. Each element received in one of the holes in the pallet is shifted into abutting engagement with at least one inner wall surface of the respective holes. The elements thus positioned in the holes are transferred by a pick-and- place unit onto the printed circuit board without altering the relative positions of the elements, so that the tip type circuit elements are mounted at the predetermined element mounting positions on the printed circuit board with a high degree of accuracy. <IMAGE>
Description
SPECIFICATION
Method of mounting tip type circuit elements on a printed circuit board and apparatus for performing the same
This invention relates to a method of mounting a plurality of tip type circuit elements at a time on a printed circuit board and an apparatus for carrying such method into practice.
One type of method known in the art for mounting tip type circuit elements on a printed circuit board comprises the steps of placing tip type circuit element supply means or multiple magazine including a plurality of magazines each containing therein a plurality of tip type circuit elements on tip type circuit element push-up means including rods of the same number as the magazines, pushing upwardly by each rod the tip type circuit elements contained in one of the magazines, attracting by vacuum to a vacuum chuck of tip type circuit element transfer means or a pick-and-place unit each tip type circuit element that has reached the top position of each magazine after being pushed upwardly by each rod, and moving the pick-and-place unit to a position above the printed circuit board and removing the attracting force from the vacuum chuck to thereby mount the tip type circuit elements on the printed circuit board.
The aforesaid method of the prior art has the disadvantage that the tip type circuit elements contained in each magazine shift sideways in the clearance between the inner wall surfaces of the magazine and the tip type circuit elements, so that difficulties are encountered in mounting the tip circuit elements at predetermined mounting positions on the printed circuit board with a high degree of accuracy.
This invention has been developed for the purpose of obviating the aforesaid disadvantage of the prior art. Accordingly, the invention has as its object the provision of a method for mounting a plurality of tip type circuit elements on a printed circuit board with a high degree of accuracy and an apparatus suitable for carrying such method into practice.
According to an aspect of the invention, there is provided a method of mounting tip type circuit elements on a printed circuit board comprising the steps of: feeding tip type circuit elements by tip type circuit element feeding means containing tip type circuit elements therein into tip type circuit element receiving holes formed in a pallet in positions corresponding to tip type circuit element mounting positions on the printed circuit board, the tip type circuit element receiving holes being dimensioned such that each tip type circuit element can be received in a loose condition in one of the tip type circuit element receiving holes; shifting each tip type circuit element fed into one of the tip type circuit element receiving holes so as to position each tip type circuit element in abutting relation to at least one of the inner wall surface of the respective tip type circuit element receiving hole; and transferring the tip type circuit elements onto the printed circuit board by tip type circuit element transfer means without altering the relative positions of the tip type circuit elements, and mounting the tip type circuit elements at the predetermined tip type circuit element mounting positions on the printed circuit board.
According to another aspect of the invention, there is provided an apparatus for mounting tip type circuit elements on a printed circuit board comprising: a pallet formed with tip type circuit element receiving holes in positions corresponding to predetermined tip type circuit element mounting positions on the printed circuit board, the tip type circuit element receiving holes being dimensioned such that each tip type circuit element can be received in a loose condition in one of the tip type circuit element receiving holes; tip type circuit element feeding means containing a plurality of tip type circuit elements therein and feeding same in such a manner that one tip type circuit element is received in one of the tip type circuit element receiving holes; means for shifting the tip type circuit elements fed into the tip type circuit element receiving holes so as to position each tip type circuit element in abutting relation to at least one of the inner wall surfaces of the respective tip type circuit element receiving hole; and tip type circuit element transfer means for transferring the positioned tip type circuit elements onto the printed circuit board without altering the relative positions of the tip type circuit elements, and mounting the tip type circuit elements at the predetermined tip type circuit element mounting positions on the printed circuit board.
The invention will be described hereinafter, by way of example, with reference to the accompanying drawings, in which:
Fig. 1 is a plan view of a multiple magazine used in a tip type circuit element mounting
method of the prior art;
Fig. 2 is a front view of the multiple magazine shown in Fig. 1, with certain parts being cut out;
Fig. 3 is a front view, with certain parts being cut out, of the essential portions of an apparatus for mounting tip type circuit elements on a printed circuit board of the prior art using the multiple magazine shown in Fig. 1;
Fig. 4 is a plan view of a printed circuit board on which tip type circuit elements are mounted according to the present invention;;
Fig. 5 is a sectional view of the apparatus for mounting tip type circuit elements on a printed circuit board according to one embodiment of the invention, showing the whole structure of the multiple magazine and the pallet;
Fig. 6 is a view as seen in the direction of arrows VI-VI in Fig. 5;
Fig. 7 is a sectional view, on an enlarged scale, of the essential portions of the apparatus shown in
Fig. 5;
Fig. 8 is a sectional view of the pallet shown in an inclined position;
Fig. 9 is a sectional view of the pallet and the pick-and-place unit;
Fig. 10 is a sectional view of the apparatus for mounting tip type circuit elements on a printed circuit board according to another embodiment of the invention, showing the whole structure of the multiple magazine and the pallet;;
Fig. 11 is a view as seen in the direction of arrows XI-Xl in Fig. 10;
Fig. 12 is a sectional view, on an enlarged scale, of the essential portions of the apparatus shown in Fig. 10;
Fig. 13 is a plan view of the pallet; and
Fig. 14 is a sectional view of the pallet and the pick-and-place unit.
One example of method for mounting tip type circuit elements on a printed circuit board and apparatus for carrying such method into practice of the prior art will first be described by referring to Figs. 1-3. As shown in Figs. 1 and 2, tip type circuit elements 1 are contained in a plurality of numbers in superposed relation in each magazine 3 of a rectangular shape in section of a multiple magazine 2 having at its bottom a stopper 4 for avoiding dislodging of the tip type circuit elements 1 from the magazine 3. The multiple magazine 2 includes a plurality of magazines 3 having magazine plates 5 secured to the top and bottom thereof respectively.In mounting a plurality of tip type circuit elements 1 on a printed circuit board, not shown, by using the multiple magazine 2, the multiple magazine 2 is first placed on tip type circuit element push-up means 6 as shown in Fig.
3. The tip type circuit element push-up means 6 includes rods 7 of the same number as the magazines 3 which are driven by a motor 8 and moved upwardly so that the rods 7 simultaneously move at their forward ends the stoppers 4 in the magazines 3. The tip type circuit elements 1 moved upwardly by the upward movement of the stoppers 4 to positions in which they are flush with the top surface of the upper magazine plate 5 are simultaneously drawn by suction by a vacuum chuck 10 having suction ducts 9 disposed in positions corresponding to the positions of the magazines 3 so that the uppermost tip type circuit elements 1 in all the magazines 5 are attracted to the vacuum chuck 10.The vacuum chuck 10 is moved by a pick-and-pace unit 11 to a position above the printed circuit board and then the tip type circuit elements 1 are released from the vacuum chuck 10, so that the elements 1 can be
mounted on the circuit board.
The magazines 3 are each constructed such that their inner dimension are larger than the outer
dimensions of the tip type circuit elements 1
contained therein, so that a clearance is formed
between the tip type circuit elements 1 and the inner wall surfaces of each magazine 3. Thus, when the aforesaid method and apparatus for mounting the tip type circuit elements 1 on the printed circuit board are used, it is difficult to
mount the elements 1 on the printed circuit board at the predetermined positions by attracting the
elements 1 by suction to the vacuum chuck 10
because the elements 1 tend to shift sideways in the clearance between the elements 1 and the inner walls of the magazines 3.Also, in the method and apparatus of the prior art described hereinabove, the tip type circuit elements 1 contained in the magazines 3 set in the multiple magazine 2 are pushed upwardly by the tip type circuit element push-up means 6. This arrangement nas suffered the disadvantages that a load is applied to the elements 1 and the elements 1 may be jammed in the magazines 3, and that two elements 1 from the same magazines 3 may be sucked by and attracted to the vacuum chuck 10 when a plurality of elements 1 are simultaneously sucked from the magazines 3 through the suction ducts 9, so that correct positioning of the elements l on the printed circuit board is unobtainable when the former are mounted on the latter.
Embodiments of method and apparatus for mounting tip type circuit elements on a printed circuit board according to the invention, which obviates the aforesaid disadvantages of the prior art, will now be described by referring to Figs.
4-14.
Fig. 4 shows one example of printed circuit board assembled by the method and apparatus according to the invention, which may be used as an electronic tuner, for example. In Fig. 4, tip type circuit elements 22 rectangular in cross-sectional shape are mounted in a plurality of numbers on a printed circuit board 21 and secured thereto so that the elements 22 are at right angles to the board 21. Since the elements 22 on the board 21 are generally large in number, the elements 22 are
mounted on the board 21 at a plurality of times, and not a!l the elements 22 are mounted in one operation in most cases. in the context of description of the present invention, however, it has no significance whether all the elements 22 are mounted in one operation or in a plurality of operations.
Figs. 5-9 show one embodiment of the
invention. In Fig. 5, a multiple magazine 23
serving as tip type circuit element feeding means
includes a pair of upper and lower magazine plates
25 spaced apart from each other by a
predetermined distance and interconnected by
support rods 24. and a plurality of magazines 26
arranged between the upper and lower magazine
plates 25 in positions corresponding to the
positions on the printed circuit board 21 at which the tip type circuit elements 22 are mounted. A
plurality of tip type circuit elements 22 are
contained in each of the magazines 26 in
superposed relation, and a weight 27 is placed over the uppermost tip type circuit element 22 in each magazine 26 so as to apply a downwardly directed light load to the elements 22 in each magazine 26. A cover 28 is witted to the upper end of each magazine 26. The multiple magazine 23 also includes a stopper plate 29, a spacer 30, a sliding plate 31 and a guide plate 32 disposed beneath the lower magazine plate 25 in the indicated order as seen from above and secured to the lower magazine plate 25. The stopper plate 29 holds in place the lower ends of the magazines 26 and is formed with through holes or openings 33 (See Fig. 7) permitting the elements 22 to be inserted therethrough into the magazines 26. The spacer 30 has the functions of enabling the sliding plate 31 to move smoothly in the directions of arrows P in Fig. 5 and keeping the elements 22 from coming into abutting engagement with the undersurface of the stopper plate 29.The spacer 30 is formed with through holes or openings 34 of a size large enough not to interfere with movements of the elements 22 caused by the sliding movement of the sliding plate 31. The sliding plate 31 is formed with receiving through holes or openings 35 capable of containing elements 22 in positions immediately below the magazines 26 when the sliding plate 31 is disposed in the position shown in Fig. 5, the openings 35 having a size larger than the elements 22. The guide plate 32 has no openings disposed immediately below the magazines 26 but is formed with guide through holes or openings 36 of a size larger than that of the receiving openings 35 which are indexed with the receiving openings 35 as the sliding plate 31 moves a predetermined distance leftwardly in Fig.
5. The stopper plate 29, spacer 30, sliding plate 31 and guide plate 32 are secured to the lower magazine plate 25 as by through bolts. The sliding plate 31 has a small size so that it can be moved inside the positions in which the through bolts are inserted, or a relief is provided as by forming slots.
A pallet 37 is disposed beneath the multiple magazine 23 for movement in the directions of arrows Q in Fig. 5, and includes a pallet body 38 in the form of a planar plate of large thickness, and a pallet plate 40 attached to the surface of the pallet body 38 formed with element receiving holes or openings 39 of the rectangular shape in positions corresponding in a plane to the positions on the printed circuit board 21 at which the tip type circuit elements 22 are mounted. The pallet plate 40 is substantially of the same thickness as the tip type circuit elements 22.The element receiving openings 39 formed in the pallet plate 40 are positioned such that they are indexed with the guide openings 36 formed in the guide plate 32 when the pallet 37 is positioned against the guide plate 32 of the multiple magazine 23, and have a size larger than that of the guide openings 35 of the guide plate 32.
In Fig. 9, a pick-and-place unit 41 serving as tip type circuit element transfer means movable in the directions of arrow R is positioned above the pallet 37 and includes a vacuum chuck 42 formed with sucking ducts 43 disposed in positions corresponding to the positions on the printed circuit board 21 at which the tip type circuit elements 22 are mounted. The sucking ducts 43 are connected via a vacuum pipe 44 to a vacuum pump, not shown.
The openings 33, 34, 35 and 36 formed in the stopper plate 29, spacer 30, sliding plate 31 and guide plate 32 respectively are larger in size in going downwardly from the stopper plate 29 so that the tip type circuit elements 22 positively move downwardly therethrough. In actual practice, the tip type circuit elements 22 have an external size of 1.6 x 3.2 mm, and the guide openings 36 of the guide plate 32 have a size of about 2.2 x 3.8 mm. In order that the tip type circuit elements 22 moving downwardly through the guide openings 36 may be positively received in the tip type circuit element receiving openings 39 of the pallet plate 40, the tip type circuit element receiving openings 39 of the pallet plate 40 have a size of about 2.5 x 4.0 mm.
The method of mounting the tip type circuit elements 22 on the printed circuit board 21 by using the apparatus of the aforesaid construction will now be described.
In Fig. 5, the tip type circuit elements 22 contained in the magazines 26 are depressed downwardly by the weight of the weights 27 so that the lowermost tip type circuit element in each magazine 26 moves downwardly through the openings 33, 34, and 35 formed in the stopper plate 29, spacer 30 and sliding plate 31 respectively under the force of the weight 27 and the overlying elements 22 to be supported on the surface of the guide plate 32. While the elements 22 are in this condition, the pallet 37 is moved to a position in which it is positioned below the multiple magazine 23, and the element receiving openings 39 of the rectangular shape formed in the pallet plate 40 of the pallet 37 are indexed with the guide openings 36 formed in the guide plate 32.
Then, the sliding plate 31 is moved leftwardly as indicated by an arrow in Fig. 6. The lowermost elements 22 contained in the element receiving openings 35 formed in the sliding plate 31 also move in the direction of the arrow. As the element receiving openings 35 formed in the sliding plate 31 are brought into index with the guide openings 36 of the guide plate 32, the elements 22 move downwardly into the guide openings 36 of the guide plate 32 and then into the element receiving openings 39 formed in the pallet plate 40 of the pallet 37, to be deposited on the surface of the pallet body 38. Since the element receiving openings 39 are larger in size than the elements 22, the elements 22 drop on to the surface of the pallet body 38 in the element receiving openings 39 in positions which are not predetermined but may vary haphazardly from element to element.
After the tip type circuit elements 22 are received in the element receiving openings 39 of the pallet plate 40 on the surface of the pallet body 38 as described hereinabove, the pallet 37 is moved downwardly away from the multiple magazine 23 and then tilted as shown in Fig. 8 in such a manner that its left side is disposed at a lower level than its right side. As a result, the tip type circuit elements 22 in the element receiving openings 39 of the pallet plate 40 shift by their own weight in the respective openings 39 into abutting engagement with one side wall (left side wall) of the element receiving openings 39, to be positioned thereby.At this time, the pallet 37 is not only tilted to have its left side at a lower level than its right side but also tilted so that the left upper corner in Fig. 6, for example, is disposed at a lower level, so that each element 22 can be positively positioned by the adjacent two inner wall surfaces of the respective element receiving opening 39. The pallet 37 is constructed such that the left upper corner of each element receiving opening 39 of the pallet plate 40 is precisely in agreement with the position on the printed circuit board 21 at which the tip type circuit element 22 in such opening 39 is mounted.
Vibration of the pallet 37 in the direction of arrows
S in Fig. 8 ensures that the elements 22 move smoothly and accurately when the pallet 37 is tilted.
Upon completion of the positioning of the tip type circuit elements in the element receiving openings 39 of the pallet 37, the pallet 37 is returned to the horizontal position, and the pickand-place unit 41 serving as tip type circuit element transfer means is positioned over the pallet 37 as shown in Fig. 9, and suction ducts 43 of a vacuum chuck 42 of the pick-and-place unit 41 are indexed with the element receiving openings 39 of the pallet 37 and positioned against the tip type circuit elements 22 in the openings 39. The vacuum pump, not shown, is actuated to suck air through a vacuum pipe 44 from the vacuum chuck 42, to attract the tip type circuit elements 22 to the suction ducts 43.Then the pick-and-place unit 41 is moved upwardly to transfer the tip type circuit elements 22 on to the printed circuit board 21 set in a predetermined position, and the elements 22 are released from the suction ducts 43 of the vacuum chuck 42 to thereby mount each of the elements 22 on the board 21 in a position at which each element 22 is designed to be mounted.
In the embodiment shown and described hereinabove, the tip type circuit elements 22 fed from the multiple magazine 23 serving as tip type circuit element feeding means to the pallet 37 in the tip type circuit element receiving openings 39 thereof having inner dimensions larger than the outer dimensions of the tip type circuit elements 22 are positioned in the openings 39 by tilting the pallet 37 or by tilting same and at the same time causing same to vibrate, and then the elements 22 are transferred on to the printed circuit board 21 by the pick-and-place unit 41 serving as tip type circuit element transfer means. By this arrangement, each tip type circuit element 22 can be positively mounted on the printed circuit board 21 at a position at which each element 22 is designed to be mounted with a high degree of accuracy.Positioning of the elements 22 can be effected readily because the pallet 37 has only to be tilted to accomplish the object.
In this embodiment, the pallet 37 may be tilted
either manually or automatically. It is not essential to impart vibration to the pallet 37 as the latter is tilted. The pallet 37 of this embodiment has been
described as including the pallet plate 40
constituting a separate member from the pallet body 38 and formed therein with the tip type circuit element receiving openings 39. However, the tip type circuit element receiving openings 39 may be formed directly in the pallet body 38. The use of the pallet plate 40 as a separate member as described hereinabove offers the advantage that production is facilitated because the tip type circuit element receiving openings 39 can be formed in the pallet plate 40 by means of a press, for example.
Figs.10~14 show another embodiment of the invention in which parts similar or equivalent to those shown in Figs. 5-9 are designated by like reference characters, and their description shall be omitted or described briefly. In this embodiment, the multiple magazine 23 of the same construction as that described with reference to the embodiment shown in Figs. 5-9 is used as tip type circuit element feeding means, but the pick-and-place unit 41 used as tip type circuit element transfer means is partly distinct in construction from the pick-and-place unit 41 used in the embodiment shown in Figs.5~9.
More specifically, in the embodiment shown in Figs.10~14, the pallet 37 includes an upper or first pallet plate 40A and a lower or second pallet plate 40B. The first and second pallet plates 40A and 40B are formed with tip type circuit element receiving openings 39A and 39B respectively in positions which correspond in a plane to the positions on the printed circuit board 21 at which the tip type circuit elements 22 are mounted. The tip type circuit element receiving openings 39A and 39B are larger in size than the guide openings 36 formed in the guide plate 32 of the multiple magazine 23, and the first and second pallet plates 40A and 40B have a combined thickness substantially equal to the thickness of the tip type circuit elements 22 when the pallet plates 40A and 40B are superposed one over the other.As shown in Figs. 1 3 and 14, the first pallet plate 40A is screwed to the pallet body 38 and spaced apart therefrom a predetermined distance, and the second pallet plate 40B is interposed between the first pallet plate 40A and the pallet body 38 for sliding movement substantially diagonally of the square pallet 37. A compression spring 46 is mounted between the second pallet plate 40B and a member 45 secured to and projecting from the pallet body 38 so as to normally urge the second pallet plate 40B leftwardly and upwardly in Fig. 13 by the biasing force of the spring 46. When the second pallet plate 40B is in this condition, tip type circuit element receiving openings 39A formed in the first pallet plate 40A are indexed with tip type circuit element receiving openings 39B formed in the second pallet plate 40B. The first and second pallet plates 40A and 408 are formed in positions disposed rightwardly upwardly and leftwardly downwardly in Fig. 13 with boss receiving openings 47A and 47B respectively. The boss receiving openings 47A formed in the first pallet plate 40A and the boss receiving openings 47B formed in the second pallet plate 40B are spaced apart from each other substantially diagonally of the pallet plates 40A and 40B, and indexed with each other when the second pallet plate 40B moves in the direction of arrows T in Fig.13 against the biasing force of the compression spring 46.
The pick-and-place unit 41 used in this embodiment includes plate slide bosses 48 projecting downwardly from the undersurface of the vacuum chuck 42 in positions corresponding to the boss receiving openings 47A and 47B formed in the first and second pallet plates 40A and 40B respectively as aforesaid. The plate slide bosses 48 are each formed at the lower end with an inclined portion 49 which has the functions of facilitating the insertion of the plate slide bosses 48 into the respective boss receiving openings 47A and 47B and causing the second pallet plate 408 to move in sliding movement in the direction of the arrows T as the plate slide bosses 48 inserted into the boss receiving openings 47A further extend into the boss receiving openings 47B.The plate slide bosses 48 are slidably supported at their upper end portions in a casing of the vacuum chuck 42, and a compression spring 48 serving as a shock absorber is mounted between the upper end of each plate slide boss 48 and the top of the casing of the vacuum chuck 42, to thereby absorb the shock which might otherwise be applied to the pick-and-place unit 41 when the plate slide bosses 48 are inserted in the boss receiving openings 47A and 47B.
Fig. 14 is an out-of-the-way sectional view taken along the upper and lower plate slide bosses at the same time and also along the compression spring disposed on a diagonal of the pallet body, to enable the construction to be better understood.
The method of mounting the tip type circuit elements on the printed circuit board according to the embodiment shown in Figs.10~14 and described hereinabove will now be described.
The tip type circuit elements 22 are fed to the pallet 37 by moving the sliding plate 31 of the multiple magazine 23 in the same manner as described by referring to the embodiment shown in Figs.5~9. Then, the pick-and-place unit 41 is moved to a position above the pallet 37 to which the tip type circuit elements 23 have been fed as shown in Fig. 14, and moved downwardly.
Downward movement of the pick-and-place unit 41 brings the inclined portions 49 of the plate slide bosses 48 projecting downwardly through the undersurface of the vacuum chuck 42 into engagement in the boss receiving openings 47A formed in the first pallet plate 40A. Further downward movement of the pick-and-place unit 41 causes the inclined portions 49 of the plate slide bosses 48 to project into the boss receiving openings 47B formed in the second pallet plate 408. Thus the right edge of each boss receiving openings 478 of the pallet plate 408 as viewed in
Fig. 14 abuts against the inclined portion 49 of the boss 48 projecting thereinto and has a horizontal component of force applied thereto, so that as the bosses 48 progressively enter the boss receiving openings 47B the second pallet plate 40B is moved rightwardly in Fig. 14 or in the direction of the arrows T in Fig.13 against the biasing force of the compression spring 46.Sliding movement of the second pallet plate 408 brings the tip type circuit element receiving openings 39A and 39B of the first and second pallet plates 40A and 40B, which were indexed with each other when the second pallet plate 40B was stationary, out of index with each other as the tip type circuit element receiving openings 39B of the second pallet plate 40B move to broken line positions in
Fig. 13. The tip type circuit elements 22 in the element receiving openings 39A and 39B are shifted by the movement of the second pallet plate 40B into contact with the right lower corner of the element receiving openings 39A in Fig. 13 to be positioned.As each element 22 is positioned by being held in the upper and lower element receiving openings 39A and 398, the inclined portion 39 of each plate slide boss 48 extends through the lower boss receiving opening 47B and the straight portion of the boss 48 is disposed in the boss receiving openings 47A and 47B, thereby preventing the second pallet plate 408 from further moving. As the pick-and-plate unit 41 further moves downwardly, the suction ducts 43 of the vacuum chuck 42 are brought into abutting engagement at their ends with the upper surfaces of the tip type circuit elements 22 which are attracted to the vacuum chuck 42 by the action of the vacuum pump, not shown.Thereafter, the pick-and-place unit 41 is moved upwardly and transferred to a position above the printed circuit board 21 as described by referring to the embodiment shown in Figs.5~9. Deactuation of the vacuum chuck 42 releases the elements 22 from the suction ducts 43 and allows same to be mounted on the board 21 at predetermined positions with a high degree of accuracy.
As the pick-and-place unit 41 is moved upwardly, the second pallet plate 408 is returned to its original position by the biasing force of the compression spring 46, to be ready for receiving the next following tip type circuit elements 22 fed to the pallet 37 by the multiple magazine 23.
The embodiment shown in Figs.10~14 can achieve similar effects to those achieved by the embodiment shown in Figs. 5-9 of mounting the tip type circuit elements 22 on the printed circuit board 21 in the predetermined positions with a high degree of accuracy.
In the embodiment shown in Figs.10~14, the first and second pallet plates 40A and 40B may be consolidated into one pallet plate which is movable in sliding movement diagonally of the pallet body 38, so that the tip type circuit elements 22 can be arranged in the regular positions by the oblique sliding movement of the pallet plate. The multiple magazine of the sliding type has been described as serving as tip type circuit element feeding means in the two embodiments described hereinabove. However, the invention is not limited to this specific form of tip type circuit element feeding means, and any other suitable feeding means may be used, such as feeding means for feeding one tip type circuit element after another to the element receiving openings 39 of the pallet 37. The pick-and-place unit 41 has been described as being used as tip type circuit element transfer means in the two embodiments described hereinabove. However, the invention is not limited to this specific form of tip type circuit element transfer means and any other suitable transfer means may be used.
From the foregoing description, it will be appreciated that the present invention provides a method and apparatus for mounting tip type circuit elements on a printed circuit board enabling the tip type circuit elements to be mounted at predetermined positions on the printed circuit board with a high degree of accuracy.
Claims (13)
1. A method of mounting tip type circuit elements on a printed circuit board comprising the steps of:
feeding tip type circuit elements by tip type circuit element feeding means containing tip type circuit elements therein into tip type circuit element receiving holes formed in a pallet in positions corresponding to tip type circuit element mounting positions on the printed circuit board, the tip type circuit element receiving holes being dimensioned such that each tip type circuit element can be received in a loose condition in one of the tip type circuit element receiving holes;
shifting each tip type circuit element fed into one of the tip type circuit element receiving holes so as to position each tip type circuit element in abutting relation to at least one of the inner wall surfaces of the respective tip type circuit element receiving hole; and
transferring the tip type circuit elements onto the printed circuit board by tip type circuit element transfer means without altering the relative positions of the tip type circuit elements, and mounting the tip type circuit elements at the predetermined tip type circuit element mounting positions on the printed circuit board.
2. A method as claimed in claim 1, wherein shifting of the tip type circuit elements occurring in said tip type circuit element shifting step is effected by tilting the pallet.
3. A method as claimed in claim 2, wherein vibration is imparted to the pallet as the latter is tilted in said tip type circuit element shifting step.
4. A method as claimed in claim 1, wherein said pallet comprises a pallet body and a pallet plate arranged on the pallet body for sliding movement and formed with said tip type circuit element receiving holes, and wherein shifting of the tip type circuit elements in the tip type circuit element receiving holes occurring in said tip type circuit element shifting step is effected by moving the pallet plate relative to the pallet body.
5. A method as claimed in any one of claims 1-4, wherein said tip type circuit element feeding means comprises a multiple magazine including magazines arranged in positions corresponding to the predetermined tip type circuit element mounting positions on the printed circuit board, each of said magazines containing a plurality of tip type circuit elements superposed one over another, and wherein the pallet and the multiple magazines are relatively positioned to each other in said tip type circuit element feeding step in such a manner that the pallet is disposed beneath the multiple magazine, whereby the lowermost tip type circuit element in each magazine drops into one of the tip type circuit element receiving holes of the pallet indexed therewith.
6. An apparatus for mounting tip type circuit elements on a printed circuit board comprising:
a pallet formed with tip type circuit element receiving holes in positions corresponding to predetermined tip type circuit element mounting positions on the printed circuit board, the tip type circuit element receiving holes being dimensioned such that each tip type circuit element can be received in a loose condition in one of the tip type circuit element receiving holes;
tip type circuit element feeding means containing a plurality of tip type circuit elements therein and feeding same in such a manner that one tip type circuit element is received in one of the tip type circuit element receiving holes;;
means for shifting the tip type circuit elements fed into the tip type circuit element receiving holes so as to position each tip type circuit element in abutting relation to at least one of the inner wall surfaces of the respective tip type circuit element receiving hole; and
tip type circuit element transfer means for transferring the positioned tip type circuit elements on to the printed circuit board without altering the relative positions of the tip type circuit elements, and mounting the tip type circuit elements at the predetermined tip type circuit element mounting positions on the printed circuit board.
7. An apparatus as claimed in claim 6, wherein said shifting means comprises pallet tilting means for tilting the pallet so as to cause each tip type circuit element to be shifted in the respective tip type circuit element receiving hole.
8. An apparatus as claimed in claim 7, wherein said shifting means further comprises means for imparting vibration to the pallet as the latter is tilted by said pallet tilting means.
9. An apparatus as claimed in claim 6, wherein said pallet comprises a pallet body and a pallet plate arranged on the pallet body for sliding movement and formed with said tip type circuit element receiving holes, and wherein said shifting means comprises means cooperating with the pallet plate for causing the latter to move in sliding movement on the pallet body, to thereby cause each tip type circuit element to be shifted in the respective tip type circuit element receiving hole.
10. An apparatus as claimed in claim 6, wherein said pallet comprises a pallet body, a first pallet plate secured to the pallet body and a second pallet plate disposed in a superposed relation with the first pallet plate, and said tip type circuit element receiving holes comprise first holes formed in the first pallet plate and second holes formed in the second pallet plate, said second pallet plate being movable in sliding movement between a first position in which the first holes are substantially indexed with the associated second holes to enable each tip type circuit element to be received in the respective pair of said first and second holes and a second position in which the first holes are out of index with the associated second holes; and said shifting means comprises means cooperating with the second pallet plate for moving the latter to the second position to hold each tip type circuit element received in the respective pair of said first and second holes between the inner wall surfaces of the pair of the holes.
11. An apparatus as claimed in any one of claims 6-10, wherein said tip type circuit element feeding means comprises a multiple magazine including a main body having a plurality of magazines each containing a plurality of tip type circuit elements arranged in vertically superposed relation one over another, said plurality of magazines being located in positions corresponding to predetermined tip type circuit element mounting positions on the printed circuit board, a guide plate secured to the undersurface of the main body, and a sliding plate interposed between the main body and the guide plate; said tip type circuit element transfer means further comprises means for positioning the pallet and
multiple magazine relative to each other so that the pallet is disposed beneath the guide plate and the tip type circuit element receiving holes formed in the pallet are out of index with the magazines; said guide plate is formed with guide through holes adapted to be indexed with the tip type circuit element receiving holes of the pallet when the pallet and the multiple magazine are positioned relative to each other by said positioning means, and said sliding plate is formed with receiving through holes normally indexed with the magazines for receiving therein the lowermost tip type circuit elements in the magazines, the sliding plate is movable in sliding movement to a position in which the receiving through holes formed in the sliding plate are substantially indexed with the tip type circuit element receiving holes formed in the pallet; whereby the tip type circuit elements received in the receiving through holes formed in the sliding plate are moved by the sliding movement of the sliding plate and fed into the respective tip type circuit element receiving holes formed in the pallet through the associated guide through hole formed in the guide plate.
12. A method of mounting tip type circuit elements on a printed circuit board substantially as hereinbefore described with reference to Figs.
4 to 14 of the accompanying drawings.
13. Apparatus for mounting tip type circuit elements on a printed circuit board such apparatus being constructed and arranged substantially as hereinbefore described with reference to and as illustrated in Figs. 4 to 14 of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13701879A JPS5661194A (en) | 1979-10-25 | 1979-10-25 | Method of carrying chip element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2063227A true GB2063227A (en) | 1981-06-03 |
| GB2063227B GB2063227B (en) | 1983-04-07 |
Family
ID=15188897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8034234A Expired GB2063227B (en) | 1979-10-25 | 1980-10-23 | Method of mounting tip type circuit elements on a printed circuit board and apparatus for performing the same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5661194A (en) |
| BR (1) | BR8006824A (en) |
| FR (1) | FR2468285A1 (en) |
| GB (1) | GB2063227B (en) |
| MY (1) | MY8400337A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4644642A (en) * | 1982-04-21 | 1987-02-24 | U.S. Philips Corporation | Method of and device for placing chip-type electrical and/or electronic components on a substrate |
| US4670981A (en) * | 1986-03-17 | 1987-06-09 | Nitto Kogyo Kabushiki Kaisha | Method of mounting electronic parts on the predetermined positions of a printed circuit board |
| US4722135A (en) * | 1986-02-07 | 1988-02-02 | General Electric Co. | Apparatus for placing surface mounting devices on a printer circuit board |
| US4868974A (en) * | 1987-09-01 | 1989-09-26 | Sumitomo Electric Industries, Ltd. | Chip mounting apparatus |
| US4985107A (en) * | 1988-03-01 | 1991-01-15 | Sci Systems, Inc. | Component location device and method for surface-mount printed circuit boards |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020032512A (en) * | 2018-08-31 | 2020-03-05 | 日本電産株式会社 | Conveying jig and conveying device comprising the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1249067A (en) * | 1969-03-12 | 1971-10-06 | Int Computers Ltd | Improvements in or relating to methods of connecting integrated circuit chips to printed circuit boards |
| JPS5537879B2 (en) * | 1973-10-15 | 1980-09-30 | ||
| GB2017540B (en) * | 1978-02-21 | 1982-08-18 | Toko Inc | Electronic component automatic insertion system and apparatus |
-
1979
- 1979-10-25 JP JP13701879A patent/JPS5661194A/en active Granted
-
1980
- 1980-10-23 FR FR8022727A patent/FR2468285A1/en active Granted
- 1980-10-23 BR BR8006824A patent/BR8006824A/en unknown
- 1980-10-23 GB GB8034234A patent/GB2063227B/en not_active Expired
-
1984
- 1984-12-30 MY MY8400337A patent/MY8400337A/en unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4644642A (en) * | 1982-04-21 | 1987-02-24 | U.S. Philips Corporation | Method of and device for placing chip-type electrical and/or electronic components on a substrate |
| US4722135A (en) * | 1986-02-07 | 1988-02-02 | General Electric Co. | Apparatus for placing surface mounting devices on a printer circuit board |
| US4670981A (en) * | 1986-03-17 | 1987-06-09 | Nitto Kogyo Kabushiki Kaisha | Method of mounting electronic parts on the predetermined positions of a printed circuit board |
| US4868974A (en) * | 1987-09-01 | 1989-09-26 | Sumitomo Electric Industries, Ltd. | Chip mounting apparatus |
| AU598393B2 (en) * | 1987-09-01 | 1990-06-21 | Sumitomo Electric Industries, Ltd. | Chip mounting apparatus |
| US4985107A (en) * | 1988-03-01 | 1991-01-15 | Sci Systems, Inc. | Component location device and method for surface-mount printed circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6211520B2 (en) | 1987-03-12 |
| MY8400337A (en) | 1984-12-31 |
| JPS5661194A (en) | 1981-05-26 |
| BR8006824A (en) | 1981-04-28 |
| FR2468285A1 (en) | 1981-04-30 |
| GB2063227B (en) | 1983-04-07 |
| FR2468285B1 (en) | 1984-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |