JPH09139598A - Electronic component insertion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the generation of a gap between groove parts and lead wires by a method wherein the groove parts are formed in the points of pushers, which can pinch the lead wires, the groove parts are formed in a depth of a dimension smaller than the wire diameter of the thinnest lead wire among the lead wires, which are inserted in a board, and the distance between the board and the pushers is adjustable according to the thickness of the lead wires. SOLUTION: The depth of groove parts 32 formed in pushers 11 is set in a dimension equal with the wire diameter of the thinnest lead wire 12A among lead wires. A very small difference H is generated between the heights of the pushers 11 by a difference between the wire diameters of the wire 12A and a lead wire 12B, but the difference H can be adjusted by moving up and down the position of the fulcrum of an arm 23 by a very small amount by rotating an eccentric axis 43 by a rotationally driving part 44. By manufacturing an electronic component insertion device into such a constitution, when lead wires 12 are inserted between the pushers 1 and a receiving lever 14 and are shaped, the generation of a gap can be prevented between the groove parts 32 formed in the pushers 11 and the lead wires 12A and 12B also in the case where the lead wire 12 is thin 12A and also in the case where the lead wire 12 is thick 12B.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inserting apparatus for mounting an electronic component having a lead wire in an axial direction on a printed circuit board.

[0002]

5 to 9 show a conventional electronic component inserting apparatus of this type. Where 11 is a pair of pushers,
Corresponding to the electronic component 13 having the pair of lead wires 12 in the axial direction, they are provided at a distance from each other. As shown in FIG. 5, the lead wire 12 is sandwiched between the pusher 11 and the receiving lever 14 so that the electronic component 13 is held in the horizontal direction.

That is, in FIG. 5, when the electronic component 13 is delivered to the insertion device as shown by a, a pair of pushers 11 described above and a pair of insertion guides 15 arranged outside the pushers 11 are provided. The pair of movable blades 16 arranged outside the insertion guides 15 are lowered so as to approach the printed circuit board arranged below. Then, as shown in b, when the pusher 11 and the receiving lever 14 sandwich and hold the lead wire 12, the pusher 11 stops descending. However, the movable blade 16 further descends, and as shown in c, the movable blade 16
And the fixed blade 17 provided corresponding to these movable blades 16 cut the lead wire 12 to a required length. afterwards,
When the insertion guide 15 descends and hits the lead wire 12 as shown in d, the molding of the lead wire 12 is started. When the forming of bending the lead wire 12 downward at right angles is completed as shown in e, the receiving lever 14 retracts backward, that is, in the direction perpendicular to the paper surface in FIG. Then, the pusher 11 starts descending again together with the insertion guide 15. Thereafter, the insertion guide 15 stops descending when it reaches the position of the printed circuit board 18, and then the pusher 11 stops descending at a height corresponding to the electronic component 13 to reach the state shown in f. At this time, the pusher 11 inserts the lead wire 12 bent downward into the hole 19 of the printed board 18 and holds the lead wire 12 between the lead wire 12 and the printed board 18. Finally, as shown in g, the lead wire 12 protruding from the printed circuit board 18 is held on the back side of the printed circuit board 18 while the lead wire 12 is held by the pusher 11 to hold the electronic component 13.
The lead wire 12 is crimped by bending the portion of the lead wire with the crimping lever 20.

FIG. 6 shows a drive mechanism of the pusher 11.
The pair of pushers 11 are vertically sliders 21
These sliders 21 are connected to the lower end of one shaft 22 in the vertical direction. Reference numeral 23 is a horizontal arm, and the arm 23 is vertically swingable around a horizontal fixed shaft 24 supporting the central portion thereof. One end of this arm 23 is connected to the shaft 22 via a spring 25 and a fixed collar 26. Also arm
The other end of 23 is interlocked with a drive cam 27 for swinging the arm 23 up and down.

Therefore, when the other end of the arm 23 is swung upward by the drive cam 27, the one end is swung correspondingly, whereby the pusher pushes the pusher as described above.
11 will be lowered. The slider 21 is configured to slide up and down while being guided by an appropriate guide member (not shown).

A block 28 having a rectangular frame shape is attached to the upper end portion of the shaft 22, and an inclined surface 29 is formed on the inner surface of the upper portion of the frame of the block 28. And block
In the frame of 28, a wedge member 30 having an upper surface inclined corresponding to the inclined surface 29 is arranged. This wedge member 29
Is driven by the drive unit 31 to move in and out,
The height of the descending end of 11 is set.

As shown in FIG. 6 and FIG. 7, a groove portion 32 opening downward is formed at the lower end of each pusher 11, and the lead wire 12 can be held in this groove portion 32. Further, FIG. 7 shows a lead wire 12 having the smallest wire diameter and a lead wire 12B having the largest wire diameter among the lead wires 12 inserted into the holes 19 of the printed circuit board 18 by the pusher 11. The depth D of the groove 32 is set to be equal to the maximum lead wire diameter 12B.

[0008]

As described above, the lead wire is
The depth D of the groove 32 of the pusher 11 is adjusted to the maximum lead wire diameter 12B in order to accommodate different wire diameters at the time of bending and forming 12. But then,
In the case of the lead wire 12B having the largest wire diameter as shown in (b), the lead wire 12B is accommodated in the groove portion 32 without excess or deficiency, but as shown in FIG. Groove 32
If the depth is smaller than the depth D, the groove 32 and the printed circuit board
A gap 33 is formed between the lead wire 12 on 18 and the lead wire 12.

When such a gap 33 is formed, FIG. 9 (a)
Connect the lead wire with the pusher 11 and the receiving lever 14 as shown in
When the lead wire 15 is bent and formed by the insertion guide 15 by sandwiching the lead wire 12, the lead wire 12 is curved so that the main body portion of the electronic component 13 is displaced upward as shown in the figure. There is a problem that a force is applied to the portion and the molded shape of the lead wire 12 becomes inaccurate.

Further, due to the improper shape of the lead wire 12, the pusher 11 can be used even when the lead wire is caulked after being inserted into the printed circuit board 18 shown in FIG. 9B.
There is a problem that a gap 34 is formed between the groove portion and the lead wire 12 and the caulking state becomes insufficient.

In view of the above problems, the present invention eliminates the gap between the groove of the pusher and the lead wire at the time of molding the lead wire, reduces the force acting on the main body of the electronic component, and has an accurate molding shape and caulking. The purpose is to realize the state and.

[0012]

In order to solve the above problems, a lead wire of an electronic component is formed into a predetermined shape and inserted into a hole of a printed circuit board, and the side opposite to the insertion direction of the printed circuit board. The electronic component insertion device based on the present invention, in which the lead wire is crimped at the portion of, is capable of inserting the lead wire of the electronic component into the hole of the printed circuit board, and at the same time as the printed circuit board on the surface of the printed circuit board. And a groove portion formed at the tip of the pusher for sandwiching the lead wire, the groove portion being the most of the lead wires inserted into the printed circuit board. A means for moving the pusher in the direction of approaching the printed circuit board and a lead wire being sandwiched by the pusher, which is formed to a depth equal to or smaller than the diameter of the thin wire. When it is obtained by the distance to the pusher configured to have an adjustable means in accordance with the thickness of the lead wire from the printed circuit board.

According to this structure, since the groove portion of the pusher is formed to a depth equal to or smaller than the diameter of the thinnest lead wire to be inserted into the printed circuit board, the pusher groove is formed at the time of molding the lead wire. There is no gap between the groove and the lead wire. Therefore, the force acting on the electronic component main body portion at the time of this molding is reduced, and an accurate molding shape and caulking state are realized.

[0014]

1 to 4 illustrate an example of an electronic component inserting apparatus according to the present invention and its operation. The same members as those shown in FIGS. 5 to 9 are designated by the same reference numerals.

As shown in FIG. 1, the block as shown in FIG. 6 is not provided at the upper end of the shaft 22, and the upper end of the shaft 22 is connected to one end of the arm 23. The central portion of the arm 23 is supported by an eccentric shaft 43 that is integrally rotatable with a horizontal rotation shaft 42 supported by a bracket 41. These rotary shaft 42 and eccentric shaft 43
Are configured to be rotated by the rotation driving unit 44. Further, as shown in FIG. 2, the depth D of the groove portion 32 of the pusher 11 is set to be equal to the wire diameter of the thinnest lead wire 12A.

According to this structure, when the lead wire 12 is sandwiched between the pusher 11 and the receiving lever 14 as shown in FIG. 3 to form the lead wire 12, a thin lead wire as shown in FIG. Whether it is the wire 12A or the thick lead wire 12B as shown in FIG.
There is an advantage that no gap is generated between the groove portion 32 of 11 and the lead wires 12A and 12B.

As shown in FIG. 3, the lead wires 12A, 12
A slight difference in the height of the pusher 11 due to the difference in the wire diameter of B
However, this pusher height difference H is
It can be adjusted by rotating the eccentric shaft 43 at 44 so that the position of the fulcrum of the arm 23 is moved up and down by a very small amount.
FIG. 4A shows a state of forming the lead wire 12 as described above. As shown in the figure, the lead wire 12 of the electronic component 13 can be securely pressed by the pusher 11, the load is not applied to the main body of the electronic component 13, and the molding shape of the lead wire 12 is also accurate. .

Further, as shown in FIG. 4B, the same drive mechanism can be used to set the height of the pusher 11 when the lead wire 12 is caulked after being inserted into the printed circuit board 18. , In this case also pusher 11
A gap is prevented from being formed between the groove portion 32 and the lead wire 12. Therefore, the caulking operation can be reliably performed.

[0019]

As described above, according to the present invention, the groove formed at the tip of the pusher for holding the lead wire has the depth equal to or smaller than the diameter of the thinnest of the lead wires inserted into the printed circuit board. Since the pusher holds the lead wire, the distance from the printed circuit board to the pusher can be adjusted according to the thickness of the lead wire. It is possible to prevent a gap from being formed between the lead wire and the lead wire. Therefore, it is possible to reduce the force acting on the main body portion of the electronic component, and at the same time, it is possible to realize an accurate molded shape and a crimped state.

[Brief description of the drawings]

FIG. 1 is a three-dimensional view of a main part of an electronic component insertion device according to the present invention.

FIG. 2 is a view showing a tip portion of a pusher in the same device.

FIG. 3 is a diagram illustrating the operation of the pusher.

FIG. 4 is a diagram illustrating an effect based on the operation of the pusher.

FIG. 5 is an operation explanatory view of a conventional electronic component insertion device.

FIG. 6 is a three-dimensional view of a main part of a conventional electronic component insertion device.

FIG. 7 is a diagram showing a tip end portion of a pusher in the apparatus of FIG.

FIG. 8 is a view for explaining the operation of the pusher.

FIG. 9 is a view for explaining the action based on the operation of the pusher.

[Explanation of symbols]

 11 Pusher 12 Lead wire 13 Electronic component 18 Printed circuit board 19 Hole 23 Arm 32 Groove 43 Eccentric shaft

Claims (2)

[Claims] 1. An electronic component in which a lead wire of an electronic component is formed into a predetermined shape and is inserted into a hole of a printed circuit board, and the lead wire is caulked at a portion of the printed circuit board opposite to the insertion direction. An insertion device, which is capable of inserting a lead wire of the electronic component into a hole of a printed circuit board, and a pusher capable of holding the lead wire between the printed circuit board and the surface of the printed circuit board,
And a groove portion formed at the tip of the pusher for holding the lead wire, the groove portion having a depth equal to or smaller than the diameter of the thinnest of the lead wires to be inserted into the printed circuit board. A means for moving the pusher in a direction approaching the printed circuit board, and a means for adjusting the distance from the printed circuit board to the pusher when the pusher clamps the lead wire according to the thickness of the lead wire. An electronic component insertion device characterized by the above. 2. The pusher is configured to be moved in a direction approaching the printed circuit board by being connected to an arm swinging around a fulcrum, and the fulcrum supports the arm by an eccentric shaft. The electronic component according to claim 1, wherein the eccentric shaft is rotationally driven to adjust the distance from the printed circuit board to the pusher when the pusher clamps the lead wire. Insertion device.