JP2007142211A - Method and machine for mounting component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten the time required for mounting an electronic component on a substrate. <P>SOLUTION: In the component-mounting method for making the nozzles of a plurality of heads suck the electronic component, carrying it and loading it on the substrate; the respective heads are set rotatable, independently about the center axes of the respective nozzles, and an R axis adjustment step is provided for rotating the head about the center axis of the nozzle, and for adjusting it so as to be a prescribed rotating angle. The component is mounted, such that the period for performing the R axis adjustment step in one of the plurality of heads, and the period for performing the R axis adjustment step in the other head, have parts overlapping with each other. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component mounting method and a component mounter for mounting an electronic component on a substrate by a head having a component suction nozzle.

  Conventionally, a head unit equipped with a component suction nozzle can be rotated around the central axis of the nozzle, and an electronic component such as an IC can be moved from a component supply unit such as a parts feeder by a head unit that can be moved up and down in the height direction. 2. Description of the Related Art Surface mounters that are attracted and mounted at predetermined positions on a printed circuit board are known.

  As the component mounting operation of this surface mounter, first the head unit is moved to the component supply unit that supplies the component to be mounted, then the head is lowered with respect to the head unit, and the electronic component of the component supply unit (hereinafter referred to as component) Adsorbed with a nozzle. Then, after imaging the part sucked by the camera, etc., the head unit is moved to the part mounting position, the part posture sucked by the nozzle is compared with the normal mounting posture at the mounting position, and the head is moved to the center axis of the nozzle. After rotating in the direction (R-axis direction) to adjust the rotation angle of the component, the component is mounted at the mounting position of the printed circuit board (see, for example, Patent Document 1).

In the surface mounter, a head unit is provided with a plurality of heads in order to efficiently mount components on a printed circuit board (hereinafter referred to as a substrate), and each head performs the component mounting operation. That is, after each of the plurality of heads picks up the component, the rotation angle of the first component in the R-axis direction while moving the component (first component) sucked by the first head of the head unit to a predetermined mounting position. The first part is lowered and mounted at a predetermined mounting position. Next, while moving the component (second component) adsorbed by the second head of the head unit to a predetermined mounting position, the rotation angle of the second component in the R-axis direction is adjusted, and the second mounting component is moved to the predetermined mounting position. Two parts are lowered and mounted. Thus, the components attracted to each head are surely mounted at a predetermined mounting position by separately performing the rotation angle adjusting operation and the component lowering operation for each head.
JP-A-11-145692

  In recent years, with an increase in the density of components to be mounted on a substrate, further speeding up of component mounting is required. For this reason, even when the components are mounted, the mounting time is shortened by adjusting the rotation angle of the components while the head unit is moving. However, there is a limit to further shorten the mounting time after performing the angle adjustment operation of each head within the moving time of each head. That is, when the components are sequentially mounted on the board and the moving distance between the component mounting positions is short, the rotation angle adjustment operation may be delayed compared to the moving time. Therefore, if the rotation angle cannot be adjusted completely during the movement of the head unit, the head cannot wait for mounting on the component mounting position even though the movement of the head unit has been completed. In some cases, mounting time was lost.

  Conventionally, since the rotation angle adjustment operation at each head is performed during the movement time of each head, the excess time of the rotation angle adjustment operation that cannot be performed within the movement time is accumulated as it is. The excess time had a significant effect on the implementation tact time.

  SUMMARY An advantage of some aspects of the invention is that it provides a component mounting method and a component mounter that can reduce the time required to mount an electronic component on a substrate.

  In order to solve the above problems, a component mounting method of the present invention is a component mounting method in which an electronic component is adsorbed to and transported by nozzles of a plurality of heads, and each head is mounted on a respective nozzle. An R-axis adjustment step that allows the head to rotate independently about a central axis, and rotates the head about the central axis of the nozzle to adjust to a predetermined rotation angle. The timing for performing the R-axis adjustment step in one head and the timing for performing the R-axis adjustment step in another head have portions that overlap each other.

  In order to solve the above-described problem, a component mounting machine according to the present invention includes a plurality of heads that are movably supported on a base, nozzles provided on these heads, and the nozzles that move the heads. A drive unit that rotates the component, a component supply unit that supplies an electronic component, and the drive unit that controls the drive unit to convey the electronic component adsorbed by the nozzle and is supported by the substrate support unit And a control unit mounted on the board, wherein the control unit rotates the head around the central axis of the nozzle to adjust the rotation angle to a predetermined rotation angle. With respect to the above, among the plurality of heads, the timing for performing the R-axis adjustment in one head and the timing for performing the R-axis adjustment in another head are overlapped with each other.

  According to this component mounting method and component mounting machine, the R axis adjustment step for adjusting the rotation angle by rotating the head around the central axis of the nozzle so as to obtain a predetermined rotation angle is performed at the same time. The time required for mounting is compared with the conventional method and apparatus in which the R axis adjustment is performed independently for each head because each head is overlapped with other heads. Can be shortened.

  That is, if the R axis adjustment of the next head (head operating after the preceding head) is performed during the R axis adjustment of one head (leading head), the time required for the R axis adjustment of the preceding head is utilized. Since the R axis adjustment of the next head can be performed, the time required for mounting can be shortened.

  In particular, in the component mounting method and the component mounting machine, the R-axis adjustment is performed while the electronic component is being transported, and the posture according to the mounting position is set before the electronic component is mounted on the substrate. Further, it is preferable that the rotation angle of the electronic component is adjusted by rotating the head around the central axis of the nozzle.

  According to this configuration, the R-axis adjustment in the next head is performed during the transportation of the electronic component in the preceding head, so that the time required for mounting can be shortened. That is, by performing the R axis adjustment in the next head using the movement time of the preceding head, it is not necessary to perform the R axis adjustment of the next head during the movement time of the next head. Therefore, compared to the conventional case where the R-axis adjustment of a predetermined head is performed beyond the movement time of the head, the components can be mounted immediately after the movement of the head is completed, and the time required for mounting can be reduced. .

  In the component mounting method and the component mounter, it is preferable that the R axis adjustment in each head is performed after the electronic component is sucked and before the first electronic component is mounted on the substrate.

  According to such a configuration, the moving time from the component supply unit to the predetermined mounting position is the moving time until the first component mounted first among the electronic components mounted on the head unit is mounted. The movement time is longer than that of other components that only require movement time on the substrate. Therefore, by performing the R-axis adjustment within this movement time, the R-axis adjustment can be reliably performed for all electronic components mounted on the head unit, and the time required for mounting can be shortened.

  Further, in the component mounting method and the component mounting machine, during the transportation of the electronic component, the R-axis adjustment and the head are moved in the height direction to bring the electronic component closer to a predetermined height with respect to the substrate. It is preferable to perform axis adjustment.

  According to such a configuration, during the transportation of the electronic component, the Z-axis adjustment step for bringing the substrate close to a predetermined height is performed in advance, thereby reducing the distance between the substrate and the sucked electronic component. In addition, it is possible to reduce the head descent time when mounting electronic components, and as a result, it is possible to further reduce the time required for mounting.

  Further, in the component mounting method and the component mounting machine, the Z-axis adjustment is performed for the heads that the electronic components adjacent to each other come into contact with each other when the electronic components sucked by the nozzles of the heads are rotated around the central axis of the nozzles. The head is moved in the height direction so that the height positions of these electronic components are in the order of board mounting from the lower side, and the R-axis adjustment is preferably performed after the Z-axis adjustment.

  According to such a configuration, before the R-axis adjustment step is performed on the head that sucks an electronic component that may come into contact with an adjacent electronic component when the electronic component is rotated around the central axis of the nozzle, the electronic component is Since the heads are moved so that their height positions are arranged in the order of substrate mounting from the lower side, it is possible to avoid contact between adjacent electronic components when the R-axis adjustment step is performed. Further, since they are arranged in the order of mounting, even if an electronic component that has been in a mounting posture after the R-axis adjustment step is lowered in that posture at a predetermined mounting position, it does not come into contact with other electronic components. Therefore, even when a relatively large electronic component is picked up, the time required for mounting can be shortened.

  According to the component mounting method and the component mounter of the present invention, the time required to mount the electronic component on the substrate can be shortened.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a component mounter according to the present embodiment, and FIG. 2 is a side view of the component mounter according to the present embodiment.

  1 and 2 schematically show a surface mounter (hereinafter abbreviated as a mounter) to which the present invention is applied. As shown in the figure, a conveyor 2 for conveying a substrate 3 is arranged on a base 1 of the mounting machine, and the substrate 3 is conveyed on the conveyor 2 and stopped at a predetermined mounting operation position. ing.

On both sides of the conveyor 2, component supply units 4 are arranged. These component supply units 4 are provided with multiple rows of tape feeders 4a. Each of the tape feeders 4a is configured such that small pieces of chip parts such as ICs, transistors, capacitors, etc. are stored at predetermined intervals, and the held tapes are led out from the reels.
In this way, the parts are intermittently drawn out as the parts are taken out.

  Above the base 1, a head unit 6 for component mounting is provided. The head unit 6 can be moved between the component supply unit 4 and the mounting work position where the substrate 3 is located, and in the X-axis direction (direction parallel to the conveyor 2) and the Y-axis direction (direction orthogonal to the conveyor 2). It can be moved.

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servomotor 9 are disposed on the base 1, and a head unit 6 support member is disposed on the fixed rail 7. 11 is arranged, and a nut portion 12 provided on the support member 11 is screwed into the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 6 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  The Y-axis servo motor 9 and the X-axis servo motor 15 are provided with encoders 9a and 15a, respectively, so that the position of the head unit 6 is detected.

  A plurality of heads 20 for component mounting are mounted on the head unit 6, and in the illustrated example, four heads 20 are mounted in a line at equal intervals in the X-axis direction.

  The head 20 can be moved in the Z-axis direction and rotated around the R-axis (the central axis of the suction nozzle 21) with respect to the frame of the head unit 6, and the Z-axis servomotor 16 (see FIG. 3) is used as a drive source. The lift drive means and the rotation drive means using the R-axis servomotor 17 (see FIG. 3) as a drive source are driven. Each head 20 is provided with a suction nozzle 21 at its tip (lower end), and negative pressure is supplied to the tip of the suction nozzle 21 from a negative pressure supply means (not shown). Parts are attracted by suction force. In the present embodiment, the servo motors 15, 9, 16, 17 and the encoders 15a, 9a, 16a, 17a constitute the drive unit of the present invention.

  On the base 1, an image pickup unit 18 (image pickup means) for recognizing an image of the component suction state by the head unit 6 is further provided. In this embodiment, the mounting work position and each component supply unit 4 are provided. The imaging units 18 are provided between the two. The imaging unit 18 includes a camera and a lighting device.

  FIG. 3 is a block diagram showing a control system of the mounting machine. This block diagram mainly shows a part related to the present invention in the control system of the mounting machine.

  The mounting machine includes a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU in advance, a RAM that temporarily stores various data during operation of the apparatus, and the like. 10 (control unit of the present invention). The control device 10 includes an axis control unit 101, an image processing unit 102, a storage unit 103, and a main control unit 104 as functional configurations.

  The axis control unit 101 includes an X-axis servo motor 15, a Y-axis servo motor 9, an R-axis servo motor 17 and a Z-axis servo motor 16 provided in each head 20, and encoders 15a, 9a, 17a, 16a provided thereon. Are connected to each other, and drive control of each of the servo motors 15, 9, 17, 16 is performed based on detection values of the encoders 15a, 9a, 17a, 16a.

  The image processing unit 102 is connected to the imaging unit 18, performs predetermined image processing on the image of the component captured by the camera provided in the imaging unit 18, and the component from the tape feeder 4 a in each head 20. Information on the presence or absence of suction, the shape of the part, the suction position of the part, and the angle of the part around the R axis with respect to the X direction and the Y direction are detected, and the detected values are transmitted to the main control unit 104.

  The storage unit 103 mounts the board data 103b related to the position and direction of the parts to be mounted on the board 3, the part data 103c related to the shape of the parts supplied from the tape feeder 4a, and the parts of the tape feeder 4a on the board 3. An operation program 103a for controlling the operation is stored.

  The main control unit 104 controls the mounting operation for mounting components on the board 3 in an integrated manner. Specifically, the head unit 6 is moved to the component supply unit 4 to control negative pressure supply means (not shown), thereby causing the component to be sucked from the tape feeder 4a (suction operation). Then, the head unit 6 that sucks the component is moved onto the camera of the imaging unit 18 (recognition operation), and after the component recognition, the head unit 6 is moved to the component mounting position of the substrate 3, and the sucked component is transferred to the substrate 3. Install (transfer operation). Each servo motor is controlled via the axis control unit 101 based on the operation program 103a, the board data 103b, and the component data 103c stored in the storage unit 103.

  Next, the operation of the mounting machine according to the present embodiment will be described with reference to FIG.

  First, in step S1, component suction is performed. That is, the main control unit 104 drives and controls the X-axis and Y-axis servomotors 15 and 9 via the axis control unit 101 to move the head unit 6 to the predetermined component supply unit 4. Of the heads 20 arranged at a certain height (initial position), the Z-axis servo motor 16 is driven and controlled to lower the specific head 20 to the suction position, and the negative pressure supply means is controlled to suck The inside of the nozzle 21 is set to a negative pressure, and necessary parts are sucked to the tip of the suction nozzle 21. This operation is repeated for a plurality of heads 20, and components to be mounted on each head 20 are sucked (sucking operation). After the suction, the heads 20 are arranged again at the initial positions.

  The suction operation includes an R-axis adjustment operation in which each head 20 is rotated around the central axis of the suction nozzle 21 in accordance with the shape of the component to be sucked before the component is picked. Details of the adsorption operation will be described later.

  Next, after the components are adsorbed by each head 20, the components are recognized in step S2. That is, the main control unit 104 drives and controls the X-axis servo motor 15 and the Y-axis servo motor 9 via the axis control unit 101 to move the head unit 6 so as to pass over the imaging unit 18. Then, all the images of the components attracted to each head 20 are captured by the camera of the imaging unit 18, and the components are recognized in comparison with the component data 103c (recognition operation).

  Next, after images of all the sucked parts are captured, the parts are transported in step S3. That is, the main control unit 104 drives and controls the X-axis servo motor 15 and the Y-axis servo motor 9 via the axis control unit 101 to move the head unit 6 to a predetermined mounting position where components are mounted. Transport the sucked parts. That is, the head unit 6 is moved so that a specific component to be mounted on the substrate 3 is located immediately above the predetermined mounting position (conveying operation).

  Next, after the parts are transported to a position immediately above the predetermined mounting position by the transporting operation, the parts are mounted on the substrate 3 in step S4. That is, the main control unit 104 drives and controls the Z-axis servomotor 16 via the axis control unit 101 to lower the head 20 and place the component on the mounting position of the substrate 3. Then, the negative pressure supply means is controlled to release the negative pressure in the suction nozzle 21 and raise the head 20 to the initial position (mounting operation).

  In addition, in the transfer operation including the above-described transport operation and mounting operation, the R axis that rotates the posture of the sucked component around the central axis of the suction nozzle 21 and adjusts it to the mounting position posture before mounting the component. Although the adjustment operation is included, details of the transfer operation will be described later.

  Next, in step S5, it is determined whether or not the mounting of all the components attracted to each head 20 has been completed. If the sucked part remains in any of the heads 20, it is determined NO in step S5, and the process returns to step S3 to carry and carry the remaining parts (steps S3 and S4). When all the components attracted to the head 20 have been mounted, it is determined in step S6 whether all the components to be mounted on the substrate 3 are mounted. In step S1, the process returns to step S1 and steps S1 to S5 are performed. When all the components to be mounted on the board 3 are mounted, the component mounting operation ends.

  Next, the suction operation will be described in detail with reference to FIG. FIG. 5 is a flowchart showing the adsorption operation in the present embodiment. In the present embodiment, the case where four heads 20 are provided in the head unit 6 will be described, but the number of heads is not limited to four.

  When the components to be mounted for each of the four heads 20 are determined, the suction operation is started, and an initial value of zero is input as the head determination value N for determining the head 20 to be subjected to the suction operation (step S11). ).

  Next, a head that performs a suction operation is selected from the plurality of heads 20 (step S13). That is, 1 is added to the head determination value N having an initial value of zero (step S12), and the head 20 that performs the suction operation first is selected.

  Here, the head 20 that performs the suction operation first is the first head 20, the head 20 that performs the suction operation next is the second head, and the head 20 that performs the suction operation last is the fourth head 20. The parts attracted by the first to fourth heads are respectively referred to as a first part, a second part, and a fourth part.

  Next, the presence of a component to be picked up is determined (step S14). That is, the main control unit 104 determines whether or not the component is to be attracted to the first head 20, and if there is a component to be attracted, YES is determined in step S14, and the X-axis servo motor 15 and the Y-axis servo motor 9 are determined. Is controlled to move the head unit 6 to a predetermined component supply unit 4 (step S15). Further, if it is not necessary to cause the first head 20 to attract the component in the current suction operation, NO is determined in step S14, and the second head 20 as the next head is again determined by the processing in steps S12 and S13. It is selected as the target of the suction operation.

  Next, it is determined whether or not the R axis adjustment described later is activated for the head 20 (step S16). That is, the tip portion of the suction nozzle 21 needs to be positioned at a rotation angle suitable for suction with respect to the component, depending on the shape of the suction target component, the shape of the tip portion of the suction nozzle 21, and the like. Therefore, when the tip portion of the suction nozzle 21 is not at a rotation angle suitable for suction of the suction target component, the head 20 is rotated around the central axis of the suction nozzle 21 by driving and controlling the R-axis servo motor 17. R axis adjustment to be adjusted is performed (step S17: R axis adjustment step). In step S16, it is determined whether or not this R-axis adjustment has been started. If the head 20 has not undergone the R-axis adjustment step, NO is determined in step S16 and the R-axis adjustment is performed in step S17. .

  Next, it is determined whether or not the R-axis adjustment of the next head 20 is possible (step S18). That is, it is determined whether or not the R-axis adjustment in the second head 20 as the next head is possible within the set condition, for example, the movement time until the first head reaches the component supply unit 4. If the R-axis adjustment can be performed, it is determined YES in step S18, and the R-axis adjustment of the second head 20 is performed in parallel with the R-axis adjustment operation of the first head 20 (step S17). ). In step S18, whether or not the R axis can be adjusted is similarly determined for the third head corresponding to the next head of the second head. As described above, by repeating the processes of S17 and S18, in parallel with the R-axis adjustment operation of the first head 20, all the heads 20 that require R-axis adjustment (second to fourth heads 20) are Z-axis. Adjustments are made. In other words, the R axis adjustment is performed for each head 20 so that the timing of performing the R axis adjustment step of the first head 20 and the timing of performing the R axis adjustment steps of the other heads 20 overlap each other. In this embodiment, in principle, it is assumed that the R-axis adjustment of all the second to fourth heads is performed within the movement time of the first head 20.

  In step S18, if R adjustment is performed for all the heads 20 (first to fourth heads 20) or if it is determined that R-axis adjustment is not possible for the next head 20, NO is determined in step S18. After the movement of the head unit 6 (first head 20) to the component supply unit 4 is completed, the first head 20 is lowered by drivingly controlling the Z-axis servomotor 16 (step S19). That is, the first head 20 is lowered to the suction height position for sucking the first component, and the first component is sucked.

  Next, in step S20, it is determined whether or not the suction of all the heads 20 has been completed. If there is a head 20 that has not completed the suction of components, steps S12 to S20 are repeated.

  That is, when the components are sequentially picked up by each head 20, when the suction of the first component by the first head 20 is completed, there is a head 20 (second to fourth heads 20) that has not picked up the component. Therefore, NO is determined in step S20. In Steps S12 and S13, after 1 is added to the head determination value N and the second head is selected, in the case where the component is also attracted to the tip of the suction nozzle 21 of the second head 20, YES is determined in Step S14. The X-axis servo motor 15 and the Y-axis servo motor 9 are driven and controlled, and the head unit 6 is moved to the component supply unit 4 that supplies the second head 20 to the second component (step S15). Here, in the second head 20, since the R-axis has already been adjusted as described above, it is determined YES in step S16. Therefore, after the movement of the head unit 6 is completed, the Z-axis servomotor 16 is driven and controlled as it is, and the second head 20 is lowered to attract the second component (step S19).

  In this way, when the first component 20 to the fourth head 20 have been sucked from the first component to the fourth component, YES is determined in step S20, and the sucking operation ends (step S21). In addition, after each head 20 complete | finishes R-axis adjustment, a some head may adsorb | suck a component simultaneously.

  Next, the transfer operation will be described in detail with reference to FIGS. FIG. 6 is a flowchart showing the transfer operation in the present embodiment. FIG. 7 is a time chart in the transfer operation, and shows the driving time of each axis in a time series when the components sucked by the first to fourth heads 20 are mounted on the substrate 3. is there.

  That is, XY in FIG. 7 indicates the drive time of the X-axis and Y-axis servomotor 9 for moving the head unit 6. Further, the R axis and the Z axis of each head 20 represent the drive times of the R axis servo motor 17 and the Z axis servo motor 16 of each head 20, respectively.

  In FIG. 6, when the recognition operation is completed, a transfer operation including a moving operation and a mounting operation is started. First, an initial value zero is input as a head determination value N for determining a target head 20 to perform the mounting operation (step S31). ).

  Next, a head for performing a transfer operation is selected from the plurality of heads 20 (step S33). That is, for the first time, 1 is added to the head determination value N having an initial value of zero (step S32), and the head 20 that performs the first transfer operation is selected.

  Here, the head 20 that performs the transfer operation first is the first head 20, the head 20 that performs the transfer operation next is the second head, and the head 20 that performs the transfer operation last is the fourth head 20. The parts sucked by the first to fourth heads are respectively referred to as a first part, a second part, and a fourth part.

  Next, it is determined whether there is a part to be mounted on the head 20 (step S34). That is, it is determined whether or not a component is sucked to the tip of the suction nozzle 21 of the first head 20, and if the first component is sucked to the first head, YES is determined in step S34, and X The head servo motor 15 and the Y-axis servo motor 9 are driven and controlled to move the head unit 6 to the mounting position on the substrate 3 where the first component is mounted (step S35). If the first component is not attracted to the first head 20 in the current mounting operation, NO is determined in step S34, and the processes in steps S32 and S33 are performed again. That is, the second head 20 which is the next head is selected as a target for the mounting operation.

  Next, it is determined whether or not the R axis adjustment described later for the head 20 has been activated (step S36). In other words, the posture of the component picked up by the picking operation may be different from the posture at the mounting position, and a slight deviation occurs at the time of picking up. Therefore, in step S37, the R-axis servo motor 17 is driven and controlled so that the head 20 rotates about the central axis of the suction nozzle 21 so that the posture of the sucked target component matches the posture of the mounting position. Axis adjustment is performed (R-axis adjustment step). In step S36, it is determined whether or not this R-axis adjustment has been started. If the head 20 has not undergone the R-axis adjustment step, NO is determined in step S36 and R-axis adjustment is performed in step S37. .

  Next, it is determined whether or not the R-axis adjustment of the next head 20 (second head 20 in the present embodiment) is possible (step S38). That is, it is determined whether or not the R-axis adjustment of the second head 20 is possible within a set condition, for example, the movement time until the first head reaches the mounting position of the first component. If the R axis adjustment can be performed, YES is determined in step S38, and the R axis adjustment of the second head 20 is performed in parallel with the R axis adjustment operation of the first head 20 (step S37). In step S38, whether or not the R axis can be adjusted is similarly determined for the third head corresponding to the next head of the second head. As described above, by repeating the processes of S37 and S38, in parallel with the R-axis adjustment operation of the first head 20, all the heads 20 that require R-axis adjustment (second to fourth heads 20) are Z-axis. Adjustments are made. In other words, the R axis adjustment is performed for each head 20 so that the timing of performing the R axis adjustment step of the first head 20 and the timing of performing the R axis adjustment steps of the other heads 20 overlap each other.

  In the present embodiment, the time until the first component moves to the mounting position by the first head 20, that is, within the movement time from the position of the imaging unit 18 where the recognition operation is completed to the mounting position of the first component (FIG. 7). It is determined that the R-axis adjustment can be performed for all of the first to fourth heads 20 within the first component movement time in FIG. 7, and as shown in FIG. The R-axis adjustment of the four heads 20 is performed in parallel. Therefore, in a state before the first component sucked by the first head 20 is mounted on the substrate 3, the components (first to fourth components) sucked by the respective heads 20 are respectively changed by the heads 20. It is sucked and held in a posture that matches the posture at the mounting position.

  When the R adjustment for all the heads 20 is completed or when it is determined that the R-axis adjustment is not possible for the next head 20 (NO in step S38), the first head 20 (head unit 6) is brought to the mounting position. After the movement, the first head 20 is lowered by drivingly controlling the Z-axis servomotor 16. That is, the first head 20 is lowered to the mounting position to mount the first component (step S39).

  Next, in step S40, it is determined whether or not the mounting of all the heads 20 has been completed. If there is a head 20 that has not been mounted, steps S32 to S40 are repeated.

  That is, when the mounting of the first component by the first head is completed, NO is determined in step S40 due to the presence of the head 20 (second to fourth heads 20) not mounting the component. Then, the second head as the next head is selected (steps S32 and S33).

  In the example shown in FIG. 7, since the component is also attracted to the tip of the suction nozzle 21 of the second head 20, YES is determined in step S <b> 34 and the X-axis servo motor 15 and the Y-axis servo motor 9 are driven and controlled. Thus, the head unit 6 is moved to a predetermined mounting position of the second component that is adsorbed by the second head 20 (step S35). Since the R-axis has already been adjusted in the second head 20 as described above, it is determined YES in step S36, and after the movement of the head unit 6 is completed, the Z-axis servomotor 16 is driven to control the second head. 20 is lowered to mount the target component on the mounting position (step S39).

  That is, as shown in FIG. 7, after the first component sucked by the first head 20 is mounted on the substrate 3 (after completion of the first head mounting and lowering), the second component sucked by the second head is removed. The second component is moved to a predetermined mounting position, and after the second component movement is completed, the components of the second head 20 are mounted on the substrate 3 (second head mounting operation). In this way, for each of the third component and the fourth component, the third component movement and the fourth component movement for moving to the predetermined mounting position are performed, and the components that are attracted from the first head 20 to the fourth head 20 ( When all the first to fourth parts) have been mounted, YES is determined in step S40, and the transfer operation ends (step S41).

  As described above, in the present embodiment, in the suction operation and the transfer operation, the timing of the R axis adjustment step for adjusting the R axis of each head 20 is overlapped. Compared with the case where it carries out, it can shorten the time which component mounting requires. Further, in the above embodiment, the R-axis adjustment of the first to fourth heads 20 is performed in parallel during the movement of the first component having the most time allowance due to the movement of the imaging unit 18 from the camera position. Therefore, each R-axis adjustment can be reliably completed within the time of the first component movement, and as a result, the mounting time can be shortened.

  Here, a time chart in the conventional method is shown in FIG. Each name, symbol, and the like have the same meaning as in FIG. 7 showing the time chart of this embodiment. In the conventional method shown in FIG. 9, the mounting and lowering of each head 20 is performed within the time of movement of the first to fourth components in which each head 20 moves to each mounting position.

  When comparing the conventional method shown in FIG. 9 with the present embodiment shown in FIG. 7, the conventional method cannot complete the R-axis adjustment within the time of the second to fourth movements. Although the movement to the mounting position is completed, there is a time α to stop until the R-axis adjustment is completed at that position. On the other hand, in the present embodiment, the R axis adjustment in all the heads 20 is performed in parallel within the time of the first component movement, and all of them are completed within the time of the first component movement. As a result, the time α that has been lost becomes unnecessary. Therefore, in the present embodiment, the mounting time can be shortened by the total time α, that is, the shortening time t shown in FIG.

  In the above-described embodiment, the case where each head 20 (head unit 6) is moved to the mounting position of each component and then the head 20 is lowered from the initial position to mount the component has been described. The Z axis may be adjusted so that the head 20 approaches a predetermined height with respect to the substrate 3 during conveyance.

  Specifically, in the flowchart of FIG. 6, the sucked component is brought to a predetermined height between Step S35 at which the head unit 6 starts moving and Step S39 at which the mounting of the component in the Z-axis direction is started. The Z-axis adjustment step for lowering is performed. That is, the Z-axis servomotor 16 is driven and controlled so that the suction component of the head 20 is lowered to a predetermined height position approaching the substrate 3. The predetermined height may be a height position that does not interfere with other components already mounted on the substrate 3.

  FIG. 8 shows a time chart when such Z-axis adjustment is performed in parallel with the R-axis adjustment while the head unit 6 moves. As shown in FIG. 8, in FIG. 7, between the first part movement and the second part movement, between the second part movement and the third part movement, between the third part movement and the fourth part movement. Whereas the mounting and lowering were performed uniformly, in the embodiment shown in FIG. 8, the height position of the component attracted to the head 20 during the time of movement of the first to fourth components becomes a predetermined height. As described above, the Z-axis adjustment is performed for each head 20. Therefore, the descent time of the head 20 that is performed after the head unit 6 is stopped is only the main descent time from the predetermined height position to the mounting position, and in the case of FIG. 7 where the head unit 6 is lowered from the initial position to the mounting position. Compared to this, the descent time is shortened. That is, as shown in FIG. 8, in the embodiment shown in FIG. 8 in which the Z-axis adjustment is performed within the movement time of each head 20, the mounting time is shorter than the embodiment shown in FIG. 7 by a shortened time T (see FIG. 8). Can be shortened.

  In the embodiment shown in FIG. 8, the Z-axis adjustment of each head 20 is performed separately during the time for moving each suction component to the mounting position (time for moving the first to fourth components). The Z axis adjustment may be performed at a predetermined height position with respect to all the heads 20 within the time of the first component movement.

  The Z-axis adjustment has been described for the case where all the heads 20 are uniformly lowered to the same predetermined height position. However, the respective heads 20 are lowered so that their height positions are sequentially different in the vertical direction. Alternatively, they may be lowered to random height positions.

  As a more preferable form, the components sucked by the head 20 are in the order of being mounted on the substrate 3 from the lower side, and even when adjacent components rotate around the central axis of the suction nozzle 21, they do not contact each other. It is preferable that the Z-axis adjustment is arranged at intervals (mounting order height position).

  Specifically, the mounting order of the components to be mounted on the substrate 3 is the order of the first head 20, the second head 20, and the third head 20, and a large electronic component (second component) adsorbed to the second head 20 is used. ) Around the central axis of the suction nozzle 21 at the same height position, when the parts (first part, third part) sucked by the first and third heads 20 are contacted, After performing the Z-axis adjustment as described above, it is preferable to perform the R-axis adjustment.

  That is, based on the information stored in advance in the storage unit 103 of the control device 10 and information such as the arrangement interval related to the components, the first component, the second component, and the third component from the bottom before performing the R-axis adjustment. And the suction parts (first and third parts) of the first and third heads 20 and the suction parts of the second head 20 rotate around the central axis of the suction nozzle 21. Even if it exists, Z-axis adjustment is performed so that it may become the space | interval which does not contact mutually. Thereafter, R-axis adjustment is performed to adjust the components of the first and second heads 20 so as to be in the mounting position and posture, respectively.

  In this way, even if the R-axis adjustment is performed, the second component, the first component, and the third component are not brought into contact with each other, and after the first component is mounted, the large second component is mounted. Then, since the third component is mounted, each component can be mounted on the substrate 3 without contacting each other.

  In the above-described embodiment, the case where the R axis adjustment is completed for all the heads 20 within the time of the first component movement has been described. However, the timing when the R axis adjustment is performed in one head 20 and the other heads 20 are performed. It suffices to have a portion in which the timing for adjusting the R axis is performed simultaneously. For example, the R-axis adjustment of the second to fourth heads 20 may be performed within the time of the second component movement, or the R of the first head 20 and the second head 20 within the time of the first component movement. The axis adjustment may be performed, and the R axis adjustment of the third head 20 and the fourth head 20 may be performed within the time of the third component movement. In this case, when the time for moving the third component is short, the time for adjusting the R axis of the third and fourth heads 20 is exceeded. Therefore, the mounting time can be shortened as compared with the case where the R-axis adjustment of the third head 20 and the fourth head 20 is performed separately.

It is a top view which shows the component mounting machine of this invention. It is a side view which shows the component mounting machine of this invention. It is a block diagram which shows the control system of the component mounting machine of this invention. It is a flowchart which shows mounting operation. It is a flowchart which shows adsorption | suction operation | movement. It is a flowchart which shows transfer operation | movement. It is a time chart in transfer operation in one embodiment of the present invention. It is a time chart in transfer operation in other embodiments of the present invention. It is a time chart in the conventional transfer operation | movement.

Explanation of symbols

3 Substrate 6 Head unit 10 Control device 16 Z-axis servo motor 17 R-axis servo motor 20 Head 21 Suction nozzle 101 Axis control unit 104 Main control unit

Claims (10)

A component mounting method for adsorbing and transporting electronic components to nozzles of a plurality of heads and mounting them on a substrate,
Each head can be rotated independently around the central axis of each nozzle,
An R-axis adjustment step of adjusting the head to rotate around the central axis of the nozzle to obtain a predetermined rotation angle;
A component mounting method comprising: a portion of the plurality of heads, wherein a time when the R-axis adjustment step in one head is performed and a time when the R-axis adjustment step in another head is performed overlap each other.   The R-axis adjustment step is performed during the transportation of the electronic component, and the head is moved around the central axis of the nozzle so that the posture is in accordance with the mounting position before the electronic component is mounted on the substrate. The component mounting method according to claim 1, wherein the component is rotated to adjust a rotation angle of the electronic component.   3. The component mounting method according to claim 2, wherein the R-axis adjustment step in each head is performed after the electronic component is sucked and before the first electronic component is mounted on the substrate.   During the transportation of the electronic component, the R-axis adjustment step and the Z-axis adjustment step of moving the head in the height direction to bring the electronic component close to a predetermined height with respect to the substrate, The component mounting method according to claim 2 or 3.   In the Z-axis adjustment step, when the electronic components adsorbed to the nozzles of each head are rotated around the central axis of the nozzles, the height positions of the electronic components adjacent to the adjacent electronic components are on the lower side. 5. The component mounting method according to claim 4, wherein the head is moved in a height direction so as to be in a board mounting order, and the R-axis adjustment step is performed after the Z-axis adjustment step. 6. A plurality of heads movably supported on a base;
Nozzles provided in these heads,
A drive unit for moving the head and rotating the nozzle;
A component supply unit for supplying electronic components;
A control unit for controlling the driving unit to transport the electronic component sucked by the nozzle from the component supply unit and mounting the electronic component on a substrate supported by the substrate support unit;
A component mounting apparatus comprising:
The control unit performs the R-axis adjustment in one of the plurality of heads for the R-axis adjustment for adjusting the head to rotate around the central axis of the nozzle so as to obtain a predetermined rotation angle. A component mounting machine characterized in that a timing and a timing for performing the R-axis adjustment in another head are overlapped with each other.   The control unit performs the R-axis adjustment during the transportation of the electronic component, and moves the head to the center of the nozzle so that the posture is in accordance with the mounting position before the electronic component is mounted on the substrate. The component mounting machine according to claim 6, wherein the rotation angle of the electronic component is adjusted by rotating around an axis.   The component mounting machine according to claim 7, wherein the control unit performs the R-axis adjustment in each head before the first electronic component is mounted on the substrate after the electronic component is sucked.   The controller performs the R-axis adjustment and the Z-axis adjustment for moving the head in a height direction to bring the electronic component closer to a predetermined height with respect to the substrate during the transportation of the electronic component. The component mounting machine according to claim 7 or 8, characterized in that:   In the Z-axis adjustment, when the electronic components sucked by the nozzles of the heads are rotated around the central axis of the nozzles, the height positions of the adjacent electronic components are lowered on the lower side. 10. The component mounter according to claim 9, wherein the head is moved in the height direction so that the mounting order is from the board to the board, and the R-axis adjustment step is performed after the Z-axis adjustment.

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