JP3870585B2 - Electronic component mounting apparatus and mounting method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting a surface mount type electronic component on a flexible tape-like substrate having flexibility, and a mounting method thereof.
[0002]
[Prior art]
A conventional electronic component mounting apparatus for mounting a surface mount type electronic component on an insulating substrate will be described with reference to an external perspective view of FIG.
[0003]
In the figure, reference numeral 1 denotes an insulating substrate whose outer shape is processed into a predetermined shape, and is positioned and held on the table 3 of the electronic component mounting apparatus 2.
[0004]
Reference numeral 3A denotes a mounting portion of the surface mount type electronic component 4, which can be moved within the range of the table 3 while the electronic component 4 is sucked and held by a slide arm connected so as to be movable in the X, Y, and Z directions. It is arranged.
[0005]
In the conventional electronic component mounting apparatus 2 configured as described above, when the electronic component 4 is mounted on the insulating substrate 1 placed on the table 3, the electronic component 4 supplied by the component supply unit 5 is first mounted. The part 3A is sucked and held, and then carried to the mounting position of the electronic component 4 on the insulating substrate 1 and the mounting part 3A descends to mount the electronic component 4 at a predetermined position on the insulating substrate 1, and then the mounting unit 3A returns to the original position, and the above operation is repeated to replace the insulating substrate 1 after all the electronic components 4 are mounted on the insulating substrate 1.
[0006]
[Problems to be solved by the invention]
However, in order to cope with the recent downsizing and higher performance of electronic devices, the insulating substrates used for these devices are often made of rigid insulating films made of flexible insulating films. There is a high tendency to use a flexible substrate made of a thin insulating film due to an increase in “bending use” in a downsized apparatus, and the insulating substrate 1 whose outer shape is processed into a predetermined shape is placed on the table 3. In the above-described conventional electronic component mounting apparatus 2 that mounts the electronic component 4 in a fixed manner, it is difficult to handle the flexible substrate when the flexible substrate is attached to or detached from the table 3.
[0007]
The present invention solves such a conventional problem, and an object of the present invention is to provide an electronic component mounting apparatus and a mounting method thereof that can efficiently mount electronic components on a flexible substrate.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the present invention uses a flexible substrate made of a tape-like insulating film, a first table that moves only in the conveyance direction of the flexible substrate, and a first table that holds the first table and is orthogonal to the conveyance direction. Flexible by holding the flexible substrate on the first table consisting of the second table that moves only in the direction in which the second table moves, and moving the first and second tables in a predetermined direction. The mounting position of the electronic component on the substrate is aligned, and then the surface mounting type electronic component held by the mounting portion is mounted on the flexible substrate.
[0009]
According to this mounting method, the slack of the flexible substrate provided near the second table can absorb the kinks of the flexible substrate even when the first and second tables move in a predetermined direction. It is possible to obtain an electronic component mounting apparatus with high work efficiency and a mounting method thereof that can efficiently mount an electronic component on a flexible substrate and can automatically transport the flexible substrate before and after mounting the electronic component.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, a flexible substrate made of a tape-like insulating film having flexibility is provided, and the flexible substrate is conveyed while holding the flexible substrate unwound. A first table that moves only in a direction, a second table that holds the first table and moves only in a direction orthogonal to the conveyance direction of the flexible substrate, and the flexible table after each table moves in a predetermined direction. A mounting portion for mounting a surface mount type electronic component on the upper surface of the substrate, a winding portion for winding the flexible substrate on which the electronic component is mounted, a portion between the unwinding portion and the second table, and the second table And a sensor for detecting the amount of sag provided on the flexible substrate between the winding portion and the winding part, and the amount of sag is set to a predetermined amount based on detection information of the sensor. At least is obtained by the winding unit and the control unit for controlling the movement of the unwinding unit and the electronic component mounting apparatus comprising a, a sagging of the flexible substrate which is provided in the vicinity of the second table, the first and second tables as Since it is possible to reliably absorb kinks and the like of flexible substrates that are likely to occur during movement in a predetermined direction, after mounting predetermined electronic components using a tape-shaped flexible substrate as a substrate for mounting electronic components Since the flexible substrate can be automatically conveyed, the electronic component mounting apparatus with excellent work efficiency can be realized.
[0011]
The invention of claim 2 is the invention of claim 1, wherein the suction holes provided in the first table, which is positioned by sucking and holding the flexible substrate, in addition to the effect of the invention described in claim 1 Even when a very thin flexible board is used, the flexible board can be securely sucked and held on the first table with a simple configuration, and the flexible board can be moved when the first and second tables are moved. The positional deviation can be reduced, and the electronic component can be mounted at a predetermined position with high accuracy.
[0012]
According to a third aspect of the present invention, in the first or second aspect of the present invention, the first receiving portion having the same height as the upper surface of the first table is formed on the side of the first table, before and after the conveyance direction of the flexible substrate. provided, the flexible substrate is obtained by so as to convey on said first receiving portion, the first table from the first receiving unit, also the transport of the same height of the flexible board referred to the first receiving part from the first table Since the path can be configured, the flexible substrate can be smoothly conveyed.
[0013]
The invention according to claim 4 is the invention according to claim 3, wherein a second receiving portion having the same height as the upper surface of the first table is provided on the side of the second table, before and after the conveyance direction of the flexible substrate, the flexible substrate is obtained by so as to convey onto the second receiving portion, in addition to the effect of the invention described in claim 3, when the movement of the second moving table and the direction perpendicular the conveying direction of the flexible substrate In addition, since the flexible substrate is placed on the second receiving portion, the flexible substrate can be prevented from being twisted or kinked, and the mounting accuracy of the electronic component can be improved.
[0014]
The invention according to claim 5 is the invention according to claim 4, wherein a pressing member for pressing the floating of the flexible substrate is provided in the second receiving portion of the second table. In addition to the above-described operation, the electronic component can be mounted on the flexible substrate in a state where the upward floating of the flexible substrate is pressed by the pressing member, so that the mounting accuracy of the electronic component can be further improved.
[0015]
Invention according to claim 6, in the invention described in claim 4 or 5, the second receiving portion of the second table, which has a guide portion for regulating both side edge of the flexible substrate, the second table However, even when the flexible substrate moves in a direction in which twisting or twisting is likely to occur, both ends of the flexible substrate are always regulated by the guide portions, so that the occurrence of twisting and twisting can be reduced. It is what you have.
[0016]
According to a seventh aspect of the present invention, in the invention according to any one of the first to sixth aspects, the mounting portion is a surface mount type electronic component up to a predetermined position within the moving range of the first and second tables. with holds and moves, by moving the first and second tables is intended to be mounted later determine the position of the flexible substrate, the first and also during the round trip time go get electronic component of the mounting portion Since the mounting position of the electronic component can be adjusted by moving the two tables, the mounting efficiency of the electronic component can be improved.
[0017]
The invention according to claim 8, holding the tape-shaped flexible substrate made of an insulating film, the first table and the first table is movable only in the conveying direction in the same direction of the flexible substrate is supplied continuously to above both retained on said second table movable only in the direction perpendicular to the conveying direction of the flexible substrate said first table, having a sagging before and after the conveying direction by moving the respective table in a predetermined direction after adjusting the position of the mounting portion to be mounted position of the flexible substrate to hold the surface mount electronic component, an electronic component mounting method for mounting an electronic component on the flexible substrate, slack the tape-like flexible substrate allowed to be held on the first table, Te in the case of moving the first and second table in a predetermined direction The looped flexible substrate difficult such kinks occurred high mounting accuracy of the electronic components, and has an effect of good electronic component mounting method of the working efficiency can be continuously supplied to the flexible substrate can be obtained.
[0018]
Embodiments of an electronic component mounting apparatus and a mounting method according to the present invention will be described below with reference to FIGS.
[0019]
In addition, the same code | symbol is attached | subjected to the part of the same structure as the part demonstrated by the term of the prior art, and description is abbreviate | omitted.
[0020]
1 is an external perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a table portion that is the main part, and FIG. 3 is a perspective view of a transport part that is the main part. In the figure, reference numeral 11 denotes a flexible substrate made of a tape-like insulating film having flexibility, which is sequentially supplied from the unwinding portion 12 of the present apparatus and conveyed onto the first and second tables 13 and 14. Yes.
[0021]
The first table 13 is configured to be movable along the guide rail 15 provided on the upper surface of the second table 14 only in the front-rear direction, which is the same direction as the conveyance direction of the flexible substrate 11, while the second table 14 is The first table 13 is held along a guide rail 17 provided on the bottom plate portion 16, and both are configured to be movable only in a direction orthogonal to the conveyance direction of the flexible substrate 11.
[0022]
The first and second tables 13 and 14 protrude forward and backward in the conveyance direction of the flexible substrate 11 and have the first and second receiving portions 18 and 19 (see FIG. 2) having the same height as the first table 13. A sectional view and a perspective view of FIG. 3 are provided respectively. The second receiving portion 19 is provided with a first and a second table when the first and second tables 13 and 14 are moved in a predetermined direction. An escape groove 20 corresponding to the amount of movement of the first table 13 is provided so that the receiving portions 18 and 19 do not interfere with each other.
[0023]
Further, the second table 14 is provided with a guide portion 21 for suppressing twisting or the like during the conveyance of the flexible substrate 11, and the flexible substrate generated during the conveyance or the like above the second receiving portion 19. 11 is provided.
[0024]
In the above configuration, the tape-like flexible substrate 11 supplied from the unwinding portion 12 is first inserted through the through hole 21A of the guide portion 21 from the second receiving portion 19 on the unwinding portion side of the second table 14 to the first receiving portion. 18 is held by the first table 13 via 18 and is further wound by the winding portion 23 from the first receiving portion 18 on the winding portion side through the through hole 21A of the guide portion 21 and the second receiving portion 19 of the second table 14. It has been taken.
[0025]
Further, in this apparatus, a slack 11A is provided on the flexible substrate 11 between the unwinding section 12, the winding section 23 and the second receiving section 19 attached to the corresponding second table 14. A sensor 24 is provided on the side of the sag 11A so that the amount of sag is always detected, and the detected information is input to a control unit (not shown) to make a predetermined determination. The amount of sag is always maintained at a predetermined amount by controlling the amount of operation of the take-out unit 12 and the winding unit 23 and the like.
[0026]
Reference numeral 25 denotes a mounting portion in which the arm 25B is connected to the central support portion 25A, and the surface mounting type electronic component 4 supplied by the component supply portion 5 is held by the holding portions 26 provided at both end portions of the arm 25B. In this state, the holding unit 26 is rotated and moved so as to be always at the same position with respect to the position of the entire apparatus, and then the mounting unit 25 is lowered so that the electronic component 4 can be mounted on the flexible substrate 11. ing.
[0027]
In the electronic component mounting apparatus having the above configuration, when the electronic component 4 is mounted on the flexible substrate 11, the conveyed flexible substrate 11 is first sucked and held by the suction holes 13 </ b> A of the first table 13. Only move forward and backward in the conveyance direction of the flexible substrate 11 to align the position of the electronic component 4 in the front-rear direction with respect to the mounting position of the electronic component 4 and subsequently hold down the second table 14 to prevent the flexible substrate 11 from floating and the like. The member 22 sandwiches the flexible substrate 11, and in this state, the second table 14 moves in a direction orthogonal to the conveyance direction of the flexible substrate 11 to align the position in the orthogonal direction with respect to the mounted position, The electronic component 4 is moved downward by rotating the holding portion 26 holding the electronic component 4 to the mounting position of the electronic component. Is mounted on the flexible substrate 11 and the above-described mounting operation is repeated, and after all the electronic components 4 are mounted within the range of the predetermined flexible substrate 11, the flexible substrate 11 is conveyed by a predetermined amount. It has become.
[0028]
Next, the transfer operation will be briefly described. When the mounting of the predetermined electronic component 4 is completed as described above, the second table 14 is first returned to the initial position, and the pressing member 22 is raised to raise the flexible substrate. 11 is returned to the free state, and then the first table 13 moves toward the winding portion by a predetermined conveying distance while the flexible substrate 11 is sucked, and again holds the flexible substrate 11 at this position. And the suction of the first table 13 is released.
[0029]
Then, the first table 13 returns to the initial position, and the flexible substrate 11 is sucked and held again, and the conveyance is finished by releasing the pressing member 22.
[0030]
As described above, in the electronic component mounting apparatus, the flexible substrate 11 is placed on the same height conveyance path constituted by the first and second receiving portions 18 and 19 and the first table 13, and the electronic substrate is mounted on the electronic substrate mounting apparatus. The mounted portion of the component 4 is sucked and held by the first table 13, and both side ends of the flexible substrate 11 before and after the component 4 are regulated by the through holes 21 </ b> A of the guide portion 21. Since it is configured to be pressed by the pressing member 22, unnecessary twisting and floating of the flexible substrate 11 can be reduced.
[0031]
Further, due to the slack 11A provided in the flexible substrate 11 in addition to the above-described configuration, the flexible substrate 11 can be twisted, kinked or the like when the first and second tables 13 and 14 are moved in a predetermined direction. Therefore, the electronic component 4 can be mounted with high accuracy.
[0032]
Further, even when the amount of the sag 11A is excessive or insufficient due to the conveyance of the flexible substrate 11 or the like, the sensor 24 always detects the amount of the sag 11A and controls a control unit (not shown) based on the detected information. ) Operates the unwinding portion 12 or the winding portion 23 to control the amount of slack 11A to be a constant amount, so that stable mounting conditions for the electronic component 4 can always be secured.
[0033]
As described above, according to the electronic component mounting apparatus and a mounting method according to the invention, used as a tape-shaped as a flexible substrate 11, while slack 11A while held in the first table 13, the first Since the electronic component 4 can be mounted after the first and second tables 13 and 14 are moved in a predetermined direction and the mounting position of the electronic component 4 on the flexible substrate 11 is determined, the tape-like flexible substrate 11 is kinked or the like. The electronic component 4 can be accurately mounted at a predetermined position, and the flexible substrate 11 can be automatically conveyed thereafter.
[0034]
In the above embodiment, the flexible substrate 11 is sucked and held on the first table 13 as an example. However, the flexible substrate 11 is provided with a pilot hole and the first table 13 is provided with a pilot pin. It may be conveyed as a configuration to be combined, or other methods may be used.
[0035]
Further, the configuration of the mounting portion 25 and the method of moving the tables 13 and 14 are not limited to those described above, and various types can be used. Furthermore, the mounting components on the flexible substrate 11 are also of surface mounting type. Of course, in addition to the electronic component 4, members constituting the device used can be directly mounted on the flexible substrate 11.
[0036]
【The invention's effect】
As described above, according to the present invention, a tape-shaped flexible substrate is used, and surface-mount type electronic components and the like can be continuously and accurately mounted, and automatic conveyance can be easily performed. A practically advantageous effect that an electronic component mounting apparatus and a mounting method thereof can be obtained is obtained.
[Brief description of the drawings]
FIG. 1 is an external perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a table portion that is the main part. 4] External perspective view of a conventional mounting device [Explanation of symbols]
4 Electronic component 5 Component supply part 11 Flexible substrate 11A Slack 12 Unwinding part 13 First table 13A Suction hole 14 Second table 15, 17 Guide rail 16 Bottom plate part 18 First receiving part 19 Second receiving part 20 Escape groove 21 Guide Part 21A Through-hole 22 Holding member 23 Winding part 24 Sensor 25 Mounting part 25A Central support part 25B Arm 26 Holding part

Claims (8)

  An unwinding unit for supplying a flexible substrate made of a tape-like insulating film having flexibility; a first table that moves only in the conveying direction of the flexible substrate while holding the unrolled flexible substrate; and A second table that holds only one table and moves only in a direction perpendicular to the conveyance direction of the flexible substrate, and a surface mount type electronic component is mounted on the upper surface of the flexible substrate after each table moves in a predetermined direction. And a winding unit for winding the flexible substrate on which the electronic component is mounted, and a flexible substrate between the unwinding unit and the second table and between the second table and the winding unit. And a sensor for detecting the amount of sag, and at least the winding portion so that the amount of sag is a predetermined amount based on detection information of the sensor. Electronic component mounting apparatus comprising a control unit for controlling the movement of the fine unwinding unit.   The electronic component mounting apparatus according to claim 1, wherein a suction hole is provided in the first table to position the flexible substrate by suction.   Claims in which a first receiving portion having the same height as the upper surface of the first table is provided on the side of the first table before and after the conveying direction of the flexible substrate, and the flexible substrate is conveyed on the first receiving portion. Item 3. The electronic component mounting apparatus according to Item 1 or 2.   A second receiving portion having the same height as the upper surface of the first table is provided on the side of the second table before and after the conveying direction of the flexible substrate, and the flexible substrate is conveyed on the second receiving portion. 3. The electronic component mounting apparatus according to 3.   The electronic component mounting apparatus according to claim 4, wherein a pressing member that suppresses floating of the flexible board is provided in the second receiving portion of the second table.   The electronic component mounting apparatus according to claim 4 or 5, wherein guide portions for restricting both side ends of the flexible substrate are provided in the second receiving portion of the second table.   After the mounting part moves while holding the surface mount type electronic components to a predetermined position within the movement range of the first and second tables, and after moving the first and second tables to determine the position of the flexible substrate The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is mounted. A flexible substrate made of a tape-like insulating film that is continuously supplied, a first table that can be moved only in the same direction as the conveyance direction of the flexible substrate, and the conveyance direction of the flexible substrate that holds the first table together Surface mounting of the mounting position of the flexible substrate that is held on the first table of the second table that can move only in a direction orthogonal to the first table, and that has a slack in the front and rear in the transport direction by moving each table in a predetermined direction An electronic component mounting method in which an electronic component is mounted on the flexible substrate after being matched with a position of a mounting portion holding a type of electronic component.

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