KR102159204B1 - A robot for attaching flexible printed crcuit board equipped with crcuit board pressing apparatus - Google Patents

Abstract

The present invention is provided on a main body table, a jig transfer unit that horizontally transfers a carrier jig to which a flexible circuit board is attached, and is provided on an upper part of the main body table, and picks up the flexible circuit board and attaches it to the carrier jig. It provides a flexible circuit board automatic attaching robot equipped with a substrate pressing device including a substrate pressing device that is provided on one substrate loading unit and an upper portion of a main body table and presses a flexible circuit board attached to a carrier jig.

Description

TECHNICAL FIELD A robot for attaching flexible printed circuit board equipped with a crcuit board pressing apparatus

The present invention relates to a flexible circuit board automatic attachment robot equipped with a substrate pressing device, and more particularly, a flexible circuit board equipped with a board pressing device capable of automatically aligning and firmly attaching a plurality of flexible circuit boards to a carrier jig. It relates to an automatic attachment robot.

In general, a flexible printed circuit board (FPCB) is a structure in which a circuit is formed on a flexible film and an electronic device is mounted, and is applied to various electronic devices such as portable terminals, notebook computers, and digital cameras.

These flexible circuit boards are flexible in their physical properties and do not retain their original shape. Therefore, in order to surface-mount electronic devices such as chip parts on the flexible circuit board, a structure capable of supporting the flexible circuit board flat during the surface mounting process is required. need.

Accordingly, in supplying a flexible circuit board to a surface mounting device that mounts chip components on a flexible circuit board, a plurality of flexible circuit boards are usually aligned and accurately attached to a predetermined position of the carrier jig, and then the carrier jig is mounted on the surface mounting device. To perform the surface mounting process.

At this time, in the process of attaching a plurality of flexible circuit boards to a carrier jig, an operator typically repeatedly directly attaches a plurality of flexible circuit boards one by one at a predetermined position of the carrier jig to which the adhesive tape is attached.

However, when the operator manually attaches a plurality of flexible circuit boards to the carrier jig as described above, it is difficult to accurately attach the flexible circuit board to a certain position of the carrier jig, and since the operator presses and attaches it by hand, it is flexible to the carrier jig. There was a problem with a high defect rate because the circuit board was not evenly attached.

In the present invention, a flexible circuit board automatic attaching robot equipped with a substrate pressing device, specifically, a plurality of flexible circuit boards can be quickly and accurately mounted and attached to a carrier jig, and in particular, temporary attachment to a carrier jig by a substrate loading unit. An object is to provide a flexible circuit board automatic attachment robot equipped with a substrate pressing device capable of improving product reliability by uniformly pressing and firmly attaching a plurality of flexible circuit boards through a substrate pressing device.

The technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems that are not mentioned will be clearly understood by those of ordinary skill in the technical field to which the present invention belongs from the following description. I will be able to.

In order to solve the above-described problems, the present invention provides a main body table, a jig transfer unit that horizontally transfers a carrier jig to which a flexible circuit board is attached, and is provided on an upper part of the main body table, and the flexible circuit board A flexible circuit board equipped with a substrate pressing device including at least one substrate loading unit that picks up and attaches to the carrier jig and a substrate pressing device that is provided on the top of the main body table and presses the flexible circuit board attached to the carrier jig. Attachment robots are provided.

In addition, the substrate pressing device includes a vertical frame arranged vertically from the top of the main body table to the rear end of the jig transfer section, a parallel guide connected to the top of the vertical frame so as to be parallel to the jig transfer section, and from the top of the jig transfer section along the parallel guide. A substrate pressurizing device including a transfer member provided to be movable, a lifting member provided to be able to move up and down on the transfer member, and a pressurizing member provided under the lift member to pressurize and attach the flexible circuit board loaded on the carrier jig is provided. It provides a robot that automatically attaches a flexible circuit board.

In addition, the pressing member provides a flexible circuit board automatic attachment robot provided with a substrate pressing device comprising at least one pressing roller that presses and rolls the flexible circuit board loaded on the carrier jig.

In addition, the jig transfer unit is disposed on the top of the main body table in one direction, and the first and second conveyor frames that form a jig transfer path through which the carrier jig is transferred, and the front and rear ends of the conveyor frame are rotatably provided. A substrate comprising a rotation shaft, a pair of wire belts each wound on both edges of the first and second rotation shafts and transferring the carrier jig along the jig transfer path, and a rotation shaft driving means for transferring rotational force to the first and second rotation shafts It provides a flexible circuit board automatic attachment robot equipped with a pressing device.

In addition, the jig transfer unit further includes a jig alignment unit that aligns a carrier jig transferred along the jig transfer path to a substrate pressing position where the substrate pressing device presses the flexible circuit board. to provide.

In addition, the jig alignment unit is provided so as to be elevated on the jig transfer path, and a stopper means for stopping or passing the carrier jig to the substrate pressing position according to the elevating operation, and a jig detection that detects the carrier jig stopped at the substrate pressing position by the stopper means. A substrate pressurizing device comprising a sensor, a jig alignment plate disposed under the jig transfer path and supporting by aligning and supporting a carrier jig stopped at a substrate pressing position, and an elevating means for raising and lowering the jig alignment plate according to a detection signal from the jig detection sensor It includes a flexible circuit board automatic attachment robot equipped with.

In addition, there is provided a flexible circuit board automatic attachment robot provided with a substrate pressing device in which a plurality of fixing pins for aligning and fixing a carrier jig are formed on an upper surface of the jig alignment plate.

In addition, the jig transfer unit provides a flexible circuit board automatic attaching robot equipped with a substrate pressing device including a thickness sensing sensor that detects the thickness of the flexible circuit board attached to the carrier jig.

A flexible circuit board automatic attachment robot equipped with a substrate pressing device according to an embodiment of the present invention can precisely attach a plurality of flexible circuit boards to a predetermined position on the upper surface of the carrier jig, and to the carrier jig through the substrate pressing device. By uniformly pressing a plurality of stacked and attached flexible circuit boards and attaching them more firmly. There is an advantage that can improve product reliability.

1 is a front view showing the configuration of a flexible circuit board automatic attachment robot equipped with a substrate pressing device according to an embodiment of the present invention.
2 is a plan view showing the configuration of a flexible circuit board automatic attaching robot equipped with a substrate pressing device according to an embodiment of the present invention.
3 is a front cross-sectional view showing an internal configuration of a jig transfer unit according to an embodiment of the present invention.
Figure 4 is a side cross-sectional view showing the internal configuration of the jig transfer unit according to an embodiment of the present invention.
5 shows a configuration of a substrate loading unit according to an embodiment of the present invention.
6 shows a configuration of a substrate pressing apparatus according to an embodiment of the present invention.
7 and 8 are sequentially showing the operation of the flexible circuit board automatic attachment robot equipped with a substrate pressing device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The detailed description to be disclosed hereinafter together with the accompanying drawings is intended to describe exemplary embodiments of the present invention, and is not intended to represent the only embodiments in which the present invention may be practiced.

In the drawings, parts irrelevant to the description may be omitted in order to clearly describe the present invention, and the same reference numerals may be used for the same or similar components throughout the specification.

In an embodiment of the present invention, expressions such as “or” and “at least one” may represent one of words listed together, or a combination of two or more.

1 is a front view showing the configuration of a flexible circuit board automatic attachment robot 10 equipped with a substrate pressing device according to an embodiment of the present invention, and FIG. 2 is a substrate pressing device according to an embodiment of the present invention. The configuration of the provided flexible circuit board automatic attachment robot 10 is shown in plan view.

For convenience of explanation, in the flexible circuit board automatic attachment robot 10 provided with the substrate pressing device according to the present embodiment illustrated in FIG. 1, the side on which the substrate pressing device 600 is disposed is defined as the rear, and Explain by defining the other side as the front.

1 and 2, a flexible circuit board automatic attachment robot 10 equipped with a substrate pressing device according to an embodiment of the present invention includes a main body table 100, a jig transfer unit 200, and a substrate loading unit ( 400, 500) and a substrate pressing device 600 may be included.

The main body table 100 supports the jig transfer unit 200, the substrate loading units 400 and 500, and the substrate pressing device 600 on the upper portion of the table.

In addition, a control unit 110 for controlling operations such as the jig transfer unit 200, the substrate loading units 400 and 500, and the substrate pressing device 600 may be provided at one side of the main body table 100.

The jig transfer unit 200 is provided on the upper body table 100 to horizontally transport the carrier jig 2 to which the flexible printed circuit board (FPCB) is attached from the upper body table 100. I can.

That is, the jig transfer unit 200 is configured to transfer the carrier jig 2 in the front-rear direction from the top of the main body table 100, and the carrier jig 2 is transferred to the substrate loading unit 400, 500 to the flexible circuit board 1 By transferring to a preset substrate loading position to be loaded, a plurality of flexible circuit boards 1 picked up and transferred by the substrate loading units 400 and 500 may be loaded at a predetermined position of the carrier jig 2.

In addition, the jig transfer unit 200 transfers the carrier jig 2 loaded with the flexible circuit board 1 to a preset substrate pressing position where the substrate pressing device 600 presses the flexible circuit board 1, The flexible circuit board 1 loaded on (2) can be firmly attached by the substrate pressing device 600.

At this time, an adhesive tape (not shown) is attached to the upper surface of the carrier jig 2 at the position where the flexible circuit board 1 is loaded, and the flexible circuit is attached to the upper surface of the carrier jig 2 by an adhesive tape (not shown). The substrate 1 may be attached.

Here, the carrier jig 2 serves to align and supply the flexible circuit board 1 to a surface mount device (SMD).

That is, in supplying the flexible circuit board 1 as a surface-mounting device for mounting chip components on the flexible circuit board 1, in order to improve productivity, a plurality of flexible circuit boards 1 are usually used in the carrier jig 2 The carrier jig (2) is supplied to the surface mount device after it is aligned and accurately attached to a certain position.

At this time, when the flexible circuit board 1 is attached to the carrier jig 2 in a different position, the product cannot be mounted at a predetermined position in the surface mounting process, resulting in a defect in the product. Accordingly, it is very important to firmly attach the flexible circuit board 1 to a predetermined position of the carrier jig 2.

Figure 3 is a front cross-sectional view showing the internal configuration of the jig transfer unit 200 according to an embodiment of the present invention, Figure 4 is a side showing the internal configuration of the jig transfer unit 200 according to an embodiment of the present invention It is a cross-sectional view.

3 and 4, the jig transfer unit 200 is disposed in one direction above the main body table 100, and a conveyor frame 210 that forms a jig transfer path through which the carrier jig 2 is transferred and , The first and second rotational shafts 221 and 222, which are respectively rotatably provided at the front and rear ends of the conveyor frame 210, and are wound on both edges of the first and second rotational shafts 221 and 222, respectively, and the jig transfer path It may include a pair of wire belts 230 for transporting the carrier jig 2 along the way, and a rotation shaft driving means (not shown) for transmitting rotational force to the first and second rotation shafts 221 and 222.

Here, in the conveyor frame 210, a pair of frames are arranged spaced apart from each other by a predetermined interval, so that a jig transfer path through which the carrier jig 2 is transferred in the longitudinal direction may be formed between the pair of frames.

In addition, the conveyor frame 210 is wound on the first and second rotational shafts 221 and 222 so as to prevent the pair of wire belts 230 that transport the carrier jig 2 from sagging downward, on the inner side of the frame. A belt support guide 211 for supporting the wire belt 230 may be formed.

In addition, the rotation shaft driving means (not shown) includes a drive motor (not shown) and a power transmission unit (not shown) that transmits power of the drive motor (not shown) to at least one of the first and second rotation shafts 221 and 222. In this case, the power transmission unit (not shown) may be configured with a gear, chain, or belt structure, and may transmit power of a driving motor (not shown) to the rotation shafts 221 and 222.

With this configuration, when the first and second rotation shafts 221 and 222 are rotated by the drive of the rotation shaft driving means (not shown), a pair of wire belts 230 wound around the first and second rotation shafts 221 and 222 Is operated, and at this time, when the carrier jig 2 is input to the front end of the conveyor frame 210, the carrier jig 2 is placed on a pair of wire belts 230 provided along the length direction of the conveyor frame 210. Both sides are supported so that the carrier jig 2 can be transferred to the rear end of the conveyor frame 210 along a pair of wire belts 230.

In addition, the jig transfer unit 200 includes a carrier jig 2 transferred along the jig transfer path by a pair of wire belts 230, and a substrate loading position or a substrate pressing device 600 corresponding to the substrate loading units 400 and 500. It may further include at least one jig alignment portion (240a, 240b) arranged in the substrate pressing position corresponding to ).

3 and 4, the jig alignment units 240a and 240b are provided on the jig transfer path of the conveyor frame 210, and the board loading units 400 and 500 are loaded with the substrate on which the flexible circuit board 1 is loaded. The first jig alignment unit 240a may be disposed at the position, and the second jig alignment unit 240b may be disposed at the substrate pressing position where the substrate pressing device 600 presses the flexible circuit board 1.

At this time, the first jig alignment unit 240a is provided so as to be elevated on the jig transfer path of the conveyor frame 210 and stops or passes the carrier jig 2 at the substrate loading position according to the elevating operation ( 241), a jig detection sensor 244 that detects the carrier jig 2 stopped at the substrate loading position by the stopper means 241, and a carrier jig disposed at the bottom of the jig transfer path and stopped at the substrate loading position (2) It may include a jig alignment plate 245 for aligning and supporting, and an elevating means 246 for raising and lowering the jig alignment plate 245 according to a detection signal from the jig detection sensor 244.

In addition, the second jig alignment unit 240b has the same configuration as the first jig alignment unit 240a described above, and differs only in that the carrier jig 2 is aligned with the substrate pressing position.

Here, the stopper means 241 may include a stopper 242 provided to be elevating on the jig transfer path, and a stopper driving means 243 for lifting and lowering the stopper 242.

In addition, a plurality of fixing pins (not shown) for aligning and fixing the carrier jig 2 on the jig alignment plate 245 may be formed to protrude at regular intervals on the upper surface of the jig alignment plate 245.

That is, a plurality of through holes (not shown) are formed in the carrier jig 2 at regular intervals, and a position on the jig alignment plate 245 corresponding to the plurality of through holes (not shown) formed in the carrier jig 2 Each of the fixing pins (not shown) may be formed.

In addition, the lifting means 246 includes a cylinder 247 for lifting the jig alignment plate 245 according to a detection signal of the jig detection sensor 244, and a guide support 248 for guiding the lifting of the jig alignment plate 245 It may include.

With this configuration, when the carrier jig 2 transferred along the jig transfer path by a pair of wire belts 230 on the conveyor frame 210 enters the substrate loading position or the substrate pressing position, the stopper 242 Is stopped at the corresponding position. At this time, the carrier jig 2 stopped at the corresponding position is sensed by the jig detection sensor 244, and the lifting means 246 is transferred to the carrier jig according to the detection signal of the jig detection sensor 244. It is possible to raise the jig alignment plate 245 disposed under the 2).

In this process, the carrier jig 2 is supported on the top of the jig alignment plate 245, and a plurality of fixing pins (not shown) formed on the upper surface of the jig alignment plate 245 are formed on the carrier jig 2 By being inserted into the through hole (not shown), the carrier jig 2 may be fixedly supported by being aligned with the jig alignment plate 245.

In addition, as the jig alignment plate 245 supports the carrier jig 2 and increases a predetermined height, the carrier jig 2 is spaced a predetermined height from the pair of wire belts 230 and interferes with the wire belt 230 It will not be.

At this time, a plurality of flexible circuit boards 1 may be loaded and attached to the carrier jig 2 arranged at the substrate loading position by the jig alignment plate 245 by the substrate loading units 400, 500 to be described later. The upper surface of the carrier jig 2 arranged at the substrate pressing position by the alignment plate 245 may be pressed by the substrate pressing device 600, and a detailed description thereof will be described later.

In addition, when the process by the above-described substrate loading unit (400,500) or the substrate pressing device (600) is completed, according to a preset operation, the lifting means 246 lowers the jig alignment plate 245 to its original position and thus the jig alignment plate The carrier jig 2 supported by 245 is again seated on a pair of wire belts 230, and at the same time, the stopper 242 descends and is retracted from the jig transfer path, so that the carrier jig 2 is transferred to the wire belt ( 230) can be transferred along the jig transfer path.

At this time, when the carrier jig 2 completely passes through the jig detection sensor 244, the stopper 242 retracted according to the detection signal of the jig detection sensor 244 is returned to its original position, thereby following the jig transfer path. The transported carrier jig 2 can be stopped at the substrate loading position or the substrate pressing position.

Meanwhile, a substrate alignment unit 300 may be provided above the jig transfer unit 200 so as to be movable along the longitudinal direction of the jig transfer unit 200 and arrange the flexible circuit board 1 in a predetermined arrangement.

1 and 2, the substrate alignment unit 300 includes a substrate alignment plate 310 on which an alignment means for aligning the flexible circuit board 1 is formed on an upper surface, and the substrate alignment plate 310 A guide member 320 and a substrate alignment plate 310 that guide and couple the substrate alignment plate 310 to the jig transfer unit 200 so as to move in the front-rear direction along the longitudinal direction of the jig transfer unit 200 from the top of the transfer unit 200 ) May include a guide driving means 330 for transmitting a driving force to the guide member 320 so that it moves in the front and rear direction by the guide member 320.

Here, an alignment means for aligning a plurality of flexible circuit boards 1 is provided on the upper surface of the substrate alignment plate 310, and the alignment means includes a plurality of flexible circuit boards 1 arranged at regular intervals and seated. It may include a seating groove 311 and a plurality of auxiliary fixing pins (not shown) protruding in the plurality of seating grooves 311 to align and fix the flexible circuit board 1 seated in the seating groove 311 have.

In addition, a plurality of through holes (not shown) are formed in the flexible circuit board 1 at regular intervals, and the plurality of through holes (not shown) formed in the flexible circuit board 1 and the corresponding substrate alignment plate 310 Auxiliary fixing pins (not shown) may be formed at positions in the seating groove 311, respectively.

In this case, the substrate alignment plate 310 may be replaced according to the standard of the carrier jig 2 or the flexible circuit board 1.

The substrate alignment unit 300 having such a configuration moves the substrate alignment plate 310 to the substrate loading position corresponding to the substrate loading unit 400,500 through the guide driving means 330, and thus, by the substrate loading unit 400,500 The plurality of flexible circuit boards 1 to be loaded may be aligned with the mounting groove 311 of the substrate alignment plate 310 and an auxiliary fixing pin (not shown).

On the other hand, at least one substrate loading unit (400, 500) is provided on the top of the main body table (100), and the flexible circuit board (1) is picked up and attached to the carrier jig (2) arranged at the substrate loading position on the jig transfer path. can do.

At this time, before attaching the flexible circuit board 1 to the carrier jig 2, the substrate loading units 400 and 500 pick up the flexible circuit board 1 in a pre-process and load it on the substrate alignment unit 300, and then The flexible circuit board 1 arranged in a predetermined arrangement by the alignment unit 300 may be picked up and mounted on the carrier jig 2 to be attached.

5 illustrates the configuration of the substrate loading units 400 and 500 according to an embodiment of the present invention.

In this embodiment, as an example, a pair of substrate loading units 400 and 500 is provided, and the flexible circuit board 1 is attached to the carrier jig 2 through the pair of first and second substrate loading units 500 The configuration will be described.

Referring to FIGS. 1, 2 and 5, the first substrate loading unit 400 includes a first support frame 410 disposed perpendicularly to the central portion of the jig transfer unit 200 from the top of the main body table 100, and , Moving in a direction perpendicular to the jig transfer part 200 along the first horizontal guide 420 connected to the upper part of the first support frame 410 so as to be orthogonal to the jig transfer part 200, and the first horizontal guide 420 It is provided under the first transfer member 430 that is provided to be possible, the first lifting member 440 and the first lifting member 440 that are provided to be lifted on the first transfer member 430, the flexible circuit board It may include a first pickup member 450 for picking up (1).

In addition, a plurality of flexible circuit boards 1 are stacked on one side of the first support frame 410 from the top of the main body table 100 to provide a substrate supply unit 120 capable of supplying the flexible circuit board 1. have.

In this case, a plurality of flexible circuit boards 1 may be arranged at regular intervals on the substrate supply unit 120 to be stacked in multiple layers.

The first pick-up member 450 provided in the first substrate loading unit 400 may include a plurality of adsorption pads 451 that pick up and pick up the plurality of flexible circuit boards 1.

With this configuration, in the first substrate loading unit 400, the first pickup member 450 having a plurality of adsorption pads 451 is provided so as to be elevated by the first elevating member 440, and a first transfer By being provided to be movable in a direction orthogonal to the jig transfer unit 200 by the member 430, the first pickup member 450 is moved in the vertical and horizontal directions, and the substrate supply unit 120 through the plurality of suction pads 451 ), a plurality of flexible circuit boards 1 can be picked up and loaded on the substrate alignment plate 310 disposed above the jig transfer unit 200, and a plurality of The flexible circuit board 1 may be picked up and attached to the carrier jig 2 disposed at the substrate loading position on the jig transfer unit 200.

The second substrate loading unit 500 includes a second support frame 510 disposed perpendicular to the front end of the jig transfer unit 200 from the top of the main body table 100, and a second support frame 510 in parallel with the jig transfer unit 200. A second horizontal guide 520 connected to the upper portion of the support frame 510, and a second transfer member 530 provided to be movable from the top of the jig transfer unit 200 in the front-rear direction along the second horizontal guide 520 ), and a second pick-up member provided under the second lift member 540 and the second lift member 540 provided to be liftable on the second transfer member 530 to pick up the flexible circuit board 1 (550) may be included.

The second pick-up member 550 provided in the second substrate loading unit 500 may also include a plurality of adsorption pads 551 that pick up and pick up the plurality of flexible circuit boards 1.

With this configuration, in the second substrate loading unit 500, a second pickup member 550 having a plurality of adsorption pads 551 is provided so as to be elevated by the second lifting member 540, and a second transfer Since the member 530 is provided so as to be movable from the top of the jig transfer unit 200 in the front-rear direction, the second pick-up member 550 is moved in the vertical and horizontal directions, and the jig transfer unit ( A plurality of flexible circuit boards (1) can be picked up from the substrate alignment plate 310 disposed above the 200), and the plurality of flexible circuit boards (1) picked up are placed at the substrate loading position on the jig transfer unit 200 It can be mounted and attached to the carrier jig (2).

At this time, in this embodiment, a plurality of flexible circuit boards 1 are alternately operated on one side and the other side of the upper surface of the carrier jig 2 by alternately operating the first substrate loading unit 400 and the second substrate loading unit 500. By stacking and attaching, the flexible circuit board 1 can be more quickly and accurately attached to a predetermined position of the carrier jig 2.

On the other hand, the substrate pressing device 600 is provided on the top of the main body table 100, by uniformly pressing and firmly attaching the flexible circuit board 1 temporarily attached to the carrier jig 2 by the substrate loading unit 400,500 can do.

6 shows the configuration of a substrate pressing device 600 according to an embodiment of the present invention.

1, 2 and 6, the substrate pressing device 600, a vertical frame 610 disposed perpendicular to the rear end of the jig transfer unit 200 from the top of the main body table 100, and a jig transfer unit A parallel guide 620 connected to the upper part of the vertical frame 610 so as to be parallel with 200, and a transfer member 630 provided to be movable from the top of the jig transfer part 200 along the parallel guide 620 in the front and rear direction. ), and is provided under the lifting member 640 and the lifting member 640 provided to be able to move up and down on the transfer member 630, and pressurizes and attaches the flexible circuit board 1 loaded on the carrier jig 2 It may include a pressing member 650.

Specifically, the vertical frame 610 is disposed at the rear end of the jig transfer unit 200 from the top of the main body table 100, and the vertical frame 610 is parallel to the jig transfer unit 200 at the top of the jig transfer unit 200 Parallel guides 620 arranged in such a manner are connected.

In addition, the transfer member 630 is connected to the parallel guide 620 to move the transfer guide 631 and the transfer guide 631 provided to be movable in the front-rear direction along the parallel guide 620 and the transfer guide driving It may include means (not shown).

At this time, the transfer guide driving means (not shown) may include a drive motor (not shown) and a power transmission unit (not shown) that transmits power of the drive motor (not shown) to the transfer guide 631, at this time The power transmission unit (not shown) may be configured as one of a gear, a chain, or a belt structure, and transmit power of a driving motor (not shown) to the transfer guide 631.

In addition, it goes without saying that the movement amount of the transfer guide 631 can be controlled through the driving amount control of the driving motor (not shown).

In addition, the elevating member 640, the pressing member 650 is coupled to the lower end, the elevating frame 641 is coupled to the guide so as to be elevating to the transfer guide 631, and the elevating frame is coupled to the transfer guide 631 It may include a vertical cylinder 642 for lifting 641).

In addition, the pressing member 650 is provided in the lower part of the lifting frame 641, and a plurality of pressing rollers 651 that pressurize and roll a plurality of flexible circuit boards 1 that are loaded and temporarily attached to the carrier jig 2 It may include.

In the substrate pressing device 600 having such a configuration, a pressing member 650 having a plurality of pressing rollers 651 is provided so as to be elevated by an elevating member 640, and a jig conveying unit ( 200) is provided so as to be movable in the front-rear direction, so that the pressing member 650 is moved to the top of the carrier jig 2 and then lowered to be temporarily attached to the carrier jig 2 through a plurality of pressing rollers 651 A plurality of flexible circuit boards (1) can be pressed, and the plurality of flexible circuit boards (1) are uniformly moved back and forth at a predetermined interval while pressing the plurality of flexible circuit boards (1). Can be firmly attached.

In addition, the second jig alignment unit 240b described above may be provided on the jig transfer unit 200 located under the substrate pressing device 600, and transfer along the jig transfer path through the second jig alignment unit 240b. By aligning the carrier jig (2) to the substrate pressing position under the substrate pressing device 600, the substrate pressing device 600 is a plurality of flexible circuit boards (1) loaded in the carrier jig (2) aligned to the substrate pressing position. ) Can be pressurized.

On the other hand, on the transfer path of the jig transfer unit 200 to which the carrier jig 2 is transferred, a thickness detection sensor (not shown) that detects the loading thickness of the flexible circuit board 1 loaded on the carrier jig 2 may be provided. Through this, it is possible to determine whether or not there is a loading error by detecting that the flexible circuit board 1 is loaded in multiple layers on the carrier jig 2.

In addition, a control unit 110 for controlling the operation of the flexible circuit board 1 automatic attachment robot 10 may be provided at one side of the main body table 100.

That is, the operation of the jig transfer unit 200, the substrate alignment unit 300, the substrate loading unit 400,500, and the substrate pressing device 600 can be set through the control unit 110, and at this time, the carrier jig 2 or the flexible It goes without saying that the operation setting can be different according to the standard of the circuit board 1.

Hereinafter, with reference to the accompanying drawings, a description will be given of an operation process of the robot 10 for automatically attaching a flexible circuit board equipped with a substrate pressing device according to an embodiment of the present invention.

7 and 8 sequentially illustrate the operation of the flexible circuit board automatic attachment robot 10 provided with a substrate pressing device according to an embodiment of the present invention.

Referring to FIG. 7, when the carrier jig 2 is inserted into the jig transfer path at the front end of the jig transfer unit 200, the carrier jig 2 is transferred to the jig transfer path by a pair of wire belts 230 (refer to FIG. 4). Can be transported along.

In this case, in the transfer process of the carrier jig 2, the carrier jig 2 may be aligned and disposed at a substrate loading position corresponding to the substrate loading units 400 and 500 by the first jig aligning part 240a.

In addition, a plurality of flexible circuit boards 1 are picked up from the substrate supply unit 120 (see FIG. 2) through the substrate loading units 400 and 500, and the substrate is placed on the substrate alignment plate 310 disposed above the jig transfer unit 200. By loading on the alignment plate 310, a plurality of flexible circuit boards 1 can be arranged in a predetermined arrangement corresponding to the carrier jig 2, and a plurality of flexible circuit boards 1 arranged on the substrate alignment plate 310 Can be picked up again, loaded onto the carrier jig 2 placed at the substrate loading position, and attached.

In this embodiment, a process of alternately attaching a plurality of flexible circuit boards 1 to a carrier jig 2 by operating a pair of first and second substrate loading units 500 at the same time is shown.

Meanwhile, referring to FIG. 8, the carrier jig 2 to which a plurality of flexible circuit boards 1 are temporarily attached by the substrate loading units 400 and 500 is transferred along the jig transfer path to the lower portion of the substrate pressing device 600. The carrier jig 2 to which the stopper 242 provided in the second jig aligning part 240b is transferred may be stopped at a substrate pressing position under the substrate pressing device 600.

At this time, the jig detection sensor 244 provided in the second jig alignment unit 240b detects the carrier jig 2 stopped at the substrate pressing position, and aligns the second jig according to the detection signal of the jig detection sensor 244 The lifting means 246 (refer to FIG. 3) of the part 240b raises the jig alignment plate 245 disposed under the carrier jig 2.

In this process, the carrier jig 2 is supported on the top of the jig alignment plate 245, and a plurality of fixing pins (not shown) formed on the upper surface of the jig alignment plate 245 are formed on the carrier jig 2 By being inserted into the through hole (not shown), the carrier jig 2 may be aligned and supported on the jig alignment plate 245.

In addition, as the jig alignment plate 245 supports the carrier jig 2 and increases a predetermined height, the carrier jig 2 is spaced a predetermined height from the pair of wire belts 230 (see Fig. 4), and the wire belt ( 230) will not interfere.

In this state, the plurality of pressing rollers 651 provided in the substrate pressing device 600 may descend to press the plurality of flexible circuit boards 1 loaded on the carrier jig 2, and at the same time, the plurality of rollers A plurality of flexible circuit boards 1 can be uniformly attached to the carrier jig 2 by reciprocating before and after a predetermined interval while pressing the flexible circuit board 1.

That is, since the adhesive tape (not shown) is attached to the upper surface of the carrier jig 2 at the position where the flexible circuit board 1 is adhered, the flexible circuit board 1 is attached to the upper surface of the carrier jig 2 during the pressing process. This can be firmly attached.

On the other hand, when the flexible circuit board 1 is attached on the carrier jig 2, the stopper 242 of the second jig alignment unit 240b is retracted from the jig transfer path according to a preset operation, and at the same time, the carrier jig ( 2) is seated on a pair of wire belts 230 so that the carrier jig 2 to which the flexible circuit board 1 is attached can be discharged to the rear end of the jig transfer unit 200 along the jig transfer path.

As described above, the flexible circuit board automatic attachment robot 10 equipped with a substrate pressing device according to an embodiment of the present invention includes a plurality of flexible circuit boards 1 at a predetermined position on the upper surface of the carrier jig 2. It can be precisely attached, and by uniformly pressing a plurality of flexible circuit boards (1) mounted and attached to the carrier jig (2) through the substrate pressing device (600) and attaching them more firmly. There is an advantage that can improve product reliability.

The embodiments of the present invention disclosed in the present specification and drawings are only provided for specific examples to easily explain the technical content of the present invention and to aid understanding of the present invention, and are not intended to limit the scope of the present invention.

Therefore, the scope of the present invention should be construed that all changes or modified forms derived based on the technical idea of the present invention in addition to the embodiments disclosed herein are included in the scope of the present invention.

10: flexible circuit board automatic attachment robot 100: main body table
200: jig transfer unit 300: substrate alignment unit
400,500: substrate loading unit 600: substrate pressing device

Claims (8)

Body table;
A substrate supply unit provided on the main body table and on which a plurality of flexible circuit boards are stacked;
A jig transfer unit provided on an upper portion of the main body table and moving a carrier jig to which a flexible circuit board is attached along a jig transfer path;
A substrate alignment unit disposed above the jig transfer unit, provided to be movable in the longitudinal direction of the jig transfer unit, and aligning the flexible circuit board;
At least one substrate loading unit provided on the upper part of the main body table, picking up the flexible circuit board stacked on the substrate supplying part, loading it on the substrate alignment part, aligning it, and attaching it to the carrier jig;
A substrate pressing device provided on an upper portion of the main body table and pressing the flexible circuit board attached to the carrier jig; And
A plurality of jig alignment units arranged to align the carrier jig transported along the jig transfer path with a substrate loading position where the substrate loading unit loads the flexible circuit board and a substrate pressing position where the substrate pressing device presses the flexible circuit board But,
The jig alignment unit,
A jig alignment plate disposed under the jig transfer path to align and support the carrier jig; And
It is provided on the upper surface of the jig alignment plate, and includes a plurality of fixing pins for aligning and fixing the carrier jig,
The substrate alignment unit,
Alignment means comprising at least one seating groove in which the flexible circuit board is aligned and seated, and a plurality of auxiliary fixing pins protruding in the seating groove to align and fix the flexible circuit board seated in the seating groove Including a substrate alignment plate formed on,
When the carrier jig is supported on the jig alignment plate, the plurality of fixing pins provided on the upper surface of the jig alignment plate are inserted to correspond to a plurality of through holes formed in the carrier jig, so that the carrier jig is the jig alignment plate Aligned and fixed from above,
When the flexible circuit board is seated in the seating groove of the substrate alignment plate, the plurality of auxiliary fixing pins formed in the seating groove are inserted corresponding to a plurality of through holes formed in the flexible circuit board, so that the flexible circuit board is It is aligned and fixed within the seating groove,
The substrate loading unit,
A flexible circuit board provided on the top of the main body table and stacked on the substrate supply unit is picked up and loaded on the substrate alignment unit, or the flexible circuit board aligned and stacked on the substrate alignment unit is picked up and attached to the carrier jig. A first substrate loading unit; And
Including a second substrate loading unit that is provided on the upper portion of the main body table, picks up the flexible circuit boards arranged and stacked on the substrate alignment unit and attaches to the carrier jig
When the first substrate loading unit picks up the flexible circuit board stacked on the substrate supply unit and loads the flexible circuit board stacked on the substrate alignment unit, the second substrate loading unit picks up the stacked flexible circuit board aligned with the substrate alignment unit Attach it to the carrier jig,
The first substrate loading unit picks up the flexible circuit board from the substrate supply unit and loads the flexible circuit board into the substrate alignment unit, and then picks up the stacked flexible circuit board aligned by the substrate alignment unit and attaches it to the carrier jig. As the first substrate loading unit and the second substrate loading unit operate at the same time, the substrate pressurization alternately attaches the flexible circuit boards stacked in the substrate supply unit supplied by the first substrate loading unit to the carrier jig. A robot that automatically attaches a flexible circuit board equipped with a device.
The method of claim 1,
The substrate pressing device,
A vertical frame disposed perpendicular to the rear end of the jig transfer unit from the top of the main body table;
A parallel guide connected to the upper part of the vertical frame so as to be parallel to the jig transfer part;
A transfer member provided to be movable in a front-rear direction from an upper portion of the jig transfer part along the parallel guide;
An elevating member provided to be elevating in the transfer member; And
A robot for automatically attaching a flexible circuit board provided with a substrate pressing device including a pressing member provided under the lifting member and pressing and attaching the flexible circuit board loaded on the carrier jig.
The method of claim 2,
The pressing member,
A robot for automatically attaching a flexible circuit board provided with a substrate pressing device comprising at least one pressing roller that presses and rolls the flexible circuit board mounted on the carrier jig.
The method of claim 1,
The jig transfer unit,
A conveyor frame disposed above the main body table in one direction and forming a jig transfer path through which the carrier jig is transferred;
First and second rotational shafts respectively rotatably provided at the front end and the rear end of the conveyor frame;
A pair of wire belts wound on both edges of the first and second rotation shafts, respectively, and transferring the carrier jig along the jig transfer path; And
A robot for automatically attaching a flexible circuit board provided with a substrate pressing device including a rotation shaft driving means for transmitting rotational force to the first and second rotation shafts.
delete delete delete The method of claim 1,
The jig transfer unit,
A robot for automatically attaching a flexible circuit board provided with a substrate pressing device including a thickness detection sensor that detects the thickness of the flexible circuit board attached to the carrier jig.

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