WO2012046494A1

WO2012046494A1 - Electronic component mounting apparatus

Info

Publication number: WO2012046494A1
Application number: PCT/JP2011/067277
Authority: WO
Inventors: 淳飯阪; 茂人大山
Original assignee: 富士機械製造株式会社
Priority date: 2010-10-05
Filing date: 2011-07-28
Publication date: 2012-04-12
Also published as: CN103125153A; JP5450338B2; CN103125153B; DE112011103357T5; JP2012080003A; DE112011103357B4

Abstract

The present invention addresses the problem of providing an electronic component mounting apparatus having high efficiency in an electronic component transfer operation. An electronic component mounting apparatus (1) is provided with: a substrate transfer apparatus (36) having a plurality of substrate transfer sections (360f, 360r), which transfer circuit boards (Bf, Br) at a transfer height (C1) and stop the circuit boards (Bf, Br) at mounting areas (Af, Ar); a substrate lift apparatus (35) having a plurality of substrate lift sections (350f, 350r), which lift the circuit boards (Bf, Br) from the transfer height (C1) to a mounting height (C2); a component supplying apparatus (4), which supplies electronic components (Pf, Pr) to a suction position (B1); a mounting head (32) having a suction nozzle (320), which sucks the electronic components (Pf, Pr) at the suction position (B1) and mounts the electronic components on the mounting position (B2) on the circuit boards (Bf, Br); and a control apparatus (7). When the mounting head (32) transfers the electronic component (Pr) from the suction position (B1) to the mounting position (B2) on the second circuit board (Br), the control apparatus (7) sets the height of the first circuit board (Bf) to a standby height (C3), which is equal to or more than the transfer height (C1) but less than the mounting height (C2).

Description

Electronic component mounting machine

The present invention relates to an electronic component mounting machine for mounting electronic components on a circuit board.

The electronic component mounting machine is used to mount an electronic component on a circuit board (see, for example, Patent Documents 1 and 2). In recent years, an electronic component mounting machine having two lanes (circuit board conveyance paths) has been used to improve productivity. FIG. 17 is a right side view of a conventional electronic component mounting machine. As shown in FIG. 17, the two lanes L100f and L100r extend in the left-right direction. The two lanes L100f and L100r are juxtaposed in the front-rear direction. The board conveyance device 101 of the electronic component mounting machine 100 includes two board conveyance units 102f and 102r. A circuit board 103f and a circuit board 103r are installed in the board transfer section 102f and the board transfer section 102r, respectively.

The component supply device 104 is disposed in front of the substrate transfer device 101. The component supply device 104 supplies the electronic components 106f and 106r to the suction position 104a. The mounting head 105 conveys the electronic components 106f and 106r from the suction position 104a to the circuit boards 103f and 103r.

2005-217209 No. 2004-128400

When the electronic component 106r is mounted on the circuit board 103r, the circuit board 103r is mounted from the mounting altitude (the altitude at which the circuit board 103r is transferred by the board transfer section 102r) to the mounting altitude (the altitude at which the electronic component 106r is mounted on the circuit board 103r). ) By the back side substrate lift 108r. At the mounting height, the circuit board 103r is sandwiched from above and below by the pair of clamp members 107r and the back board lifting / lowering part 108r. That is, the circuit board 103r is fixed in a clamped state.

It takes a certain time to lift the circuit boards 103f and 103r from the transfer height to the mounting height and fix them in the clamped state. For this reason, when the target of production of the circuit boards 103f and 103r (attachment of the electronic components 106f and 106r to the circuit boards 103f and 103r) is switched from the lane L100r to the lane L100f, the production of the circuit board 103r in the lane L100r is completed. If the circuit board 103f in the lane L100f is in the clamped state, the downtime is generated accordingly.

Therefore, conventionally, not only the circuit board 103r of the lane L100r that is being produced but also the circuit board 103f of the lane L100f that is in the standby state are also clamped together. And the downtime accompanying switching of lanes L100f and L100r was reduced.

For this reason, when the electronic component 106r is mounted on the back circuit board 103r, the electronic component 106f mounted on the front circuit board 103f is in the way. Therefore, in order to avoid the mounted electronic component 106f, the moving path A100 of the mounting head 105 is set so as to straddle the electronic component 106f.

However, the movement route A100 includes a route that avoids the electronic component 106f. For this reason, the movement time of the mounting head 105 becomes long. In addition, the moving distance of the mounting head 105 becomes long. In addition, the power consumption of the mounting head 105 increases. Thus, conventionally, the transfer operation of the electronic component 106r with respect to the circuit board 103r on the back side has been inefficient.

The electronic component mounting machine of the present invention has been completed in view of the above problems. SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting machine that has a high efficiency in carrying an electronic component to a circuit board that is far from a suction position among a plurality of circuit boards.

(1) In order to solve the above-described problem, an electronic component mounting machine according to the present invention includes a substrate transfer device that includes a plurality of substrate transfer units that transfer a circuit board at a transfer height and stop the circuit board in a mounting area. A board lifting device that has a plurality of board lifting / lowering units that lift the circuit board stopped in the mounting area from the transport height to a mounting height for mounting electronic components on the circuit board, and the electronic components for mounting are sucked A component supply device for supplying the position and a plurality of the circuit boards in the plurality of mounting areas, sucking the electronic component at the suction position, and placing the electronic component at the mounting position of the circuit board at the mounting height An electronic component mounting machine comprising: a mounting head having a suction nozzle to be mounted; and a substrate transport device, the substrate lifting device, the component supply device, and a control device for controlling the mounting head. Circuit board The first circuit board and the second circuit board, and the mounting head is located farther from the suction position of the first circuit board and the second circuit board than the suction position. When transporting the electronic component to the mounting position, the control device sets the altitude of the circuit board closer to the suction position of the first circuit board and the second circuit board to the mounting height or higher. It is characterized by setting a standby altitude lower than the altitude.

According to the electronic component mounting machine of the present invention, the mounting head is a circuit board farther from the suction position of the first circuit board and the second circuit board (hereinafter, abbreviated as “circuit board farther from the suction position” as appropriate). When the electronic component is transported to the control circuit, the control device may be referred to as a circuit board closer to the suction position of the first circuit board and the second circuit board (hereinafter, “circuit board closer to the suction position” as appropriate). Abbreviated) is set to the standby altitude. For this reason, the efficiency of the electronic component transport operation with respect to the circuit board far from the suction position can be increased. Specifically, at least one of (a) shortening the movement time of the mounting head, (b) shortening the moving distance of the mounting head, and (c) reducing the power consumption of the mounting head can be achieved. it can.

(1-1) Preferably, in the configuration of (1), a first mounting operation for mounting the electronic component on the first circuit board and a second mounting operation for mounting the electronic component on the second circuit board. Among them, the mounting operation for mounting the electronic component on the circuit board far from the suction position is finished, and the circuit board closer to the circuit board in the first mounting work and the second mounting work is connected to the circuit board. When the mounting operation for mounting the electronic component is started, the control device is configured to pick up the electronic component first mounted in the mounting operation to the suction position, and the circuit board closer to the suction position. It is better to have a configuration in which the switching operation for switching the altitude of the vehicle from the standby altitude to the mounting altitude is performed in parallel.

Here, “parallel” means that at least a part of the adsorption work and at least a part of the switching work overlap with each other over time. According to this configuration, after the switching work to switch the altitude of the circuit board closer to the suction position from the standby altitude to the mounting height, the suction work to get the electronic component to be mounted first to the suction position begins. In comparison, downtime that does not contribute to the production of circuit boards can be reduced.

(1-2) Preferably, in the configuration of (1), a first mounting operation for mounting the electronic component on the first circuit board and a second mounting operation for mounting the electronic component on the second circuit board. When the mounting operation for mounting the electronic component on the circuit board closer to the suction position is not completed, the circuit farther from the suction position in the first mounting operation and the second mounting operation Prior to the end of the mounting operation of mounting the electronic component on the board ending in accordance with a predetermined end condition, the control device includes the mounting position of the circuit board closer to the suction position and the electronic component not mounted. It is preferable that the circuit board closer to the suction position is moved in the transport direction of the circuit board so that the total length of the movement path of the mounting head connecting the suction position is the shortest.

That is, this configuration is when the circuit board to be produced is switched from the circuit board closer to the suction position (incomplete) → the circuit board farther from the suction position → again to the circuit board closer to the suction position. Before the end of production of the circuit board far from the suction position (or at the same time as the end of production), close to the suction position in advance so that the total length of the movement path of the mounting head with respect to the circuit board closer to the suction position The other circuit board is moved. According to this configuration, when the circuit board closer to the suction position is produced again, the moving path of the mounting head can be shortened.

(1-3) Preferably, in the configuration of (1), the substrate lifting device includes a first substrate lifting unit that lifts the first circuit board as the plurality of substrate lifting units, and the second circuit board. A second board elevating part that raises the first circuit board, and is disposed above the first circuit board, and at the mounting height, the first circuit board is vertically moved between the first board elevating part and the first circuit board. A first clamp member sandwiched from the second circuit board, and a second clamp member disposed above the second circuit board and sandwiching the second circuit board from the up-and-down direction with the second board lifting and lowering portion at the mounting height The standby altitude is the highest altitude of the electronic component mounted on the circuit board closer to the suction position of the first circuit board and the second circuit board, and the first clamp member And the suction position of the second clamp member Write and maximum altitude of the clamp member near al, is better to be a highly configurable to match.

¡According to this configuration, the standby altitude is set to the limit altitude where the electronic component does not protrude upward from the clamp member closer to the suction position. For this reason, it is possible to quickly switch from the standby altitude to the mounting altitude. In addition, when the electronic component is transported to the circuit board far from the suction position, the mounting head does not need to avoid the electronic parts already mounted on the circuit board closer to the suction position.

(2) Preferably, in the configuration of (1) above, of the first mounting operation of mounting the electronic component on the first circuit board and the second mounting operation of mounting the electronic component on the second circuit board, Prior to the end of the mounting operation of mounting the electronic component on the circuit board farther from the suction position ending with a predetermined end condition, the control device changes the altitude of the first circuit board from the standby altitude. Of the first switching operation for switching to the mounting altitude and the second switching operation for switching the altitude of the second circuit board from the standby altitude to the mounting altitude, the altitude of the circuit board closer to the suction position is determined from the standby altitude. It is better to start the switching work for switching to the mounting height. According to this configuration, after the mounting work for mounting electronic components on the circuit board far from the suction position is completed, the switching work for switching the altitude of the circuit board closer to the suction position from the standby altitude to the mounting height begins. In comparison, downtime can be reduced.

(2-1) Preferably, in the configuration of (2), the termination condition is preferably a configuration in which mounting of the electronic component to the circuit board far from the suction position is completed. According to this configuration, it is possible to reduce downtime associated with the completion of production.

(2-2) Preferably, in the configuration of the above (2), it is preferable that the termination condition is a mounting trouble of the electronic component on the circuit board far from the suction position. According to this configuration, it is possible to reduce downtime associated with trouble.

(2-3) Preferably, in the configuration of (2), it is preferable that the termination condition is that the electronic component is out of component with respect to the circuit board far from the suction position. According to this configuration, it is possible to reduce downtime due to parts being cut.

(2-4) Preferably, in the configuration of (2), before the end, the control device switches the altitude of the circuit board closer to the suction position from the standby altitude to the mounting altitude. It is better to have a configuration that completes the work.

According to this configuration, before the end of the mounting operation for mounting the electronic component on the circuit board far from the suction position (or at the same time as the end), the altitude of the circuit board closer to the suction position is switched from the standby height to the mounting height. The switching work is completed. For this reason, compared with the case where the switching work for switching the altitude of the circuit board closer to the suction position from the standby altitude to the mounting height is completed after the mounting work of mounting electronic components on the circuit board farther from the suction position is completed. And downtime can be reduced.

(3) In order to solve the above-described problem, an electronic component mounting machine according to the present invention includes a substrate transfer device that includes a plurality of substrate transfer units that transfer a circuit board at a transfer height and stop the circuit board in a mounting area; A board lifting device that has a plurality of board lifting / lowering units that lift the circuit board stopped in the mounting area from the transport height to a mounting height for mounting electronic components on the circuit board, and the electronic components for mounting are sucked A component supply device for supplying the position and a plurality of the circuit boards in the plurality of mounting areas, sucking the electronic component at the suction position, and placing the electronic component at the mounting position of the circuit board at the mounting height An electronic component mounting machine comprising: a mounting head having a suction nozzle to be mounted; and a substrate transport device, the substrate lifting device, the component supply device, and a control device for controlling the mounting head. Circuit board The first circuit board and the second circuit board, and the mounting head is located farther from the suction position of the first circuit board and the second circuit board than the suction position. When transporting the electronic component to the mounting position, the control device, when viewed from above, is closer to the moving path of the mounting head than the suction position of the first circuit board and the second circuit board. The first circuit board and the second circuit board are arranged so as to be shifted from each other so that the circuit board does not interfere.

According to this configuration, the first circuit board and the second circuit board are arranged so as to be shifted from each other. For this reason, when the circuit board far from the suction position is produced, the circuit board closer to the suction position does not interfere with the mounting head that is transporting the electronic component. Therefore, it is not necessary to include a route for avoiding the circuit board closer to the suction position in the movement route. Therefore, the efficiency of the electronic component transport operation with respect to the circuit board far from the suction position can be increased. Specifically, at least one of (a) shortening the movement time of the mounting head, (b) shortening the moving distance of the mounting head, and (c) reducing the power consumption of the mounting head can be achieved. it can.

(3-1) Preferably, in the configuration of (3), the control device sets the first circuit board and the second circuit board so as to be shifted from each other over the entire length of the circuit board in the transport direction. It is better to have a configuration to do. According to this configuration, it is possible to easily and reliably prevent the interference of the circuit board closer to the moving position of the mounting head from the suction position.

(4) Preferably, in the configuration according to any one of (1) to (3), the control device includes the circuit board farther from the suction position among the first circuit board and the second circuit board. The electronic component that is partitioned into a plurality of unit areas and is mounted in the unit area is set to the highest altitude of the electronic component that is the highest in the unit area. When transporting the electronic component from the position to the mounting position, it is preferable to set the moving path of the mounting head based on the horizontal coordinate of the unit area and the representative altitude.

According to this configuration, the control device can set the movement route more precisely than the case where the control device sets the movement route on the assumption that the altitude of the entire circuit board far from the suction position is constant. For this reason, it is possible to increase the efficiency of the electronic component transport operation with respect to the mounting position of the circuit board far from the suction position. In addition, this structure can be used not only for the circuit board far from the suction position but also for the circuit board closer to the suction position.

(5) The configuration of (4) above can be used not only for a plurality of lanes but also for an electronic component mounting machine having a single lane. In this case, the electronic component mounting machine transfers the circuit board at a transfer height and has a board transfer unit having a board transfer unit that stops the circuit board in the mounting area, and the circuit board stopped in the mounting area. A board lifting / lowering device having a board lifting / lowering part that lifts the electronic component from a height to a mounting height for mounting the electronic component on the circuit board; a component supply device that supplies the electronic component for mounting to a suction position; and A mounting head having a suction nozzle for sucking an electronic component and mounting the electronic component at a mounting position of the circuit board at the mounting height; a substrate transport device; a substrate lifting device; a component supply device; A control device for controlling the electronic component mounting machine, wherein the control device divides the circuit board into a plurality of unit areas, and among the electronic components already mounted in the unit areas, High Is set to a representative altitude of the unit area, and when the mounting head transports the electronic component from the suction position to the mounting position, the horizontal coordinate of the unit area, The moving path of the mounting head is set based on the representative altitude.

(6) In order to solve the above-described problem, an electronic component mounting machine according to the present invention includes a substrate transfer device having a plurality of substrate transfer units that transfer a circuit board at a transfer height and stop the circuit board in a mounting area; A board lifting device that has a plurality of board lifting / lowering units that lift the circuit board stopped in the mounting area from the transport height to a mounting height for mounting electronic components on the circuit board, and the electronic components for mounting are sucked A component supply device for supplying the position and a plurality of the circuit boards in the plurality of mounting areas, sucking the electronic component at the suction position, and placing the electronic component at the mounting position of the circuit board at the mounting height An electronic component mounting machine comprising: a mounting head having a suction nozzle to be mounted; and a substrate transport device, the substrate lifting device, the component supply device, and a control device for controlling the mounting head. Circuit board The first circuit board and the second circuit board, and the arrangement of the electronic components on the first circuit board and the arrangement of the electronic components on the second circuit board match, and the control device Sets both the altitude of the first circuit board and the altitude of the second circuit board to the mounting height, and the mounting head includes the mounting position of the first circuit board and the mounting position of the second circuit board. The electronic components are alternately mounted so that the horizontal coordinates correspond to the mounting positions.

The first circuit board and the second circuit board have the same type and arrangement of electronic components to be mounted. That is, the first circuit board and the second circuit board are the same type of circuit board. The mounting head alternately mounts the electronic components so that the horizontal coordinates of the first circuit board and the second circuit board correspond to each other, in other words, the types of the electronic parts match. For this reason, the mounting head conveys the same type of electronic component twice in succession.

According to the electronic component mounting machine of the present invention, there are many common portions between the movement path of the mounting head during the production of the first circuit board and the movement path of the mounting head during the production of the second circuit board. For this reason, the efficiency of the electronic component transport operation can be increased.

According to the present invention, it is possible to provide an electronic component mounting machine having a high efficiency in the operation of transporting electronic components to a circuit board far from the suction position among a plurality of circuit boards.

FIG. 1 is a perspective view of the electronic component mounting machine according to the first embodiment. FIG. 2 is a top view of the electronic component mounting machine. FIG. 3 is a right side view of the electronic component mounting machine. FIG. 4 is a block diagram of the electronic component mounting machine according to the embodiment. FIG. 5 is a timing chart showing the movement of the electronic component mounting machine during circuit board production. FIG. 6 is a top view of the electronic component mounting machine according to the second embodiment. FIG. 7 is a top view of the electronic component mounting machine according to the third embodiment. FIG. 8 is a schematic diagram of a moving path of the mounting head of the electronic component mounting machine. FIG. 9 is a schematic diagram of the movement path of the mounting head of the electronic component mounting machine according to the fourth embodiment. FIG. 10 is a partial right side view (No. 1) of the electronic component mounting machine according to the fifth embodiment. FIG. 11 is a partial right side view (No. 2) of the electronic component mounting machine. FIG. 12 is a top view of the electronic component mounting machine according to the sixth embodiment. FIG. 13 is a partial right side view of the electronic component mounting machine according to the seventh embodiment. FIG. 14 is a perspective view of an electronic component mounting machine according to another embodiment. FIG. 15 is a perspective view of the mounting head after replacement of the suction nozzle of the electronic component mounting machine. FIG. 16 is a partial right side view of the electronic component mounting machine when three unit areas are set on the first circuit board. FIG. 17 is a right side view of a conventional electronic component mounting machine.

1: electronic component mounting machine, 3: module, 4: component supply device, 6: NG parts discharging device, 7: control device, 8: image processing device.
30: Substrate clamping device, 31: XY robot, 32: Mounting head, 34: Parts camera, 35: Substrate lifting device, 36: Substrate transport device, 40: Case, 41: Magazine, 42: Shuttle conveyor, 43: Waste box 45: cassette feeder, 60: discharge conveyor, 70: computer, 90: base, 91: cart.
300: fixed wall, 301f: first movable wall, 301r: second movable wall, 303L: guide rail, 303R: guide rail, 304f: first clamp member, 304r: second clamp member, 305: base, 309f: first One transport width change motor, 309r: second transport width change motor, 310: Y direction slider, 311: X direction slider, 312: Y direction guide rail, 313: X direction guide rail, 319a: X axis motor, 319b: Y Axis motor, 320: suction nozzle, 329a: Z-axis motor, 329b: θ-axis motor, 350f: first substrate elevating part (substrate elevating part), 350r: second substrate elevating part (substrate elevating part), 351f: first Ball screw part, 352f: first backup table, 353f: first backup pin, 353r: second backup pin, 35 f: first lift motor, 359r: second lift motor, 360f: first substrate transport section (substrate transport section), 360r: second substrate transport section (substrate transport section), 369f: first transport motor, 369r: first Two transport motors, 410: tray, 700: input / output interface, 701: calculation unit, 702: storage unit.
A1: movement path, A1f: movement path, A1r: movement path, A3: imaging area, A4: full length in the front-rear direction, Af: first mounting area (mounting area), Ar: second mounting area (mounting area), B1: Suction position, B2: mounting position, B2f: mounting position, B2r: mounting position, Bf: first circuit board, Bf1 to Bf3: unit area, Br: second circuit board, Br11 to Br33: unit area, C1: transport altitude C2: mounting altitude, C3: standby altitude, F: floor, Lf: first lane, Lr: second lane, P: electronic component, Pf: electronic component, Pr: electronic component.

Hereinafter, embodiments of the electronic component mounting machine of the present invention will be described.

<< First Embodiment >>
<Mechanical configuration of electronic component mounting machine>
First, the mechanical configuration of the electronic component mounting machine of this embodiment will be described. In the following drawings, the left side corresponds to the upstream side in the conveyance direction of the circuit board. The right side corresponds to the downstream side in the conveyance direction of the circuit board.

FIG. 1 is a perspective view of the electronic component mounting machine of the present embodiment. FIG. 2 shows a top view of the electronic component mounting machine. FIG. 3 shows a right side view of the electronic component mounting machine. In FIG. 1 and FIG. 2, the electronic components are omitted. In FIG. 1, the housing of the module 3 is shown in a transparent manner. In FIG. 2, the housing of the module 3 is omitted. Further, the Y-direction slider 310, the Y-direction guide rail 312 and the X-direction guide rail 313 are indicated by alternate long and short dash lines. Further, hatching is applied to the suction position B1, the first circuit board Bf, and the second circuit board Br.

As shown in FIGS. 1 to 3, the electronic component mounting machine 1 includes a base 90, a module 3, and a component supply device 4. A plurality of electronic component mounting machines (not shown) are arranged in series on the left and right sides of the electronic component mounting machine 1. That is, electronic components Pf and Pr are mounted in stages on the first circuit board Bf flowing through the first lane Lf and the second circuit board Br flowing through the second lane Lr by a plurality of electronic component mounting machines arranged in series. The

[Base 90, component supply device 4]
The base 90 has a rectangular parallelepiped box shape. The base 90 is arranged on the floor F of the factory. The component supply device 4 is disposed above the front portion of the base 90. The component supply device 4 includes a plurality of cassette type feeders 45. A large number of electronic components Pf and Pr are mounted on the cassette type feeder 45. At the rear end portion of the cassette type feeder 45, a suction position B1 is set. The cassette type feeder 45 supplies the electronic components Pf and Pr to be mounted to the suction position B1.

[Module 3]
The module 3 includes a substrate clamping device 30, an XY robot 31, a mounting head 32, a parts camera 34, a substrate lifting device 35, a substrate transport device 36, a control device (not shown), and an image processing device (not shown). Abbreviation).

(Substrate clamping device 30)
The substrate clamping device 30 includes a fixed wall 300, a first movable wall 301f, a second movable wall 301r, a pair of left and right guide rails 303L and 303R, a pair of front and rear first clamp members 304f, and a pair of front and rear second. A clamp member 304r and a base 305 are provided.

The base 305 has a rectangular plate shape. The base 305 is disposed on the upper surface of the base 90. Each of the pair of left and right guide rails 303L and 303R extends in the front-rear direction. The pair of left and right guide rails 303L and 303R are spaced apart from the left and right edges of the upper surface of the base 305.

The fixed wall 300 is erected on the front edge of the upper surface of the base 305. The fixed wall 300 has a C-shaped plate shape that opens downward. The C-shaped ends of the fixed wall 300 are connected to the front ends of a pair of left and right guide rails 303L and 303R.

The first movable wall 301f is disposed behind the fixed wall 300. The first movable wall 301f has a C-shaped plate shape that opens downward. Both C-shaped ends of the first movable wall 301f are attached to a pair of left and right guide rails 303L and 303R so as to be slidable in the front-rear direction.

The second movable wall 301r is disposed behind the first movable wall 301f. The second movable wall 301r has a C-shaped plate shape that opens downward. Both C-shaped ends of the second movable wall 301r are attached to a pair of left and right guide rails 303L and 303R so as to be slidable in the front-rear direction.

Each of the pair of front and rear first clamp members 304f has a prismatic shape that is long in the left-right direction. The front first clamp member 304f is disposed at the upper edge of the fixed wall 300, and the rear first clamp member 304f is disposed at the front of the upper edge of the first movable wall 301f.

Each of the pair of front and rear second clamp members 304r has a prismatic shape that is long in the left-right direction. The front second clamp member 304r is disposed at the rear of the upper edge of the first movable wall 301f, and the rear second clamp member 304r is disposed at the upper edge of the second movable wall 301r.

The first movable wall 301f is driven independently by a first transport width changing motor, which will be described later, and the second movable wall 301r is driven independently by a second transport width changing motor, which will be described later. Therefore, the first circuit board Bf and the second circuit board Br having different widths in the front-rear direction can be sandwiched between the pair of front and rear first clamp members 304f and the pair of front and rear second clamp members 304r.

(Substrate transfer device 36)
The substrate transfer device 36 includes a first substrate transfer unit 360f and a second substrate transfer unit 360r. The first substrate transport unit 360f and the second substrate transport unit 360r are included in the concept of the “substrate transport unit” of the present invention.

A first lane Lf is defined in the first substrate transfer unit 360f. The first substrate transport unit 360f includes a pair of front and rear conveyor belts. The front conveyor belt is disposed on the rear surface of the fixed wall 300, and the rear conveyor belt is disposed on the front surface of the first movable wall 301f. A first circuit board Bf is installed between the pair of front and rear conveyor belts. The first circuit board Bf is transported from the left to the right in the first lane Lf by the first substrate transport unit 360f.

A second lane Lr is defined in the second substrate transport unit 360r. The second substrate transport unit 360r includes a pair of front and rear conveyor belts. The front conveyor belt is disposed on the rear surface of the first movable wall 301f, and the rear conveyor belt is disposed on the front surface of the second movable wall 301r. A second circuit board Br is installed between the pair of front and rear conveyor belts. The second circuit board Br is transported from the left to the right in the second lane Lr by the second board transport unit 360r.

(Substrate lifting device 35)
The substrate lifting / lowering device 35 includes a first substrate lifting / lowering part 350f and a second substrate lifting / lowering part 350r. The first substrate lifting part 350f and the second substrate lifting part 350r are included in the concept of the “substrate lifting part” of the present invention.

Mainly as shown in FIG. 3, the first substrate elevating part 350f is arranged between a pair of front and rear first clamp members 304f. The first substrate elevating part 350f includes a first ball screw part 351f, a first backup table 352f, and a number of first backup pins 353f. The first backup table 352f has a rectangular plate shape. The first backup table 352f is movable in the vertical direction by the first ball screw portion 351f. A number of first backup pins 353f are disposed on the upper surface of the first backup table 352f. The multiple first backup pins 353f can support the lower surface of the first circuit board Bf. The second substrate elevating part 350r is disposed between the pair of front and rear second clamp members 304r. The configuration of the second substrate elevating unit 350r is the same as the configuration of the first substrate elevating unit 350f.

The altitude of the first circuit board Bf can be switched to the transport altitude C1, the mounting altitude C2, and the standby altitude C3 by the first board elevating part 350f. At the transfer height C1, the first circuit board Bf is supported by the first board transfer unit 360f. The mounting height C2 is set higher than the transport height C1. At the mounting height C2, the first circuit board Bf is sandwiched from above and below by a pair of front and rear first clamp members 304f and a large number of first backup pins 353f. The standby altitude C3 is set higher than the transport altitude C1 and lower than the mounting altitude C2. At the standby altitude C3, the first circuit board Bf is supported by a large number of first backup pins 353f. At the standby altitude C3, the maximum altitude of the electronic component Pf already mounted on the first circuit board Bf and the maximum altitude of the pair of front and rear first clamp members 304f coincide with each other.

(XY robot 31)
The X direction corresponds to the left-right direction, the Y direction corresponds to the front-rear direction, and the Z direction corresponds to the up-down direction. The XY robot 31 includes a Y direction slider 310, an X direction slider 311, a pair of left and right Y direction guide rails 312, and a pair of upper and lower X direction guide rails 313.

The pair of left and right Y-direction guide rails 312 are arranged on the upper surface of the housing internal space of the module 3. The Y-direction slider 310 has a long block shape in the left-right direction. The Y-direction slider 310 is attached to a pair of left and right Y-direction guide rails 312 so as to be slidable in the front-rear direction. The pair of upper and lower X-direction guide rails 313 is disposed on the front surface of the Y-direction slider 310. The X direction slider 311 has a rectangular plate shape. The X-direction slider 311 is attached to a pair of upper and lower X-direction guide rails 313 so as to be slidable in the left-right direction.

(Mounting head 32, parts camera 34)
The mounting head 32 is attached to the X direction slider 311. For this reason, the mounting head 32 can be moved in the front-rear and left-right directions by the XY robot 31. The mounting head 32 can slide downward with respect to the X-direction slider 311 by a Z-axis motor (not shown). A cylindrical holder (not shown) projects from the lower surface of the mounting head 32. The holder can be rotated around the axis (θ direction) by a θ-axis motor (not shown). A suction nozzle 320 is attached to the holder. A negative pressure or a positive pressure is supplied to the suction nozzle 320 via a pipe (not shown).

The parts camera 34 is disposed in front of the fixed wall 300. The imaging area of the parts camera 34 is above the parts camera 34. The suction nozzle 320 (that is, the mounting head 32) that sucks the electronic components Pf and Pr passes above the parts camera 34. At this time, the suction state of the electronic components Pf and Pr with respect to the suction nozzle 320 is imaged.

<Electrical configuration of electronic component mounting machine>
Next, the electrical configuration of the electronic component mounting machine of this embodiment will be described. FIG. 4 shows a block diagram of the electronic component mounting machine of the present embodiment. As shown in FIG. 4, the control device 7 includes a computer 70 and a plurality of drive circuits. The computer 70 includes an input / output interface 700, a calculation unit 701, and a storage unit 702.

The input / output interface 700 is connected via a drive circuit to a first transfer width change motor 309f, a second transfer width change motor 309r of the substrate clamp device 30, a first lift motor 359f of the substrate lift device 35, and a second lift. The motor 359r, the first transport motor 369f of the substrate transport device 36, the second transport motor 369r, the X-axis motor 319a of the XY robot 31, the Y-axis motor 319b, the Z-axis motor 329a of the mounting head 32, and the θ-axis motor 329b are electrically connected. It is connected to the. The image processing apparatus 8 is electrically connected to the input / output interface 700. A parts camera 34 is electrically connected to the image processing apparatus 8.

The signal from each device of the electronic component mounting machine 1 is intensively transmitted to the computer 70. The storage unit 702 stores various programs such as a production program necessary for mounting the electronic components Pf and Pr. In addition, the storage unit 702 stores the transport altitude C1, the mounting altitude C2, the standby altitude C3, the production time of the first circuit board Bf and the second circuit board Br, the number of production, the types of electronic components Pf and Pr, the number of points, the coordinates, and the like. Is stored. The arithmetic unit 701 produces the first circuit board Bf and the second circuit board Br based on the production program.

<Electronic component mounting machine movement>
Next, the movement of the electronic component mounting machine of this embodiment during circuit board production will be described. The movement of the electronic component mounting machine according to the present embodiment during circuit board production includes a second clamping operation, a second mounting operation, a first standby operation, a first switching operation, and a first mounting operation. ing. FIG. 5 shows a timing chart of the movement of the electronic component mounting machine of the present embodiment during circuit board production.

[Second clamping work]
In the second clamping operation, first, as shown in FIG. 2, the second circuit board Br is moved to the second mounting area Ar. The second mounting area Ar is included in the concept of “mounting area” of the present invention. Specifically, as shown in FIG. 4, the control device 7 drives the second transport motor 369 r of the substrate transport device 36. That is, as shown in FIG. 1, the pair of front and rear conveyor belts of the second substrate transport unit 360r are rotated. Then, the second circuit board Br on the pair of front and rear conveyor belts is moved to the second mounting area Ar.

Next, in the second mounting area Ar, as shown in FIG. 3, the second circuit board Br is raised from the transport height C1 to the mounting height C2. Specifically, as shown in FIG. 4, the control device 7 drives the second lifting motor 359 r of the substrate lifting device 35. That is, as shown in FIG. 3, the second circuit board Br is lifted from the second board transport section 360r by the multiple second backup pins 353r of the second board lifting / lowering section 350r. Then, the second circuit board Br is sandwiched from above and below by the pair of front and rear second clamp members 304r and a large number of second backup pins 353r. That is, the second circuit board Br is brought into a clamped state.

[Second installation work]
In the second mounting operation, as shown in FIG. 3, the electronic component Pr is mounted on the second circuit board Br. Specifically, as shown in FIG. 4, the control device 7 drives an X-axis motor 319a, a Y-axis motor 319b, a Z-axis motor 329a, and a θ-axis motor 329b. That is, as shown in FIG. 3, first, the electronic component Pr at the suction position B <b> 1 is sucked by the suction nozzle 320 of the mounting head 32. Next, the mounting head 32 is moved to the mounting position B <b> 2 by a movement path A <b> 1 passing over the parts camera 34. Then, the electronic component Pr is mounted at the mounting position B2.

[First standby work]
The first standby operation is performed in parallel with the second mounting operation. When the first circuit board Bf is carried in from the upstream side of the first lane Lf, first, similarly to the second circuit board Br in the second clamping operation, as shown in FIG. Move to the mounting area Af and stop. The first mounting area Af is included in the concept of “mounting area” of the present invention. Next, like the second circuit board Br in the second clamping operation, the first circuit board Bf is raised in the first mounting area Af as shown in FIG. However, the first circuit board Bf is raised not to the mounting altitude C2 but to the standby altitude C3. For this reason, the electronic component Pf mounted on the first circuit board Bf does not protrude upward from the pair of front and rear first clamp members 304f. Therefore, it is not necessary to put a path for avoiding the electronic component Pf in the movement path A1 of the mounting head 32.

[First switching work]
The first switching work is performed in parallel with the final stage of the second mounting work. The second mounting operation ends with the completion of mounting the electronic component Pr on the second circuit board Br as an end condition. The control device 7 starts the first switching operation when the number of parts of the unmounted electronic part Pr becomes equal to or less than a predetermined number. In the first switching work, as shown in FIG. 3, the first circuit board Bf is raised from the standby altitude C3 to the mounting altitude C2. Specifically, as shown in FIG. 4, the control device 7 drives the first lifting motor 359 f of the substrate lifting device 35. That is, as shown in FIG. 3, the first circuit board Bf is raised by a large number of first backup pins 353f of the first board raising / lowering part 350f. The first circuit board Bf is sandwiched from above and below by the pair of front and rear first clamp members 304f and a large number of first backup pins 353f. That is, the first circuit board Bf is brought into a clamped state. The first switching work is completed simultaneously with the end of the second mounting work.

[First installation work]
In the first mounting operation, as in the second mounting operation, the electronic component Pf is mounted on the first circuit board Bf as shown in FIG. The second clamping operation is performed in parallel with the first mounting operation. That is, the produced second circuit board Br is carried out from the second mounting area Ar, and a new second circuit board Br is carried into the second mounting area Ar. Then, the new second circuit board Br is held in the clamped state.

<Effect>
Next, the effect of the electronic component mounting machine of this embodiment is demonstrated. According to the electronic component mounting machine 1 of the present embodiment, as shown in FIG. 3, when the mounting head 32 transports the electronic component Pr to the second circuit board Br, the control device 7 determines the altitude of the first circuit board Bf. Set to standby altitude C3. For this reason, the efficiency of the conveyance operation of the electronic component Pr with respect to the 2nd circuit board Br can be made high. Specifically, the movement time of the mounting head 32 can be shortened. Further, the moving distance of the mounting head 32 can be shortened. Further, the power consumption of the mounting head 32 can be reduced.

Further, according to the electronic component mounting machine 1 of the present embodiment, as shown in FIG. 3, the standby altitude C3 is set to a limit altitude where the electronic component Pf does not protrude upward from the first clamp member 304f. For this reason, it is possible to quickly switch from the standby altitude C3 to the mounting altitude C2. Further, when the electronic component Pr is transported to the second circuit board Br, the mounting head 32 does not need to avoid the electronic component Pf already mounted on the first circuit board Bf.

Further, according to the electronic component mounting machine 1 of the present embodiment, as shown in FIG. 5, the control device 7 starts the first switching work prior to the end of the second mounting work. For this reason, downtime can be reduced compared with the case where the 1st switching work starts after the 2nd mounting work is completed.

Also, according to the electronic component mounting machine 1 of the present embodiment, as shown in FIG. 5, the control device 7 ends the first switching operation simultaneously with the end of the second mounting operation. For this reason, downtime can be reduced compared with the case where the first switching work is finished after the second mounting work is finished.

Further, according to the electronic component mounting machine 1 of the present embodiment, the end condition of the second mounting operation is completion of mounting of the electronic component Pr on the second circuit board Br. For this reason, the downtime accompanying the completion of production of the second circuit board Br can be reduced.

<< Second Embodiment >>
The difference between the electronic component mounting machine of this embodiment and the electronic component mounting machine of the first embodiment is that the first mounting area and the second mounting area are set so as to be shifted from each other over the entire length in the left-right direction. Is a point. Here, the differences will be described.

FIG. 6 shows a top view of the electronic component mounting machine of the present embodiment. In addition, about the site | part corresponding to FIG. 2, it shows with the same code | symbol. In FIG. 6, the housing of the module 3, the Y-direction slider, the Y-direction guide rail, and the X-direction guide rail are omitted. Further, hatching is applied to the suction position B1, the first circuit board Bf, and the second circuit board Br.

As shown in FIG. 6, the first mounting area Af is set on the right side (downstream side) of the base 90. On the other hand, the second mounting area Ar is set on the left side (upstream side) of the base 90. There is no overlapping portion between the first mounting area Af and the second mounting area Ar when viewed from the front or rear.

The electronic component mounting machine 1 of the present embodiment has the same functions and effects as those of the electronic component mounting machine of the first embodiment with respect to the parts having the same configuration. Further, according to the electronic component mounting machine 1 of the present embodiment, the first circuit board Bf does not interfere with the movement path A1 of the mounting head 32 when producing the second circuit board Br as viewed from above. For this reason, the efficiency of the operation of transporting the electronic component with respect to the second circuit board Br can be increased. Specifically, the movement time of the mounting head 32 can be shortened. Further, the moving distance of the mounting head 32 can be shortened. Further, the power consumption of the mounting head 32 can be reduced.

<< Third embodiment >>
The difference between the electronic component mounting machine of this embodiment and the electronic component mounting machine of the first embodiment is that the movement path of the mounting head during the second mounting operation is based on nine unit areas of the second circuit board. This is the point that has been set. Here, the differences will be described.

FIG. 7 shows a top view of the electronic component mounting machine of the present embodiment. In addition, about the site | part corresponding to FIG. 2, it shows with the same code | symbol. FIG. 8 shows a schematic diagram of the movement path of the mounting head of the electronic component mounting machine. In FIG. 7, the housing of the module 3, the Y direction slider, the Y direction guide rail, and the X direction guide rail are omitted. Further, hatching is applied to the suction position B1, the first circuit board Bf, and the second circuit board Br.

As shown in FIG. 7, in the second mounting operation, when the electronic component Pr is mounted at the mounting position B2, as shown in FIG. 3, the first circuit board Bf is held at the standby altitude C3. For this reason, the mounting head 32 does not have to avoid the electronic component Pf already mounted on the first circuit board Bf.

However, in the second circuit board Br, the electronic component Pr may already be mounted between the parts camera 34 and the mounting position B2. In this case, it is necessary to avoid the mounted electronic component Pr.

Therefore, the control device divides the second circuit board Br into nine unit areas Br11 to Br33. In the unit area BrXY, the X part number corresponds to the X direction (left and right direction) position, and the Y part number corresponds to the Y direction (front and back direction) position.

The mounting position B2 is set in the unit area Br33. In the seven unit areas Br12 to Br32 other than the unit areas Br11 and Br33, the electronic parts Pr are already mounted. One electronic component Pr is mounted on each of the unit areas Br12, Br13, Br21, Br23, Br31, Br32. The control device recognizes the altitude of each electronic component Pr as the representative altitude of the unit areas Br12, Br13, Br21, Br23, Br31, Br32 in which the electronic component Pr is mounted.

In the unit area Br22, four electronic components Pr are mounted. As shown in FIG. 8, the control device recognizes the altitude of the two electronic components Pr having the highest altitude as the representative altitude of the unit area Br22. That is, the control device recognizes the altitude status of the second circuit board Br as shown by the dotted line in FIG. The control device sets the movement path A1 of the mounting head 32 based on the horizontal direction coordinates of the unit areas Br11 to Br33 and the representative altitude.

The electronic component mounting machine 1 of the present embodiment has the same functions and effects as those of the electronic component mounting machine of the first embodiment with respect to the parts having the same configuration. Further, according to the electronic component mounting machine 1 of the present embodiment, the movement path A1 is set more precisely than when the control device sets the movement path A1 on the assumption that the altitude of the entire second circuit board Br is constant. can do. For this reason, the electronic component Pr already mounted on the second circuit board Br can be avoided with a small movement of the mounting head 32. Therefore, the efficiency of the operation of transporting the electronic component Pr with respect to the mounting position B2 of the second circuit board Br can be increased.

<< Fourth Embodiment >>
The difference between the electronic component mounting machine of the present embodiment and the electronic component mounting machine of the third embodiment is that the electronic component conveyed by the mounting head extends over two unit areas. Here, the differences will be described.

FIG. 9 shows a schematic diagram of the movement path of the mounting head of the electronic component mounting machine of this embodiment. In addition, about the site | part corresponding to FIG. 8, it shows with the same code | symbol. As shown in FIG. 9, the electronic component Pr conveyed by the mounting head 32 has a rectangular plate shape that is long in the left-right direction. The electronic component Pr being transported extends over two unit areas Br11 to Br33 adjacent in the left-right direction.

The control device sets the movement route A1 in consideration of the representative altitudes of the two unit areas Br11 to Br33 adjacent in the left-right direction. That is, of the representative altitudes of the two unit areas Br11 to Br33 adjacent in the left-right direction, the higher representative altitude is recognized as the total representative altitude of the two unit areas Br11 to Br33. For example, the total representative altitude of the unit areas Br11 and Br21 is the representative altitude of the unit area Br21. The total representative altitude of the unit areas Br21 and Br31 is the representative altitude of the unit area Br21 or the unit area Br31. The control apparatus sets the movement route A1 in consideration of the plurality of total representative altitudes thus authorized.

The electronic component mounting machine according to the present embodiment has the same operational effects as the electronic component mounting machine according to the third embodiment with respect to parts having a common configuration. When the electronic component Pr extends over the plurality of unit areas Br11 to Br33 as in the present embodiment, the total representative altitude of the plurality of unit areas Br11 to Br33 may be recognized to set the movement route A1.

<< Fifth Embodiment >>
The difference between the electronic component mounting machine of this embodiment and the electronic component mounting machine of the first embodiment is that the mounting of the electronic component on the second circuit board and the mounting of the electronic component on the first circuit board are alternately performed. It is a point. Here, the differences will be described.

FIG. 10 is a partial right side view (part 1) of the electronic component mounting machine according to the present embodiment. FIG. 11 is a partial right side view (No. 2) of the electronic component mounting machine. In addition, about the site | part corresponding to FIG. 3, it shows with the same code | symbol. As shown in FIG. 10, both the first circuit board Bf and the second circuit board Br are in a clamped state. The first circuit board Bf and the second circuit board Br are the same type of circuit boards.

First, as shown in FIG. 10, the mounting head 32 mounts a predetermined electronic component Pr at a predetermined mounting position B2r of the second circuit board Br. Next, as shown in FIG. 11, the mounting head 32 mounts a predetermined electronic component Pf at a predetermined mounting position B2f of the first circuit board Bf. The horizontal coordinate of the mounting position B2r on the second circuit board Br and the horizontal coordinate of the mounting position B2f on the first circuit board Bf coincide. Further, the electronic component Pr and the electronic component Pf are the same type. The mounting head 32 carries the same kind of electronic components Pr and Pf twice in succession.

The electronic component mounting machine of the present embodiment has the same operational effects as those of the electronic component mounting machine of the first embodiment with respect to parts having a common configuration. Further, according to the electronic component mounting machine of the present embodiment, the movement path A1r of the mounting head 32 during the production of the second circuit board Br, the movement path A1f of the mounting head 32 during the production of the first circuit board Bf, There are many common parts. For this reason, the efficiency of the conveyance operation of the electronic components Pr and Pf can be increased.

<< Sixth Embodiment >>
The difference between the electronic component mounting machine of the present embodiment and the electronic component mounting machine of the first embodiment is that the second mounting operation is performed while the first mounting operation is not completed. Here, the differences will be described.

FIG. 12 shows a top view of the electronic component mounting machine of the present embodiment. In addition, about the site | part corresponding to FIG. 2, it shows with the same code | symbol. As shown in FIG. 12, according to the electronic component mounting machine 1 of the present embodiment, the second mounting operation is performed without completing the first mounting operation. The reason is that the electronic component Pf is insufficient in the first mounting operation performed before the second mounting operation. That is, in order to reduce downtime associated with the replenishment of the electronic component Pf, the first mounting operation is shifted to the second mounting operation.

In the initial stage of the second mounting work, the work of shifting the position of the first circuit board Bf in the left-right direction is performed in parallel. Specifically, the first mounting area Af is set so that the mounting position B2 where the electronic component is not mounted and the parts camera 34 are aligned in a straight line when viewed from above while the first circuit board Bf is held at the standby altitude. The operation of shifting to the right with respect to the second mounting area Ar is performed.

The electronic component mounting machine of the present embodiment has the same operational effects as those of the electronic component mounting machine of the first embodiment with respect to parts having a common configuration. Further, according to the electronic component mounting machine 1 of the present embodiment, the entire length of the movement path A1 of the mounting head 32 can be shortened in the second first mounting operation.

By the way, when the electronic component Pf is mounted on both the upper and lower surfaces of the first circuit board Bf (so-called double-side mounting), a large number of first backup pins 353f (see FIG. 3) are mounted on the lower surface of the first circuit board Bf. The lower surface of the first circuit board Bf is supported while avoiding the electronic component Pf.

However, when the first mounting area Af is shifted to the right with respect to the second mounting area Ar, the first circuit board Bf, that is, the electronic component Pf already mounted on the lower surface is moved to the right with respect to the first backup pin. Will move. For this reason, there is a possibility that the electronic component Pf and the first backup pin interfere with each other.

Therefore, in the case of the electronic component mounting machine of the present embodiment, the first backup pin is arranged in advance at a position where the first backup pin does not interfere with the electronic component Pf even if the mounted electronic component Pf moves in the left-right direction. Has been. For this reason, the first mounting area Af can be shifted in the left-right direction with respect to the second mounting area Ar while avoiding interference between the electronic component Pf and the first backup pin.

If a flexible first backup member (for example, a first backup member made of a flexible porous material such as urethane foam) is disposed instead of the first backup pin, the mounted electronic component Pf moves in the left-right direction. Even so, the first backup member can be deformed in accordance with the shape of the electronic component Pf. Moreover, what is necessary is just to remove a 1st backup pin, when the electronic component Pf is not mounted in the lower surface of 1st circuit board Bf. That is, the first circuit board Bf may be disposed directly on the upper surface of the first backup table 352f (see FIG. 3). Alternatively, the first circuit board Bf may be temporarily lowered to the transfer height, and the first circuit board Bf may be moved in the left-right direction by the first substrate transfer unit 360f (see FIG. 3).

<< Seventh Embodiment >>
The difference between the electronic component mounting machine of the present embodiment and the electronic component mounting machine of the first embodiment is that the electronic component conveyed by the mounting head is large in the second mounting operation. Here, the differences will be described.

FIG. 13 shows a partial right side view of the electronic component mounting machine of the present embodiment. In addition, about the site | part corresponding to FIG. 3, it shows with the same code | symbol. As shown in FIG. 13, the total length A4 in the front-rear direction of the electronic component Pr is longer than the imaging area A3 of the parts camera 34. When such an electronic component Pr is imaged, the electronic component Pr is divided and imaged by passing above the parts camera 34.

Here, if the first circuit board Bf is in a clamped state, that is, if the electronic component Pf already mounted on the first circuit board Bf protrudes upward from the pair of front and rear first clamp members 304f, The electronic component Pf interferes with the electronic component Pr being imaged. For this reason, the suction nozzle 320, that is, the electronic component Pr is rotated by 90 ° in the horizontal direction by using the θ-axis motor 329b of FIG. Need to be moved to.

However, in this case, the direction toward the second circuit board on which the electronic component Pr is to be mounted differs from the moving direction of the electronic component Pr during imaging by 90 °. For this reason, the electronic component Pr moves away from the second circuit board by imaging.

In this regard, according to the electronic component mounting machine 1 of the present embodiment, the first circuit board Bf is held at the standby altitude. For this reason, the electronic component Pf already mounted on the first circuit board Bf does not interfere with the electronic component Pr being imaged. Therefore, the electronic component Pr can be moved in the front-rear direction with respect to the parts camera 34. Therefore, the direction toward the second circuit board and the moving direction of the electronic component Pr during imaging are easily aligned. Thus, according to the electronic component mounting machine 1 of the present embodiment, even when the electronic component Pr is large, the movement path of the mounting head 32 is unlikely to be redundant.

<< Other >>
The embodiment of the electronic component mounting machine according to the present invention has been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.

FIG. 14 is a perspective view of an electronic component mounting machine according to another embodiment. The housing of the module 3 is shown in a transparent manner. Moreover, about the site | part corresponding to FIG. 1, it shows with the same code | symbol. As shown in FIG. 14, the electronic component mounting machine 1 includes a component supply device 4 and an NG parts discharge device 6.

The component supply device 4 is mounted on the carriage 91. The component supply device 4 includes a case 40, a magazine 41 (indicated by a dotted line), a shuttle conveyor 42, and a disposal box 43.

The case 40 has a rectangular box shape that is long in the vertical direction. A tray outlet (not shown) is opened on the rear surface of the case 40. The magazine 41 has a rectangular box shape. The magazine 41 is accommodated inside the case 40. The magazine 41 is movable in the vertical direction. A large number of trays 410 are stacked in the vertical direction inside the magazine 41. A large number of electronic components P are mounted on the large number of trays 410, respectively. The shuttle conveyor 42 extends behind the case 40. The shuttle conveyor 42 is connected to the tray outlet. The disposal box 43 is disposed at the lower part of the carriage 91.

By moving the magazine 41 up and down, the tray 410 on which a desired electronic component P is mounted can be taken out from the case 40. Further, the tray 410 can be sent backward by the shuttle conveyor 42. The tray 410 that has been emptied due to the loss of the electronic component P is sent out to the disposal box 43 by an arm (not shown).

The NG parts discharge device 6 is arranged on the left side of the component supply device 4. The NG parts discharge device 6 includes a discharge conveyor 60. A defective electronic component P is placed on the discharge conveyor 60 by the suction nozzle 320. The placed electronic component P is discharged by the discharge conveyor 60 in front of the component supply device 4, that is, outside the machine.

FIG. 15 is a perspective view of the mounting head after the suction nozzle replacement of the electronic component mounting machine of the present embodiment. As shown in FIGS. 14 and 15, the suction nozzle 320 of the mounting head 32 is appropriately replaced according to the type of the electronic component P.

According to the electronic component mounting machine 1 of the present embodiment, the operation of bringing the first circuit board Bf or the second circuit board Br into the clamped state and the operation of discarding the empty tray 410 in the disposal box 43 are performed in parallel. Can be done. Here, “parallel” means that at least a part of both operations overlaps with time. According to the electronic component mounting machine 1 of the present embodiment, it is possible to reduce downtime compared to the case where both operations are performed separately over time.

In addition, according to the electronic component mounting machine 1 of the present embodiment, the operation of putting the first circuit board Bf or the second circuit board Br in the clamped state and the operation of discharging the defective electronic component P to the outside by the discharge conveyor 60. Can be performed in parallel. According to the electronic component mounting machine 1 of the present embodiment, it is possible to reduce downtime compared to the case where both operations are performed separately over time.

In addition, according to the electronic component mounting machine 1 of the present embodiment, the operation of bringing the first circuit board Bf or the second circuit board Br into the clamped state and the operation of replacing the suction nozzle 320 can be performed in parallel. it can. According to the electronic component mounting machine 1 of the present embodiment, it is possible to reduce downtime compared to the case where both operations are performed separately over time.

By the way, in the electronic component mounting machine 1, various devices (the substrate clamp device 30, the XY robot 31, the mounting head 32, the parts camera 34, the substrate lifting device 35, the substrate transport device 36, etc.) are slightly affected by heat during driving. However, it may be deformed. When various devices are deformed, the relative positional relationship between the devices changes. For this reason, the electronic component mounting machine 1 periodically corrects errors due to thermal deformation of various devices. Specifically, a mark (not shown) arranged on the lower surface of the mounting head 32 is imaged by the parts camera 34, and the error is corrected based on the displacement of the mark with respect to the reference state. When the work for bringing the first circuit board Bf or the second circuit board Br into the clamped state and the correction work are performed in parallel, the downtime is reduced as compared with the case where both work are performed separately over time. Can be reduced.

The number of lanes of the electronic component mounting machine 1 is not particularly limited. Three or more may be used. Specifically, there may be three or more substrate transfer units (first substrate transfer unit 360f, second substrate transfer unit 360r). Further, the number of mounting heads 32 is not particularly limited. A single mounting head 32 may be shared by a plurality of lanes.

In the electronic component mounting machine 1 of the first embodiment, when the number of lanes is set to three or more, as shown in FIG. 3, the waiting circuit board existing in the movement path A1 of the mounting head 32 is set at the standby altitude C3. By holding, the effect of the first embodiment can be obtained.

In the above embodiment, the component supply device 4 is arranged only on the first lane Lf side. However, the component supply device 4 may be arranged not only on the first lane Lf side but also on the second lane Lr side. For example, the base 90 may be disposed on both the front and rear sides. In this case, the entire amount of the electronic component Pf mounted on the first circuit board Bf may not be supplied from the component supply device 4 on the first lane Lf side. That is, at least a part of the electronic component Pf may be supplied from the component supply device 4 on the second lane Lr side. The same applies to the electronic component Pr mounted on the second circuit board Br.

In the above embodiment, the parts camera 34 is arranged only on the first lane Lf side. However, the parts camera 34 may be arranged not only on the first lane Lf side but also on the second lane Lr side. For example, a total of two part cameras 34 may be arranged in front of the fixed wall 300 and behind the second movable wall 301r. In this case, the two parts cameras 34 may be the same type of cameras or different types of cameras. When the two part cameras are different types of cameras, one part camera 34 may be used for imaging a small electronic component, and the other part camera 34 may be used for imaging a large electronic component. In this case, the parts camera 34 suitable for imaging the electronic component sucked by the suction nozzle 320 may be provided on the side (for example, the rear side) far from the side (for example, the front side) on which the electronic component is sucked.

Two component supply devices 4 and two part cameras 34 are arranged on the first lane Lf side and the second lane Lr side, respectively, and electronic components supplied from the component supply device 4 on the second lane Lr side. Even when Pf is mounted on the first circuit board Bf or when the electronic component Pf imaged by the parts camera 34 on the second lane Lr side is mounted on the first circuit board Bf, the above embodiment (for example, The effects of the first embodiment, the second embodiment, and the seventh embodiment) can be obtained.

Further, as shown in FIG. 5, in the first embodiment, the first switching work is performed in parallel with the final stage of the second mounting work. However, the first switching work may be performed in parallel with the initial stage of the first mounting work. Specifically, among the first mounting work, the suction work for picking up the electronic component Pf first mounted on the first circuit board Bf to the suction position and the first switching work may be performed in parallel. Good.

Here, “parallel” means that at least a part of the adsorption work and at least a part of the first switching work overlap with each other over time. In this way, the downtime can be reduced compared to the case where the suction work starts after the first switching work is completed.

Further, as shown in FIG. 5, in the first embodiment, the first standby work and the first switching work are intermittently performed. However, when the first circuit board Bf carried from the upstream side is moved to the first mounting area Af and stopped in the first standby work, the first switching work start condition (for example, an unmounted electronic component) If the Pr component count is less than or equal to the predetermined score), as shown in FIG. 3, the first circuit board Bf is directly raised at once from the transport height C1 to the mounting height C2. May be. That is, the first standby work and the first switching work may be performed continuously.

Further, as shown in FIG. 5, in the first embodiment, the end condition of the second mounting operation is that the mounting of the electronic component Pr to the second circuit board Br is completed. However, the end condition may be a mounting trouble of the electronic component Pr on the second circuit board Br. In this way, downtime associated with trouble can be reduced. Further, the end condition may be that the electronic component Pr is out of component with respect to the second circuit board Br. In this way, the downtime due to the part running out can be reduced.

Further, as shown in FIG. 5, in the first embodiment, the control device 7 starts the first switching work at the timing when the number of parts of the unmounted electronic parts Pr becomes equal to or less than a predetermined number. However, the first switching operation may be started at a timing when the number of “electronic component suction-electronic component mounting cycle” repeated by the mounting head 32 becomes a predetermined number or less. Further, the first switching operation may be started at a timing when the estimated remaining production time is within a predetermined time. In addition, the program of the control apparatus 7 may determine automatically the timing which starts a 1st switching operation | work. An operator may input to the control device 7.

Further, as shown in FIG. 5, in the first embodiment, the second clamping work is performed in parallel with the first mounting work. That is, the new second circuit board Br was held in a clamped state. However, when the component supply device 4 is disposed on both the front and rear sides of the base 90 and the electronic component Pf supplied from the rear component supply device 4 is mounted on the first circuit board Bf, the new second circuit board Br has a standby altitude C3. Retained. Similarly, when the part camera 34 is disposed in front of the fixed wall 300 and behind the second movable wall 301r, and the electronic component Pf imaged by the rear part camera 34 is mounted on the first circuit board Bf, a new second circuit is provided. The substrate Br is held at the standby altitude C3.

Further, in the first embodiment, the description has been given based on the case where the production of the circuit board is alternately performed on the first lane Lf and the second lane Lr. However, it is not indispensable that production is performed alternately on both lanes.

For example, when the production of the second circuit board Br is finished, the new first circuit board Bf is not loaded into the first lane Lf and the new first circuit board Bf is loaded into the first lane Lf. When a new second circuit board Br is carried into the second lane Lr before, the production of the second circuit board Br may be performed continuously.

Further, as shown in FIG. 6, in the second embodiment, the first mounting area Af and the second mounting area Ar are set so as not to overlap completely over the entire length in the left-right direction. However, the first mounting area Af and the second mounting area Ar may be set so as to partially overlap.

For example, when the mounting head 32 moves from the suction position B1 to the mounting position of the second circuit board Br during the production of the second circuit board Br, in order to avoid electronic components mounted on the second circuit board Br, The head 32 may be raised.

In this case, in view of the movement distance in the vertical direction required for the second circuit board Br, avoiding an electronic component having a lower altitude than the electronic component already mounted on the second circuit board Br is a useless vertical movement. Must not.

Therefore, even if the electronic component mounted portion of the first circuit board Bf and the electronic component mounted portion of the second circuit board Br exist in the movement path A1 of the mounting head 32, the first circuit board If the maximum altitude of the electronic component of Bf is less than or equal to the maximum altitude of the electronic component of the second circuit board Br, the vertical movement is not wasted. Thus, you may set so that 1st mounting area Af and 2nd mounting area Ar may overlap partially.

Further, when setting the first mounting area Af and the second mounting area Ar, the vertical movement time of the mounting head 32 that can be reduced by shifting the mounting area, and the horizontal of the mounting head 32 that increases by shifting the mounting area ( The first mounting area Af and the second mounting area Ar may be set so that the total movement time of the mounting head 32 is minimized by comparing the movement time in the front / rear / left / right direction. Further, the first mounting area Af and the second mounting area Ar may be set by a similar method so that the total moving distance and the total power consumption are minimized.

In addition, as shown in FIG. 8, in the third embodiment, when determining the movement path A1 of the mounting head 32, the mounting head 32 moving time in the vertical direction that can be reduced by avoiding the mounted electronic component Pr; The movement path A1 is set so that the total movement time of the mounting head 32 is minimized by comparing the movement time of the mounting head 32 that increases by avoiding the mounted electronic component Pr. You may decide. Further, the movement route A1 may be determined by a similar method so that the total movement distance and the total power consumption are minimized.

In the fourth embodiment, the movement route A1 is determined by the same method as the third embodiment so that any one of the total movement time, the total movement distance, and the total power consumption of the mounting head 32 is minimized. May be.

As shown in FIG. 11, in the fifth embodiment, the horizontal coordinate of the mounting position B2r on the second circuit board Br and the horizontal coordinate of the mounting position B2f on the first circuit board Bf are the same. Explained the case. However, the effect of the fifth embodiment can be obtained if the mounting position B2r and the mounting position B2f match at least the coordinates in the substrate transport direction (left-right direction).

In the fifth embodiment, a common movement path A1r of the mounting head 32 during the production of the second circuit board Br and a movement path A1f of the mounting head 32 during the production of the first circuit board Bf are continuous. The greater the number of parts, the higher the efficiency of the electronic component Pr, Pf carrying operation.

For this reason, in the fifth embodiment, the second circuit board Br and the first circuit board Bf are the same type of circuit board, and the horizontal coordinates of the mounting position B2r on the second circuit board Br and the first circuit board Bf The case where the horizontal coordinate of the mounting position B2f at the same position coincides and the electronic component Pr and the electronic component Pf are the same kind of electronic component is illustrated.

However, when the second circuit board Br and the first circuit board Bf are dissimilar circuit boards, or when the suction position B1 between the electronic component Pr and the electronic component Pf that are continuously conveyed is different, or the mounting position B2r. Even if the horizontal coordinates of the mounting position B2f are different from each other, by increasing the common part between the movement path A1r and the movement path A1f as a result of other factors, the electronic components Pr and Pf are as much as possible. The efficiency of the transfer operation can be increased.

In the above embodiment, the parts camera 34 and the mounting head 32 are separated from each other, but the parts camera 34 may be attached to the mounting head 32. This eliminates the need for the mounting head 32 to pass above the parts camera 34 as shown in FIG. For this reason, the freedom degree of the setting of movement path | route A1 of the mounting head 32 becomes high.

Further, as shown in FIG. 8, in the third embodiment, nine unit areas Br11 to Br33 are set on the second circuit board Br. However, the number of unit areas Br11 to Br33 is not particularly limited. As the number of arrangements increases, the movement route A1 can be set more precisely.

Further, a plurality of unit areas may be set not on the second circuit board Br but on the first circuit board Bf. In this case, even when the first circuit board Bf is held at the mounting altitude C2, or even when the first circuit board Bf is held at the standby altitude C3, the standby altitude C3 is high (the first circuit board). Even when the electronic component Pf mounted on Bf protrudes upward from the pair of front and rear first clamp members 304f), the mounting head 32 moves the electronic component Pf mounted on the first circuit board Bf with a small movement. Can be avoided. For this reason, the efficiency of the conveyance operation of the electronic components Pf and Pr can be increased.

FIG. 16 shows a partial right side view of the electronic component mounting machine when three unit areas are set on the first circuit board. In addition, about the site | part corresponding to FIG. 13, it shows with the same code | symbol. As shown in FIG. 16, the first circuit board Bf is in a clamped state. For this reason, the electronic component Pf protrudes upward from the pair of front and rear first clamp members 304f.

The total length A4 in the front-rear direction of the electronic component Pr is longer than the imaging area A3 of the parts camera 34. When such an electronic component Pr is imaged, the electronic component Pr is divided and imaged by passing above the parts camera 34. Three unit areas Bf1 to Bf3 are set on the first circuit board Bf.

If the three unit areas Bf1 to Bf3 are not set, the control device determines the altitude of the first circuit board Bf of the two electronic components Pf at the rear of the three electronic components Pf (hatching is performed). It is recognized as an altitude A5 (the highest altitude of the highest electronic component Pf among the mounted electronic components Pf). For this reason, the altitude A5 of the first circuit board Bf becomes higher than the minimum altitude A6 of the electronic component Pr being imaged. Therefore, the suction nozzle 320, that is, the electronic component Pr is rotated by 90 ° in the horizontal direction using the θ-axis motor 329b of FIG. 4, and the electronic component Pr is moved in the left-right direction, not the front-rear direction, with respect to the part camera 34. Must be moved.

On the other hand, when three unit areas Bf1 to Bf3 are set, the control device sets the representative altitude of the unit area Bf1 to A7, the representative altitude of the unit area Bf2 to A5, the representative altitude of the unit area Bf3 to A5, And certify separately. The control device determines that the representative altitude A7 of the unit area Bf1 is lower than the minimum altitude A6 of the electronic component Pr. That is, even if the first circuit board Bf is in a clamped state, the control device determines that the electronic component Pr can be imaged while moving in the front-rear direction while avoiding interference with the mounted electronic component Pf.

As described above, if a plurality of unit areas Bf1 to Bf3 are set on the first circuit board Bf, the representative altitude can be recognized for each of the unit areas Bf1 to Bf3. Therefore, even if the first circuit board Bf is in the clamped state. The electronic component Pr can be easily moved in the front-rear direction with respect to the parts camera 34. For this reason, the direction toward the second circuit board and the moving direction of the electronic component Pr during imaging are easily aligned. Therefore, even when the electronic component Pr is large, the movement path of the mounting head 32 is not easily redundant.

Alternatively, the position of the first mounting area Af may be set so that the electronic component Pr being imaged by the parts camera 34 and the electronic component Pf already mounted on the first circuit board Bf do not interfere with each other. At this time, it is not essential that the first circuit board Bf does not overlap the parts camera 34 over the entire length in the left-right direction. Of the first circuit board Bf, at least a portion having a highly mounted electronic component Pf that interferes with the electronic component Pr being imaged does not overlap the moving region of the electronic component Pr being imaged in the left-right direction. . When setting the position of the first mounting area Af, as shown in FIG. 16, a plurality of unit areas Bf1 to Bf3 are set on the first circuit board Bf, and based on the representative altitude recognized for each unit area Bf1 to Bf3. The optimum position may be set.

Note that the embodiments (FIGS. 8, 9, and 16) in which a plurality of unit areas are set on the circuit board can be used for an electronic component mounting machine having three or more lanes. Moreover, it can also be used for an electronic component mounting machine having a single lane. Even in this case, the electronic component already mounted on the circuit board can be avoided with a small movement of the mounting head. For this reason, the efficiency of the electronic component conveyance operation can be increased.

Claims

A board transfer device having a plurality of board transfer sections for transferring the circuit board at a transfer height and stopping the circuit board in the mounting area;
A board lifting device having a plurality of board lifting and lowering portions that raise the circuit board stopped in the mounting area from the transport height to a mounting height for mounting electronic components on the circuit board;
A component supply device for supplying the electronic component for mounting to the suction position;
A mounting head having a suction nozzle that is shared by the plurality of circuit boards in the plurality of mounting areas, sucks the electronic component at the suction position, and mounts the electronic component at the mounting position of the circuit board at the mounting height; ,
The substrate transfer device, the substrate lifting device, the component supply device, a control device for controlling the mounting head;
An electronic component mounting machine comprising:
The plurality of circuit boards include a first circuit board and a second circuit board,
When the mounting head transports the electronic component from the suction position to the mounting position of the circuit board farther from the suction position among the first circuit board and the second circuit board,
The control device sets the altitude of the circuit board closer to the suction position of the first circuit board and the second circuit board to a standby altitude that is higher than the transport altitude and lower than the mounting altitude. Electronic component mounting machine.
Of the first mounting operation for mounting the electronic component on the first circuit board and the second mounting operation for mounting the electronic component on the second circuit board, the electronic component is mounted on the circuit board far from the suction position. Prior to the end of the installation work to install the
The control device includes a first switching operation for switching the altitude of the first circuit board from the standby altitude to the mounting altitude and a second switching operation for switching the altitude of the second circuit board from the standby altitude to the mounting altitude. The electronic component mounting machine according to claim 1, wherein a switching operation for switching the altitude of the circuit board closer to the suction position from the standby altitude to the mounting altitude is started.
A board transfer device having a plurality of board transfer sections for transferring the circuit board at a transfer height and stopping the circuit board in the mounting area;
A board lifting device having a plurality of board lifting and lowering portions that raise the circuit board stopped in the mounting area from the transport height to a mounting height for mounting electronic components on the circuit board;
A component supply device for supplying the electronic component for mounting to the suction position;
A mounting head having a suction nozzle that is shared by the plurality of circuit boards in the plurality of mounting areas, sucks the electronic component at the suction position, and mounts the electronic component at the mounting position of the circuit board at the mounting height; ,
The substrate transfer device, the substrate lifting device, the component supply device, a control device for controlling the mounting head;
An electronic component mounting machine comprising:
The plurality of circuit boards include a first circuit board and a second circuit board,
When the mounting head transports the electronic component from the suction position to the mounting position of the circuit board farther from the suction position among the first circuit board and the second circuit board,
The control device is configured to prevent the first circuit board and the second circuit board closer to the suction position from interfering with the moving path of the mounting head when viewed from above. An electronic component mounting machine, wherein a circuit board and the second circuit board are arranged to be shifted from each other.
The control device divides the circuit board far from the suction position among the first circuit board and the second circuit board into a plurality of unit areas, and among the electronic components mounted on the unit areas The altitude of the electronic component having the highest altitude is set to the representative altitude of the unit area, and when the mounting head transports the electronic component from the suction position to the mounting position, The electronic component mounting machine according to any one of claims 1 to 3, wherein a moving path of the mounting head is set based on a direction coordinate and the representative altitude.