JPH11177293A - Chiplike circuit component mounting equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily perform recovery without stopping operation of mounting equipment when a chiplike circuit component is not normally stores in the storing part of a template. SOLUTION: A mounting equipment removes a chiplike circuit component (a) stored on a wrong side in a storing part 61, among the chip-shaped circuit components (a) stored in the storing part 61 of a template 6, by using a first component chick 51, while the temperate 6 shifts to a suction head from a distributor. The equipment also removes the chiplike circuit component (a) spread on the equipment 6, by using a second component chuck 52. Thus, damages of the template 3∥6 and the distributor 2 and the lack of the chip-shaped circuit component (a) at the time of final mounting of the chips on a circuit board can be almost completely eliminated. Therefore, the reliability of the chiplike circuit mounting equipment can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for mounting a chip-shaped circuit component on a circuit board, and a chip for soldering the chip-shaped circuit component mounted on the circuit board to a land electrode on the circuit board on the spot. Circuit device mounting apparatus.

[0002]

2. Description of the Related Art Conventionally, mounting a chip-shaped circuit component at a predetermined position on a circuit board has been performed using an automatic mounting apparatus as schematically shown in FIG. The chip-like circuit components housed in bulk in the plurality of containers 1, 1,... From the delivery section 11 having the escapement mechanism to the plurality of guide tubes 21, 21. Send out each. The distributor 2 has guide tubes 21, 21... Laid between panels 23, 22 fixed vertically, and the guide tubes 21, 21. It is connected directly below the outlet for sending out components, and is connected on the lower panel 22 according to the mounting pattern for mounting chip-shaped circuit components on the circuit board b.

[0003] The template 6 is arranged directly below the panel 22 on the lower side of the distributor 2. On this template 6, storage sections 61, 61 ... for storing chip-shaped circuit components are arranged. These storage sections 61 and 6
Are arranged in accordance with the mounting pattern for mounting the chip-shaped circuit components on the circuit board b. When the template 6 is arranged directly below the distributor 2, the guide tubes connected to the lower panel 22 are arranged. 21, 21 ...
And the storage section 61 correspond to the upper and lower sides. Further, a through-hole penetrating the template 6 is opened on the bottom surface of the storage portion 61, a vacuum case 4 is applied below the template 6, and the inside of the vacuum case 4 is evacuated through the exhaust pipe 5. You. by this,
The lower surface of the template 6 is maintained at a negative pressure, and an air flow is formed in the guide tubes 21 from the top to the bottom. Therefore, the chip-shaped circuit component a sent from the sending unit 11 is forcibly conveyed in the guide tubes 21, 21.
1 ... will be collected.

[0004] Next, the template 6 in which the chip-like circuit components are stored in the storage portions 61, 61 ... moves to the suction head 8 side along the guide 65. A light receiver 9 and a light source 15 are arranged above and below the template 6 in the middle of the passage. Through the through holes formed through the template 6 at the bottom of the storage portion 61, depending on whether or not the light emitted from the light source 15 is received by the light receiver 9, each of the storage portions 61, 61. It is inspected whether or not the chip-shaped circuit component is normally stored. As a result of this inspection, light leaks from the through holes of some of the storage units 61, 61..., And when this is received by the light receiver 9, the operation of the apparatus is stopped by the controller 16 and the storage units 61, 61. The reason why the chip-shaped circuit component is not properly stored is grasped and its recovery is performed. On the other hand, as a result of the inspection, all the storage units 61,
When no light leaks from the through holes 61, the template 6 moves directly below the suction head 8.

[0005] The suction head 8 has a set nozzle (not shown) projecting downward in accordance with the mounting position of the chip-like circuit component on the circuit board. The suction head 8 is lowered, and the tip of the set nozzle sucks and holds the chip-shaped circuit components of the storage portions 61 of the template 6, and then moves upward. After that, the template 6 retreats from under the suction head 8 and returns under the distributor 2.

On the other hand, a circuit board b is conveyed below the suction head 8 by the conveyor 7. The suction head 8 descends toward the circuit board b, and the chip-shaped circuit component adsorbed on the tip of the set nozzle of the suction head 8 is applied to the circuit board b. Thus, the chip-shaped circuit component is temporarily fixed with the adhesive previously applied between the land electrodes on the circuit board. Thereafter, the negative pressure at the tip of the set nozzle 31 is released, and the suction head 8 returns upward. Thereafter, the circuit board b is sent to a reflow oven, and solder such as cream solder previously applied on the land electrodes is once reflowed and then hardened, so that the terminals at both ends of the chip-shaped circuit component a are soldered to the land electrodes. Attached.

[0007]

As described above, as described above,
In the chip-shaped circuit component mounting apparatus, while the template 6 moves below the lower suction head 8 of the distributor 2, the storage portions 61, 61 of the template 6 are moved.
.. Are inspected to see if the chip-like circuit components are normally stored. At this time, when the chip-shaped circuit components a are not normally stored in the storage sections 61, 61, the mounting device is stopped each time, and the posture of the chip-shaped circuit components a is corrected or replaced, or the chip-shaped circuit components are replaced. a had to be replenished.

When the chip-shaped circuit component a does not enter the storage portions 61 of the template 6 and spills on the board surface of the template 6, the chip-shaped circuit component a
If the above operation is continued, the distributor 2 and the template 6 may be damaged. Therefore, template 6
If the chip-shaped circuit component a is not stored in any of the storage portions 61, 61, so-called shortage occurs, the mounting device is stopped, and the chip-shaped circuit component a spills on the template 6. It is necessary to inspect whether or not the chip-shaped circuit component a has been removed from the template 6. When such troubles occur frequently, the operation rate of the mounting device is reduced, the burden on the operator is increased, and the productivity is reduced.

Accordingly, the present invention has been made to solve the drawbacks of the conventional chip-like circuit component mounting device,
The purpose is to control the operation of the mounting device in any case where the chip-shaped circuit component is not normally stored in the storage portion of the template and where the chip-shaped circuit component is spilled on the board surface of the template. Without stopping
This facilitates the recovery.

[0010]

That is, in order to achieve the above object, according to the present invention, when the chip-shaped circuit component a is not housed in the housing 61 of the template 6 in a normal posture, the chip-shaped circuit component a When the component a is taken out by the first component chuck 51 and the chip-shaped circuit component a is spilled out of the storage portion 61 and is on the board surface of the template 6, a second component different from the first component chuck 51 is used. The chip-like circuit component a can be picked up from the board surface of the template 6 by the component chuck 52.

That is, the chip-shaped circuit component mounting apparatus according to the present invention comprises a plurality of containers 1, 1,... In which chip-shaped circuit components a are stored in a bulk, and a chip stored in each container 1, 1,. A distributor 2 for distributing and supplying the circuit component a, a template 6 in which a receiving portion for receiving the chip circuit component a supplied from the distributor 2 is arranged at a predetermined position, and mounting the circuit component a A conveyor 7 for transporting a circuit board b to be mounted, and a suction head for sucking the circuit components stored in the storage section of the template 6 from the storage section and mounting the sucked chip-shaped circuit components a on the circuit board b. 8 on the path along which the template 6 moves from the distributor 2 to the suction head 8. A first part chuck 51 to take out the chip-like circuit components a housed without, the storage section 61 and the template 6, the second component chuck 5 to take up a chip-shaped circuit part a which is on board of the template 6
2 is provided.

In this chip component mounting apparatus, the chip circuit component a is mounted on the circuit board b by basically the same operation as described above. That is, the chip-shaped circuit component a distributed from the containers 1, 1,...
Then, the chip-shaped circuit component a is mounted on the circuit board b by the suction head 8.

In this process, the chip-shaped circuit component a sent from the distributor 2 must be stored in the storage portion 61 of the template 6 in a prone position. Otherwise, it is impossible to take out the chip-shaped circuit component a from the storage portion 61 with the suction head 8 described later and mount it on the circuit board in a normal posture. Therefore, the inspection means including an image sensor such as a CCD camera detects the presence / absence of the chip-shaped circuit parts a in each of the storage parts 61 and the storage posture of the chip-shaped circuit parts a in the storage parts 61. Then, when the chip-shaped circuit component a is stored in the storage portion 61 in an abnormal posture, for example, in a standing state, the first component chuck 51 is moved to the storage portion 61 to remove the chip-shaped circuit component a. Take it out of the storage section 61.

As described above, when the chip-shaped circuit component a does not enter the storage portions 61 of the template 6 but spills on the board surface of the template 6, the operation of the chip-shaped circuit component a is continued. , Distributor 2
Or the template 6 may be damaged. Then, the second component chuck 52 is moved along the board surface of the template 6 to remove the chip-shaped circuit component a on the board surface of the template 6. The second component chuck 52 removes the chip-shaped circuit components a on the board surface of the template 6 and in the storage portion, and does not take out the chip-shaped circuit components a stored in the storage portions 61.

Thereafter, the template 6 is returned under the distributor 2, and the chip-shaped circuit components a are supplied only to the storage portions 61 of the template 6 in which the chip-shaped circuit components a are not stored. Then, after detecting a missing item, an abnormal posture, etc. again, the template 6 is moved to the suction head 8
Move it down. Therefore, as described above, the chip-shaped circuit component a is taken out from the storage portion 21, 21,... Of the template 6 by the suction head 8, and mounted on the circuit board.

[0016]

Embodiments of the present invention will now be described specifically and in detail with reference to the drawings.
The overall configuration of the chip-shaped circuit component mounting device according to the present invention is as already described with reference to FIG. That is, a plurality of containers 1 containing chip-shaped circuit components in a bulk shape are arranged, and a distributor 2 is arranged therebelow. As shown in FIGS. 4 and 5, the container 1 has a funnel-shaped bottom surface, and a through hole is opened at the center where the bottom surface is lowest. Further, the upper end of the component discharge pipe 11 is slidably fitted through the through hole, and
Is inserted into the container 1. In the case shown, the component discharge pipe 11 is inserted so as to substantially coincide with the central axis of the container 1, and the upper end thereof is obliquely opened.

The container 1 is attached to the frame 11 so as to be vertically movable. As shown in FIG. 5, a cam mechanism 17 is attached to the container 1 via a bracket 18.
The cam mechanism 17 receives power from a motor 15 via a transmission mechanism 19. Thereby, the container 1 is reciprocated up and down. In FIG. 4, what is indicated by a two-dot chain line indicates the relative movement of the discharge pipe 11 accompanying the vertical movement of the container 1. As the container 1 moves up and down, the chip-shaped circuit components a therein are sent out one by one into the discharge pipe 11.

At the lower end of the component discharge pipe 11, an escapement mechanism for releasing the chip-shaped circuit components a one by one to the guide tubes 21, 21... Of the distributor 2 is provided. That is, the lower end of the component discharge pipe 12 and the guide tubes 21
A plate-like slider 13 that slides back and forth on the frame base 11 in the direction of the arrow in FIG. The slider 13 is provided with a component storage hole 14 for receiving only one chip-shaped circuit component a.
With the reciprocation of 3, the component storage hole 14 reciprocates between the lower end of the component discharge pipe 12 and the upper ends of the guide tubes 21. Thus, at the position of the component discharge pipe 12, only one of the pipes 12 is accommodated in the component storage hole 14. When the component storage hole 14 is moved to the guide tube 21 by the slide of the slider 13, the chip-shaped circuit component Is sent out to the guide tube 21 of the distributor 2.

The distributor 2 is composed of a pair of plates 22 and 2 held vertically and horizontally opposed to each other via a frame.
3 (see FIG. 10), and flexible guide tubes 21, 21,... The upper ends of the guide tubes 21, 21... Are connected to the upper plate 23 so as to be connected to the component passing holes provided in the frame base 11, respectively. It is connected to the lower plate 22 at a corresponding position.

As shown in FIG.
Under the lower plate 22, the chip-shaped circuit component a is set in accordance with the mounting position of the chip-shaped circuit component on the circuit board.
The template 6 provided with the storage section 61 for storing the information is inserted. At this time, the lower end of the guide tube 21 fixed to the lower plate 22 of the distributor 2 is disposed on each storage portion 61 of the template 6.

At the bottom of the storage section 61 of the template 6,
A through hole 61a is provided. The through-hole 61 a is arranged so as to be deviated to one side in the longitudinal direction of the storage section 61. When the template 6 is inserted under the plate 22 on the lower side of the distributor 2, the vacuum case 4
The guide tube 34 and the storage portion 6
Air is sucked through one through hole 61a. Accordingly, the chip-shaped circuit components a sent out from the containers 1, 1,... Are conveyed by the flow of air formed in the guide tube 21 by the suction of the air, and are received by the storage portion 61 of the template 6. .

In FIG. 6, inside the storage section 61 on the right side,
The chip-shaped circuit component a is stored in a state of being laid down in the front-rear direction on the paper surface, and has a normal and good storage posture. On the other hand, in the storage section 61 on the left side in FIG. 6, the chip-shaped circuit component a is stored in a state of standing on the through hole 61a. It is easy to store.

The template 6 in which the chip-shaped circuit component a is stored in the storage section 61 in this manner is conveyed directly below a suction head 8 described later. FIG. 1 shows an example of a transport mechanism for transporting the template 6. In the illustrated example, a ball screw 67 rotated by a motor (not shown) penetrates a bracket 65 supporting the template 6, and the ball screw 67 Are rotated forward and backward by a motor (not shown), so that the template 6 moves left and right in FIG. 1 and moves between the lower part of the distributor 2 and the lower part of the suction head 8. Reference numeral 68 denotes a frame on which a ball screw 67 is provided, and reference numeral 66 denotes a bearing that supports one end of the ball screw 67.

Along the ball screw 67, the template 6
Detects whether or not the chip-shaped circuit component a is stored in the correct position in the storage section 61 of the template 6 in the middle of the path moving from directly below the distributor 2 to the suction head 8 described below. Inspection means are arranged. As shown in FIGS. 1 and 2, the illustrated inspection means is provided with a light source 15 disposed below the position where the template 6 passes, and above the position where the template 6 passes opposite the light source 15. And an image sensor 9 such as a CCD camera.

For example, when there is no chip-shaped circuit component a in the storage section 61 as in the second storage section 61 from the left shown in FIGS. 1 and 2, the template 6 moves between the light source 15 and the image sensor 9. When passing, light leaks from the light source 15 side to the upper side of the template 6 through the through hole 61a of the storage section 61 as shown by the arrow. Therefore, the presence or absence of the chip-shaped circuit component a in each of the storage portions 61 is detected by receiving the light by the image sensor 9 and performing image processing on the light by the computer (not shown).

As shown in FIG. 1 and FIG. 2, the chip-shaped circuit component a is stored in the storage section 61 as in the second storage section 61 from the right. Light leaks from the light source 15 side to the upper side of the template 6 through the through hole 61a of the storage section 61 as indicated by the arrow.
Therefore, in this case as well, the light from the light source 15 is received by the image sensor 9 and image processing is performed by a computer (not shown) to determine whether the storage posture of the chip-shaped circuit component a in each of the storage units 61, 61. Is detected. Further, by this image processing, the positions of the storage units 61, 61... In which the chip-shaped circuit component a is missing or in which the posture is abnormal are specified.

As shown in FIG. 1 and FIG. 3, first and second component chucks 51 and 52 are arranged on the position ahead of the inspection means and above the position where the template 6 passes. The first component chuck 51 takes out the chip-shaped circuit component a determined to be stored in the storage portion 61 of the template 6 in an abnormal posture by the image sensor 9 from the corresponding storage portion 61 and discards it. Therefore, the operation of the first component chuck 51 is controlled by a computer (not shown) to which image data is input from the image sensor 9. By this operation control, the tip of the first component chuck 51 moves up and down while moving in the two-dimensional direction on the plane of the template 6, and the chip-shaped circuit component a is taken out. When the chip-shaped circuit components a are stored in all the storage portions 61 of the template 6 and all the chip-shaped circuit components a are laid down in the storage portion 61, the above-described chip-shaped circuit components a No removal is performed, and the template 6 passes directly below the first component chuck 51 as shown by a two-dot chain line in FIG.

The second component chuck 52 is shown in FIGS.
, The lower end side for picking up the chip-shaped circuit component a is long in the front-rear direction on the paper surface. The second component chuck 52 picks up and discards all the chip-shaped circuit components a on the board surface of the template 6 as shown in FIGS. 1 and 3 when the template 6 passes therebelow. is there. The second component chuck 52 is provided with the template 6
Only the chip-shaped circuit components a on the board surface and in the storage section are taken up. When the template 6 returns from the suction head 8 to the distributor 2, the first component chuck 51 and the second component chuck 52 do not operate, and the template 6 passes under them.

When it is detected by the image processing by the image sensor 9 that there is no chip-shaped circuit component a in some of the storage portions 61 of the template 6, or as described above, the first component When the chip-shaped circuit component a is taken out of a part of the storage portion 61 of the template 6 by the chuck 51, the template 6 is returned under the distributor 2 again. Then, the chip-like circuit components a are sent from some of the containers 1, 1,... Via the distributor 2 only to the storage units 61, 61. Thereafter, after the inspection as described above is performed by the inspection means, if necessary, the chip-shaped circuit component a is taken out and picked up again by the first and second component chucks 51 and 52. As a result of the inspection, when the chip-shaped circuit component a is stored in a normal posture in all of the storage portions 61 of the template 6, the template 6 moves to immediately below the next suction head 6.

FIG. 7 shows a state in which the template 6 has been moved directly below the suction head 6. As shown in the figure, suction heads 31, 31... Are provided on the lower surface of the suction head 8 in correspondence with the positions of the storage portions 61, 61. The chip-shaped circuit component is sucked and held at the tip end. In the illustrated embodiment, the suction heads 31, 31,... Are composed of a holder 32 made of plastic or the like and a nozzle portion 40 made of an elastic body such as rubber fitted in the holder 32.
Is mounted at a predetermined position on a mounting plate 36 of the suction head. Behind the mounting plate 36 is a vacuum chamber 41, which is a suction pump (not shown) (not shown).
And a negative pressure is generated by the operation of the suction pump. As a result, the tip of the nozzle portion 40 is maintained at a negative pressure, and the chip-shaped circuit component a is sucked there. afterwards,
The suction head 8 moves up, the template 6 retreats from under the suction head 8 and returns under the distributor 2.

The circuit board b is conveyed by conveying means such as a conveyor 7 and once positioned and stopped immediately below the suction head 8, and then sent next. When the circuit board b is conveyed below the suction head 8 by the conveyor 7 and stopped at a predetermined position, the suction head 8 is lowered from the state of FIG. 8 to the tip of the suction head 31 as shown in FIG. The chip-shaped circuit component a sucked and held is attached to the circuit board b.
To release the suction of the suction head 31. Thereafter, the suction head 8 moves up to the original position.

As shown in FIG. 8, adhesives e, e are previously applied to predetermined positions of the circuit board b on which the chip-shaped circuit components a are to be mounted, that is, between the land electrodes d, d. 9 by the mounting operation by the suction head 31 shown in FIG.
The chip-shaped circuit component a is adhered with the adhesives e, e, and the mounting of the chip-shaped circuit component a on the circuit board b is completed. FIG. 11 shows a state in which a chip-shaped circuit component a is mounted on land electrodes d, d on a circuit board b.

Thereafter, by repeating this operation, chip-like circuit components a, a... Are sequentially mounted on the circuit board b. The circuit board on which the chip-shaped circuit components a, a,... Are mounted is sent to the next process by the conveyor 7, and the chip-shaped circuit components a are soldered to the land electrodes d formed on the circuit board b. Done. For example, as shown in FIGS. 8 and 9, cream solders c, c are printed on the land electrodes d, d in advance. In the soldering step, the cream solder c applied on the land electrodes d, d is once reflowed and cured, and the terminals at both ends of the chip-shaped circuit component a are soldered to the land electrodes d, d.

[0034]

As described above, according to the present invention, the chip-shaped circuit component a stored in the storage portion of the template 6 is provided.
Among them, the chip-shaped circuit component a stored without falling down in the storage portion is removed by the first component chuck 51 while the template 6 is moved from the distributor 2 to the suction head 8 and spilled onto the template 6. The chip-like circuit component a is attached to the second component chuck 52.
Can be removed by This makes it possible to almost completely eliminate the damage of the template 6 and the distributor 2 and the shortage of the chip-shaped circuit component a when the chip-shaped circuit component a is finally mounted on the circuit board b. Therefore, the reliability of the chip-shaped circuit component mounting device can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing an inspection unit and a component extraction unit in an example of a chip-shaped circuit component mounting device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a main part showing a state in which the presence / absence of a chip-shaped circuit component in a storage portion of a template of the chip-shaped circuit component mounting device according to the embodiment and a storage posture thereof are inspected.

FIG. 3 is a schematic side view showing an operation of taking out a chip-shaped circuit component from a storage portion of a template by a component chuck in the embodiment.

FIG. 4 is a vertical sectional perspective view of a main part showing a portion from a container to a distributor of the chip-shaped circuit component mounting device according to the embodiment.

FIG. 5 is a partial side view showing a part of a portion from a container to a distributor of the chip-shaped circuit component mounting device according to the embodiment in a partial cross section.

FIG. 6 is a vertical sectional side view of a main part showing a lower part of the distributor and a template inserted under the distributor of the chip-shaped circuit component mounting apparatus according to the embodiment.

FIG. 7 is a vertical sectional side view of a main part showing a lower part of a suction head and a template moved below the suction head of the chip-like circuit component mounting apparatus according to the embodiment.

FIG. 8 is a vertical sectional side view of a main part showing a lower part of a suction head of the chip-shaped circuit component mounting apparatus according to the embodiment and a circuit board conveyed below the suction head.

FIG. 9 is a vertical sectional side view showing the operation of mounting the chip-shaped circuit component sucked and held by the suction head on the circuit board in the chip-shaped circuit component mounting apparatus according to the embodiment.

FIG. 10 is a schematic perspective view showing the whole of a conventional chip-shaped circuit component mounting device.

FIG. 11 is a partial plan view of the circuit board showing a state where the chip-shaped circuit components are mounted on the circuit board by the chip-shaped circuit component mounting device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 container 2 distributor 6 template 8 suction head 9 light receiver 15 light source 51 first component chuck 52 second component chuck 61 template storage unit 61a through hole at bottom of storage unit a chip-shaped circuit component b circuit board

Claims (3)

[Claims] 1. A plurality of containers (1), (1)... In which chip-shaped circuit components (a) are stored in a bulk shape, and a chip-shaped circuit stored in each container (1), (1). Distributor (2) for distributing and supplying circuit components (a)
And a template (6) in which a storage portion (61) for receiving the chip-shaped circuit component (a) supplied from the distributor (2) is arranged at a predetermined position, and mounting the chip-shaped circuit component (a). A conveyor (7) for transporting a circuit board (b) to be mounted, and a circuit component housed in the housing part (61) of the template (6) sucked from the housing part, and the sucked chip-shaped circuit part (a). And a suction head (8) for mounting the template (6) on the circuit board (b), wherein the template (6) is moved along a path from the distributor (2) to the suction head (8). A first component chuck (51) for taking out the chip-shaped circuit component (a) stored in the storage portion (61) of (6) without falling down, and a template ( 6) A chip-shaped circuit component mounting apparatus, comprising: a storage portion (61); and a second component chuck (52) for picking up a chip-shaped circuit component (a) on the board of the template (6). . 2. An inspection means for inspecting a storage posture of a chip-shaped component (a) in a storage portion of a template (6) is provided in a middle of a path moving from a distributor (2) to a suction head (8). One component chuck (51)
2. The chip-shaped circuit component (a) is taken out from the storage part (61) in which the inspection means detects that the chip-shaped circuit component a is stored without falling down. The chip-shaped circuit component mounting device as described in the above. 3. The second component chuck (52), when the template (6) passes under it, completely removes all the chip-shaped circuit components (a) on the board surface of the template (6) and in the storage portion. 3. The chip-like circuit component mounting device according to claim 1, wherein the device is a pick-up device.