KR100312531B1 - Surface Mounting Device Having a Tray Feeder - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounter provided with a tray feeder unit capable of quickly and accurately supplying various kinds of semiconductor devices and various electronic components. A gantry portion for moving the mount head assay to mount the component on the printed circuit board installed at the top of the assay, a conveyor system for transferring the printed circuit board installed at the top of the base assay, and the conveyor. A surface mounter for mounting devices of various sizes on a printed circuit board, comprising a tape feeder unit for supplying components mounted on a printed circuit board transferred by a system, and supplying components for mounting on the printed circuit board. Semiconductors of different types on the other side of the tape feeder It is provided additional tray feeder for supplying the vise and classification. The tray feeder section is composed of a supply tray, a storage tray, and a pin miss tray.

Description

Surface Mounting Device Having a Tray Feeder}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounter provided with a tray feeder unit capable of supplying various kinds of semiconductor devices and various electronic components quickly and accurately. More specifically, one side of the surface mounter includes a tape reel feeder unit and the other side unit. The present invention relates to a mounter provided with a tray feeder unit capable of easily and quickly supplying various kinds of semiconductor devices by installing a tray feeder unit.

In recent years in the development of electrical and electronic products, the trend has been to increase the density, miniaturization, and diversification of electronic components, and the development thereof is becoming more and more intense.

In particular, Surface Mounting Technology (SMT) using surface mounters for assembly production of printed circuit boards (PCBs) used in electrical and electronic components is being accelerated.

A surface mounting device (SMD) is a device for mounting electronic components on a printed circuit board. The surface mounting device receives various electronic components from a component supplier and transfers them to a predetermined mounting position on the printed circuit board. An electronic component is mounted on a circuit board.

The surface mounter is classified into a high speed machine and a general purpose machine according to its function, and since the high speed machine is configured to assemble a large number of parts in a short time, the mounting speed is fast and has an advantage that is suitable for mass production, while the mounting precision is low. Since the general purpose machine is configured to be suitable for mounting various parts, the mounting precision is high and the mounting of various parts is possible, and thus, the product has a disadvantage in that productivity is low because the mounting speed is low.

The surface mounter is mounted from a feeder part for supplying mounting parts (hereinafter referred to as a tape feeder), an X-Y gantry part for determining a working position, a conveyor part for conveying a printed circuit board to be worked on, and a tape feeder. It consists of a head part etc. which pick up components one by one and mount them on a printed circuit board.

In general, the surface mounter refers to a device for mounting electronic components including various chips on a printed circuit board (PCB).

1 is a perspective view showing the structure of a conventional surface mounter.

Looking at the structure of the conventional surface mounter in more detail with reference to FIG. 1 as follows.

First, a frame assay 100 for supporting the surface mounter is installed, and a base assay 102 is installed on the upper part of the frame assay 100 to serve as a base, and the base assay 102 is provided. In the upper part of the C), a conveyor system 104 for transferring a printed circuit board is installed, and on the right side thereof, a tape reel feeder part 122 to which various semiconductor devices are supplied is installed.

In addition, an XY gantry 106 is installed in the upper direction of the conveyor system 104 to move back, front, left, and right to mount the electronic component on the upper portion of the printed circuit board (PCB) transferred by the conveyor system 104. The XY gantry portion is composed of X-axis and Y-axis gantry frames 109a and 109b respectively supporting the X-axis and the Y-axis.

The X- and Y-axis gantry frames 109 configured as described above are provided to move the head assay 108 for mounting the components on the printed circuit board conveyed by the conveyor system 104.

The tape feeder 122 is a semiconductor device contained in the tape reel when the printed circuit board is supplied by the conveyor system 104 by hanging a tape reel containing a plurality of semiconductor devices of different sizes, the tape reel receiving unit The head assay 108 is operated to be mounted.

In this case, a head 107 is installed in the head assay 108, and a nozzle 120 is installed in the head 107 to adsorb the component. Vision 114 is provided for inspection so as to be mounted at the correct position of the substrate. In addition, the conveyor system 104 is provided with a stopper assay 110 so that the printed circuit board is transported and stopped at the working position.

However, since the device is supplied only by the tape feeder installed on one side, the surface mounter of the above-described configuration does not have a smooth mounting when mounting the printed circuit board, and it is possible to mount devices of different sizes. In this case, a tape reel containing a device suitable for the situation needs to be hung on the tape reel receiving portion of the tape feeder, thereby causing inconvenience.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem in the related art, and an object thereof is to provide a tray feeder unit capable of supplying another device on the other side where a tape feeder unit is installed, and supply various parts mounted on a printed circuit board. In addition, the present invention provides a surface mounter equipped with a tray feeder unit for rapidly improving the mounting speed of components during mounting.

1 is a perspective view showing the structure of a conventional surface mounter;

2 is a perspective view showing the structure of a surface mounter provided with a tray feeder unit of the present invention;

3 is a plan view of FIG. 2.

<Description of the code | symbol about the principal part of drawing>

10: elevator plate 12: tray guide

14 tray 16: reel storage unit

18: tape reel 20: pin miss tray

22: supply tray 24: storage tray

26: sewing machine conveyor

200: base assay 202: tape feeder

204: Conveyor part 206: Gantry part

208: tray feeder portion 210: X-axis frame

212: LM block 214: Y-axis frame

In order to achieve the above object, the present invention provides a frame assay, a base assay installed on top of the frame assay, and mounted on the printed circuit board mounted on the base assay. A gantry for moving a head assay, a conveyor system installed on an upper portion of the base assay to transfer a printed circuit board, and a tape for supplying components mounted on a printed circuit board transferred by the conveyor system. A surface mounter configured to mount devices of various sizes on a printed circuit board, the feeder unit comprising: supplying and classifying different types of semiconductor devices to the other side of a tape feeder unit for supplying components for mounting on the printed circuit board Tray feeder unit characterized in that the tray feeder unit is installed Provides an deployed surface-mounted.

In addition, the tray feeder unit is a supply tray for supplying a semiconductor device for mounting on the printed circuit board, and the semiconductor device supplied to the supply tray is absorbed by the surface mounter head to position the step before mounting on the printed circuit board. And a pin miss tray for accommodating the pin miss of the semiconductor device by accommodating vision miss when the semiconductor device contained in the storage tray is mounted on a printed circuit board by absorbing the pin tray. Provided is a surface mounter provided with a tray feeder portion.

Hereinafter, with reference to the accompanying drawings illustrating a structure of the surface mounter is installed tray feeder of the present invention as follows.

2 is a perspective view showing the structure of a surface mounter provided with a tray feeder unit of the present invention, Figure 3 is a plan view of FIG.

The surface mounter provided with the tray feeder portion of the present invention has a different kind of semiconductor device (or electronic component) on the other side of the tape feeder portion 202 for supplying electronic components for mounting on a printed circuit board (PCB). Tray feeder unit 208 for supplying and sorting is provided.

The tray feeder unit 208 prints by supplying a supply tray 22 for supplying a semiconductor device for mounting on the printed circuit board and a semiconductor device supplied to the supply tray 22 by a head of a surface mounter. Pin-missed of the semiconductor device when the storage tray 24 positioned in the step before mounting on the circuit board and the semiconductor device contained in the storage tray 24 are absorbed and mounted on the printed circuit board. Or a pin miss tray for accommodating the pinned semiconductor device by detecting a vision device (Vision, for example, a vision device such as a ccd camera) or not. 20).

First, referring to FIGS. 2 and 3, a frame assay 200 for supporting a surface mounter is installed, and a conveyor system for transferring a printed circuit board is disposed on an upper portion of the frame assay 200. 204 is installed, and the gantry portion 206 moving in front, rear, left and right to mount the electronic component on the upper portion of the printed circuit board transferred by the conveyor system 204 in the upper direction of the conveyor system 204 is provided. The gantry portion 206 is composed of X- and Y-axis frames 210 and 214 supporting the X and Y axes, respectively.

At this time, the X-axis frame 210 is fixed to the upper portion of the linear motion (LM) block 212 that slides along the rail of the Y-axis frame 214 is installed to move along the Y-axis frame 214 The right side of the X-axis frame 210 is provided with a tape feeder unit 202 for accommodating a plurality of tape reels 18 containing a semiconductor device, and the tape feeder unit 202 is provided with a semiconductor. A sewing machine conveyor 26 is provided for judging the presence or absence of a pin miss of a device and taking out a semiconductor device that has become a pin miss. A variety of devices are supplied and classified at the opposite side corresponding to the tape feeder 202. The tray feeder part 208 which can be stacked is provided.

The tray feeder unit 208 is provided with an elevator plate 10 which is driven by a driving motor (not shown) and moves up and down, and the four trays of the elevator plate 10 are not separated from each other. The tray guide 12 is formed in the corner. At this time, each tray 14 accommodated in the elevator plate 10 is provided with two supply trays 22 to which semiconductor devices are supplied, and the supply trays 22 between the two supply trays 22. The two storage trays 24 for locating the semiconductor devices accommodated in the circuit board to be mounted on the printed circuit board are skipped, and the semiconductor devices supplied from the storage trays 24 are mounted on the printed circuit board. When the presence or absence of pin miss is determined by vision, the pin miss tray 20 for accommodating the pin miss semiconductor device is provided on one side.

As such, the structure of the surface mounter in which the tray feeder part of the present invention is provided can be supplied and stored continuously so that the work time can be shortened and various kinds of semiconductor devices can be easily replaced.

The surface mounter provided with the tray feeder part of the present invention as described above can supply more various kinds of semiconductor devices by the tape feeder part and the tray feeder part respectively provided on the left and right sides of the semiconductor device housed in the tray feeder part. It is easy to supply and receive, which has the advantage of continuous work.

In addition, the tray feeder part is easy to replace, the structure is simple, there is an advantage that the durability of the device is improved, the work time is faster, there is an effect that the productivity is improved.

Claims (1)

A frame assay 200, a base assay 102 installed on top of the frame assay, and a mount assembly mounted on top of the base assay to move the mount head assay to mount components on a printed circuit board. Tape for supplying the gantry part 206, the conveyor system 204 which is installed in the upper part of the base assay for conveying a printed circuit board, and the component mounted in the printed circuit board conveyed by the conveyor system. In the surface mounter which is composed of the feeder unit 202 and mounts devices of various sizes on a printed circuit board, the types are different from each other on the other side of the tape feeder unit 202 for supplying components for mounting on the printed circuit board. A tray feeder unit 208 for supplying and classifying other semiconductor devices is provided, The tray feeder unit 208 includes a supply tray 22 for supplying a semiconductor device for mounting on the printed circuit board, and a step of absorbing the semiconductor device supplied to the supply tray as a head and mounting the printed circuit board on the printed circuit board. A pin for accommodating a pin miss of the semiconductor device by detecting the presence or absence of a pin miss of the semiconductor device when the semiconductor device contained in the storage tray and the semiconductor device contained in the storage tray are absorbed and mounted on a printed circuit board. Surface mounter is provided with a tray feeder portion, characterized in that consisting of a miss tray (20).