KR20200054404A - A robot for attaching flexible printed crcuit board equipped with crcuit board pressing apparatus - Google Patents

Abstract

The present invention provides a robot for automatic attachment of a flexible printed circuit board, equipped with a substrate pressing device. The robot includes: a body table; a jig transfer unit provided on the top of the body table, and horizontally transferring a carrier jig to which the flexible printed circuit board is attached; at least one substrate loading unit provided on the top of the body table, and picking up the flexible printed circuit board and attaching the flexible printed circuit board to the carrier jig; and a substrate pressing device provided on the top of the body table and pressing the flexible printed circuit board attached to the carrier jig.

Description

A robot for attaching flexible printed crcuit board equipped with crcuit board pressing apparatus}

The present invention relates to a robot for automatically attaching a flexible circuit board equipped with a substrate pressing device, and more specifically, a flexible circuit board provided with a substrate pressing device capable of automatically aligning and firmly attaching a plurality of flexible circuit boards to a carrier jig. It relates to an automatic attachment robot.

In general, a flexible printed circuit board (FPCB) is a structure in which a circuit is formed on a film made of a flexible material and an electronic device is mounted, and is applied to various electronic devices such as portable terminals, notebook computers, and digital cameras.

These flexible circuit boards have a structure that can support the flexible circuit board flat during the surface mounting process in order to surface mount electronic devices such as chip parts on the flexible circuit board because the physical properties themselves are flexible and do not retain the original shape. need.

Accordingly, in supplying a flexible circuit board to a flexible circuit board using a surface mounting device for mounting chip components, a plurality of flexible circuit boards are usually aligned and fixedly attached to a predetermined position of the carrier jig, and then the carrier jig is surface mounted. It is supplied to the surface mounting process.

At this time, in the process of attaching the plurality of flexible circuit boards to the carrier jig, a worker usually repeatedly directly attaches the plurality of flexible circuit boards one by one to a predetermined position of the carrier jig to which the adhesive tape is attached.

However, when the operator manually attaches a plurality of flexible circuit boards to the carrier jig as described above, it is difficult to accurately attach the flexible circuit board to a predetermined position of the carrier jig, and because the operator presses it by hand, it is flexible to the carrier jig. There was a problem in that the defect rate was high because the circuit board was not uniformly attached.

In the present invention, a flexible circuit board automatic attachment robot equipped with a substrate pressurizing device, specifically, a plurality of flexible circuit boards can be quickly and accurately loaded and attached to a carrier jig, in particular, temporarily attached to a carrier jig by a substrate loading unit It is intended to provide a robot for automatically attaching a flexible circuit board equipped with a substrate pressing device capable of improving product reliability by uniformly pressing and firmly attaching a plurality of flexible circuit boards through the substrate pressing device.

The technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description. Will be able to.

In order to solve the problems as described above, the present invention is provided on the main body table, the top of the main body table, the jig transport unit for horizontally transporting the carrier jig to which the flexible circuit board is attached, provided on the top of the main body table, flexible circuit board A flexible circuit board equipped with a substrate pressurizing device including a substrate pressurizing device for pressurizing a flexible circuit board attached to a carrier jig and provided on at least one substrate loading unit and a main body table to be picked up and attached to a carrier jig Provide an attached robot.

In addition, the substrate pressing device is a vertical frame disposed vertically on the rear end side of the jig transfer section from the top of the main body table, parallel guides connected to the top of the vertical frame parallel to the jig transfer section, along the parallel guide from the top of the jig transfer section A substrate pressurizing device including a transport member provided movably, a lifting member provided movably on the transport member, and a lower member provided on the lower part of the lifting member to press and attach the flexible circuit board mounted on the carrier jig Provided is a flexible flexible circuit board automatic attachment robot.

In addition, the pressing member provides a robot for automatically attaching a flexible circuit board equipped with a substrate pressing device made of at least one pressing roller that presses and rolls the flexible circuit board loaded on the carrier jig.

In addition, the jig transfer unit is disposed in one direction on the upper portion of the main body table, the first and second conveyor frame to form a jig transfer path to which the carrier jig is conveyed, rotatably provided at the front end and the rear end of the conveyor frame, respectively. A substrate comprising a rotating shaft, a pair of wire belts wound on both edges of the first and second rotating shafts, and transporting a carrier jig along a jig transport path, and rotating shaft driving means for transmitting rotational force to the first and second rotating shafts Provided is a flexible circuit board automatic attachment robot equipped with a pressing device.

In addition, the jig transport unit is a robot for automatic attachment of a flexible circuit board equipped with a substrate pressurizing device further comprising a jig alignment unit for aligning a carrier jig transported along a jig transport path to a substrate pressing position in which the substrate pressurizing device presses the flexible circuit board. to provide.

In addition, the jig alignment unit is provided on the jig transport path so as to be elevated, the stopper means for stopping or passing the carrier jig to the substrate pressing position according to the lifting operation, the jig detection to detect the carrier jig stopped at the substrate pressing position by the stopper means A substrate pressing device including a sensor, a jig alignment plate disposed under the jig transport path, and supporting a jig alignment plate aligned with a stationary carrier jig at a substrate pressing position, and a lifting means for elevating a jig alignment plate according to a detection signal of a jig detection sensor It includes a flexible circuit board automatic attachment robot equipped with.

In addition, a flexible circuit board automatic attachment robot is provided on a top surface of a jig alignment plate equipped with a substrate pressing device on which a plurality of fixing pins for aligning and fixing a carrier jig are formed.

In addition, the jig transfer unit provides a robot for automatically attaching a flexible circuit board equipped with a substrate pressurizing device including a thickness sensing sensor for sensing the thickness of the flexible circuit board attached to the carrier jig.

The flexible circuit board automatic attachment robot provided with the substrate pressing device according to one embodiment of the present invention can precisely attach a plurality of flexible circuit boards to a predetermined position on the upper surface of the carrier jig, and to the carrier jig through the substrate pressing device. By uniformly pressing a plurality of flexible circuit boards loaded and attached, and more firmly attaching them. There is an advantage that can improve product reliability.

1 is a front view showing the configuration of a flexible circuit board automatic attachment robot equipped with a substrate pressing device according to an embodiment of the present invention.
2 is a plan view showing the configuration of a flexible circuit board automatic attachment robot equipped with a substrate pressing device according to an embodiment of the present invention.
Figure 3 shows a front cross-sectional view showing the internal configuration of the jig transfer unit according to an embodiment of the present invention.
Figure 4 shows a cross-sectional side view showing the internal configuration of the jig transfer unit according to an embodiment of the present invention.
5 shows the configuration of a substrate loading unit according to an embodiment of the present invention.
Figure 6 shows the configuration of a substrate pressing device according to an embodiment of the present invention.
7 and 8 sequentially show the operation of the flexible circuit board automatic attachment robot equipped with a substrate pressing device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

DETAILED DESCRIPTION The following detailed description, together with the accompanying drawings, is intended to describe exemplary embodiments of the present invention, and is not intended to represent the only embodiments in which the present invention may be practiced.

In the drawings, parts unrelated to the description may be omitted to clearly describe the present invention, and the same reference numerals may be used for the same or similar elements throughout the specification.

In an embodiment of the present invention, expressions such as “or”, “at least one”, etc. may represent one of the words listed together, or a combination of two or more.

1 is a front view showing the configuration of a flexible circuit board automatic attachment robot 10 equipped with a substrate pressing device according to an embodiment of the present invention, and FIG. 2 is a substrate pressing device according to an embodiment of the present invention. The structure of the flexible circuit board automatic attachment robot 10 provided is illustrated in a plane.

For convenience of description, in the flexible circuit board automatic attachment robot 10 equipped with the substrate pressing device according to the present embodiment shown in FIG. 1, the side on which the substrate pressing device 600 is disposed is defined as the rear side, and Define the other side forward and explain.

1 and 2, the flexible circuit board automatic attachment robot 10 is provided with a substrate pressing device according to an embodiment of the present invention, the body table 100, the jig transfer unit 200, the substrate loading unit ( 400,500) and a substrate pressing device 600.

The main body table 100 supports the jig transfer unit 200, the substrate loading units 400 and 500, and the substrate pressing device 600 on the table top.

In addition, one side of the main body table 100 may be provided with a control unit 110 for controlling the operation of the jig transfer unit 200, the substrate loading unit 400,500 and the substrate pressing device 600.

The jig transfer unit 200 is provided on the upper portion of the main body table 100, and horizontally transports the carrier jig 2 on which the flexible printed circuit board (FPCB) is attached from the top of the main body table 100. Can be.

That is, the jig transfer unit 200 is configured to transfer the carrier jig 2 in the front-rear direction from the top of the main body table 100, the substrate loading unit 400,500 of the carrier jig 2 to the flexible circuit board (1) By transferring to a predetermined substrate loading position for loading, a plurality of flexible circuit boards 1 picked up and transferred by the substrate loading units 400 and 500 may be loaded at a predetermined position of the carrier jig 2.

In addition, the jig transfer unit 200 transfers the carrier jig 2 on which the flexible circuit board 1 is loaded to a predetermined substrate pressing position in which the substrate pressurizing device 600 presses the flexible circuit board 1, thereby causing the carrier jig to be transported. The flexible circuit board 1 loaded on (2) may be firmly attached by the substrate pressurization device 600.

At this time, an adhesive tape (not shown) is attached to the upper surface of the carrier jig 2 at a position where the flexible circuit board 1 is loaded, and the flexible circuit is attached to the upper surface of the carrier jig 2 by an adhesive tape (not shown). The substrate 1 can be attached.

Here, the carrier jig 2 serves to align and supply the flexible circuit board 1 to a surface mount device (SMD).

That is, in supplying the flexible circuit board 1 to the flexible circuit board 1 with a surface mount device for mounting chip components, in order to improve productivity, a plurality of flexible circuit boards 1 are usually provided with a carrier jig 2. The carrier jig 2 is supplied to the surface mount device after being aligned and fixed to a certain position.

At this time, when the position of the flexible circuit board 1 is displaced and attached to the carrier jig 2, a component may not be mounted at a predetermined position of the flexible circuit board 1 in the surface mounting process, resulting in defects in the product. Therefore, it is very important to firmly attach the flexible circuit board 1 to a predetermined fixed position of the carrier jig 2.

3 is a front sectional view showing the internal configuration of the jig transport unit 200 according to an embodiment of the present invention, Figure 4 is a side showing the internal configuration of the jig transport unit 200 according to an embodiment of the present invention It is a sectional view.

3 and 4, the jig transfer unit 200 is disposed in one direction on the upper portion of the main body table 100, and the conveyor frame 210 forming a jig transfer path to which the carrier jig 2 is transferred , The first and second rotating shafts 221 and 222, which are rotatably provided at the front end and the rear end of the conveyor frame 210, respectively, are wound on both edges of the first and second rotating shafts 221 and 222, respectively, and the jig transport path It may include a pair of wire belt 230 for transporting the carrier jig (2), and rotation shaft driving means (not shown) for transmitting rotational force to the first and second rotation shafts (221,222).

Here, the conveyor frame 210 is configured by arranging a pair of frames spaced apart from each other, so that a jig transport path through which the carrier jig 2 is transferred in the longitudinal direction between the pair of frames may be formed.

In addition, the conveyor frame 210 is wound on the first and second rotating shafts 221 and 222, so that a pair of wire belts 230 for transporting the carrier jig 2 can be prevented from sagging downward, on the inner side of the frame. A belt support guide 211 for supporting the wire belt 230 may be formed.

Further, the rotating shaft driving means (not shown) transmits a driving motor (not shown) and a power transmission unit (not shown) that transmits power of the driving motor (not shown) to at least one of the first and second rotating shafts 221 and 222. In this case, the power transmission unit (not shown) may be configured as a gear, chain or belt structure, and transmit power of the driving motor (not shown) to the rotation shafts 221 and 222.

With such a configuration, when the first and second rotating shafts 221 and 222 rotate by driving the rotating shaft driving means (not shown), a pair of wire belts 230 wound around the first and second rotating shafts 221 and 222 When the carrier jig 2 is input to the front end of the conveyor frame 210, the carrier jig 2 is provided on a pair of wire belts 230 provided along the longitudinal direction of the conveyor frame 210. Both sides are supported, and the carrier jig 2 can be transported along the pair of wire belts 230 toward the rear end of the conveyor frame 210.

In addition, the jig transfer unit 200, the carrier jig 2, which is transported along the jig transport path by a pair of wire belts 230, the substrate loading position corresponding to the substrate loading unit (400,500) or the substrate pressing device 600 It may further include at least one jig alignment unit (240a, 240b) aligned to the substrate pressing position corresponding to.

3 and 4, the jig alignment unit (240a, 240b) is provided on the jig transport path of the conveyor frame 210, the substrate loading unit (400,500) is loaded on the substrate to load the flexible circuit board (1) The first jig alignment unit 240a may be disposed at the position, and the second jig alignment unit 240b may be disposed at the substrate pressing position where the substrate pressing device 600 presses the flexible circuit board 1.

At this time, the first jig alignment unit 240a is provided on the jig transport path of the conveyor frame 210 so as to be elevated, and stopper means for stopping or passing the carrier jig 2 to the substrate loading position according to the lifting operation ( 241), a jig detection sensor 244 for detecting the carrier jig 2 stopped at the substrate loading position by the stopper means 241, and a carrier jig disposed at the lower portion of the jig transport path and stopped at the substrate loading position It may include a lifting means 246 for elevating the jig alignment plate 245 according to the detection signal of the jig alignment plate 245 and the jig detection sensor 244 to support the alignment (2).

In addition, the second jig alignment unit 240b has the same configuration as the first jig alignment unit 240a described above, and differs only in that the carrier jig 2 is aligned to the substrate pressing position.

Here, the stopper means 241 may include a stopper 242 provided to be able to elevate on a jig transport path, and a stopper driving means 243 for elevating and driving the stopper 242.

In addition, a plurality of fixing pins (not shown) for aligning the carrier jig 2 and fixing the jig alignment plate 245 on the upper surface of the jig alignment plate 245 may be formed to protrude at regular intervals.

That is, the carrier jig 2 is formed with a plurality of through holes (not shown) at regular intervals, and the positions on the jig alignment plate 245 corresponding to the plurality of through holes (not shown) formed in the carrier jig 2 Each of the fixing pins (not shown) may be formed.

In addition, the lifting means 246 is a cylinder 247 for elevating the jig alignment plate 245 according to the detection signal of the jig detection sensor 244, and a guide support 248 for guiding the elevation of the jig alignment plate 245 It may include.

By such a configuration, when the carrier jig 2 transferred along the jig transport path by the pair of wire belts 230 on the conveyor frame 210 enters the substrate loading position or the substrate pressing position, the stopper 242 Is stopped at the corresponding position, and the carrier jig 2 stopped at the corresponding position is detected by the jig detection sensor 244, and the lifting means 246 is the carrier jig according to the detection signal of the jig detection sensor 244. 2) the jig alignment plate 245 disposed at the lower portion may be raised.

In this process, the carrier jig 2 is supported on the top of the jig alignment plate 245, and a plurality of fixing pins (not shown) formed on the upper surface of the jig alignment plate 245 are formed on the carrier jig 2 By being inserted into the through hole (not shown), the carrier jig 2 can be fixedly supported by being aligned with the jig alignment plate 245.

In addition, as the jig alignment plate 245 supports the carrier jig 2 and rises a predetermined height, the carrier jig 2 is spaced a predetermined height from the pair of wire belts 230 and interferes with the wire belt 230 It will not work.

At this time, a plurality of flexible circuit boards 1 may be loaded and attached to the carrier jig 2 aligned to the substrate loading position by the jig alignment plate 245 by the substrate loading units 400 and 500, which will be described later. The carrier jig 2 aligned to the substrate pressing position by the alignment plate 245 may be pressed on the upper surface by the substrate pressing device 600, and a detailed description thereof will be described later.

In addition, when the process by the above-described substrate loading unit (400,500) or the substrate pressing device 600 is completed, according to a preset operation, the lifting means 246 lowers the jig alignment plate 245 to its original position, the jig alignment plate The carrier jig 2 supported by the 245 is seated on the pair of wire belts 230 again, and at the same time, the stopper 242 descends and retreats on the jig transport path, so that the carrier jig 2 is a wire belt ( 230).

At this time, when the carrier jig 2 completely passes through the jig detection sensor 244, the retracted stopper 242 according to the detection signal of the jig detection sensor 244 is returned to its original position, and then along the jig transport path The carrier jig 2 to be transferred can be stopped at a substrate loading position or a substrate pressing position.

On the other hand, the upper portion of the jig transfer unit 200 is provided to be movable along the longitudinal direction of the jig transfer unit 200, a substrate alignment unit 300 for aligning the flexible circuit board 1 in a predetermined arrangement may be provided.

1 and 2, the substrate alignment unit 300, the substrate alignment plate 310 and the substrate alignment plate 310 is formed with alignment means for aligning the flexible circuit board (1) on the upper surface jig The guide member 320 and the substrate alignment plate 310 for guiding the substrate alignment plate 310 to the jig transportation unit 200 so as to move in the front-rear direction along the longitudinal direction of the jig transportation unit 200 from the upper portion of the transportation unit 200 ) May include guide driving means 330 for transmitting driving force to the guide member 320 so that the guide member 320 moves in the front-rear direction.

Here, the upper surface of the substrate alignment plate 310 is provided with alignment means for aligning a plurality of flexible circuit boards (1), the alignment means is a plurality of flexible circuit boards (1) are arranged and seated at regular intervals The seating groove 311 and the plurality of seating grooves 311 may be formed to protrude in the seating groove 311 and may include a plurality of auxiliary fixing pins (not shown) to align and secure the flexible circuit board 1 seated in the seating groove 311. have.

In addition, a plurality of through-holes (not shown) are formed in the flexible circuit board 1 at regular intervals, and a plurality of through-holes (not shown) formed in the flexible circuit board 1 corresponds to the substrate alignment plate 310. Second fixing pins (not shown) may be formed at positions in the seating grooves 311.

At this time, the substrate alignment plate 310 may be replaced according to the specifications of the carrier jig 2 or the flexible circuit board 1.

The substrate alignment unit 300 having such a configuration is moved by the substrate loading unit 400,500 by moving the substrate alignment plate 310 through the guide driving means 330 to the substrate loading position corresponding to the substrate loading unit 400,500. The plurality of flexible circuit boards 1 to be loaded may be aligned to the seating groove 311 and the auxiliary fixing pin (not shown) of the substrate alignment plate 310.

On the other hand, the substrate loading unit (400,500) is provided at least one on the top of the main body table 100, picks up the flexible circuit board (1) and attaches it by loading it on the carrier jig (2) disposed at the substrate loading position on the jig transport path can do.

At this time, the substrate loading unit (400,500), prior to attaching the flexible circuit board (1) to the carrier jig (2), pick up the flexible circuit board (1) in a preliminary process and load it on the substrate alignment unit (300), and then the substrate The flexible circuit board 1 arranged in a predetermined arrangement by the alignment unit 300 can be picked up and loaded on the carrier jig 2 to be attached.

5 shows the configuration of the substrate loading unit 400,500 according to an embodiment of the present invention.

In this embodiment, as an example, the substrate loading units 400 and 500 are provided as a pair, and the flexible circuit board 1 is attached to the carrier jig 2 through a pair of first and second substrate loading units 500. The configuration to be described will be described.

1, 2, and 5, the first substrate loading unit 400 includes a first support frame 410 disposed vertically at a central portion of the jig transfer unit 200 at an upper portion of the main body table 100. , The first horizontal guide 420 connected to the upper portion of the first support frame 410 so as to be orthogonal to the jig transport unit 200 and the first horizontal guide 420 along the first horizontal guide 420 to move in a direction orthogonal to the jig transport unit 200 It is provided on the lower portion of the first transfer member 430 and the first lift member 440 and the first lift member 440 are provided to be able to elevate on the first transfer member 430, which is provided, the flexible circuit board (1) may include a first pickup member 450 for picking up.

In addition, a plurality of flexible circuit boards 1 may be stacked on one side of the first support frame 410 from the top of the main body table 100 to provide a substrate supply unit 120 capable of supplying the flexible circuit board 1. have.

At this time, a plurality of flexible circuit boards 1 may be arranged at regular intervals on the substrate supply unit 120 to be stacked in multiple layers.

The first pickup member 450 provided in the first substrate loading unit 400 may include a plurality of suction pads 451 that adsorb and pick up a plurality of flexible circuit boards 1.

With this configuration, the first substrate loading unit 400, the first pickup member 450 having a plurality of adsorption pads 451 is provided to be elevated by the first lifting member 440, in addition to the first transfer The member 430 is provided to be movable in a direction orthogonal to the jig transfer unit 200, thereby moving the first pickup member 450 in the vertical and horizontal directions to supply the substrate 120 through a plurality of adsorption pads 451. ), A plurality of flexible circuit boards 1 can be picked up and loaded on the substrate alignment plate 310 disposed on the top of the jig transfer unit 200, and also arranged on the substrate alignment plate 310 and stacked. The flexible circuit board 1 can be picked up and loaded and attached to the carrier jig 2 disposed at the substrate loading position on the jig transfer unit 200.

The second substrate loading unit 500, the second support frame 510 disposed vertically on the front end side of the jig transfer unit 200 from the top of the main body table 100, and the second so as to be parallel to the jig transfer unit 200 The second horizontal guide 520 connected to the upper portion of the support frame 510, and the second transfer member 530 provided to be movable in the front-rear direction from the top of the jig transfer unit 200 along the second horizontal guide 520 ), And a second pick-up member provided on the lower portion of the second lift-up member 540 and the second lift-up member 540 provided to be elevated on the second transfer member 530 to pick up the flexible circuit board 1 It may include (550).

The second pickup member 550 provided in the second substrate loading unit 500 may also include a plurality of suction pads 551 that adsorb and pick up a plurality of flexible circuit boards 1.

With this configuration, the second substrate loading unit 500, the second pickup member 550 having a plurality of adsorption pads 551 is provided to be elevated by the second lifting member 540, in addition to the second transfer The member 530 is provided to be movable in the front-rear direction from the top of the jig transfer unit 200, thereby moving the second pickup member 550 in the vertical and horizontal directions to move the jig transfer unit through the plurality of adsorption pads 551 ( A plurality of flexible circuit boards 1 can be picked up from the substrate alignment plate 310 disposed on the upper side of the 200, and the plurality of flexible circuit boards 1 picked up are placed at the substrate loading position on the jig transfer unit 200 It can be mounted on the carrier jig 2 to be attached.

At this time, in this embodiment, the first substrate loading unit 400 and the second substrate loading unit 500 are alternately operated to alternately alternate a plurality of flexible circuit boards 1 on one side and the other side of the upper surface of the carrier jig 2. By loading and attaching, the flexible circuit board 1 can be more quickly and accurately attached to the predetermined position of the carrier jig 2.

On the other hand, the substrate pressing device 600 is provided on the upper portion of the main body table 100, the substrate loading unit 400,500 by the uniformly press the flexible circuit board (1) attached to the carrier jig (2) uniformly attached can do.

6 shows the configuration of the substrate pressing device 600 according to an embodiment of the present invention.

1, 2 and 6, the substrate pressing device 600, the vertical frame 610 disposed vertically on the rear end side of the jig transfer unit 200 from the top of the main body table 100, and the jig transfer unit The parallel guide 620 connected to the upper portion of the vertical frame 610 to be parallel to the 200, and the transfer member 630 provided to be movable in the front-rear direction from the top of the jig transfer unit 200 along the parallel guide 620 ), And provided on the lower portion of the elevating member 640 and the elevating member 640 provided to be elevated on the conveying member 630 to press and attach the flexible circuit board 1 loaded on the carrier jig 2 It may include a pressing member 650.

Specifically, the vertical frame 610 is disposed on the rear end side of the jig transfer unit 200 from the top of the main body table 100, and the vertical frame 610 is parallel to the jig transfer unit 200 from the top of the jig transfer unit 200 The parallel guides 620 are arranged to be connected.

In addition, the transfer member 630 is connected to the parallel guide 620, the transfer guide 631 is provided to be movable in the front-rear direction along the parallel guide 620, and the drive guide drive for moving the transfer guide 631 Means (not shown).

At this time, the transfer guide driving means (not shown) may include a drive motor (not shown) and a power transmission unit (not shown) that transmits the power of the drive motor (not shown) to the transfer guide 631. The power transmission unit (not shown) may be configured as one of a gear, chain, or belt structure, and transmit power of a driving motor (not shown) to the transfer guide 631.

In addition, it is of course possible to control the movement amount of the transfer guide 631 through the control of the driving amount of the driving motor (not shown).

In addition, the lifting member 640, the pressing member 650 is coupled to the lower end, the lifting frame 641 is guided to be able to elevate to the transport guide 631 and the transport guide 631 is coupled to the lifting frame ( 641) may include a vertical cylinder 642 to elevate.

In addition, the pressing member 650 is provided on the lower portion of the lifting frame 641, a plurality of press rollers 651 to press and roll a plurality of flexible circuit boards (1) attached to the carrier jig 2 It may include.

The substrate pressing device 600 having such a configuration, the pressing member 650 having a plurality of pressing rollers 651 is provided so as to be elevated by the lifting member 640, and the jig conveying part ( 200) by being provided to be movable in the front-rear direction from the top, the pressing member 650 is moved to the top of the carrier jig 2 and then lowered to temporarily attach to the carrier jig 2 through a plurality of press rollers 651 The plurality of flexible circuit boards 1 may be pressed, and the plurality of flexible circuit boards 1 may be reciprocated before and after a predetermined interval while the plurality of flexible circuit boards 1 are pressed, thereby uniformizing the plurality of flexible circuit boards 1 on the carrier jig 2. Can be firmly attached.

In addition, the second jig alignment unit 240b described above may be provided on the jig transportation unit 200 located at the lower portion of the substrate pressing device 600, and is transferred along the jig transportation path through the second jig alignment unit 240b. By aligning the carrier jig 2 to the substrate pressing position under the substrate pressing device 600, the substrate pressing device 600 is loaded with a plurality of flexible circuit boards 1 loaded in the carrier jig 2 aligned to the substrate pressing position 1 ) Can be pressed.

On the other hand, a thickness sensing sensor (not shown) for sensing the stacking thickness of the flexible circuit board 1 loaded on the carrier jig 2 may be provided on the transport path of the jig transport unit 200 where the carrier jig 2 is transported. In this way, it is possible to determine whether a loading error occurs by sensing that the flexible circuit board 1 is stacked in multiple layers on the carrier jig 2.

In addition, a control unit 110 for controlling the operation of the robot 10 automatically attached to the flexible circuit board 1 may be provided on one side of the main body table 100.

That is, the operation of the jig transfer unit 200, the substrate alignment unit 300, the substrate loading unit 400,500 and the substrate pressing device 600 may be set through the control unit 110, wherein the carrier jig 2 or the flexible It goes without saying that the operation setting may be different according to the specifications of the circuit board 1.

Hereinafter, with reference to the accompanying drawings, an operation process of the flexible circuit board automatic attachment robot 10 equipped with a substrate pressing device according to an embodiment of the present invention will be described.

7 and 8 sequentially show the operation of the flexible circuit board automatic attachment robot 10 equipped with a substrate pressing device according to an embodiment of the present invention.

Referring to FIG. 7, when the carrier jig 2 is inserted into the front end side jig transport path of the jig transfer unit 200, the carrier jig 2 is moved by a pair of wire belts 230 (see FIG. 4). It can be transported along.

At this time, in the process of transporting the carrier jig 2, the carrier jig 2 may be arranged to be aligned with the substrate loading position corresponding to the substrate loading units 400 and 500 by the first jig alignment unit 240a.

Further, a plurality of flexible circuit boards 1 are picked up from the substrate supply unit 120 (refer to FIG. 2) through the substrate loading units 400 and 500, and the substrates are arranged on the substrate alignment plate 310 disposed on the jig transfer unit 200. By loading the alignment plate 310, the plurality of flexible circuit boards 1 can be aligned in a predetermined arrangement corresponding to the carrier jig 2, and the plurality of flexible circuit boards 1 aligned with the substrate alignment plate 310 Can be picked up again and loaded and attached to the carrier jig 2 disposed at the substrate loading position.

In the present embodiment, the process of attaching a plurality of flexible circuit boards 1 to the carrier jig 2 alternately by operating the pair of first and second substrate loading units 500 simultaneously.

Meanwhile, referring to FIG. 8, the carrier jig 2 to which the plurality of flexible circuit boards 1 are temporarily attached by the substrate loading units 400 and 500 is transported along the jig transport path to the lower portion of the substrate pressing device 600. The carrier jig 2 to which the stopper 242 provided in the second jig alignment unit 240b is transferred may be stopped at the substrate pressing position under the substrate pressing device 600.

At this time, the jig detection sensor 244 provided in the second jig alignment unit 240b detects the carrier jig 2 stopped at the substrate pressing position, and aligns the second jig according to the detection signal of the jig detection sensor 244 The lifting means 246 of the portion 240b (see FIG. 3) raises the jig alignment plate 245 disposed under the carrier jig 2.

In this process, the carrier jig 2 is supported on the top of the jig alignment plate 245, and a plurality of fixing pins (not shown) formed on the upper surface of the jig alignment plate 245 are formed on the carrier jig 2 By being inserted into the through hole (not shown), the carrier jig 2 may be aligned and supported on the jig alignment plate 245.

In addition, as the jig alignment plate 245 supports the carrier jig 2 and rises a predetermined height, the carrier jig 2 is spaced a predetermined height from the pair of wire belts 230 (see FIG. 4), and the wire belt ( 230).

In this state, the plurality of pressure rollers 651 provided on the substrate pressing device 600 may descend to press the plurality of flexible circuit boards 1 loaded on the carrier jig 2, and at the same time, the plurality of rollers A plurality of flexible circuit boards 1 can be uniformly attached to the carrier jig 2 by reciprocating back and forth at predetermined intervals while the flexible circuit board 1 is pressed.

That is, since the adhesive tape (not shown) is attached to the upper surface of the carrier jig 2 at the position where the flexible circuit board 1 is adhered, the flexible circuit board 1 is attached to the upper surface of the carrier jig 2 during the pressing process. This can be firmly attached.

On the other hand, when the flexible circuit board 1 is attached to the carrier jig 2, in accordance with a preset operation, the stopper 242 of the second jig alignment unit 240b is retracted on the jig transport path, and at the same time, the carrier jig ( 2) is seated on a pair of wire belts 230, the carrier jig 2 to which the flexible circuit board 1 is attached may be discharged along the jig transport path to the rear end of the jig transport unit 200.

As described above, the flexible circuit board automatic attachment robot 10 provided with the substrate pressing device according to an embodiment of the present invention, the plurality of flexible circuit boards (1) at a predetermined position on the upper surface of the carrier jig (2) It can be attached precisely, by pressing the plurality of flexible circuit boards (1) loaded and attached to the carrier jig (2) through the substrate pressing device (600) more firmly attached. It has the advantage of improving product reliability.

The embodiments of the present invention disclosed in the present specification and drawings are merely to provide a specific example to easily explain the technical content of the present invention and to understand the present invention, and are not intended to limit the scope of the present invention.

Therefore, the scope of the present invention should be interpreted to include all the modified or modified forms derived on the basis of the technical spirit of the present invention in addition to the embodiments disclosed herein.

10: flexible circuit board automatic attachment robot 100: body table
200: jig transfer unit 300: substrate alignment unit
400,500: Board loading unit 600: Board pressing device

Claims (8)

Body table;
It is provided on the upper portion of the main table, a jig transfer unit for horizontally transferring a carrier jig to which a flexible circuit board is attached;
It is provided on the upper portion of the body table, at least one substrate loading unit for picking up a flexible circuit board and attached to the carrier jig; And
A robot for automatic attachment of a flexible circuit board provided with a substrate pressing device provided on an upper portion of the main body table and including a substrate pressing device for pressing the flexible circuit board attached to the carrier jig.
According to claim 1,
The substrate pressing device,
A vertical frame disposed vertically at a rear end portion of the jig transfer unit at an upper portion of the main body table;
A parallel guide connected to an upper portion of the vertical frame so as to be parallel to the jig transfer part;
A transfer member movably provided in the front-rear direction from the top of the jig transfer unit along the parallel guide;
An elevating member provided so as to be elevable on the conveying member; And
A robot having an automatic attachment to a flexible circuit board provided with a substrate pressing device provided at a lower portion of the elevating member and including a pressing member for pressing and attaching the flexible circuit board mounted on the carrier jig.
According to claim 2,
The pressing member,
A robot for automatic attachment of a flexible circuit board equipped with a substrate pressurizing device comprising at least one pressure roller for pressing and rolling the flexible circuit board loaded on the carrier jig.
According to claim 1,
The jig transfer unit,
A conveyor frame disposed in one direction on the upper portion of the main body table and forming a jig transfer path through which the carrier jig is transferred;
First and second rotation shafts respectively rotatably provided at the front end and the rear end of the conveyor frame;
A pair of wire belts wound on both edges of the first and second rotation shafts, respectively, to transport carrier jigs along the jig transport path; And
A flexible circuit board automatic attachment robot equipped with a substrate pressurizing device including a rotation shaft driving means for transmitting rotational force to the first and second rotation shafts.
The method of claim 4,
The jig transfer unit,
A robot for automatically attaching a flexible circuit board equipped with a substrate pressing device further comprising a jig alignment unit to align the carrier jig transported along the jig transport path to a substrate pressing position where the substrate pressing device presses the flexible circuit board.
The method of claim 5,
The jig alignment unit,
Stopper means provided on the jig transport path to be elevated, stop or pass the carrier jig to the substrate pressing position according to the lifting operation;
A jig detection sensor detecting the carrier jig stopped at the substrate pressing position by the stopper means;
A jig alignment plate disposed at a lower portion of the jig transport path to align and support the stationary carrier jig at the substrate pressing position; And
A flexible circuit board automatic attachment robot equipped with a substrate pressurizing device comprising an elevating means for elevating the jig alignment plate according to the detection signal of the jig detection sensor.
The method of claim 6,
On the top surface of the jig alignment plate,
A flexible circuit board automatic attachment robot equipped with a substrate pressing device on which a plurality of fixing pins for aligning and fixing the carrier jig is formed.
According to claim 1,
The jig transfer unit,
A robot for automatically attaching a flexible circuit board equipped with a substrate pressurizing device comprising a thickness sensor for sensing the thickness of the flexible circuit board attached to the carrier jig.

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