JPH08206825A - Device for mounting solder ball and method therefor - Google Patents

Abstract

PURPOSE: To provide a device for mounting solder balls, in which in the case of vacuum-sucking and picking up the solder balls into many formed suction holes at the lower surface of a pickup head and mounting on electrodes in a substrate batchwise mis-mount can immediately be recovered. CONSTITUTION: The pickup head 11 vacuum-sucks and picks up many solder balls 1 in a supplying part 15 for solder ball 1 into the lower surface and the solder ball is mounted on the substrate 4 on a conveyor 8. A camera 21 observes the upper surface of the substrate 4, and if the electrode is detected to lack the solder ball 1, successively the solder ball 1 is mounted with the suction head 31 on this electrode. The substrate 4 mounting the solder balls 1 in all electrodes, is carried into a heating furnace 40 with the conveyor 8 to form a hump on the electrodes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball mounting apparatus and method for mounting solder balls for forming bumps on electrodes of a work.

[0002]

2. Description of the Related Art FIG. 14 is a side view of a conventional solder ball mounting device. Solder balls 1 that are the material of the bumps are stored in a container 2. A pickup head 3 is driven by an up-and-down moving means (not shown) to move up and down to suck the solder ball 1 in a vacuum by a suction hole formed in the lower surface of the pickup head, and move the table (not shown). Driven horizontally to move above the workpiece such as the substrate 4 clamped and positioned by the clamper 6,
Therefore, by performing the vertical movement again and releasing the vacuum suction state of the solder balls 1, a large number of solder balls 1 are collectively mounted on the electrodes 5 of the substrate 4.

[0003]

Pickup head 3
A large number of suction holes are formed on the lower surface of the solder ball 1. The solder balls 1 must be vacuum-sucked to all the suction holes and mounted on all the electrodes 5 of the substrate 4. However, with the conventional means, it is not possible to mount all the solder balls 1 vacuum-adsorbed on the lower surface of the pickup head 3 on all the electrodes 5 of the substrate 4, and one or two of the many solder balls 1 are mounted. There is a problem that one or more objects are likely to remain attached to the lower surface of the pickup head 3. In this case, the solder balls 1 are not mounted on all the electrodes 5, and there are the electrodes 5 lacking the solder balls 1, so that the substrate 4 becomes a defective product.

Further, the step of forming bumps on the electrodes of the work by the solder balls involves heating, melting and solidifying the solder balls mounted on the electrodes of the work from the step of applying flux to the bumps and the electrodes of the work. Although it includes the step of forming bumps, the technology for automatically performing all such steps as a series of continuous operations is not yet established.

Therefore, an object of the present invention is to solve the above conventional problems and provide a solder ball mounting apparatus and mounting method capable of mounting solder balls on all electrodes of a workpiece. Furthermore, the entire process from applying flux to bumps and work electrodes to forming bumps by heating, melting and solidifying the solder balls mounted on the work electrodes is automated as a series of continuous operations. It is an object of the present invention to provide a solder ball mounting device and a solder ball mounting method that can be performed in a specific manner.

[0006]

To this end, the present invention provides a mounting means for collectively mounting solder balls on a plurality of electrodes formed on the upper surface of a work and a mounting error caused by this mounting means. A mounting error inspection means for inspecting and a mounting means for replenishment for mounting one solder ball on each electrode having a mounting error detected by the mounting error inspection means are configured.

[0007]

According to the above construction, after the solder balls are mounted on the electrodes of the work by the mounting means, it is inspected by the mounting error inspection means whether or not the solder balls are mounted on all the electrodes of the work. Then, if there is an electrode where the solder ball is missing, the solder ball is subsequently mounted on this electrode by the mounting means for supplementation.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of a solder ball mounting device according to a first embodiment of the present invention. In the figure, reference numeral 4 denotes a substrate as a work, which is conveyed on the conveyor 8 in the X direction (rightward). A first mounting means 10, a mounting error inspection means 20, a second mounting means 30 as a replenishing mounting means, and a heating furnace 40 are provided in this order from the upstream side to the downstream side of the conveyor 8. ing. Further, four cylinders 7 as stoppers for stopping the transportation of the substrate 4 are provided at a pitch in the transportation path of the substrate 4 by the conveyor 8. When the rod 7a of the cylinder 7 projects upward, the rod 7a forcibly stops the conveyance of the substrate 4 to the right and positions it. That is, the cylinder 7 serves as a positioning portion for the substrate 4. When the rod 7a is pulled downward, the substrate 4 is conveyed to the right by the conveyor 8. 41
Is a control unit that controls the mounting error inspection means 20, the second mounting means 30, and the like.

Next, the first mounting means 10 will be described. The first mounting means 10 mounts the solder ball 1 on the electrode 5 (see FIG. 3) on the upper surface of the substrate 4 stopped by the cylinder 7 in the most upstream (left end in the figure). Is configured. A pickup head 11 for the solder ball 1 is held by a long moving table 12 provided in a direction orthogonal to the carrying direction of the conveyor 8. When the motor 13 of the moving table 12 rotates forward and backward, the pickup head 11 moves to the moving table 12.
Horizontally along the Y direction. In this embodiment, the conveying direction of the substrate 4 by the conveyor 8 is the X direction. Below the moving path of the pickup head 11, a solder ball 1 recovery section 14, a solder ball 1 supply section 15, a flux storage section 16, and a most upstream cylinder 7 are sequentially provided. Recovery unit 14, supply unit 15, storage unit 16, substrate 4
The most upstream cylinder 7, which is the positioning part of the
Direction (Y direction) orthogonal to the transport direction (X direction) of the substrate 4 by
Direction) are arranged side by side on a straight line.

The collecting portion 14 for the solder balls 1 is composed of a box, and the solder balls 1 left on the lower surface of the pickup head 11 due to the failure of mounting the pickup head 11 on the substrate 4 are It moves to the upper part of this collection | recovery part 14, and it drops in this collection | recovery part 14, and collects it. Further, the supply portion 15 for the solder balls 1 is composed of a container, and a large number of the solder balls 1 are stored therein. The pickup head 11 arrives above the supply unit 15 and is driven by an up-and-down moving unit (not shown) to perform up-and-down operations, so that a large number of suction holes 9 (FIG. 2) are formed on the lower surface thereof.
The solder ball 1 is vacuum-sucked and picked up.

The flux reservoir 16 comprises a container,
Flux 17 is stored. Reference numeral 18 is a cylinder, and a squeegee 19 is held at the tip of the rod 18a. The squeegee 19 slides on the liquid surface of the flux 17 by the rod 18a of the cylinder 18 protruding and retracting, and smoothes the liquid surface of the rough flux 17.

Next, the mounting error inspection means 20 will be described. Reference numeral 21 denotes a camera, which is held at the tip of an arm 22 extending from the block 23 onto the conveyor 8.
The camera 21 observes the substrate 4 stopped by the central cylinder 7. 24 is an X table and 25 is a Y table, and the Y table 25 is mounted on the X table 24 to form a first XY direction moving device. 26, 2
Reference numerals 7 are motors for driving the X table 24 and the Y table 25, respectively. The block 23 is loaded on the Y table 25. Therefore, when the motors 26 and 27 are driven, the camera 21 horizontally moves above the substrate 4 in the X direction and the Y direction and observes the electrode 5 of the substrate 4.

Next, the second mounting means 30 will be described. Three
Reference numeral 1 is a suction head, which is from the block 33 to the conveyor 8
It is held at the tip of the arm 32 extending upward. Three
Reference numeral 4 is an X table, 35 is a Y table, and 36 and 37 are respective driving motors, which constitute a second XY direction moving device. Block 33 is Y table 3
It is loaded on top of 5. Therefore, when the motors 36 and 37 are driven, the suction head 31 moves above the substrate 4 stopped by the most downstream cylinder 7 in the X and Y directions. Reference numeral 38 denotes a supply portion of the solder balls 1, which is composed of a cylindrical container and is driven by a vibrating means (not shown) to vibrate, so that the solder balls 1 are arranged in a row in the elongated groove-shaped tray portion 39. To deliver. The suction head 31 vacuum-sucks and picks up the solder balls 1 delivered to the tip of the tray 39 one by one, and mounts them on the electrodes 5 of the substrate 4. Reference numeral 44 denotes a dispenser, which applies flux onto the electrode 5 from which the solder balls 1 are missing. The dispenser 44 is horizontally moved in the X and Y directions by an XY direction moving device (not shown).

A heater is built in the heating furnace 40. The substrate 4 on which the solder balls 1 are mounted is the heating furnace 4
It is sent to the inside of 0 and heated while being conveyed to the right. Then, the solder balls 1 are melted and bumps are formed on the electrodes 5.

2 to 7 are explanatory views of the bump forming method of the first embodiment of the present invention. Next, a method of forming bumps will be described with reference to FIGS. In FIG. 1, the first
The pickup head 11 of the mounting means 10 of FIG.
The solder ball 1 is vacuum sucked and picked up by the suction hole 9 on the lower surface thereof. Next, the pickup head 11 moves above the reservoir 16 of the flux 17 and moves up and down there, so that the flux 17 is applied to the lower surface of the solder ball 1.
Attach.

FIG. 2 shows the state at this time. A large number of adsorption holes 9 are formed in a matrix on the lower surface of the pickup head 11, and the solder balls 1 are inserted in the adsorption holes 9.
Are vacuum-adsorbed. This pickup head 11
Is connected to a vacuum device (not shown) through a pipe 28. As shown, the pickup head 11
2, the lower surface of the solder ball 1 is contacted with the flux 17 as shown in FIG. 2, and then the pickup head 11 is moved upward to collectively attach the flux 17 to the lower surface of all the solder balls 1. Let Since the flux 17 has a large viscosity, the solder ball 1
When the water is made to adhere and the flux 17 is attached, the liquid surface of the flux 17 becomes rough. Therefore, after the flux 17 is attached to the solder ball 1, the squeegee 19 smoothes the liquid surface of the flux 17 roughened.

Next, the pickup head 11 is moved above the substrate 4 and is vertically moved there to mount the solder ball 1 on the electrode 5 of the substrate 4. FIG. 3 shows the state at this time. Flux 17 is attached to the lower surface of the solder ball 1, and the pickup head 11 is lowered to land the solder ball 1 on the electrode 5 on the upper surface of the substrate 4, where the vacuum suction state of the solder ball 1 is released. Then, by raising the pickup head 11,
The solder ball 1 is mounted on the electrode 5.

FIG. 4 shows a state in which the pickup head 11 is raised. In this example, the second solder ball 1 from the right side in the drawing remains attached to the suction hole 9,
Mounting on the electrode 5 has failed. As described below,
Flux is again applied by the dispenser 44 to the electrode 5 on which the solder ball 1 has failed to be mounted and the solder ball 1 is missing, and the solder ball 1 is mounted by the second mounting means 30.

Next, in FIG. 1, the board 4 on which the solder balls 1 are mounted is conveyed rightward by the conveyor 8 and hits the rod 7a of the cylinder 7 second from the upstream side to stop.
Therefore, the camera 21 horizontally moves above the substrate 4 in the XY directions and observes each of the electrodes 5 arranged in a matrix on the substrate 4 to detect whether or not the solder balls 1 are present on the electrode 5. To do. FIG. 5 shows the state at this time.
Here, in this example, the solder ball 1 is missing on the second electrode 5 from the right side in FIG. 5, and accordingly, the control unit 41 is notified of that fact.

Next, in FIG. 1, the substrate 4 is further conveyed to the right by the conveyor 8, and in the middle of the process, the flux is applied again onto the electrode 5 where the solder ball 1 is missing by the dispenser 44. In this case, the substrate 4 is stopped by the third cylinder 7 from the upstream side and the flux is applied. Next, the substrate 4 is further transported to the right and hits the rod 7a of the cylinder 7 at the right end to stop. Therefore, FIG.
, The suction head 31 of the second mounting means 30
In response to a command from the control unit 41, the solder ball 1 on the tray 39 is vacuum-sucked to the lower end of the nozzle 31a and picked up, and the solder ball 1 is mounted on the electrode 5 where the solder ball 1 is missing.

When the solder balls 1 are mounted on all the electrodes 5 of the board 4 in this manner, the board 4 is sent to the heating furnace 40 by the conveyor 8 in FIG.
Heated at 0. Then, the solder ball 1 is melted and solidified, and the bump 1'is completed on the electrode 5 as shown in FIG. In FIG. 4, the pickup head 11, which has failed to mount the solder ball 1 on the substrate 4, moves to a position above the recovery unit 14 in response to a command from the control unit 41, and sucks the air sent from the vacuum device there. The solder balls 1 adhering to the lower surface of the pickup head 11 are dropped onto the collecting portion 14 by being blown out from.

Next, a second embodiment of the present invention will be described. 8 is a plan view of a solder ball mounting apparatus according to a second embodiment of the present invention, FIG. 9 is a perspective view of a pickup head and an optical unit included in the solder ball mounting apparatus, and FIG. 10 is a sectional view of the same. 11 and 12 are explanatory views of a flux applying operation of the solder ball mounting apparatus, and FIG. 13 is a cross-sectional view of a cleaning unit of a coating head of the solder ball mounting apparatus.

First, the overall structure will be described with reference to FIG. In each figure, the same elements as those in the first embodiment described above are designated by the same reference numerals, and the description thereof will be omitted. Further, in FIG. 8, the configurations of the second mounting means 30 and the heating furnace 40 on the downstream side of the mounting error inspection means 20 are the same as those in FIG. In the second embodiment, the collecting portion 14 and the supplying portion 15 for the solder balls 1 are provided on one side of the convey path of the substrate 4 by the conveyor 8, and the storage portion 16 for the flux 17 is provided on the other side. . A third XY direction moving device 50 is provided in the middle of the conveyor 8. The third XY direction moving device 50 includes an X table 51, a Y table.
The table 52 and the respective driving motors 53 and 54 serve as a positioning unit that positions the substrate 4 at a predetermined position. Table 5 on Y table 52
5 is placed, and the substrate 4 is placed on the table 55. Therefore, the respective motors 53, 54 are driven to drive the X
When the table 51 or the Y table 52 moves in the X direction or the Y direction, the substrate 4 also moves in the same direction, and the substrate 4 is positioned at a predetermined position.

The moving table 12 straddles the conveyor 8 and is installed between the collecting section 14 and the flux storing section 16. The moving table 12 holds a pickup head 60 as a first mounting means and a flux coating head 70, and these two heads are simultaneously moved in the Y direction. 61 is a pickup head 60
And 71 is an arm for connecting the moving table 12 and 71 is an arm for connecting the coating head 70 and the moving table 12.

Pickup head 60 and coating head 70
Is equal to the distance between the supply unit 15 and the XY-direction moving device 50 and the distance between the XY-direction moving device 50 and the storage unit 16. By setting the size of the distance in this manner, the pickup The mounting operation of the solder balls 1 on the substrate 4 by the head 60 and the coating operation of the flux 17 on the substrate 4 by the coating head 70 can be simultaneously performed in conjunction with each other by the common moving table 12. An optical unit 80 is provided between the supply unit 15 of the solder ball 1 and the third XY direction moving device 50. In addition, the recovery unit 14, the supply unit 15, the optical unit 80,
The third XY direction moving device (positioning unit) 50, the cleaning unit (described later) 90, and the storage unit 16 are the conveyor 8
Are arranged side by side on a straight line in the direction (Y direction) orthogonal to the transport direction (X direction).

Next, the pickup 60 and the optical unit 80 will be described with reference to FIGS. 9 and 10. First, the pickup head 60 will be described. The pickup head 60 is composed of an upper case 62 and a lower case 63, and a transparent plate 64 is arranged between them. The lower case 63 is vacuum-sucked by a vacuum device (not shown) through the tube 65, and the solder ball 1 is inserted into the suction hole 9.
Are vacuum-adsorbed. Further, inside the upper case 62, a condenser element 66 and a sensor 67 for detecting light are provided.

The optical unit 80 mainly comprises a long box-shaped base 81. A line-shaped light source 82 that emits light upward is provided on the upper surface of the base 81. Also the base 8
Standing plates 83 and 84 are provided on both side portions of 1, and a light emitting element 85 and a light receiving element 86 are provided on the standing plates 83 and 84, respectively. 87 and 88 are codes. The light emitted horizontally from the light emitting element 85 enters the light receiving element 86. The operation of this optical unit 80 will be described later.

Next, the flux coating head 70 will be described with reference to FIGS. 11 and 12. In FIG. 7, the coating head 70 is configured by providing a plurality of pins 73 on the lower surface of a rectangular main body 72, and the flux 17
The flux 17 is attached to the lower surface of the pin 73 by performing an up-and-down operation above the storage section 16 of FIG. Then XY
It moves above the substrate 4 on the direction moving device 50 (see FIG.
2) Then, by performing the vertical movement again, the pin 73
The flux 17 attached to the lower surface of the is collectively transferred onto the plurality of electrodes 5.

In FIG. 8, a cleaning unit 90 is provided between the XY direction moving device 50 and the flux reservoir 16. Next, the cleaning unit 90 will be described with reference to FIG. Reference numeral 91 denotes a case, in which a feeding reel 92 and a take-up reel 93 are provided. The feeding reel 92 and the take-up reel 93
Is driven by a motor (not shown) and rotates about its axis.

The cleaning tape 9 is attached to the delivery reel 92.
4 is wound. Further, a block 96 is attached to the upper part of the case 91, and a grounding body 97 made of an elastic body is provided on the upper surface of the block 96. Reference numeral 95 is a guide roller. The cleaning reel 9 and the take-up reel 93 rotate in the direction of the arrow so that the cleaning tape 9
4 rotates along a guide roller 95 and a grounding body 97, and is wound around a winding reel 93. This cleaning tape 9
As 4, a synthetic resin tape having a high roughness is used.

As shown, the pin 7 of the coating head 70
3 to lower the cleaning tape 94 on the grounding body 97.
The coating head 70 is moved horizontally (see the arrow). Then, the bottom surface of all pins 73
The flux 17 that slidably contacts the cleaning tape 94 and remains on the lower surface of the cleaning tape 94 is removed by cleaning. Flux 17
The cleaning tape 94 that has been attached and soiled is wound around the winding reel 93 and collected.

This solder ball mounting device is constructed as described above, and the overall operation will be described below. Figure 8
The pickup head 60 and the coating head 70 are located above the supply portion 15 of the solder ball 1 and the substrate 4, respectively. Pickup head 6 in this state
When 0 moves up and down, the solder ball 1 is vacuum sucked and picked up by the suction hole 9 on the lower surface thereof. At the same time, the coating head 70 also moves up and down to remove the flux 17 previously attached to the bottom surface of the pin 73 from the substrate 4.
Is applied on the electrode 5 (see FIGS. 11 and 12).

Next, when the moving table 12 is driven, the pickup head 60 moves toward the substrate 4. At the same time, the coating head 70 is also flux 1
7 towards the reservoir 16 of 7. The pickup head 60 passes above the optical unit 80 as shown in FIGS. 9 and 10 while moving to the substrate 4. At this time, as shown in FIG.
Light is emitted from 2 toward the lower surface of the pickup head 60.

Here, the solder balls 1 are placed in all the suction holes 9.
Is vacuum-adsorbed (that is, when there is no pick-up error), all the adsorption holes 9 are blocked by the solder balls 1 and therefore no light enters the sensor 67. However, when the solder ball 1 is not vacuum-sucked in the suction hole 9 (in this example, the solder ball 1 is not vacuum-sucked in the central suction hole 9 in FIG. 10),
Light enters the lower case 63 through the suction hole 9 (see the light indicated by the solid arrow), and this light enters the sensor 67, so it is clear that there was a pickup error. That is, the light source 82 of the optical unit 80 serves as a means for detecting the presence or absence of a pickup error.

When a pickup error is detected, the moving table 12 is driven in the reverse direction to return the pickup head 60 onto the supply portion 15 of the solder ball 1, and the pickup operation is performed again there. Then, the pickup head 60 again moves above the optical unit 80, and again checks for a pickup error. If a pickup error is detected again, the pickup head 60 is returned to above the supply unit 15 and the pickup operation is performed again. However, if the pick-up error is not eliminated even after repeating the pick-up operation a predetermined number of times, it is considered that some trouble has occurred in the device. In this case, the pickup head 60 is attached to the collecting unit 1.
4, the vacuum suction state is released there, or air is blown from the suction holes 9 to forcefully drop the solder balls 1 from the suction holes 9 to the recovery unit 14, and then to inspect the device. I do. In such a case,
It is desirable to notify the operator that there is a problem by means of notification means such as a buzzer.

As shown in FIG. 8, the optical unit 80
The light source 82 has a line shape whose longitudinal direction is a direction intersecting with the movement direction of the pickup head 60, and thus the pickup head 60 passes above the optical unit 80 to form a matrix on the lower surface of the pickup head 60. For all the adsorption holes 9 formed,
It is possible to inspect at high speed whether there is a pickup error.

When no pick-up error is detected in the pick-up error detection shown in FIG. 10, the moving table 12 is driven to move the pick-up head 60 above the substrate 4 in FIG.
As described with reference to FIG. 4 and FIG. 4, the pickup head 60 is vertically moved to mount the solder ball 1 on the electrode 5 of the substrate 4. However, in this case, the flux 17 is applied on the electrode 5 in advance by the application head 70.

Further, in FIG. 8, the pickup head 6
When 0 moves above the substrate 4, the coating head 70
Is moving above the reservoir 16 of the flux 17,
Then, the coating head 70 moves up and down to attach the flux 17 to the lower surface of the pin 73 as shown in FIG.

Next, in FIG. 8, the moving table 12 is driven in the opposite direction to the above, the pickup head 60 moves toward the supply portion 15 of the solder ball 1, and the coating head 70 moves toward the substrate 4. . In the middle of this movement, the optical unit 80 detects whether or not there is a mounting error. That is, in FIG. 10, when the pickup head 60 moves above the optical unit 80, light is emitted from the light emitting element 85 toward the light receiving element 86. This light is emitted horizontally along the lower surface of the lower case 63. Here, when the pickup head 60 mounts all the solder balls 1 on the substrate 4 (that is, when there is no mounting error), the solder balls 1 are not attached to the lower surface of the lower case 63 at all. Therefore, since the light emitted from the light emitting element 85 enters the light receiving element 86, it is determined that there is no mounting error.

On the other hand, when the pickup head 60 cannot mount all the solder balls 1 on the substrate 4 and one or more solder balls 1 remain attached to the lower surface of the lower case 63, the light emitting element 85 is left. The light radiated from is blocked by the solder ball 1 and does not enter the light receiving element 86, so that it is found that there is a mounting error. In this case,
The pickup head 60 moves above the collection unit 14,
The solder balls 1 remaining on the lower surface of the solder ball 1 are dropped into the collecting portion 14 and collected. That is, the light emitting element 85 and the light receiving element 86 of the optical unit 80 serve as means for detecting a mounting error.

Next, the substrate 4 is conveyed downstream by the conveyor 8, and the mounting error inspection means 20 inspects for the presence of a mounting error, as in the case of the first embodiment. In the second embodiment, since the optical unit 80 inspects for the mounting error as described above, the mounting error detecting means 20 may be omitted. The inspection means 20 performs the inspection again. Then, after the solder balls 1 are mounted by the second mounting means 30 on the electrodes 5 where the solder balls 1 are missing due to a mounting error, as in the case of the first embodiment, the substrate 4 is transferred to the heating furnace 40. Then, the bumps 1'are formed. The cleaning of the pin 73 by the cleaning unit 90 is performed at an arbitrary timing while the coating head 70 is moving between the substrate 4 and the reservoir 16.

In the second embodiment, two heads, that is, a pickup head 60 and a coating head 70 are provided, and a solder ball 1 is mounted while simultaneously moving in the Y direction by a moving table 12 which is a moving means common to both. Since the flux 17 is applied, the work efficiency can be significantly increased as compared with the first embodiment. Further, by providing the optical unit 80, it is possible to accurately judge a pickup error or a mounting error and perform recovery when there is an error. Further, by providing the cleaning unit 90, the pins 73 of the application head 70 can be appropriately cleaned, and an appropriate amount of the flux 17 can be always attached to the pins 73 and applied to the electrodes 5 of the substrate 4. Of course, the various operations described above are controlled by the control unit 41.

[0043]

As described above, according to the present invention, when a large number of solder balls are collectively mounted on the electrodes of the work by the mounting means or the pickup head, this collective mounting fails and the solder balls are missing. Even if an electrode is generated, the mounting error can be immediately recovered and the solder ball can be mounted, so that the yield of the work is improved and the generation of the defective work can be eliminated.

Further, by providing the heating furnace, a series of operations from mounting the solder balls to forming the bumps can be continuously and efficiently performed. Further, by providing two heads, a pickup head and a coating head, and performing the solder ball mounting work and the flux coating work in parallel while interlocking these two heads, the overall work is significantly improved. You can

[Brief description of drawings]

FIG. 1 is a plan view of a solder ball mounting device according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of a bump forming method according to a first embodiment of the present invention.

FIG. 3 is an explanatory diagram of a bump forming method according to the first embodiment of the present invention.

FIG. 4 is an explanatory diagram of a bump forming method according to the first embodiment of the present invention.

FIG. 5 is an explanatory diagram of a bump forming method according to the first embodiment of the present invention.

FIG. 6 is an explanatory diagram of a bump forming method according to the first embodiment of the present invention.

FIG. 7 is an explanatory diagram of a bump forming method according to the first embodiment of the present invention.

FIG. 8 is a plan view of a solder ball mounting device according to a second embodiment of the present invention.

FIG. 9 is a perspective view of a pickup head and an optical unit included in a solder ball mounting apparatus according to a second embodiment of the present invention.

FIG. 10 is a cross-sectional view of a pickup head and an optical unit included in a solder ball mounting device according to a second embodiment of the present invention.

FIG. 11 is an explanatory diagram of a flux applying operation of the solder ball mounting apparatus according to the second embodiment of the present invention.

FIG. 12 is an explanatory diagram of a flux applying operation of the solder ball mounting device according to the second embodiment of the present invention.

FIG. 13 is a sectional view of a cleaning unit of an application head of a solder ball mounting device according to a second embodiment of the present invention.

FIG. 14 is a side view of a conventional solder ball mounting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder ball 4 Substrate (work) 5 Electrode 7 Cylinder (work positioning part) 8 Conveyor 10 First mounting means 11 Pickup head 15 Solder ball supply section 20 Mounting error inspection means 21 Camera 24, 34 X table 25, 35 Y table 30 Second mounting means (replenishing mounting means) 31 Suction head 38 Solder ball supply section 50 XY direction moving device (positioning section) 60 Pickup head 70 Coating head 80 Optical unit (mounting error detection means)

Claims (7)

[Claims] 1. A mounting means for collectively mounting solder balls on a plurality of electrodes formed on the upper surface of a work, a mounting error inspection means for inspecting whether or not there is a mounting error by the mounting means, and this mounting error. A solder ball mounting apparatus comprising: a replenishment mounting means for mounting solder balls one by one on the electrode having a mounting error detected by the inspection means. 2. A solder ball mounting apparatus according to claim 1, further comprising a heating furnace for heating, melting and solidifying the solder balls to form bumps on the downstream side of the replenishing mounting means. . 3. The work is conveyed on a linear conveyor, and the mounting means, the mounting error inspection means, and the replenishment mounting means are sequentially arranged from the upstream side to the downstream side of the conveyor, and Pickup mounted on the electrode of the work, the mounting means being driven by a moving table to move in a direction orthogonal to the convey direction of the conveyor to stop the solder balls provided in the solder ball supply unit on the conveyor. A camera provided with a head, wherein the mounting error inspection means relatively horizontally moves in the XY directions above the work stopped on the conveyor by the first XY direction moving device and the first XY direction moving device; The replenishing mounting means stops on the second XY direction moving device and the solder ball supply unit and the conveyor by the second XY direction moving device. Mounting apparatus of solder ball of claim 1, wherein the solder balls of the solder ball supply unit to move between the work and a suction head for mounting on the electrode. 4. A conveyer for conveying a work is provided, and a solder ball supply unit, a work positioning unit, and a flux storage unit are arranged side by side in a direction orthogonal to a convey direction of the conveyer, and solder of the supply unit is provided. A pickup head that picks up balls and collectively mounts them on a plurality of electrodes formed on the upper surface of the work, an application head that applies the flux of the reservoir to the electrodes of the work, and the pickup head. A mounting table for moving the coating head in the orthogonal direction, and a mounting error inspection means for inspecting the mounting head, the positioning unit, and the storage unit for downstream mounting errors of the pickup head. And a solder ball mounted on the electrode having the mounting error detected by the mounting error inspection means one by one. Mounting apparatus of solder balls, characterized in that a mounting means use. 5. The solder ball mounting apparatus according to claim 4, wherein a heating furnace for heating, melting and solidifying the solder balls to form bumps is provided on the downstream side of the mounting means. 6. A solder ball provided in a solder ball supply portion is vacuum-sucked on a lower surface of a pickup head to pick up the solder balls, and the picked up solder balls are collectively mounted on a plurality of electrodes of a work. A step of applying flux to the lower surface of the solder ball picked up by vacuum suction by the pickup head or the upper surface of the electrode of the work, and whether or not the solder ball is mounted on all the electrodes of the work. A step of inspecting by the mounting error inspection means, and when a mounting error is detected in the step, by the mounting means for replenishment provided in the conveyance path of the work,
A method of mounting a solder ball, comprising the step of: replenishing and mounting solder balls one by one on the electrode where the solder ball is missing. 7. The solder according to claim 6, wherein after mounting the solder ball on the electrode of the work, the work is sent to a heating furnace to heat, melt, and solidify the solder ball to form a bump. How to mount the ball.