JPH02278800A - Method and apparatus for supply of electronic component - Google Patents

Abstract

PURPOSE:To enhance reliability of an electronic-component supply operation by a constitution wherein, immediately before a cover tape is stripped off from a housing recessed part, a suction pin and an up-and-down-system pressing member are lowered to a position before the housing recessed part or to an open part. CONSTITUTION:An electronic-component housing tape 10 is provided with housing recessed parts 11 at equal intervals. Chip-shaped electronic components 12 are put in the individual housing parts 11. Openings of the housing recessed parts 11 are blocked up by a cover tape 13 which is pasted so as to be freely stripped off. Immediately before the cover tape 13 is stripped off from the housing recessed parts 11 or in a state that the tape is stripped off partially and that the recessed parts are partly open, both a suction pin 41 and an up-and- down-system pressing member 42 adjacent to the suction pin 41 are lowered to a position before each housing recessed part 11 or to a part where the housing recessed part 11 is opened. Thereby, it is possible to surely prevent the electronic components 12 from springing out.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method and apparatus for supplying electronic components when using an electronic component storage tape in which chip-shaped electronic components are stored in storage recesses.

(Summary of the Invention) The present invention is an electronic component supply method for peeling off a cover tape from an electronic component storage tape and transferring the electronic component to a suction position in an electronic component supply section of an electronic component mounting machine, comprising:
The reliability of the electronic component supply operation is improved by preventing the electronic components from flying out in the storage recess during cover tape peeling by the suction pin in the lowered position and the elevating holding member adjacent thereto. .

(Prior art) First, as a method of supplying electronic components in an electronic component supply unit with a number of electronic components installed, a suction pin is lowered to a half-opened electronic component storage tape with a part of the cover tape peeled off. A method to achieve suction while preventing the electronic components from flying out or changing their posture by replacing the holding of the stored electronic components with a suction pin and completing the peeling of the cover tape while holding the electronic components with the suction pin. has been proposed by the present applicant in Japanese Patent Application No. 63-284845.

FIG. 18 shows a method for supplying electronic components according to vfl [63-284845], in which a suction pin 41 is lowered to hold down the cover tape 13 with respect to the electronic component storage tape 10 in a half-open state with the cover tape 13 partially peeled off. Use the suction pin 41 to hold down the electronic component 12 that is about to disappear.
This shows the state in which they have been replaced. In addition, in the figure, 3 is a holding plate whose tip becomes a peeling part for peeling off the cover tape, 11
are storage recesses provided at equal intervals on the electronic component storage tape.

In the case of FIG. 18, the electronic component storage tape 10 is pitch-fed in the direction of arrow T while the suction pin 41 is lowered, and when the storage recess 11 containing the electronic component 12 is located directly below the suction pin 41, the electronic component storage tape 10 10 stops, and the suction pin 41 suction-holds the electronic component 12 and rises.

(Problem to be solved by the invention) By the way, in the complement of the fjS18 diagram, the cover tape 13
A gap G is generated between the position where the suction pin 41 is peeled off and the position where the suction pin 41 starts to press. Depending on the size of the gap G and the size of the electronic component 12 housed therein, a situation may occur in which the suction pin 41 does not have a sufficient holding effect, leading to a decrease in reliability.

The reason why the gap G occurs will be described below. First, the feeding pitch of the electronic component storage tape 10 is standardized.
For example, 4IIIUa pitches are commonly used, and are limited to a few meters in size. The cover tape peeling position is determined in accordance with the pitch. For example, the distance is determined to be 1/2 of the pitch from the center of the parts suction position.

On the other hand, the size of electronic components stored using the electronic component storage tape 10 with the same pitch is, for example, 4++o pitch.
Electronic component length x width is 1.6XO0f with n storage tape
It has a considerable range of targets, including four types between l1m+n-3, 2x2, and 5mm.

The suction pin 41 has the function of holding the electronic component 12 after it has been taken out by suction until it is mounted, but it is not preferable to hold the electronic component 12 due to the external shape of the electronic component when mounting it on a printed circuit board. This is because if there are adjacent parts that have already been mounted, the protruding suction pins will touch and cause misalignment. In addition, it is convenient for the suction pins not to protrude beyond the outer shape, both when regulating the position using the clamping claws before mounting electronic components, and when capturing images for image processing.

As mentioned above, the peeling position of the cover tape is suitable within a limited range, and on the other hand, the external shape of the suction pin suitable for the size of the electronic component is also limited, so in the combination of the two, the gap shown in Figure 18 is G, resulting in the above-mentioned problem of reduced reliability.

In view of the above-mentioned points, an object of the present invention is to provide a highly reliable electronic component feeding method and device that can reliably prevent electronic components from flying out by providing an elevating holding member adjacent to a suction pin. shall be.

(Means for Solving the Problems) In order to achieve the above object, the electronic component supply method of the present invention involves peeling off a recovery tape from an electronic component storage tape that stores electronic components in storage recesses at regular intervals. When taking out an electronic component from the storage recess with a suction pin, immediately before the cover tape is peeled off from the storage recess or when the cover tape is partially peeled off and in a half-open state, if the suction pin and the vertical movement adjacent to the suction pin are Both of the type holding members descend from a position in front of the storage recess to an open portion of the storage recess.

Further, the electronic component supply device of the present invention includes means for intermittently feeding an electronic component storage tape storing electronic components in storage recesses at regular intervals, and a pressing plate for peeling the recovery tape from the electronic component storage tape at the tip. a suction pin that is movable up and down opposite to the part of the electronic component storage tape from which the cover tape is to be peeled; and an elevating holding member that is movable up and down in the gap between the tip of the holding plate and the suction pin when lowered. The configuration includes the following.

(Function) In the electronic component supply method and device of the present invention, immediately before the cover tape is peeled off from the storage recess of the electronic component storage tape, or when the cover tape is partially peeled off and in a half-open state, the suction pin and the adjacent vertically moving The type holding member descends to the front position or the open part of the storage recess, and as the cover tape is peeled off, it presses the top surface of the electronic component in the storage recess, or it presses the top surface of the electronic component while facing at a slight interval. It acts as a guide. In other words, even if there is a gap between the peeling position of the cover tape and the outer diameter of the suction pin, the elevating holding member descends into the gap, so the suction pin alone is insufficient to hold down the electronic component. Even in such cases, electronic components can be reliably prevented from flying out.

Note that when mounting electronic components on the printed circuit board, only the suction pins are lowered and the elevating type holding member remains in the raised position, so that the elevating type holding member does not become an obstacle to mounting the electronic component.

(Example) Hereinafter, an example of the electronic component supply method and apparatus according to the present invention will be described with reference to the drawings.

In FIGS. 1 to 9, reference numeral 1 denotes a frame that is fixed upright on the electronic component mounting machine, and the frame 1 is made of electronic component storage tape (F7), which is formed by punching storage recesses in paper and is made of sloppy plastic. A receiving guide 2 supporting the bottom side of the container 10 (which may have a storage recess formed by embossing) is fixed horizontally. Further, a holding plate 3 that presses the upper surface of the electronic component storage tape 10 running on the receiving guide 2 to provide a required running resistance is pivotally attached to the frame at a fulcrum P.
Further, the holding plate 3 is biased by a spring 4 in a direction to press the electronic component storage tape 10 on the guide.

The oil-mounted electronic component storage tape 10 has storage recesses 11 at equal intervals, and a chip-shaped electronic component 12 is contained in each storage recess.The opening of the storage recess 11 is covered with a cover tape 13 that is releasably attached. It's blocked. Then, the tip 5 of the pressing plate 3 becomes a peeling part that peels off the cover tape 13, and after pulling the cover tape 13 almost perpendicularly to the running direction of the electronic component storage tape 10, the tip 5 of the pressing plate 3 is pulled along the upper surface behind the tip of the pressing plate. I try to pull it out at a sharp angle.

On the other hand, as shown in FIG. 1, a wheel 6 with an intermittent feed pin is pivotally supported on the seven frames 1 at a fulcrum Q.

Wheel 6 with intermittent feed pin is electronic component storage tape 10
It has a pin on its outer circumferential surface that engages with the feed hole of
The electronic component storage tape 10 is advanced by the arrangement interval (feeding pitch) of the storage recesses 11 in one intermittent rotation.

Cover tape 1 peeled off from electronic component storage tape 10
A pulley 30 and a pinch roller 31 urged in a direction to press against the pulley 30 and the pinch roller 31 are disposed above the frame 1 as a means for pulling out the pulley 30 and the pinch roller (rubber roller) 31. has the function of sandwiching the cover tape 13 and drawing the cover tape 13 outward by rotation of the pulley 30 in the direction of arrow S due to friction between the boot 17-30 and the cover tape 13.

The head section 40 has a suction pin 41 and an elevating presser member 42 adjacent thereto at its lower end, and has the function of raising and lowering the suction pin 41 and the presser member 42, respectively. Here, the suction pin 41 is a cylindrical vibrator with a vacuum suction hole inside, and the elevating holding member 12 surrounds the suction pin tl and has a prismatic outer shape as shown in FIG. The outer shape of the lower end surface is m
This is the size that can be used.

Note that 50 is a vacuum dust suction device that suctions and takes in the cover tape 13 pulled out to the outside.

The lower end corner of the lifting presser member 42 is provided with a moderate chamfer 51 as shown in FIG. 10 or a curved surface 52 as shown in FIG.
It is good to form/r.

In the configuration of the above embodiment, the electronic component storage tape 10
The peeled-off cover tape 13 is folded back at the tip 5 of the presser plate 3, which serves as a peeling section, and is pulled out through a rear pulley 30 and a pinch roller 31.

r: Figure 53 shows the state after the electronic component 12 is taken out from the storage recess 11, and the electronic component storage tape 10 is moved in the direction of arrow T in order to transfer the next electronic component 12 to the suction position X directly below the suction pin 41. (The peeling operation of the cover tape also starts at the same time.) At the same time, the suction pin 41 and the elevating presser member 42 start descending in synchronization. Before the cover tape 13 covering the storage recess 11 containing the electronic component 12 at the most advanced position is completely peeled off, in other words, the cover tape 13 is partially peeled off from the storage recess 11 as shown in FIG. In this state, the suction pin 41 and the elevating holding member 42 are lowered into the open part of the storage recess 11 (or the suction pin 41 and the holding member 42 are lowered onto the storage recess 11 after taking out the electronic component). The next storage recess 11 is opened (the opened part may also be covered accordingly).Here, the suction pin 41 and the elevating type holding member 42 are used to store the electronic components from which the cover tape has been peeled off with a spring cushion. It is sufficient to lightly press the upper surface of the tape 10, and the spring cushion keeps the force pressing the chimp part at a predetermined value, and the pressure in the height direction uses a mechanism 1 to absorb positional variations.

Then, the elevating holding member 42 descends to eliminate the gap between the suction pin 41 and the tip 5 of the holding plate 3, and serves to reliably prevent the electronic component 12 from flying out.

In the lowered state of the suction pin 41 and the outer-type holding member 42 shown in FIG. Pin 41 and lifting type holding member 42
The movement of the electronic component storage tape 10 and the peeling operation of the cover tape 13 are continued while the upper surface of the electronic component 12 is continued to be restricted, and the electronic component 12 reaches the suction position X as shown in FIG. The electronic component 12 is stably sucked and held by the vacuum suction operation of the suction pin 41 that has descended into the storage recess 11, and the electronic component 12 inside the storage recess 11 is taken out by the upward movement shown in FIGS. 6 to 8. . At this time, at the f51 stage, as shown in FIG.
As shown in FIG. 8, only the elevating holding member 42 rises and retreats from the tip of the suction pin 41, making it possible to perform subsequent operations such as positioning the electronic component 12.

tS1 Instead of the suction pin tl further descending to suction the electronic component 12 as shown in FIG. 1, the electronic component 12 can be suctioned without lowering the suction pin 41.

In this case, lower the suction pin! i■ becomes easier and the work speed is faster, but suction may become somewhat unstable depending on the size of the electronic component.

When the printed circuit board 50 reaches the S shoulder position, the suction pins 41 descend while adsorbing the electronic components 12 (the elevating holding member 42 does not descend) as shown in FIG. Mounting is accomplished by placing the electronic component 12 on the area coated with the agent.

Note that the drawn-out cover tape 13 is processed by being continuously sucked into a suction port of a vacuum dust suction device 50 provided separately.

In the above embodiment, the suction pin 41 and the lifting type holding member 4
2 has been described in the case where the electronic component storage tape 10 is pressed by a spring cushion, but the lower end surfaces of the suction pin 41 and the elevating presser member 42 are arranged to face the top surface of the electronic component storage tape 10 at a minute interval when lowering. It's okay. In this case, the operations corresponding to FIGS. 4 to 6 are performed without the suction pin 41 contacting the electronic component 12. Even in this case, there is a small distance between the electronic component 12 and the lower end surfaces of the suction pin 41 and the elevating presser member 42, and the movement of the electronic component 12 is restricted, so that the electronic component 12 does not jump out of the storage recess 11. Although there is a slight gap between the suction pin 41 and the top surface of the electronic component when the electronic component 12 is suctioned, this does not hinder the suction and holding of the electronic component 12 .

In the above embodiment, the elevating presser member 4 has a rectangular prism shape.
2 is shown as an example. In the case of this rectangular prism-shaped elevating presser member 42, since the direction is restricted, a rotation stopper is required to restrict the orientation of the elevating presser member 42. FIG. 12 shows another specific example of the elevating type presser member, and as shown in the figure, an elevating type presser member 42A having a cylindrical outer shape adjacent to and surrounding the suction pin 41 may be adopted. There are no restrictions on the direction of rotation, and no rotation or locking is required.

In this case as well, forming the chamfer 51 shown in FIG. 10 or the curved surface 52 shown in FIG. 11 is effective.

In addition, in the above embodiment, the elevating type holding member 42 moves up and down in parallel with the suction pin 41, but as shown in Figs.
3, 42C, each lifting type holding member 42B, 42C
It is also possible to have a structure in which it is retracted diagonally upward. In this case, the evacuation timing is determined by the left and right lifting press members 42.
B and 42C can be raised and lowered separately.

Furthermore, it is not necessary for the elevating presser member to surround the entire circumference of the suction pin 41, and it is possible to employ a rectangular plate-shaped elevating presser member 42D adjacent to the suction pin 41 as shown in FIG. The retracting direction of the elevating presser member 42D may be either parallel to the suction pin 41 or diagonally upward.

In addition, the lifting type presser member 42 having the structure 3Q in FIG.
Even if the opening direction of B is parallel to the running direction of the electronic component storage tape 10 as shown by arrow P in FIG.
The direction may be perpendicular to the running direction of the storage tape 10 as shown by arrow Q in the figure.

(Effects of the Invention) As described above, according to the present invention, the suction pin and the lifting Since the holding member descends to the open position or the open part of the storage recess to restrict the movement of electronic components within the storage recess, all the problems of the prior art can be solved with a simple configuration, and the cover It is possible to reliably and continuously hold down the electronic components in the storage recess from which the tape is removed. Moreover,
Since electronic components are taken out from the storage recess immediately after peeling off, there is no room for unnecessary trouble, and the reliability of suction and removal of electronic parts is extremely high.

[Brief explanation of drawings]

Fig. 1 is a block diagram showing the overall structure of an embodiment of the electronic component supply method and device according to the present invention, Fig. 2 is a plan view of the main part structure of the embodiment, and Figs. 7 to 9 are enlarged views to explain the embodiment, Figure 10 is an enlarged view showing the chamfer formed on the lifting type holding member, and Figure 11 is the lifting type FIG. 12 is an enlarged view showing the curved surface processing formed on the holding member, and FIG.
) is a plan sectional view showing a specific example of an elevating type presser member with a split structure, FIG. 15 is a plan sectional view showing a specific example of the elevating presser member, and FIGS. 16 and 17 are elevating type with split structure. FIG. 18 is an enlarged sectional view illustrating the electronic component supply method proposed by the present applicant. DESCRIPTION OF SYMBOLS 1... Frame, 2... Receiving side, 3... Holding plate, 5... Tip, 6... Wheel with intermittent feed pin, 10... Electronic component storage tape, 11... Storage recess, 12...Electronic component, 13...Cover tape, 3
0...boo] No 31... pinch roller -40...
・Hen FfftS, 41... Suction pin, 4.2, 4
2 A to 82D... Elevating type holding member.

Claims (3)

[Claims] (1) In an electronic component supply method in which a cover tape is peeled off from an electronic component storage tape that stores electronic components in storage recesses at regular intervals, and the electronic components are taken out from the storage recesses using a suction pin, the cover tape is removed from the storage recesses. Immediately before it is peeled off or when it is in a half-open state where it is partially peeled off, both the suction pin and the elevating presser member adjacent to the suction pin are lowered to a position in front of the storage recess or to an open part of the storage recess. An electronic component supply method characterized by: (2) The electronic component supply method according to claim 1, wherein the upper surface of the electronic component storage tape from which the cover tape has been peeled is pressed when the elevating presser member is lowered. (3) means for intermittently feeding the electronic component storage tape containing electronic components stored in storage recesses at regular intervals; a presser plate for peeling the recovery tape from the electronic component storage tape at the tip; The present invention is characterized by comprising a suction pin that is movable up and down in opposition to the portion of the cover tape to be peeled off, and an elevating holding member that is movable up and down in the gap between the tip of the holding plate and the suction pin when lowered. electronic component supply equipment.