JPS622690A - Part feeder - Google Patents

Part feeder

Info

Publication number
JPS622690A
JPS622690A JP60142942A JP14294285A JPS622690A JP S622690 A JPS622690 A JP S622690A JP 60142942 A JP60142942 A JP 60142942A JP 14294285 A JP14294285 A JP 14294285A JP S622690 A JPS622690 A JP S622690A
Authority
JP
Japan
Prior art keywords
component
assembly
parts
transfer
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60142942A
Other languages
Japanese (ja)
Other versions
JPH0671156B2 (en
Inventor
真弘 丸山
寛二 秦
一天満谷 英二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60142942A priority Critical patent/JPH0671156B2/en
Publication of JPS622690A publication Critical patent/JPS622690A/en
Publication of JPH0671156B2 publication Critical patent/JPH0671156B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はチップ型抵抗、チップ型積層コンデンサ等に代
表されるリードレスタイプの電子部品を、電子回路を構
成する基板上に装着する電子部品装着装置において主に
利用される部品供給装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electronic component mounting apparatus for mounting leadless type electronic components such as chip resistors, chip multilayer capacitors, etc. onto a substrate constituting an electronic circuit. This relates to a parts supply device that is mainly used in the industry.

従来の技術 電子部品装着装置においては、従来特開昭55−118
698号公報に示されているような部品供給装置が用い
られている。
Conventional technology Regarding electronic component mounting equipment, the prior art
A component supply device as shown in Japanese Patent No. 698 is used.

この部品供給装置において用いられる部品集合体Aは、
第3図に示すように、テープ本体aに長手方向に1列に
所定ピッチで多数の部品収容部すを形成し、ここに電子
部品Cを装入するとともに、テープ本体aの表裏面にシ
ールテープdと保持テープeを貼着して前記電子部品C
を保持する構成となっている。又部品集合体Aの側縁部
には所定ピッチで送り孔が形成されている。
The parts assembly A used in this parts supply device is
As shown in FIG. 3, a large number of component housing parts are formed in one row in the longitudinal direction at a predetermined pitch in the tape body a, and electronic components C are inserted therein, and seals are sealed on the front and back surfaces of the tape body a. The electronic component C is attached by pasting the tape d and the holding tape e.
It is configured to hold. Further, feed holes are formed at a predetermined pitch on the side edge of the parts assembly A.

電子部品装着装置において、前記部品集合体Aは第3図
に示すように、前記送り孔に噛み合って移動させる移送
装置fによって一方向に間欠的に送られ、その移送途中
で部品収容部すを覆うシールテープdが巻取装置gで巻
終取られて剥離され、部品収容部すに装入された電子部
品Cは、真空チャックh(ピックアップ手段)によって
吸着され、部品集合体Aから取り出された後、前記真空
チャックhによって基板1上の所定位置に装着される。
In the electronic component mounting apparatus, as shown in FIG. 3, the component assembly A is intermittently sent in one direction by a transfer device f that engages with the feed hole and moves the component assembly A, and during the transfer the component assembly A is moved in one direction. The covering sealing tape d is wound up and peeled off by the winding device g, and the electronic component C loaded into the component storage section is sucked by a vacuum chuck h (pickup means) and taken out from the component assembly A. After that, it is mounted at a predetermined position on the substrate 1 by the vacuum chuck h.

発明が解決しようとする問題点 従来の部品供給装置は上述のように、部品集合体の表面
に部品収容部を覆うように貼着されたシールテープを、
部品をピックアップする手前位置で巻取装置にて巻き取
って剥離する構成となっているので、新たな部品集合体
と交換するときに、シールテープの巻き取り端部を巻取
装置にセットする必要があって、作業工数を増加させ、
更に自動化を進める上でネックとなるという問題点を有
している。
Problems to be Solved by the Invention As mentioned above, the conventional parts supply device uses a sealing tape attached to the surface of the parts assembly so as to cover the parts housing part.
Since the parts are wound up and peeled off by a winding device before being picked up, it is necessary to set the winding end of the seal tape on the winding device when replacing with a new parts assembly. There is an increase in work man-hours,
Furthermore, it has the problem of becoming a bottleneck in promoting automation.

また、交換時間を短くするために部品集合体とその供給
装装置をユニット化したパーツカセットを用いることも
考えられたが、予備のパーツカセットを必要としてコス
ト高となるとともにパーツカセットに予め部品集合体を
セットする作業が別途に必要となり、交換時間は短くで
きても作業工数は少なくならないという問題点がある。
In addition, in order to shorten the replacement time, it has been considered to use a parts cassette in which the parts assembly and its supply device are integrated into a unit, but this requires a spare parts cassette, which increases costs, and the parts are assembled in the parts cassette in advance. There is a problem in that a separate work is required to set the body, and even if the replacement time can be shortened, the number of man-hours will not be reduced.

問題点を解決するための手段 本発明は上記問題点を解決するため、長手方向に沿って
多数形成された部品収容部内に部品を収容し部品収容部
の開口部をシールテープで覆ってなるテープ状の部品集
合体を巻き取ったリールを回転自在に支持する支持手段
を設け、前記リールから部品集合体を引き出して移送す
る移送手段を設け、部品集合体の移送経路上゛に部品収
容部内の部品をピックアップするピックアップ装置を設
けるとともに部品のビラクツツブ位置よりも移送方向手
前位置にシールテープを吸引して剥離する真空ドラムを
備えた剥離装置を設けたことを特徴とする部品供給装置
を提供するものである。
Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a tape in which components are accommodated in a plurality of component accommodating sections formed along the longitudinal direction, and the openings of the component accommodating sections are covered with a sealing tape. A support means is provided to rotatably support a reel wound up with a part assembly of a shape, and a transfer means is provided to pull out and transfer the parts assembly from the reel, and a part assembly in the parts storage section is provided on the transfer path of the parts assembly. To provide a parts supply device, characterized in that a pickup device for picking up parts is provided, and a peeling device equipped with a vacuum drum for sucking and peeling a seal tape is provided at a position in front of a position where the parts are picked up in the transfer direction. It is.

作用 本発明は上記構成を有する結果、部品集合体の交換時に
、部品集合体を巻き取ったリールを支持手段にセットし
、部品集合体を移送手段にて移送させるようにす・るだ
けで、シールテープは移送経路上を移送中に真空ドラム
で吸着されて剥離される。従って、シールテープの端部
を巻取装置に装着する等の作業を無くすことができ、部
品集合体の交換時間を短くできるとともに自動化も容易
に図ることができる。
Operation As a result of the present invention having the above configuration, when replacing a parts assembly, the reel on which the parts assembly is wound is set on the support means, and the parts assembly is transferred by the transport means. The seal tape is adsorbed and peeled off by a vacuum drum while being transferred on the transfer path. Therefore, it is possible to eliminate the work of attaching the end portion of the seal tape to a winding device, etc., and the time required to replace the parts assembly can be shortened, and automation can be easily achieved.

実施例 以下、本発明を電子部品装着l&置に適用した一笑施例
を第1図及び第2図を参照しながら説明する。
EXAMPLE Hereinafter, an example in which the present invention is applied to electronic component mounting will be described with reference to FIGS. 1 and 2.

部品集合体1は、テープ本体2に所定ピッチで1列状に
多数形成された部品収容部3に電子部品4を装入すると
ともに、テープ本体2の表裏面に貼5aされたシールテ
ープ5及び保持テープ6で前記電子部品4を保持する構
成となっている。又部品集合体1の側縁部には所定ピッ
チで送り孔7が形成されている。この部品集合体1はリ
ール8に所定長づつ巻終取られている。
In the component assembly 1, electronic components 4 are loaded into a plurality of component accommodating portions 3 formed in a row at a predetermined pitch on a tape body 2, and seal tapes 5 and 5a pasted on the front and back surfaces of the tape body 2 are inserted. The electronic component 4 is held by a holding tape 6. Further, feed holes 7 are formed at a predetermined pitch on the side edge of the component assembly 1. This parts assembly 1 is wound onto a reel 8 at a predetermined length.

10は電子部品装着装置におげろ部品供給装置で、部品
集合体1を一直線状に移動案内する移動経路を形成する
フレーム11の一端部に前記リール8を回転自在に支持
するブラケットからなる支持手段12が配置固定されて
いる。前記移動経路にはその一端から、部品集合体1を
上下から挟持して移送する一対の送りローラからなる送
出装置13、部品集合体1を検知する反射型ファイバセ
ンサなどからなるセンサ14、部品集合体1のシールテ
ープ5を吸着して剥離する真空ドラム15を備えたシー
ルテープ剥離装置16、部品集合体1の側縁部に形成さ
れた送り孔7に矩形運動する送り爪17を係合させて部
品集合体1を1ピツチづつ間欠的に送る間欠移送装(i
l18、部品集合体1の最初の送り孔7を検知して前記
送りローラ13.13を停止させ間欠移送装置18によ
る移送に切り替えるためのセンサ19、前記間欠移送装
置18の送り爪17が送り孔7から離脱したときに前記
送り孔7に係合して部品集合体1の位置を規制する位置
規制手段20、及び部品収容部3に装入された電子部品
4を吸着して取り出し、図外の基板の所定位置に装着す
る真空チャックからなるピックアップ手段21が順に配
設されており、さらにこの移送経路から送り出されたテ
ープ本体及V保持テープを切断処理するカッター22が
配設されている。
Reference numeral 10 denotes a component supply device for the electronic component mounting device, and a support means consisting of a bracket that rotatably supports the reel 8 at one end of a frame 11 forming a moving path for guiding the component assembly 1 in a straight line. 12 are fixed in position. The moving path includes, from one end thereof, a feeding device 13 consisting of a pair of feed rollers that clamps and transfers the component assembly 1 from above and below, a sensor 14 consisting of a reflective fiber sensor or the like that detects the component assembly 1, and a component assembly. A seal tape peeling device 16 includes a vacuum drum 15 that attracts and peels the seal tape 5 of the assembly 1, and a feed claw 17 that moves in a rectangular manner is engaged with a feed hole 7 formed in the side edge of the parts assembly 1. An intermittent transfer device (i
l18, a sensor 19 for detecting the first feed hole 7 of the parts assembly 1, stopping the feed roller 13.13 and switching to transfer by the intermittent transfer device 18; a sensor 19 for detecting the first feed hole 7 of the parts assembly 1; A position regulating means 20 engages with the feed hole 7 to regulate the position of the component assembly 1 when the electronic component 4 is removed from the component storage section 7, and a position regulating means 20 that sucks and takes out the electronic component 4 loaded into the component storage section 3, Pick-up means 21 consisting of a vacuum chuck to be attached to a predetermined position on the substrate are sequentially disposed, and a cutter 22 for cutting the tape body and V-holding tape sent out from this transfer path is also disposed.

前記シールテープ剥離装置16は、真空ドラム15に吸
着されたシールテープ5を真空ドラム15の周面から引
鯵剥がして排出する排出手段23と、排出されたシール
テープ5を短く切断する力γター24と、切断片を受は
入れる収容箱25とを備えている。
The seal tape peeling device 16 includes a discharge means 23 for peeling off the seal tape 5 adsorbed on the vacuum drum 15 from the circumferential surface of the vacuum drum 15 and discharging it, and a force γ tar for cutting the discharged seal tape 5 into short lengths. 24, and a storage box 25 for receiving the cut pieces.

又、前記間欠移送装置18は、一対の送り爪17を突設
された動作板26を上下駆動層のソレノイド27の出力
輪の上端に取付け、このソレノイド27を移送経路の前
後方向に移動可能な移動体28に取付けるとともにこの
移動体28をシリング−装置29またはソレノイドにて
駆動するように構成され、ソレノイド27とシリング−
!!装29の出退動作を組み合わせて送り爪17を矩形
状に移動させるように構成されている。また、前記位置
規制手段20もこの間欠移送装!!18の動作板とソレ
ノイドからなる構成と同様の構成である。
In addition, the intermittent transfer device 18 has an operating plate 26 on which a pair of feed pawls 17 are protruded, attached to the upper end of the output wheel of a solenoid 27 of the upper and lower drive layers, so that the solenoid 27 can be moved in the front and back direction of the transfer path. It is attached to a moving body 28 and is configured to drive this moving body 28 with a Schilling device 29 or a solenoid.
! ! It is configured to move the feeding claw 17 in a rectangular shape by combining the moving and retracting operations of the gear 29. Moreover, the position regulating means 20 is also this intermittent transfer device! ! This configuration is similar to the configuration of No. 18 consisting of an operating plate and a solenoid.

30はシールテープ5を剥離された後、移送経 。30 shows the transport process after the seal tape 5 is peeled off.

路上を移動する部品集合体1の上面を覆う案内板で、前
記センサ19及びピックアップ手段21の部分は開口さ
れている。
The guide plate covers the upper surface of the parts assembly 1 moving on the road, and the sensor 19 and the pickup means 21 are opened.

以上の構成において、部品集合体1を七ツ)して電子部
品4を基板に装着するには、部品集合体1を巻き取った
り−ル8を支持手段12にセットし、部品集合体1の先
端部を引き出して送出装置13の一対の送りローラ間に
差し込む、すると、送出装r!t13が作動して部品集
゛合体1の送り出しが開始され、部品集合体1の先端が
センサ14にて検知されると、シールテープ剥離装置1
6が作。
In the above configuration, in order to mount the electronic component 4 on the board by rolling up the component assembly 1, the component assembly 1 is wound up and the loop 8 is set on the support means 12, and the component assembly 1 is rolled up. Pull out the tip and insert it between the pair of feed rollers of the feed device 13, then the feed device r! t13 is activated to start feeding out the parts assembly 1, and when the tip of the parts assembly 1 is detected by the sensor 14, the seal tape peeling device 1
Made by 6.

動し、真空ドラム15が吸着機能を持って回転するとと
もにカッター24が作動する。従って、部品集合体1の
先端部が真空ドラム15の下に位置すると、そのシール
テープ5が真空ドラム15に吸着されてその周面に沿っ
て巻き取られるように移動し、一方部品集合体1はその
まま移送経路に沿って移動するため、シールテープ5は
部品集合体1から剥離され、さらに排出手段23にて真
空ドラム15から引き剥がされてカッター24にて切断
さhる。なお、部品集合体1の先端部は予めシールテー
プ5を剥がしておくのが好ましい、シールテープ5を剥
離された部品集合体1の先端が移送装置18の位置まで
送り込まれると、センサ19にて検知され、送出装置1
3による送りが停止され、間欠移送装置18が作動して
部品集合体1は所定ピッチづつ間欠移送される。即ち、
ツレ/イド27とシリング−装置29の出退動作によっ
て送り爪17が矩形状に移動することによって、送り爪
17が上昇して送り孔7に係合した状態で前進動作する
行程で部品集合体1が1ピツチづつ送られるのである。
The vacuum drum 15 rotates with a suction function, and the cutter 24 operates. Therefore, when the tip of the parts assembly 1 is located under the vacuum drum 15, the sealing tape 5 is attracted to the vacuum drum 15 and moves to be wound up along the circumferential surface of the vacuum drum 15, while the parts assembly 1 Since the sealing tape 5 continues to move along the transfer route, it is peeled off from the parts assembly 1, further peeled off from the vacuum drum 15 by the discharge means 23, and cut by the cutter 24. It is preferable to remove the sealing tape 5 from the tip of the parts assembly 1 in advance. When the tip of the parts assembly 1 from which the sealing tape 5 has been removed is fed to the position of the transfer device 18, the sensor 19 Detected and sent out device 1
3 is stopped, and the intermittent transfer device 18 is activated to intermittently transfer the parts assembly 1 at a predetermined pitch. That is,
As the feed pawl 17 moves in a rectangular shape due to the movement of the thread/id 27 and the silling device 29, the feed pawl 17 moves upward and engages with the feed hole 7, and moves forward to assemble the parts. 1 is sent one pitch at a time.

また送り爪17が下降位置に移動する際には位置規制手
段20が上昇位置になってその爪が送り孔7に係合する
ことによって部品集合体1が動かないように位置規制さ
れる。こうして、部品集合体1が1ピツチづつ順次送ら
れ、その部品収容部3内の電子部品4がピックアップ手
段21の位置に達すると、このピックアップ手段21に
よって吸着されて取り出され、図外の基板上に装着され
るのである。
Further, when the feed claw 17 moves to the lowered position, the position regulating means 20 moves to the raised position and the claw engages with the feed hole 7, thereby regulating the position of the component assembly 1 so that it does not move. In this way, the component assembly 1 is sent one pitch at a time, and when the electronic component 4 in the component storage section 3 reaches the position of the pickup means 21, it is sucked and taken out by the pickup means 21, and placed on a board (not shown). It is installed on the

リール8の部品集合体1が無くなると、センサ14又は
19にて検知されるので、上記と同様に直ちに新たなり
−ル8を支持装置12にセットしてその先端部を送出装
置13に差し込めばよい。
When the component assembly 1 of the reel 8 runs out, it is detected by the sensor 14 or 19, so if you immediately set a new reel 8 on the support device 12 and insert its tip into the delivery device 13 in the same way as above, good.

本発明は上記実施例に示す外、種々の態様に構成するこ
とができる0例えば、上記実施例では部品集合体1の移
送手段として送出装置13と間欠移送装置18を併用し
たものを例示したが、移送経路の始端に単一の移送手段
を配置してもよい。
The present invention can be configured in various ways other than those shown in the above embodiments. For example, in the above embodiment, the delivery device 13 and the intermittent transfer device 18 are used together as a means for transferring the parts assembly 1. , a single transport means may be arranged at the beginning of the transport path.

また、上記実施例のシールテープ剥離装置16において
は、剥離したシールテープ5をカッター24で切断する
ものを例示したが、そのまま溜めて廃棄するようにして
もよい、また、移送装置18としては送り爪17を矩形
状に移動させる方式のものを例示したが、周囲に送り爪
を有する間欠回転体を用いてもよく、その場合部品集合
体1の送り孔7に送り爪を最初に位置合わせして係合さ
せるためにはこの間欠回転体を昇降可能に構成するのが
最も確実である。
Further, in the seal tape peeling device 16 of the above embodiment, the peeled seal tape 5 is cut by the cutter 24, but it may be collected and discarded as is. Although a type of movement of the pawl 17 in a rectangular shape is illustrated, an intermittent rotating body having a feed pawl around the periphery may be used. In that case, the feed pawl is first aligned with the feed hole 7 of the parts assembly 1. In order to achieve this engagement, it is most reliable to construct this intermittent rotating body so that it can be moved up and down.

発明の効果 本発明は上記構成を有するので、新たな部品集合体に交
換するときに、部品集合体を巻き取ったリールをセット
して移送手段にて移送するようにするだけで、移送中に
真空ドラムでシールテープを吸着して剥離することがで
き、従来のように部品集合体のシールテープのj!1部
を巻取装置等にセットする作業が不要であるので、部品
集合体の交換作業に要する時間を大幅に短縮することが
でき、それだけ非稼動時間を短縮で訃る。また交換作業
が単純であるため、自動化も可能となる。さらに、部品
集合体はリールに巻き取っただけの形態で供給すればよ
いので、軽量安価で、余計な手間も一切不要であるとい
う効果がある。
Effects of the Invention Since the present invention has the above configuration, when replacing the parts assembly with a new part assembly, all that is required is to set the reel on which the parts assembly has been wound up and transport it by the transport means, and during the transport, The seal tape can be adsorbed and peeled off using a vacuum drum. Since there is no need to set one part on a winding device or the like, the time required to replace the parts assembly can be significantly reduced, and the non-operating time can be reduced accordingly. Furthermore, since the replacement work is simple, automation is also possible. Furthermore, since the parts assembly can be supplied in the form of just being wound onto a reel, it is lightweight and inexpensive, and there is no need for any extra effort.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の縦断側面図、第2図はその
要部の斜視図、第3図は従来例の縦断側面図である。 1・・・部品集合体 3・・・部品収寥部 4・・・部品 5・・・シールテープ 8・・・リール 10・・・部品供給装置 12・・・支持手段 13・・・送出装置 15・・・真空ドラム 16・・・シールテープ剥離装置 18・・・間欠移送装置
FIG. 1 is a longitudinal sectional side view of an embodiment of the present invention, FIG. 2 is a perspective view of its essential parts, and FIG. 3 is a longitudinal sectional side view of a conventional example. 1... Parts assembly 3... Parts receiving section 4... Parts 5... Seal tape 8... Reel 10... Parts supply device 12... Support means 13... Delivery device 15... Vacuum drum 16... Seal tape peeling device 18... Intermittent transfer device

Claims (2)

【特許請求の範囲】[Claims] (1)長手方向に沿って多数形成された部品収容部内に
部品を収容し部品収容部の開口部をシールテープで覆っ
てなるテープ状の部品集合体を巻き取ったリールを回転
自在に支持する支持手段を設け、前記リールから部品集
合体を引き出して移送する移送手段を設け、部品集合体
の移送経路上に部品収容部内の部品をピックアップする
ピックアップ装置を設けるとともに部品のピックアップ
位置よりも移送方向手前位置にシールテープを吸着して
剥離する真空ドラムを備えた剥離装置を設けたことを特
徴とする部品供給装置。
(1) Components are accommodated in a large number of component accommodating sections formed along the longitudinal direction, and the openings of the component accommodating sections are covered with sealing tape. A reel is rotatably wound around a tape-shaped component assembly. A support means is provided, a transfer means is provided for pulling out and transferring the component assembly from the reel, and a pickup device for picking up the components in the component storage section is provided on the transfer path of the component assembly, and the transfer direction is further than the pickup position of the components. A parts supply device characterized by having a peeling device equipped with a vacuum drum that attracts and peels a seal tape at a front position.
(2)移送手段が、間欠移送装置と部品集合体の先端部
を間欠移送装置まで送り出す送出装置とからなる特許請
求の範囲第1項記載の部品供給装置。
(2) The component supply device according to claim 1, wherein the transfer means comprises an intermittent transfer device and a delivery device that sends out the leading end of the component assembly to the intermittent transfer device.
JP60142942A 1985-06-28 1985-06-28 Parts feeder Expired - Lifetime JPH0671156B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60142942A JPH0671156B2 (en) 1985-06-28 1985-06-28 Parts feeder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60142942A JPH0671156B2 (en) 1985-06-28 1985-06-28 Parts feeder

Publications (2)

Publication Number Publication Date
JPS622690A true JPS622690A (en) 1987-01-08
JPH0671156B2 JPH0671156B2 (en) 1994-09-07

Family

ID=15327229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60142942A Expired - Lifetime JPH0671156B2 (en) 1985-06-28 1985-06-28 Parts feeder

Country Status (1)

Country Link
JP (1) JPH0671156B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123306U (en) * 1988-02-15 1989-08-22

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5735942U (en) * 1980-08-05 1982-02-25
JPS57155800A (en) * 1981-03-20 1982-09-25 Fujitsu Ltd Method of isolating taping element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5735942U (en) * 1980-08-05 1982-02-25
JPS57155800A (en) * 1981-03-20 1982-09-25 Fujitsu Ltd Method of isolating taping element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123306U (en) * 1988-02-15 1989-08-22

Also Published As

Publication number Publication date
JPH0671156B2 (en) 1994-09-07

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