JPH04107991A - Electronic part takeup equipment - Google Patents

Abstract

PURPOSE:To secure an appropriate takeup interval for making it possible to take up an electronic part securely by pushing up the electronic part in a pocket using a pushup pin in the process of using a nozzle to take up the electronic part. CONSTITUTION:Nozzle 11 of conveying head 10 attracts a part P housed in a pocket 8 of tape 2 to take up the part P. Further when a cam 27 rotates a lever 24 swings to move a roller 25 to push up a pushup pin 20 installed inside a guide section 3 so as to move vertically freely. Accordingly, the nozzle 11 moves down to synchronize with the operation of taking up part P, the cam 27 rotates to push up the part P, thereby adjusting the height of the upper surface of part P so that the interval between the upper surface of part P and the lower end of nozzle 11 becomes the optimum takeup interval (t).

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component supply device, in which the top surface of an electronic component stored in a pocket of an electronic component enclosing tape and a transfer head for picking up the electronic component. The electronic component is pushed up from below so that the tick-up distance between the nozzle and the lower end of the nozzle is a predetermined distance.

(Conventional technology) In electronic component mounting equipment that picks up electronic components such as resistor chips and capacitor chips by the nozzle of the transfer head, and transfers and mounts them onto a board, this method is used to supply electronic components to the transfer head. The electronic component encapsulation tape method is widely used.

In this method, an electronic component encapsulating tape is wound around a supply reel, and while the tape is being pitch-fed by a pitch feeding means, the nozzle of the transfer head is raised and lowered, and the nozzle is used to pick up the electronic components in the pocket of the tape. It absorbs and ticks up.

FIG. 4 shows a conventional means, in which 1°O is an electronic component enclosing tape, and the electronic component P is placed in a pocket 101 of the tape.
is stored. 102 is a transfer head, 103 is a nozzle, and 104 is a guide portion for the tape 100.

If the vertical stroke of the nozzle 103 is excessive during tick-up, the lower end of the nozzle 103 will collide with the top surface of the electronic component P, destroying the electronic component P. Furthermore, if the lifting stroke is too small, the electronic component P cannot be tapped or knobed due to insufficient suction force. Therefore, in order to avoid such a tick-up error, the tick-up interval t between the upper surface of the electronic component P and the lower end of the nozzle must be maintained at an appropriate interval.

(Problem to be Solved by the Invention) However, due to molding errors and assembly errors of the guide portion 104, the height of the top surface of the electronic component P guided by the guide portion 104 tends to vary, and as a result, The above-mentioned tick-up interval t also varies, and there is a problem in that a tick-up error is likely to occur. Tick-up errors due to variations in the tick-up intervals are particularly likely to occur frequently in microelectronic components such as resistor chips and capacitor chips.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component supply device that can prevent the above-mentioned pick-up mistakes.

(Means for Solving the Problems) The present invention provides a supply reel around which an electronic component encapsulating tape is wound, a pitch feeding means for pitch feeding the electronic component encapsulating tape, and an electronic component encapsulating tape fed out from the supply reel. a guide section that guides the electronic component toward the pitch feeding means; a pick-up interval between the top surface of the electronic component stored in the pocket of the electronic component encapsulating tape and the lower end of the nozzle of the transfer head that picks up the electronic component; A push-up pin for pushing up the electronic component from below and driving means for the pin are provided to maintain a predetermined interval between the electronic parts.

(Function) According to the above configuration, when the electronic component is ticked up by the nozzle, by pushing up the electronic component in the pocket with the push-up pin, the height of the top surface of the electronic component is set to a predetermined height, and an appropriate tick-up interval is set. This ensures that electronic components can be picked up reliably.

(Example 1) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a side view of the electronic component supply device.

Reference numeral 1 denotes a supply reel, on which an electronic component supply tape 2 is wound. A long plate-shaped guide section 3 is provided at the front of the supply reel 1, and a pitch feeding means 4 for the tape 2 consisting of a sprocket or the like is provided at the front of the guide section 3.
is provided. Reference numeral 5 designates a guide cover for the tape 2 provided on the guide portion 3, and a slit 6 is cut out in the front portion of the guide cover for folding and peeling off the cover tape 2a stuck to the upper surface of the tape 2. . 7 is a take-up reel for the cover tape 2a.

10 is a transfer head, 11 is a nozzle, and the electronic component P stored in the pocket 8 of the tape 2 is attracted to the nozzle 11 and ticked up (see FIG. 2).

Reference numeral 20 denotes a push-up pin that is disposed inside the guide portion 3 so as to be movable up and down, and is biased downward by a coil spring 21. Reference numeral 22 denotes a driving means for the pin 20, which includes a lever 24 that swings around the pin 23, a roller 25 and a cam follower 26 that are pivotally attached to both ends of the lever 24, a cam 27, and a drive means for the cam 27. It consists of a motor 28. When the cam 27 rotates, the lever 24 swings and the roller 25 pushes up the pin 20.

30 is a plate on which the guide portion 3 is placed. This plate 30 is placed on a table 31. A nut 32 integrally provided on the plate 30 is screwed into a feed screw 33 provided on the table 31.
When the feed screw 33 rotates, the plate 30 slides on the tiple 31 along the feed screw 33 and stops the desired tape 2 at the tick-up position of the nozzle 11.

In synchronization with the nozzle 11 descending and ticking up the electronic component P, the cam 27 rotates and pushes up the electronic component P from below, thereby touching the top surface of the electronic component P and the nozzle 1.
so that the lower end of 1 is the best tick-up interval t,
Adjust the height of the top surface of the electronic component P (see Figure 2). The best tick-up interval t varies slightly depending on the type of electronic component P, but is generally about 0.1 m.

In this way, according to the present means, when the nozzle 11 ticks up the electronic component P, the best tick-amp interval t can be obtained, so the electronic component P can be reliably ticked up.

(Embodiment 2) In FIG. 3, reference numeral 40 denotes an embossed tape, and a pocket 41 of the tape 40 houses a rather large electronic component P having a shape L such as a QFP. An opening 42 is formed at the bottom of the pocket 41. A pedestal 43 is protruded from the edge of the opening 42 , and the electronic component P is temporarily adhered to the pedestal 43 with an adhesive 44 . Therefore, since the electronic component P cannot be easily removed from the pocket 41, the child 40 does not have a cover tape.

In this case, when the pin 20 rises, the electronic component P is pushed up and separated from the pedestal 43, and the height of the top surface thereof is adjusted (see the chain line in the figure).

(Effects of the Invention) As explained above, the present invention provides a supply reel around which an electronic component encapsulating tape is wound, a pitch feeding means for pitch feeding the electronic component encapsulating tape, and an electronic component encapsulating tape fed out from the supply reel. A guide section that guides the tape toward the pitch feeding means, a tick-up between the top surface of the electronic component stored in the pocket of the electronic component encapsulating tape, and the lower end of the nozzle of the transfer head that picks up the electronic component. In order to maintain a predetermined interval, a push-up pin that pushes up the electronic component from below and a drive means for this pin are provided, so when the electronic component is ticked up by the nozzle, the electronic component inside the blur is pushed up by the push-up pin. By pushing up, the height of the top surface of the electronic component can be set to a desired height, an appropriate tick-up interval can be secured, and the electronic component can be reliably ticked up.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, in which FIG. 1 is a side view of an electronic component supply device, FIG. 2 is a side view during pick-up, and FIG. 3 is a side view of another embodiment. FIG. 4 is a side view of the conventional means. 1... Supply reel 2.40... Electronic component enclosing tape 3 ・ ・ ・ Guide section 4 . ... Push-up pin 22 ... Name of driving means agent Patent attorney Akira Okaji and two others No. 2 H, 7 ]? 4 Figure

Claims (1)

[Claims] A supply reel wound with an electronic component encapsulating tape, a pitch feeding means for pitch feeding the electronic component encapsulating tape, and a pitch feeding means for feeding the electronic component encapsulating tape fed from the supply reel toward the pitch feeding means. In order to maintain a predetermined take-up interval between the guide part that guides the electronic component, the upper surface of the electronic component stored in the pocket of the electronic component encapsulating tape, and the lower end of the nozzle of the transfer head that takes up the electronic component, An electronic component supply device characterized by being provided with a push-up pin that pushes up the electronic component from below, and a drive means for the pin.