JP2001326254A - Apparatus and method for carrying tape-like circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for carrying a tape-like circuit board stably to/from a mounting position and a part mounter comprising that carrying apparatus. SOLUTION: A tape-like circuit board 4A rewound from a supply side reel 12 and imparted with a tension by a first tension roller 44 is positioned at the IC chip mounting position of a mounting table 13. An IC chip is then fixed to the tape-like circuit board and the board is entrained about a sprocket 49 at the feed-out position before being imparted with a tension by a second tension roller 46 and wound around a reel 11 on the containing side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape-shaped circuit board transfer device for loading and unloading a tape-shaped circuit board as an example of a film-shaped circuit board on which electronic components such as IC chips are mounted to and from an electronic component mounting position. And a component mounting apparatus provided with the tape-shaped circuit board transfer device.

[0002]

2. Description of the Related Art Conventionally, when electronic components are mounted on a substrate,
The substrate is generally transported to a predetermined position by a conveyor. More specifically, as shown in FIG. 33, the substrate 125 is loaded into the stage 121 by the loader 120, the loaded substrate 125 is positioned on the stage 121, and then the stage 121 is raised to move the substrate 125 to the electronic component mounting position. After that, the electronic component 1 held by the head 123 with respect to the substrate 125 positioned on the stage 121
24 is mounted. After the mounting, the stage 121 is lowered, and then the substrate 125 on which the components are mounted is unloaded from the stage 121 by the unloader 122.

[0003]

However, in the above-described structure, when the substrate is a thin substrate having a thickness of, for example, about 50 μm, the load of the loader 120 or the unloader 122 can be stabilized by the low rigidity. It is difficult to convey by a conveyor such as. In addition, there is also a problem that it takes a long time to replace the substrate to prevent the thin substrate from being damaged, and it takes tact. Also, there is a problem that it is difficult to handle the thin substrate in the pre-process and post-process of mounting.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, and to provide a tape-shaped circuit board transport apparatus and method capable of stably loading and unloading a tape-shaped circuit board with respect to a mounting position, and the above-mentioned method. An object of the present invention is to provide a component mounting apparatus including a tape-shaped circuit board transport device.

[0005]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, after the gold bumps of the electrodes of the IC chip are aligned with the electrodes of the tape-shaped circuit board positioned at the IC chip mounting position, the electrodes of the IC chip are positioned. When applying the ultrasonic wave while applying the ultrasonic wave while pressing the gold bumps to the electrodes of the tape-shaped circuit board, and mounting the IC chip on the tape-shaped circuit board, mounting the tape-shaped circuit board on the IC chip A tape-shaped circuit board transfer device for transferring to a position,
A supply-side reel fitting / holding section for detachably fitting / holding a supply-side reel for rewinding the tape-shaped circuit board, and a storage-side reel for detachably fitting / holding a storage-side reel for winding the tape-shaped circuit board. The tape-shaped circuit that is movable between the fitting holding portion and the drawn-out position and the undrawn position, and that the tape-shaped circuit board unwound from the supply-side reel is wound by the storage-side reel. A circuit board drawer sprocket which is arranged on a transfer path for transferring the substrate and can transfer the tape-like circuit board, and the tape-like circuit board between the supply reel and the circuit board drawer sprocket is wound around. Tension on the tape-like circuit board, and a predetermined range along the moving direction of the sprocket for drawing out the circuit board according to the tension of the tape-like circuit board. A first tension roller that can move forward and backward within the tape-like circuit board between the circuit board drawer sprocket and the storage side reel is hung around to apply tension to the tape-like circuit board, and A second tension roller capable of moving forward and backward within a predetermined range along a moving direction of the circuit board drawer sprocket in accordance with a tension of the tape-shaped circuit board; and a position of the first tension roller and a position of the second tension roller. A detecting device for detecting a transport state of the tape-shaped circuit board by a tension exerted by the first tension roller or the second tension roller based on the position, (1) The tape-like circuit board to which the tension is applied by the tension roller is put on the sprocket at the pull-out position. To be before and a positioning holding capable loading stand by the IC chip mounting position,
After aligning the electrodes of the tape-shaped circuit board positioned at the IC chip mounting position with the gold bumps of the electrodes of the IC chip, the gold bumps of the electrodes of the IC chip are taped to the tape. After applying ultrasonic waves while applying pressure to the electrodes of the circuit board, ultrasonic bonding is performed, and the IC chip is mounted on the tape circuit board, and then the tape circuit board on which the IC chip is mounted is mounted on the tape circuit board. The present invention provides a tape-shaped circuit board transfer device, wherein after being wound around the sprocket at the pull-out position, the tension is applied by the second tension roller to be wound around the storage-side reel.

According to a second aspect of the present invention, a first urging member for urging the first tension roller to its initial position and a second urging member for urging the second tension roller to its initial position And a first sensor for detecting whether the first tension roller is at an initial position farthest from the sprocket within the predetermined range, and the second tension roller includes: A second sensor for detecting whether or not the initial position is farthest from the sprocket within a predetermined range, and the first tension roller is positioned at the initial position by the urging force of the first urging member. When the first sensor detects that the tension is applied to the tape-like circuit board between the supply-side reel and the sprocket for drawing out the circuit board. On the other hand, when the first sensor detects that the first tension roller is displaced from the initial position against the urging force of the first urging member, the supply-side reel and the circuit board It is determined that the tension acts on the tape-shaped circuit board between the pull-out sprocket and the tape-like circuit board, and the urging force of the second urging member positions the second tension roller at the initial position. And when detected by the second sensor, the tension is not applied to the tape-shaped circuit board between the sprocket for drawing out the circuit board and the storage-side reel, while the urging force of the second urging member is not applied. When the second sensor detects that the second tension roller is displaced from the initial position, the circuit board withdrawal sprocket and the The above-mentioned tape circuit substrate between the pay side reel to provide a tape-like circuit board conveying device according to the first aspect which is adapted to determine the above tension is acting.

According to a third aspect of the present invention, the inspection device includes a third sensor for detecting whether or not the first tension roller is located closest to the sprocket within the predetermined range, A fourth sensor for detecting whether or not the second tension roller is located closest to the sprocket within the predetermined range, wherein the first tension roller is provided along a moving direction of the sprocket for drawing out the circuit board. When it is located at a position closest to the sprocket within the predetermined range, it is determined that the urging force of the first urging member has stopped acting,
When the second tension roller is located at a position closest to the sprocket within the predetermined range along the moving direction of the sprocket for drawing out the circuit board, it is determined that the urging force of the second urging member has stopped acting. The tape-like circuit board transport device according to the first or second aspect is provided.

According to a fourth aspect of the present invention, a leader tape is provided at the tip of the tape-shaped circuit board, and the leader tape is first rewound from the supply side reel, and the first tension roller, The tape-shaped circuit board conveying device according to any one of the first to third aspects, wherein the tape-shaped circuit board conveying device is configured to be wound around the sprocket and the second tension roller and wound around the storage-side reel.

According to a fifth aspect of the present invention, a leader tape is provided at a rear end of the tape-shaped circuit board, and the tape-shaped circuit board is wound around the storage-side reel, and thereafter, the leader tape at the rear end is provided. Finally, the tape-shaped circuit board transport device according to any one of the first to fourth aspects, wherein the tape-shaped circuit board transport device is wound around the storage-side reel.

According to a sixth aspect of the present invention, there is further provided a leader tape detecting device for detecting a leader tape, and when the leader tape detecting device detects the leader tape at the rear end of the tape-shaped circuit board, A tape-like circuit board transport device according to a fifth aspect, wherein a sprocket is moved from the drawn position to the undrawn position, and then the leader tape is wound around the storage-side reel.

According to a seventh aspect of the present invention, there is provided a first driving device for moving the sprocket between the extracted position and the unextracted position, the mounting table, and
When the sprocket is moved from the undrawn position to the drawn position by the first driving device, the mounting table unit moves along the direction of movement of the sprocket integrally with the sprocket; and the mounting table unit is provided with the mounting table unit; After the sprocket is located at the pull-out position, the sprocket is rewound from the supply reel and the first
Positioning the mounting table at the IC chip mounting position before being wound around the sprocket with respect to the tape-shaped circuit board to which the tension is applied by a tension roller;
A tape-shaped circuit board transport device according to any one of the first to fifth aspects, further comprising a drive device.

According to an eighth aspect of the present invention, the tape-shaped circuit board is sucked and fixed and held by a vacuum suction groove formed in the surface of the mounting table, and the tape-shaped circuit board is mounted when the IC chip is mounted. Any one of the first to sixth aspects, wherein the tape-shaped circuit board is positioned so as not to move, and air is blown when the tape-shaped circuit board is transported so that the tape-shaped circuit board is lifted from the surface of the mounting table. According to one embodiment, there is provided a tape-shaped circuit board transfer device.

According to a ninth aspect of the present invention, when the sprocket is moved from the undrawn position to the drawn position, the supply-side reel is rotated in a direction in which the tape-shaped circuit board is rewound so that the tape-shaped circuit board is rotated. When unwinding the circuit board and rotating the storage side reel in the unwinding direction of the tape-shaped circuit board to rewind the tape-shaped circuit board, while moving the sprocket from the drawn position to the undrawn position The tape-shaped circuit board is wound by rotating the supply-side reel in a direction in which the tape-shaped circuit board is wound, and the storage-side reel is rotated in a direction in which the tape-shaped circuit board is wound. A tape-shaped circuit board transport device according to any one of the first to eighth aspects, wherein the circuit board is wound up. .

According to a tenth aspect of the present invention, the tape-shaped circuit board has sprocket engagement holes at predetermined intervals, and can be conveyed at a predetermined pitch by engaging with the sprocket. A tape-like circuit board conveying device according to any one of the aspects is provided.

According to an eleventh aspect of the present invention, the electrodes of the tape-shaped circuit board are aluminum electrodes.
The present invention provides a tape-like circuit board transport device according to any one of the aspects.

According to a twelfth aspect of the present invention, there is provided the tape-like circuit board conveying apparatus according to any one of the first to eleventh aspects, wherein the tape-like circuit board has a thickness of 0.2 mm or less.

According to a thirteenth aspect of the present invention, the tape-like circuit board transport according to any one of the first to eleventh aspects, wherein the tape-like circuit board is an insulator substrate having a thickness of 0.2 mm or less. Provide equipment.

According to a fourteenth aspect of the present invention, the tape-shaped circuit board travels between the circuit board drawing sprocket and the first tension roller and between the circuit board drawing sprocket. The tape-like circuit board conveying device according to any one of the first to thirteenth aspects, further comprising a third tension roller for maintaining a path substantially parallel to a moving direction of the circuit board drawing sprocket.

According to a fifteenth aspect of the present invention, the first to fourteenth embodiments
And an IC chip joined body in which the IC chip is joined to the tape-shaped circuit board conveyed by any one of the tape-shaped circuit board conveying devices.

According to a sixteenth aspect of the present invention, there is provided the IC chip assembly according to the fifteenth aspect, wherein the IC chip is a memory for an IC card.

According to a seventeenth aspect of the present invention, the first to fourteenth embodiments
A component mounting apparatus, comprising the tape-shaped circuit board transport device according to any one of the above aspects, wherein the component mounting apparatus joins and mounts the IC chip on the tape-shaped circuit board transported by the tape-shaped circuit substrate transport device. I do.

According to an eighteenth aspect of the present invention, after the gold bumps of the electrodes of the IC chip and the electrodes of the tape-shaped circuit board positioned at the IC chip mounting position are aligned, the electrodes of the IC chip are aligned. When applying the ultrasonic wave while pressing the gold bumps against the electrodes of the tape-shaped circuit board and performing ultrasonic bonding, and mounting the IC chip on the tape-shaped circuit board, mounting the tape-shaped circuit board on the IC chip A tape-like circuit board carrying method for carrying to a position, wherein a supply-side reel for rewinding the tape-like circuit board is detachably fitted to and held by a supply-side reel fitting holding section, and a storage-side reel fitting and holding. The storage-side reel that winds up the tape-shaped circuit board is detachably fitted and held in the section, and the tape-shaped circuit board unwound from the supply-side reel is held in the storage-side reel. A circuit board drawer sprocket, which is arranged on a transfer path for transferring the tape-like circuit board so as to be wound up and can transfer the tape-like circuit board, is moved from an undrawn position to a drawn position, and the supply reel and the The tape-shaped circuit board between the sprocket for drawing out the circuit board is wound around a first tension roller to apply tension to the tape-shaped circuit board, and the circuit board is drawn out according to the tension of the tape-shaped circuit board. The first tension roller can move forward and backward within a predetermined range along the moving direction of the sprocket, and the tape-shaped circuit board between the sprocket for drawing out the circuit board and the storage side reel is hung on a second tension roller. Turned to give tension to the tape-like circuit board,
The second tension roller can be moved forward and backward within a predetermined range along the moving direction of the circuit board drawer sprocket according to the tension of the tape-shaped circuit board, and the first tension roller is rewound from the supply side reel. Before hanging the tape-shaped circuit board to which the tension is applied on the sprocket at the pull-out position, the tape-shaped circuit board can be positioned and held on the mounting table at the IC chip mounting position, and the position of the first tension roller and the second Based on the position of the tension roller, the detecting device detects the transport state of the tape-shaped circuit board due to the tension applied by the first tension roller or the second tension roller, and detects the transport state of the tape-shaped circuit board at the IC chip mounting position. The gold van of the positioned electrode of the tape-shaped circuit board and the electrode of the IC chip Then, while pressing the gold bumps of the electrodes of the IC chip against the electrodes of the tape-shaped circuit board, ultrasonic waves are applied and ultrasonically bonded to join the IC chip to the tape-shaped circuit board. Then, the tape-shaped circuit board on which the IC chip is mounted is wrapped around the sprocket at the pull-out position, and the tension is applied by the second tension roller, and the tape is wound around the storage side reel. And a method of transporting a tape-shaped circuit board, characterized in that

According to a nineteenth aspect of the present invention, the first tension roller is urged to its initial position by the first urging member, and the second tension roller is urged to its initial position by the second urging member. While urging, the inspection device detects whether the first tension roller is at an initial position farthest from the sprocket within the predetermined range by a first sensor, and the second tension roller detects whether the first tension roller is at the initial position. The second sensor detects whether or not the initial position farthest from the sprocket within a predetermined range is detected by the second sensor.
When the first sensor detects that the first tension roller is located at the initial position by the urging force of the urging member, the tape-shaped portion between the supply reel and the circuit board drawing sprocket. When the first sensor detects that the first tension roller is displaced from the initial position against the urging force of the first urging member while the tension does not act on the circuit board,
It is determined that the tension acts on the tape-like circuit board between the supply reel and the circuit board drawing sprocket, and the second tension roller is actuated by the urging force of the second urging member. When the second sensor detects that the tape-like circuit board is located at the initial position, the tension is not applied to the tape-like circuit board between the circuit board drawer sprocket and the storage-side reel. (2) When the second sensor detects that the second tension roller is displaced from the initial position against the urging force of the urging member, the circuit board drawer sprocket and the storage side reel are displaced. An eighteenth aspect provides the method of transporting a tape-like circuit board according to the eighteenth aspect, wherein it is determined that the tension acts on the tape-like circuit board in between.

According to a twentieth aspect of the present invention, the inspection device detects whether or not the first tension roller is located closest to the sprocket within the predetermined range with the third sensor. A fourth sensor detects whether or not the second tension roller is positioned closest to the sprocket within the predetermined range, and the first tension roller determines whether or not the first tension roller moves along the moving direction of the circuit board withdrawal sprocket. When it is located at the position closest to the sprocket within the range, it is determined that the urging force of the first urging member has stopped acting,
When the second tension roller is located at a position closest to the sprocket within the predetermined range along the moving direction of the sprocket for drawing out the circuit board, it is determined that the urging force of the second urging member has stopped acting. The method for transporting a tape-like circuit board according to the eighteenth or nineteenth aspect is provided.

According to a twenty-first aspect of the present invention, a leader tape is provided at the leading end of the tape-like circuit board, and the leader tape is first rewound from the supply-side reel, and the first tension roller, The sprocket, the second
The tape-like circuit board transport method according to any one of the eighteenth to twentieth aspects, wherein the tape-like circuit board transport method is configured to be wound around a tension roller and wound around the storage-side reel.

According to a twenty-second aspect of the present invention, a leader tape is provided at a rear end of the tape-shaped circuit board, and the tape-shaped circuit board is wound around the storage side reel, and then the leader tape at the rear end is provided. Finally, the tape-shaped circuit board transport method according to any one of the eighteenth to twenty-first aspects, wherein the tape-shaped circuit board transport method is wound around the storage-side reel.

According to a twenty-third aspect of the present invention, when the leader tape detecting device detects the leader tape at the rear end of the tape-shaped circuit board, the sprocket is moved from the drawn position to the undrawn position. And a tape-like circuit board transport method according to the twenty-second aspect, wherein the leader tape is wound around the storage-side reel.

[0029] According to a twenty-fourth aspect of the present invention, the sprocket is moved by the first driving device between the pulled-out position and the undrawn position, and has the mounting base, and the first driving device. When moving the sprocket from the undrawn position to the drawn position, the mounting table unit is moved along the moving direction of the sprocket integrally with the sprocket, and the mounting table unit is provided, and the sprocket is mounted on the mounting table unit. After being located at the pull-out position, the IC chip mounting position before being wound around the sprocket with respect to the tape-like circuit board to which the tension is applied by the first tension roller after being rewound from the supply-side reel, According to any one of the eighteenth to twenty-second aspects, the mounting table is positioned by the second driving device. To provide a tape-like circuit board transfer method.

According to a twenty-fifth aspect of the present invention, the tape-shaped circuit board is sucked and fixed and held by a vacuum suction groove formed in the surface of the mounting table, and the tape-shaped circuit board is mounted when the IC chip is mounted. In order to move the tape-shaped circuit board so that the tape-shaped circuit board cannot be moved, air blowing is performed when the tape-shaped circuit board is transported, so that the tape-shaped circuit board is lifted from the surface of the mounting table.
24. The method for transporting a tape-shaped circuit board according to any one of the twenty-fourth aspects.

According to a twenty-sixth aspect of the present invention, when the sprocket is moved from the undrawn position to the drawn position, the supply-side reel is rotated in a direction in which the tape-shaped circuit board is rewound and the tape-shaped circuit board is rotated. When unwinding the circuit board and rotating the storage side reel in the unwinding direction of the tape-shaped circuit board to rewind the tape-shaped circuit board, while moving the sprocket from the drawn position to the undrawn position The tape-shaped circuit board is wound by rotating the supply-side reel in a direction in which the tape-shaped circuit board is wound, and the storage-side reel is rotated in a direction in which the tape-shaped circuit board is wound. The method for transporting a tape-shaped circuit board according to any one of the eighteenth to twenty-fifth aspects, wherein the circuit board is wound up. Subjected to.

According to a twenty-seventh aspect of the present invention, the tape-shaped circuit board has sprocket engagement holes at predetermined intervals, and can be engaged with the sprocket and conveyed at predetermined pitches. A method for transporting a tape-like circuit board according to any one of aspects is provided.

[0033] According to a twenty-eighth aspect of the present invention, the electrodes of the tape-shaped circuit board are aluminum electrodes.
7. A method for transporting a tape-like circuit board according to any one of aspects 7 to 7.

According to a twenty-ninth aspect of the present invention, there is provided the tape-like circuit board conveying method according to any one of the eighteenth to twenty-eighth aspects, wherein the tape-like circuit board has a thickness of 0.2 mm or less.

According to a thirtieth aspect of the present invention, the tape-shaped circuit board transport according to any one of the eighteenth to twenty-eighth aspects, wherein the tape-shaped circuit board is an insulating substrate having a thickness of 0.2 mm or less. Provide a way.

[0036]

Embodiments of the present invention will be described below in detail with reference to the drawings.

First, a method of bonding an IC chip to a tape-like circuit board drawn out by the tape-like circuit board conveying apparatus and method according to the first embodiment of the present invention will be described.

As shown in FIGS. 1 and 2, the bonding method of the IC chip to the tape-shaped circuit board is as follows: each of the gold bumps 3 of the electrode 2 of the IC chip 1 and the aluminum electrode 5 of the tape-shaped circuit board 4A. Then, each of the gold bumps 3 of the electrodes 2 of the IC chip 1 is pressed against each of the electrodes 5 of the tape-shaped circuit board 4A, and ultrasonic waves are applied thereto to heat them. Ultrasonic bonding is performed by melting at the interface between the gold bump 3 and the electrode 2 at the bonding portion and performing metal intermolecular bonding. The IC chip joined body manufactured by joining in this manner is used for, for example, a memory of an IC card.

Gold bumps 3 are formed on the electrodes 2 of the IC chip 1 by a known bump bonding method or the like.

On the other hand, the tape-shaped circuit board 4A is, for example,
It is a thin tape-shaped circuit board having a thickness of 0.2 mm or less, and specific examples thereof include an insulating substrate such as polyethylene terephthalate (PET) resin, polyimide resin, and vinyl chloride resin having a thickness of 0.2 mm or less; It is an insulating substrate made of, for example, polyethylene terephthalate (PET) resin having a thickness of 05 mm, and a predetermined pattern of, for example, an aluminum electrode 5 is formed on the surface thereof. Examples of such patterns include a combination of a pair of rectangular electrodes 5a, 5a as shown in FIG. 3A, and a pair of right-angled triangular electrodes 5c, 5c as shown in FIG. No. In the pair of rectangular electrodes 5a, 5a in FIG. 3A, the length D in the longitudinal direction is set to, for example, 0.1 mm or more on one side of the IC chip 1, and in the pair of rectangular electrodes 5c, 5c in FIG. 5c, the dimension D in the longitudinal direction of the overlapping area is shown.
Is the dimension of one side of the IC chip 1, for example, 0.1 mm or more. In addition, the material of the insulator of the tape-shaped circuit board 4A is not limited to polyethylene terephthalate (PET) resin, and any material such as polyimide resin and vinyl chloride resin can be used.

The tape-shaped circuit board 4A is connected in a tape shape, wound around a reel or the like, and supplied in a reel-type supply form.
The C chip 1 is mounted.

FIG. 4 shows an example of the tape-shaped circuit board 4A. In FIG. 4, a plurality of sprocket engagement holes 4a,..., 4a are formed on both sides at predetermined intervals along the longitudinal direction, and the sprocket engagement holes 4a,.
By engaging a sprocket 49 described later,
The tape-like circuit board 4A can be transported and supplied at predetermined pitches. In the present embodiment, three electrode forming regions 4d, 4d, 4d are arranged in the width direction of the tape-shaped circuit board 4A.
Are arranged, and a pair of rectangular electrodes 5a, 5a shown in FIG. 3A are arranged at intervals in each electrode forming region 4d. A pitch detection hole 4b is formed in a pattern (however, it may be formed through) at the center between the electrode forming regions 4d, 4d adjacent in the width direction.
.., 4b are counted so that the transport amount of the tape-shaped circuit board 4A is calculated by the control device 1000. When the tape-shaped circuit board 4A is transported, the tape-shaped circuit board 4A is fed at a predetermined pitch. That can be detected. Therefore, the pitch detection holes 4b,.
The position of the electrode forming region 4d can be recognized by counting the number of the electrodes and recognizing the position of the electrode forming region 4d.

Instead of counting the number of pitch detection holes 4b,..., 4b, sprocket engagement holes 4a,
, 4a may be counted to recognize the position of the electrode forming region 4d, so that the position of the electrode forming region 4d can be recognized. In this case, for example, a multiple of the pitch of the sprocket engagement holes 4a,..., 4a may be set as the pattern pitch of the electrode forming region 4d. Also, instead of counting the number of sprocket engagement holes 4a,..., 4a, a recognition mark 4c is formed at the center between electrode forming regions 4d, 4d adjacent in the longitudinal direction, and the recognition mark 4c is detected. Thus, the position of the electrode forming region 4d may be recognized.

Next, FIG. 6 shows an outline of the tape-shaped circuit board transfer apparatus and method according to the first embodiment. As shown in FIG. 6, the tape-like circuit board 4A is supplied in a state where the tape-like circuit board 4A is wound on the tape supply-side reel 12 in advance, and the mounting table is rewound toward the tape storage-side reel 11. The IC chip 1 is mounted on the predetermined electrode 5 of the tape-shaped circuit board 4A on the board 13. That is, the processing is generally performed as follows.

First, the sprocket 49 is engaged with the sprocket engagement holes 4a,..., 4a of the tape-shaped circuit board 4A from the tape supply side reel 12 on which the tape-shaped circuit board 4A is wound in a tape shape, and is intermittently rotated. By doing so, the tape-shaped circuit board 4 </ b> A is taken up on the tape storage side reel 11 intermittently at predetermined pitches while being rewound and pulled out. At this time, a portion where the IC chip 1 is to be mounted is positioned on the mounting table 13.

Next, the IC chip 1 is sucked and held by a suction nozzle 15 as shown in FIG.

Next, the gold bump 3 of the electrode 2 of the IC chip 1 sucked and held by the suction nozzle 15 and the tape supply side reel 12 are intermittently rewound at predetermined intervals and positioned on the mounting table 13. The electrodes 5 of the tape-shaped circuit board 4A are aligned with each other.

After that, while pressing the gold bumps 3 of the electrodes 2 of the IC chip 1 against the electrodes 5 of the tape-like circuit board 4A, the ultrasonic horn is used to suck the IC chip 1 through the suction nozzle 15.
Gold bump 3 of electrode 2 and electrode 5 of tape-shaped circuit board 4A
Ultrasonic waves are applied to the joint portion with the above to perform ultrasonic joining. The mounted state is shown in FIG. In FIG. 5, the positions of the gold bumps 3 on the electrodes 2 of the IC chip 1 are shown in a perspective view for easy understanding. By this joining operation, the pair of left and right gold bumps 3 is joined to each rectangular electrode 5a.

Next, after bonding, if there is an IC chip 1 to be mounted next in an area positioned on the mounting table 13, the IC chip 1 is attached to the suction nozzle 15.
To perform the same mounting operation as described above.

By repeating this, when there is no more IC chip 1 to be mounted in the above area, the tape-shaped circuit board 4
The tape-shaped circuit board 4A is intermittently rewound and pulled out from the tape-supply-side reel 12 in which A has been wound in a tape shape at a predetermined interval, and wound around the tape-storage-side reel 11, and the IC chip 1 is then mounted. Another area to be mounted is mounting table 1
3 are positioned. After that, the IC chip 1 is mounted on the other area as described above.

The tape-shaped circuit board 4A having the IC chip mounted thereon, which is manufactured by bonding as described above, is cut into predetermined IC chips to be used as, for example, a memory of an IC card.

FIG. 7 shows a semiconductor mounting apparatus 30 as an example of a component mounting apparatus in which a tape-shaped circuit board conveying apparatus 40 for carrying out the tape-shaped circuit board conveying method according to the above embodiment is incorporated. In addition, the tape-shaped circuit board transfer device 4
0 and each operation of the semiconductor mounting device 30
00 is controlled (see FIG. 30).

The semiconductor mounting device 30 includes a wafer storage device 101, a wafer expanding unit 102, a wafer recognition unit 103, an IC chip unloading and reversing device 1
04, an XY robot 105, and an ultrasonic horn mounting head unit 106.

In the wafer storage device 101, a large number of wafers 100,..., 100 are stored, and one wafer 10 taken out of the wafer storage device 101 is stored.
0 is positioned and held by the wafer expanding unit 102. After the wafer 100 held by the wafer expanding unit 102 is recognized by the wafer recognition unit 103,
Wafer 1 held in wafer expanding section 102
From 00, the IC chip take-out and reversing device 104 sucks and holds the IC chip 1 and takes it out, and then the IC chip take-out and reversing device 104 rotates 180 degrees to invert the IC chip 1. IC chip removal and reversing device 1
The IC chip 1 inverted by 04 is the XY robot 1
The suction head 15 is held by the suction nozzle 15 of the ultrasonic horn mounting head 106 movable in the X and Y directions perpendicular to each other by 05, moved along the X-axis direction by the XY robot 105 and positioned on the mounting table 13, and then in a tape shape. The mounting table 13 is transferred by the circuit board transfer device 40 along the Y-axis direction.
The tape-shaped circuit board 4A positioned above is mounted. An operation in which the IC chip 1 is sucked and held by the suction nozzle 15 and moved along the X-axis direction by the XY robot 105 to be positioned on the mounting table 13, and is transferred and mounted along the Y-axis direction by the tape-shaped circuit board transfer device 40. The operation of positioning the tape-shaped circuit board 4A on the table 13 is performed simultaneously in parallel.

As shown in FIG. 8, the tape-shaped circuit board transfer device 40 is fixed to the upper end of the frame 31 and is a disk-shaped supply-side reel fitting and holding rotatable by a tape supply-side reel motor 43. And a disk-shaped storage-side reel fitting and holding section 21 fixed to the lower end of the frame 31 and rotatable by a tape storage-side reel motor 48.
A first tension roller 44 and a second tension roller 46 that are movable and rotatable within a predetermined range with respect to the frame 31, respectively. A third tension roller 45 rotatably supported by the frame 31, a detection device 69 fixed near the center of the frame 31, and the mounting table 13 movable by the mounting table unit 53 with respect to the frame 31. Have. In the drawing, reference numeral 32 denotes an auxiliary guide roller rotatably supported by the frame 31, which assists the tape-shaped circuit board 4A from the sprocket 49 toward the third tension roller 45 in an auxiliary manner.

As shown in FIG. 10A, a portion of the supply-side reel 12 around which the tape-shaped circuit board 4A is wound has a concave portion 12a having a width slightly larger than the width of the tape-shaped circuit board 4A. Thus, the tape-shaped circuit board 4A is prevented from shifting from the supply-side reel 12 in the width direction.
Also, the storage reel 11 has a recess 11a having a width slightly larger than the width of the tape circuit board 4A at a portion where the tape circuit board 4A is wound. 4A does not shift in the width direction. However, the concave portion 11a is further provided with a concave portion 11b for an IC
The IC chip 1 mounted on A is stored so as not to be damaged. Also, two IC chips 1,
1 is mounted on the tape-like circuit board 4A, FIG.
0 (C), two IC chip recesses 11c, 11
c. That is, according to the number of IC chips 1,
The IC chip 1 is provided with a recess for the IC chip at the mounting position.

The disk-shaped supply-side reel fitting holding section 22
The tape supply side reel 12 for rewinding the tape-shaped circuit board 4A is detachably fitted and held, and the supply side reel fitting and holding section 22 is driven by the tape supply side reel motor 43 to drive the tape supply side reel 12. The tape-shaped circuit board 4A is wound from the tape supply reel 12 by being rotationally driven counterclockwise as shown in FIG. Will be returned.

Further, the storage-side reel 11 for winding the tape-shaped circuit board 4A is detachably fitted and held in the disk-shaped storage-side reel fitting / holding section 21, so that a tape storage-side reel motor is provided. By driving 48, the storage-side reel fitting and holding portion 21 is selectively rotated clockwise or counterclockwise integrally with the tape storage-side reel 11, and rotates counterclockwise in FIG. When driven, the tape-shaped circuit board 4A is wound on the storage-side reel 11.

The sprocket 49 for drawing out the circuit board
Is disposed on a transport path of the tape-shaped circuit board 4A, on which the tape-shaped circuit board 4A unwound from the supply-side reel 12 is wound by the storage-side reel 11, in a thickness direction of the tape-shaped circuit board 4A. 9 (that is, left and right positions in FIGS. 16 and 14) and the undrawn position (that is, FIG. 11, FIG. 11). 14 (right end position in FIG. 14).

The movement of the sprocket 49 in the Y-axis direction is controlled by the control device 1000, as shown in FIG. 11, as shown in FIG. , The screw shaft connected to the rotation shaft of the Y-axis drive motor 65 rotates, and the sliding body 61 fixed to the nut screwed to the screw shaft moves forward and backward along the sliding guide rail 60. It is performed by The sliding body 61 is engaged with the sliding guide rail 60 so as to advance and retreat, and the sliding body 61 is guided by the sliding guide rail 60. In FIG.
As shown in FIG. 5, the sprocket 49 is rotatably supported via an upright bracket 62. The rotation axis of the sprocket 49 is arranged along the X-axis direction orthogonal to the Y-axis direction. In the vicinity of the periphery of the sprocket 49, a guide roller 66 is rotatably supported by the bracket 62 so as to prevent the tape-shaped circuit board 4A or a leader tape 4B described later from coming off from the sprocket 49. The sprocket 49 includes the control device 1000
Under the control described above, the sprocket drive motor 50 fixed to the bracket 62 can be driven forward and reverse. The forward rotation by the sprocket drive motor 50 is performed for transporting the tape-shaped circuit board 4A and the like, and
The forward / reverse rotation is performed for fine adjustment of the position of the tape-shaped circuit board 4A. As shown in FIG. 15, a connecting portion 51 on the Y-axis side protrudes and is fixed to the sliding body 61, and can be connected to a connecting portion 52 on the mounting base unit side of the mounting base unit 53 described later. It has become.

On the other hand, the first tension roller 44 is
With respect to the frame 31, the supply-side reel fitting holding section 2
The side opposite to the drawer side of the circuit board drawer sprocket 49 than the line connecting the center axis of the housing 2 and the storage side reel fitting and holding portion 21 (ie, the right side in FIGS. 9 and 14).
Are supported so as to be able to move forward and backward within a predetermined range. The first tension roller 44 is wound around the tape-shaped circuit board 4A from the supply-side reel 12 toward the circuit board draw-out sprocket 49 to apply tension to the tape-shaped circuit board 4A. Circuit board 4A
In accordance with the tension of the circuit board, the circuit board drawer sprocket 49 can be moved forward and backward along the moving direction, and guides the tape-shaped circuit board 4A.

A third tension roller 45 is rotatably fixed to the frame 31 at a predetermined interval on the circuit board drawing sprocket side of the first tension roller 44. The tape-shaped circuit board 4A is wound around the third tension roller 45 from the first tension roller 44 toward the sprocket 49 for drawing out the circuit board, and tension is applied to the tape-shaped circuit board 4A. The circuit board 4A is guided.

The third tension roller 45 keeps the tape-shaped circuit board 4A parallel to the base surface (mounting surface) when the tape-shaped circuit board 4A is pulled out by the sprocket 49. In other words, the third tension roller 45 45
The tape-shaped circuit board 4A is required to maintain the traveling path of the tape-shaped circuit board 4A substantially parallel to the moving direction of the circuit board drawn-out sprocket 49 between the tape-shaped circuit and the circuit board leading-out sprocket 49. If the substrate 4A is not parallel to the base surface (the gantry surface),
Will be interfered when moving the lower part of the tape-shaped circuit board 4A. In order to avoid such interference, it is necessary to arrange the third tension roller 45 to keep the tape-shaped circuit board 4A parallel to the base surface (mounting surface).

The second tension roller 46 is disposed between the frame 31 and the sprocket for drawing out a circuit board from the line connecting the central axes of the supply-side reel fitting and holding portion 22 and the storage-side reel fitting and holding portion 21. On the opposite side of the pull-out side of 49 (that is, on the right side in FIG. 14), it is supported below the first tension roller 44 so as to be able to move forward and backward within a predetermined range. The tape-shaped circuit board 4A is wound around the second tension roller 46 from the circuit-board-drawing sprocket 49 toward the storage-side reel 11 to apply tension to the tape-shaped circuit board 4A, and
In accordance with the tension of the tape-shaped circuit board 4A, the tape-shaped circuit board 4A can be moved forward and backward along the moving direction of the circuit board drawer sprocket 49.

The detecting device 69 detects the transport state of the tape-shaped circuit board 4A based on the position of the first tension roller 44 and the position of the second tension roller 46. More specifically, the detection device 69 includes a supply-side tape-shaped circuit board breakage detection sensor 72, a storage-side tape-shaped circuit board breakage detection sensor 73, a supply-side catch detection sensor 74, a storage-side catch detection sensor 75, and a supply-side First
, A supply-side second direction detection sensor 76B, a storage-side first direction detection sensor 77A, and a storage-side second direction detection sensor 77B. Each of these sensors, as shown in FIG.
Normally, the detection light emitted from the detection light emitting device 84a is received by the detection light receiving device 84b, and the dog 78 is inserted into the gap 84c between the detection light emitting device 84a and the detection light receiving device 84b. Alternatively, when the detection light is blocked by the position of the dog 78 or 79, the presence of the dog 78 or 79 can be detected. When the length of each dog is such that each dog is positioned so as to straddle an adjacent sensor and both ends of each dog can be detected by each sensor, while the central portion of each dog is detected by one sensor The dimensions are set to such an extent that other sensors cannot detect them.

As shown in FIG. 19, a rectangular opening 31 extending in the left-right direction (Y-axis direction) of FIG.
a is formed, and the bearing portion 4 of the first tension roller 44 is formed.
The first spring 70 is provided between the bearing portion 44 a of the first tension roller 44 and the frame 31, and the first spring 70 is constantly moved by the urging force of the first spring 70. Bearing part 4 of one tension roller 44
4a is urged so as to be located in the opening 31a on the side opposite to the drawer side of the circuit board drawer sprocket 49 (ie, on the right side in FIGS. 9, 14 and 19). Further, the bearing portion 4 of the first tension roller 44
The supply side dog 78 is attached to the supply side 4a so as not to rotate, and the supply side dog 78 moves forward and backward integrally with the movement of the first tension roller 44.

Also, a rectangular opening 31b extending in the left-right direction (Y-axis direction) of FIG. 19 is formed below the rectangular opening 31a of the frame 31 at a constant interval from the opening 31a. Bearing portion 46a is movable within the opening 31b, and the second spring 71
Bearing portion 46a of tension roller 46 and frame 31
And the bearing portion 46a of the second tension roller 46 is always in the opening 31b on the side opposite to the drawing side of the sprocket 49 for drawing out the circuit board by the urging force of the second spring 71 (that is, 9, 14 and 19). Further, the storage-side plate-shaped dog 79 is attached to the bearing portion 46a of the second tension roller 46 so as not to rotate, and the storage-side dog 79 moves forward and backward integrally with the advance and retreat of the second tension roller 46. Moving.

Therefore, the first tension roller 44
In normal operation, as shown in FIG. 24, the dog 78 on the supply side has the first direction detection sensor 76A on the supply side and the second direction detection sensor 76B on the supply side, or the first direction detection sensor 76B on the supply side. The tape-shaped circuit board 4A is located at a position detected by the direction detection sensor 76A or the supply-side second direction detection sensor 76B, and is directed from the supply-side reel 12 to the circuit-board-drawing sprocket 49. To give a moderate tension to the surface. When the second tension roller 46 is normal, the dog 79 on the storage side thereof is
Is the storage-side first direction detection sensor 77A and the storage-side second direction detection sensor 77B, or the storage-side first direction detection sensor 77A, or the storage-side second direction detection sensor 77B. Thus, a suitable tension is applied to the tape-shaped circuit board 4A from the circuit board drawer sprocket 49 toward the storage side reel 11 at the position detected by the above.

If the tape-shaped circuit board 4A from the supply reel 12 to the circuit board draw-out sprocket 49 via the first tension roller 44 is cut,
As shown in FIG. 27, the urging force of the first spring 70
The rotation axis of the first tension roller 44 is the opening 31 in FIG.
The dog 78 is moved to the right end position in FIG. In other words, when the supply-side dog 78 is detected by the supply-side tape-shaped circuit board breakage detection sensor 72, the rotation axis of the first tension roller 44 connected to the supply-side dog 78 is connected to the opening 31a in FIG. Is located at the right end position, and indicates that the first spring 70 has been cut off on the supply side, and an alarm 900 is displayed.

If the tape-shaped circuit board 4A facing the storage-side reel 11 is cut off from the circuit board draw-out sprocket 49 via the second tension roller 46, the second spring, as shown in FIG. By the urging force of 71, the rotating shaft of the second tension roller 46 moves to the right end position in the opening 31b in FIG. 19, and the dog 79 is detected by the storage-side tape-shaped circuit board cut-out detection sensor 73. . In other words, when the storage-side dog 79 is detected by the storage-side tape-shaped circuit board cut-out detection sensor 73, the rotation axis of the second tension roller 46 connected to the storage-side dog 79 is positioned within the opening 31b in FIG. , Indicating that the second spring 71 has been cut off on the storage side, and an alarm 900 is displayed.

As shown in FIG. 26, when the supply-side dog 78 is detected by the supply-side catch detection sensor 74, the rotation axis of the first tension roller 44 to which the supply-side dog 78 is connected is changed. 19 is located at the left end position in the opening 31a of FIG. 19, and is a tape-shaped circuit on the supply side, that is, from the supply side reel 12 to the circuit board drawing sprocket 49 via the first tension roller 44. This indicates that the board 4A has been caught, and an alarm 900 is displayed.

As shown in FIG. 26, when the storage-side dog 79 is detected by the storage-side catch detection sensor 75, the rotation shaft of the second tension roller 46 to which the storage-side dog 79 is connected is rotated. 19 is located at the left end position in the opening 31b of FIG. This indicates that the board 4A has been caught, and an alarm 900 is displayed.

In the frame 31 near the storage side reel 12, a storage side reel fullness detection sensor 91 is arranged, and the detection light emitted from the detection light generation device 91a is received by the detection light receiving device 91b. Sometimes, the storage side reel 12 is not full, and the detection light emitted from the detection light generator 91a is obstructed by the tape-shaped circuit board 4A wound around the storage side reel 12, and the detection light receiving device 9
When the light is no longer received by 1b, the storage side reel 1
No. 2 is determined by the control device 1000 to be full, and an alarm 900 notifies the operator.

Here, in the above various cases, the alarm 900
Displaying means that a warning display is displayed on an operation screen, a warning lamp is turned on, or the like in order to inform the operator of the various abnormal situations. In addition, when one type of alarm 900 is displayed to notify that an abnormality has occurred, a plurality of types of alarms 900 are used to distinguish according to each abnormal state.
May be displayed.

As described above, the inspection device 69, namely, the catch detection sensor 74 on the supply side, the catch detection sensor 75 on the storage side, and the first direction detection sensor 7 on the supply side.
6A, a supply-side second direction detection sensor 76B, a storage-side first direction detection sensor 77A, a storage-side second direction detection sensor 77B, and a supply-side tape-shaped circuit board breakage detection sensor 72. Based on the detection result by the combination of the storage-side tape-shaped circuit board breakage detection sensor 73 and the supply-side dog 78 integrated with the first tension roller 44 and the storage-side dog 79 integrated with the second tension roller 46, Under the control of the control device 1000, the drive of the tape supply-side reel motor 43, the tape storage-side reel motor 48, and the sprocket drive motor 50 for running and driving the tape-shaped circuit board 4A and the display of the alarm 900 are displayed. Control. As a result, the stable tape-shaped circuit board 4
A withdrawal and storage operation of A can be realized. In addition,
Although the description has been given of the tape-shaped circuit board 4A, the sensors and the dogs similarly act on the leader tape 4B to be described later to perform the detection operation.

Here, the function of the mounting table 13 will be described with reference to FIG. On the surface of the mounting table 13, a pair of guide projections 13c,
13c is arranged so that the tape-shaped circuit board 4A can be smoothly transported and supplied along the longitudinal direction between the pair of guide projections 13c. Further, on the surface of the mounting table 13, a pitch detection hole detection sensor 13a capable of detecting the pitch detection holes 4b,..., 4b formed in the pattern on the tape-shaped circuit board 4A is arranged, and the pitch is detected on the sensor 13a. When the hole 4b passes, the pitch detection holes 4b,
, 4b and by detecting that the tape-shaped circuit board 4A has been conveyed by a predetermined pitch,
The unloading operation is stopped to enable automatic supply at a predetermined pitch. The tape-shaped circuit board 4A automatically supplied at predetermined pitches is sucked and fixed and held by vacuum suction grooves 13b formed in a recessed shape on the surface of the mounting table 13 and arranged in a grid pattern. The tape-shaped circuit board 4A can be positioned and held so as not to move. When the tape-like circuit board 4A is transported, the vacuum suction in the vacuum suction groove 13b is switched to air blow by driving the compressed air supply pump 151 (see FIG. 13), and the arrow 2 is moved from the vacuum suction groove 13b.
0, the tape-like circuit board 4A is lifted from the surface of the mounting table 13 by air blowing to allow the tape-like circuit board 4A to be smoothly transported. The tape-shaped circuit board 4A can be prevented from being damaged by friction between them. Note that the leader tape 4B is attached to the tape-shaped circuit board 4.
As in the case of A, when the paper is conveyed after passing over the mounting table 13, the air is blown in the same manner.

Here, the structure of the mounting table unit 53 that supports the mounting table 13 will be described.

As shown in FIG. 13, the mounting base unit 53 is mounted on a mounting base unit base 53a fixed to the base 150 of the semiconductor mounting apparatus, and fixed rails for a pair of linear guide members 56, 56 in the Y-axis direction. 56a, 56a are fixed so as to extend along the Y-axis direction, and fixed rails 56a, 56a
The movable part 5 of the linear guide members 56 in the Y-axis direction
6b and 56b can move forward and backward along the Y-axis direction. On the pair of movable parts 56b, 56b, a Y-axis direction moving pedestal 53b is fixed so as to straddle them. On the sliding guide rail side of the Y-axis direction moving pedestal 53b, a mounting table side connecting portion 52 protrudes and is fixed, and the Y-axis direction moving pedestal 53b has an X-axis drive constituted by an air cylinder or the like. Both the device 80 and the fixed rail 55a of the linear guide member 55 in the X-axis direction are fixed so as to extend along the X-axis direction. On the fixed rail 55a of the linear guide member 55 in the X-axis direction, the movable portion 55b of the linear guide member 55 in the X-axis direction can move forward and backward along the X-axis direction. The pedestal 53c for moving in the X-axis direction is attached to the movable portion 55b. X-axis direction pedestal 5
3c, a driving block 64 to which a piston rod 80a of an X-axis driving device 80 is connected, and a pedestal 5 for X-axis direction movement.
A stopper 57 that abuts and positions a part of the drive block 64 when the drive block 64 moves in the X-axis direction integrally with 3c is fixed. Attached to the drive block 64 is a Z-axis drive device 81, such as an air cylinder, that raises and lowers the mounting table mounting base 63 in the Z-axis direction perpendicular to the X-axis direction and the Y-axis direction, in other words, The movable part of the Z-axis driving device 81 is connected to the mounting table mount 63 via a linear guide member 54 in the Z-axis direction that guides the movement of the mounting table mount 63 along the Z-axis direction. The mounting table 13 is fixed to the mounting table 63. The mounting table 63 has a pair of heaters 63a, 63a built therein, and is tape-shaped to be positioned on the mounting table 13. When the IC chips 1,..., 1 are mounted on the circuit board 4A using ultrasonic waves, they can be heated.

Therefore, when the sprocket 49 moves from the undrawn position II to the drawn position I along the Y-axis direction by driving the Y-axis drive motor 65, as shown in FIG. Shaft side connecting part 51
Is the mounting table unit 53 waiting at the standby position III.
Contacting the connecting portion 52 of the mounting base unit side of the
1 and the mounting base unit 53 move integrally along the Y-axis direction (see FIGS. 17A and 17B). At this time, the movement of the mounting table unit 53 along the Y-axis direction is guided by the pair of linear guide members 56 in the Y-axis direction.

Next, as shown in FIG. 17B, when the sprocket 49 is located at the extraction position I, the mounting table unit 53 is positioned at the mounting table driving position IV. Then, by driving the X-axis driving device 80, the mounting table 13 of the mounting table unit 53 is moved from the retreat position V, which is located apart from the slide guide rail 60, in the X-axis direction orthogonal to the Y-axis direction. Then, while being guided by the linear guide member 55 in the X-axis direction, the movement along the X-axis direction enters between the slide guide rail 60 and the leader tape 4B. Then, the mounting table 13 moves to a mounting position VI where a part of the drive block 64 is abutted and stopped by a stopper 57 fixed to the X-axis direction moving base 53c (FIG. 17).
(C)). As described above, the mounting table 13 enters between the sliding guide rail 60 and the leader tape 4B, and the mounting position V
Immediately after being located at position I, the mounting table 13 is located at the lower end position of the mounting position VI and is not in contact with the leader tape 4B, as shown in FIG. Is driven to guide the movement along the Z-axis direction by the linear guide member 54 in the Z-axis direction.
The mounting table 13 is raised via
Contact.

Next, as shown in FIG. 17 (D), the tape supply-side reel motor 43, the tape storage-side reel motor 48, and the sprocket drive motor 50 are driven while being controlled by the control device 1000 to supply the tape. The leader tape 4B is sent by rotating the side reel 12, the storage side reel 11, and the sprocket 49, and the leader tape 4B
Is lost, the leader tape detection sensor 9 fixed to the frame 31 near the third tension roller 45
0, and the detection signal is input to the control device 1000. Then, the control device 1000 starts the detection of the pitch detection holes 4b,..., 4b of the tape-shaped circuit board 4A by the pitch detection hole detection sensor 13a of the mounting table 13, and a predetermined number of the pitch detection holes 4b,. 4b, the tape supply side reel motor 43, the tape storage side reel motor 48, and the sprocket drive motor 5
0 is stopped. As a result, the mounting table 13
In the upper mounting position, the IC chip 1 of the tape-shaped circuit board 4A
The part to be mounted is positioned, and the part is sucked and fixedly held on the mounting table 13 by the vacuum suction groove 13b. At this time, the mounting table 13 side is moved in the Y-axis direction so that the pitch detecting holes 4b,..., 4b of the tape-shaped circuit board 4A can be detected accurately by the pitch detecting hole detecting sensor 13a of the mounting table 13. When the adjustment is necessary, the Y-axis drive motor 65 is driven under the control of the control device 1000 to move the mounting unit 53 together with the slide 61 in the Y-axis direction.

The transport speed for each pitch of the tape-shaped circuit board 4A is, for example, two stages: high speed (15 mm / s) and low speed (1 mm / s). To increase the suspension system, it is desirable that the speed be as low as possible. However, if the speed is low, the production tact becomes long, so that the material is conveyed at a high speed halfway, and conveyed at the low speed before engaging with the sprocket 49, so that both the stopping accuracy and the improvement of the productivity are achieved. .

The mounting table unit 53 is always driven by the mounting table driving position I by the urging force of the spring 910 (see FIG. 17) and guided by the linear guide members 56 in the Y-axis direction.
V is urged to return to the standby position III. Therefore, when the connecting portion 51 on the Y-axis side of the sliding body 61 is separated from the connecting portion 52 on the mounting base unit side of the mounting base unit 53,
The mounting table unit 53 returns from the mounting table driving position IV to the standby position III by the urging force of the spring 910 (see FIG. 17).

When the tape-shaped circuit board 4A is pulled out and stored, the operation of the tape-shaped circuit board 4A is controlled by detecting the leader tapes 4B provided at the leading and trailing ends of the tape-shaped circuit board 4A.

Here, unlike the tape-shaped circuit board 4A, the leader tape 4B has no electrode on which the IC chip 1 is to be mounted, and has a supply reel 12 of the tape-shaped circuit board 4A.
In order to facilitate the rewinding of the tape-shaped circuit board 4A and the winding on the storage-side reel 11, it is possible to prevent damage to the portion having the electrode to which the IC chip 1 is to be mounted when the tape-shaped circuit board 4A is pulled out and stored. belongs to. If the pitch detection hole 4b of the tape-shaped circuit board 4A is not provided in the leader tape 4B, the leader tape 4B is conveyed toward the mounting table 13 and the pitch is detected by the pitch detection hole detection sensor 13a of the mounting table 13. If the detection hole 4b is detected, it can be determined that the tape-shaped circuit board 4A is being conveyed instead of the leader tape 4B. An example of the leader tape 4B has a reflectance different from the reflectance of the surface of the tape-shaped circuit board 4A. 4B
Is detected, and the detection result can be input to the control device 1000. Therefore, the leader tape 4B at the tip of the tape-shaped circuit board 4A is first placed on the supply-side reel 12A.
When it is rewound from the first tension roller 44, the third tension roller 45, the sprocket 49, and the second tension roller 46 and wound around the storage-side reel 11, a leader tape detection sensor 90
To detect the leader tape 4B and detect the leader tape 4B. When the leader tape 4B ends and the tape-like circuit board 4A is detected, the detection signal is input to the control device 1000 and the tape-like circuit board 4A is detected. Notify when supplies are ready. After detecting the end of the leader tape 4B, the pitch detection holes 4b,.
The detection is started by the pitch detection hole detection sensor 13a of No. 3 and it is detected that the tape-shaped circuit board 4A is sent by a predetermined pitch, and a detection signal is input to the control device 1000. Under control, it is detected that the first IC chip mounting area of the tape-shaped circuit board 4A is located on the mounting table 13, and the tape supply-side reel motor 43, the tape storage-side reel motor 48, and the sprocket drive motor The drive of 50 is stopped. Therefore, the length of the leader tape 4B at the leading end of the tape-shaped circuit board 4A is sufficient when the leader tape detection sensor 90 changes the state from the presence of the leader tape 4B to the state without the leader tape 4B. The length is such that it is wound around.

When the leader tape 4B or the tape-shaped circuit board 4A is transported by the mounting table 13, the compressed air supply pump 151 (see FIG. 13) is driven to reduce the vacuum suction in the vacuum suction groove 13b by air blow. To perform air blowing upward from the mounting base 13 so that the tape-shaped circuit board 4A runs on the mounting base 13 with the tape-shaped circuit board 4A floating from the mounting base 13,
The tape-shaped circuit board 4A can be prevented from being damaged by friction between the tape-shaped circuit board 4A and the mounting table 13.

Hereinafter, the operation of the semiconductor mounting apparatus having the tape-shaped circuit board transport device according to the above configuration will be described. These operations are all performed by the control device 10.
The operation is controlled at 00. In addition, each (B) of FIGS.
, Square “□” indicates each sensor, and black square “■” indicates that the corresponding sensor detects and is on. Further, the first direction detection sensor 76A on the supply side and the second direction detection sensor 7 on the supply side
In FIG. 6B, when any one of the sensors is on, it means that the first tension roller 44 is rotating in the on-side direction. In the storage-side first direction detection sensor 77A and the storage-side second direction detection sensor 77B, when either of the sensors is on, it means that the second tension roller 46 is rotating in the ON-side direction. I do. Note that the on / off detection of the sensor is shown as an example, and may be completely reversed. For example, a black square “■” indicates that the corresponding sensor detects and is off, and the supply-side first direction detection sensor 76A
In the second direction detection sensor 76B on the supply side,
When any one of the sensors is off, it means that the first tension roller 44 is rotating in the direction of the off side, and the first direction detection sensor 77A on the storage side and the second direction detection sensor 77B on the storage side. May mean that the second tension roller 46 is rotating in the off-side direction when any of the sensors is off.

<Reel mounting> First, a tape-shaped circuit board 4 on which a large number of IC chips 1,...
The supply-side reel 12 around which A is wound is fitted and held by the supply-side reel fitting and holding section 22. At this time, the sprocket 49 of the tape-shaped circuit board 4A is in the undrawn position I.
I. The X-axis driving device 80 is located at the position where the piston rod 80a is retracted, so that the mounting table 13 is located at the retracted position V on the mounting table unit 53, and the mounting table unit 53 is at the standby position I in the Y-axis direction.
Waiting for II.

<Tape Set> As shown in FIG. 20, the leading tape 4B at the end of the tape-shaped circuit board 4A is wound counterclockwise from the supply reel 12 fitted and held in the supply reel fitting holding section 22. The rewound and rewound leader tape 4B is wrapped around the first tension roller 44 clockwise, and wrapped around the third tension roller 45 counterclockwise, and then wrapped around the sprocket 49 counterclockwise.
After being wrapped around the second tension roller 46 in a clockwise direction, it is locked and wrapped around the storage side reel 11 fitted and held by the storage side reel fitting and holding section 212. All such operations are performed manually. In this state, the leader tape 4
B is in a slackened state.

<After turning on the tape set button>
When a tape set button (not shown) on the operation panel of the transport device is turned on, as shown in FIG.
000 under the control of the tape supply side reel motor 43.
When the tape is rotated clockwise, the tape storage side reel motor 48 is simultaneously rotated counterclockwise to tension the slack leader tape 4B with a constant tension and remove the slack of the leader tape 4B. I do. At this time, tension is applied to the leader tape 4B by the first tension roller 44 and the second tension roller 46, respectively, so that the first tension roller 44 and the second tension roller 46 are respectively positioned at the center of the openings 31a and 31b. Will be located at Therefore, the supply-side first direction detection sensor 76A and the supply-side second direction detection sensor 76A
B, and the first direction detection sensor 77 on the storage side and the second direction detection sensor 77B on the storage side are on.

<Wrapping the Leader Tape 4B around the Storage Side Reel 11> Next, as shown in FIG.
With the rotation axis of the sprocket 49 fixed,
Is rotated counterclockwise to further rewind the leader tape 4B from the supply-side reel 12, and the leader tape 4B is
The first and third tension rollers 44 and 45, the sprocket 49, and the second tension roller 46 are sequentially wound around the storage-side reel 11, and the leader tape 4B is wound around the storage-side reel 11 by a predetermined amount. Thereafter, the leader tape 4B is fed toward the second tension roller 46 by manually rotating the sprocket 49 in the counterclockwise direction, and is wound around the second tension roller 46. Just wrap.

<Movement of Sprocket 49 to Pull-out Position I> Next, as shown in FIG.
The slide 61 moves along the slide guide rail 60 by the drive of the Y-axis drive motor 65 under the control of
The sprocket 49 supported by 1 is in the undrawn position II.
From the tape supply side reel motor 43 while the sprocket 49 is fixed by the sprocket drive motor 50 so as not to rotate as shown in FIGS. The supply reel 12 is intermittently rotated in the counterclockwise direction, and the storage reel 11 is intermittently rotated clockwise by the tape storage reel motor 48, so that the leader tape 4B is wound from each of the reels 12, 11. While returning, the sprocket 49 is moved to the pull-out position I away from the reels 12 and 11. By doing so, the sprocket 49 can be smoothly moved to the pull-out position I without putting any force on the leader tape 4B. At this time, as shown in FIG. 23, the first direction detection sensor 76A on the supply side and the first direction detection sensor 77A on the storage side are turned on, and the second direction detection sensor 76B on the supply side and the second direction detection sensor 76B on the storage side. 2 direction detection sensor 77B
Is turned off, and the tape supply-side reel motor 43 is driven to rotate in the counterclockwise direction.
Reference numeral 8 denotes a case in which the first direction detection sensor 76A on the supply side and the first direction detection sensor 77A on the storage side are turned on, and the second direction detection sensor 76B on the supply side and the storage side. The second direction detection sensor 77B is turned on, and the driving of the tape supply side reel motor 43 and the tape storage side reel motor 48 is stopped. The amount of rewinding on each reel is controlled by the control device 1000 so that the leader tape 4B does not loosen significantly and the movement of the sprocket 49 does not overload the leader tape 4B. When the sliding member 61 moves along the sliding guide rail 60, the sliding member 61
The connecting part 51 on the Y-axis side comes into contact with the connecting part 52 on the mounting base unit side of the mounting base unit 53, and the mounting base unit 53 moves integrally with the slide body 61 from the standby position III to the mounting base driving position IV. Move toward.

When the sprocket 49 is located at the extraction position I, the mounting table unit 53 is moved to the mounting table driving position I.
V.

<Movement of the Mounting Table 13 to the Mounting Position VI> Next, the X-axis driving device 80 is driven to
3 is moved from the retracted position V in the X-axis direction, enters between the slide guide rail 60 and the leader tape 4B, and is driven together with the mounting block 13 by the drive block 64.
Is stopped by the stopper 57 of the X-axis direction movement pedestal 53c, and the mounting table 13 is positioned at the mounting position VI. Thereafter, the Z-axis driving device 81 is driven, and the mounting table 13 at the mounting position VI moves or rises along the Z-axis direction, and comes into contact with the back surface of the leader tape 4B.

<Production (IC Chip Mounting)> Next, the initial position of the tape-shaped circuit board 4A on the mounting table 13 is adjusted. That is, the air is blown on the mounting table 13, and the tape supply side reel motor 43, the tape storage side reel motor 48, and the sprocket drive motor 50 are driven in a state where the leader tape 4 </ b> B is floated from the mounting table 13. Supply side reel 12, storage side reel 1
1 and the sprocket 49 are rotated counterclockwise as shown in FIG. 24 to further transport the leader tape 4B and start transporting the tape-like circuit board 4A following the leader tape 4B. After the end of the leader tape 4B, that is, the detection of the tape-shaped circuit board 4A, is performed by the leader tape detection sensor 90, the tape-shaped circuit board 4 is detected by the pitch detection hole detection sensor 13a on the mounting table 13.
When the pitch detection holes 4b,..., 4b of A are detected,
Detecting a desired number of pitch detection holes 4b,..., 4b, the conveyance of the tape-shaped circuit board 4A is stopped. As a result, the first IC chip mounting area of the tape-shaped circuit board 4A is
3, the air blow is stopped, the suction is switched to vacuum suction in the vacuum suction groove 13b, and the first IC chip mounting area of the tape-shaped circuit board 4A is positioned and held on the mounting table 13. During the mounting preparation operation of the tape-shaped circuit board 4A, the suction nozzle 15 holds the IC chip 1 by suction independently of the mounting preparation operation.

The IC based on the detection of the pitch detection hole 4b
If position correction is necessary at the time of recognizing the position of the chip mounting area, that is, the electrode forming area 4d, the sprocket drive motor 5
0 is driven forward and reverse. The reason is that the movement amount due to position correction is usually a very small amount of 0.5 mm or less,
It is sufficient to drive the sprocket drive motor 50 in the forward and reverse directions, and it is not necessary to drive the supply-side reel motor 43 and the storage-side reel motor 48. Although the position correction is not specifically shown, a component camera for recognizing the IC chip (bump-side pattern surface) and a board camera for recognizing the tape-shaped circuit board side are arranged. Recognition is performed by grasping the amount of deviation between the center of the IC chip and the center of the IC chip mounting area of the tape-shaped circuit board 4A, and correcting the amount corresponding to the amount of deviation. The X direction used for position correction is the head axis, and the Y direction is the Y axis of the substrate (tape circuit board).
Correction is performed using the axes, and the position is corrected so that the center positions of the IC chip and the tape-shaped circuit board are aligned.

In this manner, the electrode of the IC chip 1 sucked and held by the suction nozzle 15 is placed on the portion of the tape-shaped circuit board 4A that is positioned on the mounting table 13 and held by suction, where the IC chip 1 is to be installed. , 2 are pressed against the electrodes 5,..., 5 of the tape-shaped circuit board 4A while applying ultrasonic waves to perform ultrasonic bonding.

After or after the joining, the suction nozzle 15 is lifted or lifted, the suction holding by the vacuum suction groove 13b on the mounting table 13 is released, and the tape-shaped circuit board 4A is lifted from the mounting table 13 by air blow. After that, the control device 1
000, the tape supply side reel motor 43, the tape storage side reel motor 48, and the sprocket drive motor 50 are driven to control the supply reel 1
2. The storage-side reel 11 and the sprocket 49 are rotated counterclockwise. After the pitch detection holes 4b,..., 4b of the predetermined number of tape-shaped circuit boards 4A are detected by the pitch detection hole detection sensors 13a on the mounting table 13, the transport of the tape-shaped circuit boards 4A is stopped. I do. As a result, the next IC chip mounting area of the tape-shaped circuit board 4A is located on the mounting table 13, and the air blow is stopped and the vacuum in the vacuum suction groove 13b is stopped in the same manner as the previous IC chip mounting operation. Switching to suction, the tape-like circuit board 4
The next IC chip mounting area of A is positioned and held on the mounting table 13. Thereafter, the mounting operation of the IC chip 1 which is next suction-held by the suction nozzle 15 is performed in the same manner as the above-described IC chip mounting operation.

By continuously performing such an operation, a continuous mounting operation of the IC chips 1,..., 1 in the IC chip mounting region of the tape-shaped circuit board 4A is performed. In each such mounting operation, as shown in FIG. 24, the first direction detection sensor 76A on the supply side and the first direction detection sensor 77A on the storage side are turned on, and the second direction detection sensor on the supply side. 76B and the second direction detection sensor 77B on the storage side are turned off, and the tape supply side reel motor 43 is driven to rotate counterclockwise and is rewound, and the tape storage side reel motor 48 also rotates counterclockwise. When driven and wound, the first direction detection sensor 76A on the supply side and the first direction detection sensor 77A on the storage side are turned on, and the second direction detection sensor 76B on the supply side and the storage side The case where the second direction detection sensor 77B is turned on and the drive of the tape supply side reel motor 43 and the tape storage side reel motor 48 is stopped is repeated.

In the case where one IC chip 1 is mounted in the width direction of the tape-shaped circuit board 4A, that is, in the X-axis direction, after the mounting operation of one IC chip 1 is completed, the tape-shaped circuit board 4A is mounted. When the plurality of IC chips 1 are mounted in the width direction of the tape-shaped circuit board 4A, that is, in the X-axis direction, the tape-shaped circuit board 4A is not transferred.
The suction operation of the IC chip 1 which is next suction-held by the suction nozzle 15 is continued while the suction chip 15 is being suction-held and positioned on the mounting table 13. After the mounting operation of the predetermined number of IC chips 1 in the X-axis direction is completed, the tape-shaped circuit board 4A is transported, and the next IC chip mounting area is positioned and held on the mounting table 13.

<Final Operation (Tape Trailer / Leader Tape Detection)> Based on the detection of the pitch detection holes 4b,..., 4b, the final IC chip mounting area of the tape-shaped circuit board 4A is detected, and the final IC chip mounting is performed. After the IC chip mounting operation in the area is performed, under the control of the control device 1000,
The motor 43 for the tape supply side reel, the motor 48 for the tape storage side reel, and the sprocket drive motor 50 are driven to supply the supply side reel 12 and the storage side reel 1.
1, and the sprocket 49 is rotated counterclockwise to start transporting the tape-shaped circuit board 4A.

Then, as shown in FIG. 25, when the leader tape detection sensor 90 detects the leader tape 4B on the rear end side of the tape-like circuit board 4A, the mounting table 13 is automatically controlled under the control of the control device 1000. Down, then X
The shaft driving device 80 is driven to retract the mounting table 13 from the mounting position VI to the retracted position V.

Thereafter, by driving the Y-axis drive motor 65, the sliding member 61 is retracted along the sliding guide rail 60 from the drawn position I to the undrawn position II along the Y-axis direction. At this time, the connecting portion 51 of the sliding body 61 on the Y-axis side
Is a connecting portion 52 of the mounting base unit 53 on the mounting base unit side.
The mounting table unit 53 is separated from the linear guide member 56 in the Y-axis direction by the urging force of the spring 910 (see FIG. 17).
With the guidance of 56, the mounting table drive position IV shifts to the standby position I
Return to II. When the sliding body 61 is retracted and the sprocket 49 is positioned at the undrawn position II from the drawn position I,
The drive of the Y-axis drive motor 65 is stopped. While the sprocket 49 returns from the withdrawn position I to the undrawn position II, as shown in FIGS. 25 and 29, the tape supply side reel motor 43, the tape storage side reel motor 48, and the sprocket drive motor 50 are driven. hand,
The supply-side reel 12 is rotated clockwise, the storage-side reel 11 is rotated counterclockwise, and the sprocket 49 is held so as not to rotate, so that the tape-shaped circuit board 4A and the leader tape 4B are not slackened. . At this time, the supply-side first direction detection sensor 76A and the storage-side first direction detection sensor 77A are turned off, and the supply-side second direction detection sensor 76B and the storage-side second direction detection sensor 77B are turned off. Turns on and the tape supply side reel motor 43
Is rotated clockwise, the tape storage side reel motor 48 is rotated counterclockwise, and the supply side first direction detection sensor 76A and the storage side first direction detection sensor 77A The second direction detection sensor 76B on the supply side and the second direction detection sensor 7 on the storage side
7B is also turned on, and the case where the drive of the tape supply side reel motor 43 and the tape storage side reel motor 48 is stopped is repeated.

After the sprocket 49 is located at the undrawn position II, the tape supply reel motor 43, the tape storage reel motor 48 and the sprocket drive motor 50 are driven to supply the reel 12, the storage reel 11, and the like. Then, the sprocket 49 is rotated counterclockwise, and the tape-shaped circuit board 4A and the leader tape 4B are all wound around the storage-side reel 11.

Then, the storage reel 1 on which the tape-shaped circuit board 4A on which the IC chips 1,...
1 is removed from the storage-side reel fitting / holding portion 21.

Next, the new supply-side reel 12 is fitted to the supply-side reel fitting / holding section 22, and the empty storage-side reel 11 is fitted to the storage-side reel fitting / holding section 21.
A mounting operation similar to the mounting operation described above is performed. In this manner, the IC chips 1,..., 1 are continuously supplied to a large number of tape-shaped circuit boards 4A,.
Can be attached.

<The catch detection sensors 74 and 75 are on> During the above operations, as shown in FIG. 26, the supply-side catch detection sensor 74, the storage-side catch detection sensor 75, or both of the sensors 74 , 75 are turned on, the alarm 90 is controlled by the control device 1000.
"0" is displayed to notify the worker that the rotation is poor.

<Circuit Board Cut-Out Detection Sensors 72 and 73 are On> In addition, during each of the above operations, as shown in FIG. When the sensor 73 or both of the sensors 72 and 73 are turned on, an alarm 900 is displayed under the control of the control device 1000, and the operator is notified that the tape has run out.

According to the above embodiment, the thin circuit board is the tape-shaped circuit board 4A having a tape shape, and the tape-shaped circuit board 4A is wound around a reel to form a reel supply type. Can be.
That is, the tape-shaped circuit board 4A as an example of a thin board can be stably transported without using a conveyor by winding the tape-shaped circuit board 4A around a reel and storing the wound circuit. . In addition, the replacement of the board can be performed by feeding the tape-shaped circuit board 4A at a pitch, and the transfer tact can be greatly reduced.

In addition, in the process before and after the mounting, it is sufficient to replace the reel with the reel, and the handling can be facilitated.

By connecting the leader tape 4B to the leading and trailing ends of the tape-shaped circuit board 4A, respectively,
When the tape-shaped circuit board 4A is wound on the supply-side reel 12 and when it is wound on the storage-side reel 11, the outermost surface can be the leader tape 4B, and the tape-shaped circuit board can be used. It is possible to prevent adhesion of dirt and the like on the substrate 4A. When the tape-like circuit board 4A is pulled out to the pull-out position I to perform the mounting preparation operation, the leader tape 4B at the tip of the tape-like circuit board 4A is attached to each of the tension rollers 44, 45, 4.
6, the tape-like circuit board 4A connected subsequently to the leader tape 4B can be smoothly wound around each of the tension rollers 44, 45, 46 and the storage-side reel 11. Also, even when the IC chip 1 is mounted on the last electrode pattern of the tape-shaped circuit board 4A, the leader tape 4B is sufficiently wound around the supply-side reel 11, so that the last electrode pattern of the tape-shaped circuit board 4A is Up to this point, the IC chip 1 can be securely mounted.

Also, when feeding the tape-shaped circuit board 4A,
By driving the compressed air supply pump 151 (see FIG. 13), air is blown upward from the mounting table 13, and the tape-shaped circuit board 4 </ b> A The tape-like circuit board 4A can be prevented from being damaged due to friction between the tape-like circuit board 4A and the mounting table 13 by running on the upper side. Further, in the transport operation similar to the present embodiment, in order to stably move the tape-shaped circuit board 4A without damage, there is also a method of temporarily lowering the mounting table for each transport operation and separating it from the tape-shaped circuit board 4A. However, if the mounting table 13 is lowered for each transport operation, the tact will be longer. On the other hand, the air blow is performed upward from the mounting table 13 so that the tape-shaped circuit board 4A
The tape-like circuit board 4 </ b> A is floated from the mounting table 13.
If the robot runs on the mounting table 13, it is not necessary to lower the mounting table 13 for each transport operation, and the tact does not become long.

By providing the leader tape 4B at the rear end of the tape-shaped circuit board 4A, when the leader tape detection sensor 90 detects the leader tape 4B at the rear end of the tape-shaped circuit board 4A, Circuit board 4A
And the tape supply side reel motor 48, the tape storage side reel motor 48, and the sprocket drive motor 50 so that the leader tape 4B is stored in the storage side reel 12.
Can be automatically driven to wind the tape-shaped circuit board 4A and the leader tape 4B onto the storage-side reel 11, and the winding operation after the mounting of the tape-shaped circuit board 4A can be automated.

The inspection device 69, namely, the catch detection sensor 74 on the supply side, the catch detection sensor 75 on the storage side, and the first direction detection sensor 76A on the supply side
A supply-side second direction detection sensor 76B, a storage-side first direction detection sensor 77A, a storage-side second direction detection sensor 77B, a supply-side tape-shaped circuit board breakage detection sensor 72, Detecting sensor 7 for detecting breakage of tape-side circuit board on storage side
3 to drive the tape-shaped circuit board 4A based on the detection result of the combination of the dog 78 on the supply side integrated with the first tension roller 44 and the dog 79 on the storage side integrated with the second tension roller 46. The drive of each of the tape supply side reel motor 43 and the tape storage side reel motor 48 is controlled by the control device 1000. At this time, the sprocket shaft of the sprocket 49 positioned at the pull-out position I is fixed by the sliding member 61 so as not to be movable in the Y-axis direction, and when the sprocket 49 advances and retreats along the pull-out direction,
9 itself so that it does not rotate.
Is held by In this way, as shown in FIG. 29, the control device 10 is controlled based on the on / off state of each sensor.
If the rotation of the tape supply side reel motor 43 and the tape storage side reel motor 48 is controlled at 00, the detection of the breakage of the tape-shaped circuit board 4A on both the supply side and the storage side, clockwise and counterclockwise detection, and In addition, it is possible to detect the hooking, and it is possible to realize a stable operation of pulling out and storing the tape-shaped circuit board 4A.

Further, if the motor for transporting the tape-like circuit board 4A is simply stopped at regular intervals without detecting the position of the electrode or the like of the tape-like circuit board 4A, the electrode of the tape-like circuit board 4A is not detected. Inability to cope with variations in position. Further, if the recognition position where the tape-shaped circuit board 4A is printed is detected at a high speed in order to shorten the time required for the entire mounting operation, there will be many detection variations and many errors. Further, it is difficult to form a sharp edge on the aluminum electrode pattern due to its characteristics when printing and forming the aluminum electrode pattern. All the position recognition becomes difficult. Therefore,
In this embodiment, the pitch detection holes 4 which are marks related to the mounting point are used as the position recognition targets of the tape-shaped circuit board 4A.
Since b or the sprocket engagement hole 4a is used, the accumulated error and the relative error are small, and the stopping accuracy can be improved.

Further, even in a tape pattern in which it is difficult to form a sharp edge of the pattern, the sprocket engagement holes 4a,. Can be done.

Since the mounting table 13 is slidable between the mounting position VI and the retracted position V, the mounting table 13 is slid from the mounting position VI to the retracted position V when the tape-shaped circuit board 4A is stored. By doing so, the mounting table 13 does not exist in the tape storing direction (Y-axis direction) of the tape-shaped circuit board 4A, so that it does not interfere with the storing operation of the tape-shaped circuit board 4A. The housing operation of the circuit board 4A can be performed smoothly. On the other hand, when the mounting table 13 is kept at the mounting position VI, a part of the tape-shaped circuit board 4A may be caught on the mounting table 13 during the storing operation of the tape-shaped circuit board 4A, and the mounting table 13 may be smoothly moved. However, in the present embodiment, such an inconvenience can be surely solved.

The movement of the mounting table 13 from the standby position III to the mounting table driving position IV is performed in conjunction with the movement of the sprocket 49 from the undrawn position II to the drawn position I, so that the mounting table 13 is driven. This eliminates the need for a drive source dedicated to the movement, and can be realized with a simple configuration.

In this embodiment, the pitch detection hole 4b or the sprocket engagement hole 4a is used as the position recognition target of the tape-shaped circuit board 4A.
Does not receive feed accuracy in the pitch direction. In other words, FIG.
In the case of using a pattern as shown in (1), since the pattern is long in the pitch direction (Y direction), the IC chip can contact the pattern 5a even if the feed is slightly out of order.
As a result, the feed accuracy in the pitch direction is not received.

Further, according to the above embodiment, since the gold bumps 3 of the IC chip 1 and the electrodes 5 of the tape-shaped circuit board 4A are directly joined, the conventional case using an anisotropic conductive film is different. In comparison, the step of attaching the anisotropic conductive film becomes unnecessary, and the number of steps can be reduced.
Further, since the anisotropic conductive film is not required, the bonding time for bonding the IC chip 1 to the circuit board 4A can be shortened, and the mounting tact can be reduced as a whole. Further, the IC chip assembly after joining becomes thinner by the absence of the anisotropic conductive film, and the thickness of the entire tape when the IC chip assembly is taped and parts are supplied by the taping cassette can be reduced. Also,
When applied to an IC card or the like, the IC card can be made thinner. Further, since the bumps 3 of the IC chip 1 and the electrodes 5 of the tape-shaped circuit board 4A are directly bonded without interposing an anisotropic conductive film,
Compared to the case where an anisotropic conductive film is used, stronger bonding is possible, and reliability can be improved.

Further, the tape-shaped circuit board 4A is continuously supplied by rewinding the tape-shaped circuit board 4A from the tape supply reel 12 on which the tape-shaped circuit board 4A has been wound. Can be attached to
Mounting efficiency can be improved. Also, by rewinding from the tape supply side reel 12 at a predetermined pitch,
The tape-like circuit board 4A can be supplied stably,
In addition, it is possible to reduce the transfer tact. Further, when the tape-shaped circuit board 4A and the IC chip 1 are ultrasonically bonded, the material of the electrodes 5 of the tape-shaped circuit board 4A is made of aluminum instead of gold, whereby the cost can be reduced.

Further, it is possible to simplify the steps before and after the joining step such as preparing and attaching an anisotropic conductive film and heating and curing the anisotropic conductive film.
Mounting tact can be reduced, and productivity can be improved. In the above embodiment, for example, the IC chip 1
The joining operation can be completed in about one second per piece.

The present invention is not limited to the above embodiment, but can be implemented in various other modes.

For example, the second tension roller 46 and the storage-side reel 12 are disposed on the upper side, and the supply-side reel 11 and the first and third tension rollers 44 and 45 are disposed on the lower side. You may make it.

Further, the tape-like circuit board 4 is mounted on the mounting table 13.
A substrate holder for positioning and holding A may be separately provided.

FIG. 3 shows another embodiment of the present invention.
As shown in FIG. 1 and FIG.
And before joining the electrode 5 of the tape-shaped circuit board 4A to
An insulating thermosetting adhesive 7 is disposed on either the IC chip 1 or the tape-shaped circuit board 4A, and the IC chip 1 and the tape-shaped circuit board 4A are bonded together with the adhesive 7 and heated at the time of joining. , The adhesive 7 can be cured and fixed. As an example of the adhesive 7,
It is preferable to use an insulating thermosetting epoxy resin. In addition, since the insulating thermosetting epoxy resin is used, the joint can be sealed with the resin, and aging of the joint due to oxidation or the like can be prevented.

Further, according to this embodiment, in addition to the effect when the anisotropic conductive film is not used, the bonding strength between the IC chip 1 and the tape-shaped circuit board 4A is improved by the adhesive 7. Thus, peeling of the IC chip 1 from the tape-shaped circuit board 4A can be reliably prevented. Also,
The bonding time of the ultrasonic bonding can be further reduced by the adhesive 7.

It is to be noted that, by appropriately combining any of the above-described various embodiments, the effects of the respective embodiments can be exhibited.

[0129]

According to the present invention, since the gold bumps of the IC chip and the electrodes of the tape-shaped circuit board are directly bonded, a difference is obtained as compared with the conventional case using an anisotropic conductive film. The process of attaching the anisotropic conductive film is unnecessary,
The number of steps can be reduced.

Further, since the anisotropic conductive film is not required, the bonding time for bonding the IC chip to the tape-shaped circuit board can be shortened, and the mounting tact can be reduced as a whole.

Further, the IC chip assembly after joining becomes thinner by the absence of the anisotropic conductive film. For example, when the IC chip assembly is taped and supplied by a taping cassette, the thickness of the entire tape may be reduced. it can.

When the present invention is applied to an IC card or the like, the IC card can be made thinner.

In addition, since the bumps of the IC chip and the electrodes of the tape-shaped circuit board are directly bonded without interposing an anisotropic conductive film, the present embodiment is compared with the case where an anisotropic conductive film is used. As a result, stronger bonding can be achieved, and the reliability can be improved.

Further, when the tape-shaped circuit board and the IC chip are ultrasonically bonded, the material of the electrodes of the tape-shaped circuit board is made of aluminum instead of gold, whereby the cost can be reduced.

Further, it is possible to simplify the steps before and after the joining step such as preparing and attaching an anisotropic conductive film and heating and curing the anisotropic conductive film.
Mounting tact can be reduced, and productivity can be improved.

Further, by unwinding the tape-shaped circuit board from the reel on which the tape-shaped circuit board has been wound, the tape-shaped circuit board can be continuously supplied and IC chips can be continuously mounted. Efficiency can be improved. In addition, by rewinding the reel from the reel at a predetermined pitch, the tape-shaped circuit board can be supplied stably,
In addition, it is possible to reduce the transfer tact.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a method of joining an IC chip to a tape-shaped circuit board used in a tape-shaped circuit board transport apparatus and method according to an embodiment of the present invention.

FIG. 2 is a partially enlarged view of an IC chip joined body joined according to FIG. 1;

FIGS. 3A and 3B are various examples of the electrodes of the tape-shaped circuit board of FIG.

FIG. 4 is a partially enlarged view of the tape-shaped circuit board of FIG. 1;

FIG. 5 shows the I of the IC chip joined body joined according to FIG.
It is explanatory drawing which shows the joining state of the bump of a C chip and the electrode of a tape-shaped circuit board transparently.

FIG. 6 is an explanatory diagram in a case where a tape-shaped circuit board is in a tape-shaped supply mode.

FIG. 7 is a perspective view of a semiconductor mounting apparatus in which the tape-shaped circuit board transfer device that performs the tape-shaped circuit board transfer method is incorporated.

FIG. 8 is a perspective view showing a positional relationship among a supply-side reel, first to third tension rollers, a sprocket, a storage-side reel, and the like in the tape-shaped circuit board transfer device.

FIG. 9 is a cross-sectional view of the tape-shaped circuit board transfer device.
Supply-side reel, first to third tension rollers, sprocket,
It is a schematic explanatory view showing a positional relationship of a storage side reel and the like.

FIGS. 10A, 10B, and 10C are enlarged cross-sectional views of a supply-side reel, a storage-side reel, and another example of a storage-side reel of the tape-shaped circuit board transport device.

FIG. 11 is a perspective view of the sprocket at the undrawn position and the mounting base unit at the standby position of the tape-shaped circuit board transfer device.

FIG. 12 is an enlarged perspective view of a sprocket portion of the tape-shaped circuit board transfer device.

FIG. 13 is a perspective view of a mounting table unit of the tape-shaped circuit board transfer device.

FIG. 14 is an explanatory diagram showing a positional relationship among a supply-side reel, first to third tension rollers, a sprocket, a storage-side reel, and the like in the tape-shaped circuit board transfer device.

FIG. 15 is a perspective view of the sprocket at the undrawn position and the mounting base unit at the standby position of the tape-shaped circuit board transfer device.

FIG. 16 is a perspective view of a sprocket at a pull-out position of the tape-shaped circuit board transfer device and a mounting table unit at a mounting table driving position.

FIG. 17 (A), (B), (C), (D),
(E) and (F) respectively show the positional relationship between the sprocket at the undrawn position and the mounting table unit at the standby position, and the sprocket at the drawn position and the mounting table driving position at the drawing position of the tape-shaped circuit board transfer device. Positional relationship with the mounting table unit, sprocket at the pull-out position and positional relationship with the mounting table unit at the mounting table drive position (after the mounting table has been moved from the retracted position to the mounting position), and the tape-like circuit board supply start state Positional relationship between the sprocket and the mounting base unit,
It is explanatory drawing which shows the positional relationship between the tape-shaped circuit board and the mounting table in (C), and the positional relationship between the tape-shaped circuit board and the mounting table in (D).

FIG. 18 is an explanatory view showing the structure of each sensor of the detection device of the tape-shaped circuit board transfer device.

FIG. 19 is an explanatory diagram showing a positional relationship among a supply-side reel, first to third tension rollers, a sprocket, a storage-side reel, and the like in the tape-shaped circuit board transfer device.

20 (A) and 20 (B) each show a positional relationship among a supply side reel, first to third tension rollers, a sprocket, a storage side reel, and the like when a tape is set in the tape-shaped circuit board transfer device. FIG. 4 is a diagram and an explanatory diagram of an on / off detection state of each sensor.

FIGS. 21A and 21B are positional relationships of a supply-side reel, first to third tension rollers, a sprocket, a storage-side reel, and the like after a tape set button is turned on in the tape-shaped circuit board transfer device. FIG. 7A is an explanatory diagram showing an ON state, and FIG.

FIGS. 22A and 22B are supply-side reels, first to third tension rollers, sprockets, and storage-side reels, respectively, in a state where the leader tape has been wound around the storage-side reels in the tape-shaped circuit board transfer device. FIG. 3 is an explanatory diagram illustrating a positional relationship of reels and the like and an explanatory diagram of an on / off detection state of each sensor.

FIGS. 23A and 23B respectively show supply-side reels, first to third tension rollers, sprockets, storage-side reels, and the like in a state where a sprocket is moved to a pull-out position in the tape-shaped circuit board transfer device. It is explanatory drawing which shows a positional relationship, and explanatory drawing of the on-off detection state of each sensor.

24A and 24B are supply-side reels, first to third tension rollers, sprockets, and storage-side reels in the above-described tape-shaped circuit board transfer device in a state where an IC chip is mounted and the tape-shaped circuit board is transferred. FIG. 3 is an explanatory diagram showing a positional relationship such as the above and an explanatory diagram of an on / off detection state of each sensor.

FIGS. 25A and 25B are supply-side reels, first to third tension rollers, sprockets, and the like in the above-described tape-like circuit board transport device in a state where a leader tape is detected at the rear end of the tape-like circuit board; FIG. 4 is an explanatory diagram showing a positional relationship of a storage-side reel and the like and an explanatory diagram of an on / off detection state of each sensor.

26A and 26B are positions of a supply reel, first to third tension rollers, a sprocket, a storage reel, and the like in a state where a catch detection sensor is turned on in the tape-shaped circuit board transfer device. FIG. 3 is an explanatory diagram showing a relationship and an explanatory diagram of an on / off detection state of each sensor.

FIGS. 27A and 27B are supply-side reels, first to third tension rollers, sprockets, and a storage side when the tape-shaped circuit board cut-out detection sensor is turned on in the tape-shaped circuit board transport device, respectively. FIG. 3 is an explanatory diagram illustrating a positional relationship of reels and the like and an explanatory diagram of an on / off detection state of each sensor.

FIG. 28 is a perspective view of a mounting table of the tape-shaped circuit board transfer device.

FIG. 29 is a cross-sectional view of the tape-shaped circuit board transfer device,
It is a figure which shows the drive state of the motor for tape supply side reels, and the motor for tape storage side reels in the operation | movement of extraction and storage of a tape-shaped circuit board.

FIG. 30 is a block diagram showing the relationship between the control device of the tape-shaped circuit board transfer device and each device.

FIG. 31 is an explanatory view showing a method of joining an IC chip to a tape-shaped circuit board according to another embodiment of the present invention.

32 is a partially enlarged view of the IC chip joined body joined according to FIG. 31.

FIG. 33 is an explanatory view showing a conventional board transfer when mounting an electronic component on a circuit board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... IC chip, 2 ... electrode, 3 ... gold bump, 4b ... pitch detection hole, 4A ... tape circuit board, 4B ... leader tape, 5 ... electrode, 5a ... rectangular electrode, 5c ... right triangle electrode, 7 ... Adhesive, 11, 11A ... tape storage side reel,
11a: recess for tape-shaped circuit board, 11b, 11c ... I
C chip recess, 12: tape supply side reel, 12a ...
Recess for tape-shaped circuit board, 13 mounting table, 13a pitch detection hole detection sensor, 13b vacuum suction groove, 13c
Guide protrusions, 14 mounting base, 15 suction nozzles, 20 arrows, 21 fitting / holding part for storage side reel, 22 fitting / holding part for supply side reel, 30 semiconductor mounting device, 31 frame, 31a , 31b ... opening, 32 ... auxiliary guide roller, 40 ... tape-shaped circuit board transfer device, 43 ... tape supply side reel motor, 44 ... first tension roller, 4
4a: bearing portion, 45: third tension roller, 46:
2nd tension roller, 46a ... bearing part, 48 ... motor for tape storage side reel, 49 ... sprocket, 50 ...
Sprocket drive motor, 51... Y-axis side connecting portion, 52
... Connecting part on mounting table unit side, 53 ... Mounting table unit
53a: mounting base unit pedestal, 53b: Y-axis direction moving pedestal, 53c: X-axis direction moving pedestal, 54 ... Z-axis direction linear guide member, 55 ... X-direction linear guide member, 56
... Y-direction linear guide member, 57 ... Stopper, 60 ... Sliding guide rail, 61 ... Sliding body, 62 ... Bracket, 63
... Mounting table mounting table, 63a ... heater, 64 ... drive block, 65 ... Y-axis drive motor, 66 ... guide roller, 69
... Detection device, 70 ... First spring, 71 ... Second spring, 72 ...
Supply-side tape-shaped circuit board breakage detection sensor, 73: Storage-side tape-shaped circuit board breakage detection sensor, 74: Supply-side catch detection sensor, 75: Storage-side catch detection sensor,
76A: supply-side first direction detection sensor, 76B ... supply-side second direction detection sensor, 77A ... storage-side first direction detection sensor, 77B ... storage-side second direction detection sensor, 78 ... Dog on supply side, 79 ... Dog on storage side, 80 ...
X-axis driving device, 80a: piston rod, 81: Z-axis driving device, 84a: detection light generating device, 84b: detection light receiving device, 84c: gap, 90: leader tape detection sensor,
Reference numeral 91: storage side reel fullness detection sensor, 91a: detection light generating device, 91b: detection light receiving device, 100: wafer, 1
01: wafer storage device, 102: wafer holding device, 10
3. Recognition device, 104: IC chip removal and reversing device, 105: XY robot, 106: Ultrasonic horn mounting head unit, 140: Mounting table sensor, 150: Machine base of semiconductor mounting device, 900: Alarm, 910: Spring , 100
0: control device, I: pull-out position, II: undrawn position, III: standby position, IV: mounting base drive position, V: retreat position, VI: mounting position.

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Satoshi Shida 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Takafumi Tsujizawa 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 5F044 PP01

Claims (30)

[Claims] 1. A gold bump (3) of an electrode (2) of an IC chip (1) and an electrode (5, 5a, 5c) of a tape-shaped circuit board (4A) positioned at an IC chip mounting position. After the alignment, the ultrasonic bumps are applied while pressing the gold bumps of the electrodes of the IC chip against the electrodes of the tape-shaped circuit board, and the ultrasonic bonding is performed to attach the IC chip to the tape-shaped circuit board. A tape-like circuit board transfer device for transferring the tape-like circuit board to the IC chip mounting position, wherein the supply-side reel (12) for rewinding the tape-like circuit board
Supply-side reel fitting and holding section (2
2) and a storage reel (11) for winding up the tape-like circuit board.
Storage-side reel fitting and holding section (2
1) and the tape-like circuit board which can be moved between the pull-out position (I) and the non-pull-out position (II), and which is wound back from the supply-side reel by the storage-side reel. A circuit board drawer sprocket (49) arranged on a transfer path for transferring the tape circuit board and capable of transferring the tape circuit board; and the tape between the supply reel and the circuit board drawer sprocket. The circuit board is hung around to apply tension to the tape circuit board, and can move forward and backward within a predetermined range along the moving direction of the circuit board drawer sprocket according to the tension of the tape circuit board. A first tension roller (44), and the tape-shaped circuit board between the circuit board drawer sprocket and the storage side reel is wound around the tape-like circuit board. A second tension roller (46) for applying tension to the loop-shaped circuit board and moving forward and backward within a predetermined range along the moving direction of the sprocket for drawing out the circuit board according to the tension of the tape-shaped circuit board; Detecting, based on the position of the first tension roller and the position of the second tension roller, the transport state of the tape-shaped circuit board due to the tension applied by the first tension roller or the second tension roller; Detecting device (69), and mounting the IC chip before winding the tape-like circuit board rewound from the supply reel and given the tension by the first tension roller around the sprocket at the pull-out position. The mounting table (1
And 3) aligning the electrodes of the tape-shaped circuit board positioned at the IC chip mounting position with the gold bumps of the electrodes of the IC chip, and then positioning the electrodes of the IC chip. The above-mentioned gold bumps were pressed against the above-mentioned electrodes of the above-mentioned tape-shaped circuit board, ultrasonic waves were applied thereto and ultrasonically bonded, and the above-mentioned IC chip was mounted on the above-mentioned tape-shaped circuit board. A tape-like circuit board, wherein the tape-like circuit board is wound around the sprocket at the pull-out position, and then the tension is applied by the second tension roller to be wound around the storage-side reel. Transport device. 2. A first urging member for urging the first tension roller to its initial position and a second urging member for urging the second tension roller to its initial position.
The inspection device further comprises: a first sensor that detects whether the first tension roller is at an initial position farthest from the sprocket within the predetermined range, and the second tension roller. And a second sensor for detecting whether or not the initial position is farthest from the sprocket within the predetermined range. The first tension roller is moved to the initial position by the urging force of the first urging member. When the position is detected by the first sensor, the tension is not applied to the tape-like circuit board between the supply reel and the circuit board draw-out sprocket, while the first urging member is not applied. When the first sensor detects that the first tension roller is displaced from the initial position against the urging force of It is determined that the tension is acting on the tape-shaped circuit board between the tape and the sprocket for drawing out the circuit board, and the second tension roller is moved to the initial position by the urging force of the second urging member. Is detected by the second sensor, the tension is not applied to the tape-shaped circuit board between the circuit board drawer sprocket and the storage side reel, while the second urging is performed. When the second sensor detects that the second tension roller is displaced from the initial position against the urging force of the member, the second tension roller moves between the circuit board drawer sprocket and the storage side reel. 2. The tape-like circuit board conveying device according to claim 1, wherein it is determined that the tension acts on the tape-like circuit board. 3. The inspection device according to claim 1, wherein the third sensor detects whether the first tension roller is located at a position closest to the sprocket within the predetermined range, and the second tension roller has a predetermined position. A fourth sensor for detecting whether or not the sprocket is located closest to the sprocket within the range, wherein the first tension roller is within the predetermined range along the moving direction of the sprocket for drawing out the circuit board. When it is located at a position closest to the above, it is determined that the urging force of the first urging member has stopped acting, and the second tension roller is within the predetermined range along the moving direction of the circuit board drawer sprocket. When it is located at the position closest to the sprocket, it is determined that the urging force of the second urging member has stopped working. Tape-like circuit board conveying device according to claim 1 or 2 so as to. 4. A leading tape (4B) is provided at a leading end of the tape-shaped circuit board. The leader tape is first rewound from the supply reel, and the first tension roller, the sprocket, and the 4. The tape-like circuit board transport device according to claim 1, wherein the tape-like circuit board transport device is wound around a two-tension roller and wound around the storage-side reel. 5. A leader tape (4B) is provided at the rear end of the tape-shaped circuit board, and after winding the tape-shaped circuit board around the storage-side reel, the leader tape at the rear end is finally stored in the storage-side reel. The tape-shaped circuit board conveying device according to any one of claims 1 to 4, wherein the device is wound around a side reel. 6. A leader tape detecting device (90) for detecting a leader tape, wherein when the leader tape detecting device detects the leader tape at the rear end of the tape-like circuit board, the sprocket is moved to the pull-out position. 6. The tape-shaped circuit board conveying device according to claim 5, wherein the leader tape is moved to the undrawn position, and then the leader tape is wound around the storage-side reel. 7. A first driving device (65) for moving the sprocket between the pull-out position (I) and the non-pull-out position (II), the mounting table, and the first drive. A mounting table unit (53) that moves along the moving direction of the sprocket integrally with the sprocket when the sprocket is moved from the undrawn position to the drawn position by an apparatus; and After the sprocket is located at the pull-out position, the IC chip is mounted on the tape-like circuit board to which the tension is applied by the first tension roller after being rewound from the supply reel and before being wound around the sprocket. A second driving device (80) for positioning the mounting table at a position. Tape-like circuit board conveying device according to one or. 8. The tape-like circuit board is sucked and fixed and held by a vacuum suction groove (13b) formed in the surface of the mounting table, and the tape-like circuit board moves when the IC chip is mounted. 7. A method according to claim 1, further comprising positioning the tape-shaped circuit board so that the tape-shaped circuit board is not conveyed, and air blowing when transporting the tape-shaped circuit board so that the tape-shaped circuit board is lifted from the surface of the mounting table.
4. The tape-shaped circuit board conveying device according to any one of the above. 9. When the sprocket is moved from the undrawn position to the drawn position, the supply-side reel is rotated in a direction in which the tape-shaped circuit board is rewound, and the tape-shaped circuit board is rewound. While rotating the storage side reel in a direction in which the tape-shaped circuit board is unwound, the tape-shaped circuit board is rewound, and when the sprocket is moved from the drawn position to the undrawn position, the tape-shaped circuit board is wound. The supply-side reel is rotated in the take-up direction to wind up the tape-like circuit board, and the storage-side reel is rotated in the take-up direction of the tape-like circuit board to wind up the tape-like circuit board. The tape-shaped circuit board conveying device according to any one of claims 1 to 8. 10. The tape-shaped circuit board has sprocket engagement holes (4a) at predetermined intervals and can be engaged with the sprocket and conveyed at a predetermined pitch.
The tape-shaped circuit board conveying device according to any one of the above. 11. The tape-shaped circuit board conveying device according to claim 1, wherein the electrodes of the tape-shaped circuit board are aluminum electrodes. 12. The tape-like circuit board has a thickness of 0.2 m.
The tape-shaped circuit board conveying device according to any one of claims 1 to 11, wherein the length is not more than m. 13. The tape-like circuit board having a thickness of 0.2
The tape-shaped circuit board transport device according to any one of claims 1 to 11, wherein the tape-shaped circuit board transport device is an insulator substrate having a thickness of not more than mm. 14. A circuit board drawing sprocket disposed between the circuit board drawing sprocket and the first tension roller to travel the tape-like circuit board between the circuit board drawing sprocket and the circuit board drawing sprocket. And a third tension roller (45) for maintaining the third tension roller substantially in parallel with the moving direction of the first roller.
3. The tape-shaped circuit board transfer device according to any one of 3. 15. An IC chip assembly in which the IC chip is bonded to the tape-like circuit board transported by the tape-like circuit board transport device according to any one of claims 1 to 14. 16. The IC chip assembly according to claim 15, wherein the IC chip is a memory for an IC card. 17. A tape-type circuit board transfer device according to claim 1, wherein the IC chip is bonded to the tape-type circuit board transferred by the tape-type circuit board transfer device. Component mounting equipment to mount. 18. The position of the gold bump (3) of the electrode (2) of the IC chip (1) and the electrode (5, 5a, 5c) of the tape-like circuit board (4A) positioned at the IC chip mounting position. After the alignment, the ultrasonic bumps are applied while pressing the gold bumps of the electrodes of the IC chip against the electrodes of the tape-shaped circuit board, and the ultrasonic bonding is performed to attach the IC chip to the tape-shaped circuit board. When the tape-like circuit board is transported to the IC chip mounting position, the supply-side reel (12) rewinds the tape-like circuit board to the supply-side reel fitting holding portion (22). ) Is detachably fitted and held, and the storage-side reel fitting holding section (21) is provided.
The reel on the storage side (1
1) is detachably fitted and held, and is disposed on a transport path for transporting the tape-shaped circuit board so that the tape-shaped circuit board unwound from the supply-side reel is wound up by the storage-side reel. Sprockets for drawing circuit boards that can transport tape-shaped circuit boards (4
9) from the undrawn position (II) to the drawn position (I)
And the tape-like circuit board between the supply reel and the circuit board draw-out sprocket is wound around a first tension roller (44) to apply tension to the tape-like circuit board, The first tension roller can move forward and backward within a predetermined range along the moving direction of the circuit board drawer sprocket in accordance with the tension of the tape-like circuit board, and the circuit board drawer sprocket and the storage-side reel can be moved forward and backward. The tape-shaped circuit board is wound around a second tension roller (46) to apply tension to the tape-shaped circuit board, and the sprocket for drawing out the circuit board is moved according to the tension of the tape-shaped circuit board. The second tension roller is capable of moving forward and backward within a predetermined range along the direction, and is rewound from the supply side reel and the second tension roller. The first tension roller is capable of being positioned and held on a mounting table (13) at the IC chip mounting position before the tape-like circuit board to which the tension is applied by the one tension roller is wound around the sprocket at the pull-out position. Detecting the transport state of the tape-shaped circuit board by the tension applied by the first tension roller or the second tension roller by the detector (69) based on the position of the second tension roller and the position of the second tension roller. While positioning the electrodes of the tape-shaped circuit board positioned at the IC chip mounting position and the gold bumps of the electrodes of the IC chip, the gold bumps of the electrodes of the IC chip are aligned. Ultrasonic waves are applied while being pressed against the electrodes of the tape-shaped circuit board to perform ultrasonic bonding, thereby attaching the IC chip to the tape. After the tape-shaped circuit board on which the IC chip is mounted is wrapped around the sprocket at the draw-out position, the tension is applied by the second tension roller, and the tape is mounted on the storage side. A method for transporting a tape-shaped circuit board, wherein the method is carried on a reel. 19. The first tension roller is urged to its initial position by a first urging member (70), and the second tension roller is urged to its initial position by a second urging member (71). Meanwhile, the inspection device detects whether or not the first tension roller is at an initial position farthest from the sprocket within the predetermined range with the first sensor, and determines whether the second tension roller is at the predetermined position. A second sensor detects whether or not the initial position is farthest from the sprocket within the range. If the first tension roller is located at the initial position by the urging force of the first urging member, the second sensor is turned on. When detected by one sensor, the tension is not applied to the tape-shaped circuit board between the supply-side reel and the sprocket for drawing out the circuit board. When the first sensor detects that the first tension roller is displaced from the initial position against the urging force of the first urging member, the supply reel and the circuit board drawing sprocket It is determined that the tension is acting on the tape-shaped circuit board during the period, and the second tension roller is positioned at the initial position by the urging force of the second urging member. When detected by the sensor, the tension is not applied to the tape-like circuit board between the circuit board drawer sprocket and the storage side reel, while the tape-like circuit board is opposed to the urging force of the second urging member. When it is detected by the second sensor that the second tension roller is displaced from the initial position, the circuit board drawer sprocket and the storage side reel are displaced. Tape-like circuit board transfer method according to claim 18 as in the above tape-like circuit board determines that the tension is acting. 20. The inspection device detects whether or not the first tension roller is located closest to the sprocket within the predetermined range with a third sensor, and determines whether or not the second tension roller has the predetermined tension. A fourth sensor detects whether or not the sprocket is located closest to the sprocket within the range, and the first tension roller is located at the position closest to the sprocket within the predetermined range along the moving direction of the sprocket for drawing out the circuit board. When the sprocket is located at a close position, it is determined that the urging force of the first urging member has stopped acting, and the sprocket within the predetermined range along the moving direction of the sprocket for drawing out the circuit board is determined by the second tension roller. It is determined that the urging force of the second urging member has stopped acting when the position is closest to Tape-like circuit board transfer method according to claim 18 or 19 so as to. 21. A leader tape (4B) at the end of the tape-like circuit board, the leader tape is first rewound from the supply side reel, and the first tension roller, the sprocket, and the 21. The method of transporting a tape-like circuit board according to any one of claims 18 to 20, wherein the tape-like circuit board transport method is wound around a two-tension roller and wound around the storage-side reel. 22. A leader tape (4B) is provided at a rear end of the tape-shaped circuit board, and after winding the tape-shaped circuit board around the storage-side reel, the leader tape at the rear end is finally stored in the storage tape. 22. The method for transporting a tape-like circuit board according to claim 18, wherein the tape-like circuit board is wound around a side reel. 23. When the leader tape at the rear end of the tape-like circuit board is detected by the leader tape detecting device (90), the sprocket is moved from the drawn position to the undrawn position, and then the leader tape is removed. 23. The method of transporting a tape-like circuit board according to claim 22, wherein the tape-like circuit board is wound around the storage-side reel. 24. The sprocket is moved by a first drive device (65) between the pull-out position (I) and the non-pull-out position (II), the sprocket having the mounting table, and the first drive. When the sprocket is moved from the undrawn position to the drawn position by an apparatus, the mounting table unit (53) is moved integrally with the sprocket along the moving direction of the sprocket, and the mounting table unit is provided with the mounting table unit; After the sprocket is located at the pull-out position, the IC chip is mounted on the tape-like circuit board to which the tension is applied by the first tension roller after being rewound from the supply reel and before being wound around the sprocket. 23. The apparatus according to claim 18, wherein the mounting table is positioned at a position by a second driving device. Tape-like circuit board transfer method according to one. 25. The tape-shaped circuit board is sucked and fixed and held by a vacuum suction groove (13b) formed in the surface of the mounting table, and the tape-shaped circuit board moves when the IC chip is mounted. 25. The tape-type circuit board according to claim 18, wherein the tape-type circuit board is positioned so that it cannot be moved, and air is blown when the tape-type circuit board is transported so that the tape-type circuit board floats from the surface of the mounting table. Method of transporting tape-shaped circuit boards. 26. When the sprocket is moved from the undrawn position to the drawn position, the supply-side reel is rotated in a direction in which the tape-shaped circuit board is rewound, and the tape-shaped circuit board is rewound. While rotating the storage side reel in a direction in which the tape-shaped circuit board is unwound, the tape-shaped circuit board is rewound, and when the sprocket is moved from the drawn position to the undrawn position, the tape-shaped circuit board is wound. The supply-side reel is rotated in the take-up direction to wind up the tape-like circuit board, and the storage-side reel is rotated in the take-up direction of the tape-like circuit board to wind up the tape-like circuit board. The method of conveying a tape-like circuit board according to any one of claims 18 to 25. 27. The tape-shaped circuit board has sprocket engagement holes (4a) at predetermined intervals so that the tape-like circuit board can be conveyed at a predetermined pitch by engaging with the sprocket.
27. The method of transporting a tape-shaped circuit board according to any one of the items 26. 28. The method according to claim 18, wherein the electrodes of the tape-shaped circuit board are aluminum electrodes. 29. The tape-like circuit board has a thickness of 0.2 m.
The method of transporting a tape-shaped circuit board according to any one of claims 18 to 28, wherein m is equal to or less than m. 30. The tape-like circuit board having a thickness of 0.2
The method for transporting a tape-shaped circuit board according to any one of claims 18 to 28, wherein the board is an insulator substrate having a thickness of not more than mm.