KR102572327B1 - System For Automatic Dividing Ceramic Substrate - Google Patents

Abstract

<01> The present invention relates to an automatic division system for ceramic substrates that automatically divides a single ceramic substrate in which a pile of edges is formed and division units are vertically and horizontally divided by scribing lines on the upper surface into set division units. A plurality of target substrates are spaced apart from each other and stacked at regular intervals, formed to be liftable, and a magazine loader including a first pusher for pushing the substrates in the x-axis, and a second pusher for pushing the substrates in the x-axis, the magazine loader A first conveyor that moves and discharges the substrates fed from the first conveyor in the x-axis direction, a dummy divider that separates the dummy from the substrates supplied from the first conveyor, and the substrates supplied by the second pusher in the x-axis direction. A second conveyor for moving the x-axis divider in the y-axis, including an x-axis divider for dividing, a third pusher for pushing the substrate in the x-axis, and a fourth pusher for pushing the substrate in the y-axis A third conveyor through which the substrate is fed from the x-axis divider by the third pusher, a y-axis divider through which the substrate fed from the third conveyor by the fourth pusher is divided in the y-axis direction, and the y-axis divider and a fourth conveyer for transferring the substrate to a tray including a gripper holding the substrate on which the division is completed.

Description

Automatic Dividing System of Ceramic Substrate {System For Automatic Dividing Ceramic Substrate}

The present invention relates to an automatic division system for ceramic substrates, and more particularly, to automatically divide one ceramic substrate into set division units, in which a pile of edges is formed and division units are vertically and horizontally divided by scribing lines on the upper surface. It relates to an automatic splitting system for ceramic substrates.

In general, when connecting circuits between parts of an electronic product, a printed circuit board is made by drawing circuits on a board without using wires to conduct electricity.

In recent years, according to the trend of miniaturization, light weight and multifunctionality of products, printed circuit boards are also miniaturized, and the degree of integration of various circuit components mounted on printed circuit boards is gradually increasing.

Considering that the overall size of such a small printed circuit board is small, mass production is difficult because it takes a long time to manufacture each individually.

Accordingly, recently, in order to increase productivity, a plurality of identical patterns are formed on a large-sized substrate, a dividing line is formed on the substrate along the periphery of the plurality of patterns and between the plurality of patterns, and then each unit substrate is formed along the dividing line. A small printed circuit board is manufactured through a process of applying an external force to the board so as to be divided.

However, as described above, since the process of dividing each unit board in the process of manufacturing a small printed circuit board is performed manually, fine particles are generated in the process of dividing the board, and due to these particles, the printed circuit board mounted on the board There is a problem that circuit components are contaminated.

In addition, when an operator applies an excessive external force to the substrate in the process of dividing each unit substrate, there is a problem in that the substrate is cracked or damaged.

On the other hand, Korean Patent Registration No. 10-1110321 discloses a substrate splitting device including an adsorption chuck to prevent particles from scattering during a substrate splitting process, but such a conventional substrate splitting device is As input and discharge of divided substrates are performed manually, there is a problem in that efficiency of the substrate division process is lowered.

Republic of Korea Patent Registration No. 10-1110321 (published on 2012.02.16.)

An object of the present invention has been made to solve the above-mentioned problems, and provides an automatic ceramic substrate division system for preventing cracks or damage to a substrate when a ceramic substrate arranged in several pieces is divided into set units. is to do

In addition, an object of the present invention is to provide an automatic ceramic substrate splitting system in which a substrate to be split is automatically inputted, divided in two axial directions, and automatically ejected.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention not mentioned above can be understood by the following description and will be more clearly understood by the embodiments of the present invention.

It will also be readily apparent that the objects and advantages of the present invention may be realized by means of the instrumentalities and combinations indicated in the claims.

In order to solve the above problems, the automatic division system for ceramic substrates according to the present invention is a magazine in which a plurality of substrates to be divided are spaced apart at regular intervals, formed to be liftable, and including a first pusher that pushes the substrates in the x-axis. A loader, a first transporter including a second pusher that pushes the substrate in the x-axis and moving and discharging the substrate input from the magazine loader in the x-axis, a dummy from the substrate supplied from the first transporter A dummy divider for separating, an x-axis divider for dividing the substrate supplied by the second pusher in the x-axis direction, and a third pusher for pushing the substrate in the x-axis to move the x-axis divider in the y-axis A 2nd conveyor, including a 4th pusher that pushes the substrate in the y-axis, a 3rd conveyor through which the substrate is input from the x-axis divider by the 3rd pusher, and a 4th pusher from the 3rd conveyor and a y-axis divider for dividing the loaded substrate in the y-axis direction, a gripper for holding the divided substrate on the y-axis divider, and a fourth transfer unit for transferring the substrate to a tray.

More specifically, the dummy divider has a dummy seating base on which the substrate is seated so that the dummy protrudes in all directions and a dummy dividing guide formed at a position corresponding to the scribing line of the substrate and a position corresponding to the dummy of the substrate, respectively. and a dummy dividing unit including a first dummy dividing bar and a second dummy dividing bar to separate the dummy from the substrate as the dummy dividing cylinder moves up and down.

At this time, the first dummy dividing bar has a circular cross section and is formed at a position corresponding to a pair of dummy formed in parallel in the x-axis direction of the substrate, and the second dummy dividing bar has a circular cross section. Preferably, it is formed in a rod shape at a position corresponding to a pair of dummy formed in parallel in the y-axis direction of the substrate, and the first dummy dividing bar and the second dummy dividing bar are stepped in the z-axis.

On the other hand, the x-axis splitter includes a pair of x-axis fixing guides to which both ends of the substrate are fixed, an x-axis split base on which the substrate is seated, a bar shape having a circular cross section, and an x-axis split lower cylinder An x-axis dividing lower unit including an x-axis dividing bar that moves up and down so as to protrude toward the center of the x-axis dividing base and a rod shape having an inverted trapezoidal cross section, and is connected to the scribing line of the substrate by the x-axis dividing upper cylinder. An x-axis split upper unit including an x-axis split guide that is in close contact or separated from each other and pressurizes and fixes the substrate, the x-axis split guide descends to fix the substrate, and the x-axis split bar rises to separate the substrate. The x-axis segmentation is done.

In addition, the y-axis divider includes a pair of y-axis fixing guides to which both ends of the substrate are fixed, a y-axis dividing base on which the substrate is seated, a bar shape having a circular cross section, and a y-axis dividing lower cylinder A y-axis dividing lower unit including a y-axis dividing bar that moves up and down so as to protrude toward the center of the y-axis dividing base and a rod shape having an inverted trapezoidal cross section, and a y-axis dividing upper cylinder to the scribing line of the substrate A y-axis split upper unit including y-axis split guides that are in close contact or separated from each other and pressurizes and fixes the substrate, the y-axis split guide descends to fix the substrate, and the y-axis split bar rises to The y-axis segmentation is done.

As described above, the automatic division system for ceramic substrates according to the present invention has an effect of preventing cracks in the substrate or damage to the substrate when a plurality of ceramic substrates are divided into set units.

In addition, the automatic ceramic substrate splitting system according to the present invention can greatly improve substrate splitting process efficiency by automatically inputting the splitting target substrates, dividing them in two axial directions, and automatically ejecting them.

In addition to the effects described above, specific effects of the present invention will be described together while explaining specific details for carrying out the present invention.

1a and b are photographs taken before and after division of a ceramic substrate, which is an object to be divided, of the automatic division system for ceramic substrates according to an embodiment of the present invention, respectively.
2 is a block diagram showing the overall configuration of an automatic splitting system for ceramic substrates according to an embodiment of the present invention.
3 is a photograph of an automatic splitting system for a ceramic substrate according to an embodiment of the present invention.
4 is a photograph of a magazine loader in the automatic splitting system for ceramic substrates according to an embodiment of the present invention.
5 is a photograph of a first conveyor and a dummy divider in the automatic division system for ceramic substrates according to an embodiment of the present invention.
6 is a side view of a dummy divider in the automatic divider system for ceramic substrates according to an embodiment of the present invention.
7 is a diagram illustrating an x-axis divider in the automatic division system for ceramic substrates according to an embodiment of the present invention.
8 is a diagram showing a y-axis divider in the automatic division system for ceramic substrates according to an embodiment of the present invention.
9 is a photograph of an X-axis divider, a Y-axis divider, a fourth conveyor, and a tray in an automatic ceramic substrate splitting system according to an embodiment of the present invention.
A and b of FIG. 10 are photographs of X-axis division and Y-axis division performed in the automatic division system for ceramic substrates according to an embodiment of the present invention, respectively.
11a and b are photographs of the fourth conveyor and the tray in the automatic splitting system for ceramic substrates according to an embodiment of the present invention, respectively.

The above objects, features and advantages will be described later in detail with reference to the accompanying drawings, and accordingly, those skilled in the art to which the present invention belongs will be able to easily implement the technical spirit of the present invention.

In describing the present invention, if it is determined that the detailed description of the known technology related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

Hereinafter, the arrangement of an arbitrary element on the "upper (or lower)" or "upper (or lower)" of a component means that an arbitrary element is placed in contact with the upper (or lower) surface of the component. In addition, it may mean that other components may be interposed between the component and any component disposed on (or under) the component.

In addition, when a component is described as "connected", "coupled" or "connected" to another component, the components may be directly connected or connected to each other, but other components may be "interposed" between each component. ", or each component may be "connected", "coupled" or "connected" through other components.

Singular expressions used herein include plural expressions unless the context clearly dictates otherwise.

In this application, terms such as "consisting of" or "comprising" should not be construed as necessarily including all of the various components or steps described in the specification, and some of the components or some of the steps It should be construed that it may not be included, or may further include additional components or steps.

Throughout the specification, when it says "A and/or B", it means A, B or A and B, unless otherwise specified, and when it says "C to D", it means no particular contrary description As long as there is no, it means C or more and D or less.

Hereinafter, an automatic splitting system for a ceramic substrate according to some embodiments of the present invention will be described.

A and b of FIG. 1 are photographs taken before and after division of a ceramic substrate, which is an object to be divided, of the automatic division system for ceramic substrates according to an embodiment of the present invention, respectively.

First, referring to FIG. 1, a ceramic substrate (hereinafter, referred to as a substrate B), which is a division target of the automatic ceramic substrate division system according to the present invention, has a rectangular shape as a whole, and a pile is formed on the edge, respectively, on the upper surface. At least one scribing line is formed in at least one of the length and width directions according to the number of divisions.

For example, as shown in FIG. b, in a substrate B having six divisions, one scribing line is formed in the longitudinal direction and two scribing lines are formed in the width direction.

As another example, in the substrate B having two divisions, one scribing line may be formed in either the longitudinal direction or the width direction.

In addition, the substrate B having three divisions may have two scribing lines formed in either the longitudinal direction or the width direction.

In addition, in the substrate B having four divisions, one scribing line may be formed in each of the longitudinal direction and the width direction.

Meanwhile, FIG. 2 is a block diagram showing the overall configuration of the automatic division system for ceramic substrates according to an embodiment of the present invention, and FIG. 3 is a photograph of the automatic division system for ceramic substrates according to an embodiment of the present invention. am.

4 is a photograph of a magazine loader in the automatic splitting system for ceramic substrates according to an embodiment of the present invention, and FIG. 5 is an automatic splitting system for ceramic substrates according to an embodiment of the present invention, This is a picture taken of the first conveyor and the dummy divider.

6 to 8 are diagrams illustrating a dummy divider, an x-axis divider, and a y-axis divider in the automatic divider system for a ceramic substrate according to an embodiment of the present invention, respectively.

9 is a photograph of an X-axis divider, a Y-axis divider, a fourth conveyor, and a tray in an automatic ceramic substrate splitting system according to an embodiment of the present invention, and FIG. 10 a and b respectively In the automatic division system for ceramic substrates according to an embodiment of the present invention, X-axis division and Y-axis division are photographed, and FIG. 11 a and b are respectively ceramic according to an embodiment of the present invention. In the automatic substrate splitting system, this is a picture taken of the fourth conveyor and tray.

2 to 11, the automatic splitting system for ceramic substrates according to the present invention includes a magazine loader 100, a first transfer machine 200, a dummy divider 300, an x-axis divider 400, and a second transfer machine. 500, a third transfer unit 600, a y-axis divider 700, a fourth transfer unit 800 and a tray 900.

At this time, the automatic splitting system for ceramic substrates according to the present invention may include each of the above components in one chamber (not shown), and may further include a controller (not shown) including a touch screen to control each of them. .

More specifically, as shown in FIG. 4, the magazine loader 100 is formed so that a plurality of substrates B are stacked at regular intervals in the height direction (hereinafter, z-axis), and is mounted on an elevating means such as an air cylinder. ascends and descends along the z-axis.

In addition, the magazine loader 100 is installed on the opposite side where the first conveyor 200 is formed and pushes the substrate B loaded in the magazine loader 100 toward the first conveyor 200. It includes a first pusher 110 for transmitting.

Here, the first pusher 110 includes a bar that moves forward and backward in a lateral direction (hereinafter referred to as x-axis) by various driving means such as a linear motor, and the substrates B loaded in the magazine loader 100 are moved one by one. It pushes toward the first conveyor (200).

At this time, the magazine loader 100 ascends or descends so that the first pusher 110 can push the substrates B one by one toward the first conveyor 200 as described above.

On the other hand, in the first transfer machine 200, as described above, a pair of rails supporting both sides of the substrate B input from the magazine loader 110 are formed in an x-axis square, and the rear (hereinafter, y-axis) ) side includes a second pusher 210 provided with a bar that moves forward and backward in the side (hereinafter, x-axis) by various driving means such as a linear motor.

Accordingly, the first conveyor 200 transfers the substrate B to the dummy divider 300 .

In addition, the dummy divider 300 is for removing the dummy formed on the edge of the substrate B and includes a dummy seating base 310 and a dummy dividing unit 320 as shown in FIG. 6 .

More specifically, the dummy seating base 310 is a plate on which the substrate B transferred from the first conveyor 200 is seated, and is formed to a size in which the dummy of the substrate B protrudes in all directions. desirable.

In addition, the dummy dividing unit 320 includes a lifting means such as a dummy dividing cylinder 321 and a dummy dividing guide 322 for fixing the substrate B by being in close contact with the scribing line of the substrate B, and the A first dummy dividing bar 323 and a second dummy dividing bar 324 are included to separate the dummy from the substrate B.

At this time, the dummy dividing guide 322 has a rod shape having an inverted trapezoidal cross section and is lowered by the dummy dividing cylinder 321 to fix the substrate B.

In addition, the first dummy dividing bar 323 descends two dummy parallel to the x-axis direction among the piles of the substrate B by the dummy dividing cylinder 321 so as to move away from the substrate B. As a means for dropping, the cross section is circular and rod-shaped.

In addition, the second dummy dividing bar 234 lowers the two dummy formed in parallel in the y-axis direction among the piles of the substrate B by the dummy dividing cylinder 321, so that the second dummy dividing bar 234 moves down from the substrate B. As a means for dropping, the cross section is circular and rod-shaped.

At this time, the first dummy divider bar 323 and the second dummy divider bar 234 have a step in the z-axis, and are formed parallel to the x-axis direction when the dummy divider cylinder 321 descends. The shock applied to the substrate B can be alleviated by sequentially removing the two dummy formed parallel to the dummy in the y-axis direction from the substrate B instead of simultaneously.

In addition, in the dummy divider 300, the four dummy drops from the substrate B by the dummy divider unit 320 fall to the lower side of the dummy seating base 310 and are discharged to the outside of the chamber and stored. A collection box (not shown) may be further included.

To this end, the support portion on which the dummy seating base 310 is formed is formed as a square pillar whose cross-sectional area increases toward the bottom, so that the dummy detached from the substrate B can fall more smoothly.

In addition, the substrate B whose dummy is separated by the dummy divider 300 is moved to the x-axis divider 400 by the second pusher 210 .

On the other hand, as shown in FIG. 7, the x-axis divider 400 divides the x-axis divider base 410 on which the substrate B moved from the dummy divider 300 is seated and the substrate B is x-axis divider 400. It includes an x-axis division lower unit 420 and an x-axis division upper unit 430 that divides in the axial direction.

More specifically, the x-axis split base 410 is formed in the x-axis direction and includes a pair of x-axis fixing guides 411 fixing both sides of the substrate (B).

Here, the x-axis fixing guide 411 is formed in a 'c' shape in cross section, and both ends of the substrate B are fixed.

In addition, the x-axis dividing lower unit 420 is an x-axis dividing bar 422 that is lifted so that it can protrude toward the center of the x-axis dividing base 410 by means of an elevating means such as an x-axis dividing lower cylinder 421 includes

To this end, a hole is formed in the center of the x-axis split base 410 so that the x-axis split bar 422 can enter and exit.

In addition, the x-axis dividing bar 422 is a means for dividing the substrate B in the x-axis direction, and has a bar shape with a circular cross section, and is provided as many times as the number of divided substrates B in the x-axis direction.

In addition, the x-axis division upper unit 430 is moved up and down by an elevating means such as an x-axis division upper cylinder 431, and is in close contact with the scribing line of the substrate B in a rod shape having an inverted trapezoidal cross section. It includes an x-axis division guide 432 for fixing the substrate (B).

At this time, it is preferable that the x-axis division guide 432 is formed in the same number at positions corresponding to the x-axis division bar 422 .

Accordingly, in the x-axis divider 400, when both ends of the substrate B are slid and aligned on the x-axis fixed guide 411 by the second pusher 210, the x-axis divider guide 432 ) descends by the x-axis dividing upper cylinder 431 to fix the substrate (B), and the x-axis dividing bar 422 rises by the x-axis dividing lower cylinder 421 to fix the substrate (B) ) of the x-axis division is made.

In addition, the x-axis division upper unit 430, as shown in a of FIG. 10, when the x-axis division bar 422 rises and the x-axis division of the substrate (B) is made, the substrate (B) It is preferable to further include an elastic member such as a spring in order to maintain the fixing pressure of the substrate (B) by the x-axis split guide 432 so as not to be damaged.

On the other hand, in the second conveyor 500, the x-axis divider 400 is installed on the top and moves the x-axis divider 400 forward and backward in the y-axis direction by a driving means such as a linear motor.

More specifically, the second conveyer 500 places the x-axis divider 400 on the same straight line as the dummy divider 300 along the x-axis, and moves the x-axis divider 400 from the dummy divider 300. When the substrate B is moved and the x-axis division is completed, the x-axis divider 400 is positioned on the side of the third conveyor 600 as shown in FIG. 9 .

In addition, when the x-axis divider 400 is located on the side of the third conveyor 600 as described above, the second conveyor 500 completes the x-axis divider and moves the x-axis divider 400 and a third pusher 510 that pushes the substrate B located at the position toward the third conveyor 600.

At this time, the third pusher 510, like the first pusher 110, includes a bar that moves forward and backward in the x-axis direction by various driving means such as a linear motor.

On the other hand, the third conveyor 600 uses various driving means such as a linear motor to supply the substrate B moved by the third pusher 510 to the y-axis divider 700 as described above. and a fourth pusher 610 including a bar that moves forward and backward in the y-axis direction.

In addition, as shown in FIG. 8, the y-axis divider 700 includes a y-axis divider base 710 on which the substrate B moved by the third conveyor 600 is seated and the substrate B ) in the y-axis direction, and a y-axis division lower unit 720 and a y-axis division upper unit 730.

More specifically, the y-axis split base 710 includes a pair of y-axis fixing guides 711 formed in the y-axis direction to fix both sides of the substrate (B).

Here, the y-axis fixing guide 711 is formed in a 'c' shape in cross section, and both ends of the substrate B are fixed.

In addition, the y-axis dividing lower unit 720 is a y-axis dividing bar 722 that is lifted so that it can protrude toward the center of the y-axis dividing base 710 by means of an elevating means such as a y-axis dividing lower cylinder 721 includes

To this end, a hole is formed in the center of the y-axis split base 710 so that the y-axis split bar 722 can enter and exit.

In addition, the y-axis dividing bar 722 is a means for dividing the substrate B in the y-axis direction, and has a bar shape with a circular cross section, and is provided as many as the number of the substrates B divided along the y-axis.

In addition, the y-axis split upper unit 730 is moved up and down by a lifting means such as a y-axis split upper cylinder 731, and is in close contact with the scribing line of the substrate (B) in a rod shape having an inverted trapezoidal cross section A y-axis division guide 732 for fixing the substrate B is included.

At this time, the y-axis division guide 732 may be formed in the same number or more in a position corresponding to the y-axis division bar 722 .

Accordingly, in the y-axis divider 700, when both ends of the substrate B are slid and aligned on the y-axis fixed guide 711 by the fourth pusher 610, the y-axis divider guide 732 ) is lowered by the y-axis dividing upper cylinder 731 to fix the substrate (B), and the y-axis dividing bar 722 is raised by the y-axis dividing lower cylinder 721 to fix the substrate (B). ) of the y-axis division is made.

In addition, the y-axis split upper unit 730, like the x-axis split upper unit 430, is an elastic member such as a spring to maintain the fixing pressure of the substrate B by the y-axis split guide 732 may further include.

On the other hand, the fourth conveyor 800 has completed the division, and the gripper 810 holding the substrate B located on the y-axis divider 700 one by one and the gripper 810 are arranged in the x-axis and y-axis The substrate B is transferred from the y-axis divider 700 to the tray 900 by including means capable of moving in each direction.

In addition, the fourth transfer unit 800 may be replaced with a means or a robot arm capable of holding the substrate B in a vacuum adsorption method instead of the gripper 810 .

In addition, the tray 900 is formed with a plurality of seating parts 910 vertically and horizontally on which the divided substrates B are seated one by one, and at least one mounting part 910 formed so that the gripper 810 can move to an accurate position. The above reference points 920 are included.

At this time, the fourth conveyor 800 may further include various sensors or vision alignment means to move the gripper 810 to an accurate position through the reference point 920 .

In addition, the tray 900 may be configured to be movable in the y-axis when the substrate B is completely seated on each seating part 910 .

Accordingly, the automatic ceramic substrate splitting system according to the present invention configured as described above can greatly improve the efficiency of the substrate splitting process by automatically inputting the splitting target substrates, dividing them in two directions, and automatically ejecting them. .

As described above, the present invention has been described with reference to the drawings illustrated, but the present invention is not limited by the embodiments and drawings disclosed in this specification, and various modifications are made by those skilled in the art within the scope of the technical idea of the present invention. It is obvious that variations can be made.

In addition, although the operational effects according to the configuration of the present invention have not been explicitly described and described while describing the embodiments of the present invention, it is natural that the effects predictable by the corresponding configuration should also be recognized.

B. substrate
100. Magazine loader
110. First pusher
200. 1st conveyor
210. Second pusher
300. Dummy divider
310. Dummy seating base
320. Dummy division unit
321. Dummy Split Cylinder
322. Dummy division guide
323. First dummy dividing bar
324. Second dummy divider bar
400. x-axis divider
410. x-axis division base
411. x-axis fixed guide
420. x-axis division lower unit
421. x-axis split lower cylinder
422. x-axis split bar
430. x-axis division upper unit
431. x-axis split upper cylinder
432. x-axis division guide
500. Second conveyor
510. Third pusher
600. 3rd conveyor
610. 4th pusher
700. y-axis divider
710. y-axis split base
711. Y-axis fixed guide
720. Y-axis division lower unit
721. Y-axis split lower cylinder
722. y-axis split bar
730. Y-axis division upper unit
731. Y-axis split upper cylinder
732. y-axis division guide
800. 4th conveyor
810. Gripper
900. Tray
910. Seating part
920. Reference point

Claims (5)

A magazine loader including a first pusher in which a plurality of substrates to be divided are spaced apart from each other and stacked at regular intervals, formed to be liftable, and pushing the substrates in the x-axis;
a first transporter including a second pusher pushing the substrate in the x-axis and moving and discharging the substrate introduced from the magazine loader in the x-axis;
a dummy divider separating the dummy from the substrate supplied from the first conveyor;
an x-axis divider dividing the substrate supplied by the second pusher in an x-axis direction;
a second transporter including a third pusher pushing the substrate in the x-axis and moving the x-axis divider in the y-axis;
a third transporter including a fourth pusher pushing the substrate along the y-axis and receiving the substrate from the x-axis divider by the third pusher;
a y-axis divider dividing the substrate inputted from the third conveyor by a fourth pusher in a y-axis direction;
A fourth conveyor including a gripper holding the substrate on which the division is completed on the y-axis divider and transferring the substrate to a tray;
The dummy divider may include a dummy seating base on which the substrate is seated so that the dummy protrudes in all directions; And, a dummy dividing guide formed at a position corresponding to the scribing line of the substrate and a first dummy dividing bar and a second dummy dividing bar formed at a position corresponding to the dummy of the substrate are moved up and down by the dummy dividing cylinder. and a dummy dividing unit separating the dummy from the substrate according to the method.
delete According to claim 1,
The first dummy dividing bar is
It is formed in a bar shape with a circular cross section at a position corresponding to a pair of dummy formed in parallel in the x-axis direction of the substrate,
The second dummy dividing bar
It is formed in a bar shape with a circular cross section and is formed at a position corresponding to a pair of dummy formed in parallel in the y-axis direction of the substrate,
The automatic dividing system for ceramic substrates wherein the first dummy dividing bar and the second dummy dividing bar are formed stepwise in the z-axis.
According to claim 1,
The x-axis divider is
An x-axis split base on which the substrate is seated, including a pair of x-axis fixing guides to which both ends of the substrate are fixed;
An x-axis dividing lower unit having a bar shape having a circular cross section and including an x-axis dividing bar that moves up and down to protrude toward the center of the x-axis dividing base by means of an x-axis dividing lower cylinder; and
An x-axis split upper unit that has a rod shape with an inverted trapezoidal cross section and presses and fixes the substrate including an x-axis split guide that is in close contact with or spaced apart from the scribing line of the substrate by the x-axis split upper cylinder. ,
The automatic division system for a ceramic substrate according to claim 1 , wherein the x-axis division guide descends to fix the substrate, and the x-axis division bar rises to divide the substrate on the x-axis.
According to claim 1,
The y-axis divider is
a y-axis split base on which the substrate is seated, including a pair of y-axis fixing guides to which both ends of the substrate are fixed;
A y-axis dividing lower unit having a rod shape having a circular cross section and including a y-axis dividing bar that moves up and down to protrude toward the center of the y-axis dividing base by means of a y-axis dividing lower cylinder; and
A y-axis dividing upper unit having a rod shape having an inverted trapezoidal cross section and including a y-axis dividing guide that is in close contact with or spaced apart from the scribing line of the substrate by the y-axis dividing upper cylinder and pressurizes and fixes the substrate; and ,
The automatic division system for ceramic substrates wherein the y-axis division guide descends to fix the substrate, and the y-axis division bar rises to divide the substrate on the y-axis.