JP2000183598A - Electronic part mounting device and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a surface mounting type electronic part on a flexible tape- like board with high work efficiency. SOLUTION: A tape-like flexible board 11 is held on the first table 13 out of first and second tables 13, 14 moving in the prescribed direction while being slacked 11A in the vicinity of the second tables 14. Subsequently, the electronic part 4 is aligned to be mounted by moving each table 13, 14 in the prescribed direction and mounted in place. According to the arrangement, a tape-like flexible board 11 can be employed and the flexible board 11 is restrained from twisting when it moves between the tables 13, 14 resulting in an electronic part mounting device for carrying an electronic part 4 automatically while mounting accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting a surface mount type electronic component on a tape-like flexible substrate having flexibility and a mounting method thereof.

[0002]

2. Description of the Related Art A conventional electronic component mounting apparatus for mounting a surface mount type electronic component on an insulating substrate will be described with reference to the external perspective view of FIG.

In FIG. 1, reference numeral 1 denotes an insulating substrate having an outer shape processed into a predetermined shape, which is positioned and held on a table 3 of an electronic component mounting apparatus 2.

[0004] Reference numeral 3A denotes a mounting portion of the surface mount type electronic component 4, which is within the range of the table 3 in a state where the electronic component 4 is sucked and held by a slide arm movably connected in X, Y, and Z directions. It is arranged to be movable.

The operation of mounting the electronic component 4 on the insulating substrate 1 placed on the table 3 in the conventional electronic component mounting apparatus 2 having the above-described configuration is performed first by the electronic component supplied by the component supply unit 5. The mounting part 3A sucks and holds the mounting part 4A, and then carries the electronic part 4 to the mounting position of the electronic component 4 on the insulating substrate 1 and lowers the mounting part 3A to mount the electronic component 4 at a predetermined position on the insulating substrate 1, and thereafter The mounting section 3A returns to the original position, and the insulating board 1 is replaced after the above operation is repeated and the mounting of the electronic components 4 on the insulating board 1 is completed.

[0006]

However, in order to cope with recent miniaturization and high performance of electronic devices, the insulating substrates used for these devices have been changed from rigid to flexible insulating films. Due to the increase in “bending use” in equipment that has been increasingly used and miniaturized, the tendency to use flexible boards made of thin insulating films has increased, and the outer shape has been processed into a predetermined shape. In the above-described conventional electronic component mounting apparatus 2 in which the insulating substrate 1 is fixed on the table 3 and the electronic component 4 is mounted, it is difficult to handle the flexible substrate with respect to the table 3 when attaching and detaching the flexible substrate. There was a problem that it became worse.

An object of the present invention is to solve such a conventional problem, and an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of efficiently mounting an electronic component on a flexible substrate.

[0008]

In order to achieve the above object, the present invention uses a flexible substrate made of a tape-shaped insulating film, and comprises a first table which moves only in the direction in which the flexible substrate is transported, and a first table. The flexible substrate is held on a first table, which is a second table that is held and moves together only in a direction perpendicular to the transport direction, so that the first and second tables have a slack near the second table. Is moved in a predetermined direction to align the mounting position of the electronic component on the flexible substrate, and then the surface-mounted electronic component held by the mounting portion is mounted on the flexible substrate.

According to this mounting method, the flexible board provided near the second table can absorb the kinking of the flexible board even when the first and second tables are moved in a predetermined direction. It is possible to obtain an electronic component mounting apparatus with high work efficiency and a mounting method capable of efficiently mounting electronic components on a tape-shaped flexible substrate and automatically transporting the flexible substrate before and after mounting the electronic components. .

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention according to claim 1 of the present invention provides an unwinding section for supplying a flexible board made of a tape-shaped insulating film having flexibility, and an unwinding section for unwinding the flexible board. A first table that moves only in the direction of transport of the flexible substrate while holding it; a second table that holds this first table and moves only in a direction perpendicular to the direction of transport of the flexible substrate together; Mounting part for mounting a surface-mount type electronic component on the upper surface of the flexible substrate after moving in the direction, a winding part for winding the flexible substrate on which the electronic component is mounted, the unwinding part and the second table Provided on the flexible substrate between and between the second table and the winding section,
A sensor for detecting a slack amount, and a control unit for controlling at least movements of the winding unit and the unwinding unit so that the slack amount becomes a predetermined amount based on detection information of the sensor. The sagging of the flexible board provided near the two tables can reliably absorb the kinking of the flexible board which is likely to occur when the first and second tables move in the predetermined direction, and thus the board for mounting electronic components. Since the flexible substrate can be automatically conveyed after a predetermined electronic component has been mounted using a tape-shaped flexible substrate, an electronic component mounting apparatus with excellent work efficiency can be realized.

According to a second aspect of the present invention, a suction hole is provided in the first table of the first aspect, and the flexible substrate is suction-held and positioned. Even when a very thin flexible substrate is used, the flexible substrate can be securely attracted and held on the first table with a simple configuration, and the position of the flexible substrate when the first and second tables move. This has the effect that the displacement can be reduced and the electronic component can be mounted at a predetermined position with high accuracy.

According to a third aspect of the present invention, a first receiving portion having the same height as the upper surface of the first table is provided before and after the side of the first table in the transporting direction of the flexible substrate. The flexible substrate is transported onto the first receiving portion, and the transport path of the flexible substrate having the same height from the first receiving portion to the first table and from the first table to the first receiving portion. Therefore, the flexible substrate can be smoothly transported.

According to a fourth aspect of the present invention, a second receiving portion having the same height as the upper surface of the first table is provided on the side of the second table before and after the flexible substrate in the transport direction. The flexible substrate is transported onto the second receiving portion, and in addition to the operation according to the invention described in claim 3, when the second table moves in a direction orthogonal to the transport direction of the flexible substrate. However, since the flexible substrate is placed on the second receiving portion, it has an effect that occurrence of twisting, kinking, and the like of the flexible substrate can be reduced, and mounting accuracy of the electronic component can be improved.

According to a fifth aspect of the present invention, a holding member for holding the flexible board is provided on the second receiving portion of the second table.
In addition to the operation according to the invention described in (1), since the electronic component can be mounted on the flexible substrate in a state where the floating above the flexible substrate is pressed by the pressing member, the mounting accuracy of the electronic component can be further improved. Things.

According to a sixth aspect of the present invention, there is provided the second receiving portion of the second table according to the fourth or fifth aspect, wherein a guide portion for regulating both ends of the flexible substrate is provided. Even when the flexible substrate is moved in a direction in which twisting or kinking is likely to occur, both ends of the flexible substrate are always regulated by the guide portion, and therefore, it has an effect that occurrence of twisting and kinking can be reduced. Things.

According to a seventh aspect of the present invention, in the electronic component of the first aspect, the mounting portion according to any one of the first to sixth aspects is a surface-mount type electronic component up to a predetermined position within a movement range of the first and second tables. While holding and moving, the first and second tables are moved and the position of the flexible board is fixed and then mounted, and during the reciprocating time for picking up the electronic components of the mounting part, the first and second tables are also moved. Since the mounting position of the electronic component can be adjusted by moving the table, the electronic component mounting efficiency can be improved.

According to the present invention, the first and second tables are capable of moving a flexible substrate made of a tape-shaped insulating film which is continuously supplied in a direction in which the flexible substrate is conveyed and in a direction perpendicular thereto. Held on the first table, and moving each of the tables in a predetermined direction so that the mounting position of the flexible substrate having a slack before and after in the transport direction was adjusted to the position of the mounting portion holding the surface mount type electronic component. After that, the electronic components are mounted on the flexible substrate, so that the tape-shaped flexible substrate is held on the first table of the first and second tables with a slack, the first and second tables, Even when the tape is moved in a predetermined direction, the tape-shaped flexible substrate is unlikely to be twisted and the mounting accuracy of electronic components is high, and Working efficient electronic component mounting method of the Kishiburu substrate can be continuously supplied are those having an effect of obtained.

An embodiment of an electronic component mounting apparatus and a mounting method according to the present invention will be described below with reference to FIGS.

The same components as those described in the section of the related art are denoted by the same reference numerals, and description thereof is omitted.

FIG. 1 is an external perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a table portion which is the main portion, and FIG. 3 is a perspective view of a transport portion which is the main portion. In the figure, reference numeral 11 denotes a flexible substrate formed of a tape-shaped insulating film having flexibility, which is sequentially supplied from the unwinding section 12 of the apparatus, and is placed on the first and second tables 13 and 14. Being transported.

The first table 13 corresponds to the second table 1
4 is configured to be movable only along the guide rail 15 provided on the upper surface of the bottom plate portion 1 while moving back and forth only in the same direction as the transport direction of the flexible substrate 11.
The first table 13 is held along a guide rail 17 provided on the base 6, and both are movable only in a direction orthogonal to the transport direction of the flexible substrate 11.

Then, the first and second tables 13
And 14 have first and second receiving portions 18 and 19 projecting back and forth in the transport direction of the flexible substrate 11 and having the same height as the first table 13 (see the sectional view of FIG. 2 and the perspective view of FIG. 3). The first receiving portion 19 and the second receiving portion 18 and 19 interfere with each other when the first and second tables 13 and 14 move in a predetermined direction. An escape groove 20 corresponding to the amount of movement of the first table 13 is provided so that there is no gap.

Further, the second table 14 is provided with a guide portion 21 for suppressing a twist or the like at the time of transport of the flexible substrate 11, and is provided above the second receiving portion 19 at the time of the transport and the like. A holding member 22 for holding the floating of the flexible substrate 11 is provided.

In the above configuration, the tape-shaped flexible substrate 11 supplied from the unwinding section 12 first receives the guide section 2 from the second receiving section 19 on the unwinding section side of the second table 14.
The first through-hole 21A is inserted through the first receiving portion 18 and is held by the first table 13. The first receiving portion 18 on the winding portion side further passes through the through-hole 21A of the guide portion 21 and the second table 14. The paper is wound by the winding part 23 through the two receiving parts 19.

In the present apparatus, the unwinding section 12,
A slack 11A is provided on the flexible substrate 11 between the winding section 23 and the second receiving section 19 attached to the corresponding second table 14, and the sensor 24 is provided beside the sag 11A. And constantly detects the above-mentioned slack amount, and inputs the detection information to a control unit (not shown) to make a predetermined determination. Based on the result, the operation amount of the unwinding unit 12 and the winding unit 23 and the like is determined. Is controlled so that the slack amount can always be maintained at a predetermined amount.

Reference numeral 25 denotes a mounting section in which an arm 25B is connected to a central support section 25A, and a holding section in which surface mounting type electronic components 4 supplied by a component supply section 5 are provided at both ends of the arm 25B. With the holding unit 26, the holding unit 26 is rotated so as to be always at the same position with respect to the position of the entire apparatus, and then the mounting unit 25 is lowered to mount the electronic component 4 on the flexible substrate 11. It has become.

The operation of mounting the electronic component 4 on the flexible substrate 11 in the electronic component mounting apparatus having the above-described configuration is as follows. First, the transported flexible substrate 11 is sucked and held by the suction holes 13A of the first table 13, Only one table 13 moves back and forth in the transport direction of the flexible substrate 11 to adjust the position in the front and rear direction with respect to the mounting position of the electronic component 4, and then the second table 13 for preventing the flexible substrate 11 from floating. In this state, the second table 14 moves in the direction perpendicular to the transport direction of the flexible substrate 11 to adjust the position in the direction orthogonal to the mounting position, and 25 is to move the holding part 26 holding the electronic component 4 to the position where the electronic component is mounted and to descend. The electronic component 4 is mounted on the flexible substrate 11 by repeating the above mounting operation, and after mounting all the electronic components 4 within the predetermined flexible substrate 11, the flexible substrate 11 is moved by a predetermined amount. It is to be transported.

Next, the transfer operation will be briefly described. When the mounting of the predetermined electronic components 4 is completed as described above, first, the second table 14 returns to the initial position, and the holding member 22 is raised. To return the flexible substrate 11 to a free state, and then the first table 13 is moved to the winding unit side by a predetermined transport distance while the flexible substrate 11 is being sucked, and the flexible substrate 11 is again moved at this position. While being held by the pressing member 22, the suction of the first table 13 is released.

Then, the first table 13 returns to the initial position, holds the flexible substrate 11 by suction again, and finishes the conveyance by releasing the pressing member 22.

As described above, in the present electronic component mounting apparatus, the flexible substrate 11 includes the first and second receiving portions 1.
8 and 19 and the first table 13 are placed on a transport path of the same height, and the mounting portion of the electronic component 4 is sucked and held by the first table 13 and the front and rear flexible portions are mounted. Both ends of the substrate 11 are regulated by the through-holes 21A of the guide portion 21 and the portion is pressed by the pressing member 22 of the second receiving portion 19, so that unnecessary twisting and floating of the flexible substrate 11 can be reduced. Things.

Further, in addition to the above-described structure, the slack 11A provided on the flexible substrate 11 allows the first and second tables 13 and 14 to move in a predetermined direction.
The torsion, kinking, and the like of the flexible substrate 11 can be reliably absorbed by the slack 11A, and the electronic component 4 can be mounted with high accuracy.

Further, even when the amount of the sag 11A is excessively or deficient due to the conveyance of the flexible substrate 11, etc., the sensor 24 always detects the amount of the sag 11A, and the control unit ( (Not shown) controls the unwinding unit 12 or the winding unit 23 to control the slack 11A amount to be constant.
The stable mounting condition of the electronic component 4 can always be ensured.

As described above, according to the electronic component mounting apparatus and the mounting method according to the present invention, the flexible substrate 11 is tape-shaped and the sag 11A is used.
So that the first and second tables 13 and 1
4 and the first and second tables 13 and 14 are moved in a predetermined direction, and the electronic component 4 is mounted after the mounting position of the electronic component 4 on the flexible substrate 11 is determined. Since the tape-shaped flexible substrate 11 can be prevented from being twisted, the electronic component 4 can be accurately mounted at a predetermined position, and then the flexible substrate 11 can be automatically conveyed.

In the above-described embodiment, an example has been described in which the flexible substrate 11 is sucked and held on the first table 13. However, the flexible substrate 11 is provided with pilot holes, and the first table 13 is provided with pilot pins. The transport may be performed as a configuration in which both are engaged, or another method may be used.

The configuration of the mounting portion 25 and the method of moving the tables 13 and 14 are not limited to those described above, and various other types can be used. It goes without saying that, in addition to the electronic component 4 of the mounting type, the members and the like constituting the equipment to be used can also be directly mounted on the flexible substrate 11.

[0036]

As described above, according to the present invention, a tape-shaped flexible substrate is used, and surface-mounted electronic components can be continuously and accurately mounted, and automatic conveyance can be easily performed. The practically advantageous effect of obtaining an electronic component mounting apparatus and a mounting method thereof with excellent work efficiency can be obtained.

[Brief description of the drawings]

FIG. 1 is an external perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a table portion which is a main part of the same.

FIG. 3 is a perspective view of a transport portion, which is a main part of the same.

FIG. 4 is an external perspective view of a conventional mounting device.

[Explanation of symbols]

 Reference Signs List 4 electronic component 5 component supply section 11 flexible board 11A slack 12 unwinding section 13 first table 13A suction hole 14 second table 15, 17 guide rail 16 bottom plate section 18 first receiving section 19 second receiving section 20 escape groove 21 guide Part 21A Through-hole 22 Holding member 23 Winding part 24 Sensor 25 Mounting part 25A Central support part 25B Arm 26 Holding part

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Koji Yoshida 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E313 AA02 AA12 EE22 FF24 FF28

Claims (8)

[Claims] An unwinding section for supplying a flexible board made of a tape-shaped insulating film having flexibility, and a first section which moves only in a transport direction of the flexible board while holding the unwinded flexible board. A table, a second table that holds the first table and moves together only in a direction perpendicular to the transport direction of the flexible substrate, and a surface mount type on the upper surface of the flexible substrate after each of the tables moves in a predetermined direction. A mounting section for mounting the electronic component, a winding section for winding the flexible substrate on which the electronic component is mounted, and between the unwinding section and the second table and between the second table and the winding section. A sensor provided on the flexible substrate for detecting the amount of slack, and at least raising the amount of slack to a predetermined amount based on information detected by the sensor. An electronic component mounting device comprising: a control unit that controls movements of the recording unit and the unwinding unit. 2. The electronic component mounting apparatus according to claim 1, wherein a suction hole is provided in the first table to hold and position the flexible substrate by suction. 3. A first receiving portion having the same height as the upper surface of the first table is provided before and after the side of the first table in the transport direction of the flexible substrate, and the flexible substrate is transported onto the first receiving portion. 3. The electronic component mounting device according to claim 1, wherein 4. A second receiving portion having the same height as the upper surface of the first table is provided on the side of the second table before and after in the transport direction of the flexible substrate, and the flexible substrate is transported onto the second receiving portion. 4. The electronic component mounting apparatus according to claim 3, wherein: 5. A holding member for holding a floating flexible substrate at a second receiving portion of the second table.
Electronic component mounting apparatus according to the above. 6. The second receiving portion of the second table is provided with a guide portion for regulating both side ends of the flexible substrate.
Or the electronic component mounting device according to 5. 7. A flexible board, wherein the mounting portion holds and moves the surface mount type electronic component to a predetermined position within a movement range of the first and second tables, and moves the first and second tables. The electronic component mounting device according to claim 1, wherein the electronic component mounting device is mounted after the position is determined. 8. A flexible substrate made of a tape-shaped insulating film which is continuously supplied is placed on a first table of a first and a second table which can be moved in a direction in which the flexible substrate is conveyed and in a direction perpendicular thereto. Holding, moving each of the tables in a predetermined direction to adjust the mounting position of the flexible substrate having slack before and after in the transport direction to the position of the mounting portion holding the surface mount type electronic component, and then mounting the electronic component. An electronic component mounting method for mounting on the flexible substrate.