JPH1159615A - Taping equipment for electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To save labor and to lower cost by automatically replacing electronic parts with defective appearance when taping the electronic parts. SOLUTION: A carrier tape T1 which is provided in a line form with a mounting hole T5 and a feeding hole T6 is intermittently run by a pulse motor 7. A chip resistor, etc., is mounted one after another in the mounting hole T5 by the mounting/transporting means 14 of a supply means 11. The appearance of the chip resistor after mounting is checked by an appearance checking means 12. When the test result by the appearance checking means 12 is not good, a chip resistor for replacement is supplied to a transporting means 15 by the mounting/transporting means 14, and the transporting means 15 transports the same to the side of the defective chip resistor. An ejecting/mounting means 16 ejects the defective chip resistor from the mounting hole T5, and mounts the chip resistor to be replaced transported by the transporting means 15 in the mounting hole T5 after ejection. At the downstream of the appearance check position in the running direction of the carrier tape T1, an adhering means 13 adheres a cover tape T2 to the carrier tape T1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a square plate type chip fixed resistor, a melt type fixed resistor, a chip type capacitor, a Melf type capacitor, a multiple chip resistor, a multiple chip capacitor, an aluminum electrolytic capacitor, switch,
Mini-mold transistor, IC, filter, LSI,
Flat package IC, chip coil, connector, etc.
Inspection of various electronic components, such as printing, bending, chipping, etc., in order to select and tap non-defective electronic components, taping equipment for electronic components, especially new electronic components with poor appearance. The present invention relates to a device for automatically replacing electronic components.

[0002]

2. Description of the Related Art Electronic components such as square chip fixed resistors are mounted on a printed circuit board or the like by an automatic mounting machine. Taping electronic components. Conventionally,
Taping tapes used for taping electronic components include a type in which a loading hole for loading an electronic component is formed by punching and a type in which a drawing hole is formed by drawing.

FIGS. 18 (a) to 18 (c) show the former type of taping tape, and FIGS. 18 (a) and (b) are a plan view and a longitudinal sectional view for explaining the order of completion of the taping tape.
(C) is sectional drawing which follows the BB line of (a). FIG.
As shown in (a) to (c), the taping tape T includes a carrier tape T1 and a cover tape T2, and the carrier tape T1 includes a carrier tape body T3 and a bottom tape T4. The carrier tape body T3 is made of cardboard, and has a number of loading holes T5 and feed holes T6 for loading the electronic components R, which are arranged in a row along the longitudinal direction by punching.

In order to perform taping of the electronic component R using such a taping tape T, first, a bottom tape T4 made of a plastic film is adhered to the back surface of the carrier tape body T3 by thermocompression bonding, and a loading hole T5 is formed. The electronic component R is sequentially loaded into each of the loading holes T5, and then a cover tape T2 made of a plastic film is adhered to the surface of the carrier tape T1 by thermocompression bonding. By closing the upper opening of the electronic component R, the electronic component R can be loaded in a sealed state.

FIGS. 19A and 19B are a partial longitudinal sectional view and a transverse sectional view showing the latter type of taping tape. As shown in FIGS. 19A and 19B, the taping tape T includes a carrier tape T1 and a cover tape T2. The carrier tape T1 is provided with a recessed loading hole T5 for accommodating the electronic component R in a tape made of a transparent plastic film by drawing along the longitudinal direction and a feed hole T6 along the longitudinal direction. They are lined up by punching. The cover tape T2 is formed similarly to the case of the taping tape T shown in FIGS. And carrier tape T
The electronic components R can be loaded in a sealed state by sequentially loading the electronic components R into the one loading hole T5, overlapping the cover tape T2 on the surface of the carrier tape T1, and attaching them together.

Conventionally, as an apparatus for taping an electronic component while inspecting its appearance using the above-described taping tape, for example, a configuration described in Japanese Patent Publication No. 8-12053 has been known.

[0007] To explain the outline, an electronic component is linearly conveyed from a parts feeder by a linear feeder and sequentially supplied to a storage groove of a transfer disk intermittently rotated about a vertical axis. In the course of transporting the electronic component supplied to the device, the electrical characteristics such as the resistance value are measured and inspected, and the electronic component having a defective inspection result (the resistance value or the like is abnormal) is discharged from the storage groove.
An electronic component having a good inspection result (normal resistance value, etc.) is sequentially supplied to the loading hole T5 of the carrier tape T1 running intermittently in the tangential direction with the transport disk, and then is transported intermittently by the carrier tape T1. The appearance of the electronic component is inspected. If the appearance of the electronic component is good, it is left as it is. If the electronic component is bad, it is replaced with a good product and transported intermittently. A cover tape T2 is attached to the surface of the carrier tape T1, and a reel is attached. To take up.

[0008]

However, in the above-described conventional configuration, as a result of the appearance inspection of the electronic component,
If it is determined that the appearance is defective, the carrier tape stops running, and the operator picks up the defective electronic component with the device, discharges it from the loading hole, and picks up a new electronic component with the device and loads it. , Labor saving, cost reduction, etc. could not be achieved.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems. When the appearance of electronic parts is determined to be defective as a result of the appearance inspection, the defective electronic parts are automatically replaced with new electronic parts. It is an object of the present invention to provide a taping device for electronic components, which can be replaced as needed, and therefore can save labor and reduce costs.

[0010]

In order to achieve the above object, a taping device for electronic parts according to the present invention comprises a driving means for intermittently running a carrier tape having a row of holes and feed holes for electronic parts. An appearance inspection means for inspecting the appearance of an electronic component housed in the loading hole and intermittently conveyed; and, with the intermittent running of the carrier tape, an upstream side in the traveling direction of the carrier tape from the appearance inspection means. At the position, the electronic components are sequentially loaded into the loading holes, and when the inspection result by the visual inspection means is defective, the defective electronic components are discharged from the loading holes, and the replacement electronic components are discharged after the discharging. Supply means for loading into the loading hole, and a cover tape on the carrier tape at a position downstream of the appearance inspection position in the running direction of the carrier tape, and the loading hole is closed. Goods is that a sticking means for sticking as is encapsulated.

The supply means sequentially loads the electronic components into the loading holes of the carrier tape which runs intermittently. Loading / transferring means for transferring the replacement electronic component to the defective electronic component, and transferring means for transferring the replacement electronic component to the side position of the defective electronic component. Discharge / loading means for discharging the replacement electronic component transferred by the transfer means into the loading hole after the discharge while discharging from the loading hole can be provided.

[0012] Alternatively, the supply means includes a discharge means for discharging the defective electronic component from the loading hole of the carrier tape when the inspection result by the appearance inspection means is defective, and a charging means for loading the intermittently running carrier tape. It is possible to provide a loading means for loading the electronic components sequentially, and loading a replacement electronic component into the loaded hole after the discharge when the inspection result is defective.

[0013] Alternatively, the supply means may include a loading means for sequentially loading electronic components into the loading holes of the carrier tape running intermittently, and the electronic components may be removed from the loading holes when the result of inspection by the visual inspection means is defective. Discharging means for discharging,
When the inspection result is defective, the loading means may take out the electronic component loaded in the loading hole for replacement, and the replacement loading means may be loaded in the loaded hole after the discharging.

[0014] Alternatively, the supply means may include: loading means for sequentially loading electronic components into the loading holes of the carrier tape running intermittently; A discharging / loading means may be provided for discharging the electronic component loaded in the loading hole by the loading means for replacement and loading the electronic component into the loaded hole after the discharging.

[0015] Alternatively, the supply means may include a loading means for sequentially loading electronic components into the loading holes of the carrier tape which runs intermittently, and the electronic component may be removed from the loading holes when the inspection result by the visual inspection means is defective. Discharging means for discharging, after discharging the defective electronic component, after the carrier tape has run in the reverse direction, and again when running intermittently as described above, the loading hole after discharging by the loading means A replacement electronic component can be configured to be loaded into the electronic device.

According to the present invention configured as described above,
The electronic components are sequentially loaded into the loading holes of the carrier tape running intermittently by the supply means, and the appearance is inspected by the appearance inspection means. If the inspection result is good, the inspection is left as it is. The component is discharged from the loading hole, a new replacement electronic component is loaded into the loaded hole after the discharging, and then a cover tape is attached to the carrier tape by an attaching means, and only good electronic components are inserted into the loading hole. Can be encapsulated. Thus, a defective electronic component can be automatically replaced with a new electronic component.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. First, a first embodiment of the present invention will be described. FIGS. 1 to 4 show an electronic component taping apparatus according to a first embodiment of the present invention. FIG. 1 is an overall plan view, FIG. 2 is an overall front view, and FIG. FIG. 4 is a left side view of the discharging and loading means.

In this embodiment, FIG.
(B) Inspection, sorting, resistance value measurement (inspection), sorting, appearance inspection, sorting of square plate type chip fixed resistor (hereinafter abbreviated as chip resistor) R using taping tape T shown in (b). The case where taping is performed will be described. Although not shown, the chip resistor R has a carbon film formed on an outer surface of a resistor element made of ceramic (alumina),
A desired groove is formed in the carbon film to adjust the resistance value, the carbon film is protected by a coat layer made of glass or the like, and electrodes are provided on both sides on the short side.

As shown in FIGS. 1 to 4, the carrier tape T1 is pulled out from a supply source (not shown) and is rotatably supported on a base frame (not shown).
A feed hole T6 of the carrier tape T1 is engaged with a feed projection 3 which is hung on the feed wheel 2 or the like so as to be able to run in a horizontal direction, and is provided with a large number of feed projections 3 provided on the outer periphery of one side of each wheel 1, 2. The carrier tape T1 is pressed against the wheels 1 and 2 by the pressing rolls 4 and 5, so that the feed hole T6 is prevented from coming off the feed projection 3. Feed wheel 2
The output shaft of a pulse motor 7 is connected to the shaft 6, and the feed wheel 2 is intermittently rotated by driving the pulse motor 7,
The carrier tape T1 engaging the feed hole T6 with the feed projection 3 runs intermittently. Between the guide wheel 1 and the feed wheel 2, the carrier tape T1 runs intermittently in a horizontal direction along a guide groove 10 of a guide table 9 attached to a substrate 8 of a base frame.

During the intermittent running of the carrier tape T1,
The chip resistors R are sequentially loaded into the loading holes T5, and when the appearance inspection result is defective, the defective chip resistors R are discharged from the loading holes T5, and the replacement chip resistor R is discharged after the discharging. Supply means 11 to be loaded in the loading hole T5, appearance inspection means 12 for inspecting the appearance of the chip resistor R supplied by the supply means 11 as described above, and downstream from the appearance inspection position in the running direction of the carrier tape T1. At the side position, there is provided sticking means 13 for sticking the cover tape T2 to the carrier tape T1 such that the chip resistor R after inspection in the loading hole T5 is enclosed.

The supply means 11 sequentially loads the chip resistors R into the loading holes T5 of the carrier tape T1 running intermittently. Loading / transferring means 14 for transferring to the side position of T1 for replacement, and a chip resistor R for replacement transferred by the loading / transferring means 14
Means 15 for transferring the defective chip resistor R to the side position of the defective chip resistor R, discharging the defective chip resistor R from the loading hole T5, and discharging the replacement chip resistor R transferred by the transport means 15. And a discharging / loading means 16 for loading the latter loading hole T5.

The loading / transporting means 14 detects the front and back sides and measures the resistance value, and loads or transports a chip resistor R having a good quality into the loading hole T5 of the carrier tape T1. More specifically, an electrically insulating disk 17 is mounted on a vertical shaft 18, and the shaft 18 and the disk 17 are intermittently rotated by driving a pulse motor 19. A large number of storage recesses 20 are formed in the outer peripheral portion of the disk 17 at equally divided positions, and the disk 17 is intermittently rotated as described above, so that each storage recess 20 intermittently travels as described above. Each of the holes T5 of the tape T1 can be sequentially accommodated. A chip resistor R is sequentially supplied to each storage recess 20 of the disk 17 from a parts feeder 21 via a linear chute 22.

At the outer peripheral portion of the disk 17, from the supply position of the chip resistor R to the loading position, from the upstream side to the downstream side in the rotation direction of the disk 17, the front and back detection means 23, the discharge means 24, the first measurement Means 25, defective product discharging means 26,
A second measuring unit 27 and a defective product discharging unit 28 are sequentially arranged. The front and back detection means 23 can detect the front and back of the chip resistor R in the storage recess 20, and the discharge means 24 detects the chip resistor R whose front and back are supplied in the opposite direction as a result of the detection. 20 can be discharged. The first and second measuring means 25 and 27 can respectively measure the resistance value of the chip resistor R in the storage recess 20, and the defective product discharging means 26 and 28 respectively have a defective resistance value as a result of the above measurement. Can be discharged from the storage recess 20. If necessary, the chip resistor R supplied to the storage recess 20 of the disk 17 is transferred from the storage recess 20 when the chip resistor R is conveyed through each of the above-described means with the intermittent rotation of the disk 17. It is desirable to provide a cover plate, a suction means (both not shown), or the like to prevent detachment.

The loading / transporting means 14 will be specifically described. A fixed base 30 is attached to the substrate 8. A bearing member 31 is mounted on the fixed base 30, and a vertical guide shaft 32 is supported by the bearing member 31 so as to be able to move up and down. An air cylinder 34 for elevating is connected between the fixed table 30 and the elevating table 33, and the elevating table 33 is moved up and down by expansion and contraction of the air cylinder 34. Lifting table 3
A first (lower) linear guide 35 is mounted on the top 3. In the first linear guide 35, a movable portion 37 made of an aluminum alloy or the like is movably provided via a large number of steel balls 38 inside a guide base 36 made of an aluminum alloy or the like. An air cylinder 39 for movement is interposed between the air cylinder 37 and the air cylinder 37. The movable portion 37 can move forward or backward with respect to the guide table 36 by expansion and contraction of the air cylinder 39. The first linear guide 35 is arranged so that the movable portion 37 can move in a horizontal direction in a direction perpendicular to the traveling direction of the carrier tape T1.

A support 40 is fixed on the movable portion 37 of the first linear guide 35, and a second (upper) linear guide 41 is mounted on the support 40. The second linear guide 41 is, like the first linear guide 35,
It comprises a linear base 36, a movable part 37, a ball 38, and an air cylinder 39, and is arranged such that the movable part 37 can move horizontally in a direction perpendicular to the traveling direction of the carrier tape T1. Movable part 3 of second linear guide 41
7, a support table 42 is fixed, a holding table 43 is vertically fixed to a distal end of the support table 42, and a suction nozzle 44 is fixed to a distal end of a side protruding portion of the holding table 43. .
The suction nozzle 44 is arranged so that the suction part at the tip thereof faces downward, and the base is connected to a vacuum pump (both not shown) via a valve and a hose. Then, by driving the vacuum pump and opening a valve (not shown), the tip resistor R is held in a suction state by the suction nozzle 44, and the tip resistor R is released from the suction nozzle 44 by closing the valve. be able to.

The loading / transporting means 14 comprises a first and a second
The first linear guide 3 by the linear guides 35 and 41
5 is moved in two stages, and accordingly, the suction nozzle 44 is moved to the storage recess 20 at the loading position of the disk 17.
Is moved between an upper position of the carrier tape T1 and a position above a holding hole 53 of the transfer means 15 to be described later (see a solid line and a chain line in FIG. 1). Also,
The first and second linear guides 35 and 41, the suction nozzle 44, etc. are moved up and down by the expansion and contraction of the air cylinder 34, and the suction portion at the tip of the suction nozzle 44 approaches the storage recess 20 or the holding hole 53, Or, they are separated from each other (see a solid line and a chain line in FIG. 3). Therefore, the suction nozzle 44 descends while facing the storage recess 20,
After the chip resistor R in the storage recess 20 is sucked, the chip resistor R rises, and then descends in a state where the suction nozzle 44 faces the holding hole 53, and rises after the chip resistor R is released and supplied to the holding hole 53. can do.

The transfer means 15 will be described in detail. A rodless cylinder 45 is provided on a side of the guide table 9 opposite to the disk 17 along the running direction of the carrier tape T1. This rodless cylinder 4
5 has a cylinder tube 47 attached to a column 46,
A piston (not shown) having a magnet inside the cylinder tube 47 is housed so as to be slidable along the axial direction of the cylinder tube 47 by air press-fitted into the cylinder tube 47, and a magnet is placed outside the cylinder tube 47. The slider 48 is provided so as to be able to slide along the axial direction of the cylinder tube 47 by utilizing the magnetic force of the magnet as the piston moves. Stoppers 49, 5 are provided at both ends of the cylinder tube 47.
0 is attached, and the movement range of the slider 48 is regulated.

A mounting table 51 is fixed to the slider 48, a holding table 52 is fixed to the mounting table 51, and a holding hole 53 for holding the chip resistor R in a housed state is formed at the tip of the holding table 52. Have been. The bottom of the holding hole 53 is connected to a suction path 54 that is opened outward, and the suction path 54 is connected to a vacuum pump (not shown) via a valve via a hose 55. Then, the slider 48 moves toward the upstream side (the left side in FIGS. 1 and 2) in the traveling direction of the carrier tape T1, and the holding hole 53 is sucked by the loading / transporting means 14 in a state where the position is regulated by the stopper 49. The slider 48 is positioned so as to correspond to the nozzle 44, and moves toward the downstream side (to the right in FIGS. 1 and 2) in the traveling direction of the carrier tape T <b> 1. It is set to be located on the side of. Therefore, the chip resistor R supplied to the holding hole 53 by the loading / transporting means 14 as described above and held in the suction state by the driving of the vacuum pump and the opening of the valve is moved to the side of the visual inspection position. Can be transported.

The discharging / loading means 16 will be described in detail. The discharging / loading means 16 has a single suction nozzle 44 while the loading / transporting means 14 has one suction nozzle 44.
The difference is that a suction nozzle is provided. That is, the fixed table 5 is mounted on the substrate 8 on the side opposite to the loading / transferring means 14.
6 is attached. The bearing member 5 is provided on the fixed base 56.
A vertical guide shaft 58 is supported by the bearing member 57 so as to be able to move up and down, and an elevating table 59 is attached to the upper end of the guide shaft 58. Fixed table 56 and lifting table 5
An air cylinder 60 for elevating is connected between the air cylinder 9 and the elevating table 59 by the expansion and contraction of the air cylinder 60. A first (lower) linear guide 61 is mounted on the elevating table 59. Similarly to the above, the first linear guide 61 can move such that the movable portion moves forward or backward with respect to the guide table by expansion and contraction of the air cylinder. The first linear guide 61 is arranged such that its movable part can move in the horizontal direction in a direction perpendicular to the traveling direction of the carrier tape T1.

A support 62 is fixed on the movable portion of the first linear guide 61, and a second (upper) linear guide 63 is mounted on the support 62. The movable portion of the second linear guide 63 is the carrier tape T in the same manner as described above.
It is arranged so as to be able to move in a horizontal direction at right angles to one traveling direction. A support base 64 is fixed on the movable portion of the second linear guide 63, a holding base 65 is fixed vertically to a tip end of the support base 64, and a tip end of a side protrusion of the holding base 65 is The suction nozzles 66 and 67 are fixed. The suction nozzles 66 and 67 are arranged such that the suction portions at the tips thereof face downward, and the bases thereof are connected to a vacuum pump (both not shown) via a valve and a hose. Then, by driving the vacuum pump and opening the valve, the tip resistor R is held in the suction state by the suction nozzles 66 and 67, and by closing the valve, the suction nozzle 66 and
From 67, the chip resistor R can be released.

Then, the loading / transporting means 16 comprises the first and second
The first linear guide 6 by the linear guides 61 and 62
The movable part 1 is moved in two stages, and accordingly, the suction nozzles 66 and 67 move into the loading hole T5 at the appearance inspection position on the carrier tape T1 and the holding hole 53 on the side of the appearance inspection position on the transfer means 15; The suction nozzles 66 and 67 are moved between the tape T1 and a position deviated laterally from the tape T1 (see the solid and chain lines in FIGS. 1 and 4).
Are moved so as to correspond to the loading hole T5 of the carrier tape T1 and the receiving box 68 of the defective chip resistor R, and the first and second linear guides 6 are moved by the expansion and contraction of the air cylinder 60.
1, 63, the suction nozzles 66, 67, etc. are moved up and down, and the suction portions at the tips of the suction nozzles 66 and 67 are inserted into the loading hole T5 and the holding hole 5.
3 (see solid line and chain line in FIG. 3). Accordingly, the suction nozzle 66 descends in a state facing the loading hole T5, rises after sucking the chip resistor R in the loading hole T5, and descends in a state in which the suction nozzle 67 faces the holding hole 53. It can rise after sucking the chip resistor R. Further, the suction nozzle 66 is lowered in a state where the suction nozzle 66 faces the receiving box 68 to release the suctioned chip resistor R, and then is raised, and the suction nozzle 67 is moved to the loading hole T of the carrier tape T1.
5 can be lowered in a state opposite to 5, and can be raised after releasing the sucked chip resistor R.

The appearance inspection means 12 will be described in detail. Illumination equipment 70 for illuminating the chip resistor R intermittently conveyed with the intermittent running of the carrier tape T1.
And the chip resistor R illuminated by the lighting fixture 70
An imaging camera 71 that captures an image of the chip resistor R is supported by a support arm 73 fixed to a base 72, the imaging data obtained by the imaging camera 71 is compared with reference data by a processing device (not shown), It is possible to determine whether the appearance is good or bad, and if so, stop driving the pulse motor 7 for driving the carrier tape T1 and drive the supply means 11. .

The sticking means 13 will be described in detail.
, The carrier tape T1 running along the guide table 9 and the guide groove 10 can be moved forward and backward. And the cover tape T2 is the guide roll 7
The cover tape T2 is pushed by the thermocompression bonding portion 74 that is guided by the air cylinders 75 and is guided by the air cylinder 75, and is pressed against the surface of the carrier tape T1 in a heated state. And the loading hole T5 is closed, and the chip resistor R
To complete the taping tape T.

The operation of the above configuration will be described below. The carrier tape T1 is unwound from a reel (not shown), hangs on the guide wheel 1, is inserted into the guide groove 10 of the guide table 9, and then hangs on the feed wheel 2, and the feed hole T6 of the carrier tape T1 is inserted into each wheel 1, 2 , And the carrier tape T1 is pressed against the wheels 1 and 2 by the pressing rolls 4 and 5 to prevent the carrier tape T1 from coming off. After setting in this manner, the feed wheel 2 is intermittently rotated by driving the pulse motor 7, and the carrier tape T1 is caused to run intermittently.

On the other hand, the disk 17 is intermittently rotated by driving the pulse motor 19, and the chip resistor R supplied from the parts feeder 21 to the storage recess 20 via the linear chute 22 is intermittently conveyed. With this intermittent conveyance, first, the front and back detection means 23 detects the front and back of the chip resistor R, and passes the chip resistor R in the normal direction as it is,
The chip resistor R in the opposite direction is discharged out of the storage recess 20 by the discharging means 24. Subsequently, the resistance value of the chip resistor R is measured by the first measuring means 25, and the chip resistor R having a good resistance value is passed as it is, and the defective chip resistor R is passed.
Is discharged out of the storage recess 20 by the defective product discharging means 26. Subsequently, the second measuring unit 27 and the defective product discharging unit 28
However, similarly, the resistance value of the chip resistor R is measured and sorted.

When the detection of the front and back sides and the measurement of the resistance value are performed, and these good chip resistors R are transported to the loading position,
The movable part 37 of the first and second linear guides 35 and 41 of the loading and transferring means 14 is moved in two steps to
Is advanced to the storage recess at the loading position on the disk 17, that is, the chip resistor R. Then, the air cylinder 3
4, the first and second linear guides 35 and 41, the suction nozzle 44, and the like are lowered to bring the suction portion of the suction nozzle 44 into contact with or close to the chip resistor R, and the valve is driven in a state where the vacuum pump is driven. Is opened, and the chip resistor R is sucked by the suction nozzle 44 which becomes a negative pressure. Subsequently, the air cylinder 35 is extended, and the first and second linear guides 35, 41,
By raising the suction nozzle 44 and the like, the chip resistor R is taken out of the storage recess 20, and the movable portion of the second linear guide 41 is moved so as to return, so that the suction nozzle 44 holding the chip resistor R is moved. The carrier tape T1 is stopped from running and is retracted onto the loading hole T5. Subsequently, the air cylinder 34 is contracted, and the first and second linear guides 35, 41,
By lowering the suction nozzle 44 and the like, the chip resistor R held by the suction nozzle 44 is inserted into the loading hole T of the carrier tape T1.
5, the tip resistor R is released from the suction nozzle 44 by closing the valve, and is loaded into the loading hole T5. By repeating the above operation, the chip resistors R can be sequentially loaded into the loading holes T5 of the carrier tape T1 that runs intermittently.

With the intermittent running of the carrier tape T1,
When the chip resistor R loaded in the loading hole T5 reaches the appearance inspection position, the chip resistor R is illuminated by the lighting fixture 70 and captured by the imaging camera 71, and the captured data is compared with the reference data by the processing device. Printing defects, cracks,
It is determined whether or not there is a defective appearance such as chipping. Here, when it is determined that the appearance of the chip resistor R is good, the carrier tape T1 by the loading / transporting means 14 is determined in the same manner as described above.
The work of loading the chip resistor R into the loading hole T5 and the work of inspecting the appearance of the chip resistor R by the appearance inspection means 12 are continued. On the other hand, if it is determined that the appearance of the chip resistor R is bad, first, the traveling of the carrier tape T1 is stopped, and the first and second linear guides 3 of the loading / transporting means 14 are stopped.
The movable nozzles 37 of 5 and 41 are retracted in two stages from the forward position, and the chip resistor R is taken out from the storage recess 20 of the disk 17 for replacement and held in the suction state in the same manner as described above. Is positioned on the holding hole 53 of the transfer means 15 located on the loading / transfer means 14 side. Subsequently, the air cylinder 34 is contracted, the first and second linear guides 35 and 41, the suction nozzle 44, etc. are lowered, and the chip resistor R held by the suction nozzle 44 is inserted into the holding hole 53, By closing the valve, the chip resistor R is released from the suction nozzle 44 and supplied to the holding hole 53. The chip resistor R in the holding hole 53 is sucked through the pipe 55 and the suction passage 54 by opening the valve, and is held in a fixed state.

Subsequently, the rodless cylinder 45 of the transfer means 15 is driven to separate the slider 48 and the holding table 52 from the loading / transfer means 14, and is slid toward the visual inspection position, and is held in the holding hole 53. The replacement chip resistor R is transferred to the side position of the chip resistor R detected as defective. Subsequently, the movable part 37 of the first and second linear guides 61 and 63 of the discharging / loading means 16 is moved in two steps so that the suction nozzle 66 is positioned above the defective chip resistor R in the loading hole T5. At the same time, the suction nozzle 67 is advanced so that the suction nozzle 67 is positioned above the replacement chip resistor R in the holding hole 53. Subsequently, the air cylinder 60 is contracted, and the first and second linear guides 61 and 63, the suction nozzle 66,
By lowering 67 and the like, the suction portions of the suction nozzles 66 and 67 are brought into contact with or close to the defective chip resistor R in the loading hole T5 and the replacement chip resistor R in the holding hole 53, respectively. Suction nozzle 66 that becomes negative pressure when opened
And 67, the defective chip resistor R and the replacement chip resistor R are sucked. At this time, by closing the valve for the replacement chip resistor R, the holding hole 53
Release from

Subsequently, the air cylinder 60 is extended, and the first and second linear guides 61 and 63, the suction nozzle 66,
The defective chip resistor R and the replacement chip resistor R are taken out from the loading hole T5 and the holding hole 53 by raising 67 and the like, respectively, and are moved so that the movable portion 37 of the second linear guide 63 is returned. The suction nozzles 66 and 67 holding the defective chip resistor R and the replacement chip resistor R are respectively formed on the receiving box 68 and the empty carrier tape T1 from which the defective chip resistor R is discharged. It is retracted so as to be located on the loading hole T5. Subsequently, the air cylinder 60 is contracted, and the first and second linear guides 61 and 63, the suction nozzles 66 and 67 are lowered, and the defective chip resistor R held by the suction nozzle 66 is placed in the receiving box 68. Then, the replacement tip resistor R held by the suction nozzle 67 is inserted into the empty loading hole T5, and the defective tip resistor R is released from the suction nozzle 66 by closing the valve. The chip resistor R for replacement is released from the suction nozzle 67 and loaded into the loading hole T5.

Subsequently, the air cylinder 60 is extended, and the first and second linear guides 61 and 63, the empty suction nozzle 6
6, 67 and the like are raised, and the movable portion 37 of the first linear guide 61 is retracted so as to return, and the suction nozzles 66, 6
7 is further retracted to the original position, and waits for the next operation of discharging the defective chip resistor R and the operation of loading the replacement chip resistor R. During this time, the rodless cylinder 45 of the transfer means 15 is driven in the reverse direction to return the slider 48 and the holding table 52 to the loading / transfer means 14 side, and wait for the next transfer of the chip resistor R for replacement. Hereinafter, the above operation is repeated.

As described above, when only the good chip resistor R is loaded into each of the loading holes T5 of the carrier tape T1 and the carrier tape T1 is driven intermittently, the cover tape T2 is attached to the carrier tape T2 by the attaching means 13 as described above. The chip resistor R is adhered to the surface of T1 to seal the chip resistor R in the loading hole T5, and the taping tape T is completed and can be wound around a reel (not shown). Since the taping tape T has no loading hole T5 in which the chip resistor R is empty, the chip resistor R
Can be smoothly and reliably mounted on a printed circuit board or the like by a mounting machine.

In this embodiment, the defective chip resistor R is removed from the carrier tape T by the discharging / loading means 16.
1 during the operation of discharging the chip resistor R for replacement into the empty charging hole T5 after discharging while discharging from the loading hole T5.
The chip resistor R in the storage recess 20 of the disk 17 is supplied to the holding hole 53 of the transfer means 15 by the loading / transfer means 14, and the replacement chip resistor R is provided in the holding hole 53. By always replenishing, the replacement time of the chip resistor R can be shortened, and the replacement work, ie, the taping work, can be speeded up.

A modification of the loading / transporting means 14 in this embodiment will be described with reference to the schematic explanatory view shown in FIG. As shown in FIG. 5, similarly to the above, a good chip resistor R after the front and back and the resistance value are detected is replaced with the inclined chute 7.
8, supplied in a continuous state. The base of the cam lever 80 is fixed to a rotating shaft 79 rotatably supported by a base frame (not shown). A roller 81 is rotatably supported at the tip of the cam lever 80, and the cam lever 80 is
As a result, the roller 81 is always in contact with the outer peripheral surface of the cam 83. Rotating shaft 79
The base of the swing arm 84 is fixed to the arm. A support 85 is fixed to the tip of the swing arm 84.
Is attached with a linear guide 86 having the same configuration as that described above. A holding table 87 is provided on the movable portion of the linear guide 86.
A suction nozzle 83 communicated with a vacuum pump via a valve and a hose is supported on the holding table 87 so as to be movable in the axial direction, and an air cylinder 89 is fixed to the holding table 87. A piston rod 90 of the air cylinder 89 is connected to a suction nozzle 88 by a connection plate 92, and the suction nozzle 88 is moved up and down as the piston rod 90 expands and contracts.

The operation of the above configuration will be described below. When the cam 83 is rotated by the drive of a motor (not shown), the cam lever 80 swings, and accordingly, the swing arm 84 swings as shown by a chain line and a solid line. Then, first, the air cylinder 89
The suction nozzle 88 is lowered toward the inclined chute 78 by extending the piston rod 90 of the suction nozzle 88.
Is brought into contact with or close to the chip resistor R at the lowermost end in the inclined chute 78, the valve is opened while the vacuum pump is driven, and the chip resistor R is sucked by the suction nozzle 88. Subsequently, by retracting the piston rod 90 of the air cylinder 89, the suction nozzle 88 is raised to the side separated from the inclined chute 78, and the chip resistor R is taken out from the inclined chute 78. Subsequently, the swing arm 84
Swings to the solid line position, the piston rod 90 of the air cylinder 89 is extended to lower the suction nozzle 88, etc., toward the loading hole T5 side of the carrier tape T1 so that the chip resistor R held by the suction nozzle 88 Is inserted into the loading hole T5, the valve is closed, the tip resistor R is released from the suction nozzle 88, and the tip resistor R can be loaded into the loading hole T5. After the loading, the piston rod 90 of the air cylinder 89 is contracted, so that the empty suction nozzle 88
Is raised so as to be separated from the carrier tape T1.
By repeating these operations, the chip resistors R can be sequentially loaded into the loading holes T5 of the carrier tape T1 that runs intermittently.

When replacing the chip resistor R determined to be defective by the appearance inspection, the chip resistor R is replaced as described above.
Is taken out of the inclined chute 78 by the suction nozzle 88 and is swung to the solid line position together with the swing arm 84 in a state of being suction-held, and then the movable portion of the linear guide 86 is moved to move the air cylinder 89, the suction nozzle 88 and the like to the chain line position. Then, the suction nozzle 88 holding the chip resistor R is opposed to the holding hole 53 of the holding table 52. Subsequently, by extending the piston rod 90 of the air cylinder 89, the suction nozzle 88 and the like are lowered toward the holding table 52, and the chip resistor R held by the suction nozzle 88 is inserted into the holding hole 53, and the valve is opened. Is closed to release the chip resistor R from the suction nozzle 88, and the chip resistor R can be supplied into the holding hole 53. After the supply, the piston rod 90 of the air cylinder 89 is contracted to raise the empty suction nozzle 88, the movable portion of the linear guide 86 is returned, and the suction nozzle 88 and the like are returned to the carrier tape T1 side. It is possible to wait for the operation of loading the resistor R on the carrier tape T1.

Next, a second embodiment of the present invention will be described. 6 to 8 show an electronic component taping apparatus according to a second embodiment of the present invention. FIG. 6 is a plan view of a main part, FIG. 7 is a left side view of a loading unit, and FIG. FIG.

As shown in FIGS. 6 to 8, in the present embodiment, the supply means 11 comprises discharge means 92 for discharging the chip resistor R having a defective appearance inspection result from the loading hole T5 of the carrier tape T1. The chip resistors R are sequentially loaded into the loading holes T5 of the carrier tape T1 running intermittently, and when the inspection result is defective, the replacement chip resistors R are emptied after the discharge. And a loading means 93 for loading the hole T5. Other configurations are the same as those of the first embodiment, and thus different configurations will be mainly described.

The discharging means 92 will be specifically described. A support 95 is fixed to a substrate 94, and a linear guide 96 is mounted on the support 95. The linear guide 96 has a movable portion 37 provided inside the guide base 36 so as to be movable via a large number of balls 38, similarly to the above-described embodiment. A cylinder 39 is interposed. The movable portion 37 can move forward or backward with respect to the guide table 36 by expansion and contraction of the air cylinder 39. The linear guide 96 is arranged such that the movable portion 37 can move horizontally in a direction perpendicular to the traveling direction of the carrier tape T1.

A support table 97 is fixed on the movable section 37 of the linear guide 96, and a linear guide 98 is mounted on a vertical section on the front side of the support table 97. The linear guide 98 is also configured in the same manner as described above, and is arranged so that the movable portion 37 can move in the vertical direction. Linear guide 9
A holding table 99 is fixed on the movable section 37 of the holding table 9.
The suction nozzle 100 is fixed to the horizontal portion of the nozzle 9. The suction nozzle 100 is arranged so that the suction part at the tip thereof faces downward, and the base is connected to a vacuum pump (not shown) via the hose 101 and a valve.

The movement of the movable portion 37 of the linear guide 96 causes the suction nozzle 100 to move between the position above the loading hole T5 of the carrier tape T1 and the position above the receiving box 102 on the disk 17 side of the carrier tape T1. (See a chain line and a solid line in FIG. 8), and the moving portion 37 of the linear guide 98 moves the suction portion at the tip of the suction nozzle 100 toward the loading hole T5 or the receiving box 102,
Alternatively, they are separated from each other (see a chain line and a solid line in FIG. 8).

More specifically, the loading means 93 will be described.
4 is provided with a linear guide 105. As in the above embodiment, the linear guide 105 also has a movable portion 37 provided inside the guide base 36 so as to be movable via a number of balls 38, and an air for expansion and contraction is provided between the guide base 36 and the movable portion 37. A cylinder 39 is interposed. And
The movable portion 37 is moved by the expansion and contraction of the air cylinder 39 so that the guide table 3
6 to move forward or backward. The linear guide 105 is arranged such that the movable portion 37 can move in the horizontal direction along the traveling direction of the carrier tape T1.

A support 106 is fixed on the movable portion 37 of the linear guide 105, and a linear guide 107 is mounted on the support 106. This linear guide 10
7 is configured similarly to the above embodiment, and is arranged such that the movable portion 37 can move in a horizontal direction in a direction perpendicular to the traveling direction of the carrier tape T1. A support 108 is fixed on the movable portion 37 of the linear guide 107, and a linear guide 109 is attached to a vertical portion on the front side of the support 108. The linear guide 109 is also configured in the same manner as in the above embodiment, and is arranged so that the movable portion 37 can move in the vertical direction. A holding table 110 is fixed on the movable portion 37 of the linear guide 109, and the holding table 11
The suction nozzle 111 is fixed to the horizontal portion of the “0”. The suction nozzle 111 is arranged so that the suction part at the tip thereof faces downward, and the base is connected to a vacuum pump (not shown) via a valve (not shown) and a hose 112.

The movable portion 37 of the linear guide 107
The suction nozzle 111 is moved between the position above the storage recess 20 at the loading position of the disk 17 and the position above the loading hole T5 of the carrier tape T1 (see the chain line and the solid line in FIG. 7), and the linear guide 109 is moved. Of the suction nozzle 111 by the movement of the movable part 37,
0 or close to or away from the loading hole T5 (see a chain line and a solid line in FIG. 7). Also, the movement of the movable portion 37 of the linear guide 105 causes the suction nozzle 111 to be positioned above the loading hole T5 for loading the chip resistor R in the storage recess 20 of the disk 17 and above the loading hole T5 at the visual inspection position. The suction nozzle 1 is moved by moving the movable portion 37 of the linear guide 109.
The suction part at the tip of 11 is approached to each loading hole T5,
Or they are separated.

The operation of the above configuration will be described below. As in the first embodiment, the disk 17
With the intermittent rotation, detection of the front and back sides and measurement of the resistance value are performed, and when those good chip resistors R are transported to the loading position, first, the movable portion 37 of the linear guide 109 of the loading means 93 is suctioned. By lowering the nozzle 111 or the like, the suction portion of the suction nozzle 111 is brought into contact with or close to the chip resistor R in the storage recess 20 of the disk 17, and the valve is opened with the vacuum pump being driven, and the chip is operated by the suction nozzle 111. The resistor R is sucked. Subsequently, the movable portion 37 of the linear guide 109, the suction nozzle 111, and the like are raised to raise the chip resistor R
Is removed from the storage recess 20, and the movable portion 37 of the linear guide 107, the linear guide 109, the suction nozzle 111 holding the chip resistor R, and the like are retracted, and the suction nozzle 111 holding the chip resistor R is removed. It is positioned above the loading hole T5 of the carrier tape T1 that has stopped running. Subsequently, the movable portion 37 of the linear guide 109, the suction nozzle 11
Then, the tip resistor R held by the suction nozzle 111 is inserted into the loading hole T5, the valve is closed, and the tip resistor R is released from the suction nozzle 111.
Load 5 After loading, the movable part 3 of the linear guide 109
7. The empty suction nozzle 111 and the like are raised, the movable portion 37 of the linear guide 107, the linear guide 109, the suction nozzle 111 and the like are advanced, and the suction nozzle 111 is positioned on the storage recess 20 of the disk 17 and the next time. Wait for loading work. By repeating the above operation, the chip resistors R can be sequentially loaded into the loading holes T5 of the carrier tape T1 that runs intermittently.

With the intermittent running of the carrier tape T1,
The appearance of the chip resistor R loaded in the loading hole T5 is inspected by the appearance inspection means 12 in the same manner as in the first embodiment. Here, when it is determined that the appearance of the chip resistor R is good, the loading operation of the chip resistor R into the loading hole T5 of the carrier tape T1 by the loading means 93 and the chip resistor R by the appearance inspection means 12 are performed in the same manner as described above. Continue the visual inspection work of R. On the other hand, when it is determined that the chip resistor R has poor appearance, first, the traveling of the carrier tape T1 is stopped, and the movable portion 3 of the linear guide 96 of the discharging means 92 is moved.
7, the linear guide 98, the suction nozzle 101, etc. are advanced, and the suction nozzle 101 is moved to the loading hole T of the carrier tape T1.
5, that is, located on the defective chip resistor R.
Subsequently, the movable portion 37 of the linear guide 98, the suction nozzle 1
By lowering 01 or the like, the suction portion of the suction nozzle 101 is brought into contact with or close to the defective chip resistor R, and the valve is opened to suck the defective chip resistor R by the suction nozzle 101. Subsequently, the movable portion 37 of the linear guide 98, the suction nozzle 101, and the like are raised to take out the defective chip resistor R from the loading hole T5, and the movable portion 3 of the linear guide 96 is removed.
7. The linear guide 98, the suction nozzle 101 holding the defective chip resistor R, and the like are retracted, and the suction nozzle 101 holding the defective chip resistor R is positioned above the receiving box 102. Subsequently, the movable portion 37 of the linear guide 98, the suction nozzle 101, etc.
By bringing the defective chip resistor R held by 1 close to the receiving box 102 and closing the valve, the defective chip resistor R can be released from the suction nozzle 101 and dropped into the receiving box 102. .

As described above, while the defective chip resistor R is discharged from the loading hole T5 by the discharging means 92, first, the movable portion 37 of the linear guide 109 of the loading means 93, the suction nozzle 111, etc. To lower the suction nozzle 1
The suction unit 11 is brought into contact with or close to the chip resistor R in the storage recess 20 of the disk 17, the valve is opened, and the chip resistor R is sucked for replacement by the suction nozzle 111. Subsequently, the movable portion 37 of the linear guide 109, the suction nozzle 111, and the like are raised, and the replacement chip resistor R is taken out of the storage recess 20. Subsequently, the linear guide 107
Of the movable nozzle 37, the linear guide 109, the suction nozzle 111 holding the replacement chip resistor R, and the like,
Suction nozzle 11 holding chip resistor R for replacement
Loading hole T5 of the carrier tape T1 that has stopped traveling
On top. Subsequently, the movable portion 37 of the linear guide 105, the linear guide 107, the linear guide 109, the suction nozzle 111 holding the replacement chip resistor R, and the like are moved to the visual inspection means 12 side, and the replacement chip resistor is moved. The suction nozzle 111 holding the device R is positioned above the empty charging hole T5 from which the defective chip resistor R has been discharged. Subsequently, the movable part 3 of the linear guide 109
7. Lower the suction nozzle 111 and the like so that the suction nozzle 111
Is inserted into the loading hole T5, the valve is closed to release the replacement tip resistor R from the suction nozzle 111, and the replacement tip resistor R is loaded into the loading hole T5.
After the loading, the movable part 37 of the linear guide 109, the empty suction nozzle 111, etc. are raised, and the movable part 37, the linear guide 107, the linear guide 109, the suction nozzle 111, etc. of the linear guide 105 are moved to the disk 17 side, and The movable part 37 of the guide 107, the linear guide 109, the suction nozzle 111, etc. are advanced, and the suction nozzle 111 is positioned on the storage recess 20 of the disk 17 to wait for the next loading operation. Thus, only the good chip resistor R is loaded into the loading hole T5 of the carrier tape T1, and the taping operation is completed by attaching the cover tape T2 to the surface of the carrier tape T1 by the attaching means 13.

Next, a third embodiment of the present invention will be described. 9 to 11 show an electronic component taping device according to a third embodiment of the present invention. FIG. 9 is a plan view of a main part, FIG. 10 is a left side view of a loading unit and a replacement loading unit, and FIG. It is a left view of a discharge means.

As shown in FIGS. 9 to 11, in this embodiment, the supply means 11 comprises: loading means 113 for sequentially loading the chip resistors R into the loading holes T5 of the carrier tape T1 running intermittently; A discharging means 114 for discharging the chip resistor R whose inspection result by the visual inspection means 12 is defective from the loading hole T5, and a chip resistor loaded in the loading hole T5 by the loading means 113 when the inspection result is defective. A replacement loading means 115 for taking out the R for replacement and loading it into the empty loading hole T5 after the discharge is provided. Other configurations are the same as those of the first embodiment, and thus different configurations will be mainly described.

The loading means 113 will be specifically described. A support base 116 is mounted on a base frame (not shown).
A linear guide 117 is mounted on the support base 116. The linear guide 117 can move so that the movable part moves forward or backward by expansion and contraction of the air cylinder, similarly to the above embodiment, and the movable part moves in the direction perpendicular to the running direction of the carrier tape T1. It is arranged so that it can move. A support stand 118 is fixed on the movable portion of the linear guide 117, and a support stand 119 is provided on the support stand 118 so as to protrude to the side of the linear guide 117.
Has been fixed. The holding nozzle 119 has a suction nozzle 120
Can move in the axial direction with the suction part facing downward (can be moved up and down)
And the air cylinder 121 is fixed in the vertical direction. The piston rod 122 of the air cylinder 121 is connected to the suction nozzle 120 by a connection plate 123, and the suction nozzle 120 is moved up and down as the piston rod 122 expands and contracts.

Then, by the movement of the movable portion of the linear guide 117, the suction nozzle 120 is moved between the position above the storage recess 20 at the loading position of the disk 17 and the position above the loading hole T5 of the carrier tape T1. 9), the piston rod 12 of the air cylinder 121.
With the expansion and contraction of 2, the suction nozzle 120 is moved up and down so that the suction portion at the tip approaches or is separated from the storage recess 20 or the loading hole T5.

The discharge means 114 will be specifically described. A support base 124 is mounted on a base frame (not shown).
A linear guide 125 is mounted on the support 124. The linear guide 125 can move so that the movable part moves forward or backward by expansion and contraction of the air cylinder, similarly to the above-described embodiment, and the movable part moves in the direction perpendicular to the running direction of the carrier tape T1. It is arranged so that it can move. A support 126 is fixed on the movable portion of the linear guide 125, and a support 127 is provided on the support 126 so as to protrude to the side of the linear guide 125.
Has been fixed. The holding nozzle 127 has a suction nozzle 128
Can move in the axial direction with the suction part facing downward (can be moved up and down)
And the air cylinder 129 is fixed in the vertical direction. The piston rod 130 of the air cylinder 129 is connected to the suction nozzle 128 by a connecting plate 131, and the suction nozzle 128 is moved up and down as the piston rod 130 expands and contracts.

The movement of the movable portion of the linear guide 125 causes the suction nozzle 128 to move between the position above the receiving box 132 on the side of the carrier tape T1 on the disk 17 side and the position above the loading hole T5 of the carrier tape T1. The suction nozzle 128 is moved up and down as the piston rod 130 of the air cylinder 129 expands and contracts (see the solid line and chain line in FIGS. 9 and 10), and the suction portion at the tip is moved to the receiving box 132 or the loading hole T5. They are approached or separated.

The replacement loading means 115 will be specifically described. The rodless cylinder 13 is mounted on a base frame (not shown).
Three cylinder tubes 134 are attached. The support stand 1 is attached to the slider 135 of the rodless cylinder 133.
The linear guide 137 is mounted on the support base 136. This linear guide 137
In the same manner as described above, the movable portion can be moved forward or backward by the expansion and contraction of the air cylinder, and the movable portion can be moved in the direction perpendicular to the running direction of the carrier tape T1. Have been. A support table 138 is fixed on the movable portion of the linear guide 137, and a holding table 139 is fixed to the support table 138 so as to protrude to the side of the linear guide 137. A suction nozzle 140 is supported by the holding table 139 so as to be movable in the axial direction with the suction part facing downward (movable up and down).
1 is fixed in the vertical direction. The piston rod 142 of the air cylinder 141 is connected to the suction nozzle 140 by the connecting plate 14.
The suction nozzle 140 is moved up and down as the piston rod 142 expands and contracts.

The movement of the movable portion of the linear guide 137 causes the suction nozzle 140 to move to the upper side (standby position) of the carrier tape T1 on the side opposite to the disk 17 and the chip resistance by the loading means 113 at the carrier tape T1. The container R is moved to and from a position above the loading hole T5 in which the container R is loaded (see solid and chain lines in FIGS. 9 and 10),
In addition, the operation of the rodless cylinder 133 moves the suction nozzle 140 between the position above the loading hole T5 and the position above the loading hole T5 at the visual inspection position (see the solid line and the chain line in FIG. 9). With the expansion and contraction of the piston rod 142, the suction nozzle 140 is moved up and down so that the suction portion at the distal end approaches or separates from the loading hole T5.

The operation of the above configuration will be described below. As in the first embodiment, the disk 17
With the intermittent rotation, detection of the front and back sides and measurement of the resistance value are performed. When those good chip resistors R are transported to the loading position, first, the piston rod 122 of the air cylinder 121 of the loading means 113 is extended. The suction nozzle 120 and the like are lowered to bring the suction portion of the suction nozzle 120 into contact with or close to the chip resistor R in the storage recess 20 of the disk 17, and the valve is opened while the vacuum pump is driven to open the suction nozzle 120. Sucks the chip resistor R. Subsequently, the piston rod 122 of the air cylinder 121 is contracted, and the suction nozzle 120 and the like are raised to store the chip resistor R in the recess 2.
Take from 0. Subsequently, the movable portion of the linear guide 117, the suction nozzle 120 holding the chip resistor R, and the like are retracted, and the carrier tape T1 that has stopped traveling along the suction nozzle 120 holding the chip resistor R is loaded. It is located on the hole T5. Subsequently, the piston rod 122 of the air cylinder 121 is extended, the suction nozzle 120 is lowered, the tip resistor R held by the suction nozzle 120 is inserted into the loading hole T5, and the valve is closed to close the tip resistor R. Is released from the suction nozzle 120, and is loaded into the loading hole T5. After loading, the piston rod 122 of the air cylinder 121 is contracted to raise the empty suction nozzle 120 and the like, and the movable portion of the linear guide 117, the suction nozzle 120 and the like are advanced, and the suction nozzle 120 is moved above the storage recess 20 of the disk 17. And wait for the next loading operation. By repeating the above operation, the carrier tape T running intermittently
The chip resistor R can be sequentially loaded in one loading hole T5.

With the intermittent running of the carrier tape T1,
The appearance of the chip resistor R loaded in the loading hole T5 is inspected by the appearance inspection means 12 in the same manner as in the first embodiment. Here, when it is determined that the appearance of the chip resistor R is good, the loading operation of the chip resistor R into the loading hole T5 of the carrier tape T1 by the loading means 113 and the chip resistor R by the appearance inspection means 12 are performed in the same manner as described above. Continue the visual inspection work of R. On the other hand, when it is determined that the chip resistor R has poor appearance, first, the traveling of the carrier tape T1 is stopped, and the movable portion of the linear guide 125 of the discharging means 114, the suction nozzle 128, etc. are advanced, and the suction nozzle 12 is moved.
8 is located in the loading hole T5 of the carrier tape T1, that is, on the defective chip resistor R. Subsequently, the piston rod 130 of the air cylinder 129 is extended, and the suction nozzle 128 or the like is lowered to bring the suction portion of the suction nozzle 128 into contact with or close to the defective chip resistor R in the loading hole T5, and to operate the vacuum pump. In the driving state, the valve is opened, and the defective chip resistor R is sucked by the suction nozzle 128. Subsequently, the piston rod 130 of the air cylinder 129 is contracted, and the suction nozzle 128 and the like are raised to take out the defective chip resistor R from the loading hole T5. Subsequently, the movable portion of the linear guide 125, the suction nozzle 128 holding the defective chip resistor R, and the like are retracted, and the defective chip resistor R
Is located above the receiving box 132. Subsequently, the piston rod 130 of the air cylinder 129 is extended, and the suction nozzle 128 and the like are lowered, so that the defective chip resistor R held by the suction nozzle 128 is held.
By approaching the receiving box 132 and closing the valve,
The defective chip resistor R can be released from the suction nozzle 128 and dropped into the receiving box 132.

While the discharging means 114 discharges the defective chip resistor R from the loading hole T5, first,
A movable portion of the linear guide 137 of the replacement loading means 115;
The suction nozzle 140 and the like are advanced, and the suction nozzle 140 is positioned on the loading hole T5 loaded by the loading means 113, that is, on the chip resistor R. Subsequently, the piston rod 142 of the air cylinder 141 is extended, and the suction nozzle 140 or the like is lowered to bring the suction portion of the suction nozzle 140 into contact with or close to the chip resistor R in the loading hole T5, thereby driving the vacuum pump. To open the valve and suck the chip resistor R by the suction nozzle 140 for replacement.
Subsequently, the piston rod 142 of the air cylinder 141 is contracted, the suction nozzle 140 is raised, and the replacement chip resistor R is taken out from the loading hole T5. Subsequently, the rodless cylinder 133 is driven to move the slider 135, the linear guide 137, the suction nozzle 140 holding the replacement chip resistor R, and the like to the appearance inspection position side, and the replacement chip resistor R is moved. The suction nozzle 140 holding the empty hole T in which the defective chip resistor R is discharged and emptied.
5 above. Subsequently, the piston rod 142 of the air cylinder 141 is extended, the suction nozzle 140 is lowered, and the replacement chip resistor R held by the suction nozzle 140 is inserted into the empty loading hole T5, and the valve is closed and replaced. The chip resistor R for use is released from the suction nozzle 140 and is loaded in the loading hole T5. After loading, air cylinder 14
1 piston rod 142 is shrunk and the empty suction nozzle 14
Increase 0 mag. Then, rodless cylinder 133
Is driven in the opposite direction to move the slider 135 and the linear guide 13
7. Return the suction nozzle 140 and the like to the loading means 113 side, and move the movable portion 37 of the linear guide 137, the suction nozzle 14
0, etc., is retracted to be on standby for the next replacement loading operation. Thus, only the good chip resistor R is loaded into the loading hole T5 of the carrier tape T1, and the taping operation is completed by attaching the cover tape T2 to the surface of the carrier tape T1 by the attaching means 13.

Next, a fourth embodiment of the present invention will be described. 12 to 14 show an electronic component taping apparatus according to a fourth embodiment of the present invention. FIG. 12 is a plan view of a main part, FIG. 13 is a left side view of a loading unit, and FIG. It is a left side view.

As shown in FIGS. 12 to 14, in the present embodiment, the supply means 11 comprises: loading means 114 for sequentially loading the chip resistors R into the loading holes T5 of the carrier tape T1 running intermittently; The chip resistor R whose inspection result by the visual inspection means 12 is defective is discharged from the loading hole T5, and the chip resistor R loaded in the loading hole T5 is taken out by the loading means 144 for replacement.
Discharging and loading means 14 for loading into the loading hole T5 after the discharging
5 is provided. Other configurations are the same as those of the first embodiment, and thus different configurations will be mainly described.

The loading means 144 will be specifically described. A support base 146 is attached to a base frame (not shown).
A linear guide 147 is mounted on the support 146. The linear guide 147 is configured so that the movable part can move forward or backward by the expansion and contraction of the air cylinder similarly to the above embodiment, and the movable part moves in the direction perpendicular to the running direction of the carrier tape T1. It is arranged so that it can move. A support 148 is fixed on the movable portion of the linear guide 147, and the support 148 is provided on the support 148 so as to protrude to the side of the linear guide 147.
Has been fixed. The holding nozzle 149 has a suction nozzle 150
Can move in the axial direction with the suction part facing downward (can be moved up and down)
And the air cylinder 151 is fixed in the vertical direction. The piston rod 152 of the air cylinder 151 is connected to the suction nozzle 150 by a connecting plate 153, and the suction nozzle 150 is moved up and down as the piston rod 152 expands and contracts.

Then, by the movement of the movable portion of the linear guide 147, the suction nozzle 150 is moved between the position above the storage recess 20 at the loading position of the disk 17 and the position above the loading hole T5 of the carrier tape T1 (FIG. 12, the solid line and the chain line in FIG. 13), the suction nozzle 150 is moved up and down with the expansion and contraction of the piston rod 152 of the air cylinder 151, and the suction portion at the tip is moved to the storage recess 20 or the loading hole T5.
To or away from.

The discharge / loading means 145 will be described in detail. A bearing 154 is mounted on a base frame (not shown), and the support shaft 155 is rotatable along the running direction of the carrier tape T1. It is movably supported in the direction. The support shaft 155 has a carrier tape T1.
In FIG. 7, the holding members 156 and 157 are fixed to the loading hole T5 for loading the chip resistor R by the loading means 144 and the loading hole T5 at the visual inspection position. Suction nozzles 158 and 159 are held by the holding members 156 and 157 in a fixed state. Air cylinder 160 is tube 1
The piston rod 162 is configured to be rotatable and extendable with respect to the cylinder 61, the tube 161 is held in a fixed state on the base frame, and the distal end of the piston rod 162 is
55.

Then, the expansion and contraction of the piston rod 162 of the air cylinder 160 causes the support shaft 155 and the holding member 15 to move.
6, 157, and the suction nozzles 158, 159 are moved along the traveling direction of the carrier tape T1.
Correspond to the loading hole T5 for loading the chip resistor R and the loading hole T5 for inspecting the appearance of the chip resistor R.
9 are moved so as to correspond to the loading hole T5 for inspecting the appearance of the chip resistor R and the receiving box 163 of the defective chip resistor R (see the solid and chain lines in FIG. 12). Further, by rotating the piston rod 162 of the air cylinder 160 in an arbitrary direction at each of the above-described movement positions, the support shaft 155, the holding members 156, 157, and the suction nozzles 158, 159 are rotated. Are oriented vertically so as to face the loading hole T5 or horizontally so as to be separated from the loading hole T5.
9 is vertically oriented so that the suction portion faces the loading hole T5 and the receiving box 163, or the loading portion T5 and the receiving box 1
14 is oriented horizontally so as to be spaced apart from the frame 63 (FIG. 14).
Chain line and solid line).

The operation of the above configuration will be described below. As in the first embodiment, the disk 17
With the intermittent rotation, detection of the front and back sides and measurement of the resistance value are performed. When those good chip resistors R are transported to the loading position, first, the piston rod 152 of the air cylinder 151 of the loading means 144 is extended. The suction nozzle 150 is lowered to bring the suction portion of the suction nozzle 150 into contact with or close to the chip resistor R in the storage recess 20 of the disk 17;
When the vacuum pump is driven, open the valve and set the suction nozzle 15
0 sucks the chip resistor R. Subsequently, the piston rod 152 of the air cylinder 151 is contracted, the suction nozzle 150 is raised, and the chip resistor R is taken out of the storage recess 20. Subsequently, the movable portion of the linear guide 147, the suction nozzle 150 holding the chip resistor R, and the like are retracted, and the carrier tape T1 that stops moving along the suction nozzle 150 holding the chip resistor R is loaded. It is located on the hole T5. Subsequently, the piston rod 152 of the air cylinder 151 is extended, the suction nozzle 150 and the like are lowered, and the chip resistor R held by the suction nozzle 150 is inserted into the loading hole T5, and the valve is closed to close the chip resistor R. Is released from the suction nozzle 150, and is loaded into the loading hole T5.
After loading, the piston rod 152 of the air cylinder 151 is contracted, the empty suction nozzle 150 is raised, the movable portion of the linear guide 147, the suction nozzle 150, etc. are advanced, and the suction nozzle 150 is placed on the storage recess 20 of the disk 17. Position and wait for the next loading operation. By repeating the above operation, the chip resistors R can be sequentially loaded into the loading holes T5 of the carrier tape T1 that runs intermittently.

With the intermittent running of the carrier tape T1,
The appearance of the chip resistor R loaded in the loading hole T5 is inspected by the appearance inspection means 12 in the same manner as in the first embodiment. Here, if it is determined that the appearance of the chip resistor R is good, the loading operation of the chip resistor R into the loading hole T5 of the carrier tape T1 by the loading means 144 and the chip resistor by the appearance inspection means 12 are performed in the same manner as described above. Continue the visual inspection work of R. On the other hand, when it is determined that the chip resistor R has poor appearance, first, the traveling of the carrier tape T1 is stopped, and the air cylinder 16 of the discharging and loading means 145 is stopped.
0 piston rod 162, support shaft 155, holding member 1
56, 157, the suction nozzles 158, 159 are rotated,
The suction portions of the suction nozzles 158 and 159 are inserted into the loading holes T5 of the carrier tape T1, that is, the loading means 14 respectively.
4 and defective chip resistor R
Abut or approach. continue,
When the vacuum pump is driven, open the valve and set the suction nozzle 15
The chip resistor R and the defective chip resistor R supplied to the loading means 144 in each loading hole T5 are sucked by 8 and 159, respectively. Subsequently, the piston rod 162 of the air cylinder 160, the support shaft 155, the holding members 156, 1
57, the suction nozzles 158 and 159 are rotated back to take out the replacement chip resistor R and the defective chip resistor R from the loading holes T5. Subsequently, the air cylinder 160
The piston rod 162 is extended to move the support shaft 155, the holding members 156 and 157, the suction nozzles 158 and 159, and the like, and the defective chip resistor R holds the suction nozzle 158 holding the replacement chip resistor R. The suction nozzle 159 holding the defective chip resistor R is positioned beside the empty loading hole T5 that has been loaded.
3 is located on the side. Subsequently, the piston rod 162 of the air cylinder 160, the support shaft 155, the holding member 15
6, 157, the suction nozzles 158 and 159 are rotated, and the replacement chip resistor R held by the suction nozzle 158 is used.
Is inserted into the loading hole T5 vacated by the discharge of the defective chip resistor R, the chip resistor R held by the suction nozzle 159 is positioned on the receiving box 163, and the valve is closed. The replacement chip resistor R can be released from the suction nozzle 158 and loaded into the empty loading hole T5, and the defective chip resistor R can be released from the suction nozzle 159 and dropped into the receiving box 163.

After replacing the chip resistor R, the air cylinder 1
The piston rod 162 of the air cylinder 160 is retracted by rotating the piston rod 162, the support shaft 155, the holding members 156 and 157, and the empty suction nozzles 158 and 159, and then the support shaft 155, the holding members 156 and 15 are retracted.
7. The suction nozzles 156 and 157 are moved to the disk 17 and returned to stand by for the next loading operation. In this way, only a good chip resistor R is loaded into the loading hole T5 of the carrier tape T1, and the carrier tape T1 is
The taping operation is completed by attaching the cover tape T2 to the surface of the tape.

Next, a fifth embodiment of the present invention will be described. 15 to 17 show an electronic component taping device according to a fifth embodiment of the present invention. FIG. 15 is a plan view of a main part, FIG. 16 is a left side view of a loading unit, and FIG. FIG.

As shown in FIGS. 15 to 17, in this embodiment, the supply means 11 comprises: loading means 164 for sequentially loading the chip resistors R into the loading holes T5 of the carrier tape T1 running intermittently; Discharging means 165 for discharging the chip resistor R whose inspection result by the visual inspection means 12 is defective from the loading hole T5;
After the carrier tape T1 has run in the opposite direction,
Again, when traveling intermittently as described above, the loading means 16
4, a replacement chip resistor R is loaded into the empty loading hole T5 after discharge. Other configurations are the same as those of the first embodiment, and thus different configurations will be mainly described.

The loading means 164 will be specifically described. A support 166 is attached to a base frame (not shown).
A linear guide 167 is mounted on the support 166. The linear guide 167 is configured so that the movable portion can move forward or backward by the expansion and contraction of the air cylinder, as in the above-described embodiment. It is arranged so that it can move. A support base 168 is fixed on the movable part of the linear guide 167, and the support base 169 is provided on the support base 168 so as to protrude to the side of the linear guide 167.
Has been fixed. The holding table 169 has a suction nozzle 170
Can move in the axial direction with the suction part facing downward (can be moved up and down)
And the air cylinder 171 is fixed in the vertical direction. The piston rod 172 of the air cylinder 171 is connected to the suction nozzle 170 by a connecting plate 173, and the suction nozzle 170 is moved up and down as the piston rod 172 expands and contracts.

Then, by the movement of the movable portion of the linear guide 167, the suction nozzle 170 is moved between the position above the storage recess 20 at the loading position of the disk 17 and the position above the loading hole T5 of the carrier tape T1 (FIG. 15, the solid line and the chain line in FIG. 16), the suction nozzle 170 is moved up and down as the piston rod 172 of the air cylinder 171 expands and contracts, and the suction part at the tip is moved to the storage recess 20 or the loading hole T5.
To or away from.

The discharge means 165 will be specifically described. A support base 174 is attached to a base frame (not shown).
A linear guide 175 is mounted on the support 174. The linear guide 177 can move so that the movable part moves forward or backward by the expansion and contraction of the air cylinder, as in the above-described embodiment. It is arranged so that it can move. A support 176 is fixed on the movable portion of the linear guide 175, and a support 177 is provided on the support 176 so as to protrude to the side of the linear guide 175.
Has been fixed. The holding table 177 has a suction nozzle 178
Can move in the axial direction with the suction part facing downward (can be moved up and down)
And the air cylinder 179 is fixed in the vertical direction. The piston rod 180 of the air cylinder 179 is connected to the suction nozzle 178 by a connection plate 181, and the suction nozzle 178 is moved up and down as the piston rod 180 expands and contracts.

Then, the movement of the movable portion of the linear guide 165 causes the suction nozzle 178 to move between the position above the receiving box 182 on the side of the carrier tape T1 on the disk 17 side and the position above the loading hole T5 of the carrier tape T1. The suction nozzle 178 is moved up and down as the piston rod 180 of the air cylinder 179 expands and contracts (see the solid and chain lines in FIGS. 15 and 17). They are approached or separated.

The operation of the above configuration will be described below. As in the first embodiment, the disk 17
With the intermittent rotation, detection of the front and back sides and measurement of the resistance value are performed. When those good chip resistors R are transported to the loading position, first, the piston rod 172 of the air cylinder 171 of the loading means 164 is extended. The suction nozzle 170 is lowered to bring the suction portion of the suction nozzle 170 into contact with or close to the chip resistor R in the storage recess 20 of the disk 17,
Open the valve while the vacuum pump is running to open the chip resistor R
Aspirate. Subsequently, the piston rod 172 of the air cylinder 171 is contracted, the suction nozzle 170 is raised, and the chip resistor R is taken out of the storage recess 20. Subsequently, the movable portion of the linear guide 167, the suction nozzle 170 holding the chip resistor R, and the like are retracted, and the carrier tape T1 that stops moving the suction nozzle 170 holding the chip resistor R is loaded. It is located on the hole T5. continue,
Extend the piston rod 172 of the air cylinder 171,
By lowering the suction nozzle 170 and the like, the tip resistor R held by the suction nozzle 170 is inserted into the loading hole T5, the valve is closed, and the tip resistor R is released from the suction nozzle 170, and is loaded into the loading hole T5. I do. After loading, the piston rod 172 of the air cylinder 171 is contracted to raise the empty suction nozzle 170 and the like, and the movable portion of the linear guide 167, the suction nozzle 170 and the like are advanced, and the suction nozzle 170 is placed on the storage recess 20 of the disk 17. And wait for the next loading operation. By repeating the above operation, the chip resistors R can be sequentially loaded into the loading holes T5 of the carrier tape T1 that runs intermittently.

With the intermittent running of the carrier tape T1,
The appearance of the chip resistor R loaded in the loading hole T5 is inspected by the appearance inspection means 12 in the same manner as in the first embodiment. Here, if it is determined that the appearance of the chip resistor R is good, the loading operation of the chip resistor R into the loading hole T5 of the carrier tape T1 by the loading means 164 and the chip resistor R by the appearance inspection means 12 are performed in the same manner as described above. Continue the visual inspection work of R. On the other hand, if it is determined that the chip resistor R has poor appearance, first, the traveling of the carrier tape T1 is stopped, and the movable portion of the linear guide 175 of the discharging means 165, the suction nozzle 178, etc. are advanced, and the suction nozzle 17 is moved.
8 is located in the loading hole T5 of the carrier tape T1, that is, on the defective chip resistor R. Subsequently, the piston rod 180 of the air cylinder 179 is extended, the suction nozzle 178 and the like are lowered, and the suction portion of the suction nozzle 178 is brought into contact with or close to the defective chip resistor R in the loading hole T5, and the vacuum pump is operated. In the driving state, the valve is opened, and the tip resistor R is sucked by the suction nozzle 178. Subsequently, the piston rod 180 of the air cylinder 179 is contracted, and the suction nozzle 178 and the like are raised to take out the defective chip resistor R from the loading hole T5. Subsequently, the movable portion of the linear guide 175, the suction nozzle 178 holding the defective chip resistor R, and the like are retracted, and the defective chip resistor R
Is positioned above the receiving box 182. Subsequently, the piston rod 180 of the air cylinder 179 is extended, and the suction nozzle 178 and the like are lowered, and the defective chip resistor R held by the suction nozzle 178 is held.
By approaching the receiving box 182 and closing the valve,
The defective chip resistor R can be released from the suction nozzle 178 and dropped into the receiving box 182.

After the defective chip resistor R is discharged from the loading hole T5 by the discharging means 165, the pulse motor 7 (see FIG. 1) is driven to rotate in the reverse direction so that the carrier tape T1 runs in the reverse direction. The position where the loading hole T5 emptied by the discharge of the defective chip resistor R is shifted by one by one in the running direction of the carrier tape T1 with respect to the position where the chip resistor R is loaded by the loading means 164. And stop running. Subsequently, the pulse motor 7 is rotated forward to make the carrier tape T1 run intermittently, and in the same manner as described above, the chip resistor R is taken out from the storage recess 20 of the disk 17 by the loading means 164, and the defective chip resistor R Is loaded into the loading hole T5 which is empty due to the discharge of the chip resistor, and is replaced with a new chip resistor R. Thereafter, the carrier tape T1 is caused to intermittently run, and the chip resistor R after replacement is replaced.
Reaches the visual inspection position, the loading operation of the chip resistor R and the visual inspection work are continued in the same manner as described above. Thus, only the good chip resistor R is loaded into the loading hole T5 of the carrier tape T1, and the taping operation is completed by attaching the cover tape T2 to the surface of the carrier tape T1 by the attaching means 13.

The loading / transporting means 14, the transporting means 1
5, discharging / loading means 16, discharging means 92, loading means 9
3. The configurations of the loading unit 113, the discharging unit 114, the replacement loading unit 115, the loading unit 144, the discharging and loading unit 145, the loading unit 164, the discharging unit 165, and the like are not limited to the above embodiment. , A linear guide, a rodless cylinder, and an air cylinder can be changed to a transfer means such as another gear mechanism. In addition, the present invention can be variously changed in design without departing from the basic technical idea.

[0087]

As described above, according to the present invention, the electronic components are sequentially loaded into the loading holes of the carrier tape running intermittently by the supply means, and the appearance is inspected by the appearance inspection means. If so, leave it as it is, and if it is defective, discharge the defective electronic component from the loading hole by the supply means, load a new replacement electronic component into the loaded hole after discharging, and then attach the cover tape by the attaching means. Only good electronic components can be sealed in the loading holes by sticking to the carrier tape. Thus, a defective electronic component can be automatically replaced with a new electronic component. Therefore, labor and cost can be reduced in taping electronic components.

[Brief description of the drawings]

FIG. 1 is an overall plan view showing an electronic component taping apparatus according to a first embodiment of the present invention.

FIG. 2 is an overall front view showing the taping device.

FIG. 3 is a left side view showing a loading / transferring means and a transporting means of the taping device.

FIG. 4 is a left side view showing a discharging and loading means of the taping device.

FIG. 5 is a schematic explanatory view showing a modification of the loading / transferring means of the taping device.

FIG. 6 is an overall plan view showing an electronic component taping device according to a second embodiment of the present invention.

FIG. 7 is a left side view showing a loading means of the taping device.

FIG. 8 is a left side view showing a discharging unit of the taping device.

FIG. 9 is an overall plan view showing an electronic component taping device according to a third embodiment of the present invention.

FIG. 10 is a left side view showing a loading unit and a replacement loading unit of the taping device.

FIG. 11 is a left side view showing a discharging unit of the taping device.

FIG. 12 is a plan view of a main part showing an electronic component taping device according to a fourth embodiment of the present invention.

FIG. 13 is a left side view showing a loading means of the taping device.

FIG. 14 is a left side view showing a discharging and loading means of the taping device.

FIG. 15 is a plan view of a main part showing a taping device for an electronic component according to a fifth embodiment of the present invention.

FIG. 16 is a left side view showing a loading means of the taping device.

FIG. 17 is a left side view showing a discharging unit of the taping device.

18 (a) and (b) are a plan view and a longitudinal sectional view, respectively, for explaining the completion sequence of an example of the tape for taping a chip fixed resistor, and (c) is a BB line of (a). FIG.

19A and 19B are a longitudinal sectional view and a transverse sectional view, respectively, showing another example of the taping tape.

[Explanation of symbols]

 T Taping tape T1 Carrier tape T2 Cover tape T5 Loading hole T6 Feed hole 1 Guide wheel 2 Feed wheel 7 Pulse motor 9 Guide stand 11 Supply means 12 Visual inspection means 13 Sticking means 14 Loading / transfer means 15 Transfer means 16 Discharge Loading means 17 Disk 20 Storage recess 34 Air cylinder 35 Linear guide 41 Linear guide 44 Suction nozzle 45 Rodless cylinder 53 Holding hole 60 Air cylinder 61 Linear guide 63 Linear guide 66 Suction nozzle 67 Suction nozzle 92 Ejecting means 93 Loading means 96 Linear Guide 98 Linear guide 100 Suction nozzle 105 Linear guide 107 Linear guide 111 Suction nozzle 113 Loading means 114 Ejection means 115 Replacement loading means 117 Linear guide 120 Suction nozzle 12 1 air cylinder 125 linear guide 128 suction nozzle 129 air cylinder 133 rodless cylinder 137 linear guide 140 suction nozzle 141 air cylinder 144 loading means 145 discharge / loading means 147 linear guide 150 suction nozzle 151 air cylinder 158 suction nozzle 159 suction nozzle 160 air Cylinder 164 Loading means 165 Discharge means 167 Linear guide 170 Suction nozzle 171 Air cylinder 175 Linear guide 178 Suction nozzle 179 Air cylinder

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Yuji Komuro 3-26, Tanimotomuracho, Shinjuku-ku, Tokyo Inside Showa Industry Co., Ltd.

Claims (6)

[Claims] 1. A driving means for intermittently moving a carrier tape in which a loading hole and a feed hole of an electronic component are arranged, and an appearance of an electronic component stored in the loading hole and intermittently transported is inspected. With the appearance inspection means, with the intermittent running of the carrier tape, electronic components are sequentially loaded into the loading holes at an upstream position in the traveling direction of the carrier tape from the appearance inspection means, and the inspection result by the appearance inspection means When the defective electronic component is defective, the defective electronic component is discharged from the loading hole, and a replacement electronic component is loaded into the loaded loading hole after the discharging. An attaching means for attaching the cover tape to the carrier tape at a downstream position so that the loading hole is closed and the electronic component after inspection is enclosed therein. 2. A supply means for sequentially loading electronic components into a loading hole of a carrier tape running intermittently, and when an inspection result by an appearance inspection means is defective, the electronic component is moved to a side position of the carrier tape. Loading and transferring means for transferring for replacement, transferring means for transferring replacement electronic components transferred by the loading and transferring means to the side position of the defective electronic component, and loading of the defective electronic component 2. An electronic component taping device according to claim 1, further comprising a discharge / loading means for discharging the replacement electronic component transferred from the hole and loading the replacement electronic component into the loading hole after the discharge. 3. A supply means for discharging a defective electronic component from a carrier tape loading hole when an inspection result by an appearance inspection means is defective, and a feeding means for intermittently traveling carrier tape loading hole. 2. The electronic component taping device according to claim 1, further comprising: loading means for sequentially loading the electronic components and loading a replacement electronic component into the loaded hole after the discharge when the inspection result is defective. 4. A supply means for sequentially loading electronic components into a loading hole of a carrier tape running intermittently,
A discharge unit that discharges the electronic component from the loading hole when the inspection result by the visual inspection unit is defective, and an electronic component that is loaded in the loading hole by the loading unit when the inspection result is defective. 2. An electronic component taping device according to claim 1, further comprising: a replacement loading means for taking out the battery for use and loading it into the loading hole after the discharge. 5. A loading means for loading an electronic component sequentially into a loading hole of a carrier tape running intermittently;
When the inspection result by the visual inspection means is defective, the electronic component is ejected from the loading hole, and the electronic component loaded in the loading hole is taken out for replacement by the loading means, and the loaded hole after the ejection is removed. 2. An electronic component taping apparatus according to claim 1, further comprising a discharging and loading means for loading the electronic component. 6. A supply means for sequentially loading electronic components into a loading hole of a carrier tape running intermittently,
Discharging means for discharging the electronic component from the loading hole when the inspection result by the visual inspection means is defective. After discharging the defective electronic component, after the carrier tape runs in the reverse direction, When running intermittently like
2. The electronic component taping device according to claim 1, wherein the loading means is configured to load a replacement electronic component into the loaded hole after the discharge.