JP3417606B2 - Electronic component insertion device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inserting device for inserting an electronic component into a predetermined position.

[0002]

2. Description of the Related Art As shown in FIG. 11 which is a front sectional view of FIG. 10 and an AA sectional view of FIG. The cutter 3 (3a is a movable cutter, 3b is a fixed cutter), the lead wire 2 is formed into a predetermined shape, and the pair of insertion guides 4 for guiding the lead wire 2 in the insertion direction and the lead wire 2 are formed into a predetermined shape. A pitch variable unit capable of varying the pitch of the insertion unit section 6 according to the pitch of the insertion hole 8 of the substrate 7 and the insertion unit section 6 having a pair of molding levers 5 that support the lead wire 2 when molding It has a configuration including a section 9.

[0003]

However, in the conventional electronic component insertion device illustrated in FIG. 10, the gap between the insertion guide 4 and the molding lever 5 is set as shown in FIG. 12 which is a detailed view of the insertion unit portion. a is constant, but the electronic component 1 to be inserted
Since the diameter d of the lead wire 2 differs depending on the type, the small diameter molding state and the large diameter molding state are different as shown in FIGS. 13 and 14, respectively. Therefore, when the lead wire diameter d is smaller than the interval a, the lead wire 2 has a substantially "C" shape as shown in FIG. 13, or conversely, when the lead wire diameter d is larger than the interval a, As shown in FIG. 14, the molding shape becomes an “L” shape, and there is a problem that the lead wire 2 is caught between the insertion guide 4 and the molding lever 5.

Further, as shown in FIG. 12, since the distance b between the molding lever 5 and the cutter 3 (3a, 3b) is constant, FIG.
As described above, the bending length L of the lead wire 2 after molding is constant. Here, assuming that the body diameter of the electronic component 1 is D and the thickness of the substrate 7 is T, the lead wire length X that appears under the substrate 7 is X.
Becomes X = L- (D / 2) -T, and the lead wire length X that emerges under the substrate 7 changes depending on the body diameter D and the substrate thickness T. Generally, when inserting an electronic component, the value of X must be secured at a certain value or more (for example, 2 m
Therefore, the body diameter D and the substrate thickness T are restricted.

The present invention solves the above-mentioned conventional problems, and provides an electronic component insertion apparatus in which the same molding state is obtained depending on the type of electronic component and the restrictions on the body diameter and the substrate thickness are minimized. Has an aim.

[0006]

In order to achieve the above-mentioned object, the present invention provides a distance a between the insertion guide and the molding lever,
Alternatively, the distance b between the molding lever and the cutter, or the distance between the insertion guide, the molding lever and the cutter a,
b can be set separately and arbitrarily.

[0007]

According to the present invention, the insertion guide and the molding lever are combined.
Distance a, or a distance b between the molding lever and the cutter, or a distance between the insertion guide, the molding lever and the cutter.
In order to be able to arbitrarily set the intervals a and b between persons,
The same molding state is achieved depending on the type of electronic component, and it becomes possible to automatically insert the electronic component while minimizing the restrictions on the body diameter and the substrate thickness.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. 1 is a front sectional view of an electronic component inserting apparatus according to a first embodiment of the present invention, FIG. 2 is a sectional view taken along line BB of FIG. 1, and FIG. 3 is a detailed view of an inserting unit portion in FIG.

The electronic component inserting apparatus of the present embodiment is an insertion unit for forming the lead wire 2 of the electronic component 1 having the lead wires 2 at both ends in the axial direction into a predetermined shape and then inserting the lead wire 2 in the inserting direction F shown by an arrow. It is composed of a portion 6 and a pitch variable unit portion 9 which is movable in the insertion pitch direction E indicated by the arrow while holding the insertion unit portion 6.

The insertion unit section 6 is an electronic component 1 to be inserted.
Pair of cutters 3 for cutting the lead wire 2 of the specified length to a predetermined length
(3a ... Movable cutter, 3b ... Fixed cutter) and the lead wire 2 for fixing the lead wire 2 of the electronic component 1 in a direction perpendicular to the axial direction of the lead wire 2 and forming it at a predetermined insertion pitch. A pair of pushers 11 having a V-shaped groove 10 (FIG. 2) of the pusher 11 for receiving and pushing the lead wire 2 of the electronic component 1 into the substrate 7 at the time of insertion, and the pusher 11 provided corresponding to the pusher 11, Pusher when molding the lead wire 2
The lead wire 2 is prevented from falling off from the V groove 10 of 11 and can be molded into a predetermined shape, and the lead wire 2 and the pair of molding levers 5 swingable with respect to the pusher 11 are formed. 5, a pair of insertion guides 4 each having a V-shaped groove 12 for guiding the tip end portion of the lead wire 2 that has been bent and formed along the line 5 into a predetermined insertion hole 8 of the substrate 7 are provided.

The pusher 11 and the insertion guide 4 are vertically movable in a guide block in the insertion direction F shown by an arrow.
The molding lever 5 is swingably supported by a guide block 14 (FIG. 2). Also, the insertion guide 4
Is inserted in the horizontal shaft 16 supported by the block 15, the pusher 11 is inserted in the horizontal shaft 18 supported by the block 17, and the pair of these insertion guides 4 and the pusher 11 provided facing each other are , Each block
15, Block 17 is moved up and down in conjunction with lifting. The cutter 3 is fixed to the tip of the insertion guide 4,
It moves up and down at the same time as the insertion guide 4 moves up and down. The molding lever 5 is inserted into a horizontal shaft 20 supported by a block 19, and is rocked in conjunction with the elevation of the block 19.

The variable pitch unit section 9 includes the insertion guide 4
The insert guide side pitch varying section 9A for varying the pitch of the cutter 3 and the pusher 11 and the molding lever side pitch varying section 9B for varying the pitch of the molding lever 5.

The insert guide side pitch varying portion 9A has a pair of carriers 21 moving in the insert pitch direction E while holding the guide block 13 and a screw direction opposite to the left and right from the machine center line MCL. A ball screw 22 that allows each carrier 21 to change the pitch evenly in the left-right direction in the insertion pitch direction E about the machine center line MCL by rotating, and a pulse motor 23 for rotating the ball screw 22 by a predetermined amount. Has been done.

Further, the pitch varying portion 9B on the molding lever side is
A pair of carriers 24 that move in the insertion pitch direction E while holding the guide blocks 14 and a machine center line M
The screw direction is opposite to the left and right from CL, and each carrier 24 is rotated to rotate the machine center line M.
A ball screw 25 that allows the pitch to be evenly changed to the left and right in the insertion pitch direction E centering on CL, and a pulse motor 26 for rotating the ball screw 25 by a predetermined amount.

By the pitch variable unit section 9 having these two pitch variable sections 9A and 9B, the pitch of the insertion guide 4 and the molding lever 5 can be set separately, and the insertion guide 4 and the molding lever 5 can be set as shown in FIG. It is possible to change the interval a of 5.

Next, the operation of the electronic component inserting apparatus shown in FIG. 1 will be concretely described step by step.

(1) Setting the pitch of the insertion guide 4 As shown in FIG. 3, the pitch of the insertion guide 4 is changed by the insertion guide side pitch variable portion 9A shown in FIG. 1 in accordance with the pitch p of the insertion hole 8 of the substrate 7. Adjust in the E direction and set.

(2) Pitch setting of molding lever 5 As shown in FIG. 3, when the diameter of the lead wire 2 of the electronic component 1 to be inserted is d, the distance a between the insertion guide 4 and the molding lever 5 is, for example, a. The pitch of the molding lever 5 is adjusted and set in the direction of arrow E by the molding lever side pitch varying portion 9B shown in FIG.

(3) By lowering the molding block 17 of the lead wire 2, V of the pusher 11 shown in FIG.
The lead wire 2 of the electronic component 1 is held at the same time when the groove 10 descends to a position where it abuts the molding lever 5. Then block
The cutter 3 is lowered by lowering 15 and cuts the lead wire 2 of the electronic component 1 into a predetermined length. Further, the block 15 continues to descend, and descends to a position where the insertion guide 4 contacts the substrate 7, and at the same time, the lead wire 2 is bent and formed along the forming lever 5 by the V groove 12.

(4) When the insertion block 19 of the lead wire 2 to the substrate 7 is raised, the molding lever 5 is swung in a direction away from the pusher 11 and to a position where the downward movement of the pusher 11 is not hindered. After that, the pusher 11 is lowered by lowering the block 17, the lead wire 2 is inserted into the predetermined insertion hole 8 of the substrate 7, and the inserting operation of the electronic component 1 is completed. After that, the blocks 15 and 17 rise, the block 19 descends, and the insertion guide 4, pusher 11, and molding lever 5 return to the original state.

As described above, according to this embodiment, the interval a between the insertion guide 4 and the molding lever 5 is set to the variable pitch unit section 9.
Since the pitch variable parts 9A and 9B can be set separately and independently, the same molding state can be achieved depending on the type of electronic component (difference in lead wire diameter), and stable insertion operation can be realized.

FIG. 4 is a front sectional view of an electronic component inserting apparatus according to a second embodiment of the present invention, FIG. 5 is a sectional view taken along line CC of FIG. 4, and FIG. 6 is a detailed view of an inserting unit portion in FIG. 7
[Fig. 5] is an insertion state diagram in Fig. 4.

Explaining only the points different from the first embodiment shown in FIGS. 1 to 3 and the second embodiment, as shown in FIGS. 4 and 6, the cutter 3 has an insertion direction F indicated by an arrow. It is supported by a guide block 27 so as to be able to move up and down with respect to, and is inserted into a horizontal shaft 29 supported by a block 28, and is moved up and down in conjunction with the elevation of the block 28. The pitch variable unit section 9 has a cutter side pitch variable section 9C, and the cutter side pitch variable section 9C is
A pair of carriers 30 and a machine center line MC that move in the insertion pitch direction E while holding the guide blocks 27.
The screw directions are opposite to the left and right from L, and each carrier 30 is rotated to rotate the machine center line MC.
A ball screw 31 that allows the pitch to be evenly changed to the left and right in the insertion pitch direction E centering on L and a pulse motor 32 that rotates the ball screw 31 by a predetermined amount.

The other structure is the same as that of the first embodiment, and the molding lever 5 and the cutter 3 (3a, 3b) are separated by the pitch variable unit portion 9 having the two pitch variable portions 9A, 9C. It becomes possible to set the pitch to
As shown in FIG. 5, the distance b between the molding lever 5 and the cutter 3 can be changed.

Next, the operation of the electronic component inserting apparatus shown in FIG. 4 will be concretely described step by step.

(1) Setting the pitch of the insertion guide 4 As shown in FIG. 6, the pitch of the insertion guide 4 is adjusted in the direction of arrow E by the pitch changing portion 9A on the insertion guide side according to the pitch p of the insertion hole 8 of the substrate 7. And set. That is, the pitch of the molding lever 5 is also determined.

(2) Pitch setting of cutter 3 As shown in FIG. 7, the body diameter of the electronic component 1 to be inserted is D, the thickness of the substrate 7 is T, and the lead wire length under the substrate 7 is X. Then, the pitch of the cutter 3 is set by the cutter-side pitch varying unit 9C so that b = X + T + (D / 2).

(3) By lowering the molding block 17 of the lead wire 2, the V of the pusher 11 shown in FIG.
The lead wire 2 of the electronic component 1 is held at the same time when the groove 10 descends to a position where it abuts the molding lever 5. Then block
The cutter 3 is lowered by lowering 28, and the lead wire 2 of the electronic component 1 is cut into a predetermined length. Next, when the block 15 descends, the insertion guide 4 descends to a position where it abuts the substrate 7, and at the same time, the lead wire 2 is formed by the V groove 12 into the molding lever 5.
Bend and mold along.

(4) When the insertion block 19 of the lead wire 2 to the substrate 7 is moved upward, the molding lever 5 is swung in a direction away from the pusher 11 and to a position where the downward movement of the pusher 11 is not hindered. After that, the pusher 11 is lowered by lowering the block 17, the lead wire 2 is inserted into the predetermined insertion hole 8 of the substrate 7, and the inserting operation of the electronic component 1 is completed. After that, the blocks 15, 17, 28 rise, and the block 19 descends, and the insertion guide 4, pusher 11, cutter 3, and molding lever 5 return to the original state.

As described above, according to the present embodiment, the interval b between the molding lever 5 and the cutter 3 can be set independently by the pitch changing portions 9A and 9C of the pitch changing unit portion 9, so that It is possible to automatically insert electronic components with minimum restrictions on diameter and substrate thickness.

FIG. 8 is a detailed sectional view of the insertion unit portion in the third embodiment of the present invention, and FIG. 9 is an insertion state diagram in FIG.

This embodiment is a combination of the first and second embodiments, and only the main parts are shown.

Here, the insertion unit section 6 includes an insertion guide 4, a pusher 11, a molding lever 5, and a cutter 3 (3a, 3a).
b), the pitch variable unit section 9 includes an insertion guide side pitch variable section 9A for changing the pitch of the insertion guide 4 and the pusher 11 shown in FIG.
And a molding lever side pitch varying portion 9B for varying the pitch of
It is composed of a cutter-side pitch varying section 9C for varying the pitch of the cutter 3 shown in FIG.

These three pitch changing parts 9A, 9B, 9C
With the variable pitch unit unit 9 having the insertion guide 4
The distance a between the molding lever 5 and the molding lever 5 and the distance b between the molding lever 5 and the cutter 3 can be separately set arbitrarily.

Next, the operation of the electronic component inserting apparatus will be specifically described step by step.

(1) Pitch Setting of Insertion Guide 4 As shown in FIG. 8, the pitch of the insertion guide 4 is set by the insertion guide side pitch varying portion 9A according to the pitch p of the insertion hole 8 of the substrate 7.

(2) Pitch setting of molding lever 5 As shown in FIG. 8, when the diameter of the lead wire 2 of the electronic component 1 to be inserted is d, the distance a between the insertion guide 4 and the molding lever 5 is, for example, a. The pitch of the molding lever 5 is set by the molding lever side pitch varying portion 9B so that the pitch becomes equal to d = 0.2 mm.

(3) Pitch setting of the cutter 3 As shown in FIG. 9, the body diameter of the electronic component 1 to be inserted is D, the thickness of the substrate 7 is T, and the length of the lead wire protruding below the substrate 7 is X. Then, the pitch of the cutter 3 is set by the cutter-side pitch varying unit 9C so that b = X + T + (D / 2).

(4) Molding of the lead wire 2 As in the first and second embodiments, the insertion guide 4, pusher 11, molding lever 5 and cutter 3
The lead wire 2 of the electronic component 1 is formed into a predetermined shape.

(5) Insertion of the lead wire 2 into the substrate 7 As in the first and second embodiments, the pusher is used.
11. The lead wire 2 is inserted into the predetermined insertion hole 8 of the substrate 7 by the molding lever 5, and the insertion operation of the electronic component 1 is completed.
After that, the insertion guide 4, pusher 11, molding lever 5,
The cutter 3 returns to the original state.

As described above, according to the present embodiment, the distance between the insertion guide 4 and the molding lever 5 and the distance between the molding lever 5 and the cutter 3 can be set separately, so that the type of electronic component ( Even if the lead wire diameter is different), the same molding state can be achieved, and stable insertion operation can be realized, and electronic components can be automatically inserted with the restrictions on the body diameter and board thickness minimized.

[0042]

As described above, the electronic component inserting apparatus according to the present invention is provided with a gap between the insertion guide and the forming lever, a gap between the forming lever and the cutter, or an insertion guide, the forming lever and the cutter. Since the intervals of the three can be set independently, the same molding state can be achieved depending on the type of electronic component (difference in lead wire diameter), and the restrictions on body diameter and board thickness can be minimized. It becomes possible to automatically insert parts.

[Brief description of drawings]

FIG. 1 is a front sectional view of an electronic component insertion device according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line BB in FIG.

FIG. 3 is a detailed view of an insertion unit section in FIG.

FIG. 4 is a front sectional view of an electronic component insertion device according to a second embodiment of the present invention.

5 is a cross-sectional view taken along line CC of FIG.

FIG. 6 is a detailed view of the insertion unit portion in FIG.

7 is an insertion state diagram in FIG. 4. FIG.

FIG. 8 is a detailed sectional view of an insertion unit portion according to the third embodiment of the present invention.

9 is an insertion state diagram in FIG.

FIG. 10 is a front sectional view of a conventional electronic component insertion device.

11 is a cross-sectional view taken along the line AA of FIG.

12 is a detailed view of the insertion unit section in FIG.

13 is a view showing a molding state of the insertion unit portion in FIG. 10 when the lead wire diameter is small.

14 is a diagram showing a molding state of the insertion unit portion in FIG. 10 when the lead wire diameter is large.

15 is a diagram showing a state where the lead wire is inserted into the insertion hole of the board in FIG.

[Explanation of symbols]

1 ... Electronic parts, 2 ... Lead wire, 3 ... Cutter (3a ...
Movable cutter, 3b ... Fixed cutter), 4 ... Insertion guide, 5 ... Molding lever, 6 ... Insertion unit part, 7 ...
Substrate, 8 ... Insertion hole, 9 ... Pitch variable unit,
9A ... Insert guide side pitch variable part, 9B ... Molding lever side pitch variable part, 9C ... Cutter side pitch variable part,
10, 12… V groove, 11… Pusher, 13,14,27… Guide block, 15,17,19,28… Block, 16,18,
20, 29 ... Shaft, 21, 24, 30 ... Carrier, 2
2, 25, 31 ... Ball screw, 23, 26, 32 ... Pulse motor, a ... Distance between insertion guide 4 and molding lever 5, b ...
The distance between the molding lever 5 and the movable cutter 3a.

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-2-47900 (JP, A) JP-A-60-245200 (JP, A) JP-A-63-226100 (JP, A) JP-A-49- 68271 (JP, A) JP-A-63-318230 (JP, A) JP-B-49-7936 (JP, B1) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 13/04

Claims (3)

(57) [Claims] 1. A pair of cutters for cutting a lead wire into an appropriate length before molding the lead wire of an electronic component having lead wires at both ends in the axial direction into a predetermined shape, and a predetermined lead wire. And a pair of molding levers that support the lead wire when molding the lead wire into a predetermined shape, and the insertion guide. An electronic component insertion device comprising a pitch variable unit including a pitch variable portion on the insertion guide side and a pitch variable portion on the molding lever side so that the interval between the molding lever and the molding lever can be set separately and arbitrarily. 2. A pair of cutters for cutting a lead wire into an appropriate length before molding the lead wire of an electronic component having lead wires at both ends in the axial direction into a predetermined shape, and a predetermined lead wire. And a pair of molding levers that support the lead wire when molding the lead wire into a predetermined shape, and the molding lever. An electronic component insertion device comprising a pitch variable unit including a pitch variable unit on the molding lever side and a pitch variable unit on the cutter side so that the distance between the cutter and the cutter can be set separately. 3. A pair of cutters for cutting a lead wire to an appropriate length before molding the lead wire of an electronic component having lead wires at both ends in the axial direction into a predetermined shape, and a predetermined lead wire. And a pair of molding levers that support the lead wire when molding the lead wire into a predetermined shape, and the insertion guide. the distance of the shaped lever or the distance between the molding lever and the cutter or the insertion guide and the molding levers and three parties interval insertion guide side as may be set arbitrarily separate of the cutter, and, molding An electronic component inserting device having a pitch changing unit including a pitch changing unit on a lever side and a cutter side.