JPS62252998A - Electronic parts feeder - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for supplying electronic components that are automatically mounted on a printed circuit board by taking out the electronic components from a storage tape. The present invention relates to an electronic component supply device.

[Conventional technology]

FIG. 7 is a perspective view showing a conventional electronic component supply device;
Reference numeral 1 indicates an electronic component, and 2 indicates a storage tape containing the electronic component. 3 is a cover tape for preventing the electronic component 1 from falling off or jumping out from the stored tape, and the reel 5 is placed in front of the window 4 from which the electronic component 1 is taken out.
It is wound up by. These storage tape 2 and cover tape 3 are wound around a reel 7 as taping 6. These tapings 6 and reel 7 will be collectively referred to as an electronic component assembly 8. Reference numeral 9 supports the electronic component assembly, and opens the electronic component 1 into a window 4 from which the electronic component 1 is taken out.
This is an electronic component supplying device that feeds and positions electronic components one by one into the electronic component supplying device, and the window 4 is provided in a guide cover 10 incorporated in the electronic component supplying device. A plurality of electronic component supply devices 9 are attached to a movable table 11 and positioned so that the window 4 is fixed vertically below the take-out nozzle 12.

FIG. 8 shows details of the vicinity of the window 4 from which the electronic component 1 is taken out, and shows the storage tape 2 being held down by the guide cover 10. The guide cover includes a slide cover 1 that can be moved to cover the window 4.
3 is provided.

Next, the operation will be explained. On the movable table 11,
A plurality of electronic component supply devices 9 are installed, and each of these electronic component supply devices 9 is provided with an electronic component assembly 8 in which various electronic components 1 are stored. A control device (not shown) moves the electronic component supply device 9 having a desired electronic component 1 in the direction of an arrow 14 by a drive device (not shown), and a window 4 is placed vertically below the take-out nozzle 12.
Position it so that it is reached. The take-out nozzle 12 is cylindrical and has a small hole extending vertically through the center, and a negative pressure suction force is generated by a vacuum generator (not shown). By lowering this take-out nozzle 12 in the direction of the arrow 15 and bringing it into contact with the electronic component 1, the electronic component 1 is vacuum suctioned by the negative pressure suction force. With the electronic component 1 held by this vacuum suction, the take-out nozzle 12 rises to its original position, and the electronic component 1 is supplied to the next process.

Thereafter, the roller 16 is rotated in the direction of an arrow 17 by a drive device (not shown), and the storage tape 2 is fed one pitch at a time, and the electronic components 1 are successively positioned below the window 4.

9 to 11 explain in detail a series of operations in the vicinity of the window 4 when taking out the electronic component t. As described above, the electronic component supply device 9 positioned vertically below the take-out nozzle 12 is in the state shown in FIG. The slide cover 13 is positioned so as to cover all the windows 4 of the guide cover 10, and the electronic components 1 stored in the storage tape 2 are
The cover tape 3 is removed and the window 4 does not jump out or fall off even though it is in an open state.

Next, as shown in FIG. 10, in response to a command from a control device (not shown), as the take-out nozzle 12 descends as shown by arrow 15, the slide cover 13 moves down as indicated by arrow 15.
You can move in the direction of 8. The slide cover 13 completes its movement prior to the descent of the take-out nozzle 12 so that the take-out nozzle 12 and the slide cover 13 do not come into contact with each other. Due to this movement of the slide cover 13, the upper part of the window 4 is opened, so that the take-out nozzle 12 can come into contact with the electronic component 1. When the take-out nozzle 12 comes into contact with the electronic component 1 inside the storage tape 2, the electronic component 1 is vacuum-adsorbed as described above.

Thereafter, as shown in FIG. 11, as the take-out nozzle moves up, the electronic component 1 is taken out from the storage tape 2 in the direction of the arrow 20 through the opened window 4, and is supplied to the next process. After this electronic component 1 is taken out, one-pitch feeding is performed so that the next electronic component 1 is supplied to the window 4 position. In this one-pitch feed, the roller 1 shown in FIG.
6 rotates in the direction of arrow 17, and storage tape 2 and slide cover 13 move synchronously in the direction of arrow 21.

As a result, the initial state shown in FIG. 9 is returned to, that is, the state in which the slide cover 13 covers all the windows 4 of the guide cover 10, and the desired electronic components 1 are sequentially supplied by the next command. Ru.

[Problem that the invention seeks to solve]

Since the conventional electronic component supply device is configured as described above, as explained in FIG. 10 above, the slide cover 1
3 moves eight times in the direction of the arrow 18, for example, as shown in FIG. 1 may rise. In addition, the first
As explained in Fig. 0, when the slide cover 13 moves to the slide cover, the window 4 is opened, and the take-out nozzle 12 descends in the direction of the arrow 15 and approaches the mold part 1, the small hole 1
9, since the atmosphere is sucked in with negative pressure, the above-mentioned A phenomenon in which the electronic component 1 is rolled up (sucked up) may occur due to the negative pressure. For this reason, the tip of the take-out nozzle 12 is not positioned approximately at the center of the electronic component 1, resulting in a problem that suction errors may occur, such as incomplete or no suction.

This invention was made to solve the above-mentioned problems, and when taking out electronic components, prevents the electronic components from rising and curling up, and ensures that the electronic components are correctly stored in the storage tape. It is an object of the present invention to provide an electronic component supply device that can reliably pick up and take out an electronic component by bringing the tip of a take-out nozzle into contact with the electronic component in this state.

[Means for solving problems]

In the electronic component supply device according to the present invention, the slide cover is provided with, for example, a U-shaped opening smaller than the width of the electronic component and larger than the outer diameter of the tip of the take-out nozzle, and the tip of the take-out nozzle is in contact with the electronic component; The slide cover is moved after vacuum suction of electronic components is completed under negative pressure.

(Function) The electronic component supply device of the present invention does not leave the electronic components open when taking out the electronic components, that is, the slide cover prevents the electronic components from moving or jumping out from the storage tape. By configuring the slide cover to move after vacuum suction and holding by the take-out nozzle, the posture of the electronic component is always controlled by either the storage tape, the slide cover, or the take-out nozzle. .

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings. 1st
In the figure, electronic components 1. Storage tape for storing the electronic components2. Guide cover 10. The cylindrical take-out nozzle 12 having a small hole 19 in the center is similar to the conventional example described above. Reference numeral 23 is a U-shaped opening;
It is provided on the slide cover 24 and located vertically below the take-out nozzle 12.

FIG. 2 shows a plan view of what is shown in FIG.

U-shaped opening 23 formed in the slide cover 24
The width dimension of the electronic component 1 is indicated by the symbol A, the outer diameter of the tip of the take-out nozzle 12 is indicated by the symbol 26, and the electronic component 1 is
The width dimension perpendicular to the longitudinal direction of the storage tape 2 is denoted by code 2.
If it is C as shown in 7. B<A<C holds true. Reference numeral 28 indicates the width of the groove of the storage tape 2 in which the electronic component 1 is stored.

The functions and roles of this electronic component supply device are the same as those of the conventional electronic component supply device, and detailed explanation thereof will be omitted.

Next, the operation of taking out the electronic component 1 of the electronic component supplying apparatus according to the embodiment of the present invention described above will be explained with reference to FIGS. 1 to 5. As shown in FIG. 1, the electronic component supply device is positioned at the electronic component take-out position, and the take-out nozzle 12 is moved downward in the direction of arrow 15 by a command from a control device (not shown) and a drive device (not shown). Start. At that time, the window 4 of the guide cover 10 is
From the meaning of the word, the upper part is covered with a slide cover 24 in order to prevent the electronic components 1 stored in the storage tape 2 from flying off or falling off. The slide cover is provided with the U-shaped opening 23 on the ejection path. The width A of the opening has a relationship with the outer diameter B of the take-out nozzle 12 such that A>B, and the take-out nozzle 12 can freely pass through the opening 23. Moreover, the width dimension C of the electronic component 1 has a converse relationship of Arc. Furthermore, the above-mentioned dimension A means that even if the electronic component 1 moves freely within the width dimension of the storage tape 2, it may not fly out, fall off, or be improperly stored, such as rotating 90 degrees in the direction of arrow 29. It is designed to prevent this from happening.

The take-out nozzle 12, which has started descending as described above, passes through the U-shaped opening 23 and comes into contact with the electronic component 1, as shown in FIG. 3, and the electronic component 1 is vacuum-adsorbed as described above. Ru. As a result, the electronic component 1 is moved to the slide cover 24.
Separately from this, it is supported by the take-out nozzle 12.

Next, while the take-out nozzle 12 remains in the lowered state, the slide cover 24 moves eight times in the direction of the arrow 30, and the upper part of the window 4 becomes open without interfering with the take-out nozzle 12. At this time, electronic parts + ceramics! -1-!
L knob) Because 1 no 1 door 10 is very good,
The posture will not change due to vibrations, static electricity, etc. caused by the movement of the slide cover 24.

Thereafter, as shown in FIG. 5, the take-out nozzle 12 ascends while sucking and holding the electronic component 1, and supplies the electronic component 1 to the next process.

As mentioned above, the storage tape 2 from which the electronic component 1 has been taken out
In order to supply the next electronic component 1 to its take-out position, that is, the window 4, a one-pitch feed is executed, whereby the storage tape 2 and the slide cover 13 are moved synchronously in the direction of the arrow 31. By moving the storage tape 2, the window 4
Since the slide cover 13 prevents the electronic component 1 from standing up due to static electricity, etc., the electronic component 1 correctly stored on the storage tape 2 can be sent out, as shown in FIG. Return to the initial state.

In this embodiment, as described above, it is possible to prevent the electronic component 1 from rising or curling up due to the vacuum pressure, and to ensure that the electronic component is attracted to the nozzle 12 and held therein.

In the above embodiment, the electronic component 1 is taken out on a horizontal plane, but for example, as shown in FIG. It is also possible to bring the electronic component 1 into close contact with each other, to attract and hold the electronic component 1, and to take out the electronic component 1 from the electronic component supply device.

Further, in the above embodiment, the slide cover 24 is provided with a U-shaped opening 23, but instead of the opening,
As shown in FIG. 14, a convex hole 32 may be provided.
As long as the above-mentioned relationship of BAA<COD does not collapse, the opening of the slide cover can have the same effect as the above embodiment no matter what shape it has. Furthermore, the slide cover may be moved in the direction of arrow 30 only when taking out the nozzle electronic component.

〔Effect of the invention〕

As described above, according to the present invention, an opening that is smaller than the width of the electronic component and wider than the outer diameter of the ejecting means, for example, the ejecting nozzle, is provided at the electronic component ejecting position of the electronic component supply device. Since a slideable cover is provided, when pitch-feeding electronic components, the electronic components can be taken out while being held securely by suction without causing parts such as windows to fly out of the ejection opening. Moreover, it is possible to supply electronic components in any position, such as by taking them out from the side or from below.

[Brief explanation of drawings]

1 to 5 show one embodiment of the present invention, in which FIG. 1 is a perspective view showing the main parts of an electronic component supply device, FIG. 2 is a plan view, and FIGS. 3 to 5 are perspective views showing different operating states, FIG. 6 is a perspective view showing another embodiment,
FIG. 7 is a perspective view showing a conventional electronic component supply device, FIG. 8 is an enlarged perspective view of the main part of the device shown in FIG. 7, and FIGS. 9 to 13 are the main parts of the device shown in FIG. 7. FIG. 14, which is an enlarged perspective view showing different operating states, is the sixth embodiment of the present invention.
FIG. 6 is a perspective view showing another embodiment different from the one shown in the figure. In the figure, numeral 1 is an electronic component, 2 is a storage tape, and 12
23 is a take-out nozzle, 23 is an opening, and 24 is a slide cover. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Patent Attorney Tadashi Sato Figure 7

Claims (1)

[Claims] In order to supply electronic components that are automatically mounted on a printed circuit board, an electronic component supply device takes out electronic components from a storage tape on which the electronic components are stored and supplies the electronic components. A slideable cover is provided at the part where the component is to be taken out, and the cover has an outer diameter of a portion of the means for taking out that is smaller than the width of the electronic part and that contacts the electronic part for the taking out. An electronic component supply device characterized by having a larger opening.