JPS6243359B2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention provides electrolytic capacitors, high voltage capacitors,
The present invention also relates to an electronic component automatic insertion device for inserting and mounting relatively large electronic components such as resistance coils onto a substrate such as a printed circuit board.

When inserting small electronic components such as ceramic capacitors into printed circuit boards, it is possible to quickly and automatically insert a large number of electronic components onto a long, thin tape-shaped mount parallel to each other at equal intervals. Although it is becoming possible to insert relatively large electronic components such as electrolytic capacitors, it is difficult to automate the insertion, and the insertion is done manually on printed circuit boards, making the work process extremely slow. It had the drawback of being unreliable. Furthermore, as the size of the electronic components increases, handling becomes difficult and the automatic mechanism becomes large.

The present invention eliminates the above-mentioned drawbacks of the conventional technology, and enables automatic insertion of relatively large electronic components at high speed.
Moreover, it is an object of the present invention to provide a high-speed, highly reliable, and high-performance automatic electronic component insertion device that allows reliable and reliable insertion work.

In order to achieve this objective, the inventors conducted repeated research on prototypes, and based on the following knowledge obtained during the research, the present invention was made.

That is, it is not easy to form a series of electronic components for relatively large electronic components, and the electronic components must be handled individually. In that case, for holding and feeding, it is best to stack the electronic components vertically in a row with their axes horizontal, so that they can be smoothly stacked one by one using gravity without the need for any other special feeding mechanism. A simple slit is used to keep the terminals in the same direction, and no special alignment mechanism is required.The simplest mechanism can reliably hold and hold the terminals without damaging them. It was confirmed that it was possible to supply and align the terminals.

However, as a result of various studies on means of turning horizontally oriented electronic components, which is most preferable in terms of holding and supplying using levers, to eventually face perpendicularly (usually vertically) to the printed circuit board, we have found that:
When an electronic component is received horizontally in a holder, then turned and delivered to a guide, using a vacuum suction method to hold it in the holder and in the guide simplifies the mechanism. It has been confirmed that this is the most preferable method for quick and reliable operation. The present invention was made based on the findings from such research.

The present invention is an automatic electronic component insertion device that inserts and mounts electronic components having terminal portions onto a board, in which a plurality of electronic components are stacked vertically in a line with each electronic component held horizontally. a chute having a vertical slit for inserting and protruding the terminal portion of each electronic component; and an intermittent feeding mechanism for feeding the electronic components one by one to the lower end of the chute. a mechanism, a holder that holds a horizontal electronic component supplied from the supply mechanism by vacuum suction, a turning mechanism that supports the holder and changes the direction of the electronic component from a horizontal direction to a vertical direction; A guide holder that transfers and holds the vertical electronic component by vacuum suction by the turning mechanism; and a guide holder that pushes out the vertical electronic component held by the guide holder toward the board, and This automatic electronic component insertion device is characterized in that it is equipped with an extrusion mechanism for inserting a component into a hole in a board.

The present invention will be explained with reference to the drawings based on examples.
FIG. 1 shows an electronic component 1, in which a is an example of a lead wire type electronic component in which parallel lead wires 3 are led out from the main body 2, and b and c are terminal type electronic components in which parallel terminals 4 are led out from the main body 2. An example of an electronic component is shown. In this specification, the lead wire 3, the terminal 4, etc. are collectively referred to as a terminal portion.

2 and 3 show an automatic insertion machine, in which an insertion device 6 is provided on a base frame 5. FIG.
7 is a magazine, which accommodates a large number of electronic components arranged horizontally and arranged vertically in a row.
It is detachably attached to the chute 8. The electronic components are sent to the insertion device 6 via the chute 8.
In the insertion device 6, the electronic components are taken out one by one after the lead wires 3 are cut and straightened by the forming mechanism (in the case of the terminals 4, only straightening is done), as will be described later.
The direction is changed vertically downward by a turning mechanism and inserted into the printed circuit board 9. Printed circuit board 9
is mounted on the XY table 10 on the base frame 5. The XY table 10 automatically moves in the X and Y directions according to the program, so that the hole to be inserted by the insertion device 6 is located directly below the insertion device 6. In the case of a lead wire type electronic component, there is a clinch mechanism in the XY table 10, which cuts the lead wire 3 protruding from the back side of the printed circuit board 9 to a predetermined length and bends the tip.

When there are a plurality of types of electronic components, the automatic insertion machines dedicated to each type can be arranged in series and the printed circuit boards 9 can be successively fed in to perform the insertion operation.

The insertion device will be explained with reference to FIGS. 4-15.

First, FIG. 4 is for explaining the outline of the insertion device 6, and is shown as a model for easy understanding. Reference numeral 11 denotes a frame, which is a basic frame that holds each part of the insertion device 6. Reference numeral 12 denotes a supply mechanism, in which a large number of electronic components 1 that have fallen down the chute 8 are
The electronic components 1 are stacked vertically with the central axes of the electronic components 1 horizontal, and the two lead wires 3 (the following explanation will be given mainly in the case of lead wire type electronic components) are at the top and bottom. The directions of rotation around the central axis are aligned. A forming mechanism 13 is provided at the bottom of the supply mechanism 12, and the forming mechanism cuts the lead wire 3.
The electronic components 1A that have been corrected, deformed, etc. are dropped one by one by an intermittent supply mechanism 14 at the lower end of the supply mechanism 12.

The electronic component 1B that fell was placed in the vacuum suction holder 1.
5, the center axis of the electronic component is turned from a horizontal direction to a direction perpendicular to the printed circuit board 9, and is transferred onto the insertion center axis 17;
Come to position C. A guide 18 is a guide holder that guides the insertion direction while holding the electronic component by vacuum suction, and is provided in a guide mechanism 20 that moves up and down (reciprocates in a direction perpendicular to the board) by an elevating mechanism 19. The component 1C is received from the holder 15 and held.

Next, the guide mechanism 20 is lowered by the lifting mechanism 19, and the electronic component is lowered to the position 1E where the tip of the lead wire 3 approaches the surface of the printed circuit board 9. The electronic component is further pushed down by the pushing mechanism 21 and inserted into the printed circuit board 9. It is done.

Forming mechanism 13, intermittent supply mechanism 14, turning mechanism 1
6. The movement of the elevating mechanism 19 and the pushing mechanism 21 is controlled by a main shaft 22 which reciprocates instead of a horizontal shaft via a cam. The mechanism around the main shaft 22 is called a drive mechanism 23 (shown abstractly as an ellipse in FIG. 4).

The height of the electronic component 1A that is temporarily stopped for molding in the molding mechanism 13 is defined as the molding level, and the intermittent supply mechanism 1
The holder 15 received the electronic component 1B that fell from the
The height of the holding tool 15 of the electronic component 1C turned onto the insertion central axis 17 by the turning mechanism 16 is the turning level 2.
It is called 6.

Hereinafter, the drive mechanism 23, the supply mechanism 12 (including the intermittent supply mechanism 14), the turning mechanism 16 (including the holder 15), the guide mechanism 20 (including the guide 18 and the lifting mechanism 19), and the extrusion mechanism 21 Explain in detail.

First, the drive mechanism 23, as shown in FIG.
A main shaft 22 is provided which horizontally penetrates the frame 11 and is rotatably supported by a bearing 27. A gear 28 is fixed to the shaft end of the main shaft 22. As shown in FIG. 11, the gear 28 is fixed to the lever 29 and meshes with a gear 31 rotatably supported around a shaft 30, and is connected to the frame 1 by a pin 32.
The main shaft 22 is designed to reciprocate within a range of approximately 120 degrees by the expansion and contraction of the cylinder 33 pivotally connected to the main shaft 22.

As shown in FIG. 14 and FIGS.
6. A lifting cam 37 and a turning/pushing cam 38 are attached.

The air operating cams 34, 35 actuate limit switches 39, 40 (FIGS. 5 and 7).
The limit switch 39 drives the tilting cylinder 149 to tilt the guide tool 18, and the timer operates the vacuum of the guide tool 18 and the vacuum of the push rod 137. The vacuum of the guide tool 18 and the push rod 137 is released at the lower limit of the guide mechanism 20 and the push rod 13, respectively.
Use the lower limit switch of 7. The limit switch 40 releases the vacuum in the holder 15.

The forming cam 36 causes the forming mechanism 13 to reciprocate horizontally, and drives a guide roller 42 through a cam groove 41 shifted in the axial direction. frame 11
A lever 46 is rotatably supported around a shaft 45 supported by brackets 43 and 44, and the lever 46 is provided with arms 47 and 48 facing in opposite directions, and a guide roller is attached to the tip of the arm 47. 42
is rotatably provided, and the forming mechanism 13 is connected to the tip of the arm 48 via a pin 101 as described later. Therefore, as the forming cam 36 reciprocates, the forming mechanism 13 reciprocates in the horizontal direction. Regarding the arms 47, 48, see also FIGS. 12-15.

The elevating cam 37 is for elevating the guide mechanism 20, and as shown in FIG.
to drive. The guide roller 49 has one end pivotally connected to a pin 50 of the frame 11, and the other end connected to the lifting mechanism 19.
It is rotatably attached to a lever 52 which is pivotally connected to a rod 51. Therefore, the lifting cam 37
As the rod 51 rotates back and forth, the rod 51 is raised and lowered, and a guide mechanism connected to the rod 51 by a pin 53 is raised and lowered. 54 is the guide roller 4
9 is a spring that presses the lifting cam 37.

As shown in FIG. 10, the turning/pushing cam 38 has a turning cam type 55 for driving the turning mechanism 16 that changes the direction of the holder 15 in the range α=120 degrees, and a turning cam type 55 in the range β=120 degrees for driving the turning mechanism 16 that changes the direction of the holder 15. It is an extrusion cam type 56 that operates the extrusion mechanism 21. Further, the intermittent supply mechanism 14 is operated by rotating the shaft 59. By reciprocating the turning/pushing cam 38, the turning cam mold 55 causes the lever 58 to swing around the center of the shaft 59 via the guide roller 57 (the shaft 59 is fixed to the lever 58, 11), and by operating the turning mechanism 16 via the pin 60 (the mechanism and operation will be described in detail later), the holder 15
1 from horizontal to vertical, and align the electronic component 1C with the insertion center axis 17.
Movement to position 5' and reciprocating movement to the original position 15 are performed. At the same time, the extrusion cam die 56 causes the lever 62 to swing around the pin 63 via the guide roller 61, and drives the guide roller 65 guided by the guide groove 64 to operate the extrusion mechanism 21 (its The structure and operation will be described in detail later), and the electronic component 1 is pushed out.
E (FIG. 4) is pushed into the printed circuit board and then returned to its original position. 66 and 67 are springs that press the guide rollers 57 and 61 against the turning/pushing cam 38.

On the other hand, a shaft 59 is fixed to the lever 58 and rotates.
As shown in FIGS. 5 and 9, a bevel gear 68 fixed to a pin 60 is rotated, and a lever 71 is swung through a bevel gear 69 that meshes with the bevel gear 68 and a shaft 70. The lever 71 is connected to the rod 72 as shown in FIG. 15, and the intermittent supply mechanism 14 is operated (the structure and operation will be described in detail later) to reach the molding level 2.
The electronic components 1A (FIG. 4) molded in step 4 are dropped one by one.

Next, the supply mechanism 12 will be explained.

As shown in FIGS. 5, 6, 9, and 15, a chute 73 that continues below the chute 8 is provided. The cross section of the chute 73 has an inner dimension slightly larger than the main body 2 of the electronic component 1, and the electronic component 1
They are designed so that they can be stacked vertically in a line, parallel to each other with their central axes horizontal. A slit 74 is vertically provided on the outer surface of the chute 73, through which the lead wire 3 is inserted and protrudes.
This slit 74 restricts the direction of rotation of the electronic component 1 with respect to the central axis, and the two lead wires 3
are aligned so that they overlap vertically.

An intermittent supply mechanism 14 is provided at the bottom of the chute 73. This is done by stopping the electronic component 1A (FIG. 4) at the temporary molding level 24 in order to mold the lead wire 3 by the molding mechanism 13, and moving the molded electronic components one by one to the holding level 25. It is for supplying.

As shown in FIGS. 9 and 14, the intermittent supply mechanism 14 includes a lever 76 rotatably supported on the wall of the chute 73 around a pin 75 provided at the level of the forming level 24. One end of the lever 76 is pivotally connected to the rod 72, and two stopper rods 77, 78 are provided at the other end so as to be in contact with the periphery of the electronic component 1A and separated by a predetermined central angle.

If only the action of the stopper rods 77 and 78 is described, the first
In Figure 6a, the electronic component 1A is attached to the stopper rod 78.
It is held on the molding level 24 by being supported by. Next, even when the lever 76 rotates and becomes horizontal as shown in FIG. 2B, the electronic component 1A is supported by the stopper rod 78. The lever 76 rotates further and the stopper rod 7
8 reaches the molding level 24 as shown in C of the same figure,
Electronic component 1A falls, but electronic component 1 directly above it
Since F is supported by the stopper rod 77, it does not fall.
Only one electronic component 1A is supplied downward. Next, the lever 76 rotates in the opposite direction, but the electronic component 1
F is supported by a stopper rod 77. Lever 7
When the electronic component 6 returns to the state shown in FIG. 1A again, the electronic component 1F comes off the stopper rod 77, but is supported by the stopper rod 78 located below it and stops at the position 1A in FIG. Repeat this operation to remove electronic component 1.
A, 1F, 1G, . . . are sequentially supplied downward one by one.

Next, the turning mechanism 16 will be explained.

As shown in FIGS. 9 and 15, the electronic components 1B that have been molded and dropped one by one by the intermittent supply mechanism 14 are placed on the holding level 25 at the holding tool 15.
It is becoming more accepted.

For details of the turning mechanism 16, see FIGS. 10 and 14.
This will be explained with reference to FIGS. 17 to 20.

A link 1 is attached to the upper part of the bracket 116 fixed to the inside of the frame 11 by a pin 117.
18 is pivotally mounted, and one end of a triangular frame 120 is rotatably supported by a shaft 119 at the bottom. The other end of the triangular frame 120 has a pin 60
It is pivotally connected to one end of a link 121 which is pivotally connected to the lever 58 by a pin 122.

A pin 124 is attached to the bracket 123 of the holder 15.
One end of the link 118 is pivotally connected via the link.
A portion of the holder 15 is extended to form a shaft 125, which is rotatably supported via a bearing 126 at the other end of the triangular frame 120, as shown in FIGS. 19 and 20. The center axis of the shaft 125 is connected to the holder 1
The center of the holder 127 of No. 5 is assumed to be 127.

The contact surface 128 of the holder 15 with the electronic components 1B, 1C forms a part of the cylindrical surface,
19, 2.
As shown in FIG. 0, a recess 129 is provided. A vacuum is introduced into the recess 129 through a communication hole 130 and a pipe 131, and the electronic components 1B and 1C are attracted and held at the contact surface 128.

With this configuration, as shown in FIG.
When the turning cam type 55 performs reciprocating rotation, the link 1
21, the triangular frame 120 swings, and by the action of the link 118, the holder 15 is
The direction is changed from the horizontal position as shown in Figure 17,
It is vertical as shown in Fig. 18, and the insertion center axis 17
The electronic components are transferred to match the position of 1C.
and by reversing the turning cam die 55,
Return to the original position and posture. At this time, the holder center 127 moves up and down between the holding level 25 and the turning level 26. 132 is a positioning stopper.

The electronic component is vacuum-suctioned to the holder 15 and transferred to the position 1C, and then the guide 18 vacuum-suctions and holds the electronic component 1C as described later.
The vacuum is released and the holding force disappears, after which the holder 15 begins its stroke to return to its original position.

By using a link mechanism as described above as the turning mechanism 16, the holding level 25 and the turning level 26 are
It is possible to reduce the height difference between the two and the height difference, and the height of the entire device can be lowered to make it more compact.

Next, the guide mechanism 20 will be explained.

As shown in FIGS. 5, 6, 8, 9, and 12, the elevating frame 133 of the guide mechanism 20
is guided by the slide bearing 134, and the pin 5 is lifted up and down by the lifting and lowering of the rod 51 as the lifting mechanism 19.
It is designed to go up and down through 3.

As shown in FIG. 9, the lifting frame 133 is provided with a guide rod 135 and a bearing 136 to guide the vertical movement of a push rod 137 of the pushing mechanism 21, which will be described later.

At the bottom of the elevating frame 133,
As shown, a bracket 138 is fixed, and a lever 140 is rotatably provided via a pin 139, as shown in FIGS. 12, 13, and 21. The lever 140 is shown in FIG.
As shown in FIG. 21, the guide tool 18 is fixed.

The guide tool 18 has a contact surface 141 with the electronic component 1C.
has a cylindrical surface and comes into wide contact with the electronic component 1C, and has a recess 142. Recess 1
A vacuum is introduced to the contact surface 142 through a communication hole 143 and a pipe 144, and the electronic component 1C is attracted and held on the contact surface 141. The tip of the guide 8 is a guide piece 146 having a guide groove 145 for guiding the lead wire 3.

On the other hand, the elevating frame 133 has
As shown in FIGS. 2 and 13, a bracket 148 is rotatably provided via a pin 147, and a tilting cylinder 149 of the guide tool 18 is attached to the bracket 148.
is installed. Working cylinder 149 is pin 1
It is pivotally connected to the lever 140 via the lever 50.

As the tilting cylinder 149 expands and contracts, the guide 18 is tilted as shown in FIG. 19, or vertically positioned to contact and attract the electronic component 1C as shown in FIG. 20.

Reference numeral 151 (FIG. 13) is an adjustment screw that contacts the lever 140 and adjusts the vertical position of the guide tool 18.

Next, the extrusion mechanism 21 will be explained.

The elevating frame 133 has figures 9, 10,
As shown in FIG. 12, a bracket 153 having a pin 152 is fixed. A bell crank 156 having arms 154 and 155 is attached to the pin 152.
is rotatably supported. A guide roller 56 that is guided by the guide groove 64 of the lever 62 is rotatably provided at the tip of the arm 154. The tip of arm 155 becomes a hawk end,
The pin 157 is engaged. The pin 157 is fixed to the side surface of the sleeve 158 as shown in FIGS. 13 and 14.

As shown in FIG. 9, the sleeve 158 is supported by the guide rod 135 via a bearing 159 so as to be vertically slidable, and holds the push rod 137. As shown in FIGS. 6, 8, 9, and 14, the push rod 137 has an elongated hole 160, and the slide piece 16 whose upper end engages with the upper end of the push rod 137.
1 is adjusted and fixed in the elongated hole 160 with a screw 162, so that the relative height with respect to the sleeve 158 can be adjusted.

By vertically swinging the arm 155 of the bell crank 156, the push rod 137, together with the sleeve 158, can slide vertically relative to the lifting frame 133.

A cap 163 is provided at the lower end of the push rod 137. The bottom surface of the cap 163 is the electronic component 1
It serves as a contact surface 164 that contacts the top surface of C,
A recess 165 is provided as shown in FIGS. 19 and 20. The recess 165 has communication holes 166,1
67, a hollow portion 168, and a pipe 169 to introduce a vacuum, and in addition to pressing down the electronic component 1C on the contact surface 164, it can also be held by vacuum suction.

Therefore, the pin 152 of the bell crank 156
moves up and down together with the lifting frame 133. However, if the guide groove 64 of the lever 62 (FIG. 10) is held vertically, the guide roller 65 also moves up and down vertically, so the push rod 137 moves up and down along with the lifting frame 133. It moves up and down together with the guide tool 18. When the guide groove 64 is inclined, the push rod 137 slides up and down relative to the lifting frame 133 and therefore relative to the guide 18.

Next, to explain the operation, a large number of electronic components 1 stored in the magazine 7 enter the chute 73 of the supply mechanism 12 of the insertion device 6 via the chute 8, and are deposited in a line in the vertical direction.

The electronic component 1A is stopped at the molding level 24 by the intermittent supply mechanism 14, and the lead wire 3 is cut to a predetermined length by the molding mechanism 13, and a bend 115 (FIGS. 24, 25, 26) is added as necessary. In addition, the distortion and the interval dimension of the lead wires 3 are corrected.

The electronic components that have been molded are transferred to the intermittent supply mechanism 14
The objects are dropped one by one by the holder 15 on one side and stopped at a holding level 25, where they are held by the holder 15 by vacuum suction.

Next, the holder 15 is turned and moved by the turning mechanism 16, and the electronic component 1C is held perpendicularly on the insertion central axis 17. Next, a guide tool 18 serves as a guide holder that guides and holds the electronic component in the insertion direction.
is vertically brought into contact with the electronic component 1C by the tilting cylinder 149, and is held by vacuum suction. After that, the vacuum suction of the holder 15 is released, and the electronic component 1
This means that C has been transferred to the guide tool 18 and handed over.

Next, tilt the lever 62 (FIG. 10) inward and lower the push rod 137 to remove the cap 163 from the electronic component 1.
After touching the top of C, the guide mechanism 20 is lowered together with the pushing mechanism 21 by the elevating mechanism 19 with the lever 62 vertical, and the electronic component 1C is lowered while being held by the guide tool 18 to the position 1E. The lowering of the guide mechanism 20 is stopped when the tip of the lead wire 3 approaches the printed circuit board 9,
The guide tool 18 is also stopped.

Next, the lever 62 (FIG. 10) is rotated to lower only the push rod 137, thereby removing the electronic component 1E.
is inserted into the printed circuit board 9 while being guided in the insertion direction by the contact surface 128 and the guide groove 145.

Thereafter, the cylinder 33 is retracted, the main shaft 22 is reversely rotated, each operation is reversed, and each mechanism is returned to its original state. Repeat the above actions,
The electronic components are inserted into the printed circuit board 9 one by one.

23 and 24 show a holder 15 and a guide 18 for the terminal type electronic component 1C, and the guide 18 has a guide piece 146 as shown in FIGS. 19 to 21.
There isn't.

As described above, either the lead wire type or terminal type electronic component insertion device 6 can be easily applied by simply replacing the minimum number of directly related parts when the size of the target electronic component is different. In addition, even if the type or shape of the lead wire type or terminal type is different (square cross section, etc.), for example, the bracket 179 can be provided in advance on the frame 11, or the dimensions of the molding mechanism 13 etc. can be made to be compatible with the frame 11. By making units compatible by unifying them, it is possible to easily convert them into other uses.

According to the present invention, an electronic component is held in a holder that performs a turning operation to turn the electronic component from a horizontal direction to a vertical direction, and the electronic component is transferred from the holder to the guide tool and held in the guide tool using a vacuum. By using the adsorption method, it has become possible to quickly and reliably convert from horizontal to vertical direction with a simple mechanism, which makes it possible to hold and feed electronic components, align the terminals, and prevent damage to the terminals. It is now possible to hold and feed in the most preferred horizontal direction.

Therefore, it is possible to use a horizontal arrangement method for holding and supplying without complicating the entire device, and the holding and supplying means can utilize the action of gravity, and have a simple structure. The feeding operation is quick and reliable, and the direction of the electronic components can be aligned using a single slit with a simple structure. Since this simple holding and supplying means aligns the direction of the electronic component and the direction of the terminal, there is no need for a mechanism to align the direction of the terminal on the holder or guide, and the device can be held and delivered using the simple method of vacuum suction. This makes it possible to simplify the structure of the holder and guide, making the operation quick and reliable, and since the terminals are not touched, deformation and damage to the terminals can be prevented.

In this way, the holding and supplying means, the holding tool, and the guide tool work together, and the structure of the entire device is simple and compact, and the insertion speed is high and the reliability is high. It is possible to provide an insertion device, which has extremely great practical effects.

[Brief explanation of the drawing]

The drawings relate to embodiments of the present invention, and FIG. 1a is a lead wire type electronic component, b and C are perspective views of a terminal type electronic component, and FIGS. 2 and 3 are a front view and a side view of an automatic insertion machine. , FIG. 4 is a schematic cross-sectional side view for explaining the insertion device, FIGS. 5 and 6 are plan views, and FIG. 7 is a side view, FIG. 8 is a cross-sectional side view taken along line C--C in FIG. 5, FIG. 9 is a cross-sectional side view taken along line D--D in FIG. 5, and FIG.
11 is a cross-sectional view taken along the line FF in FIG. 5, FIG. 12 is a cross-sectional rear view taken along the line G-G in FIG. 9, and FIG. 13 is a rear cross-sectional view taken along the line H-H in FIG. 9. Figure 14 is a cross-sectional rear view taken along line J--J in Figure 9, Figure 15 is a cross-sectional view taken along line K--K in Figure 9, and Figures 16 a, b, and c show the operation of the intermittent supply mechanism. Partial rear views, Figures 17 and 18 are rear views of a part of the turning mechanism, and side views (Fig. 10) showing the states before and after turning, respectively.
), Figure 19 is a cross-sectional rear view of the holder, guide, and push rod in the state shown in Figure 17 (see Figure 14), Figure 20 is a cross-sectional rear view taken along the line Q-Q in Figure 18, Figure 21 is a cross-sectional plan view taken along line RR in Figure 20;
Fig. 22 is a side view of the embodiment in the case of a terminal type electronic component, Fig. 23 is a cross-sectional rear view taken along the line V-V, and Fig. 24
This figure is a cross-sectional plan view taken along the line WW in FIG. 23. 1, 1A, 1B, 1C, 1E, 1F, 1G...Electronic component, 2...Main body, 3...Lead wire, 4...Terminal, 5
...Base frame, 6...Insertion device, 7...Magazine, 8...Chute, 9...Printed circuit board, 10...
XY table, 11... Frame, 12... Supply mechanism, 13... Forming mechanism, 14... Intermittent supply mechanism, 1
5, 15'... Holder, 16... Turning mechanism, 17... Insertion center shaft, 18... Guide tool, 19... Lifting mechanism, 20
...Guiding mechanism, 21... Pushing mechanism, 22... Main shaft,
23... Drive mechanism, 24... Molding level, 25... Holding level, 26... Turning level, 27... Bearing, 28...
Gear, 29...Lever, 30...Shaft, 31...Gear, 3
2... Pin, 33... Cylinder, 34... Air operation cam, 35... Air operation cam, 36... Molded cam, 37
... Lifting cam, 38... Turning/pushing cam, 39,
40...Limit switch, 41...Cam groove, 42...
Guide rollers, 43, 44...Brackets, 45...
Shaft, 46...Lever, 47, 48...Arm, 49...
Guide roller, 50...pin, 51...rod, 52
...Lever, 53...Pin, 54...Spring, 55...Turning cam type, 56...Extrusion cam type, 57...Guide roller, 58...Lever, 59...Shaft, 60...Pin, 6
1...Guide roller, 62...Lever, 63...Pin,
64...Guide groove, 65...Guide roller, 66,6
7... Spring, 68, 69... Bevel gear, 70... Shaft,
71... Lever, 72... Rod, 73... Shoot,
74...Slit, 75...Pin, 76...Lever, 7
7, 78...stopper rod, 116...bracket, 1
17...pin, 118...link, 119...shaft, 12
0... Triangular frame, 121... Link, 122... Pin, 123... Bracket, 124... Pin, 125
...Shaft, 126...Bearing, 127...Holder center, 12
8... Contact surface, 129... Recess, 130... Communication hole, 1
31... Pipe, 132... Stopper, 133... Lifting frame, 134... Slide bearing, 135
...Guide rod, 136...Bearing, 137...Push rod, 1
38... Bracket, 139... Pin, 140... Lever, 141... Contact surface, 142... Recess, 143... Communication hole, 144... Pipe, 145... Guide groove, 146
...Guide piece, 147...Pin, 148...Bracket,
149...Tilt cylinder, 150...Pin, 151...
Adjustment screw, 152...pin, 153...bracket,
154, 155... Arm, 156... Bell crank, 157... Pin, 158... Sleeve, 159...
Bearing, 160...Elongated hole, 161...Slide piece, 16
2...screw, 163...cap, 164...contact surface,
165... recess, 166, 167... communicating hole, 168
...Hollow part, 169...pipe.

Claims (1)

[Scope of Claims] 1. In an electronic component automatic insertion device that inserts and mounts electronic components having terminal portions onto a board, a plurality of electronic components are vertically aligned in a row with each electronic component being held horizontally. A chute is provided with a vertical slit for inserting and protruding the terminal portion of each electronic component, and an intermittent supply mechanism for feeding electronic components one by one to the lower end of the chute. a holder that holds the horizontal electronic component supplied from the supply mechanism by vacuum suction; and a turning mechanism that supports the holder and changes the direction of the electronic component from the horizontal direction to the vertical direction. a guide holder that transfers and suction-holds the vertical electronic component by vacuum suction; a guide holder that pushes the vertical electronic component held by the guide holder toward the substrate; An electronic component automatic insertion device comprising: a push-out mechanism for inserting the terminal portion into a hole in a board.