JP2002324999A - Method and apparatus for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for mounting an electronic component requiring no significant remodeling of components and the like in changing the number of suction nozzles for mounting an electronic component on a head for mounting, and capable of continuing transfer process by the suction nozzle for transfer to speed up the processing resulted from an improved operation rate of the apparatus. SOLUTION: Using a belt conveyer 25 as a transfer means for transferring an electronic component 7 fed toe a mounting position P1 of the packaging component by a suction nozzle for transferring to a component suction position P2 from where the component is transferred to a head 29 for mounting reduces remodeling of other components in response to modification of the number of the nozzles, 27a, 27b, 27c, and 27d, as well as continuously transfers with a nozzle 9 for transferring during transfer of the electronic component 7 to the component suction position P2, and further detects the nozzle 9 for transferring on the transfer path of the belt conveyer 25 to be able to reduce the number of sensors required for detecting failed feed of the electronic component 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a component transfer step of picking up electronic components on a tray carried into a fixed position of a component carry-in section by a transfer suction nozzle and transferring the electronic components to a mounting component mounting position.
Suction transfer process for transferring the electronic components supplied to the mounting component mounting position to the component pick-up position, which is the location for delivery to the mounting head, and mounting for mounting the electronic components transferred to the component pick-up position to the mounting head The present invention relates to an electronic component mounting method and an electronic component mounting machine that perform a component mounting step of sucking a suction nozzle and moving the mounting head to a fixed position on a circuit board on which the electronic component is mounted.

[0002]

2. Description of the Related Art FIG. 8 shows a configuration of a main part of a conventional electronic component mounting machine. The electronic component mounter 1 picks up the electronic component 7 on the tray 5 carried into the fixed position of the component carry-in part 3 by the transfer suction nozzle 9 and moves it to the mounting component mounting position P1. A suction transporting step of transporting the electronic component 7 supplied to the mounting component mounting position P1 to a component suction position P2, which is a delivery place to the mounting head 11, and mounting the electronic component 7 transported to the component suction position P2. Mounting suction nozzles 13a mounted on the mounting head 11,
A component mounting process is performed in which the electronic component 7 is moved to a fixed position on a circuit board on which the electronic component 7 is mounted by moving the mounting head 11 by suction at 13b and 13c.

The transfer suction nozzle 9 can be reciprocated between the component carry-in portion 3 and the mounting component mounting position P1 by a guide member 14, and the electronic components 7 on the component carry-in portion 3 are moved one by one. Move to mounting component mounting position P1.

In the suction conveyance step, a guide rail 1 is used as a conveyance means for conveying the electronic component 7 to a component suction position P2 separated by a distance S from the mounted component mounting position P1.
5, the mounting component mounting position P1 is shifted to the component suction position P2.
A shuttle table 17 capable of reciprocating in the section up to is adopted. The shuttle table 17 includes three mounting suction nozzles 13 mounted on the mounting head 11.
The size is set so that three electronic components 7 can be placed at the same intervals as the arrangement pitch of a, 13b, and 13c. The electronic component 7 placed on the shuttle table 17 is
The suction pad is embedded and mounted on the shuttle table 17 and held by suction.

[0005]

However, in the electronic component mounting machine 1 described above, for example, when the mounting head 11 is changed to one having a large number of mounting suction nozzles to be mounted, the shuttle table is required. 17 also needs to be changed accordingly, and the transfer range and the like by the transfer suction nozzle 9 also need to be changed, and a significant modification is required for the change in the number of mounting suction nozzles. There was a problem.

The supply of electronic components to the component pick-up position P2 by the shuttle table 17 is a batch process in which a certain number of electronic components are collectively conveyed, and while the shuttle table 17 is moving to the component pick-up position P2. However, the transfer processing by the transfer suction nozzle 9 cannot be performed, and there is a problem that the operation efficiency of the apparatus is poor.

Further, in order to detect a supply failure of the electronic components on the shuttle table 17, for example, a component detection sensor for detecting the presence or absence of the electronic components is provided for each mounting position of the electronic components on the shuttle table 17. In addition, there is a problem that the cost of the apparatus becomes high due to the increase in the number of sensors to be equipped.

The present invention has been made in view of the above circumstances, and does not require a large modification of components and the like in response to a change in the number of mounting suction nozzles on a mounting head. It is possible to respond flexibly, and while the electronic component is being conveyed to the component suction position P2, the transfer process by the transfer suction nozzle can be continued, thereby improving the operation rate of the apparatus. An electronic component mounting method capable of increasing the speed, further minimizing the number of sensors required for detecting a defective supply of electronic components, and reducing the cost of the apparatus by reducing the number of sensors; and It is an object to provide an electronic component mounting machine.

[0009]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic apparatus, comprising:
A component transfer process in which the component is sucked by the transfer suction nozzle and transferred to the mounting component mounting position, and a suction transfer in which the electronic component supplied to the mounting component mounting position is transferred to the component suction position where the electronic component is transferred to the mounting head. Process and component mounting where the electronic components conveyed to the component pick-up position are picked up by the mounting pick-up nozzle mounted on the mounting head and moved to a fixed position on the circuit board where the electronic components are mounted by moving the mounting head. And mounting the plurality of electronic components on the transport means at the same pitch as the arrangement pitch of the plurality of mounting suction nozzles, and the transport means for mounting the plurality of mounting nozzles. This is achieved by an electronic component mounting method, wherein the electronic component mounting method is configured to run along a direction in which suction nozzles are arranged, and the plurality of mounting suction nozzles simultaneously take out the plurality of electronic components on the transport unit.

It is another object of the present invention to provide a component loading section in which electronic components are loaded into a fixed position while being placed on a tray, and a component pick-up section mounted from a mounting component loading position which is appropriately separated from the component loading section. A transfer unit for transferring the electronic component to a position, a transfer suction nozzle for transferring the electronic component from the component loading unit to a mounting component mounting position of the transfer unit, and a transfer unit that is transferred to the component suction position by the transfer unit. A mounting head for picking up an electronic component with a mounting suction nozzle and mounting the electronic component at a fixed position on a circuit board placed at an appropriate distance from the component suction position, and a control for controlling the operation of each of the above units Electronic component mounting machine comprising a controller for mounting, wherein a belt conveyor running along an arrangement direction of a plurality of mounting suction nozzles mounted on the mounting head is used as the transporting means. It was achieved by the electronic component mounting apparatus, characterized in that.

According to the above configuration, the component suction position corresponding to the number of mounting suction nozzles in the mounting head is set on the conveying path of the belt conveyor. A change in the number of nozzles can be adequately dealt with only by changing the range of the component suction position set on the conveyor path of the belt conveyor, etc., and major remodeling of other components is required. Instead, it can be done with software. In addition, since the transfer process by the transfer unit is not a batch process but a continuous process, the transfer process by the transfer suction nozzle can be continued while the electronic component is being transferred to the component suction position. Can.

Preferably, in the electronic component mounting method and the electronic component mounting machine described above, the mounting component mounting position is the last mounting of a plurality of mounting suction nozzles mounted on the mounting head. It is good to set it as the composition set up in the adsorption possible range of the suction nozzle for use. In this case, for example, the component suction position provided on the mounting head is
According to the arrangement of the four mounting suction nozzles, four component suction positions are set on the belt conveyor,
The last component suction position is selected as the mounting component mounting position, and the electronic components transferred to the mounting component mounting position by the transfer suction nozzle are immediately processed by the mounting head moving operation. Becomes possible. Further, the time required for moving the electronic component from the mounting component mounting position to the foremost component suction position is also reduced.

More preferably, in the electronic component mounting method and the electronic component mounting machine described above, a component detection sensor for detecting the presence or absence of an electronic component is provided at an appropriate position on a transport path of the belt conveyor as the transport means. Then, based on the component detection sensor, determine the supply failure of the electronic component,
It is preferable to control the operation of each unit. In this way, the electronic components supplied to the belt conveyor in an appropriate posture are always detected by the component detection sensors provided on the conveyor path of the belt conveyor. Even if a plurality of component detection sensors for detecting the presence or absence of components are not provided for each component mounting location, a supply failure such as a missing electronic component can be reliably detected with only a single component detection sensor. .

More preferably, in the electronic component mounting method and the electronic component mounting machine described above, the belt conveyor as the transporting means is configured to be reversible and transported to a terminal end or a base end of the belt conveyor. It is preferable that a component disposal box for collecting electronic components is provided. By doing so, the normal or reverse rotation of the driving operation of the belt conveyor allows the defective parts to be promptly collected in the parts disposal box at the end of the belt conveyor, and the normal conveyance processing can be promptly restored. .

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of an electronic component mounting method and an electronic component mounting machine according to the present invention will be described below in detail with reference to the drawings. FIGS. 1 to 3 show a first embodiment of an electronic component mounting machine for realizing an electronic component mounting method according to the present invention, and FIG. 1 shows an electronic component mounting machine according to a first embodiment of the present invention. FIG. 2 is a perspective view showing an external perspective view, FIG. 2 is a perspective view showing a configuration of a main part in the electronic component mounting machine shown in FIG. 1, and FIG. 3 is an explanatory diagram of an operation of supplying electronic components by the belt conveyor shown in FIG.

The electronic component mounter 21 of the first embodiment
Is provided with a component supply mechanism 23 near the arrow A in FIG. This component supply mechanism 23, as shown in FIG.
A component carry-in portion 3 in which the electronic component 7 is carried in a fixed position while being placed on the tray 5, and a component from a single mounting component mounting position P1 which is set at an appropriate distance from the component carry-in portion 3. Belt conveyor 25, which is a transport means for transporting electronic components 7 to suction position P2, and transfer suction for transferring electronic components 7 from component carry-in section 3 to mounting component mounting position P1 set on belt conveyor 25. The nozzle 9 and the electronic components 7 conveyed to the component suction position P2 by the belt conveyor 25 are mounted on the mounting suction nozzles 27a, 27b, 27c, 2
The mounting head 29, which is mounted at a fixed position on the circuit board, which is mounted at a position appropriately distant from the component suction position P2 by suction at 7d, and a control controller 31, which controls the operation of each of the above units, It is a configuration provided.

The transfer suction nozzle 9 can be reciprocated between the component carry-in portion 3 and the mounting component mounting position P1 by the guide member 14, and the electronic components 7 on the component carry-in portion 3 are moved one by one. Move to mounting component mounting position P1.

In the case of this embodiment, the mounting component mounting position P1 and the component suction position P2 are defined by a plurality of mounting suction nozzles 27a, 27b,
The belt conveyor 25 is set on a straight line extending along the arrangement direction of the mounting heads 29c and 27d.
A plurality of mounting suction nozzles 27a, 27
It travels along the arrangement direction of b, 27c, 27d. The belt conveyor 25 uses an antistatic belt suitable for transporting electronic components as a material of the belt. Further, the belt conveyor 25 is driven to run in one direction indicated by an arrow B in the figure by receiving the rotational driving force of the driving motor 35 on the driving roller 36 around which one end of the belt is wound.

The component suction position P2 is determined by the mounting suction nozzles 27a, 27b, 27c, 27d on the mounting head 29.
Component pick-up positions P lined up at a separation interval corresponding to the array of
Is composed of _{2 1, P2 2, P2 3} , P2 4. These four component suction positions P2 ₁ , P2 ₂ , P2 ₃ , and P2 ₄ are arranged along the transport direction of the belt conveyor 25, and the foremost component suction position P2 ₁ is the electronic component mounting suction nozzle 27a. 7 suction position, last component suction position P2
Reference numeral ₄ denotes a position at which the mounting suction nozzle 27d sucks the electronic component 7. A plurality of mounting suction nozzles 27a, 27b,
27c, 27d and the electronic component 2 on the belt conveyor 25
7 have the same arrangement pitch, so that a plurality of electronic components 2
7 can be simultaneously adsorbed and taken out.

The component supply mechanism 23 according to the present embodiment detects the presence / absence of the electronic component 7 placed at the mounting component mounting position P1 on the transport path of the belt conveyor 25, and detects whether or not the component mounting posture is appropriate. Is provided with a component detection sensor 33. The component detection sensor 33 is provided for the belt conveyor 2.
The light emitting sensors 33a and the light receiving sensors 33b arranged on both sides of the mounting component mounting position P1 on the optical sensor 5 detect the presence or absence of the electronic component 7 and the mounting posture of the electronic component 7 in an optically non-contact manner.

The control controller 31 manages all of the transfer operation by the transfer suction nozzle 9, the transport operation by the belt conveyor 25, and the mounting operation by the mounting head 29. Then, the control controller 31 monitors the output of the component detection sensor 33, determines the supply failure of the electronic component 7 based on the output of the component detection sensor 33, and stops the operation of each unit, Warning and display of occurrence of

In the electronic component mounter 21 described above, the electronic component 7 on the tray 5 carried into the fixed position of the component carry-in section 3 is
This is a component transfer step in which the electronic component 7 supplied to the mounting component mounting position P1 is transferred to the mounting head 29 by the belt conveyor 25 by sucking the electronic component 7 to the mounting component mounting position P1 by suction using the suction nozzle 9 for mounting. A suction conveyance process of conveying the electronic component 7 to the component suction position P2 by the belt conveyor 25;
9 for mounting suction nozzles 27a, 27b, 27
The electronic component 7 is mounted on a predetermined circuit board by performing a component mounting step of moving the mounting head 29 to a fixed position on a circuit board on which the electronic component 7 is mounted by sucking at c and 27d and moving the mounting head 29. I do.

FIG. 3A shows, for example, the mounting head 29.
When the number of mounting suction nozzles mounted thereon is changed to ten, the belt conveyor 25 is set as the component suction position P2.
10 component suction positions c1 to c10 set above,
This shows a state in which ten electronic components 7 are sequentially transferred to the mounting component mounting position P1 at the end of the belt conveyor 25 in accordance with the transport speed of the belt conveyor 25. FIG. 3 (b)
5A shows a state in which the belt conveyor 25 has conveyed the distance S from the state shown in FIG. 5A and ten electronic components 7 have arrived at the component suction positions c1 to c10.

As described above, according to the above configuration, the mounting suction nozzles 27a, 27b,
Component suction position P corresponding to the number of equipment 27c, 27d
_{2 1, P2 2, P2 3} , P2 4 is to be set on the conveying path of the belt conveyor 25, mounting the suction nozzle 27a on mounting head 29, 27b, 27c, to equipment number of changes 27d Therefore, it is possible to sufficiently cope with only by changing the range setting of the component suction position set on the transport path of the belt conveyor 25, and it is not necessary to make large modifications to other components and the like. Since the response can be completed, it is possible to respond flexibly and inexpensively.

Further, since the transfer process by the transfer means is a continuous process, not a batch process, the transfer by the transfer suction nozzle 9 is performed even while the electronic component 7 is being transferred to the component suction position P2. The processing can be continued, and the processing speed can be increased by improving the operation rate of the apparatus.

In the above configuration, the belt conveyor 2
Since the electronic component 7 supplied in a proper posture to the electronic component 5 is always detected by the component detection sensor 33 provided on the transport path of the belt conveyor 25, the electronic component 7 is not detected as in the conventional case where the shuttle table is operated. Even if a plurality of component detection sensors 33 for detecting the presence / absence are not provided for each component mounting position, a supply failure such as a missing electronic component 7 can be reliably detected with only a single component detection sensor 33. And minimizing the number of sensors required to detect a supply failure of the electronic component 7,
The device cost can be reduced by reducing the number of sensors.

In the electronic component mounting method and the electronic component mounting machine according to the present invention, preferably, the mounting component mounting position P
It is preferable that the number 1 is set to a range in which the last suction nozzle 27d among the plurality of mounting suction nozzles mounted on the mounting head 29 can be suctioned. In this case, for example, the case where the number of mounting suction nozzles mounted on the mounting head 29 is ten as shown in FIG. 3 will be described as an example. As shown in FIG. Suction position P
2, the last component suction position c10 of the ten component suction positions c1 to c10 set on the belt conveyor 25 is selected as the mounting component mounting position P1, and the transfer suction nozzle 9 As a result, the electronic component 7 transferred to the component suction position P1 can immediately be mounted by the moving operation of the mounting head 29. The time required for moving the electronic component 7 from the mounting component mounting position P1 to the foremost component suction position c1 is also shown in FIGS.
As is clear from the comparison of FIG. 3B, since the movement of the distance S shown in FIG. 3B is not required, the processing is shortened and the processing efficiency is improved.

FIG. 5 shows the configuration of a component supply mechanism 41 used in an electronic component mounter according to a third embodiment of the present invention. This component supply mechanism 41 is configured such that, in addition to the configuration of the component supply mechanism 23 shown in the first embodiment, the belt conveyor 25 as the transporting means is configured to be reversible, and is provided at the base end of the belt conveyor 25. And a component disposal box 43 for collecting the transported electronic components 7. Further, the suction pressure of the transfer suction nozzle 9 is monitored, and if the suction pressure of the transfer suction nozzle 9 is inappropriate during the transfer operation of the electronic component 7 by the transfer suction nozzle 9, FIG. As shown in steps S611 to S614 of the flowchart, after the transfer processing is completed, the belt conveyor 25 is reversely rotated by a predetermined amount, and the parts transferred at an inappropriate pressure are collected in the parts disposal box 43. This is because the electronic component 7 transferred at an improper pressure becomes improper in the mounting direction and posture, which causes inconveniences such as dropping of the component and poor suction during the suction / mounting operation by the mounting head 11. . By doing so, the normal operation or the reverse rotation of the driving operation of the belt conveyor 25 allows the defective parts to be quickly removed from the belt conveyor 25.
Is collected in the component disposal box 43 at the end, and the normal transport processing can be returned promptly.

FIG. 7 shows the configuration of a component supply mechanism 51 used in an electronic component mounter according to a fourth embodiment of the present invention. The component supply mechanism 51 collects the transported electronic components 7 not only at the base end side of the belt conveyor 25 but also at the tip end of the belt conveyor 25 in addition to the configuration of the component supply mechanism 41 shown in the third embodiment. A component disposal box 53 is provided. Thus, the belt conveyor 2
By disposing the component disposal boxes 43, 53 at both ends of 5, the unnecessary electronic components 7 can be disposed more quickly.

[0030]

According to the electronic component mounting method and the electronic component mounting machine of the present invention described in claims 1 and 3, the component suction position corresponding to the number of mounting suction nozzles in the mounting head is: Because it is set on the conveyor path of the belt conveyor, only the change in the range setting of the component suction position set on the conveyor path of the belt conveyor, etc. in response to a change in the number of mounting suction nozzles on the mounting head Therefore, since there is no need for major remodeling of other components and the like, and the software can be used, it is possible to flexibly and inexpensively.
In addition, since the transfer process by the transfer unit is not a batch process but a continuous process, the transfer process by the transfer suction nozzle can be continued while the electronic component is being transferred to the component suction position. As a result, the processing speed can be increased by improving the operation rate of the apparatus.

Further, according to the structure of the fourth aspect, for example, the four component suction positions correspond to the arrangement of the four mounting suction nozzles mounted on the mounting head as the component suction positions. Is set on the belt conveyor, the last component suction position is selected as the mounting component mounting position, and the electronic component transferred to the mounting component mounting position by the transfer suction nozzle is Immediately, mounting processing by moving the mounting head becomes possible. Further, the time required for moving the electronic component from the mounting component mounting position to the foremost component suction position is also reduced, and processing efficiency is realized.

According to the configuration of the fifth aspect, the electronic components supplied to the belt conveyor in an appropriate posture are always detected by the component detection sensor provided on the conveying path of the belt conveyor. Even if there is no need to equip each component mounting location with multiple component detection sensors to detect the presence of
A single component detection sensor alone can reliably detect a supply defect such as a missing electronic component, and minimizes the number of sensors required to detect a defective supply of electronic components. Cost can be reduced.

According to the second and sixth aspects of the present invention, the defective parts can be promptly recovered in the parts disposal box at the end of the belt conveyor by the forward or reverse rotation of the driving operation of the belt conveyor. In this way, it is possible to return to the normal transport processing at an early stage.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a first embodiment of an electronic component mounter according to the present invention.

FIG. 2 is a perspective view showing a configuration of a main part in the electronic component mounting machine shown in FIG.

FIG. 3 is an explanatory diagram of an operation of supplying an electronic component by the belt conveyor shown in FIG. 2;

FIG. 4 is an explanatory diagram of a supply operation of an electronic component by a belt conveyor used in a second embodiment of the electronic component mounter according to the present invention.

FIG. 5 is a perspective view showing a configuration of a main part of a third embodiment of the electronic component mounter according to the present invention.

FIG. 6 is a flowchart showing operation control in the third embodiment shown in FIG.

FIG. 7 is a perspective view showing a configuration of a main part of a fourth embodiment of an electronic component mounter according to the present invention.

FIG. 8 is a perspective view showing a configuration of a main part of a conventional electronic component mounting machine.

[Explanation of symbols]

 3 Component Loading Section 5 Tray 7 Electronic Component 9 Transfer Suction Nozzle 21 Electronic Component Mounter 23 Component Supply Mechanism 25 Belt Conveyor 27a to 27d Mounting Suction Nozzle 29 Mounting Head 31 Control Controller 33 Component Detection Sensor 41 Component Supply Mechanism 43 Parts disposal box 51 Parts supply mechanism 53 Parts disposal box

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Keiji Ohara 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. Terms (reference) 3C030 AA08 AA12 AA21 5E313 AA01 AA11 AA23 DD12 EE02 EE03 EE24 EE25 FF24 FF28

Claims (6)

[Claims] 1. A component transfer process in which electronic components on a tray carried into a fixed position of a component carry-in section are suctioned by a transfer suction nozzle and transferred to a mounting component mounting position, and supplied to the mounting component mounting position. The picking-up process of transferring the electronic component to the component pick-up position, which is a delivery place to the mounting head, and picking up the electronic component transported to the component pick-up position by the mounting pick-up nozzle mounted on the mounting head, An electronic component mounting method for performing a component mounting step of moving an electronic component to a fixed position on a circuit board on which the electronic component is mounted by moving the mounting head, wherein a plurality of mounting nozzles are arranged at the same pitch as the arrangement pitch of the mounting suction nozzles. Electronic components are arranged on a conveying means, and the conveying means is caused to travel along an arrangement direction of the plurality of mounting suction nozzles, and the plurality of mounting suction nozzles are provided on the conveying means. Electronic part of Electronic component mounting method characterized by taking out simultaneously. 2. The electronic component according to claim 1, wherein when the electronic component is placed on the transporting means, it is determined whether or not the electronic component is non-defective, and if the electronic component is defective, the electronic component is discarded. Implementation method. 3. A component loading section in which electronic components are loaded into a fixed position while being placed on a tray, and a transport of electronic components from a mounting component loading position, which is appropriately away from the component loading section, to a component suction position. Carrying means, a transfer suction nozzle for transferring an electronic component from the component loading section to a mounting component mounting position of the transfer means, and a mounting suction nozzle for mounting the electronic component transferred to the component suction position by the transfer means. An electronic component comprising: a mounting head that is mounted at a fixed position on a circuit board that is mounted at a position that is appropriately separated from the component suction position by suctioning the component; and a control controller that controls operations of the above-described units. An electronic machine characterized by using a belt conveyor that runs along an arrangement direction of a plurality of mounting suction nozzles mounted on the mounting head, as the transporting means. Goods mounting machine. 4. The mounting component mounting position is set to be within a suctionable range of a rearmost mounting suction nozzle among a plurality of mounting suction nozzles mounted on the mounting head. Item 4. An electronic component mounting machine according to Item 3. 5. A component detection sensor for detecting the presence or absence of an electronic component is provided at an appropriate position on a transport path of a belt conveyor as the transport unit, and based on the component detection sensor,
The electronic component mounter according to claim 3, wherein the operation of each unit is controlled by determining a supply failure of the electronic component. 6. A belt conveyor as the transporting means is configured to be reversible, and a component disposal box for collecting transported electronic components is provided at a terminal or a base end of the belt conveyor. An electronic component mounting machine according to any one of claims 3 to 5.