JP2004039818A - Electronic part packaging method and packaging line thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently and surely package parts for not only small-sized and intermediate-sized substrates but also large-sized substrates by juxtaposing a plurality of part mounting machines for the small-sized and intermediate-sized substrates in a part packaging line. <P>SOLUTION: The part packaging line adjoins and juxtaposes a plurality of rows of track conveyors 21 and 22 juxtaposed on a frame 11, and a plurality of the part packaging machines 10 having a packaging head 70 moved with an XY robot 41. Each part packaging machine 10 can convert a plurality of two-row track conveyors 21 and 22 into one wide track conveyor. In addition, the XY robot 41 is composed of a first X-axis slider 51 and a second X-axis slider 61, and a packaging head is slid in two stages. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting method and an electronic component mounting line in which a plurality of XY robot type component mounters are arranged and electronic components are mounted on a printed circuit board.
[0002]
[Prior art]
Conventionally, as the XY robot type component mounter, a mounter for a small / medium-sized substrate with a substrate width (width in the X-axis direction) of about 250 to 300 mm and a mounter for a large-sized substrate with a width of 600 mm or more have been used. If the board on which the components are mounted is both a small / medium-sized board and a large-sized board, use both a small / medium-sized board and a large-sized board according to the size of the board to be mounted. Also, small and medium-sized substrates and large-sized substrates were dealt with using only a mounting machine for large-sized substrates.
[0003]
When using both mounting machines for a small / medium-sized substrate and a large-sized substrate, there is a problem that installation costs are increased because both types of mounting machines are installed. In addition, when using only a mounter for a large substrate, when mounting on a small substrate, the distance from the electronic component supply unit to the small substrate is longer than in the case of a large substrate. Since the time for holding and moving is long, there is a problem that the mounting efficiency is deteriorated as compared with a case where a mounting machine for a small substrate is used.
[0004]
In order to cope with each of the above problems, there has been proposed an electronic component mounting line in which a plurality of mounting machines for small and medium-sized boards are arranged to mount components on the board. Such electronic component mounting lines are mounted on the gantry, and a plurality of rows of track conveyors 1 and 2 are arranged side by side on the gantry in the Y-axis direction and transport the board in the X-axis direction orthogonal to the Y-axis direction. A component mounting machine having a mounting head 4 provided on the XY robot 3 and moved in the X-axis and Y-axis directions, and a suction nozzle 4a provided on the mounting head 4 to suction components and mount them on a substrate ( And a clamp device for positioning and clamping the substrate S conveyed to a predetermined position on each of the track conveyors 1 and 2 connected in the X-axis direction. The components are mounted on the substrate S by the suction nozzles 4a.
[0005]
[Problems to be solved by the invention]
In the electronic component mounting line proposed above, as shown in FIG. 8, the suction nozzle 4a of the component mounter has a non-mountable area S1 where a component cannot be mounted on the substrate S. This is for the following reason. The X-axis rail 5 provided in the component mounting machine and on which the mounting head 4 reciprocates is shorter than its X-axis direction width because it is accommodated in the component mounting machine. On the other hand, the mounting head 4 reciprocates on the X-axis rail 5. When the mounting head 4 moves to the left end (or right end) of the X-axis rail 5, the mounting head 4 is arranged at the center of the mounting head 4 in the X-axis direction. The drawn suction nozzle 4a cannot reach the boundary between adjacent component mounters. As a result, an unmountable area S1 where the suction nozzle 4a cannot mount a component is generated near the boundary between adjacent component mounters.
[0006]
Therefore, for example, when mounting a component by clamping a board over two adjacent component mounters, the component is placed on the board portion corresponding to the non-mountable area S1 (that is, a portion near the boundary between both component mounters). Could not be implemented.
[0007]
Therefore, the present invention has been made to solve the above-described problems, and by mounting a plurality of component mounters for small and medium-sized boards in parallel, it is possible to reduce the cost not only for small and medium-sized boards but also for large-sized boards. Another object of the present invention is to provide a component mounting method and a component mounting line that can efficiently and reliably mount components.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a structural feature of the invention according to claim 1 is that a plurality of rows of track conveyors for transporting substrates in the X-axis direction are arranged side by side in a Y-axis direction orthogonal to the X-axis direction. A plurality of component mounters, which are mounted with a mounting head provided with a suction nozzle for sucking and mounting components on a substrate so as to be movable in the X-axis and Y-axis directions, are arranged side by side and connected in the X-axis direction. In the electronic component mounting method in which the board is conveyed to a predetermined position on each track conveyor and positioned and clamped, and each suction nozzle mounts a component on the clamped board, two or more of the track conveyors in a plurality of rows are used. By converting to a wide track conveyor, it is possible to transport a wide substrate and mount components on the substrate.
[0009]
Further, the structural feature of the invention according to claim 2 is that when two or more track conveyors are converted into one wide track conveyor, the mounting area of the suction nozzle of each component mounter is at least set to the adjacent component mounter. Can be extended to the boundary of the component mounter, and a set of parallel component mounters consisting of at least the component mounter and the component mounter adjacent to the component mounter can be used to make a large large substrate that is wider than the width of the component mounter in the X-axis direction. After mounting components, the large substrates are transported by a wide track conveyor to the next set of component mounting machines.
[0010]
A structural feature of the invention according to claim 3 is that a plurality of rows of track conveyors arranged in parallel in the Y-axis direction on the gantry and transporting substrates in the X-axis direction orthogonal to the Y-axis direction, respectively, Mounting machine provided on an XY robot mounted on the XY robot and moved in the X-axis and Y-axis directions, and a suction nozzle provided on the mounting head for sucking components and mounting them on a substrate And a clamp device for positioning and clamping a substrate conveyed to a predetermined position on each track conveyor connected in the X-axis direction, wherein a plurality of units are arranged side by side adjacent to each other. Is provided in the electronic component mounting line for mounting a plurality of track conveyors in a plurality of rows of track conveyors into one wide track conveyor.
[0011]
Further, the configuration of the invention according to claim 4 is characterized in that conversion storage means for storing that two or more track conveyors in a plurality of rows of track conveyors are converted into one wide track conveyor, and the conversion storage means When the conversion is stored, mounting area expanding means for expanding the mounting area of the suction nozzle of each component mounting machine at least to the boundary with the adjacent component mounting machine, a component mounting machine and a component adjacent to the component mounting machine Mounting means for mounting components on a large-sized substrate having a width equal to or greater than the width of the component mounting machine in the X-axis direction by using a set of component mounting machines arranged in parallel, and after mounting by the mounting means, Transport means for transporting a large substrate to a component mounter by a wide track conveyor.
[0012]
A structural feature of the invention according to claim 5 is that a suction nozzle of one component mounter mounts a component near a boundary between the component mounter and an adjacent component mounter in a mount area of the component mounter. When the operation is performed, an interference preventing means is provided to prevent the mounting head of the adjacent component mounter from entering an area where the mounting head interferes with the mounting head of one component mounter.
[0013]
[Action and Effect of the Invention]
In the invention according to claim 1 configured as described above, when a plurality of track conveyors are set, a small or medium-sized substrate having a relatively small width is transported by each track conveyor, and is positioned and clamped at a predetermined position. The components are mounted on this board. When two or more of the track conveyors in a plurality of rows are converted into one wide track conveyor, the wide track conveyor conveys a wide substrate, positions it at a predetermined position, clamps it at a predetermined position, and mounts components on the substrate. Therefore, by using a component mounter that can be arranged in parallel with a plurality of boards, it is possible to handle both small / medium-sized boards and large-sized boards. Since it is not necessary to have both mounting machines, an increase in equipment cost can be suppressed.
[0014]
Also, when the mounting head (suction nozzle) carries components from the electronic component supply unit to the substrate, the distance from the electronic component supply unit to the small substrate depends on the use of the mounting machine for large substrates, and the components are transferred to the small substrate. Since the mounting head is shorter than in the case of mounting, the time for the mounting head to hold and move the component can be suppressed to be short, so that the component can be mounted efficiently.
[0015]
In the invention according to claim 2 configured as described above, when two or more track conveyors are converted to one wide track conveyor, the suction nozzle of each component mounting machine mounts at least up to the boundary with the adjacent component mounting machine. The area is expanded. Thus, for example, when mounting a component by clamping the board over two adjacent component mounters, it is possible to mount the component on a board portion near the boundary between the two component mounters, which was a conventionally unmountable area. it can. Therefore, it is possible to reliably mount the component on any part of the board.
[0016]
In the invention according to claim 3 configured as described above, when a plurality of rows of track conveyors are set, a small or medium-sized substrate having a relatively small width is transported by each track conveyor, and is positioned and clamped at a predetermined position. The components are mounted on this board. When two or more of the track conveyors in a plurality of rows are converted into one wide track conveyor by the conversion means, the wide board is conveyed by the wide track conveyor, and the wide board is conveyed and clamped at a predetermined position to mount components on the board. . Therefore, by using a component mounter that can be arranged in parallel with a plurality of boards, it is possible to handle both small / medium-sized boards and large-sized boards. Since it is not necessary to have both mounting machines, an increase in equipment cost can be suppressed.
[0017]
Also, when mounting on a small / medium-sized board, when the mounting head (suction nozzle) carries the component from the electronic component supply unit to the board, the component is mounted on the small board by using a mounting machine for a large board. As compared with the case, the distance from the electronic component supply unit to the small substrate becomes shorter, so that the time for the mounting head to hold and move the component can be reduced, so that the component can be mounted efficiently. .
[0018]
In the invention according to claim 4 configured as described above, when two or more track conveyors are converted into one wide track conveyor, the suction nozzle of each component mounter is at least adjacent to the component mounter by the mounting area expanding means. The mounting area is extended to the boundary with. Thus, for example, when mounting a component by clamping the board over two adjacent component mounters, it is possible to mount the component on a board portion near the boundary between the two component mounters, which was a conventionally unmountable area. it can. Therefore, it is possible to reliably mount the component on any part of the board.
[0019]
In the invention according to claim 5 configured as described above, for example, when mounting a component by clamping a substrate in a state of extending over two adjacent component mounters, a portion of the board near a boundary between the two component mounters may be mounted. When mounting components, the mounting heads of both component mounters do not interfere with each other, so that components can be mounted smoothly and safely.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of an electronic component mounting line according to the present invention will be described below with reference to FIGS. FIG. 1 shows the entire structure of the electronic component mounting line. The electronic component mounting line has a configuration in which a plurality of (two in the present embodiment) component mounters 10 are arranged side by side.
[0021]
As shown in FIG. 1, each of the component mounters 10 is provided on a base frame 11 and transports a substrate S. The substrate transport device 20 is mounted on one side (front side) of the substrate transport device 20. A component supply device 30 for supplying an electronic component P to be mounted on the device, and a substrate transport device that is disposed above the two devices 20 and 30 and holds the electronic component P supplied by the component supply device 30 by suction using a mounting head 70. A component mounting device 40 that automatically mounts the component on the substrate S clamped at 20 is provided.
[0022]
As shown in FIG. 2, the control device 10a of each component mounter 10 is connected to a control computer A on the same network via a LAN, and a plurality of component mounters are controlled by a command from the control computer A. 10 cooperate to mount the electronic component P on the substrate S. The control computer A stores a program shown in the flowchart of FIG. 7, and the control computer A controls the mounting head 70 of each component mounting machine 10 based on this program so as not to interfere. .
[0023]
The substrate transport device 20 transports the substrate S in a predetermined direction (for example, the X-axis direction), and includes two rows of first and second track conveyors 21 and 22 arranged along the Y-axis direction. Note that the X-axis direction is the direction in which the substrate is transported, the Y-axis direction is a direction that is on the same plane as the substrate and is orthogonal to the X-axis, and the Z-axis direction is a direction that is perpendicular to the same plane as the substrate.
[0024]
As shown in FIG. 1, the first track conveyor 21 includes a reference support member 24 and a first intermediate support member 25 mounted on a base 23 so as to face each other. Each of these members 24 and 25 is formed in a U-shape opened downward, and the lower ends of both members 24 and 25 are attached to the base 23. A first guide rail 24a extending in the transport direction (the X-axis direction in FIG. 1) and a second guide rail 25a facing the first guide rail 24a in parallel are provided on the upper edges of both members 24, 25. Are mounted respectively. Further, a pair of conveyor belts (not shown) for supporting and transporting the substrate S guided by the first and second guide rails 24a, 25a are opposed to the reference support member 24 and the first intermediate support member 25. The first and second guide rails 24a and 25a are arranged in parallel with each other. Thus, when the conveyor belt is driven, the substrates S supported by the pair of conveyor belts are guided and conveyed by the guide rails 24a and 25a.
[0025]
As shown in FIG. 1, the second track conveyor 22 includes a second intermediate support member 26 and a second end support member 27 which are mounted on the base 23 so as to face each other. Each of these members 26 and 27 is formed in a U-shape opened downward, and the lower ends of both members 26 and 27 are attached to the base 23. A third guide rail 26a extending in the transport direction and a fourth guide rail 27a facing in parallel with the third guide rail 26a are mounted on the upper ends of the two members 26 and 27, respectively. Further, a pair of conveyor belts (not shown) for supporting and transporting the substrate S guided by the third and fourth guide rails 26a, 27a are opposed to the second intermediate support member 26 and the other end support member 27. And are arranged in parallel with the third and fourth guide rails 26a and 27a, respectively. Thus, when the conveyor belt is driven, the substrates S supported by the pair of conveyor belts are guided and conveyed by the guide rails 26a and 27a.
[0026]
In the above-described substrate transfer device 20, the first and second intermediate support members 25 and 26 are detachably attached to the base 23, and by removing these support members 25 and 26 from the base 23, Two rows of truck conveyors can be converted to one wide truck conveyor. In this wide track conveyor, when the conveyor belt is driven, the large substrates supported by the pair of conveyor belts are guided and transported by the first and fourth guide rails 24a and 27a.
[0027]
Further, the substrate transport device 20 is provided with a clamp device 80 for positioning and clamping each substrate S transported to a predetermined position by the first and second track conveyors 21 and 22. Each clamp device 80 includes a plate-shaped pedestal 81 that moves up and down in the Z-axis direction, and a plurality of support pins (not shown) erected on the pedestal 81. After the substrate S has been transported to the predetermined position, when the pedestal 81 is raised, the tips of the plurality of support pins abut against the lower surface of the substrate S, the substrate S is pushed upward, and both edges of the substrate S in the Y-axis direction are formed. The first and second guide rails 24a and 25a (or the third and fourth guide rails 26a and 27a) are engaged with engaging projections. As a result, the substrate S is positioned and clamped at a predetermined position. When the pedestal 81 is lowered, the substrate S is also lowered, and the substrate S is again supported by the pair of conveyor belts.
[0028]
As shown in FIG. 1, the component supply device 30 has a configuration in which a plurality of cassette type feeders 31 are arranged on a base frame 11. The cassette type feeder 31 includes a main body 32 detachably attached to the base frame 11, a supply reel 33 provided at a rear part of the main body 32, and a component take-out part 34 provided at a tip of the main body 32. An elongate tape (not shown) in which electronic components P are sealed at a predetermined pitch is wound and held on the supply reel 33, and the tape is pulled out at a predetermined pitch by a sprocket (not shown) to release the electronic component P from the sealed state. Then, they are sequentially sent to the component take-out unit 34. A monitoring camera 35 is provided between the component supply device 30 and the substrate transport device 20, and monitors the state of the electronic component P sucked by the suction nozzle 74 a provided on the mounting head 70 by the monitoring camera 35. .
[0029]
As shown in FIGS. 3 and 4, the component mounting device 40 includes an XY robot 41 mounted on the base frame 11 and disposed above the substrate transfer device 20 and the component supply device 30. The XY robot 41 includes a main body frame 42 which is elongated in the Y-axis direction, and a pair of Y-axis rails 43 extending along the Y-axis direction are attached to the main body frame 42 so as to be parallel to the Y-axis rails 43. The provided Y-axis feed screw 44 is rotatably attached. Then, a Y-axis slider 45 is mounted in which each sliding engagement portion 45a is slidably engaged with the Y-axis rail 43 and a screw engagement portion 45b is threadedly engaged with the Y-axis feed screw 44. A Y-axis servomotor 46 is connected to the Y-axis feed screw 44. When the Y-axis feed screw 44 is rotated by the Y-axis servomotor 46, the Y-axis slider 45 reciprocates along the Y-axis direction.
[0030]
Below the Y-axis slider 45, an X-axis first slider 51 and an X-axis second slider 61 are attached so as to reciprocate along the X-axis direction. A mounting plate 47 extending in the X-axis direction is vertically fixed to the lower surface of the Y-axis slider 45, and the X-axis first slider 51 can slide on the side of the mounting plate 47 facing the same side. Installed.
[0031]
The mounting plate 47 is provided with a sliding engagement portion 47a slidably engaged with a pair of X-axis first rails 52 provided along the X-axis direction on the rear surface of the X-axis first slider 51. An X-axis first feed screw 47b provided in parallel with the X-axis first rail 52 is rotatably mounted. The screw engaging portion 51a provided on the X-axis first slider 51 is screw-engaged with the X-axis first feed screw 47b. An X-axis first servomotor 48 is connected to the X-axis first feed screw 47b. When the X-axis first feed screw 47b is rotated by the X-axis first servomotor 48, the X-axis first slider 51 is moved. Reciprocates along the X-axis direction.
[0032]
An X-axis second slider 61 is slidably mounted on the front surface of the X-axis first slider 51. A pair of X-axis second rails 53 extending along the X-axis direction are attached to the front surface of the X-axis first slider 51, and an X-axis second feed screw provided in parallel with the X-axis second rails 53. 54 is rotatably mounted. A screw engagement portion 61a slidably engaged with the X-axis second rail 53 is attached to the rear surface of the X-axis second slider 61, and is screw-engaged with the X-axis second feed screw 54. 61b is fixed to the rear surface of the X-axis second slider 61. An X-axis second servomotor 55 is connected to the X-axis second feed screw 54. When the X-axis second feed screw 54 is rotated by the X-axis second servomotor 55, the X-axis second slider 61 is moved. Reciprocates along the X-axis direction.
[0033]
As shown in FIG. 5, a mounting head 70 having a suction nozzle 74a for sucking the electronic component P and mounting it on the substrate S is attached to the X-axis second slider 61. Thereby, the mounting head 70 is provided on the XY robot 41 and is moved in the X-axis and Y-axis directions. The mounting head 70 includes a head frame 71 attached to the X-axis second slider 61. At the lower part of the head frame 71, a cylindrical nozzle holder 72 for holding a plurality of (for example, eight) spindles 74 so as to be able to reciprocate up and down (Z-axis direction) is mounted rotatably about the axis. Each spindle 74 is urged upward by a compression spring (not shown), and a suction nozzle 74a is attached to a lower end.
[0034]
The nozzle holder 72 is intermittently rotated by an R-axis motor 73 attached to the head frame 71 so that the suction nozzle 74a stops at a predetermined position. The spindle 74 stopped at a mounting point (mounting station) for mounting the electronic component P among predetermined positions is compressed when the nozzle lowering lever 77 is lowered by rotation of a Z-axis feed screw 76 driven by a Z-axis motor 75. The suction nozzle 74a is also lowered against the spring force of the spring, and the suction nozzle 74a is also lowered. When the nozzle lowering lever 77 is raised by the counterclockwise rotation of the Z-axis feed screw 76, the spindle 74 is raised by the spring force of the compression spring, and the suction nozzle 74a is also raised.
[0035]
Note that the spindle 74 and, consequently, the suction nozzle 74a are rotated around the axis by the Q-axis motor 78 to perform θ correction. Each of the suction nozzles 74a is connected to a negative pressure supply via a pipe provided with an on-off valve (both are not shown). The suction nozzle 74a is switched and selected according to the type of the electronic component P. Note that only one suction nozzle 74a may be provided instead of a plurality.
[0036]
Next, a case where components are mounted on various substrates from small to large by the electronic component mounting line configured as described above will be described. When mounted on a small / medium-sized board, the first to fourth guide rails are mounted by mounting the reference support member 24, the first and second intermediate support members 25 and 26, and the other end support member 27 on the base 23. 24a to 27a are attached to the base 23 to form two rows of track conveyors 21 and 22 having a relatively narrow width in the Y-axis direction. Thereafter, the small or medium-sized board S having a relatively small width is conveyed by the track conveyors 21 and 22 and is positioned and clamped at a predetermined position to mount the electronic component P on the board S.
[0037]
When a large-sized board is mounted, these two rows of track conveyors 21 and 22 are converted into one wide track conveyor. Specifically, by removing only the first and second intermediate support members from the base 23 and leaving the reference support member and the other end support member on the base 23, one track having a relatively large width in the Y-axis direction is provided. Set to be a conveyor. Thereafter, the wide board SL is conveyed by the wide track conveyor, positioned and clamped at a predetermined position, and components are mounted on the board SL. Therefore, by using the component mounter 10 that can be arranged in parallel, a small and medium-sized board and a large-sized board can be handled. Therefore, for a user who handles both boards, the small and medium-sized board and the large-sized board can be handled. It is not necessary to have both mounting machines, so that an increase in equipment cost can be suppressed.
[0038]
When the mounting head 70 (suction nozzle 74a) carries an electronic component from the component supply device 30 to the substrate when mounting the component on a small / medium-sized substrate, the mounting device for a large substrate is diverted to the small substrate. Since the distance from the component supply device 30 to the small substrate is shorter than in the case where components are mounted, the time for the mounting head 70 to hold and move the electronic components can be reduced, so that the electronic components can be efficiently provided. Can be implemented.
[0039]
Next, the case of mounting on a large substrate (a substrate wide in both the X-axis and the Y-axis directions) will be described in detail. In this case, as shown in FIG. 6, after a wide track conveyor including the first and fourth guide rails 24a and 27a is set, the wide substrate SL is conveyed to a predetermined position by the wide track conveyor and clamped. The wide substrate SL is positioned and clamped at the predetermined position by the device 80. After that, the XY robot 41 mounts the electronic components on the substrate SL.
[0040]
The operation of the XY robot 41 will be described with reference to FIG. The X-axis first slider 51 of each component mounter 10 moves along the X-axis direction and intermittently stops at four positions P1, P2, P3, and P4 in order from right to left. The position P1 is the position where the X-axis first slider has been moved to the rightmost position as shown in FIG. 6A, and the position P4 is the X-axis first slider 51 as shown in FIG. 6D. Is the position at which the X-axis first slider 51 has been moved to the rightmost position in the component mounter 10, as shown in FIG. 6B. The position P3 is a position where the X-axis first slider 51 has been moved to the leftmost position in the component mounter 10, as shown in FIG. 6C.
[0041]
Further, the X-axis second slider 61 of the component mounter can move along the X-axis direction and stop at any position within the width of the X-axis first slider 51 substantially in the X-axis direction. Therefore, when the X-axis first slider 51 is at the position P1, the mounting head 70 provided on the X-axis second slider 61 reciprocates from the position shown by the solid line to the position shown by the broken line as shown in FIG. Can move. At this time, the suction nozzle 74a provided on the mounting head 70 is moved to the boundary with the component mounting machine 10 adjacent to the right side, so that the mounting area is extended to the right side boundary. On the other hand, when the X-axis first slider 51 is at the position P4, the mounting head 70 provided on the X-axis second slider 61 reciprocates from the position shown by the solid line to the position shown by the broken line as shown in FIG. Can move. At this time, the suction nozzle 74a provided on the mounting head 70 is moved to the boundary with the component mounting machine adjacent to the left side, so that the mounting area is extended to the left side boundary.
[0042]
Therefore, when two or more track conveyors are converted into one wide track conveyor (when mounting on one board using two or more component mounters (mounting heads, suction nozzles)), the X-axis By sliding the mounting head 70 in two steps by the configuration including the first slider 51 and the X-axis second slider 61, the suction nozzle 74 a of each component mounter 10 can move the mounting area at least to the boundary with the adjacent component mounter 10. Be extended. Accordingly, for example, when the electronic component is mounted by clamping the board SL in a state where the electronic component is mounted on two adjacent component mounters 10, the electronic component is mounted on the board portion near the boundary of the component mounter 10, which has been a non-mountable area. Can be implemented. Therefore, it is possible to reliably mount the electronic component on any part of the substrate.
[0043]
Furthermore, when mounting on one board using two or more component mounters (mounting heads, suction nozzles), the control computer A on the same network as each component mounter 10 By executing the program shown in the flowchart, the suction nozzle 74a of one component mounter 10 mounts the electronic component in the mounting area of the component mounter 10 and near the boundary with the adjacent component mounter 10. In this case, one component mounter 10 and the adjacent component mounter 10 are prohibited so that the mounting head 70 of the adjacent component mounter 10 does not enter an area where the mount head 70 interferes with the mount head 70 of the one component mounter 10. Machine 10 is controlled.
[0044]
The control computer A inputs the position information of the X-axis first slider 51 from one of the component mounters (for example, the component mounter on the left side) 10 and based on the position information, the other component mounter (for example, The prohibition position of the X-axis first slider 51 of the right component mounter 10 is determined, and the prohibited position is output to the other component mounter 10.
[0045]
More specifically, the control computer A starts the program in step 100, and when one of the component mounters 10 inputs that the position of the X-axis first slider 51 is P1, the other component mounter It is determined that the prohibited positions of the X-axis first slider 51 of the machine 10 are P3 and P4 (steps 102 and 104), and these prohibited positions are output to the other component mounting machine 10. When the position of the X-axis first slider 51 is input as P2, it is determined that the prohibited position of the X-axis first slider 51 of the other component mounter 10 is P4 (steps 102, 106, 108). The forbidden position is output to the other component mounter 10. When the position of the X-axis first slider 51 is input as P3, it is determined that the prohibited position of the X-axis first slider 51 of the other component mounter 10 is P1 (steps 102, 106, 110, and 102). 112), this prohibited position is output to the other component mounter 10. Then, when inputting that the position of the X-axis first slider 51 is P4, it is determined that the prohibited positions of the X-axis first slider 51 of the other component mounting machine 10 are P1 and P2 (steps 102, 106, 106). 110, 114, 116), and outputs these prohibited positions to the other component mounter 10. In any case, the other component mounter 10 does not move the X-axis first slider 51 to the prohibited position based on the command from the control computer A. That is, the X-axis first slider 51 is moved to a position other than the prohibited position.
[0046]
For example, as shown in FIG. 6A, when the left component mounter 10 mounts electronic components near the boundary with the right component mounter 10, the X-axis of the left component mounter 10 is used. The first slider 51 is at the position P1. Based on this position information, the prohibited positions of the X-axis first slider 51 of the right component mounter 10 become the positions P3 and P4, and the right component mounter 10 moves the X-axis first slider 51 only to the position P1 or P2. The movement can prevent interference between the two mounting heads 70. When the X-axis first slider 51 of the left component mounter 10 is at the position P2 (see FIG. 6B), the right component mounter 10 is controlled in the same manner as described above. The prohibited position of the X-axis first slider 51 of the right component mounter 10 is at the position P4, and the X-axis first slider 51 of the right component mounter 10 can move to the positions P1 to P3. When the X-axis first slider 51 of the left component mounter 10 is at the positions P3 and P4 (see FIGS. 6C and 6D), the X-axis first slider of the right component mounter 10 is used. The prohibition position of 51 is eliminated, and the X-axis first slider 51 of the right component mounter 10 can move to the positions P1 to P4.
[0047]
When mounting on a small / medium-sized substrate, or at the end of the mounting operation, the X-axis first slider 51 is preferably arranged at the position P2 or P3 as shown in FIG. 6B or FIG. 6C. .
[0048]
In addition to the first and second intermediate supports other than the above-described method of converting the two or more track conveyors into one wide track conveyor by removing the first and second intermediate support members 25 and 26 as the conversion means of the present invention, A method is adopted in which at least one of the two or more track conveyors is converted into a wide track conveyor by moving the members 25 and 26 and the other end support member 27 in the Y-axis direction to change the width of each track conveyor. You may make it.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an overall structure of an embodiment of an electronic component mounting line according to the present invention.
FIG. 2 is a block diagram illustrating an electronic component mounting line and a control computer that controls the line.
FIG. 3 is a top view of the component mounter shown in FIG. 1;
FIG. 4 is an exploded perspective view of the XY robot shown in FIG.
FIG. 5 is a perspective view of the mounting head shown in FIG.
FIG. 6 is a top view showing an operating state of an X-axis first slider and a mounting head when one large substrate is mounted by an electronic component mounting line including two component mounters shown in FIG. 1;
7 is a flowchart showing a program for preventing interference between adjacent X-axis first sliders when mounting one large-sized substrate by an electronic component mounting line including two component mounters shown in FIG. 1; .
FIG. 8 is a top view of a component mounter constituting an electronic component mounting line according to a conventional technique.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Component mounting machine, 11 ... Base frame, 20 ... Board transfer device, 21, 22 ... Truck conveyor, 23 ... Base, 24a-27a ... Guide rail, 24 ... Reference support member, 25 ... 1st intermediate support member, 26: second intermediate support member, 27: other end support member, 30: component supply device, 31: cassette type feeder, 32: main body, 33: supply reel, 34: component take-out part, 35: surveillance camera, 40: component Mounting device, 41: robot, 42: body frame, 43: Y-axis rail, 44: Y-axis feed screw, 45a: sliding engagement portion, 45b: screw engagement portion, 45: Y-axis slider, 46: Y-axis Servo motor, 47a: sliding engagement portion, 47b: X-axis first feed screw, 47: mounting plate, 48: X-axis first servo motor, 51: X-axis first slider, 51a: screw engagement portion, 52 ... X-axis first rail, 53 ... X Second rail, 54: X-axis second feed screw, 55: X-axis second servomotor, 61: X-axis second slider, 61a: sliding engagement portion, 61b: screw engagement portion, 70: mounting head, 71: head frame, 72: nozzle holder, 73: R-axis motor, 74: spindle, 74a: suction nozzle, 75: Z-axis motor, 76: Z-axis feed screw, 77: nozzle lowering lever, 78: Q-axis motor, 80: Clamping device, 81: Pedestal.

Claims (5)

A plurality of rows of track conveyors each of which conveys a board in the X-axis direction are arranged in the Y-axis direction orthogonal to the X-axis direction, and a mounting head provided with a suction nozzle for sucking a component and mounting the component on the board is provided. A plurality of component mounters mounted movably in the X-axis and Y-axis directions are juxtaposed and arranged side by side, and the board is transported and positioned to a predetermined position on each of the track conveyors connected in the X-axis direction. In the electronic component mounting method of clamping and mounting the component on the substrate clamped by each of the suction nozzles, by converting two or more of the plurality of rows of track conveyors into one wide track conveyor, An electronic component mounting method, wherein a substrate can be transported and a component can be mounted on the substrate. When two or more track conveyors are converted into one wide track conveyor, the mounting area of the suction nozzle of each of the component mounters can be extended to at least a boundary between adjacent component mounters, and at least the component mounters and the Using a set of parallel component mounters consisting of component mounters adjacent to the component mounter, the components are mounted on a large substrate that is wider than the width of the component mounter in the X-axis direction. 2. The electronic component mounting method according to claim 1, wherein the large substrate is transported to the set of component mounting machines by the wide track conveyor. A plurality of rows of track conveyors arranged side by side in the Y-axis direction on the gantry to convey substrates in the X-axis direction orthogonal to the Y-axis direction; and A plurality of component mounting machines having a mounting head that is moved in the axial and Y-axis directions and a suction nozzle provided on the mounting head to suction a component and mount the component on the substrate are arranged side by side adjacent to each other. A clamp device for positioning and clamping a substrate conveyed to a predetermined position on each of the track conveyors connected in the X-axis direction, and an electronic component mounting line for mounting the component on the clamped substrate by the suction nozzles 3. The electronic component mounting according to claim 1, further comprising conversion means for converting two or more track conveyors in the plurality of rows of track conveyors into one wide track conveyor. Inn. Conversion storage means for storing that two or more track conveyors in the plurality of rows of track conveyors have been converted into one wide track conveyor,
When the conversion storage means stores the conversion, a mounting area expanding means for expanding the mounting area of the suction nozzle of each component mounting machine to at least a boundary with an adjacent component mounting machine,
A mounting means for mounting the component on a large-sized substrate having a width equal to or more than the width of the component mounter in the X-axis direction by a set of parallel component mounters including the component mounter and the component mounter adjacent to the component mounter. When,
4. The electronic component mounting line according to claim 3, further comprising: transport means for transporting the large substrate to the next set of component mounting machines by the wide track conveyor after mounting by the mounting means. When the suction nozzle of one component mounter is mounting the component in the mounting area of the component mounter and near the boundary with the adjacent component mounter, the mounting head of the adjacent component mounter is mounted. 5. The electronic component mounting line according to claim 4, further comprising interference prevention means for prohibiting the device from entering an area that interferes with the mounting head of the one component mounter.

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