JP7145497B2 - Component mounting device and component mounting method - Google Patents

Description

TECHNICAL FIELD The present disclosure relates to a component mounting apparatus for mounting an axial component on a substrate, and a component mounting method.

2. Description of the Related Art Among component mounting apparatuses for mounting components on a board, there is known a component mounting apparatus in which an axial component supplied from a component supply device is gripped by a gripping device and mounted on the board. For example, the component mounting device disclosed in Patent Document 1 has a mounting head that functions as a gripping device to grip two leads extending laterally from a component body of an axial component from both sides in a bent state, and to mount the gripped leads on a substrate. is known.

Axial components are held in a component feeder before being delivered to the placement head. The component supply device bends and shapes the leads of the axial component. The component supply device includes, for example, a pair of movable mold and fixed mold. The movable mold makes contact with the lead extending laterally from the component main body of the axial component from below, and lifts the lead in a bent state. The fixed molding die is arranged outside the movable molding die and guides the movement of the lead of the axial part in the bent state from the outside.

JP 2015-37084 A

In the conventional component mounting apparatus, if the distance between the insertion holes of the substrate is narrower than the minimum distance between the pair of fixed molding dies, the leads of the axial component cannot be inserted into the insertion holes of the substrate. Therefore, such axial components are manually attached to the board.

SUMMARY OF THE INVENTION Accordingly, an object of the present disclosure is to solve the above-described conventional problems, and to provide a component mounting apparatus capable of mounting axial components in insertion holes of a substrate at intervals narrower than the interval between a pair of fixed molding dies. and to provide a component mounting method.

The component mounting device of the present disclosure includes:
a pair of movable molding dies that come into contact with the leads extending laterally from the component body of the axial component from below and lift the leads in a bent state;
a pair of fixed molding dies arranged outside the movable molding dies for guiding the movement of the leads in the bent state from the outside;
It has a pair of claw portions which are arranged above the stationary molding die and hold the leads in a bent state lifted up by the movable molding die from both sides, and the held leads of the axial component are formed on the substrate. a mounting head movable to be inserted into the insertion hole;
a spacing adjustment unit that adjusts the spacing between the pair of claws of the mounting head,
The gap adjusting section adjusts the gap between the pair of claws of the mounting head before transferring the axial component from the movable mold to the mounting head so as to match the gap between the pair of fixed molds. ,
The spacing adjusting section adjusts the spacing between the pair of claws when the axial component is transferred from the movable molding die to the mounting head when the spacing between the insertion holes of the substrate is smaller than the spacing between the pair of fixed molding dies. is further narrowed to the spacing of the insertion holes of the substrate.

The component mounting method of the present disclosure includes:
a lead forming step of bringing the leads extending laterally from the component body of the axial component into contact with the movable mold from below and lifting the leads in a bent state;
A delivery step in which the leads in a bent state lifted up by the movable molding die are sandwiched and gripped from both sides by a pair of claw portions of a mounting head arranged above a fixed molding die arranged outside the movable molding die. When,
a mounting step of inserting the lead of the gripped axial component into an insertion hole formed in a substrate;
a spacing adjustment step of adjusting the spacing between the pair of claws of the mounting head,
In the lead molding step, the fixed molding die is used to guide the movement of the bent lead lifted by the movable molding die from the outside,
The interval adjustment step includes:
The gap between the pair of claw portions of the mounting head is adjusted to match the gap between the pair of fixed molds before the axial component is transferred from the movable mold to the claw portion of the mounting head. 1 interval adjustment step;
When the interval between the insertion holes of the substrate is smaller than the interval between the pair of fixed molds, the interval between the pair of claws is adjusted to the distance between the pair of claw portions when the axial component is transferred from the movable mold to the mounting head. and a second spacing adjustment step of narrowing to the spacing of the insertion holes.

According to the present disclosure, it is possible to provide a component mounting apparatus and a component mounting method capable of mounting axial components in insertion holes of a substrate that are spaced narrower than the space between a pair of fixed molding dies.

1 is a plan view of a component mounting device according to an embodiment of the present disclosure; FIG. Schematic explanatory drawing of the component connection body inserted in a component supply apparatus Schematic explanatory diagram of a component mounting apparatus according to an embodiment of the present disclosure Schematic explanatory diagram of a component supply device according to an embodiment of the present disclosure Front perspective view around the lead bending mechanism Perspective view of the surroundings of the mold with the movable mold in the uppermost position Front perspective view of forming pitch adjustment mechanism with pitch width set to minimum value Front perspective view of forming pitch adjustment mechanism with pitch width set to maximum value The front view of the component mounting part provided in the component mounting device Structural drawing of the placement head provided in the component placement device 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to an embodiment of the present disclosure; FIG. Perspective view of the claw part included in the chuck unit Explanatory drawing of transfer operation of axial parts using chuck unit Explanatory drawing of transfer operation of axial parts using chuck unit Explanatory drawing of the mounting operation of the axial component using the chuck unit Explanatory drawing of the mounting operation of the axial component using the chuck unit 2 is a flow chart showing a component mounting method according to an embodiment of the present disclosure; Schematic longitudinal sectional view for explaining a component mounting method according to an embodiment of the present disclosure. Schematic longitudinal sectional view for explaining a component mounting method according to an embodiment of the present disclosure. Schematic longitudinal sectional view for explaining a component mounting method according to an embodiment of the present disclosure. Schematic longitudinal sectional view for explaining a component mounting method according to an embodiment of the present disclosure. Schematic longitudinal sectional view for explaining a component mounting method according to an embodiment of the present disclosure. Schematic longitudinal sectional view for explaining a component mounting method according to an embodiment of the present disclosure. Schematic longitudinal sectional view for explaining a component mounting method according to an embodiment of the present disclosure.

According to a first aspect of the present disclosure, a pair of movable molding dies for contacting leads extending laterally from a component body of an axial component from below and lifting the leads in a bent state, and arranged outside the movable molding dies. and a pair of stationary molding dies for guiding the movement of the leads in the bent state from the outside, and a pair disposed above the stationary molding dies for gripping the leads in the bent state lifted up by the movable molding dies from both sides. a mounting head that has claws and is movable to insert the lead of the gripped axial component into an insertion hole formed in a substrate; and a gap between the pair of claws of the mounting head is adjusted. a gap adjusting part, wherein the gap adjusting part adjusts the gap between the pair of claws of the mounting head before transferring the axial component from the movable mold to the mounting head. and the gap adjusting unit transfers the axial component from the movable mold to the mounting head when the gap between the insertion holes of the substrate is smaller than the gap between the pair of fixed molds. Provided is a component mounting device which further narrows the gap between the pair of claws to the gap between the insertion holes of the board.

According to the second aspect of the present disclosure, after the movable molding die lifts the axial component to the uppermost end, the spacing adjuster adjusts the spacing between the pair of claws to the spacing between the insertion holes of the substrate. There is provided a component placement apparatus according to the first aspect, which narrows.

According to a third aspect of the present disclosure, the spacing adjusting section narrows the spacing between the pair of claws to the spacing between the insertion holes of the substrate at the same time that the movable molding die lifts the axial component. A component mounting apparatus according to the first aspect is provided.

According to a fourth aspect of the present disclosure, the distance between the movable mold and the fixed mold is greater than the diameter of the lead, and the lead is between the movable mold and the fixed mold. The component mounting apparatus according to any one of the first to third aspects, wherein the lead is bent so that the lower portion of the lead expands outward by being guided.

According to a fifth aspect of the present disclosure, a lead forming step of bringing the lead extending laterally from the component body of the axial component into contact with the movable mold from below and lifting the lead in a bent state;
A delivery step in which the leads in a bent state lifted up by the movable molding die are sandwiched and gripped from both sides by a pair of claw portions of a mounting head arranged above a fixed molding die arranged outside the movable molding die. When,
a mounting step of inserting the lead of the gripped axial component into an insertion hole formed in a substrate;
a spacing adjustment step of adjusting the spacing between the pair of claws of the mounting head,
In the lead molding step, the fixed molding die is used to guide the movement of the bent lead lifted by the movable molding die from the outside,
The interval adjustment step includes:
The gap between the pair of claw portions of the mounting head is adjusted to match the gap between the pair of fixed molds before the axial component is transferred from the movable mold to the claw portion of the mounting head. 1 interval adjustment step;
When the interval between the insertion holes of the substrate is smaller than the interval between the pair of fixed molds, the interval between the pair of claws is adjusted to the distance between the pair of claw portions when the axial component is transferred from the movable mold to the mounting head. a second spacing adjustment step of narrowing to the spacing of the insertion holes;
A component mounting method is provided.

According to the sixth aspect of the present disclosure, the second gap adjusting step adjusts the gap between the pair of claws after the movable mold lifts the axial part to the uppermost end of the insertion hole of the substrate. A component mounting method according to the fifth aspect, wherein the spacing is narrowed.

According to the seventh aspect of the present disclosure, the second gap adjusting step adjusts the gap between the pair of claws to the gap between the insertion holes of the substrate at the same time when the movable mold lifts the axial component. To provide a method for mounting a part by narrowing.

According to an eighth aspect of the present disclosure, the distance between the movable mold and the fixed mold is greater than the diameter of the lead, and the lead is positioned between the movable mold and the fixed mold. The component mounting method according to any one of the fifth to seventh modes, wherein the lead is bent so that the lower portion of the lead expands outward by guiding.

Exemplary embodiments of a component supply device according to the present disclosure will be described below with reference to the accompanying drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and includes configurations based on similar technical ideas.

(embodiment)
First, a component mounting apparatus 1 according to an embodiment of the present disclosure will be described with reference to FIG. FIG. 1 is a plan view of the component mounting apparatus 1. FIG. A component mounting apparatus 1 has a function of mounting a component 3 on a board 2 . The component mounting apparatus 1 may perform insertion mounting with respect to the board 2 or may perform surface mounting with respect to the board 2 . Hereinafter, the horizontal transport direction (horizontal direction) with respect to the substrate 2 is the X direction, the direction perpendicular to the X direction in the horizontal plane (front-rear direction) is the Y direction, and the direction perpendicular to the XY plane (vertical direction) is the Z direction. Define direction.

A component supply unit 6 is provided on the upper surface of the base 4 provided in the component mounting apparatus 1 . The component supply unit 6 includes a first component supply device 6a that supplies axial components (axial lead type components), a second component supply device 6b that supplies radial components (radial lead type components), and chip type components. and a third component supply device 6c. An axial component is a component having two leads projecting sideways (horizontally) from both sides of the component body. A radial component is a component having two leads protruding downward from the lower part of the component body. A component supply unit 6 supplies components 3 with a parts feeder 10 such as an axial feeder, a radial feeder, or a tape feeder. The component mounting apparatus 1 includes a plurality of first component supply devices 6a, and each of the first component supply devices 6a may have different lead forming intervals of axial components to be supplied.

The component mounting apparatus 1 can grip a radial component, an axial component, and a chip-type component with one common mounting head.

A Y-axis beam 14 is provided at both ends of the base 4 in the X direction, and an X-axis beam 15 is provided on the Y-axis beam 14 so as to be movable in the Y direction. A plate-shaped plate member 16 is attached to the X-axis beam 15 so as to be slidable in the X direction. By driving the X-axis beam 15 and the plate member 16, the component mounting section 17 can move in the XY directions. The component mounting section 17 has a function of receiving the component 3 from the component supply unit 6 and mounting the component 3 on the board 2 . The Y-axis beam 14, the X-axis beam 15, and the plate member 16 constitute a head moving mechanism 12 that moves the component mounting portion 17 in the horizontal direction (X direction, Y direction).

A component recognition camera 19 is provided between the substrate 2 and the component supply unit 6 on the base 4 and has an upward imaging field of view. The component recognition camera 19 captures an image of the component 3 held by the component mounting section 17 moving above from below.

Next, with reference to FIG. 2, a description will be given of the axial component D and the component linked body C that connects and holds the axial component D. As shown in FIG. FIG. 2 is a schematic explanatory diagram of the component connecting body C to be inserted into the first component supply device 6a. The axial component D includes a component main body B and two leads L laterally extending from the component main body B in mutually opposite directions. In the component connecting body C, the plurality of axial components D are connected by arranging the plurality of axial components D at a predetermined pitch Sp and holding both outer ends of the two leads L with tapes T, respectively.

Next, a schematic operation of the component mounting apparatus 1 will be described with reference to FIG. FIG. 3 is a schematic explanatory diagram of the component mounting apparatus 1. FIG.

In FIG. 3, the component supply unit 6 is attached to the base 1a in a state in which the feeder-side connection portion 6e provided in the component supply unit 6 and the device-side connection portion 1b provided in the base 1a are connected. By connecting the feeder-side connection portion 6 e and the device-side connection portion 1 b , the component supply unit 6 is electrically connected to the component mounting apparatus 1 and air (compressed air) is supplied to the component supply unit 6 . A component holding portion 17 a for holding the component 3 supplied by the component supply unit 6 is attached to the lower end of each component mounting portion 17 . The component holding portion 17a sandwiches and holds, for example, the lead L of the axial component whose legs have been bent.

In the component mounting operation, the component mounting section 17 moves above the component supply unit 6 by means of the X-axis beam 15 and the Y-axis beam 14, and moves the component 3 supplied to the supply position 6d of the component supply unit 6 to the component holding section 17a. is held and picked up by (arrow a). The component mounting unit 17 picks up, for example, a component holding unit 17a that holds the axial component D that has undergone leg bending. The component mounting unit 17 holding the component 3 moves above the board 2 held at the mounting position of the board transport mechanism 5 by the X-axis beam 15 and the Y-axis beam 14, and mounts the component 3 on the board 2 ( arrow b). The component mounting unit 17 holds, for example, an axial component and moves above the substrate 2, inserts the leads L into the insertion holes 2a formed in the substrate 2, and mounts the axial component. The insertion hole 2 a of the substrate 2 is a through hole into which the lead L is inserted in order to mount the axial component D on the substrate 2 .

When the component mounting section 17 that has taken out the component 3 from the component supply unit 6 moves above the component recognition camera 19, the component recognition camera 19 images and recognizes the component held by the component mounting section 17. FIG. A board recognition camera 18 positioned below the X-axis beam 15 and moving integrally with the component mounting portion 17 is mounted on the plate member 16 to which the component mounting portion 17 is attached.

As the component mounting unit 17 moves, the board recognition camera 18 moves above the board 2 positioned on the board transport mechanism 5, picks up the board mark (not shown) provided on the board 2, and picks up the board. Recognize the position of 2. Further, the substrate recognition camera 18 images the insertion hole 2a formed in the substrate 2 and recognizes the position of the insertion hole 2a. In the component mounting operation of the axial component to the board 2 by the component mounting unit 17, the mounting position is determined by taking into consideration the recognition result of the axial component by the component recognition camera 19 and the recognition result of the board 2 and the insertion hole 2a by the board recognition camera 18. A correction is made.

Next, with reference to FIG. 4, the configuration of the first component supply device 6a will be further described. FIG. 4 is an explanatory diagram of the configuration of the second component supply device 6b. In this embodiment, the first component supply device 6a includes a main body portion 7, a feeder-side connection portion 6e, and a reel holding portion 7d. The feeder-side connecting portion 6 e is installed on the lower surface of the main body portion 7 . The reel holding portion 7d is installed on the upstream side of the main body portion 7 in the component feeding direction (on the left side in FIG. 3). A reel 8 for winding and storing a linked component body C inserted from a component insertion port 7e provided on the upstream side of the main body 7 is placed on the reel holding portion 7d.

Inside the main body 7, there is a pair of left and right guides for guiding the component assembly C substantially horizontally from a component insertion port 7e that opens upstream to a discharge port 7f that opens downstream in the component feeding direction (right side in FIG. 3). is provided with a transport path 7g. The connected body of parts C is pitch-fed downstream in a state in which the left and right tapes T constituting the connected body of parts C are placed on the left and right transport paths 7g. A supply position 6d is provided in the middle of the transport path 7g. That is, the conveying path 7g guides the component linked body C from the component insertion opening 7e on the upstream side in the component feeding direction to the supply position 6d on the downstream side.

In FIG. 4, a feed unit 82, a lead bending mechanism 83, and a moving mechanism 94 are installed inside the main body 7. As shown in FIG. The feed unit 82 is a unit that feeds the axial component D to the feed position 6d. In this embodiment, the feed unit 82 pitch-feeds the component linked bodies C downstream along the transport path 7g. The lead bending mechanism 83 is installed downstream of the feeding unit 82 . The lead bending mechanism 83 cuts the left and right leads L of the pitch-fed axial component D at predetermined positions to separate them from the tape T, and bends the leads L remaining on the component body B downward. Execute and supply to supply position 6d. A detailed configuration of the lead bending mechanism 83 will be described later.

The moving mechanism 94 is a mechanism that reciprocates the feeding unit 82 in the front-rear direction (Y direction) along the component feeding direction. In this embodiment, the moving mechanism 94 is an air cylinder. The air cylinder has a rod (not shown) coupled to the feed unit 82 . A rotating shaft (not shown) reciprocates along the component feeding direction by moving the rod in and out of the air cylinder.

The tape T from which the axial part D has been separated is discharged from the discharge port 7f. A pair of upper and lower tape ejection guides 84 are installed downstream of the ejection port 7f. The tape T ejected from the ejection port 7f is ejected downward along a pair of tape ejection guides 84. As shown in FIG. An operation/display panel 85 is installed on the upper surface of the main body 7 on the upstream side. The operation/display panel 85 is provided with operation buttons for operator's operation input and display means such as a 7-segment display for displaying the operation state.

In FIG. 4, a feeder control section 86 is installed inside the body section 7 . A socket 87 and an air supply port 88 are installed on the downstream side surface of the feeder-side connection portion 6e. The feeder controller 86 is electrically connected to the mold 49 , operation/display panel 85 , socket 87 and moving mechanism 94 . The feeder control section 86 is electrically connected to the apparatus side connection section 1b via a socket 87. As shown in FIG. Air is supplied to the air supply port 28 via the device-side connection portion 1b. The air supplied to the air supply port 28 is supplied to the molding die 49 and the moving mechanism 94 through a tube 89 installed inside the body portion 7 .

Next, the configuration of the lead bending mechanism 83 will be described with reference to FIGS. 5 and 6. FIG. FIG. 5 is a perspective view of the periphery of the lead bending mechanism 83. As shown in FIG. FIG. 6 is a perspective view of the mold 49 and its surroundings when the movable mold is in the uppermost position. In FIG. 5, the front wall and one side wall of the main body are omitted to facilitate understanding of the structure.

As shown in FIGS. 5 and 6, the lead bending mechanism 83 includes a lead cutting section 115 for cutting the lead L to a predetermined length, a pair of molds 49 for bending the lead L, and a cam mechanism 117. , have The lead L of the axial component D sent to the supply position 6 d by the sending unit 82 is cut by the lead cutting section 115 and bent substantially vertically by the molding die 49 . The lead cutting portion 115 and the molding die 49 are provided on both left and right sides of the component body portion B of the axial component D. As shown in FIG. The lead cutting part 115 is provided outside the molding die 49 in the direction (horizontal direction) perpendicular to the component feeding direction.

The lead cutting unit 115 has a fixed blade 115a and a movable blade 115b that is vertically movable with respect to the fixed blade 115a. The fixed blade 115a is fixed to the body portion 7 of the first component supply device 6a. The fixed blade 115a extends in the component feeding direction (front-rear direction) above the lead L of the axial component D to be fed. The movable blades 115b are provided on both sides in the width direction of the fixed blade 115a. The movable blade 115b extends vertically and moves upward from below the lead L at the supply position 6d. A lower portion of the movable blade 115 b is connected to the cam mechanism 117 . The upper end portion of the movable blade 115b is formed in a V shape when viewed from the side. The movable blade 115b is moved upward with respect to the fixed blade 115a by the cam mechanism 117 at the supply position 6d, and cuts the lead L by sandwiching it between the fixed blade 115a and the movable blade 115b. Specifically, the movable blade 115b is raised to lift the lead L at the supply position 6d from below to sandwich the lead L between the upper end of the movable blade 115b and the fixed blade 115a, and then the movable blade 115b is further raised. Then, the lead L is cut. Thus, the fixed blade 115a and the movable blade 115b cut the lead L in cooperation.

The pair of molding dies 49 has a pair of stationary molding dies 52 and a pair of movable molding dies 50 vertically movable with respect to each of the stationary molding dies 52 . The stationary molding die 52 is fixed to the body portion 7 of the first component supply device 6a. The stationary molding die 52 has guide grooves 52a formed vertically to guide the bending of the leads L (see FIG. 7). The guide groove 52a is formed in a V shape in plan view. The movable mold 50 is provided on both inner sides of the fixed mold 52 in the width direction. The movable mold 50 extends vertically and is connected to a cam mechanism 117 at its lower portion. The movable molding die 50 is moved upward from below the lead L at the supply position 6 d by the cam mechanism 117 . The upper end portion of the movable mold 50 is formed in a V shape when viewed from the side. By raising the movable mold 50 relative to the fixed mold 52 from below the leads L at the supply position 6d, the leads L are guided by the guide grooves 52a and bent substantially vertically.

The cam mechanism 117 includes a bar 121 connected to the lower portion of the movable molding die 50, a bar support 123 supporting the bar 121, a cam follower 125 connected to the lower portion of the bar support 123, and the cam follower 125 being rotatable. A cam plate 127 having an inclined surface 127a and an actuator 119 for horizontally driving the cam plate 127 are provided.

The bar 121 is inserted through through-holes formed in the lower portions of the movable mold 50 and the movable blade 115b. The bar 121 extends in the width direction (X direction) and has both ends supported by bar supports 123 . The bar support 123 has an upwardly extending U-shaped first arm 123a and an inverted U-shaped second arm 123b downwardly extending from the first arm 123a. Both ends of the bar 121 are connected to the first arm 123a. For example, a roller-shaped cam follower 125 is connected between the second arms 123b.

The cam plate 127 is driven by the actuator 119 in the front-rear direction (Y direction). Accordingly, the cam follower 125, the bar support 123, and the bar 121 move up and down as the cam follower 125 rotates on the slope 127a. As a result, the movable mold 50 and the movable blade 115b, which are respectively connected to the bar 121, move up and down according to the drive of the actuator 119. FIG.

Next, a forming pitch adjusting mechanism 130 for adjusting the forming pitch of the bent leads will be described with reference to FIGS. 7 and 8. FIG. FIG. 7 is a front perspective view of the molding pitch adjustment mechanism 130 with the pitch width set to the minimum value. FIG. 8 is a front perspective view of the molding pitch adjustment mechanism 130 with the pitch width set to the maximum value.

The molding die 49 and the lead cutting section 115 are unitized in the molding pitch adjusting mechanism 130 . The molding pitch adjustment mechanism 130 includes a pair of molding dies 49 , a pair of first supports 131 , two guide shafts 133 , screw shafts 135 and a pair of frames 137 . The forming pitch Fp here means the distance (interval) between the tip portions of the bent leads. Therefore, the spacing Fp between the guide grooves 52a of the pair of fixed molding dies 52 is the molding pitch (see FIG. 8).

A pair of molding dies 49 bend two leads L laterally extending from the component body portion B of the axial component D in opposite directions. A pair of first supports 131 support a pair of molds 49 . The guide shafts 133 pass through the pair of first supports 131 and slidably guide the pair of first supports 131 while facing each other. The screw shaft 135 is arranged parallel to the guide shaft 133 . For example, the screw shaft 135 is arranged parallel to the guide shaft 133, and the right screw thread 135a and the left screw thread 135b are formed separately. A pair of frames 137 extend in opposition to each other along the component conveying direction.

The pair of first supports 131 has a left first support 131L and a right first support 131R. Note that when describing items common to the left first support 131L and the right first support 131R, both are simply referred to as the first support 131. FIG. The left first support 131L has a through hole 131Lb that screws together with the left screw thread 135b. The right first support 131R has a through-hole 131La that engages with the right screw thread 135a.

The molding pitch adjustment mechanism 130 also includes a second support 139 and a support member 141 fixed to the frame 137 and extending parallel to the guide shaft 133 . The support member 141 is, for example, a plate member. Both ends of the support member 141 are fixed to the inner side surfaces of the pair of frames 137 . One support member 141 is fixed to the front end of the inner surface of frame 137 and another support member 141 is fixed to the rear end of the inner surface of frame 137 .

The first support 131 has a cylindrical portion 131 a extending outward from the outer surface of the first support 131 . The cylindrical portion 131a also extends inside the first support 131 to form a through hole. A guide shaft 133 is inserted through the cylindrical portion 131a. Therefore, the cylindrical portion 131 a extends along the guide shaft 133 . Further, the first support 131 has a screw hole 131b for fixing the fixed molding die 52 from the outside in the width direction. A movable mold 50 is sandwiched between the fixed mold 52 and the first support 131 so as to be vertically movable.

The pair of frames 137 are fixed to the main body 7 of the first component supply device 6a by fixing members such as bolts 138, respectively. Two guide shafts 133 are inserted through the frame 137 and both ends of each of the guide shafts 133 are fixed to the respective frames 137 . Each guide shaft 133 is fixed to the frame 137 inside the support member 141 in the front-rear direction.

A second support 139 supports the lead cutting portion 115 . The second support 139 has a body portion 139a through which the guide shaft 133 passes, and a block portion 139b that can be attached to and detached from the body portion 139a. The block portion 139b is detachably fixed from above the body portion 139a. A fixed blade 115a is fixed to the block portion 139b from the inner side in the width direction. A concave portion 139ba recessed outward is formed on the inner surface of the block portion 139b. The movable blade 115b slides vertically in the concave portion 139ba. Therefore, the inner side surface of the concave portion 139ba serves as a sliding surface for the movable blade 115b.

The second support 139 has protrusions 139g that protrude forward and backward. A screw hole 139h (see FIG. 14) is formed in the projecting portion 139g downward from the upper surface. The lower surface of the support member 141 contacts the upper surface of the projecting portion 139g, and is fixed to the upper surface of the supporting member 141 and the upper surface of the projecting portion 139g with bolts 145 via spacers 143. As shown in FIG.

Next, referring to FIG. 9, the configuration of the component mounting portion 17 will be described. The component mounting section 17 includes a plurality of (here, three) mounting heads 17A, 17B, and 17C.

The mounting heads 17A and 17B include a head main body portion 21 and a suction nozzle 22 mounted on the lower end portion of the head main body portion 21 . A rotating mechanism (not shown) for horizontally rotating the suction nozzle 22 is incorporated in the head main body 21 . The suction nozzle 22 is moved in the Z direction, that is, moved up and down by a nozzle lifting mechanism 23 arranged above the head main body 21 . The suction nozzle 22 holds the component 3 supplied from the component supply unit 6 by suction, and transfers and mounts it on the board 2 .

In this description, the component mounting section 17 is composed of a plurality of mounting heads 17A, 17B and 17C, but the mounting heads 17A and 17B may be omitted and composed of only one mounting head 17C.

The mounting head 17</b>C includes a head main body 24 , a chuck unit 25 and a head lifting mechanism 26 . The chuck unit 25 is mounted below the head main body 24 so as to be horizontally rotatable with the vertical direction (Z direction) as the axis.

A detailed configuration of the mounting head 17C is shown in FIG. The head lifting mechanism 26 includes a lifting motor 261 , a feed screw 262 , and a nut portion 263 screwed onto the feed screw 262 and fixed to the head body portion 24 . The head lifting mechanism 26 rotates the feed screw 262 by driving the lifting motor 261 and moves the nut portion 263 to move the head main body portion 24 in the Z direction, that is, to lift or lower the head body portion 24 .

The head main body 24 is provided with a chuck drive motor 241 that drives the chuck unit 25 , a chuck rotation motor 242 that horizontally rotates the chuck unit 25 , and a pusher device 243 . The pusher device 243 includes a pusher 44 and a pusher actuator 45 . The pusher 44 is moved in the Z direction by the pusher actuator 45, that is, moved up and down. The pusher 44 lowers the component 3 gripped by the chuck unit 25 to push down the component 3 .

The chuck unit 25 has a lifting rod 251 . The upper end of the lifting rod 251 is connected to the chuck drive motor 241 via a reduction mechanism consisting of a worm wheel 241a and a worm gear 241b. When the chuck driving motor 241 rotates the worm gear 241b, the worm wheel 241a meshing with the worm gear 241b swings. As a result, the elevating rod 251 coupled to the worm wheel 241a moves in the Z direction, that is, elevates.

The chuck unit 25 has a pair of claws 39 (39a, 39b) for gripping the component 3. As shown in FIG. The claw portion 39 chucks (holds) the component 3 and is made of metal that is resistant to wear. The claw portion 39a and the claw portion 39b are connected to the lifting rod 51 of the head lifting mechanism 26 via the slide mechanism 38, respectively. As the lifting rod 251 moves up and down, the slide mechanism 38 operates, and the claw portions 39a and 39b approach or separate from each other. That is, the gap between the claw portions 39a and 39b can be adjusted. In this way, the chuck unit 25 functions as an interval adjusting portion that adjusts the interval between the claw portions 39a and 39b (the interval between the pair of claw portions 39).

When the lifting rod 251 is positioned at the highest position, the claw portions 39a and 39b are most separated. When the lifting rod 251 descends, the slide mechanism 38 moves the claws 39a and 39b closer to each other accordingly. When the lifting rod 251 descends to the lowest position, the claws 39a and 39b come into contact with each other.

Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. FIG. 17 is a block diagram showing the configuration of the control system of the component mounting apparatus 1. As shown in FIG. A control unit 70 provided in the component mounting apparatus 1 includes a mounting storage unit 71 , an interval adjusting unit 72 , a mounting operation processing unit 73 and a height adjusting unit 74 . Also, the control section 70 is connected to the substrate transport mechanism 5 , the component supply unit 6 , the component mounting section moving mechanism 13 , the component mounting section 17 , and the component recognition camera 19 . The control unit 70 includes, for example, a processor, FPGA, and the like. The interval adjusting section 72, the mounting operation processing section 73, and the height adjusting section 74 may each be composed of a plurality of processors or the like, or may be composed of a single processor.

The mounting storage unit 71 stores various production data necessary for mounting the component 3 on the board 2 . The mounting storage unit 71 is a storage device composed of at least one of a memory, a hard disk, an SSD, and the like, and stores mounting data including, for example, the type and shape of the axial component D to be mounted on the substrate 2 and the coordinates of the mounting position. are stored for each type of mounting board to be manufactured. The component mounting section moving mechanism 13 is controlled by the control section 70 to drive the X-axis beam 15 , the plate member 16 and the component mounting section 17 . Thereby, the component mounting work is performed.

The mounting operation processing section 73 controls each section to control the component mounting operation for mounting the axial component D on the board 2 . Each component supply unit 6 has a feed unit 82 , a lead bending mechanism 83 , an operation/display panel 85 , a feeder control section 86 and an actuator 119 . The feeder control section 86 controls the feed unit 82 to perform a component feeding operation for pitch-feeding the linked component body C, and controls the lead bending mechanism 83 to perform lead bending processing.

As shown in FIG. 12 , the claw portion 39 includes a substantially L-shaped base portion 41 and a grip portion 42 extending vertically from below the base portion 41 . A plurality of holes 41 a are formed in the base 41 . The claw portion 39 is attached to the slide mechanism 38 of the mounting head 17C through the hole portion 41a.

A gripping surface 40 of the claw portion 39 is a surface for gripping the radial component and the axial component D described above. Holding grooves 40 c for holding the leads L of the axial component D are formed in the gripping surface 40 . The holding groove 40 c extends toward the tip of the claw portion 39 in order to guide the lead L of the axial component D toward the substrate 2 .

Next, with reference to FIGS. 13 to 16, the operation of gripping the component 3 using the chuck unit 25 and mounting it on the substrate 2 in the case of the axial component D will be described.

As shown in FIG. 13, the axial component D to be worked by the chuck unit 25 is removed from the parts feeder 10 in a state in which the tips of the leads L projecting sideways from both sides of the component body B are bent downward. supplied. A movable molding die 50 is provided in the parts feeder 10 . The movable mold 50 is brought into contact with the lead L of the axial part D from below and lifted. As the movable molding die 50 rises, the axial component D is transferred from the movable molding die 50 to the claw portion 39 as shown in FIG. The axial component D is gripped by the claw portion 39 by holding the lead L in the holding groove 40 c of the claw portion 39 .

After that, the chuck unit 25 is lifted by the head lifting mechanism 26, and lifted from the parts feeder 10 while the axial part D is gripped by the claw portion 39. As shown in FIG.

Next, as shown in FIG. 15, the pair of claws 39 gripping the axial component D moves above the board 2 which has been positioned in advance at the working position. Specifically, after the chuck unit 25 having the claw portions 39 rises in the Z direction, it moves in the XY directions and is positioned above the substrate 2 .

Next, the pair of claws 39 descends with respect to the substrate 2 to insert the leads L into the insertion holes 2a formed in the substrate 2 and bring the lower surface of the component main body B into contact with the substrate 2 . Next, as shown in FIG. 16, the pair of claws 39 move upward to release the grip of the axial component D. Then, as shown in FIG. Next, the pusher 44 descends in the direction of arrow g to press the axial component D against the substrate 2 . Next, the lead L is clinched by a clinch mechanism (not shown). In this manner, the axial component D is attached to the substrate 2 .

Next, with reference to FIGS. 17 to 23, the mounting method of the axial component D to the board 2 will be described in more detail. FIG. 17 is a flow chart showing the mounting method of this embodiment. 18 to 23 are schematic longitudinal sectional views for explaining the component mounting method of the embodiment.

In step S<b>11 , the interval adjustment section 72 of the control section 70 acquires lead information of the axial component D mounted on the board 2 . The lead information is, for example, information on the forming pitch of the bent leads L of the axial component D. As shown in FIG. The molding pitch of the leads L is the interval Fp between the pair of fixed molding dies 52 . The interval adjustment unit 72 may store the lead information input by the user in the mounting storage unit 71 and acquire the lead information from the mounting storage unit 71 .

In step S12, the interval adjustment unit 72 of the control unit 70 acquires insertion hole information. The insertion hole information is, for example, information on the interval 2p between the insertion holes 2a of the substrate 2 into which the axial component D is inserted (see FIG. 15). The interval adjustment unit 72 may store the insertion hole information input by the user in the mounting storage unit 71 and acquire the insertion hole information from the mounting storage unit 71, or may store the image captured by the board recognition camera 18. Alternatively, the insertion hole information may be obtained by image processing.

In step S<b>13 , the spacing adjustment unit 72 performs first spacing adjustment in which the chuck width 39 w that is the spacing between the pair of claws 39 is adjusted to the same length as the spacing Fp between the fixed molds 52 . That is, the gap adjusting section 72 controls the slide mechanism 38 so that the chuck width 39w of the claw portion 39 is the same length as the gap Fp of the fixed molding die 52 . The space Fp between the fixed molds 52 is adjusted in advance by the user, for example, to have the same length as the space 2p between the insertion holes 2a of the substrate 2 . If the interval 2p between the insertion holes 2a is too short to adjust the interval Fp between the fixed molds 52 to the length of the interval 2p between the insertion holes 2a, the interval Fp between the fixed molds 52 is adjusted to the minimum length. .

At step S14, the lead L of the axial component D is formed. By operating the actuator 119, the cam mechanism 117 raises the movable mold 50 as shown in FIG. The lead L of the axial component D extends linearly laterally from the component main body portion B and is held in an unbent state (unbent state). In such an arrangement, the lead L is lifted by raising the movable mold 50 .

As shown in FIG. 19, when the movable molding die 50 rises and contacts the leads L, the leads L are sandwiched between the movable molding die 50 and the fixed molding die 52 and bent. At this time, the lower ends of the two leads L are formed with the interval Fp. As shown in FIG. 20, when the movable mold 50 is further raised, the leads L are raised in a bent state. At this time, the stationary molding die 52 guides the upward movement of the leads L in the bent state. In this manner, the leads L of the axial component D are bent from the sides of the component body B. As shown in FIG. The first stage molding of the axial part D is performed on the part feeder 10 side. A distance Mf between the movable molding die 50 and the fixed molding die 52 is set longer than the diameter of the lead L in advance. By guiding the leads L between the movable molding die 50 and the fixed molding die 52, the leads L are bent so that the lower portions of the leads L spread outward.

In step S15, the claw portion 39 of the mounting head 17C grips the axial component D lifted by the movable molding die 50, thereby transferring the axial component D from the first component supply device 6a to the mounting head 17C. As shown in FIG. 21, the claw portion 39 of the mounting head 17C moves above the fixed molding die 52 with a space therebetween. As shown in FIG. 22 , the axial component D is transferred to the claw portion 39 by further raising the movable mold 50 .

When the movable molding die 50 lifts the axial part D to the height of the uppermost end and the axial part D is placed in the space between the claws 39 , the leads L of the axial part D come into contact with the inner walls of the claws 39 . there is The lead L is made of a material having elasticity (for example, a soft wire), and a springback force is generated to return to the state before molding. As a result, the lead L contacts the inner wall of the claw portion 39 and the lead L of the axial component 32 can be gripped by the claw portion 39 . The movable mold 50 that has delivered the axial component D to the claw portion 39 retreats downward due to the operation of the cam mechanism 117 .

During this transfer, if the interval 2p between the insertion holes 2a of the substrate 2 is smaller than the interval Fp between the fixed molds 52 as in Yes in step S16, the interval adjuster 72 adjusts the chuck width 39w of the claw portion 39 to A second spacing adjustment is performed to adjust the spacing to the same length as the spacing 2p between the insertion holes 2a of the substrate 2 .

In the second spacing adjustment, the spacing adjustment section 72 drives the chuck driving motor 241 of the chuck unit 25 to adjust the chuck width 39w of the claw section 39 to the same length as the spacing 2p between the insertion holes 2a of the substrate 2. .

In this way, when the spacing 2p between the insertion holes 2a of the substrate 2 is smaller than the spacing Fp between the fixed molds 52, the spacing adjuster 72 adjusts the chuck width 39w of the claws 39 between the first spacing adjustment and the second spacing adjustment. Adjust in two steps. As a result, the chuck width 39w of the pair of claw portions 39 is narrowed to the length of the interval 2p, and the forming pitch of the leads L is adjusted to the length of the interval 2p.

In step S18, the chuck unit 25 attaches the axial component D to the substrate 2 by inserting the leads L of the axial component D into the insertion holes 2a of the substrate 2, as shown in FIG.

Further, when the axial component D is transferred from the first component supply device 6a to the mounting head 17C, the interval 2p between the insertion holes 2a of the substrate 2 is smaller than the interval Fp between the fixed molding dies 52, as indicated by No in step S16. If not, in the first interval adjustment, the interval 2p between the insertion holes 2a and the interval Fp between the fixed molds 52 have already been adjusted to have the same length. Therefore, the chuck width 39w of the claw portion 39 is adjusted to the same length as the interval 2p between the insertion holes 2a by the first interval adjustment. Accordingly, in step S18, the chuck unit 25 can insert the leads L of the axial component D into the insertion holes 2a of the substrate 2 and mount the axial component D on the substrate 2. FIG.

According to the component mounting apparatus 1 of this embodiment, the pair of movable molding dies 50 contact the leads L extending laterally from the component main body portion B of the axial component D from below and lift the leads L in a bent state; A pair of stationary molding dies 52 arranged outside the molding die 50 to guide the movement of the lead L in the bent state from the outside, and a bent lead arranged above the stationary molding die 52 and lifted up by the movable molding die 50. a mounting head 17C having a pair of claws 39 for gripping L from both sides and capable of moving so as to insert the lead L of the gripped axial component D into the insertion hole 2a formed in the substrate 2; and a space adjusting portion 72 for adjusting the space between the pair of claw portions 39 of 17C. The gap adjustment part 72 adjusts the gap between the pair of claw parts 39 of the mounting head 17C to the gap Fp between the pair of fixed molds 52 before the axial component D is transferred from the movable mold 50 to the mounting head 17C. adjust. When the spacing 2p between the insertion holes 2a of the substrate 2 is smaller than the spacing between the pair of fixed molding dies 52, the spacing adjusting section 72 adjusts the pair of claws 39 when transferring the axial component D from the movable molding die 50 to the mounting head 17C. The gap between them is further narrowed to the gap 2p between the insertion holes 2a of the substrate 2. As a result, the chuck width 39w between the pair of claw portions 39 of the mounting head 17C is adjusted to the spacing Fp of the fixed molding die 52 before the axial component D is transferred from the movable molding die 50 to the mounting head 17C. be. If the interval 2p between the insertion holes 2a of the substrate 2 is smaller than the interval Fp between the fixed molding dies 52, when the axial component D is transferred from the movable molding die 50 to the mounting head 17C, the chuck width 39w between the claws 39 is set to the substrate. 2, the spacing between the leads L can be reduced to the spacing 2p between the insertion holes 2a of the substrate 2. FIG.

Further, according to the component mounting method of the present embodiment, the lead L extending laterally from the component main body portion B of the axial component D is brought into contact with the movable molding die 50 from below, and the lead L is lifted in a bent state. In the forming step S14, the bent lead L lifted by the movable mold 50 is bent by the pair of claws 39 of the mounting head 17C arranged above the fixed mold 52 arranged outside the movable mold 50. A delivery step S15 in which the gripped axial component D is gripped from both sides, a mounting step S18 in which the leads L of the gripped axial component D are inserted into the insertion holes 2a formed in the substrate 2, and the gap between the pair of claw portions 39 of the mounting head 17C are adjusted. and an adjusting interval adjustment step. In the lead forming step S14, the stationary forming die 52 is used to guide the movement of the bent leads L lifted by the movable forming die 50 from the outside. In the interval adjusting step, the interval between the pair of claw portions 39 of the mounting head 17C is adjusted to the interval Fp between the pair of fixed molding dies 52 before the axial component D is transferred from the movable mold 50 to the claw portions 39 of the mounting head 17C. and when the distance 2p between the insertion holes 2a of the substrate 2 is smaller than the distance Fp between the pair of fixed molds 52, the mounting head 17C receives the axial component D from the movable mold 50. and a second gap adjusting step S17 for narrowing the gap between the pair of claws 39 to the gap between the insertion holes 2a of the substrate 2 when handing over.

Further, the gap adjusting part 72 may narrow the chuck width 39w between the pair of claw parts 39 to the gap 2p between the insertion holes 2a of the substrate 2 after the movable mold 50 lifts the axial component D to the uppermost end. Since the chuck width 39w between the pair of claws 39 is narrowed to the distance 2p between the insertion holes 2a of the substrate 2 after being lifted to the uppermost end, the pair of claws 39 and the movable molding die 50 do not interfere with each other.

Further, the gap adjusting part 72 may narrow the chuck width 39w between the pair of claw parts 39 to the gap between the insertion holes 2a of the substrate 2 at the same time when the movable mold 50 lifts the axial part D. As shown in FIG. 24, when the leads L are formed by the movable molding die 50 and the fixed molding die 52, the lower ends of the leads L are made to spread outward. By performing two-step molding to narrow the interval of L, it is possible to perform molding with higher dimensional accuracy. Moreover, since the chuck width 39w between the claw portions 39 is narrowed at the same time when the movable mold 50 lifts the axial component D, the mounting speed can be further improved.

Further, the distance Mf between the movable mold 50 and the fixed mold 52 is longer than the diameter of the lead L, and the lead L is guided between the movable mold 50 and the fixed mold 52 so that the lead L The lead L is bent so that the lower part of the lead L expands outward. By bending the leads L so that the lower portions of the leads L are widened by the movable molding die 50 and narrowing the lower portions of the leads L by the claw portions 39, more accurate molding dimensions can be realized.

Although the present disclosure has been fully described in connection with preferred embodiments and with reference to the accompanying drawings, various variations and modifications will become apparent to those skilled in the art. Such variations and modifications are to be included therein insofar as they do not depart from the scope of the present disclosure by the appended claims. Also, combinations and order changes of elements in each embodiment can be implemented without departing from the scope and spirit of the present disclosure.

By appropriately combining any of the various embodiments and modifications described above, the respective effects can be obtained.

A component mounting apparatus and a component mounting method according to the present disclosure can be applied to a component mounting apparatus and a component mounting method for mounting axial components individually supplied from a component connecting body in which axial components are connected to a substrate.

REFERENCE SIGNS LIST 1 component mounting device 1b device side connection portion 2 substrate 2a insertion hole 2p spacing 3 component 4 base 5 substrate transfer mechanism 6 component supply unit 6a first component supply device 6b second component supply device 6c third component supply device 6d supply position 6e feeder-side connection portion 7 main body portion 7d reel holding portion 7e component insertion port 7f discharge port 7g transport path 8 reel 12 head moving mechanism 10 parts feeder 13 component mounting portion moving mechanism 14 Y-axis beam 15 X-axis beam 16 plate member 17 component Mounting part 17a Component holding part 17A, 17B, 17C Mounting head 18 Board recognition camera 19 Component recognition camera 21 Head body part 22 Suction nozzle 23 Nozzle lifting mechanism 24 Head body part 25 Chuck unit 26 Head lifting mechanism 38 Slide mechanism 39 Claw part 39w Chuck Width 40 Gripping Surface 40c Holding Groove 41 Base 41a Hole 42 Gripping Part 49 Mold 50 Movable Mold 50a Tip 52 Fixed Mold 52a Guide Groove 55 Screw 57 Hex Wrench 70 Controller 71 Mounting Memory 72 Spacing Adjuster 73 Mounting operation processing section 82 Feeding unit 83 Lead bending mechanism 85 Operation/display panel 86 Feeder control section 87 Socket 88 Air supply port 89 Tube 94 Moving mechanism 106 Parts detection section 102 Return prevention unit 115 Lead cutting section 115a Fixed blade 115b Movable blade 117 Cam Mechanism 119 Actuator 130 Forming Pitch Adjustment Mechanism 131 First Support 131L Left First Support 131La Through Hole 131R Right First Support 131Ra Through Hole 131a Cylindrical Part 131b Screw Hole 131c Protruding Part 131d Screw Hole 133 Guide Shaft 135 Screw Shaft 135a right screw thread 135b left screw thread 135c right screw shaft 135d collar 135e body 135f rod 135g head 135h tongue 135k ring 135m bolt 135n opening surface 135p groove 135q screw hole 137 frame 137a through hole 137b groove 1398 second bolt 139 139a body portion 139b block portion 139ba recessed portion 139bb, 139c, 139d, 139e through hole 139f Groove 139g Projection 140 Screw 141 Supporting member 142 Fixing part 143 Spacer 145, 147 Bolt 241 Chuck driving motor 241a Worm wheel 241b Worm gear 242 Chuck rotating motor 251 Elevating rod 261 Elevating motor 262 Feed screw 263 Nut part B Part body part C: Parts concatenated body D: Axial part Fp: Forming pitch L: Lead Sp: Pitch T: Tape

Claims (8)

a pair of movable molding dies that come into contact with the leads extending laterally from the component body of the axial component from below and lift the leads in a bent state;
a pair of fixed molding dies arranged outside the movable molding dies for guiding the movement of the leads in the bent state from the outside;
It has a pair of claw portions which are arranged above the stationary molding die and hold the leads in a bent state lifted up by the movable molding die from both sides, and the held leads of the axial component are formed on the substrate. a mounting head movable to be inserted into the insertion hole;
a spacing adjustment unit that adjusts the spacing between the pair of claws of the mounting head,
The gap adjusting section adjusts the gap between the pair of claws of the mounting head before transferring the axial component from the movable mold to the mounting head so as to match the gap between the pair of fixed molds. ,
When the spacing between the insertion holes of the substrate is smaller than the spacing between the pair of fixed molding dies, the spacing adjusting section adjusts the distance between the pair of claws when transferring the axial component from the movable molding die to the mounting head. narrowing the spacing further to the spacing of the insertion holes in the substrate;
Parts mounting device. After the movable molding die lifts the axial component to the uppermost end, the spacing adjustment unit narrows the spacing between the pair of claws to the spacing between the insertion holes of the substrate.
The component mounting device according to claim 1. The gap adjusting part narrows the gap between the pair of claws to the gap between the insertion holes of the substrate at the same time when the movable molding die lifts the axial component.
The component mounting device according to claim 1. The distance between the movable mold and the fixed mold is longer than the diameter of the lead, and the lead is guided between the movable mold and the fixed mold so that the lower part of the lead is the leads are bent so as to expand outward;
The component mounting device according to any one of claims 1 to 3. a lead forming step of bringing the leads extending laterally from the component body of the axial component into contact with the movable mold from below and lifting the leads in a bent state;
A delivery step in which the leads in a bent state lifted up by the movable molding die are sandwiched and gripped from both sides by a pair of claw portions of a mounting head arranged above a fixed molding die arranged outside the movable molding die. When,
a mounting step of inserting the lead of the gripped axial component into an insertion hole formed in a substrate;
a spacing adjustment step of adjusting the spacing between the pair of claws of the mounting head,
In the lead molding step, the fixed molding die is used to guide the movement of the bent lead lifted by the movable molding die from the outside,
The interval adjustment step includes:
The gap between the pair of claw portions of the mounting head is adjusted to match the gap between the pair of fixed molds before the axial component is transferred from the movable mold to the claw portion of the mounting head. 1 interval adjustment step;
When the interval between the insertion holes of the substrate is smaller than the interval between the pair of fixed molds, the interval between the pair of claws is adjusted to the distance between the pair of claw portions when the axial component is transferred from the movable mold to the mounting head. a second spacing adjustment step of narrowing to the spacing of the insertion holes;
How to install parts. In the second gap adjusting step, the gap between the pair of claws is narrowed to the gap between the insertion holes of the substrate after the movable molding die lifts the axial component to the uppermost end.
The component mounting method according to claim 5. In the second gap adjusting step, the gap between the pair of claws is narrowed to the gap between the insertion holes of the substrate at the same time when the movable molding die lifts the axial component.
The component mounting method according to claim 5. The distance between the movable mold and the fixed mold is greater than the diameter of the lead, and the lead is guided between the movable mold and the fixed mold so that the lower part of the lead is outside. bending the lead so that it spreads outward;
The component mounting method according to any one of claims 5 to 7.

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