JP3733488B2 - Method and apparatus for manufacturing horizontal chip electronic component - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a method and apparatus for manufacturing a horizontal chip electronic component, and in particular, an electronic component is inserted into a hole of a resin case having a flat surface on at least one surface, and the lead wire of the electronic component is brought into close contact with the resin case. The present invention relates to an apparatus for manufacturing a horizontal chip electronic component that can be bent in parallel with a plane and mounted on a surface mount substrate, and a manufacturing method that can efficiently manufacture the horizontal chip electronic component.
[0002]
[Prior art]
In recent years, demands for downsizing and weight reduction of electronic devices are very strong, and attempts have been made to deal with these demands by downsizing electronic components mounted on a substrate.
[0003]
However, in an electronic component with a lead wire, the lead wire is inserted into a hole provided in the substrate, soldered and mounted, and mounted on a so-called through-hole substrate, so it can be mounted only on one side of the substrate. However, it was difficult to increase the mounting density.
[0004]
In order to eliminate the above-mentioned drawbacks, a so-called double-sided mounting board has been proposed and widely used in which electronic components are mounted on both sides of the board so as to dramatically improve the mounting density.
[0005]
Electronic components used for double-sided mounting boards require specially shaped electronic components that can be soldered without passing lead wires through the through holes, and various chip-type electronic components are in practical use. Recently, electronic components with a lead wire with a narrower pitch have been proposed since the interval between the lead wires of the electronic component is about 0.5 mm. However, conventional electronic components with lead wires are used for surface mounting boards. It could not be mounted, and a special electronic component having a special shape for surface mounting had to be manufactured and used on the surface mounting board.
[0006]
Also, the dedicated electronic parts for surface mount boards are specially shaped and require expensive manufacturing equipment for manufacturing, and are expensive because they are manufactured through many manufacturing processes. There was room for.
[0007]
On the other hand, as an electronic component with a lead wire that has been put into practical use in the past, a round capacitor is vertically arranged and a resin seat plate is provided on the lead wire portion, and the seat plate There is a so-called vertical chip electronic component that is bent through a short cut lead wire to become a soldering terminal. According to this, even in the case of a capacitor, the length is longer than the diameter. Since the size is large, there is a drawback that the height is inevitably high, and it is still insufficient to meet the demand for reducing the thickness of the substrate with electronic components mounted as much as possible.
[0008]
[Problems to be solved by the invention]
The present invention has been made to eliminate the above-mentioned drawbacks of the prior art, and its object is to insert an electronic component with a lead wire into a hole formed in a resin case and solder the lead wire. By making the lead terminal for soldering by bending it parallel to the plane to be placed on the board at the time, it is possible to mass-produce horizontal chip electronic components at low cost using electronic components with lead wires In addition, this makes it possible to provide low-cost lateral electronic components that can be mounted on a surface-mount substrate.
[0009]
Another object of the present invention is to make it possible to place a conventional electronic component with a lead wire in a resin case and place it on a substrate in a state where it is laid sideways. It is to be able to sufficiently meet the desire to reduce the thickness of the substrate with the electronic component mounted thereon as much as possible, while keeping the height from the substrate lower than that of the chip electronic component.
[0010]
  Yet another object is to insert an electronic component with a lead wire into the resin case while intermittently rotating the cylindrical resin case held by the resin case holding device, and then press the electronic component to store it in a predetermined position. Further, after the lead wire of the electronic component is cut to a required length, the bending member in which the lead wire separating portion, the first bent portion, and the second bent portion are formed is used.Through the first 90 ° folding process by the first folding part and the second 90 ° folding process by the second folding part.The work to bend the lead wire parallel to the plane to be placed on the board can be performed continuously by an automatic machine, and this makes it possible to reduce the cost of horizontal chip electronic components that can be mounted on a surface mount board. Is to enable mass production.
[0011]
[Means for Solving the Problems]
[0012]
  In short, according to the present invention (Claim 1), at least one surface is provided with a flat surface to be placed on a substrate during soldering and is formed into a cylindrical shape., A protrusion provided with a guide surface on one side is formed, and lead wire storage portions are respectively formed on two opposing ridge lines.A plurality of resin case holding devices mounted on a turntable that rotates intermittently so as to hold the resin case, a resin case supply device that supplies the resin case to the resin case holding device, and the resin case holding device. To the held resin caseMultiple lead wires protrude from one sideSupply electronic components with lead wiresThe lead wire comes out to the guide surface, protrusion, and lead wire storage part sideAn electronic component supply device to be inserted, a pressing device that presses the electronic component inserted into the resin case and stores the electronic component in a predetermined position, and a lead wire of the electronic component inserted into the resin case has a required length. A lead wire cutting device that cuts intoThe pluralityLead wireMutualThe lead wire separating portion, the first bent portion, and the second bent portion have a bending member in which a lead wire separating portion to be separated and a first bent portion and a second bent portion for bending the lead wire are formed. By moving the bending member so that the bent portion sequentially contacts the lead wire and swinging it up and down appropriately.First, the first bent portion is brought into contact with the lead wire and bent by 90 °, and then the second bent portion is brought into contact with the lead wire bent by 90 ° and further bent by 90 °. Store in the storageAnd a lead wire bending device configured to bend the lead wire in parallel with the plane.
[0013]
【Example】
Hereinafter, the present invention will be described based on embodiments shown in the drawings. 2 and 3, a horizontal chip electronic component manufacturing apparatus 1 according to the present invention includes a resin case holding device 2, a resin case supply device 3, an electronic component supply device 4, a pressing device 5, and a lead wire cutting. A device 6 and a lead wire bending device 8 are provided.
[0014]
In FIG. 4, the resin case holding device 2 is for holding the resin case 9 and transporting it to each station, and is composed of a fixed holding member 10 and a movable holding member 11.
[0015]
The fixed gripping member 10 has a V-shaped gripping portion 10 a formed at the tip, and is fixed to the main body 12 with a screw 13.
[0016]
The movable gripping member 11 has a V-shaped gripping portion 11a formed at the tip thereof so as to face the V-shaped gripping portion 10a of the fixed gripping member 10, and slides in a guide groove 12a provided in the main body 12 in the directions of arrows A and B. It is movably fitted and pressed by a spring 14 disposed at the rear and is always urged in the direction of arrow A.
[0017]
While moving in the direction of arrow A and pressing the rectangular resin case 9 with the V-shaped gripping portion 10a of the fixed gripping member 10 and the V-shaped gripping portion 11a of the movable gripping member 11, the resin case 9 is centered. It comes to hold.
[0018]
In the illustrated embodiment, as shown in FIG. 1, 16 resin case holding devices 2 having the above-described configuration are mounted at equal intervals on a turntable 15 that rotates intermittently by 22.5 °, and the resin case holding device The apparatus 2 is configured to hold the resin case 9 and sequentially convey it to a predetermined station.
[0019]
  The resin case 9Multiple lead wires 16a are coming out from one sideThe resin case is for housing an electrolytic capacitor 16 which is an example of an electronic component with a lead wire.
[0020]
1 and 6, the resin case 9 is formed with a storage chamber 9a which is a hole penetrating in the vertical direction. For example, the width is 3.6 mm to 4.6 mm, the height is 3.5 mm to 4.5 mm, and the length is 6 mm. It is formed as a rectangular parallelepiped of about 3 mm to 13.3 mm, and has a cylindrical shape with a hole of about 3 mm to 4 mm in diameter at the center, for example. The electrolytic capacitor 16 is inserted in the storage chamber 9a in the direction of arrow M. It comes to store.
[0021]
A protrusion 9c provided with a guide surface 9b is formed in the lower portion of the storage chamber 9a, and lead wire storage portions 9d are formed on two opposing ridge lines of the resin case 9.
[0022]
A surface 9e between the two lead wire storage portions 9d is a flat surface so that the resin case 9 can be stably placed on a substrate (not shown).
[0023]
Then, the electrolytic capacitor 16 is inserted into the storage chamber 9a, the lead wire 16a protruding from the lower part is bent at a right angle along the guide surface 9b, and is further mounted on a substrate (not shown) during soldering. The lead wire 16a is accommodated in the lead wire accommodating portion 9d by being bent in parallel with 9e to form a lead terminal 16c for soldering.
[0024]
2 and 5, the resin case supply device 3 is for supplying the resin case 9 to the resin case holding device 2, and includes a resin case alignment device 18, a first delivery device 19, and a rotary conveyance device. 20 and a second delivery device 21.
[0025]
The resin case aligning device 18 is for aligning the directions of the resin cases 9 and supplying them in the direction of arrow B. The resin case aligning device 18 aligns the resin cases 9 by a known vibration type component supply device (not shown). The guide groove 18a is conveyed in the direction of arrow B.
[0026]
The first delivery device 19 is for delivering the resin case 9 from the resin case alignment device 18 to the rotary conveyance device 20, and protrudes into the piston rod 24 of the fluid pressure cylinder 23 fixed to the base 22 and has an arm 25. Is installed.
[0027]
Then, a compressed fluid is supplied to the fluid pressure cylinder 23 to extend the piston rod 24, and the protruding arm 25 is moved in the direction of arrow C so that the resin cases 9 are transferred from the guide groove 18a to the rotary conveying device 20 one by one. It is configured.
[0028]
The rotary conveyance device 20 is for conveying the resin case 9 to a supply position below the resin case holding device 2, and is provided with a plurality of resin case holding chambers 20 a. The resin case 9 delivered to the case holding chamber 20a is rotated by 90 ° in the direction of arrow D and conveyed below the resin case holding device 2 located at the first station of the turntable 15.
[0029]
The second delivery device 21 is for supplying the resin case 9 to the resin case holding device 2, and in FIG. 5, the rod 26 is guided by the guide tube 28 and is slidable in the vertical direction. ing.
[0030]
A crank arm 30 that swings in the direction of arrow E or F about the shaft 29 is connected to the lower end of the rod 26, and an arm 31 is fixed to the upper end.
[0031]
A protruding pin 33 having a diameter of 3.4 mm, which is urged upward by a spring 32, is slidably fitted to the arm 31, and the crank arm 30 is swung in the direction of arrow E or F to move the protruding pin 33 to 20 mm. The resin case 9 held in the resin case holding chamber 20a is moved in the direction of the arrow G and protrudes in the direction of the arrow G. The V-shaped holding portion 10a of the fixed holding member 10 of the resin case holding device 2 and the movable holding member It is comprised so that it may press and hold with 11 V-shaped holding parts 11a.
[0032]
The electronic component supply device 4 is for supplying the electrolytic capacitor 16 to the resin case 9, and in FIG. 2 and FIG. 3, the electrolytic capacitor 16 supplied from the supply device (not shown) in the direction of arrow I. The lead wire 16a is held by the gripping arm 4a of the third delivery device 34, and is conveyed by being intermittently rotated by 90 ° in the direction of arrow J in the vertical plane.
[0033]
On the other hand, the electronic component supply device 4 is mounted with four transfer arms 4a each provided with a holding mechanism for holding the main body 16b of the electrolytic capacitor 16, is rotated in the arrow K direction, and is movable up and down in the arrow L or M direction. It is configured.
[0034]
The main body 16b of the electrolytic capacitor 16 held by the third delivery device 34 and transported to the uppermost transport position is lowered in the arrow M direction and held by the transport arm 4a, and then lifted in the arrow L direction. Then, it is rotated 270 ° in the direction of the arrow K and transported to the upper part of the fifth station of the turntable 15. At this position, it is lowered again in the direction of the arrow M, held by the resin case holding device 2 and waiting at this position. As shown in FIG. 8, it is configured to be inserted into the storage chamber 9a of the resin case 9 through a lead wire 16a.
[0035]
Note that the lead wire 16a of the electrolytic capacitor 16 is formed in a U shape in advance, so that the tip of the lead wire 16a does not interfere with the resin case 9 when inserted into the storage chamber 9a.
[0036]
The pressing device 5 is for pressing the electrolytic capacitor 16 and storing it in a predetermined position of the resin case 9, and is disposed at the sixth station of the turntable 15.
[0037]
9 and 10, a resin case support 35 is guided by a guide bush 36 and fixed to the upper end of a rod 38 slidable in the direction of arrow N or O, and a spring receiver 39 and a base fixed to the rod 38. A spring 41 is mounted between the spring hook 40 fixed to the base 22 and always urges the rod 38 in the direction of arrow O.
[0038]
The lower end of the rod 38 is connected to a cam device (not shown). The cam device is operated to raise the resin case support 35 in the direction of arrow N by 10 mm so as to support the resin case 9 from below. It is configured.
[0039]
The electronic component pressing pin 42 is slidably disposed in the arrow P or Q direction on the movable base 43 in which the two guide shafts 43a are slidably fitted to the guide arm 45, and is always in the arrow P direction by the spring 44. Is being energized.
[0040]
The movable base 43 is connected to a cam device (not shown) similar to the resin case support base 35 by a connecting rod 46. The cam device is actuated to lower the movable base 43 in the direction of arrow P by 14 mm. The capacitor 16 is configured to be pressed and stored to a predetermined position of the resin case 9.
[0041]
The lead wire cutting device 6 is for cutting the lead wire 16a of the electrolytic capacitor 16 to a required length, and is disposed at the seventh station of the turntable 15. In FIG. It is fixed to the blade fixing base 49.
[0042]
The movable blade 50 is fixed to a movable base 52 slidably fitted in a sliding groove 51 a provided in a cutting device main body 51 fixed to the base 22, and a shaft 53 is attached to the movable base 52. One end of a crank arm 54 that swings in the direction of the arrow T or U as a center is connected.
[0043]
The other end of the crank arm 54 is connected to a cam device (not shown) in the same manner as the resin case support 35 by a connecting rod 55, and the connecting rod 55 is moved in the direction of arrow R by operating the cam device. Then, the crank arm 54 is swung in the direction of arrow T, the movable base 52 is slid 6 mm in the direction of arrow V together with the movable blade 50, and the lead wire 16a is sheared between the fixed blade 48 and the movable blade 50 to the required length. It is configured to cut.
[0044]
The cut lead wire 16a falls in the direction of the arrow W, is sucked and processed by a suction device (not shown), and the cut lead wire 16a is operated by the mechanism of the horizontal chip electronic component manufacturing apparatus 1. It does not become an obstacle.
[0045]
  The lead wire bending device 8pluralLead wire 16aMutualIt has a bending member 56 formed with a lead wire separating portion 56a to be separated and a first bent portion 56b and a second bent portion 56c for bending the lead wire 16a, and the lead wire separating portion 56a and the first bent portion are formed. By moving the bending member 56 so that the portion 56b and the second bent portion 56c sequentially contact the lead wire 16a and swinging up and down appropriately,After the first 90 ° bending by the first bending portion 56b and the second 90 ° bending process by the second bending portion 56c.The lead wire 16a of the electrolytic capacitor 16 is bent in parallel with the plane 9e to be placed on the substrate during soldering and stored in the lead wire storage portion 9d. It is arranged.
[0046]
12 to 15, the bending member is attached to the movable base 60 slidably fitted in the sliding groove 59 a provided in the lead wire bending apparatus main body 59 fixed to the base 22 in the direction of the arrow X or Y. 56 is rotatably mounted by a pin 58.
[0047]
Stoppers 61 and 62 are provided below and above the bending member 56 of the movable base 60 so as to limit the vertical movement of the bending member 56.
[0048]
One end of a crank arm 64 that swings in the direction of arrow a or b about a shaft 63 is connected to the movable base 60, and the other end is connected to a cam device (not shown) by a connecting rod 65. By actuating the cam device, the connecting rod 65 is moved in the direction of arrow c to swing the crank arm 64 in the direction of arrow a, and the movable base 60 is moved in the direction of arrow X by 12 mm.
[0049]
The bending member 56 has a substantially V-shaped lead wire separating portion 56a on the front surface, a first bent portion 56b that is a horizontal plane continuous to the lead wire separating portion 56a, and an inverted L-shaped portion continuing to the first bending portion 56b. The second bent portion 56c is provided with a projection 56d, and the lower portion of the tip 56e is formed in a semicircular shape.
[0050]
A U-shaped groove 59b is formed in front of the lead wire bending apparatus main body 59, and a groove plate 66 is fixed by a screw 68 so as to cover the U-shaped groove 59b, and a guide groove 69 having a rectangular cross section. Is configured.
[0051]
A driving plate 70 having a U-shaped engaging portion 70a formed at the upper end is fitted into the guide groove 69 so as to be slidable in the direction of arrow e or f. The lower end of the driving plate 70 is connected to the cam device by a connecting rod 71. (Not shown), and is configured to operate the cam device to move the connecting rod 71 in the direction of arrow h by 5 mm to raise the drive plate 70 in the direction of arrow e.
[0052]
The engaging portion 70a is disposed at a position facing the front of the bending member 56, and when the bending member 56 is moved in the arrow X direction by the connecting rod 65, the tip end portion 56e is a position indicated by a solid line in FIG. To the position indicated by the phantom line, enters and engages in the engaging portion 70a, and moves the drive plate 70 in the direction of arrow e to rotate the bending member 56 about the pin 58 in the direction of arrow g. It is supposed to be moved.
[0053]
Then, by actuating the cam device, the connecting rod 65 is moved in the direction of the arrow c, the crank arm 64 is swung in the direction of the arrow a, and the bending member 56 is moved together with the movable base 60 in the direction of the arrow X. After the lead wire 16a of the capacitor 16 is reliably separated by the lead wire separating portion 56a, the first bent portion 56b is brought into contact with the lead wire 16a and moved from the position indicated by the solid line in FIG. (Arrow arrow j direction) It is comprised so that it may be bent.
[0054]
Next, by moving the connecting rod 71 in the direction of arrow h, the drive plate 70 is raised in the direction of arrow e, and the bending member 56 in which the distal end portion 56e engages with the engaging portion 70a is moved in the direction of arrow g around the pin 58. The second bent portion 56c is rotated and brought into contact with the lead wire 16a bent 90 °, and is bent further 90 ° parallel to the plane 9e to be placed on the substrate during soldering. It is configured to be accommodated in the accommodating portion 9d and to be a lead terminal 16c for soldering.
[0056]
The present invention is configured as described above, and the operation thereof will be described below. 1 to 5, the resin case 9 is aligned by a vibrating component supply device (not shown) and is conveyed in the direction of arrow B through the guide groove 18a.
[0057]
Compressed fluid is supplied to the fluid pressure cylinder 23, the piston rod 24 extends, the protruding arm 25 moves in the direction of arrow C, pushes the resin case 9 out of the guide groove 18a, and enters the resin case holding chamber 20a of the rotary conveyance device 20. Deliver.
[0058]
When the rotary conveyance device 20 rotates 90 ° in the direction of arrow D and conveys the resin case 9 to the lower side of the resin case holding device 2, a cam device (not shown) is activated to swing the crank arm 30 in the direction of arrow E. The protrusion pin 33 is moved upward by 20 mm in the arrow G direction.
[0059]
Then, the resin case 9 held in the resin case holding chamber 20a of the rotary conveyance device 20 is pushed out in the direction of arrow G, and is movable with the V-shaped holding portion 10a of the fixed holding member 10 of the resin case holding device 2 located at the first station. Supplyed between the V-shaped gripping portion 11a of the gripping member 11, the V-shaped gripping portion 10a and the V-shaped gripping portion 11a hold the resin case 9 while positioning it.
[0060]
The supply operation of the resin case 9 to the resin case holding device 2 is performed every time the turntable 15 rotates intermittently by 22.5 °, and the resin case 9 is sequentially supplied to the resin case holding device 2.
[0061]
When the resin case holding device 2 to which the turntable 15 is rotated 90 ° and the resin case 9 is supplied reaches the fifth station, in FIGS. 6 to 8, the third delivery device 34 is moved from the supply device (not shown). The lead wire 16a of the electrolytic capacitor 16 supplied in the direction of the arrow I is pinched and turned 90 ° in the vertical plane in the direction of the arrow J, and the electrolytic capacitor 16 is transported to the uppermost position and stands by.
[0062]
The electronic component supply device 4 descends in the direction of arrow M, and is sandwiched and delivered by the clamping mechanism of the transport arm 4a to hold the body 16b of the electrolytic capacitor 16 held by the third delivery device 34, and then rises in the direction of arrow L Then, it is rotated 270 ° in the direction of arrow K, and is conveyed above the resin case holding device 2 stopped at the fifth station of the turntable 15.
[0063]
And the electronic component supply apparatus 4 descend | falls again in the arrow M direction, and inserts the electrolytic capacitor 16 into the storage chamber 9a of the resin case 9 currently hold | maintained at the resin case holding | maintenance apparatus 2 from the lead wire 16a (FIG. 8).
[0064]
Since the lead wire 16a of the electrolytic capacitor 16 is previously formed in a dogleg shape as shown in FIG. 6, the lead wire 16a can be smoothly inserted into the storage chamber 9a without interference. Further, the lead wire 16a is formed by previously crushing two portions to be bent, which will be described later, so that it can be easily bent.
[0065]
The resin case 9 supplied with the electrolytic capacitor 16 and held by the resin case holding device 2 is rotated by a cam device (not shown) in FIGS. 9 and 10 when the turntable 15 is rotated and conveyed to the sixth station. The rod 38 is actuated to move in the direction of arrow N, the resin case support 35 is raised 10 mm, and the resin case 9 is supported from below.
[0066]
Next, another cam device (not shown) is operated to move the connecting rod 46 in the direction of arrow P, and the electronic component pressing pin 42 is pushed down 14 mm in the direction of arrow P together with the movable base 43, and the electronic component pressing pin 42 performs electrolysis. The capacitor 16 is pressed and stored in a predetermined position of the resin case 9.
[0067]
When the turntable 15 further rotates and the resin case holding device 2 is transported to the seventh station, a cam device (not shown) is actuated in FIG. 11 to move the connecting rod 55 in the direction of arrow R, and the crank arm 54 is swung in the direction of arrow T, the movable base 52 is slid 6 mm in the direction of arrow V together with the movable blade 50, and the lead wire 16 a is cut to a required length by shearing with the fixed blade 48 and the movable blade 50.
[0068]
The cut lead wire 16a falls in the direction of the arrow W, but is sucked and processed by a suction device (not shown). Therefore, the cut lead wire 16a is scattered to produce the horizontal chip electronic component manufacturing apparatus 1. Does not inhibit the operation of
[0069]
When the turntable 15 further rotates and the resin case holding device 2 is conveyed to the ninth station, the cam device (not shown) is activated in FIGS. 12 to 15 to move the connecting rod 65 in the direction of arrow c. Then, by swinging the crank arm 64 in the direction of arrow a and moving the bending member 56 in the direction of arrow X together with the movable base 60, first, the lead wire 16a of the electrolytic capacitor 16 is surely separated by the lead wire separating portion 56a. After that, the first bent portion 56b is brought into contact with the lead wire 16a and bent from the position indicated by the solid line in FIG. 14 to the position indicated by the phantom line (in the direction of the arrow j).
[0070]
Next, another cam device (not shown) is actuated to move the connecting rod 71 in the direction of arrow h, raise the drive plate 70 in the direction of arrow e, and bend the tip portion 56e into engagement with the engaging portion 70a. The member 56 is rotated about the pin 58 in the direction of the arrow g, and the second bent portion 56c is brought into contact with the lead wire 16a bent 90 ° to be placed on the substrate 9e when soldering. The horizontal chip electronic component 72 is completed as a lead terminal 16c for soldering by bending the lead wire into the lead wire housing portion 9d.
[0071]
When the turntable 15 further rotates and reaches the 13th station, the completed horizontal chip electronic component 72 is discharged in the direction of the arrow Z, and the resin case holding device 2 that has become empty is returned to the first station again. Ready for the next production.
[0072]
Thereafter, the above-described operation is continuously repeated, and the horizontal chip electronic components 72 are successively produced in a very short time.
[0073]
In the above embodiment, the electronic component with lead wire is described as an electrolytic capacitor. However, the electronic component with lead wire is not limited to an electrolytic capacitor, and any electronic component provided with a lead wire may be used. Such an electronic component may be used.
[0074]
【The invention's effect】
In the present invention, an electronic component with a lead wire is inserted into the hole formed in the resin case as described above, and the lead wire is bent in parallel with a plane to be placed on the substrate when soldering. Since the lead terminal is used, there is an effect that mass production of the horizontal chip electronic component can be performed at low cost by using the electronic component with lead wire, and as a result, the horizontal electronic component that can be mounted on the surface mounting substrate can be provided at low cost. An extremely excellent effect in the industry can be obtained.
[0075]
In addition, with the above configuration, the conventional electronic component with lead wires can be placed on the substrate while being stored in a resin case and laid sideways, and as a result, the height from the substrate is higher than that of the conventional vertical chip electronic component. Since the thickness can be kept low, there is an effect that the request for reducing the thickness of the substrate with electronic components mounted thereon can be sufficiently satisfied.
[0076]
  Furthermore, after inserting the electronic component with a lead wire into the resin case while intermittently rotating the cylindrical resin case held by the resin case holding device, the electronic component is pressed and stored in a predetermined position. After the lead wire of the electronic component is cut to a required length, the lead wire is cut by a bending member in which a lead wire separating portion, a first bent portion, and a second bent portion are formed.Through the first 90 ° folding process by the first folding part and the second 90 ° folding process by the second folding part.The operation of bending the plane parallel to the plane to be placed on the substrate can be continuously performed by an automatic machine. As a result, the horizontal chip electronic components that can be mounted on the surface mounting substrate can be mass-produced at low cost.
[Brief description of the drawings]
FIG. 1 is a plan view schematically showing a manufacturing process of a horizontal chip electronic component by a horizontal chip electronic component manufacturing apparatus.
FIG. 2 is a plan view of an apparatus for manufacturing a horizontal chip electronic component.
FIG. 3 is an enlarged perspective view of a main part of a horizontal chip electronic component manufacturing apparatus.
FIG. 4 is a plan view of a resin case holding device.
FIG. 5 is a front view of a resin case supply device.
FIG. 6 is a front view showing a state where an electronic component with a lead wire is inserted into a hole of a resin case.
FIG. 7 is a front view showing a state in which an electronic component with a lead wire is inserted into a hole of a resin case.
FIG. 8 is an enlarged front view of a main part showing a state in which an electronic component with a lead wire is inserted into a hole of a resin case.
FIG. 9 is a front view of the pressing device.
FIG. 10 is an enlarged front view of a main part showing a state where an electronic component with a lead wire is pressed against a resin case.
FIG. 11 is a front view of the lead wire cutting device.
FIG. 12 is a front view of the lead wire bending apparatus.
FIG. 13 is an enlarged perspective view of a main part of a lead wire bending apparatus.
FIG. 14 is an enlarged front view of a main part showing a first step of bending the lead wire of the electronic component with lead wire.
FIG. 15 is an enlarged front view of the main part showing a second step of bending the lead wire of the electronic component with lead wire.
[Explanation of symbols]
      1 Horizontal chip electronic component manufacturing equipment
      2 Resin case holding device
      3 Resin case feeder
      4 Electronic component supply equipment
      5 Pressing device
      6 Lead wire cutting device
      8 Lead wire bending device
      9 Resin case
      9a Resin case hole as storage room
9b guide surface
9c protrusion
      9d Lead wire storage
      9e plane
    15 Turntable
    16 Electrolytic capacitor as an example of electronic components with lead wires
    16a Lead wire
    16c Lead terminal for soldering
    56 Folding member
    56a Lead wire separation part
    56b 1st bending part
    56c 2nd bending part
    72 Horizontal chip electronic components

Claims (1)

At least one surface is provided with a flat surface to be placed on the substrate during soldering, formed in a cylindrical shape, formed with a protrusion having a guide surface on one side, and leads to two opposing ridge line portions, respectively A plurality of resin case holding devices mounted on a turntable that rotates intermittently so as to hold the resin case in which the wire storage portion is formed; a resin case supply device that supplies the resin case to the resin case holding device; A lead wire-equipped electronic component in which a plurality of lead wires protrudes from one side is supplied to the resin case held by the resin case holding device, and the lead wires come out to the guide surface, the protruding portion, and the lead wire storage portion side. an electronic component feeding device for inserting as said a pressing device for the inserted into the resin case to press the electronic component housed in a predetermined position, Lee said electronic component is inserted into the resin case A lead wire cutting device for cutting the wire to the required length, the plurality of first bent portion bending the lead wire isolation portion and said lead wire to separate the leads from each other and the second bent portion is formed The bending member is moved so that the lead wire separating portion, the first bending portion, and the second bending portion sequentially contact with the lead wire, and appropriately swings up and down. First, the first bent portion is brought into contact with the lead wire and bent by 90 °, and then the second bent portion is brought into contact with the lead wire bent by 90 ° and further bent by 90 °. An apparatus for manufacturing a horizontal chip electronic component, comprising: a lead wire bending device that is housed in the lead wire housing portion and configured to bend the lead wire parallel to the plane.

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