JP2004335950A - Board conveying device and circuit body forming device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a board conveying device and a circuit body forming device in which a plurality of circuit boards can be conveyed simultaneously without stacking the circuit boards. <P>SOLUTION: In the board conveying device, a board 43 is placed on the upper surface of a conveying belt serving as a board conveying surface, and is conveyed with movement of the conveying belt. The board conveying device is provided with a conveying rail 79 having the conveying belt for guiding a conveying path; and a control rail which is provided in the conveying rail 79, is positioned on a counter side of the conveying belt across the board 43, and is set so that a clearance between the control rail and the conveying rail is greater than a thickness of the board and smaller than a thickness which is double the board. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate transport apparatus and a circuit body forming apparatus that place a substrate on a transport belt, transport the substrate as the transport belt moves, and mount electronic components on the transported substrate to form a circuit.
[0002]
[Prior art]
2. Description of the Related Art In recent years, there has been an increasing need to carry and use electronic devices, as typified by mobile phones, and the circuit board used in these electronic devices has a small area and a thickness of 0.3 to 0.1 mm. It tends to be as thin as about 4 mm. In order to emphasize versatility, the circuit body forming apparatus for forming this type of circuit board is generally referred to as an M size from an X-direction dimension of 50 mm × Y-direction dimension of 50 mm to an X-direction dimension of 330 mm × Y-direction dimension of 250 mm. The design is such that a circuit board up to a board thickness of about 4 mm can be produced.
[0003]
Hereinafter, a substrate transport / regulation device of a conventional circuit body forming apparatus will be described with reference to FIGS. FIG. 9 and FIG. 10 are schematic configuration diagrams of a conventional substrate transfer / regulation device of a circuit body forming apparatus.
The regulation holding of the circuit board 3 of the XY table 1 corresponds to the model switching with a small setup, so that the transport rail 5 supporting the circuit board 3 from the lower surface is raised, and the board upper surface regulating rail 7 arranged on the upper surface of the board is moved up. The circuit board 3 is sandwiched and clamped between them, so that adjustment work for each board thickness is not required.
[0004]
At this time, the gap between the board transfer surface and the board upper surface regulating rail 7 is about 5 mm so that the board having a board thickness of about 4 mm can be transferred. By the way, in the case of a small circuit board 3, a method of reducing the loading / unloading operation of the circuit board 3 by loading a plurality of the circuit boards 3 into the equipment at once as a means of improving productivity is adopted. For example, the dimension L in the X direction ₁ = 150 mm circuit board 3, maximum X direction dimension L _max For equipment that can handle a circuit board 3 of = 330 mm, if the circuit boards 3 are arranged without any gaps between them, as shown in FIG. It can be produced (for example, see Patent Document 1).
[0005]
[Patent Document 1]
JP 2002-43793 A
[0006]
However, when the thickness of the circuit boards 3a and 3b is about 0.3 to 0.8 mm, unless the circuit boards are transported away from each other, the circuit board 3a hits the stopper 9 as shown in FIG. Since the gap between the board conveying surface and the board upper surface regulating rail 7 is about 5 mm, the circuit board 3b rides on or goes under the circuit board 3a due to the inertia of the circuit board 3b, and the predetermined circuit board regulating position is set. 11, the circuit board 3b cannot be positioned, and production cannot be started. Further, the mounting position of the electronic component already mounted on the circuit board may be shifted or may be missing. For this reason, conventionally, as shown in FIG. 13, the circuit board 3a is first loaded into the XY table 1 from the loading rail 13 and stopped by the downstream stopper 9, and then the upstream stopper 15 is inserted and set. The circuit board 3b is stopped at the board stop position 17. In FIG. 9, reference numeral 19 denotes a carry-out rail, and in FIG. 10, reference numeral 21 denotes a transport belt.
[0007]
[Problems to be solved by the invention]
However, when the circuit board is carried into the XY table as described above and stopped by the downstream stopper, and then the upstream stopper is inserted and the circuit board is stopped at the set board stop position, the circuit board is released. Therefore, it takes a longer time to complete the transfer as compared with the case where the transfer is performed at once.
In addition, since a gap between the circuit boards is ensured, the number of circuit boards that can be carried into the facility decreases, and the merit of putting a plurality of circuit boards into the facility decreases.
Further, in order to transport the circuit boards having an arbitrary thickness of 0.3 to 0.8 mm with no gap therebetween, the gap between the board transport surface of the XY table and the board upper surface regulating rail is determined by the thickness of the circuit board. Therefore, the board upper surface regulating rail 7 or the transport rail 5 shown in FIG. 10 must be replaced and adjusted each time to cope with the situation, and the advantage of the XY table, that is, the good board thickness switching setup workability is impaired. Was.
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide a substrate transfer apparatus and a circuit body forming apparatus capable of simultaneously transferring a plurality of circuit boards without overlapping each other. A second object of the present invention is to provide a circuit board forming apparatus and a circuit board forming apparatus which have no restriction on the thickness of a circuit board and have good board thickness switching setup workability.
[0008]
[Means for Solving the Problems]
The substrate transport apparatus according to claim 1, wherein the substrate is transported on a transport belt serving as a substrate transport surface, and the substrate is transported as the transport belt moves. An apparatus, comprising: a transport rail having the transport belt and guiding a transport path; and a transport rail provided on the transport rail and located on an opposite side of the transport belt with the substrate interposed therebetween. A regulating rail set to be larger than the thickness of the substrate and smaller than twice the thickness of the substrate.
[0009]
In this substrate transfer device, the distance between the regulation rail and the transfer belt is set to be larger than the thickness of the substrate and smaller than twice the thickness of the substrate, so that the circuit board does not run over or bend by the inertia of the circuit board. Can be conveyed simultaneously. Therefore, it is not necessary to stop each circuit board with the stopper. As a result, the time required to complete the transfer can be shortened, the number of circuit boards that can be carried into the facility is maximized, and the advantage of loading a plurality of circuit boards is maximized.
[0010]
According to a second aspect of the present invention, there is provided a circuit body forming apparatus provided on the XY table which moves in the XY directions while regulating and holding the substrate according to the component mounting position command, and is transported by the transport rail. One stopper for stopping the substrate at a predetermined position, a loading rail for loading the substrate into the XY table, an unloading rail for unloading the substrate from the XY table, and an actuator for vertically moving the XY table. The gap between the regulation rail and the substrate transport surface of the transport belt is greater than the thickness of the substrate and is greater than twice the thickness of the substrate in accordance with the substrate thickness in conjunction with the vertical movement of the XY table. It can be set small.
[0011]
In this circuit body forming apparatus, a substrate transport device is provided on an XY table, and a gap between a regulating rail and a substrate transport surface of a transport belt can be set according to a substrate thickness in conjunction with the vertical movement of the XY table. It becomes. Therefore, even when the circuit boards having an arbitrary thickness are transported side by side without any gap, the gap between the board transport surface of the XY table and the regulation rail is set according to the thickness of the circuit board, and the regulation rail or There is no need to replace and adjust the rail each time. As a result, it is possible to sufficiently exhibit good substrate thickness switching setup workability, which is an advantage of the XY table.
[0012]
According to a third aspect of the present invention, there is provided a circuit body forming apparatus, wherein the substrate transport device according to the first aspect is provided on an XY table which moves in the XY directions while regulating and holding the substrate according to a component mounting position command, and is transported by the transport rail. One leading substrate stopper for stopping the substrate at a prescribed position, a loading rail for loading the substrate into the XY table, a loading rail for removing the substrate from the XY table, and a vertical movement of the loading rail and the loading rail. And a clearance between the regulation rail and the substrate transport surface of the transport belt, which is larger than the thickness of the substrate according to the substrate thickness, in conjunction with the lifting and lowering movement of the carry-in rail and the carry-out rail. The thickness can be set smaller than twice the thickness of the substrate.
[0013]
In this circuit body forming apparatus, the substrate transfer device is provided on an XY table, and the gap between the regulating rail and the substrate transfer surface of the transfer belt is adjusted according to the substrate thickness in conjunction with the lifting and lowering movement of the carry-in rail and the carry-out rail. It can be set. That is, in the configuration according to the second aspect, the XY table moves up and down and the carry-in rail and the carry-out rail are fixed, whereas in the configuration according to the third aspect, the XY table is fixed and the carry-in rail and the carry-out rail move up and down. You. Therefore, the gap between the board transfer surface of the XY table and the regulating rail is set in accordance with the thickness of the circuit board, as in the configuration of the second aspect. As a result, it is possible to sufficiently exhibit good substrate thickness switching setup workability, which is an advantage of the XY table.
[0014]
5. The circuit body forming apparatus according to claim 4, wherein the XY table raises a transport rail supporting the substrate from a lower surface, and clamps the substrate between the XY table and a regulating rail disposed above the substrate. It is characterized by the following.
[0015]
In the circuit body forming apparatus, when the board is lifted by the transfer rail supporting the lower surface of the XY table, the board is clamped between the regulating rail disposed above the board and the board. become. This eliminates the necessity of adjusting the clamp gap for each substrate thickness when clamping the substrate, thereby providing good substrate thickness switching setup workability.
[0016]
6. The circuit body forming apparatus according to claim 5, further comprising a determination unit configured to determine whether or not the plurality of substrates simultaneously loaded on the transport rail are at a specified position, wherein the transport rail before shifting to a production operation. The transfer completion state of the substrate is determined based on a determination result from the determination unit.
[0017]
In this circuit body forming apparatus, the completion state of the transfer of the substrate to the transfer rail before shifting to the production operation is determined by the determination result from the determination unit, so that the presence or absence of a substrate position shift due to the occurrence of a gap between the substrates or the like. Can be confirmed.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of a substrate transport apparatus and a circuit body forming apparatus according to the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective view showing a schematic configuration of a circuit body forming apparatus provided with a substrate transport apparatus according to the present invention, and FIG. 2 is a view showing a lowered position of an XY table as (a) and a substrate transport position as (b). FIG. 3 is a side view showing an XY table, a carry-in rail, and a carry-out rail. FIG. 4 is an explanatory view showing an enlarged view of main parts A and B of FIG. 3 and FIG. FIG. 5 is an explanatory view showing a side view of the state in which the XY table is raised, and FIG. 6B is a side view of the circuit board clamped state, and FIG. FIG. 7 is a plan view showing sensor positions on the transport rail.
[0019]
As shown in FIG. 1, a loader unit 33, a substrate holding unit 35, and an unloader unit 37 are provided on a base of the circuit body forming apparatus 100. The loader section 33 is provided with a carry-in rail 39, and the unloader section 37 is provided with a carry-out rail 41. The circuit board 43 of the unloader unit 37 is carried into the substrate holding unit 35 by the carrying-in rail 39, and the circuit board 43 of the board holding unit 35 is carried to the unloader unit 37 by the carrying-out rail 41.
[0020]
Y-axis robots 45 and 45 are provided on the base, and an X-axis robot 47 is suspended between the two Y-axis robots 45 and 45. Can move forward and backward in the Y-axis direction. A mounting head 49 is attached to the X-axis robot 47 so that the mounting head 49 can move forward and backward in the X-axis direction, thereby enabling the mounting head 49 to move in the XY plane.
[0021]
A mounting head 49 mounted on an XY robot 51 including an X-axis robot 47 and Y-axis robots 45 and 45 and freely moving on an XY plane is supplied with electronic components such as a resistance chip and a chip capacitor. A desired electronic component is sucked from the component supply unit 59 via the nozzle 52 attached to the mounting head 49, and can be mounted on the component mounting position of the circuit board 43. The mounting operation of such an electronic component is controlled based on a mounting program set in advance.
[0022]
A board camera 53 is mounted on the mounting head 49, and the board camera 53 reads a board position mark or the like for positioning the circuit board 43. Based on the read information, it is calculated how the circuit board 43 is tilted with respect to the XY robot 51 and at what position.
[0023]
Further, in the vicinity of the substrate holding unit 35, a two-dimensional displacement (suction posture) of the electronic component sucked by the mounting head 49 is detected, and the mounting head 49 corrects so as to cancel the positional shift. A component recognition sensor 57 is provided for determining whether the electronic component is good or bad (for example, a defect such as a bent lead). The component recognition sensor 57 is disposed below the head moving path, and a plurality of components that are suction-held by the mounting head 49 during the high-speed movement from the component supply unit 59 to the mounting position without stopping the mounting head 49. Image electronic components at once.
[0024]
The mounting head 49 is configured as a multiple head in which a plurality of suction heads are connected side by side. Further, the mounting head 49 holds the mounting nozzle 52 so as to be exchangeable. The nozzle replacement of the mounting head 49 is performed by a nozzle change unit 60 provided near the substrate holding unit 35. The mounting head 49 moves the mounting nozzle 52 up and down by an actuator, for example, an air cylinder, and replaces the mounting nozzle 52 in the nozzle change unit 60.
[0025]
When the circuit board 43 carried in from the loader unit 33 is transported to a predetermined board stop position, the mounting head 49 is moved in the XY plane by the XY robot 51 and sucks a desired electronic component from the component supply unit 59. Then, the electronic component is moved to the component recognition sensor 57 to check the suction state of the electronic component, and to perform the quality judgment and the correction operation. Thereafter, electronic components are mounted at predetermined positions on the circuit board 43.
[0026]
In this way, the circuit body forming apparatus 100 completes the mounting of the electronic component on the circuit board 43 by repeating the operation of attracting the electronic component and mounting the electronic component on the circuit board 43. The circuit body forming apparatus 100 carries out the mounted circuit board 43 from the mounting position to the unloader section 37, and carries in a new circuit board 43 into the loader section 33, and repeats the above operation.
[0027]
As shown in FIG. 2, the board holding unit 35 is provided with an XY table 61 that moves in the XY directions while regulating and holding the circuit board 43 in accordance with the component mounting position command. The XY table 61 moves up to the substrate transfer height H. As shown in FIG. 3, when the XY table 61 is arranged at the lowered position, the carry-in rail 39 and the carry-out rail 41 are located above.
[0028]
As shown in FIG. 4, a belt pulley 65 is provided on the carry-in rail 39, and a conveyor belt 67 is hung on the belt pulley 65. Further, a belt pulley 69 is provided on the carry-out rail 41, and a conveyor belt 71 is hung on the belt pulley 69. These transport belts 67 and 71 can be driven synchronously by a drive motor (not shown).
[0029]
A regulation rail 73 is provided on the carry-in rail 39 so as to be separated from the transport belt 67. The regulation rail 73 can guide the circuit board 43 having a thickness t transported by the transport belt 67 from above. Similarly, a regulation rail 75 is provided on the carry-out rail 41 so as to be separated from the conveyor belt 71, and the regulation rail 75 can guide the circuit board 43 conveyed by the conveyor belt 71 from above. Both of the regulation rail 73 and the regulation rail 75 have their ends and start ends extended above the substrate holding portion 35 and are in an overhang state.
[0030]
On the XY table 61, a substrate transfer device 200 is provided at an upper portion, and the substrate transfer device 200 has a transfer rail 79. A belt pulley 81 is provided on the transport rail 79, and a transport belt 83 is hung on the belt pulley 81. In addition, a regulation rail 85 is provided on the conveyance rail 79 so as to be separated from the conveyance belt 83, and the regulation rail 85 guides the conveyance path.
[0031]
As shown in FIG. 4B, the regulation rail 85 is attached to the transport rail 79 so as to be vertically movable in parallel. The regulation rail 85 is located on the opposite side of the conveyor belt 83 with the circuit board 43 interposed therebetween. Further, a compression spring 87 is provided between the regulation rail 85 and the transport rail 79, and the compression spring 87 urges the regulation rail 85 to a raised position. Therefore, the regulating rail 85 is normally arranged at the ascending position, and is lowered by pressing from above.
[0032]
Above the control rail 85, the control rail 73 of the carry-in rail 39 and the control rail 75 of the carry-out rail 41 are arranged. When the XY table 61 is raised, the control rail 85 is controlled by the control rail 73 and the control rail 75. The rail 75 is pressed from above to be pressed down against the urging force of the compression spring 87. As shown in FIG. 5, at the position where the XY table 61 has been lifted, the distance A between the regulation rail 85 and the conveyor belt 83 is larger than the thickness t of the circuit board 43 and twice the thickness 2t of the circuit board 43. It is set to be smaller (t <A <2t).
[0033]
The amount of elevation of the XY table 61 is controlled in accordance with the thickness of the circuit board 43 by the elevation amount control signal from the control unit provided in the circuit body forming apparatus 100 so that the above set range (t <A <2t). Adjusted. Accordingly, in conjunction with the vertical movement of the XY table 61, the distance A between the regulation rail 85 and the substrate transport surface of the transport belt 83 is larger than the thickness of the circuit substrate 43 according to the thickness of the circuit substrate 43, and The thickness is set smaller than twice the thickness of the substrate 43. This makes it possible to sufficiently exhibit the good workability of the XY table 61, which is an excellent workability for switching the thickness of the substrate.
[0034]
The circuit board 43 carried in from the loader section 33 is stopped at a predetermined board stop position of the board holding section 35. This stop is performed by one leading board stopper 89 that stops the circuit board 43 transferred by the transfer rail 79 at a predetermined position. When the circuit board 43 is not loaded into the board holding unit 35, the lower end of the leading board stopper 89 is located above the board transfer surface. On the other hand, when the circuit board 43 is carried into the board holding unit 35 and the circuit board 43 is stopped at the board stop position, the lower end is lowered to project on the board transfer surface, so that the first circuit board 43 Of the transfer direction, and acts to stop the circuit board 43 at a predetermined stop position.
[0035]
Accordingly, the plurality of circuit boards 43 carried in from the carry-in rail 39 to the transport rail 79 of the board holding unit 35 are in a state where the ends are connected to each other, so that the leading one circuit board 43 is accurately positioned. By being positioned, the second and subsequent circuit boards 43 are naturally positioned following the head. The head substrate stopper 89 is driven up and down by, for example, an air cylinder. In addition, it may be driven up and down by a hydraulic cylinder, an electric motor, an electromagnetic plunger, or the like.
[0036]
As shown in FIG. 6, the XY table 61 raises the transport rail 79 that supports the circuit board 43 stopped by the leading board stopper 89 from the lower surface, and the regulating rail 85 disposed above the circuit board 43. And clamp both edges. Therefore, even when the circuit boards 43 have different thicknesses, the upper surface serving as the mounting surface of the electronic component is always arranged at a constant reference position. This eliminates the need for adjusting the clamp gap for each substrate thickness when clamping the circuit board 43, and provides good board thickness switching setup workability.
[0037]
As shown in FIG. 7, sensors 91, 93, and 95 serving as determination means are provided on the transport rail 79. The sensor 91 is located at the front of the first circuit board 43a, and the sensor 93 is located at the next circuit board 43b. The front and sensor 95 detect the rear end of the last circuit board 43b. These sensors 91, 93, and 95 determine whether or not the plurality of circuit boards 43 simultaneously loaded on the transport rail 79 are at specified positions. That is, the circuit body forming apparatus 100 can determine the completion state of the transfer of the circuit board 43 to the transfer rail 79 before shifting to the production operation, based on the determination results from these sensors 91, 93, and 95. This makes it possible to reliably confirm the presence or absence of a substrate position shift due to a gap between the substrates.
[0038]
Next, the operation of the circuit body forming apparatus 100 including the above-described substrate transfer device 200 will be described.
For example, when two thin circuit boards 43 having a thickness t are simultaneously transferred, the XY table 61 rises to the substrate transfer height H during the substrate transfer operation. At this time, the control rail 73 provided on the carry-in rail 39 and the control rail 75 provided on the carry-out rail 41 come into contact with the control rail 85 provided on the XY table 61, and as shown in FIG. Is pushed down.
[0039]
The regulating rail 85 is urged upward by a compression spring 87 as shown in FIG. 5B, but descends when a force is applied from above. The lower surface 85a of the regulating rail 85 is a substrate upper surface regulating surface, and the lower surface 85a always becomes the upper surface height of the circuit board 43 during the production operation.
[0040]
The interval A between the conveyor belt 83 and the regulating rail 85 is set so that t <A <2t when the substrate thickness is t, and the circuit boards 43a and 43b do not overlap. The completion of the transfer of the circuit board 43 is detected when the sensors 91 and 93 shown in FIG. 7 are turned on and the sensor 95 is turned off. By this determination, the displacement of the substrate due to the occurrence of a gap between the substrates is checked.
[0041]
When the substrate transfer operation is completed, the XY table 61 is lowered again. At that time, the regulating rail 85 is raised by the force of the compression spring 87. At the same time, as shown in FIG. 6, the transport rail 79 is raised, the circuit board 43 is clamped, and the electronic components are mounted. After the mounting is completed, the clamp is released by lowering the transport rail 79. Next, when the leading board stopper 89 is raised, the circuit board 43 is in a state capable of being conveyed, and is conveyed to the unloading rail 41 by driving the conveying belt 83, and further from the unloading rail 41 to the unloader section 37. Will be carried out.
[0042]
According to the board transfer device 200, the distance A between the regulation rail 85 and the transfer belt 83 is set to be larger than the thickness of the circuit board 43 and smaller than twice the thickness of the circuit board 43, so that the circuit board 43 can ride on due to inertia. As a result, a plurality of circuit boards 43 can be simultaneously conveyed. Therefore, it is not necessary to stop each circuit board 43 with the stopper. Thereby, the time until the completion of the transfer can be shortened, the number of the circuit boards 43 that can be carried into the equipment is maximized, and the merit of loading the plurality of circuit boards 43 is maximized.
[0043]
In addition, according to the circuit body forming apparatus 100, the substrate transfer device 200 is provided on the XY table 61, and the distance between the regulation rail 85 and the substrate transfer surface of the transfer belt 83 is linked with the vertical movement of the XY table 61. A can be set according to the board thickness, and even when circuit boards of any thickness are transported side by side with no gap, the gap between the board transport surface of the XY table 61 and the regulation rail 85 is limited to the circuit board 43. It is no longer necessary to replace and adjust the regulating rail 85 or the transport rail 79 each time. This makes it possible to sufficiently exhibit the excellent substrate thickness switching setup workability, which is an advantage of the XY table 61.
[0044]
Although the substrate transfer apparatus 200 according to the above embodiment has been described with an example in which the XY table 61 is provided so as to be able to move up and down, the XY table 61 and the carry-in rail 39 and the carry-out rail 41 move relatively up and down. The XY table 61 may be fixed, and the carry-in rail 39 and the carry-out rail 41 may be configured to be able to move up and down, as shown in FIG. 8, for example, contrary to the present embodiment. In this example, for example, the carry-in rail 39 and the carry-out rail 41 can be moved up and down by a link mechanism 99 connected by a rotatable arm 97. Even with such a configuration, the gap between the board transfer surface of the XY table 61 and the regulation rail 85 can be set in accordance with the thickness of the circuit board 43, and a good board thickness switching setup work which is an advantage of the XY table 61. The ability can be fully exhibited.
[0045]
【The invention's effect】
As described above in detail, according to the substrate transfer apparatus according to the present invention, a transfer rail having a transfer belt and guiding a transfer path, and a distance between the transfer belt provided on the transfer rail and the transfer belt is greater than a thickness of the substrate. Since a regulating rail which is large and is set to be smaller than twice the thickness of the board is provided, the circuit board does not run up or go under due to inertia, and a plurality of circuit boards can be transported simultaneously. Therefore, it is not necessary to stop each circuit board with the stopper. As a result, the time required to complete the transfer can be shortened, and the number of circuit boards that can be carried into the equipment can be maximized, so that the merit of loading a plurality of circuit boards can be maximized.
[0046]
According to the circuit body forming apparatus of the present invention, the substrate transport device is provided on the XY table, and the gap between the regulation rail and the substrate transport surface of the transport belt is reduced by the substrate thickness in conjunction with the vertical movement of the XY table. Therefore, it can be set to be larger than the thickness of the substrate and smaller than twice the thickness of the substrate. The gap between the rail and the circuit board can be set according to the thickness of the circuit board. There is no need to replace or adjust the regulation rail or transfer rail each time, and it is an advantage of the XY table. Can be demonstrated.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating a schematic configuration of a circuit body forming apparatus provided with a substrate transfer device according to the present invention.
FIGS. 2A and 2B are explanatory diagrams illustrating a lower position of the XY table and a substrate transfer position of the XY table.
FIG. 3 is a side view showing an XY table, a carry-in rail, and a carry-out rail.
FIG. 4 is an explanatory view showing an enlarged view of main parts A and B in FIG. 3 and FIG.
FIGS. 5A and 5B are explanatory views showing a side view and a cross-sectional view of the XY table in a raised state, respectively.
FIGS. 6A and 6B are explanatory views showing a side view and a cross-sectional view of the circuit board clamped state.
FIG. 7 is a plan view illustrating a sensor position on a transport rail.
FIGS. 8A and 8B are explanatory diagrams showing a lowering position of a carry-in rail and a carry-out rail in a modification of the elevating mechanism, and FIG.
FIG. 9 is a plan view of a conventional substrate transfer device.
10A and 10B are explanatory diagrams illustrating a lower position of a transfer rail and a higher position of the transfer rail in a conventional substrate transfer device.
FIG. 11 is a plan view showing a dimensional relationship of a circuit board carried into a conventional board transfer device.
FIG. 12 is a side view showing a situation in which a conventional substrate transfer apparatus has climbed a substrate.
FIG. 13 is a plan view illustrating a stopped state of a circuit board in a conventional board transfer device.
[Explanation of symbols]
39 Loading rail
41 Export rail
43 circuit board
61 XY table
79 Transport rail
83 conveyor belt
85 Regulation rail
89 Top board stopper
91, 93, 95 sensors (judgment means)
100 Circuit body forming device
200 substrate transfer device
A interval
t Substrate thickness

Claims (5)

A substrate transport device that places a substrate on an upper surface of a transport belt serving as a substrate transport surface and transports the substrate with movement of the transport belt,
A conveyance rail having the conveyance belt and guiding a conveyance path,
A regulating rail provided on the transport rail and positioned on the opposite side of the transport belt with the substrate interposed therebetween, wherein a distance between the transport belt and the transport belt is set to be larger than the thickness of the substrate and smaller than twice the thickness of the substrate; A substrate transfer device comprising: A board transfer device according to claim 1, provided on an XY table that moves in the XY directions while regulating and holding the board according to a component mounting position command,
One leading substrate stopper for stopping the substrate transferred by the transfer rail at a specified position,
A loading rail for loading a substrate into the XY table;
An unloading rail for unloading the substrate from the XY table;
An actuator for raising and lowering the XY table,
In conjunction with the vertical movement of the XY table, a gap between the regulation rail and the substrate transport surface of the transport belt is set to be larger than the thickness of the substrate and smaller than twice the thickness of the substrate according to the substrate thickness. A circuit body forming apparatus characterized in that it is possible. A board transfer device according to claim 1, provided on an XY table that moves in the XY directions while regulating and holding the board according to a component mounting position command,
One leading substrate stopper for stopping the substrate transferred by the transfer rail at a specified position,
A loading rail for loading a substrate into the XY table;
An unloading rail for unloading the substrate from the XY table;
Comprising an actuator that moves the carry-in rail and the carry-out rail up and down,
In conjunction with the lifting and lowering movement of the carry-in rail and the carry-out rail, a gap between the regulation rail and the substrate transport surface of the transport belt is larger than the thickness of the substrate and twice as large as the substrate according to the substrate thickness. A circuit body forming apparatus characterized in that it can be set smaller than the thickness. 4. The XY table according to claim 2, wherein the transport rail supporting the substrate from below is lifted, and the XY table clamps the substrate between the control rail and a regulating rail disposed above the substrate. 5. Circuit body forming apparatus. Determining means for determining whether or not the plurality of substrates simultaneously loaded on the transfer rail is at a specified position,
4. The circuit body forming apparatus according to claim 2, wherein a completion state of the transfer of the substrate to the transfer rail before shifting to the production operation is determined based on a determination result from the determination unit.

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