KR100328344B1 - Feeding System of Surface Mount Device - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a feeding device for a surface mounter. In particular, a surface mounter capable of supplying various kinds of semiconductor devices continuously and rapidly by installing a tape feeder containing an IC (INTERGRATED CIRCUIT) at one side of the surface mounter It relates to a feeding device of.

The present invention provides a frame assay, a base assay installed on an upper portion of the frame assay, and a gantry mounted on an upper portion of the base assay to move a mount head assay to mount a component on a printed circuit board. And a tape feeder for supplying electronic components mounted on the printed circuit board carried by the conveyor system, and a conveyor system installed at the upper portion of the base assay. In a surface mounter for mounting a device on a printed circuit board, two sets are provided in a set so that the electronic components for mounting on the printed circuit board can be continuously supplied and tapes can be supplied at the same time or sequentially. It is characterized in that the feeder assay is installed.

Description

Feeding System of Surface Mount Device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounter for mounting surface mount components including various chips on a printed circuit board (PCB), so that various types of semiconductor devices and various electronic components can be supplied quickly and accurately. More specifically, a surface mounter capable of supplying various kinds of semiconductor devices continuously and rapidly by installing a tape feeder containing an IC (INTERGRATED CIRCUIT; hereinafter referred to as an 'IC') on one side of the surface mounter. It relates to a feeding device of.

In recent years in the development of electrical and electronic products, the trend has been to increase the density, miniaturization, and diversification of electronic components, and the development thereof is becoming more and more intense.

In particular, Surface Mounting Technology (SMT) using surface mounters for assembly production of printed circuit boards (PCBs) used in electrical and electronic components is being accelerated.

The surface mounter is a core equipment of the surface mount assembly equipment for mounting a surface mounting device (SMD) on a printed circuit board. The surface mounter receives various surface mount components from a component supplyer and transfers them to the mounting position of the printed circuit board. Equipment to be mounted on the substrate.

Types are classified into high-speed machines and general-purpose machines according to their functions. The high-speed machines are configured to assemble many parts in a short time, so the mounting speed is high, which is suitable for mass production, but the mounting precision is low. Since the machine is configured to be suitable for the mounting of various parts, the mounting precision is high and the mounting of various parts is possible.

The surface mounter is a feeder for supplying mounting parts (hereinafter referred to as a tape feeder), an X-Y gantry portion for determining a working position, a conveyor portion for conveying a printed circuit board to be worked on, and a mounting component from a tape feeder. It consists of a head and the like which are picked up in sequence and mounted on a printed circuit board.

In general, the surface mounter refers to a device that mounts various electronic components including chips on a printed circuit board (PCB) and is also called a MOUNTER.

1 is a perspective view showing the structure of a conventional surface mounter.

Looking at the structure of the conventional surface mounter in more detail with reference to FIG. 1 as follows.

First, a frame assay 100 for supporting the surface mounter is installed, and a base assay 102 is installed on the upper part of the frame assay 100 to serve as a base, and the base assay 102 is provided. ), A conveyor system 104 for transferring a printed circuit board is installed, and a tape feeder 122 for supplying various semiconductor devices is provided on the right side thereof.

In addition, in the upper direction of the conveyor system 104, an XY gantry 106 is provided which moves back, front, left, and right to mount electronic components on the upper part of the printed circuit board transferred by the conveyor system 104. The XY gantry portion is composed of respective gantry frames 109 supporting the X and Y axes.

In the gantry frame 109 configured as described above, a mounter head assay 108 for mounting a component on a printed circuit board conveyed by the conveyor system 104 is installed to be movable.

The tape feeder 122 hangs a tape reel containing a plurality of semiconductor devices of different sizes and hangs the tape reel in a tape reel accommodating portion, and when the printed circuit board is supplied by the conveyor system 104, Mounter head assay 108 is operated to be adsorbed and mounted on a printed circuit board.

In this case, a mounter head 107 is installed in the mounter head assay 108, and a nozzle 120 for adsorbing parts is installed in the mounter head 107 to vertically move, and the nozzle 120 Vision (114) is installed to inspect the components adsorbed by the chuck to be mounted at the correct position on the printed circuit board. In addition, the conveyor system 104 is provided with a stopper assay 110 so that the printed circuit board is transported and stopped at the working position, and a pusher 116 is installed to raise the printed circuit board. The magnet 118 is installed at the bottom to fix the pusher 116.

In addition, the conveyor system 104 for transferring a printed circuit board is provided with a pair of guides (23, 24) facing each other.

However, in the prior art as described above, the device is supplied by a tape feeder installed at one side. When all the ICs accommodated in the tape feeder are mounted during the mounting work, the operation of the equipment should be stopped and the tape feeder newly accommodated with the IC should be replaced. There was a disadvantage.

As a result, it took a long time, did not provide a smooth supply when mounting printed circuit boards, and when mounting devices of different sizes, the tape reel containing the device suitable for the situation could be reeled. There is a problem that comes with the inconvenience of working because you have to walk on the payment.

Accordingly, the present invention has been made to solve such a conventional problem, and an object thereof is to provide a feeding apparatus of a surface mounter which can be installed to replace the tape feeder assay as a whole so as to supply various kinds of devices. .

In addition, the feeder of the surface mounter can provide various parts to be mounted on the printed circuit board by installing a tape feeder assay, and use them alternately or install both at the same time to improve the mounting speed of the components at the time of mounting. To provide.

1 is a perspective view showing the structure of a conventional surface mounter;

Figure 2 is a perspective view showing the structure of the surface mounter of the present invention,

Figure 3 is a perspective view showing the structure of the feeding device of the surface mounter of the present invention,

4 is a bottom perspective view of FIG. 3.

*** Explanation of symbols for main parts of drawing ***

10, 12, 14: Slider blocks 16, 18, 20: Slide plate

22: clamp block 24: interface unit

26: handle 28: holder

30: holder 32: tape feeder

200, 202: Feeding device assay

Accordingly, in order to achieve the above object, the present invention provides a frame assay, a base assay installed on top of the frame assay, and a component mounted on a printed circuit board mounted on the base assay. Supplying a gantry portion for moving the mount head assay, a conveyor system installed on the base assay to transfer the printed circuit board, and an electronic component mounted on the printed circuit board transferred by the conveyor system A surface mounter configured to mount devices of various sizes on a printed circuit board, which is composed of a tape feeder, and installs two in a group so as to continuously supply electronic components for mounting on the printed circuit board. Tape feeder assays are installed to feed or sequentially Provided is a feeding apparatus of the surface mounter.

The tape feeder assay also includes a plurality of slide plates; And a plurality of slider blocks installed to move back and forth along the slide plate, and a cradle and a stationary fixed between the slider blocks so that a plurality of tape feeders fixed between the plurality of slider blocks to accommodate electronic components can be installed. .

The tape feeder assay also includes an interface unit at one rear side.

In addition, the slide block is provided with a plurality of clamp blocks for determining the position so that the electronic component can be accurately supplied by the tape feeder in which the electronic component is accommodated on one side.

(Example)

Hereinafter, the feeding device structure of the surface mounter of the present invention with reference to the accompanying drawings.

2 is a perspective view showing the structure of the surface mounter of the present invention, Figure 3 is a perspective view showing the structure of the feeding device of the surface mounter of the present invention, Figure 4 is a bottom perspective view of FIG.

First, the feeding device of the surface mounter of the present invention is a surface mounter for mounting devices of various sizes on a printed circuit board, and installs two in a set so as to continuously supply electronic components for mounting on the printed circuit board. Tape feeder assays (200, 202) are installed to supply electronic components at the same time or sequentially supply, the tape feeder assay (200, 202) and a plurality of slide plates (16, 18, 20); A plurality of slider blocks (10, 12, 14) installed to move back and forth along the slide plate (16, 18, 20) and the plurality of slider blocks (10, 12, 14) is fixed to accommodate electronic components It consists of a cradle 28 and a fixed bracket 30 fixed between the slider block so that a plurality of tape feeder 32 can be installed, the tape feeder assay (200, 202) has an interface unit 25 at one rear The slide blocks 10, 12, and 14 are installed with a plurality of clamp blocks 22 corresponding to each other so as to accurately position the electronic parts by a tape feeder 32 in which the electronic parts are accommodated. do.

Referring to the above-described drawings in more detail as follows.

First, a base assay 100 for supporting a surface mounter is installed, and a conveyor system 204 for transporting a printed circuit board is installed on an upper portion of the base assay 100, and the conveyor system 204 is provided. ), A gantry portion 206 moving forward, backward, left and right for mounting electronic components on the upper portion of the printed circuit board transferred by the conveyor system 204 is installed. Each of the frames 210 and 214 supporting the X and Y axes.

At this time, the X-axis frame 210 is fixed to the upper portion of the LM block 212 sliding along the rail of the Y-axis frame 214 is installed to move along the Y-axis frame 214, The right side of the X-axis frame 210 is provided with tape feeder assays 200 and 202 for accommodating a plurality of tape reels (not shown) containing semiconductor devices.

In addition, the tape feeder assays 200 and 202 are provided with a plurality of slide blocks 10, 12, 14 corresponding to one side of the plurality of slide plates 16, 18, 20, respectively, and slide blocks 10, 12. (14) is installed to be able to move back and forth along one side of the slide plates (16, 18, 20). In this case, the slide block 10 and the slide plate 18 are positioned parallel to each other at a predetermined distance, and the slide block 12 and the slide plate 20 are also positioned parallel to each other by a predetermined distance.

In addition, a cradle 28 is connected between the slide block 10 and the slide plate 18 so that a plurality of tape feeders 32 in which the IC is accommodated can be fixed. A fixing stand 30 is connected between the slide block 10 and the slide plate 18 so as to support the entirety of the 32. At this time, the slide block 10 is installed to move along one side of the slide plate 16, the one side portion of the clamp block to reach a position that can accurately supply the IC of the tape feeder 32 ( 22) is installed.

Subsequently, the slide block 12 is installed on one side of the slide plate 18 so as to be movable back and forth, and the cradle 28 and the fixing table 30 are disposed between the slide block 12 and the slide plate 20. Is installed, and the tape feeder 32 is fixed to the holder 28 and the holder 30.

One interface unit 25 is provided at one rear portion of the tape feeder assays 200 and 202, and a handle 26 is installed at an upper portion of each interface unit 25 to provide a tape feeder assay 200 and 202. It is easy to push in the direction of the arrow.

Thus, the feeding device structure of the surface mounter of the present invention can shorten the working time by simultaneously supplying the electronic parts contained in the tape feeder by using two tape feeding devices as one set, and supplying the electronic parts from one feeding device. During the process, the electronic parts can be accommodated in the other feeding device, alternately supplied, and can be produced without stopping the operation of the equipment.

As described above, the feeding device structure of the surface mounter of the present invention can shorten the working time by simultaneously supplying the electronic parts contained in the tape feeder by using two tape feeding devices as one set, and the electronic parts can be removed from one feeding device. During supply, electronic parts can be accommodated in the other feeding device and alternately supplied, allowing continuous production without stopping the equipment.

Therefore, since the surface mounting work is continuously performed, the working time is shortened, and various kinds of semiconductor devices can be easily replaced, thereby improving productivity.

Claims (4)

A frame assay, a base assay installed on an upper portion of the frame assay, a gantry portion provided on an upper portion of the base assay, and a mount head assay installed to mount a component on a printed circuit board; It is composed of a conveyor system for transferring a printed circuit board mounted on the base assay and a tape feeder assay for supplying electronic components mounted on the printed circuit board carried by the conveyor system. In the surface mounter for mounting on a printed circuit board, The tape feeder assay may include a plurality of slide plates, a plurality of slider blocks installed to move back and forth along the plurality of slide plates, and a plurality of tape feeders fixed between the plurality of slider blocks to accommodate electronic components. It consists of a cradle and a fixture fixed between the slider blocks so that The tape feeder assay is characterized in that the surface of the surface mounter is configured to supply the electronic components at the same time or sequentially to install a pair of two to supply the electronic components for mounting on the printed circuit board continuously Feeding device. delete The surface mounter of claim 1, wherein an interface unit is installed at one side of the tape feeder assay, and a handle is installed at an upper portion of the interface feeder to push and pull the tape feeder assay. Feeding device. The surface mounter according to claim 1, wherein the slide block is provided with a plurality of clamp blocks correspondingly positioned at one side thereof so that the electronic component can be accurately supplied by a tape feeder in which the electronic component is accommodated. Feeding device.