WO2023084647A1

WO2023084647A1 - Component mounter and component mounting system

Info

Publication number: WO2023084647A1
Application number: PCT/JP2021/041380
Authority: WO
Inventors: 公夫藤井; 貴幸仲
Original assignee: 株式会社Fuji
Priority date: 2021-11-10
Filing date: 2021-11-10
Publication date: 2023-05-19

Abstract

This component mounter mounts electronic components on a substrate. The component mounter is provided with: an accommodation part for accommodating an electronic component; a component taking-out mechanism for taking out the electronic component accommodated in the accommodation part; a component placement part on which the electronic component having been taken out from the accommodation part by the component taking-out mechanism is placed; a nozzle for sucking the electronic component placed on the component placement part; a nozzle moving mechanism for moving the nozzle from the component placement part to the substrate; and a discarding mechanism for discarding, when the electronic component placed on the component placement part has not been sucked by the nozzle, the electronic component from the component placement part.

Description

Component mounting machine and component mounting system

This specification relates to a component mounting machine and a component mounting system that mount electronic components on a board.

In order to supply electronic components to be mounted on a substrate in a component mounting machine, it is possible to provide an accommodating section for accommodating the electronic components before mounting and a component mounting section for placing the electronic components taken out from the accommodating section. be. In such a component mounter, the component take-out mechanism takes out the electronic component accommodated in the accommodation section and moves it to the component placement section. Thereafter, the nozzle picks up the electronic component placed on the component mounting portion, moves the nozzle picking up the electronic component to the board, and mounts the electronic component on the board. For example, Japanese Unexamined Patent Application Publication No. 2012-80003 discloses an example of a component mounter that includes an accommodation section and a component placement section. The component mounter disclosed in Japanese Patent Application Laid-Open No. 2012-80003 includes a discharge section for discharging defective electronic components. is sucked by the nozzle and moved to the discharge section. As a result, defective electronic components are removed from the component placement section.

In the component mounter disclosed in Japanese Patent Application Laid-Open No. 2012-80003, a defective electronic component is sucked by a nozzle and moved to a discharge section. However, if the electronic component placed on the component mounting portion cannot be picked up by the nozzle due to damage of the nozzle or the like, the electronic component cannot be picked up by the nozzle and removed. In such a case, the electronic component remains on the component mounting portion, limiting the number of electronic components that can be mounted on the component mounting portion.

This specification discloses a technique for removing electronic components that could not be picked up by the nozzle from the component placement unit.

The component mounter disclosed in this specification mounts electronic components on boards. A component mounter includes an accommodating portion for accommodating electronic components, a component pick-up mechanism for picking out the electronic components accommodated in the accommodating portion, and a component placement portion for placing the electronic components picked out from the accommodating portion by the component pick-up mechanism. a nozzle for picking up the electronic component placed on the component mounting portion; a nozzle moving mechanism for moving the nozzle from the component mounting portion to the substrate; a discarding mechanism for discarding the electronic component from the component placement section when the electronic component is not removed.

Further, the component mounting system disclosed in this specification includes a component housing device that houses electronic components, and a component mounter that mounts the electronic components housed in the component housing device on a board. The component storage device includes a component pick-up mechanism for picking up electronic components housed in the component storage device, and a component placement section on which the electronic component taken out from the component storage device by the component pick-up mechanism is placed. A component mounter includes a nozzle that picks up an electronic component placed on a component mount, and a nozzle moving mechanism that moves the nozzle from the component mount to a substrate. The component mounting system is installed in either the component storage device or the component mounter, and discards the electronic component from the component placement section when the electronic component placed on the component placement section is not picked up by the nozzle. further comprising a discarding mechanism for

If the electronic components on the component mounting section are not picked up by the nozzle, the electronic components will remain on the component mounting section. By discarding the electronic components on the component mounting section that are not picked up by the nozzle by the discarding mechanism, the electronic components left on the component mounting section can be discarded. As a result, it is possible to avoid leaving unnecessary electronic components on the component mounting portion. Therefore, productivity can be improved.

1 is a top view showing a schematic configuration of a component mounting system according to Examples 1 to 3; FIG. FIG. 2 is a block diagram showing the control system of the mounter of Examples 1 to 3; FIG. 2 is a block diagram showing the control system of the component storage device of Examples 1 and 2; The top view which shows schematic structure of a shuttle. 5 is a flowchart showing an example of processing of the control device of the mounter when discarding the electronic components left on the shuttle in the first embodiment; 5 is a flow chart showing an example of processing of the control device of the component storage device when discarding the electronic components left on the shuttle in the first embodiment. 10 is a flow chart showing an example of processing of the control device of the component mounter when discarding the electronic components left on the shuttle in the second embodiment. The block diagram which shows the control system of the components accommodation apparatus of Example 3. FIG. 10 is a flowchart showing an example of processing of the control device of the component storage device when discarding the electronic components left on the shuttle in the third embodiment;

The main features of the embodiments described below are listed. It should be noted that the technical elements described below are independent technical elements, exhibiting technical usefulness alone or in various combinations, and are limited to the combinations described in the claims as filed. not a thing

In the component mounter disclosed in this specification, the discarding mechanism may include a discarded component storage unit. If the electronic component placed on the component mounting portion is not picked up by the nozzle, the new electronic component is picked up by the component picking mechanism when it is picked up from the accommodating portion and placed on the component mounting portion. The missing electronic components may be moved from the component placement section to the discarded component storage section. According to such a configuration, even if the nozzle cannot pick up the electronic component, when a new electronic component is placed on the component placement section using the component pick-up mechanism, the electronic component that has not been picked up can be placed on the component placement section. is moved to the discarded parts storage section. As a result, electronic components that cannot be picked up by the nozzle can be prevented from remaining on the component mounting portion.

The component mounter disclosed in this specification may have multiple nozzles. The disposal mechanism may include another nozzle that picks up an electronic component placed on the component placement section when one nozzle does not pick up the electronic component. According to such a configuration, even if one nozzle fails to pick up the electronic component, the electronic component is moved from the component placement section using a nozzle different from the nozzle that failed to pick up the electronic component. As a result, it is possible to prevent electronic components from remaining on the component mounting portion.

In the component mounter disclosed in this specification, the disposal mechanism may include a discarded component storage section arranged below the component placement section, and a reversing mechanism for reversing the component placement section. The reversing mechanism may reverse the component mounting section and dispose of the electronic components that were not picked up in the discarded component storage section when the electronic components mounted on the component mounting section were not picked up by the nozzle. . According to such a configuration, by inverting the component mounting section by the reversing mechanism, it is possible to remove from the component mounting section any electronic component that has not been picked up by the nozzle and remains on the component mounting section.

(Example 1)
A component mounting system 1 according to an embodiment will be described with reference to the drawings. As shown in FIG. 1 , the component mounting system 1 includes a component mounter 10 and a component storage device 40 .

First, the component mounter 10 will be explained. The component mounter 10 is a device that mounts the electronic component 4 on the board 60 . The component mounter 10 is also called an electronic component mounting device or a chip mounter. Usually, the component mounter 10 is installed side by side with other board working machines such as a solder printer and a board inspection machine to form a series of mounting lines. The component mounter 10 includes a board transfer device 16 , a mounting head 18 , a nozzle station 20 , an imaging device 22 , a disposal box 23 , a control device 24 and a transmitter/receiver 26 .

The board transfer device 16 carries in, positions, and carries out the board 60 . The substrate transfer device 16 can include, for example, a pair of belt conveyors and a support device (not shown) that supports the substrate 60 from below. The board 60 carried in by the board transfer device 16 is positioned at the working position, the electronic components 4 are mounted at predetermined positions on the board 60 , and then carried out by the board transfer device 16 .

The mounting head 18 has a nozzle 6 that picks up the electronic component 4 . The mounting head 18 has a plurality of nozzles 6, and has eight nozzles 6 in this embodiment. The nozzle 6 is detachably attached to the mounting head 18 . The mounting head 18 can move the nozzle 6 in the Z direction (here, the vertical direction), and brings the nozzle 6 closer to and away from the shuttle 50 (described in detail later) and the substrate 60 . The mounting head 18 can pick up the electronic component 4 from the shuttle 50 with the nozzle 6 and mount the electronic component 4 picked up by the nozzle 6 onto the board 60 . Although the mounting head 18 has a plurality of nozzles 6 in this embodiment, it may have a single nozzle 6 . The mounting head 18 is connected to a head moving device (not shown), and the mounting head 18 is moved within the mounter 10 by the head moving device. Specifically, the head moving device moves the mounting head 18 between the shuttle 50 (described later in detail) and the substrate 60 . The head moving device can be, for example, an orthogonal robot that moves the mounting head 18 in the XY directions.

The nozzle station 20 is arranged between the control device 24 and the substrate transfer device 16 . The nozzle station 20 can accommodate a plurality of nozzles 6 and delivers the nozzles 6 to and from the mounting head 18 .

The imaging device 22 is arranged between the control device 24 and the substrate transfer device 16 . The imaging device 22 has a camera and a light source. The camera is arranged so that its imaging direction is directed upward, and images the nozzle 6 sucking the electronic component 4 from below. That is, when the nozzle 6 sucks the electronic component 4 , the camera photographs the lower surface of the electronic component 4 sucked by the nozzle 6 . A CCD camera, for example, is used as the camera. The light source is composed of an LED and illuminates the lower surface (imaging surface) of the electronic component 4 sucked by the nozzle 6 . Image data of an image captured by the imaging device 22 is stored in a memory (not shown) of the control device 24 .

The disposal box 23 is arranged between the control device 24 and the substrate transfer device 16 . A waste box 23 accommodates a defective nozzle 6 . Specifically, when the nozzle 6 does not pick up the electronic component 4 , the nozzle 6 is disposed of in the disposal box 23 .

The transmitting/receiving unit 26 is communicably connected to a management device (not shown) and the component housing device 40, and transmits and receives information to and from the management device and the component housing device 40. Further, the transmitting/receiving section 26 is connected to the control device 24 . The transmitting/receiving unit 26 acquires information to be transmitted to the management device and the component storage device 40 from the control device 24 and outputs information received from the management device and the component storage device 40 to the control device 24 .

The control device 24 is configured using a computer having a CPU and a storage device. The control device 24 controls the operation of each part of the mounter 10 based on a production program transmitted from a management device (not shown). As shown in FIG. 2, the control device 24 is connected to the substrate transport device 16, the mounting head 18, the imaging device 22, and the transmitter/receiver 26, and controls the substrate transport device 16, the mounting head 18, the imaging device 22, and the transmitter/receiver 26. It controls each part of

Next, the component storage device 40 will be explained. The component accommodation device 40 accommodates the electronic components 4 to be mounted by the component mounter 10 and supplies the accommodated electronic components 4 to the component mounter 10 . As shown in FIGS. 1 and 3, the component storage device 40 includes a magazine 42, a wafer mounting section 44, a substrate transfer device 46, a shuttle head 48, a shuttle 50, a temporary placement table 54, and a control device. 56 and a transmitter/receiver 58 .

The magazine 42 accommodates a plurality of wafers 62. In this embodiment, the electronic component 4 is a component obtained by cutting the wafer 62 . The wafer mounting part 44 mounts the wafers 62 accommodated in the magazine 42 . The wafers 62 accommodated in the magazine 42 are moved to the wafer mounting section 44 by a wafer moving device (not shown).

The board transfer device 46 carries in and out the board 60 . The substrate transport device 46 includes, for example, a pair of belt conveyors. The board transfer device 46 is arranged continuously with the board transfer device 16 of the component mounter 10 in the transfer direction (the X direction in FIG. 1). The board 60 carried into the component storage device 40 by the board transfer device 46 is carried into the component mounter 10 by the board transfer device 46 and the board transfer device 16 . No work is performed on the substrate 60 in the component storage device 40 . The board 60 carried into the component accommodation device 40 by the board transfer device 46 waits in the component accommodation device 40 until it is carried into the component mounter 10 .

The shuttle head 48 picks up the electronic component 4 from the wafer 62 and moves it onto the shuttle 50 . Shuttle head 48 moves between wafer platform 44 and shuttle 50 . The shuttle head 48 has a suction mechanism (for example, a nozzle) that suctions the electronic component 4 , and suctions the electronic component 4 from the wafer 62 . Also, the shuttle head 48 is connected to a moving device (not shown) and moves among the wafer mounting section 44 , the shuttle 50 and the temporary table 54 . The moving device can be, for example, an orthogonal robot that moves the shuttle head 48 in the XY directions.

The shuttle 50 carries the electronic components 4 mounted on the board 60 by the component mounter 10 . As shown in FIG. 4, the shuttle 50 is provided with a plurality of (eight in this embodiment) cavities 51 . Cavity 51 has a shape that can accommodate electronic component 4 . The electronic component 4 picked up by the shuttle head 48 is accommodated within the cavity 51 .

The shuttle 50 also includes a drive device 52 and a negative pressure generator 53 (see FIG. 3). The shuttle 50 is configured to be movable in the transport direction (the X direction in FIG. 1) by a driving device 52, and is positioned to be accommodated in the component storage device 40 (a position moved to the left from the position of the shuttle 50 shown in FIG. 1). , to a position (position shown in FIG. 1) straddling between the component storage device 40 and the component mounter 10. As shown in FIG. When housing the electronic component 4 picked up by the shuttle head 48 into the cavity 51 , the shuttle 50 is moved to a position where it can be accommodated in the component housing device 40 . Further, when the electronic component 4 is accommodated in the cavity 51 , the shuttle 50 is moved to a position straddling between the component accommodation device 40 and the component mounter 10 . The negative pressure generator 53 is connected to a suction port (not shown) provided in each cavity 51 . When the negative pressure generator 53 is turned on while the electronic component 4 is accommodated in the cavity 51, the electronic component 4 in the cavity 51 is sucked and held in the cavity.

The temporary placement table 54 is used to temporarily place the electronic component 4 picked up by the shuttle head 48 before placing it on the shuttle 50 . Specifically, when the electronic components 4 picked up from the wafer 62 cannot be placed on the shuttle 50 because the electronic components 4 remain on the shuttle 50, the electronic components 4 picked up by the shuttle head 48 are placed on the temporary placement table. 54 temporarily. The electronic components 4 placed on the temporary placement table 54 are picked up again by the shuttle head 48 and placed on the shuttle 50 after the electronic components 4 left on the shuttle 50 are discarded.

The transmission/reception unit 58 is communicably connected to a management device (not shown) and the component mounter 10, and transmits and receives information to and from the management device and the component mounter 10. Further, the transmitting/receiving section 58 is connected to the control device 56 . The transmitting/receiving unit 58 acquires information to be transmitted to the management device and the component mounter 10 from the control device 56 and outputs information received from the management device and the component mounter 10 to the control device 56 .

The control device 56 (see FIG. 3) is configured using a computer having a CPU and a storage device. The control device 56 controls the operation of each part of the component storage device 40 . As shown in FIG. 3, the control device 56 is connected to the substrate transport device 46, the shuttle head 48, the drive device 52, the negative pressure generator 53 and the transmitter/receiver 58, and the substrate transport device 46, the shuttle head 48, the drive It controls each part of the device 52 , the negative pressure generator 53 and the transmitter/receiver 58 .

Next, the processing for discarding the electronic component 4 left on the shuttle 50 will be described. The electronic components 4 accommodated in the component accommodation device 40 are placed on the shuttle 50 and supplied to the component mounter 10 . In the mounter 10 , the electronic component 4 on the shuttle 50 is picked up by the nozzle 6 and moved onto the board 60 . At this time, the electronic component 4 may not be picked up by the nozzle 6 due to, for example, damage to the nozzle 6 . As a result, unnecessary electronic components 4 are left on the shuttle 50, and the number of electronic components 4 that can be placed next on the shuttle 50 is reduced. Processing for removing (discarding) the electronic components 4 left on the shuttle 50 when the electronic components 4 on the shuttle 50 cannot be picked up by the nozzle 6 will be described below.

First, the processing of the control device 24 of the mounter 10 will be described. As shown in FIG. 5, in a state in which the shuttle 50 is arranged in a position straddling between the component storage device 40 and the component mounter 10 (the position shown in FIG. 1), the control device 24 controls the shuttle 50 to All the electronic components 4 are caused to be sucked by the nozzles 6 (S12). As described above, in this embodiment the mounting head 18 has eight nozzles 6 and the shuttle 50 is provided with eight cavities 51 . The shuttle 50 is placed between the component storage device 40 and the component mounter 10 with the electronic components 4 accommodated in all eight cavities 51 . The mounting head 18 picks up the electronic component 4 with each of the eight nozzles 6 . The mounting head 18 can then move all the electronic components 4 on the shuttle 50 simultaneously from the shuttle 50 onto the substrate 60 .

Next, the controller 24 transmits to the transmitter/receiver 58 of the component storage device 40 via the transmitter/receiver 26 that all the electronic components 4 on the shuttle 50 have been picked up by the nozzles 6 (S14).

Next, the control device 24 determines whether or not an error in picking up the nozzle 6 occurred when the electronic component 4 was picked up by the nozzle 6 in step S12 (S16). Specifically, the control device 24 takes an image of each nozzle 6 from below with the imaging device 22 and determines whether or not the electronic component 4 is imaged. In the present embodiment, the imaging device 22 that takes an image of the nozzle 6 from below is used to determine whether or not there is a suction failure of the nozzle 6, but the configuration is not limited to this. It is sufficient if it is possible to determine whether or not the electronic component 4 is sucked to the nozzle 6. For example, it is possible to determine whether the electronic component 4 is sucked to the nozzle 6 from an image captured by an imaging device that captures an image of the nozzle 6 from the side. You can decide whether or not

If the image of the electronic component 4 has not been captured, that is, if the nozzle 6 has failed to pick up (YES in step S16), the controller 24 notifies the controller 24 via the transmitter/receiver 26 of the fact that the nozzle 6 has failed to pick up. is transmitted to the transmitting/receiving unit 58 of the component storage device 40 (S18). Since the control device 24 can specify the nozzle 6 in which the suction error occurred, it can also specify the position of the cavity 51 that accommodated the electronic component 4 in which the suction error occurred. At S18 , it is also transmitted to the transmitting/receiving section 58 of the component accommodating device 40 which electronic component 4 accommodated in which cavity among the eight cavities of the shuttle 50 has caused a picking error. On the other hand, if the image of the electronic component 4 is being captured, that is, if the suction error of the nozzle 6 has not occurred (NO in step S16 ), the control device 24 detects the suction error of the nozzle 6 via the transmission/reception unit 26 . It is transmitted to the transmitting/receiving section 58 of the component accommodating device 40 that no such error has occurred (S20).

Next, the processing of the control device 56 of the component storage device 40 will be explained. As shown in FIG. 6, the control device 56 controls the component mounting machine 10 in a state where the shuttle 50 is arranged in a position straddling between the component accommodating device 40 and the component mounting machine 10 (the position shown in FIG. 1). (S22). When the process of step S14 described above is executed, the transmitting/receiving section 58 receives information regarding the end of pickup from the transmitting/receiving section 26 of the mounter 10 . By outputting the information received by the transmitting/receiving unit 58 to the control device 56, the control device 56 acquires the information regarding the end of adsorption. If the information on the end of adsorption has not been acquired (NO in step S22), the process waits until the information on the end of adsorption is acquired.

When the information regarding the end of suction is acquired (YES in step S22), the control device 56 drives the drive device 52 to move the shuttle 50 to a position where it can be accommodated in the component storage device 40 (S24). Next, the controller 56 picks up the electronic component 4 from the wafer 62 with the shuttle head 48 (S26).

Next, the control device 56 determines whether or not it has received information on whether or not the nozzle 6 has failed to pick up (hereinafter also referred to as "picking information") from the component mounter 10 (S28). When the process of step S18 or step S20 described above is executed, the transmitting/receiving section 58 receives the information regarding suction from the transmitting/receiving section 26 of the component mounter 10 . Specifically, when the process of step S18 described above is executed, the transmitting/receiving section 58 receives information that an adsorption error has occurred, and when the process of step S20 described above is executed, the transmitting/receiving section 58 Receive information that no pick-up error has occurred. If the information on adsorption has not been acquired (NO in step S28), the process waits until the information on adsorption is acquired.

When the information on suction is acquired (YES in step S28), the control device 56 determines whether or not the suction error of the nozzle 6 has occurred based on the information on adsorption acquired in step S28 (S30). If the suction error of the nozzle 6 has occurred (YES in step S30), the control device 56 places the electronic component 4 picked up in step S26 on the temporary placement table 54 (S32). When the nozzle 6 fails to pick up, the electronic component 4 remains on the shuttle 50 without being taken out from the shuttle 50 . If the electronic components 4 remain on the shuttle 50 , all the electronic components 4 to be supplied to the component mounter 10 next (ie, eight pieces) cannot be placed on the shuttle 50 . For this reason, the electronic component 4 picked up in step S26 is temporarily placed on the temporary placement table 54 . Then, the controller 56 picks up the electronic components 4 remaining on the shuttle 50 with the shuttle head 48 (S34). At this time, since the control device 56 knows in which cavity the electronic component 4 on the shuttle 50 is not picked up, the electronic component 4 on the shuttle 50 can be quickly picked up. Next, the controller 56 discards the electronic component 4 picked up by the shuttle head 48 (S36). Specifically, the control device 56 moves the electronic component 4 picked up by the shuttle head 48 to a disposal box (not shown) installed inside the component storage device 40 . As a result, no electronic component 4 remains on the shuttle 50 .

Next, the control device 56 picks up the electronic component 4 placed on the temporary placement table 54 with the shuttle head 48 (S38). Then, the control device 56 places the picked up electronic component 4 on the shuttle 50 (S40).

On the other hand, if no nozzle 6 pick-up error has occurred (NO in step S30), the shuttle 50 is in a state where no electronic component 4 is left. Therefore, the processing of steps S32 to S38 is skipped, and the control device 56 places the picked up electronic component 4 on the shuttle 50 (S40).

In this embodiment, even if the nozzle 6 fails to pick up and electronic components 4 remain on the shuttle 50 , the shuttle head 48 is used to dispose of the electronic components 4 remaining on the shuttle 50 . This makes it possible to avoid unnecessary electronic components 4 being left on the shuttle 50 .

In this embodiment, the electronic components 4 picked up by the shuttle head 48 are temporarily placed on the temporary placement table 54 in step S26, and then the electronic components 4 remaining on the shuttle 50 are picked up by the shuttle head 48 and discarded. However, it is not limited to such a configuration. For example, the shuttle head 48 may have a suction mechanism for picking up the electronic components 4 remaining on the shuttle 50 in addition to the suction mechanism for moving the electronic components 4 from the wafer 62 to the shuttle 50 . In this case, when the electronic component 4 remains on the shuttle 50 due to the suction error of the nozzle 6 , the electronic component 4 picked up from the wafer 62 by the shuttle head 48 is not once placed on the temporary placement table 54 . With the electronic components 4 picked up from the wafer 62, the electronic components 4 remaining on the shuttle 50 can be removed using another suction mechanism.

(Example 2)
In the above-described first embodiment, when the electronic component 4 remains on the shuttle 50 due to the suction error of the nozzle 6, the electronic component 4 remaining on the shuttle 50 is discarded using the shuttle head 48. It is not limited to such a configuration. For example, in the component mounter 10, the electronic components 4 left on the shuttle 50 may be discarded using a nozzle 6 different from the nozzle 6 that failed in picking up.

As shown in FIG. 7, first, the control device 24 controls the shuttle 50 in a state where the shuttle 50 is arranged in a position straddling between the component storage device 40 and the component mounter 10 (the position shown in FIG. 1). All the electronic components 4 above are sucked by the nozzle 6 (S42). Note that the processing of step S42 is the same as the processing of step S12 in the first embodiment, and detailed description thereof will be omitted.

Next, the control device 24 determines whether or not an error in picking up the nozzle 6 occurred when the electronic component 4 was picked up by the nozzle 6 in step S42 (S44). Note that the process of step S44 is the same as the process of step S16 in the first embodiment, so detailed description thereof will be omitted. In this embodiment, after step S42, the control device 24 determines whether or not a pick-up error of the nozzle 6 has occurred without transmitting information regarding the end of pick-up to the component storage device 40. FIG. Therefore, the controller 24 determines whether or not the nozzle 6 fails to pick up while the shuttle 50 is positioned between the component storage device 40 and the component mounter 10 . If no suction error of the nozzle 6 occurs (NO in step S44), the processing of steps S46 to S52 (the processing of removing the electronic component 4 left on the shuttle 50) is skipped, and the processing of step S54 is performed. proceed to

On the other hand, if there is an error in picking up the nozzle 6 (YES in step S44), the control device 24 causes the nozzle 6 that did not pick up the electronic component 4 in the process of step S42 to pick up the electrons remaining on the shuttle 50 again. The component 4 is sucked (S46). When the nozzle 6 fails to pick up, the nozzle 6 may be worn out or damaged and cannot pick up the electronic component 4 . However, for some reason, the nozzle 6 may not pick up the electronic component 4 even though the nozzle 6 is ready to pick up the electronic component 4 . In this case, if the same nozzle 6 is used to pick up the electronic component 4 again, the nozzle 6 may be able to pick up the electronic component 4 . Therefore, the control device 24 again causes the same nozzle 6 to pick up the electronic component 4 remaining on the shuttle 50 (S46), and determines whether or not the picking error of the nozzle 6 has occurred (S48). If the suction error of the nozzle 6 has not occurred (NO in step S48), the process of step S50 and step S52 is skipped and the process proceeds to step S54.

On the other hand, if the suction error of the nozzle 6 occurs again (YES in step S48), the control device 24 determines that there is a high possibility that the electronic component 4 cannot be picked up by the nozzle 6. Then, the control device 24 causes the electronic component 4 remaining on the shuttle 50 to be picked up by a nozzle 6 different from the nozzle 6 that could not pick up the electronic component 4 (S50). At this time, if there are any remaining nozzles 6 provided in the mounting head 18 (that is, nozzles 6 other than the nozzles 6 that could not pick up the electronic component 4) that do not pick up the electronic component 4, the control device 24 , the electronic parts 4 remaining on the shuttle 50 are picked up by the nozzles 6 which are not picking up the electronic parts 4 . When the electronic component 4 is sucked by all of the remaining nozzles 6 of the mounting head 18 (that is, the nozzles 6 other than the nozzles 6 that could not pick up the electronic component 4), the control device 24 determines that the nozzles 6 After the sucked electronic component 4 is mounted on the substrate 60, any one of the nozzles 6 is made to suck the electronic component 4 remaining on the shuttle 50.例文帳に追加Further, the control device 24 may mount a new nozzle 6 on the mounting head 18 and cause the new nozzle 6 to pick up the electronic component 4 remaining on the shuttle 50 . In this case, the control device 24 discards the nozzle 6 that failed to pick up the electronic component 4 in the disposal box 23 and mounts a new nozzle 6 housed in the nozzle station 20 on the mounting head 18 . Then, the control device 24 causes the new nozzle 6 to pick up the electronic component 4 remaining on the shuttle 50 .

Next, the control device 24 determines whether or not an error in picking up the nozzle 6 occurred when the electronic component 4 was picked up by the nozzle 6 in step S50 (S52). If the suction error of the nozzle 6 has occurred (YES in step S52), the process returns to step S50, and the processes of steps S50 and S52 are repeated. That is, the controller 24 causes another nozzle 6 to pick up the electronic component 4 remaining on the shuttle 50 . Alternatively, the electronic component 4 remaining on the shuttle 50 may be sucked again by the same nozzle 6 (the nozzle 6 that picked up the electronic component 4 in step S50) by returning to the process of step S46. On the other hand, if no nozzle 6 pick-up error has occurred (YES in step S52), the control device 24 determines that there is no electronic component 4 left on the shuttle 50. FIG. Then, the control device 24 transmits the information regarding the end of the suction to the transmission/reception unit 58 of the component storage device 40 via the transmission/reception unit 26 (S54). As a result, the control device 56 of the component storage device 40 acquires the information regarding the end of suction and moves the shuttle 50 to a position where it can be accommodated in the component storage device 40 .

In the present embodiment, even if an electronic component 4 remains on the shuttle 50 due to a suction error of the nozzle 6 , the electronic component 4 remaining on the shuttle 50 is removed by the nozzle 6 sucking it. That is, when the electronic component 4 remains on the shuttle 50, the electronic component 4 is removed from the shuttle 50 on the mounter 10 side. When the control device 56 acquires the information about the end of picking up, no electronic component 4 remains on the shuttle 50 . Therefore, also in this embodiment, it is possible to avoid unnecessary electronic components 4 being left on the shuttle 50 .

In this embodiment, when the nozzle 6 fails to pick up the electronic component 4, the nozzle 6 that did not pick up the electronic component 4 picks up the electronic component 4 remaining on the shuttle 50 again. Not limited. For example, when a nozzle 6 fails to pick up an electronic component 4, the electronic component 4 remaining on the shuttle 50 is not picked up again by the nozzle 6 that did not pick up the electronic component 4, and another nozzle 6 remains on the shuttle 50. The electronic component 4 may be adsorbed. That is, steps S46 and S48 may be omitted. If the nozzle 6 is no longer able to pick up the electronic component 4 due to exhaustion or the like, the electronic component 4 cannot be picked up even if the processing for picking up the electronic component 4 is executed again. will waste time. By omitting the process of causing the same nozzle 6 to suck the electronic component 4 again, the time required for the process of removing the electronic component 4 remaining on the shuttle 50 can be reduced.

(Example 3)
In the first embodiment described above, the electronic components 4 left on the shuttle 50 are discarded using the shuttle head 48 in the component storage device 40 , and in the second embodiment described above, the nozzle 6 is used in the component mounter 10 to dispose of the shuttle 50 . Although the electronic component 4 left on top was discarded, the configuration is not limited to this. For example, when the electronic component 4 remains on the shuttle 50 due to the suction error of the nozzle 6 , the electronic component 4 remaining on the shuttle 50 may be discarded by reversing the shuttle 50 .

As shown in FIG. 8, the component storage device 140 of this embodiment includes a rotation mechanism 150 that rotates the shuttle 50 in addition to the configuration of the component storage device 40 of the first and second embodiments. The rotating mechanism 150 is configured to rotate the shuttle 50 around an axis parallel to the transport direction. The rotation mechanism 150 reverses the shuttle 50 so that the upper surface of the shuttle 50 (the surface on which the cavity 51 is provided) faces downward, and also reverses the shuttle 50 so that the upper surface of the shuttle 50 faces upward again. It should be noted that the configuration of the component storage device 140 of this embodiment is substantially the same as the configuration of the component storage device 40 of the above-described first and second embodiments except for the rotating mechanism 150 . Therefore, the description of the configuration similar to that of the component storage device 40 of the first and second embodiments will be omitted.

Next, a description will be given of the process of discarding the electronic component 4 left on the shuttle 50 in this embodiment. In addition, in the present embodiment, the processing of the control device 24 of the mounter 10 is the same as that of the above-described first embodiment, so detailed description thereof will be omitted.

As shown in FIG. 9, the control device 56, in a state in which the shuttle 50 is arranged at a position straddling between the component storage device 40 and the component mounter 10 (the position shown in FIG. 1), receives information regarding the completion of pickup. has been received (S62), and waits until information regarding the end of adsorption is received (NO in step S62). When receiving the information about the end of suction (YES in step S62), the control device 56 moves the shuttle 50 to a position where it can be accommodated in the component storage device 40 (S64), and the shuttle head 48 picks up the electronic component 4 from the wafer 62 ( S66). After that, the control device 56 determines whether or not the information on adsorption has been received (S68), and waits until the information on adsorption is received (NO in step S68). When receiving the information about suction (YES in step S68), the control device 56 determines whether or not a suction error of the nozzle 6 has occurred (S70). Note that the processing of steps S62 to S70 is the same as the processing of steps S22 to S30 in the first embodiment, so detailed description thereof will be omitted.

If no suction error of the nozzle 6 has occurred (NO in step S70), no electronic component 4 is left on the shuttle 50. Therefore, the process of steps S72 to S76 (the process of removing the electronic components 4 left on the shuttle 50) is skipped. On the other hand, if the suction error of the nozzle 6 has occurred (YES in step S70), the controller 56 causes the rotation mechanism 150 to rotate (reverse) the shuttle 50 (S72). Next, the controller 56 turns off the negative pressure generator 53 (S74). As a result, the suction from the suction port provided in the cavity 51 is stopped, and the suction to the electronic components 4 accommodated in the cavity 51 (the electronic components 4 remaining in the shuttle 50) is stopped. Since the shuttle 50 is turned upside down and the suction from the suction port is stopped with the cavity 51 facing downward, the electronic components 4 housed in the cavity 51 fall downward and fall below the shuttle 50 (in detail, are discarded in a discard box (not shown) arranged below the shuttle 50 when the shuttle 50 is arranged in a position where it can be accommodated in the component storage device 40 . After that, the controller 56 causes the rotation mechanism 150 to rotate (reverse) the shuttle 50 again (S76). As a result, the shuttle 50 is in a state in which the cavity 51 faces upward, and the electronic component 4 can be accommodated in the cavity 51 . In this embodiment, even if the suction error of the nozzle 6 occurs and the electronic components 4 remain on the shuttle 50, the remaining electronic components 4 on the shuttle 50 can be discarded by reversing the shuttle 50. . Therefore, also in this embodiment, it is possible to avoid unnecessary electronic components 4 being left on the shuttle 50 .

Points to note regarding the component mounting system 1 described in the embodiment will be described. The component storage device 40 of the embodiment is an example of a "storage section", the shuttle head 48 is an example of a "component pick-up mechanism", the shuttle 50 is an example of a "component placement section", and the mounting head 18 is an example of a "nozzle moving mechanism".

Specific examples of the technology disclosed in this specification have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. In addition, the technical elements described in this specification or in the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the techniques exemplified in this specification or drawings achieve multiple purposes at the same time, and achieving one of them has technical utility in itself.

Claims

A component mounter for mounting electronic components on a substrate,
a housing section that houses the electronic component;
a component retrieving mechanism for retrieving the electronic component housed in the housing;
a component placement section on which the electronic component taken out from the accommodating section by the component take-out mechanism is placed;
a nozzle for sucking the electronic component placed on the component placement portion;
a nozzle moving mechanism for moving the nozzle from the component mounting portion to the substrate;
a disposal mechanism for discarding the electronic component from the component mounting portion when the electronic component mounted on the component mounting portion is not sucked by the nozzle;
A component mounter.
The discarding mechanism includes a discarded component storage unit,
When the electronic component placed on the component placement section is not picked up by the nozzle, a new electronic component is taken out from the accommodation section by the component take-out mechanism and placed on the component placement section. 2. The component mounter according to claim 1, wherein the electronic component that has not been picked up is moved from the component placement unit to the waste component storage unit.
A plurality of nozzles are provided,
2. The component mounting according to claim 1, wherein said discarding mechanism includes another nozzle for picking up said electronic component placed on said component placement section when said electronic component is not picked up by one nozzle. machine.
The disposal mechanism is
a discarded component storage section disposed below the component placement section;
and a reversing mechanism for reversing the component placement unit,
The reversing mechanism reverses the component mounting section when the electronic component mounted on the component mounting section is not picked up by the nozzle, and removes the electronic component that has not been picked up from the component mounting section as the waste component. 2. The component mounter according to claim 1, which disposes in a part.
a component housing device for housing electronic components;
a component mounting machine that mounts the electronic component housed in the component housing device on a board,
The component storage device is
a component take-out mechanism for taking out the electronic component accommodated in the component accommodation device;
a component placement unit on which the electronic component taken out from the component storage device by the component take-out mechanism is placed;
The component mounter,
a nozzle for sucking the electronic component placed on the component placement portion;
a nozzle moving mechanism for moving the nozzle from the component mounting portion to the substrate;
When the electronic component placed on the component mounting section is not picked up by the nozzle, the electronic component is removed from the component mounting section. A component mounting system further comprising a discarding mechanism for discarding.