JPS622785Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component automatic assembly device that takes out chip-shaped electronic components from a tape in which chip-shaped electronic components are enclosed at regular intervals and automatically mounts them at predetermined positions on a printed circuit board.

First, a schematic diagram of a typical automatic electronic component assembly device is shown in Fig. 1. In Fig. 1, 1 is a tape wound around a tape reel 2 and containing chip-like electronic components at equal intervals, 3 is a tape delivery unit which delivers the tape 1 at a specified pitch, a plurality of tapes and their corresponding tape delivery units are loaded on a movable table 4, and a desired tape is selected from the plurality of tapes by a control device such as a computer. Then, a chip-like electronic component is taken out of the selected tape by a vacuum chuck 5, and an electronic component positioning device 6 aligns the center position of the vacuum chuck 5 with the center of the electronic component and determines the mounting direction of the electronic component, and then,
Move horizontally by pulse motors 7 and 8
Electronic components are mounted at predetermined positions on a printed circuit board placed on an XY table 9 .

By the way, the structure of the tape 1 is as shown in FIG.
1 is provided, a chip-shaped electronic component 12 is inserted into this square hole 11, and a cover tape 13 is inserted.
and 14 enclose the electronic component 12. Also, tape 1 has a tape feed hole 15 for feeding the tape.
are set at a certain pitch. Therefore, conventionally, before the vacuum chuck 5 sends out the electronic component 12, the tape delivery unit 3 shown in FIG.
1 was fed a predetermined pitch and the cover tape 13 on the front side was peeled off.

However, when the cover tape 13 is peeled off, the negative pressure causes the electronic components 12 to fly out due to static electricity, or tilt as shown in Fig. However, the position of the electronic component is often not normal, and there is a problem in stably mounting the electronic component at a predetermined position on a printed circuit board in a predetermined direction.

In view of these points, the present invention provides a new electronic component automatic assembly device that eliminates the problem that occurs when peeling off a cover tape and enables stable removal of electronic components using a vacuum chuck.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 3 is a diagram showing the specific structure of the main part of the electronic component automatic assembly apparatus according to the present invention, that is, the tape feeding unit, and 16 is a tape feeding hole 15 of the tape 1 .
18 is a gear that meshes with the gear 16, 19 is a friction drum that rotates together with the gear 18, and 20 is attached to the friction drum 19 by a spring 21. 22 is a cover tape take-up reel which rotates together with the friction rotary disk 20 and winds up the cover tape 13; and 23 is a gear feed pawl 24 for feeding the gear 16 at a predetermined pitch. 25 is a positioning claw that fixes the rotational position of the gear 16 with a spring 26, 27 is a guide plate that helps the tape 1 run, 28 is a tape peeling plate that serves as a fulcrum when peeling off the cover tape, 29 is an electronic This is a protrusion prevention plate that prevents the component 12 from protruding.

Therefore, since the tape feed hole 15 is engaged with the pin 17 of the tape 1 encapsulating electronic components wound around the tape reel 2, when the feed lever 23 is pushed down, the gear 16 is moved by one pitch, for example. rotates to the right (in the direction of the arrow), and the tape 1 is also fed by one pitch. At the same time, gear 1
8 rotates to the left (in the direction of the arrow), and the friction drum 1
The cover tape take-up reel 22 is rotated clockwise due to the frictional force between the friction rotary plate 20 and the cover tape 13, and the cover tape 13 is peeled off using the tape peeling plate 28 as a fulcrum and taken up on the cover tape take-up reel 22. It will be done. At this time, as shown in the detailed views of FIG.
It is pressed against the surface of the base tape 10 of No. 1 ,
Moreover, since the protrusion prevention plate 29 is provided very close to the tape peeling plate 28, the electronic component 12 in the square hole 11 can be removed by the vacuum chuck 5 without tilting or popping out as shown in FIG. The electronic component is sent to the removal position, and is sucked up by the vacuum chuck 5 and taken out from the tape 1 , as shown in FIG. 4B.

Here, even if the thickness of the tape 1 varies, the spring 30 always connects the protrusion prevention plate 2 to the base tape 10.
The purpose is to bring 9 into contact with each other, and it is not necessarily necessary. Further, the distance T between the tape peeling plate 28 and the protrusion prevention plate 29 only needs to be such that the cover tape 13 can be wound up without any trouble. For example, if the thickness of the chip-shaped electronic component is 0.7 mm,
The interval T should be selected to be about 0.2 mm.

By the way, in FIGS. 4A and 4B, the tape peeling plate 28 is pressed against the cover tape 13 by a spring 31, but this is provided to make it easier to peel off the cover tape 13.

In this embodiment, the tape peeling plate 28
Although the protrusion prevention plate 29 and the protrusion prevention plate 29 are provided separately, they may be formed integrally, a slit-shaped opening is provided in the integrally formed plate, and the cover tape 13 may be pulled out from this opening.

As mentioned above, the electronic component automatic assembly device according to the present invention can reliably prevent electronic components from popping out or tilting when peeling off the cover tape on the front side of the tape containing chip-shaped electronic components. , it becomes possible to stably take out electronic components using a vacuum chuck.

[Brief explanation of the drawing]

Fig. 1 is a schematic diagram showing a general electronic component automatic assembly device;
Figure C is an explanatory diagram for explaining the drawbacks of the conventional method.
The figure is a specific configuration diagram showing the tape feeding unit of the electronic component automatic assembly apparatus according to the present invention, and FIGS. 4A and 4B are detailed views showing the main parts of the electronic component automatic assembly apparatus according to the present invention. Explanation of main drawing numbers: 1 ... Tape containing chip-shaped electronic components, 3... Tape delivery unit, 4...
...Moving table, 5...Vacuum chuck, 6...Electronic component positioning device, 9...XY table, 10...Base tape, 11...Square hole, 12...Chip-shaped electronic component, 13, 14...Cover tape, 16,1
8...Gear, 19...Friction drum, 20...Friction rotary disk, 22...Cover tape take-up reel, 23
...Feed lever, 27...Guide plate, 28...Tape peeling plate, 29...Protrusion prevention plate, 30, 31
...Spring.

Claims (1)

[Scope of utility model registration request] a tape feeding mechanism that feeds out a tape in which chip-shaped electronic components are enclosed at approximately equal intervals in predetermined pitches;
In an electronic component automatic assembly apparatus, which has a means for peeling off a surface side cover tape of the tape and a vacuum chuck for taking out an electronic component from the tape, and automatically mounts the electronic component at a predetermined position on a printed circuit board. . An electronic component automatic assembly apparatus, characterized in that an electronic component protrusion prevention means is provided between a position where the cover tape is peeled off and a position where the electronic component is taken out using the vacuum chuck.