JP7385534B2 - Conveyance equipment, substrate processing equipment - Google Patents

Description

The technology disclosed herein relates to a pin placement mechanism that places backup pins on a plate.

Surface mounters support the printed circuit board with support pins called backup pins to prevent the printed circuit board from bending when electronic components and the like are mounted on the printed circuit board. As a document disclosing this kind of technology, the following Patent Document 1 can be exemplified. In Patent Document 1, a head unit is provided with a pin insertion/extraction mechanism (pin placement mechanism).

JP2014-203966A

According to the above-mentioned document, a pin placement mechanism (pin insertion/extraction mechanism) is provided in the head unit, and the work of placing backup pins on the plate is performed using the head unit. Therefore, when the head unit is performing other work or is stopped, the work of arranging the backup pins cannot be performed.

The technology disclosed in this specification has an object to perform backup pin placement work independently of the head unit.

A conveying device for conveying a substrate to a working position of a substrate working device, the first conveyor frame having a conveyor belt for conveying the substrate on the inner surface, and the first conveyor frame having a conveyor belt for conveying the substrate on the inner surface. a second conveyor frame located opposite to the second conveyor frame; and an inter-conveyor distance changing device that changes the distance between the conveyors by moving the second conveyor frame in a second direction perpendicular to the first direction, which is the conveyance direction of the substrate. and a pin placement mechanism, wherein the pin placement mechanism includes a holding section that holds a backup pin, and a support device that supports the holding section movably in the first direction with respect to the second conveyor frame. , a drive device that moves the holding part in the first direction with respect to the second conveyor frame.

In this configuration, the holding part that holds the backup pin can be moved in the first direction by the drive device. Further, by driving the inter-conveyor distance changing device, the conveyor frame can be moved in the second direction together with the second conveyor frame. In other words, the holding part that holds the backup pin can be moved to any position independently of the head unit. Therefore, the backup pin arrangement work can be performed even when the head unit is performing other work or is stopped.

An embodiment of the transport device disclosed in this specification may have the following configuration.

The second conveyor frame may include a pin station where the backup pin is temporarily placed. With this configuration, there is no need to move the second conveyor frame when going to the pin station to pick up backup pins.

In the pin station, the backup pins are arranged in a line in the first direction. With this configuration, each of the backup pins arranged in a row can be accessed by simply moving the holding part in the first direction along the second conveyor rail. That is, when accessing the backup pin of the pin station, it is not necessary to move the holding part in the second direction. Therefore, the work of taking out the backup pin from the pin station and the work of returning it can be facilitated.

The holding section may include a pair of arms that hold the backup pin in between, a cylinder that opens and closes the arms, and a sensor that detects the presence or absence of the backup pin held between the arms. With this configuration, it is possible to check the holding state to see whether the backup pin is held by the holding section.

The support device includes a rail member fixed to the second conveyor frame and long in the first direction, a slide base that slides in the first direction along the rail member, and a mounting base for attaching the holding part. The slide base may further include an elevating section that supports the mounting base in a movable manner. With this configuration, the holding part can be raised and lowered by driving the raising and lowering part. Moreover, the elevating part is provided between the slide base and the mounting base, and has a structure in which only two parts, the mounting base and the holding part attached to it, are raised and lowered. With such a configuration, it is possible to reduce the power of the elevating section, and it is possible to downsize the pin arrangement mechanism.

According to the technology disclosed in this specification, backup pin placement work can be performed independently of the head unit.

It is a top view of a conveyance device. It is a perspective view of a conveyance device. FIG. 3 is a perspective view of the conveyance device seen from direction A in FIG. 2; It is a perspective view of a pin station and a clamp head. It is a top view of a clamp head. It is a top view of a pin station and a clamp head. 4 is an enlarged view of a part of FIG. 3. FIG. 8 is an enlarged view of a part of FIG. 7. FIG. It is a figure showing the support structure of a clamp head. It is a figure showing the structure of an elevating part. It is a top view of an arm. FIG. 3 is an explanatory diagram of a backup pin detection operation by a sensor. FIG. 2 is a plan view of a surface mounter. FIG. 3 is a diagram showing a support structure of a head unit. It is a diagram comparing the movable ranges of the clamp head and the head unit.

<Embodiment>
1. Configuration of the transport device 10 The transport device 10 is a device that transports the printed circuit board PX. In the following description, the X direction (first direction) indicates the conveyance direction of the printed circuit board PX, and the Y direction (second direction) indicates the direction perpendicular to the X direction. Further, the left side in FIG. 1 (upstream in the substrate transport direction) is the front side, and the right side in FIG. 1 (downstream in the substrate transport direction) is the rear side.

As shown in FIGS. 1 to 3, the conveyance device 10 includes a front support member 11, a rear support member 15, a first conveyor frame 21, a second conveyor frame 25, a belt drive device 50, and a conveyor belt. A distance changing device 60 is provided.

The front support member 11 includes a pair of fixed frames 12 and 13 and a connecting frame 14, as shown in FIGS. 2 and 3. The pair of fixed frames 12 and 13 are L-shaped and face each other at a predetermined distance in the Y direction. The connecting frame 14 connects the two fixed frames 12 and 13.

The rear support member 15 includes a pair of fixed frames 16 and 17 and a connecting frame 18. The pair of fixed frames 16 and 17 are L-shaped and face each other at a predetermined distance in the Y direction. The connecting frame 18 connects the two fixed frames 16 and 17.

The front support member 11 and the rear support member 15 have the same structure, and are arranged separately at the front and rear in the X direction, as shown in FIG.

The first conveyor frame 21 and the second conveyor frame 25 are elongated in the X direction, which is the conveyance direction of the printed circuit board PX, and are located facing each other and separated by a predetermined distance in the Y direction orthogonal to the X direction.

The first conveyor frame 21 is supported front and rear by fixed frames 12 and 16 of the front support member 11 and the rear support member 15. The first conveyor frame 21 is a fixed frame whose position in the Y direction cannot be changed.

The second conveyor frame 25 is supported front and rear by two movable plates 81 and 82. The front movable plate 81 is movable in the Y direction between the two fixed frames 12 and 13, and the rear movable plate 82 is movable in the Y direction between the two fixed frames 16 and 17.

The second conveyor frame 25 is a movable frame whose position in the Y direction can be changed by moving the two movable plates 81 and 82 in the Y direction.

The first conveyor frame 21 and the second conveyor frame 25 have a pair of pulleys 26 and 27 at both ends in the X direction of inner surfaces 21A and 25A of the opposing frames.

A conveyor belt 28 is stretched between the two pulleys 26 and 27 of the first conveyor frame 21 and the two pulleys 26 and 27 of the second conveyor frame 25, respectively.

The belt drive device 50 is a device that drives the conveyor belt 28 and includes a drive shaft 51, a pair of interlocking rollers 53, and a motor 55.

The drive shaft 51 is located approximately at the rear end portions of the two conveyor frames 21 and 25, as shown in FIG. The drive shaft 51 passes through the second conveyor frame 25, and one shaft end is rotatably fixed to the inner surface of the first conveyor frame 21.

The pair of interlocking rollers 53 are fixed to the drive shaft 51 and rotate integrally with the drive shaft 51. A pair of interlocking rollers 53 are located on the inner surface of each conveyor frame 21, 25, and a portion of the conveyor belt 28 is hung on the outer peripheral surface thereof.

The motor 55 is located at the other end of the drive shaft 51. As the drive shaft 51 rotates due to the drive of the motor 55, power is transmitted to each conveyor belt 28 via the interlocking rollers 53.

Therefore, the two conveyor belts 28 provided on the inner surfaces of the two conveyor frames 21 and 25 can be rotated synchronously in the X direction.

In this way, the two conveyor belts 28 rotate synchronously in the X direction, so that the printed circuit board PX on the conveyor belt 28 can be conveyed in the X direction.

The inter-conveyor distance changing device 60 is a device that changes the inter-conveyor distance Ly by moving the second conveyor frame 25 in the Y direction with respect to the first conveyor frame 21.

The inter-conveyor distance Ly is the distance from the conveyor belt 28 of the first conveyor frame 21 to the conveyor belt 28 of the second conveyor frame 25, as shown in FIG.

The inter-conveyor distance changing device 60 includes a pair of drive shafts 61 and 62, a belt 73, and a motor 75, as shown in FIG.

The drive shaft 61 is arranged between the fixed frames 12 and 13 of the front support member 11, and the drive shaft 62 is arranged between the fixed frames 16 and 17 of the rear support member 15. The two drive shafts 61 and 62 are opposing shafts whose axes face in the Y direction and face each other in the X direction.

One end sides of the drive shafts 61 and 62 pass through the fixed frames 13 and 17, respectively. The drive shafts 61 and 62 have pulleys 63 and 64 attached to their shaft ends protruding from the fixed frames 13 and 17, respectively.

As shown in FIG. 3, the motor 75 is located below the pulley 64 and, like the pulley 64, is arranged outside the fixed frame 17. The motor 75 has a pulley 76 attached to the motor shaft.

A belt 73 is arranged so as to span these three pulleys 63, 64, and 76.

From the above, by driving the motor 75, the power is transmitted to the drive shafts 61, 62 via the belt 73, and the front and rear drive shafts 61, 62 can be rotated synchronously.

Movable plates 81 and 82 are attached to the front and rear drive shafts 61 and 62, respectively, via ball nuts and the like.

The drive shafts 61, 62 and the movable plates 81, 82 constitute a so-called screw mechanism, and the rotation of the drive shafts 61, 62 moves the movable plates 81, 82 in the Y direction along the drive shafts 61, 62. I can do it.

Thereby, the second conveyor frame 25 supported by the two movable plates 81 and 82 moves in the Y direction, and the distance Ly between the conveyors can be adjusted.

In this way, by using the second conveyor frame 25 as a movable frame and making it possible to adjust the distance Ly between the conveyors, the same conveyance device can handle printed circuit boards PX of different sizes (that is, different lengths in the Y direction). transportation becomes possible.

2. Backup Pin P Arrangement Mechanism The transport device 10 further includes a pin arrangement mechanism 100 (see FIG. 1). The pin arrangement mechanism 100 is a mechanism that arranges the backup pins P on the plate 310 of the backup device 300.

The backup pin P is a support pin that supports the printed circuit board PX from below so that the printed circuit board PX does not bend when the electronic component E is mounted on the printed circuit board PX.

The pin placement mechanism 100 includes a clamp head 110, a support device 130, and a drive device 170, as shown in FIGS. 4 to 7.

The clamp head 110 includes a pair of arms 111A and 110B and a cylinder 120, as shown in FIGS. 4 and 5. The clamp head 110 is an example of a holding section that holds the backup pin P.

The pair of arms 111A and 111B are long in the X direction and face each other in the Y direction. The pair of arms 111A and 111B are provided with a clamp groove 112 at the tip of the inner surface. The clamp groove 112 may be circular as shown in FIG. 5, or trapezoidal as shown in FIG. 11.

The cylinder 120 displaces the pair of arms 111A and 111B outward or inward in the Y direction with the center line L1 as a reference line.

By displacing the pair of arms 111A and 110B inward, the backup pin P can be held between the clamp grooves 112.

By displacing the pair of arms 111A and 110B outward, the backup pin P can be released from being held by the clamp groove 112.

Further, as shown in FIG. 4, a pin station 190 for temporarily placing a backup pin P is provided in front of the clamp head 110 in the moving direction.

The pin station 190 is fixed to the second conveyor frame 25 via a vertical wall 191, and moves integrally with the second conveyor frame 25.

The pin station 190 is located below the second conveyor frame 25 and has a U-shaped cross section.

The pin station 190 has a long shape in the X direction, and as shown in FIGS. 4 and 6, the backup pin P is located at a position slightly inside (closer to the conveyor center O) than the inner surface 25A of the second conveyor frame 25. can be arranged in a line along the X direction.

As shown in FIG. 6, the center line L2 of the backup pins P arranged in a row and the center line L1 of the clamp head 110 are aligned in the Y direction and are on the same straight line. The center line L1 of the clamp head 110 is, for example, the center line of the arms 111A, 111B when the pair of arms 111A, 111B are closed (or may be open). In other words, it is a line that serves as a reference for the operation when the two arms 111A and 111B open and close in the Y direction.

By aligning the positions of the two center lines L1 and L2 in the Y direction in advance, when moving the clamp head 110 to the position of the backup pin P of the pin station 190, no position adjustment in the Y direction is required. There are benefits.

The support device 130 is a device that supports the clamp head 110 movably in the X direction with respect to the second conveyor frame 25.

The support device 130 includes an X-rail 131, a slide base 135, a mounting base 141, and an elevating section 151, as shown in FIGS. 7 and 8.

The X rail 131 has a long shape in the X direction, and is attached to the outer surface 25B of the second conveyor frame 25. The X rail 131 is arranged approximately between the front drive shaft 61 and the rear drive shaft 62. The X rail corresponds to the "rail member" of the present invention.

The slide base 135 has a U-shaped slider 136 that slidably fits into the X rail 131.

The slide base 135 moves in the X direction along the X rail 131 by the guiding action of the slider 136.

The mounting base 141 is generally L-shaped and has a vertical wall 142 and a bottom wall 145. The mounting base 141 is attached to the slide base 135 via an elevating section 151.

As shown in FIG. 4, the bottom wall 145 of the mounting base 141 protrudes from the outer surface 25B side of the second conveyor frame 25 to the inner surface 25A side, bypassing the lower surface of the second conveyor frame 25, and its tip end A clamp head 110 is attached to the portion.

As shown in FIG. 7, the drive device 170 is located on the outer surface 25B side of the second conveyor frame 25, and includes a motor 171, a pulley 173, and a belt 175. The motor 171 has a pulley 172 on the motor shaft.

The motor 171 is attached to the rear end of the outer surface 25B of the second conveyor frame 25 in the X direction, and the pulley 173 is attached to the front end of the outer surface 25B of the second conveyor frame 25 in the X direction.

A belt 175 spans two pulleys 172 and 173. A slide base 135 is fixed to a part of the belt 175.

From the above, by transmitting the power of the motor 171 to the slide base 135 via the belt 175, the mounting base 141 can be moved integrally with the slide base 135 (FIGS. 7 and 8). By moving the mounting base 141, the clamp head 110 fixed to the mounting base 141 can be moved in the X direction along the second conveyor frame 25 (FIGS. 4 and 9).

The elevating section 151 is a device that adjusts the height (position in the Z direction) of the clamp head 110. As shown in FIG. 10, the elevating section 151 includes a vertical guide 152 attached to the outer peripheral surface of the slide base 135 and a cylinder 153.

A slider 143 attached to the inner surface of the vertical wall 142 of the mounting base 141 is movably fitted into the vertical guide 152. The cylinder 153 has its axis directed in the vertical direction, and its rod tip is fixed to the bottom wall 145 of the mounting base 141.

Therefore, by driving the cylinder 153, the mounting base 141 can be moved in the vertical direction to adjust the height of the clamp head 110.

As explained above, the clamp head 110 can be moved in the X direction along the second conveyor frame 25 by driving the motor 171. Further, by driving the motor 75, it can move integrally with the second conveyor frame 25 in the Y direction. Further, by driving the cylinder 153, the position in the height direction (Z direction) can be adjusted.

In this way, the clamp head 110 is movable in three orthogonal directions, and the backup pin P can be taken out from the pin station 190 and placed at any position on the plate 310.

That is, when taking out the backup pin P from the pin station 190, the clamp head 110 is first slid in the X direction along the second conveyor frame 25 and moved to the pin station 190.

Thereafter, the arms 111A and 111B of the clamp head 110 are opened and closed, and the backup pin P is held between the two arms 111A and 111B.

After holding the backup pin P, the clamp head 110 is raised. Thereby, the backup pin P can be lifted and taken out from the pin station 190.

After that, by moving the clamp head 110 in the X direction or the Y direction while holding the backup pin P that has been taken out, the backup pin P can be moved to an arbitrary position on the base 310.

Once the backup pin P has been moved to the target position, the clamp head 110 is lowered and the pair of arms 111A and 111B are opened in synchronization with the timing when the backup pin P reaches the height of the base 310. , release the hold on the backup pin P.

With the above, the backup pin P can be placed at the target position on the base 310. By repeating this operation one by one, a plurality of backup pins P can be arranged on the base 310.

Note that the operation of returning the backup pin P on the base 310 to the pin station 190 may be performed in the reverse order to the above.

Further, as shown in FIG. 11, the clamp head 110 includes a sensor 115 that detects the backup pin P. The sensor 115 is, for example, a photoelectric sensor including a light emitting element 116 and a light receiving element 117.

The light projecting element 116 is attached to one arm 111A of the pair of arms 111A and 111B, and the light receiving element 117 is attached to the other arm 111B. The light projecting element 116 and the light receiving element 117 face each other in the Y direction and constitute a detection optical axis L that is orthogonal to the X direction.

In this embodiment, the clamp head 110 has sensors 115A to 115C arranged at three locations on a pair of arms 111A and 111B.

Specifically, the sensor 115A is arranged in the center of the clamp groove 112, the sensor 115B is arranged in a position closer to the tip end than the clamp groove 112 in the length direction of the arm 111, and A sensor 115B is arranged at a rear position in the horizontal direction. Note that reference numeral 114 is an opening through which a cable connected to the sensor 115 is passed.

In this way, by arranging the sensors 115A to 115C at multiple locations in the length direction (X direction) of the arm 111, including the central portion (groove center) of the clamp groove 112, the detection light of each sensor 115A to 115C is The relative positional relationship between the clamp groove 112 and the backup pin P can be confirmed from the states of the axes LA to LC.

Therefore, clamping errors of the backup pin P by the clamp head 110 can be suppressed.

For example, when the clamp head 110 is brought closer to the backup pin P in order to take out the backup pin P from the pin station 190, as shown in FIG. The detection optical axis LB is in a state of being light-shielded. At this time, the other detection optical axes LA and LC are both in the light receiving state.

When the clamp head 110 is further moved in the same direction, the central portion of the clamp groove 112 overlaps the backup pin P, and the detection optical axis LA of the sensor 115A is in a state of being blocked. At this time, the other detection optical axes LB and LC are both in the light receiving state.

After that, as the movement continues, the rear end portion of the clamp groove 112 overlaps the backup pin P, and as shown in FIG. 12(b), the detection optical axis LC of the sensor 115C becomes light-blocked. At this time, the other detection optical axes LA and LB are both in the light receiving state.

When the detection optical axis LC is blocked and the detection optical axis LA changes from the blocking state to the receiving state, the clamp head 110 is moved in the opposite direction by the radius dimension of the backup pin P having a circular cross-sectional shape. By returning the position, the clamp head 110 can be positioned so that the backup pin P is located approximately at the center of the clamp groove 112, as shown in FIG. 12(c).

Therefore, clamping errors of the backup pin P by the clamp head 110 can be suppressed.

Further, the sensor 115A is located at the center of the clamp groove 112, and can detect whether the backup pin P is present in the clamp groove 112 by light entering/blocking of the detection optical axis LA. be.

From the above, by monitoring the output of the sensor 115A (light entrance/blocking of the detection optical axis LA), it is possible to detect the dropout of the backup pin P held by the clamp head 110 during the backup pin P placement work. I can do it.

3. Configuration of Surface Mounting Machine As shown in FIG. It includes a drive device 230 that moves in directions (XY directions).

The transport device 10 is arranged at the center of the base 210. The conveying device 10 includes a first conveyor frame 21 and a second conveyor frame 25.

Each conveyor frame 21, 25 is equipped with a pair of conveyor belts 28 which are driven in circulation in the X direction, and can transport the printed circuit board PX in the X direction by friction with the belts. Note that the board to be transported is not limited to the printed circuit board PX, but may be any board on which electronic components are mounted.

The surface mounting machine 200 has an entrance on the left side as shown in FIG. 13, and the printed circuit board PX is carried into the machine from the left side as shown in FIG. 13 through the transport device 10. The carried-in printed circuit board PX is carried by the carrying device 10 to a working position G at the center of the base, and is stopped there.

Four component supply units 213 are provided on the base 210 so as to surround the work position G. In each component supply section 213, a large number of feeders 280 for supplying electronic components E are installed in a row.

At the work position G, the mounting process (mounting work) of mounting the electronic component E supplied through the feeder 280 onto the printed circuit board PX is performed by the mounting head 263 mounted on the head unit 260. The printed circuit board PX that has been processed is transported to the right in FIG. 13 through the transport device 10, and is carried out of the machine.

The drive device 230 roughly includes a pair of support legs 241, a head support 251, a Y-axis ball screw 245, a Y-axis motor 247, an X-axis ball screw 255, and an X-axis motor 257. More specifically, as shown in FIG. 13, a pair of support legs 241 are installed on the base 210. Both support legs 241 are located on both sides of the working position G, and both extend straight in the Y direction.

Guide rails 242 extending in the Y direction are installed on the upper surfaces of both support legs 241, and a head support body 251 is attached to these left and right guide rails 242 with both longitudinal ends thereof fitted.

Further, a Y-axis ball screw 245 extending in the Y direction is attached to the right support leg 241, and a ball nut (not shown) is screwed into the Y-axis ball screw 245. A Y-axis motor 247 is attached to the Y-axis ball screw 245.

When the Y-axis motor 247 is energized, the ball nut advances and retreats along the Y-axis ball screw 245, and as a result, the head support 251 fixed to the ball nut, and eventually the head unit 260 described below, move in the Y direction along the guide rail 242. (Y-axis servo mechanism).

The head support body 251 has a long shape in the X direction. As shown in FIG. 14, a guide member 253 extending in the X direction is installed on the head support 251, and a head unit 260 is attached to the guide member 253 so as to be movable along the axis of the guide member 253. It is being An X-axis ball screw 255 extending in the X direction is mounted on the head support 251, and a ball nut is screwed onto the X-axis ball screw 255.

An X-axis motor 257 is attached to the X-axis ball screw 255, and when the motor 257 is energized, the ball nut advances and retreats along the X-axis ball screw 255, and as a result, the head unit 260 fixed to the ball nut moves in the X direction along the guide member 253 (X-axis servo mechanism).

Therefore, by controlling the X-axis motor 257 and the Y-axis motor 247 in a combined manner, the head unit 260 can be moved in the plane direction (XY direction) on the base 210.

A plurality of mounting heads 263 for mounting electronic components E are mounted on the head unit 260 in a row in the X-axis direction.

Each mounting head 263 is configured to be movable up and down with respect to the head unit 260 by a direct movement mechanism (for example, a screw mechanism) using a Z-axis motor as a drive source. The mounting head 263 may further be rotatable around an axis by driving an R-axis motor.

Each mounting head 263 has a suction nozzle at its tip. Each mounting head 263 is configured to be supplied with negative pressure from a negative pressure means (not shown), so as to generate a suction force at the tip of the head (suction nozzle).

With this configuration, by operating the X-axis motor 257, Y-axis motor 247, and Z-axis motor at predetermined timing, the electronic components E supplied through the feeder 280 are taken out by the mounting head 263 and printed. It is possible to execute the process of mounting on the board PX.

Furthermore, the surface mounter 200 has a backup device 300 at a work position G in the center of the base.

As shown in FIG. 14, the backup device 300 includes a base 310 and a lifting device 330 that raises and lowers the base 310 in the height direction.

By arranging the backup pins P at predetermined positions on the base 310, the printed circuit board PX can be supported by the backup pins P during the mounting work, and deflection of the printed circuit board PX can be suppressed.

The arrangement of the backup pins P differs depending on the type of printed circuit board PX to be worked on. Therefore, when switching the type of printed circuit board PX, it is necessary to arrange the backup pins P according to the type.

As already explained, since the conveyance device 10 is provided with the pin arrangement mechanism 100, it is possible to automatically perform the arrangement work of the backup pins P when changing the type of printed circuit board PX.

The pin placement mechanism 100 is independent from the head unit 260. Therefore, the work of arranging the backup pins P can be performed even when the head unit 260 is performing other work or is stopped.

Furthermore, since the backup pin P placement work can be performed without using the head unit 260, there is no fear of head crash (damage to the mounting head due to interference with an interfering object, etc.) associated with the pin placement work.

FIG. 15 is a diagram comparing the movable range V1 of the clamp head 110 and the movable range V2 of the head unit 260.

The movable range V1 of the clamp head 110 is wider in the X direction than the movable range V2 of the head unit 260.

This is because the clamp head 110 is not restricted in its movement as long as it is within the entire length range of the second conveyor frame 25 in the X direction, unless there is an interfering object such as a drive shaft, and outside the movable range V2 of the head unit 260. However, it is movable.

In this embodiment, as shown in FIG. 15, the pin station 190 is arranged outside the movable range V2 of the head unit 260 in the movable range V1 of the clamp head 110.

By arranging the pin station 190 outside the movable range V2 of the head unit 260, there is no need to arrange the pin station 190 within the movable range V2 of the head unit 260. Thereby, the space within the movable range V2 of the head unit 260 can be effectively utilized.

In other words, in the case of a configuration in which the backup pin P is placed using the head unit 260, the pin station 190 is placed within the movable range V2 of the head unit 260, as shown by the "broken line frame K" in FIG. There is a need.

However, with this configuration, it is possible to arrange the pin station 190 outside the movable range V2 of the head unit, so in this space, other effective devices such as the component supply section 213 and a changer for replacing mounting nozzles can be used. It becomes possible to arrange elements. Therefore, the space within the movable range V2 of the head unit 260 can be effectively utilized.

4. Effects The backup pin P can be placed independently of the head unit 260.

<Other embodiments>
The technology disclosed in this specification is not limited to the embodiments described above and illustrated in the drawings, and includes, for example, the following embodiments within its technical scope.

In the embodiment described above, the surface mounter 200 is illustrated as an example of a substrate processing apparatus. The substrate processing apparatus does not need to be a surface mounter as long as it has the transport device 10, the backup device 300, and the head unit 260 that performs predetermined operations on the substrate. For example, a coating device may be used in which a coating head for coating a substrate with a coating liquid is mounted on the head unit 260. Alternatively, the printing device may include a squeegee head for printing solder paste onto a substrate on the head unit 260.

In the above-described embodiment, the clamp head 110 is illustrated as an example of the holding part that holds the backup pin P. The holding portion is not limited to the clamp head 110. For example, a magnetic attraction type holding section using an electromagnet may be used.

In the embodiment described above, an example is shown in which photoelectric sensors 115A to 115C are provided at three locations on the arm 111. The number of sensors is sufficient as long as it can confirm at least the state in which the backup pin P is held by the clamp head 110, and only one sensor is sufficient. For example, only the sensor 115A disposed at the center of the clamp groove 112 may be sufficient. Further, the proximity sensor is not limited to a photoelectric type, and a magnetic type proximity sensor may be used.

10 Conveyor device 21 First conveyor frame 25 Second conveyor frame 28 Conveyor belt 50 Belt drive device 60 Inter-conveyor distance changing device 100 Pin arrangement mechanism 110 Clamp head 111A, 111B Arm 120 Cylinder 130 Support device 131 X rail (rail member)
135 Slide base 141 Mounting base 151 Lifting section
170 Drive device 190 Pin station 200 Surface mounter (substrate processing device)
260 head unit 263 mounting head 300 backup device 310 base

Claims (8)

A transport device that transports a substrate to a working position of a substrate processing device,
a first conveyor frame having a conveyor belt on the inner surface for conveying the substrate;
a second conveyor frame having a conveyor belt for conveying the substrate on its inner surface and located opposite to the first conveyor frame;
an inter-conveyor distance changing device that changes the inter-conveyor distance by moving the second conveyor frame in a second direction perpendicular to the first direction, which is the conveyance direction of the substrate;
a pin placement mechanism attached to the second conveyor frame ,
The pin arrangement mechanism is
a holding part that holds a backup pin;
a support device that is attached to the second conveyor frame and supports the holding part so as to be movable in the first direction with respect to the second conveyor frame;
A conveyance device including a drive device attached to the second conveyor frame and configured to move the holding part in the first direction with respect to the second conveyor frame. The conveying device according to claim 1,
The second conveyor frame is a conveyance device having a pin station where the backup pin is temporarily placed. The conveying device according to claim 2,
A conveying device, wherein the backup pins are arranged in a line in the first direction in the pin station. The conveyance device according to any one of claims 1 to 3,
The holding part is
a pair of arms that sandwich and hold the backup pin;
a cylinder that opens and closes the arm;
A conveyance device, comprising: a sensor that detects the presence or absence of a backup pin held between the arms. The conveying device according to any one of claims 1 to 4,
The support device is
a rail member fixed to the second conveyor frame and long in the first direction;
a slide base that slides in the first direction along the rail member;
a mounting base for mounting the holding part;
A conveyance device comprising: an elevating section that supports the mounting base so as to be movable up and down with respect to the slide base. The conveying device according to any one of claims 1 to 5,
The second conveyor frame is a movable frame movable in the second direction,
The conveying device, wherein the pin placement mechanism moves in the second direction integrally with the second conveyor frame . A conveying device according to any one of claims 1 to 6 ,
a head unit that performs a predetermined work on the substrate transported to the work position by the transport device;
a backup device that supports the board carried into the working position using backup pins;
A substrate processing apparatus comprising: a head unit that performs a predetermined operation on the substrate backed up by the backup device. The substrate processing apparatus according to claim 7 ,
A substrate processing apparatus including a pin station for temporarily placing the backup pin at a position outside the movable range of the head unit.

Images