JPS62165994A - Electronic parts mounting apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components such as chip resistors and chip multilayer capacitors onto a substrate constituting an electronic circuit.

Conventional technology Conventionally, as an electronic component mounting device, Japanese Patent Application Laid-Open No. 56-118
The one disclosed in Japanese Patent No. 698 is known.

As shown in FIG. 6, the tape-shaped component assembly A used in the electronic component mounting apparatus has a large number of accommodation recesses formed in a row at a predetermined pitch in the tape body a, and the electronic components C are placed in the tape body a. The electronic component C is housed therein, and a sealing tape d is attached to the surface of the tape body a to hold the electronic component C.

The electronic component mounting device intermittently feeds the tape-shaped component assembly A in one direction using a feeding device q, peels and winds up the sealing tape using a tape peeling device, and stores the tape-shaped component assembly A in a housing recess. The electronic component C is suctioned and taken out by a suction head i, and is mounted on a predetermined position on a substrate j using this suction head 1.

Furthermore, after peeling off the seal tape d, the movement of the tape-shaped component assembly A may cause the electronic component C to move and take an incorrect posture within the housing recess, or may be pulled out of the suction head i.
In order to prevent the suction from failing due to this, a closing member is provided which moves together with the tape-shaped parts assembly while closing the opening of the accommodation recess and retreats to the position where the tape-shaped parts assembly returns to its original position. It has also been proposed that the housing recess is opened immediately before suction.

In order to ensure that the electronic component C is suctioned by the suction head 1, a device in which the electronic component C is pushed up from below using a push-up pin during suction has also been proposed.

Furthermore, there is also known a tape-shaped component assembly A that has multiple rows of storage recesses so that a large number of electronic components C can be accommodated in one tape-shaped component assembly A to improve work efficiency. .

Problems to be Solved by the Invention However, in the electronic component mounting apparatus using the tape-shaped component assembly having the plurality of rows of accommodation recesses,
If the electronic component is pushed up with a push-up pin during suction to eliminate suction failure, multiple rows of accommodation recesses will be opened at once even if the above-mentioned closing member is provided, and the suction head will not be able to pick up the electronic component. When suctioning, it is impossible to open only the closing member of the accommodation recess and keep the other accommodation recesses closed with the closing members, and the influence of the operation of the push-up pins when suctioning other rows. There is a problem in that the electronic components may become incorrectly oriented or ejected as a result of this, and there is a risk that suction may fail.

The present invention aims to solve the above problems.

Means for Solving the Problems In order to achieve the above object, the present invention provides a tape-shaped component in which electronic components are accommodated in component-accommodating recesses in multiple rows at different positions with respect to the traveling direction, and the openings are closed with sealing tape. A seal tape peeling position is provided on the moving path of the assembly, and a suction head that can be lowered to suction the electronic components in the housing recess is disposed so that its position can be changed in the width direction of the tape-shaped component assembly. Closing members that can close the openings of the four housing parts located below the installation position and move to the open position are arranged corresponding to the housing recesses, and the electronics in each of these housing recesses are placed below the tape-shaped component assembly. The device is characterized in that push-up pins are provided to push up the parts, and the lowering of the suction head, the movement of the closing member of the accommodation recess to the open position, and the operation of the push-up pins facing the accommodation recess are linked. It is something to do.

Operation Since the present invention has the above-described configuration, when mounting an electronic component using a tape-shaped component assembly provided with a plurality of rows of housing recesses with different numbers of tM in the direction of travel, the suction head is placed in the housing where the suction head faces the Only the opening of the recess can be opened before the suction head descends to pick up the suction, and the accommodation recesses in the other rows can be kept closed with a closing member. Even if an electronic component is pushed up from below, electronic components in other rows will not move unexpectedly and take an incorrect posture or be pulled out, eliminating the risk of suction failure.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 6.

As shown in FIG. 5, the tape-shaped component assembly 1 used in this electronic component mounting apparatus has a holding tape 2 in which a large number of accommodating recesses 3 for accommodating electronic components are formed in three rows at a predetermined pitch in the width direction. At the same time, the tape length and direction are also formed at a predetermined pitch. A large number of perforations 4 are formed at a predetermined pitch on both side edges of the holding tape 2.
After storing electronic components P (not shown, see FIG. 3) in the housing recesses 3 of the holding tube 2, a sealing tape 6 is pasted on the upper surface of the holding tube 2 so as to close the openings of the three rows of housing recesses 3. It is made up of clothes. Further, as shown in FIG. 3, the holding tape 2 has a thick tape body 2a formed with a through hole that forms a housing recess 3, and a tape body 2a that forms a bottom wall of the housing recess 3. Thin support tape 2 attached to the bottom surface
It is composed of b.

This tape-shaped component assembly 1 is set in an electronic component mounting apparatus as shown in FIGS. 1 and 2.

This electronic component mounting device includes a feeding device 6 equipped with a gear ring 7 that engages with the feeding hole 4, a tape peeling device 8 that peels off the seal tape 6 at a position in front of a presser plate 9, and winds it up.
It includes a suction head 10 that suctions and picks up the electronic components in the housing recess 3 and attaches them to a predetermined position on a printed circuit board (not shown).

A cover plate 11 that covers the upper surface of the tape-shaped component assembly 1 is disposed between the placement position of the suction head 10 and the peeling position of the seal tape 5, and the electronic component P is disposed when the tape-shaped component assembly 1 is moved. In order to prevent the parts from being pulled out, only one component accommodating part 3 comes forward from the covering plate 11 in the longitudinal direction of the tape assembly 1 in one feeding operation of the feeding device 6.

The suction head 10 is configured so that its position can be changed in the width direction of the tape-shaped component assembly 10 so that it can be positioned facing above the accommodation recesses 3 of each row. In addition, tape-shaped parts assembly 1
A push-up means 12, such as a cylinder device or a renoid, is disposed below the suction head 1o and moves in conjunction with the suction head 1o. The accommodation recess 3 is located in the front part of the covering plate 11, that is, below the placement position of the suction head 10.
Closing members 13 for closing the openings of the housing recesses 3 are provided so as to cover the entire width direction of the housing recesses 3, and are connected to the cylinder devices 15 so as to be movable to the open position in which they enter into the slits 14 formed in the covering plate 11. Supported. Also,
Between the tape-shaped component assembly 1 and the pushing-up means 12, there are three push-up pins 1 located opposite to the accommodation recesses 3 of each row.
6 is supported by a support block 17 so as to be able to rise,
It is constructed so that each can be pushed up individually by the pushing up means 12. 18 is the holding tape 2 in the feeding device 6 part.
This is a guide.

In the above configuration, the tape-like component assembly 1 is intermittently moved one pitch at a time in the direction of the arrow in FIG. 2 by the feeding device 6. During the movement, the seal tape 5 is first peeled off by the tape peeling device 8, and then passes under the cover plate 11 to reach a position below the suction head 10. The feeding device 6 is controlled so that each housing recess 3 sequentially stops at a position below the suction head 1o. During the intermittent movement, the housing recess 3
Since the opening is closed by the closing member 13VC, the electronic component P inside is securely held. Tape-shaped parts assembly 1
When the suction head 10 stops, the suction head 10 moves so as to be positioned opposite to any one of the three rows of accommodation recesses 3 from which the electronic component P is to be taken out.
At the same time, the push-up means 12 also moves to a position below the push-up pin 16 facing the housing recess 3 thereof. Then the third
As shown by the arrow in the figure, before the suction head 1o is lowered, the closing member 13 is moved to the open position by the cylinder device 15, and then the suction head 1Q is lowered and the push-up means 12 is activated to push the suction head 1o downward. The raising pin 16 rises, and the electronic component 6 in the housing recess 3 moves from the state shown in FIG. 3 to the state shown in FIG.
is sucked by the suction head 10 and the push-up pin 1
6 penetrates the bottom wall of the accommodation recess 3 and pushes up the electronic component P, so that the electronic component P is reliably attracted to the suction head 10. In this way, the electronic component P is picked up by the suction head 10, and mounted on a printed circuit board (not shown) by the suction head 10. The holding tape 2 from which the electronic components P have been taken out is sequentially wrapped around the gears 7 of the feeding device 6 to move and drive the tape-like component assembly 1, and is then reversed and cut as appropriate (not shown) along the guide 18. It travels towards the device and is cut and discarded.

The present invention is not limited to the above embodiments, and can be implemented with various modifications. For example, in the embodiment described above, a plurality of push-up pins 1θ are arranged so as to be able to rise, and the push-up pins 16 are individually operated by the push-up means 12 that moves in conjunction with the suction head 1o. Each of the pin rollers may be provided with a small movement means to operate the push-up pin 16 facing the suction head 10.

Effects of the Invention According to the electronic component mounting apparatus of the present invention, since a tape-shaped component assembly having multiple rows of accommodation recesses is used as described above, a large number of tape-shaped component assemblies can be mounted with one roll of the tape-shaped component assembly compared to the conventional method. It can hold electronic components, improving work efficiency, and during suction operation, the push-up pin breaks through the bottom wall of the storage recess and pushes up the electronic components from below, so electronic components can be reliably picked up by the suction head. It is possible to open only one component storage recess in one feeding,
The accommodation recesses in other rows are held closed by cover plates, so even if you try to push up the electronic components with the push-up pin as described above, the electronic components in other rows will move unexpectedly and become incorrectly positioned. There is no risk of suction failure as there is no possibility of the electronic parts being stuck or pulled out, and the electronic parts can be reliably held in the housing recess even when the tape-shaped parts assembly is moved. .

[Brief explanation of drawings]

Fig. 1 is a perspective view of the main parts of an embodiment of the present invention, Fig. 2 is a partially cross-sectional schematic front view showing the overall configuration, Figs. 3 and 4 are operational explanatory diagrams of the main parts, and Fig. 5 is FIG. 6 is a plan view of the tape-shaped component assembly, and a partially sectional front view of a conventional component mounting machine. 1...Tape-shaped parts assembly, 3...Accommodating recess, 5...Seal tape, 1o...
- Suction head, 13... Closing member, 16...
...Push-up pin, P...Electronic component. Name of agent: Patent attorney Toshio Nakao and 1 other person G4
Figure 1 Figure 2

Claims (1)

[Claims] A sealing tape peeling position is provided in the moving path of a tape-shaped component assembly in which electronic components are accommodated in component housing recesses provided in multiple rows in the direction of travel, and the openings thereof are closed with sealing tape. A suction head that can move up and down to suction the electronic components in the storage recess is arranged so that its position can be changed in the width direction of the tape-shaped component assembly, and components are accommodated at different positions in double rows below the suction head placement position. A closing member that closes the opening of the recess and is movable to the open position is provided, and push-up pins are provided below the tape-shaped component assembly to push up the electronic components in each accommodation recess, and the suction head is lowered. An electronic component mounting device characterized in that the movement of the closing member to the open position and the operation of a push-up pin facing the accommodation recess are linked.