JP4350537B2 - Component insertion device, surface mounter and component testing device - Google Patents

Description

  The present invention relates to a component insertion apparatus for inserting a so-called DIP component into a printed circuit board or a socket, and also relates to a surface mounter and a component test apparatus equipped with this component insertion apparatus.

  2. Description of the Related Art Conventionally, there has been a surface mounter that is provided with a head unit mounted with a mounting head so as to be movable on an XY plane, and by which electronic components are transported and mounted on a printed circuit board from a component supply unit. Generally known.

Among components mounted on a printed circuit board, package components called DIP (Dual In-line Package) and S (shrink) -DIP (hereinafter referred to as “DIP”) having lead rows on both sides of the package
This type of DIP component is mounted on a printed circuit board by inserting a lead into a through hole (lead insertion hole) and soldering it by a flow solder method or the like.

  In a surface mounter for mounting DIP parts, a chuck-type mounting head is mounted on the head unit. During mounting operation, the DIP parts are gripped from the outside of the lead row by the claws of the mounting head and the leads are shaped. It is comprised so that components may be conveyed by. That is, the DIP component is opened in a “C” shape so that the distance between the lead row tips is slightly wider than the distance between the through holes. Therefore, by transporting the leads in an elastically deformed state so that the distance between the lead row tips matches the distance between the through holes, each lead can be securely inserted into the through holes during mounting. After the insertion, the DIP component is prevented from falling off the printed circuit board by utilizing the spring back of the lead.

  This type of surface mounter is required to support high-density mounting, and the following problems arise when mounting DIP components. That is, in the above-described conventional configuration in which the DIP component is mechanically gripped and conveyed by the chuck, a clearance for opening and closing the chuck is required around the mounting position of the DIP component, so that it is difficult to meet the demand for high-density mounting. Become. Therefore, in recent years, DIP parts have been transported using a negative pressure adsorption type mounting head that does not require a clearance for opening and closing the chuck. However, in a negative pressure adsorption type mounting head, the chuck type Since it is impossible to elastically deform the leads like the mounting heads of the above, it is necessary to transport the DIP parts after plastically deforming the leads in advance so that the distance between the lead rows and the distance between the through holes coincide. As a result, there is a kind of adverse effect that a forming apparatus for plastically deforming the lead and a process for performing the work are separately required. Further, since the mounted DIP component cannot be held using the spring back of the lead, the DIP component may fall off the printed circuit board before soldering.

  Therefore, it is desirable to be able to meet the demand for high-density mounting without causing such an adverse effect when mounting DIP components.

  In addition to the surface mounter as described above, for example, the DIP component is transported to the test apparatus while being negatively adsorbed by the mounting head, and the DIP component is mounted on a socket provided in the test apparatus, and various types are mounted. A so-called component testing device for performing a test is known. However, even in this type of device, it is necessary to insert a DIP component into a socket after plastically deforming a lead using a forming device in advance. If the work can be omitted, the apparatus can be simplified and the cost can be reduced, and the DIP parts can be tested quickly.

  The present invention has been made in view of the above circumstances. For example, in a device such as a surface mounter or a component testing apparatus, it is possible to take out and insert a DIP component in a narrow place, and to connect a lead in advance. It is intended to enable automatic insertion into a printed circuit board or socket without plastic deformation, and to effectively prevent dropping of DIP parts after insertion.

  The present invention has been made to solve the above-described problems, and has a DIP component head capable of holding a DIP component having lead rows on two opposite side surfaces of a package, and is provided movably. A component insertion device comprising: a head unit; and a control means for driving and controlling the head unit so that the DIP component is taken out from the component supply position by the DIP component head, transported to the target position, and inserted. The DIP component head has a head main body that is driven back and forth with respect to the head unit, and a DIP component holding tool provided at the tip of the head main body, and the holding tool includes the head main body. A pair of holding plates arranged in a state of being opposed to each other in a direction orthogonal to the advancing / retreating direction and having a fixed interval, and provided between the holding plates to advance the head body. And a pair of holding plates that are driven to move back and forth in the same direction, and when the DIP component is inserted between the holding plates, each lead bends and the distance between at least the tip portions of each lead row is the above-mentioned purpose. The spacing is set so that the DIP component is held between the two holding plates by the elastic force of the lead due to bending, and the pushing member has a space in which the DIP component can be inserted. The retracting position formed between the two holding plates and the operation position for moving forward from this position and pushing out the DIP parts held in the space from between the two holding plates are configured to be able to advance and retract, and the control means includes When holding the DIP component from the component supply position, the pusher member is disposed at the retracted position and the DIP component is held from the package side. When the DIP component head is controlled so that the lead row is completely inserted between the holding plates in the thickness direction of the package, and the DIP component is inserted into the target position. After the holding tool is disposed at a position where the two holding plates abut on or close to the upper surface of the target position, the DIP component is pushed out between the two holding plates only by driving the pushing member. It is comprised so that it may insert in a position (Claim 1).

  According to this component insertion apparatus, the DIP component is taken out from the component supply unit by the head unit and appropriately inserted into a target position such as a printed circuit board. Specifically, after the head unit is moved and the head is arranged at a position corresponding to the DIP component at the component supply position, the head main body is advanced to move the DIP component from the package side between the holding plates of the holding tool. Insert it. As a result, the lead of each lead row bends inward, and specifically, the holding tool is bent by its elastic force by bending so that the interval between the tip portions of each lead row corresponds to the lead insertion hole at the target position. The DIP parts are held between the two holding plates. In this state, the head main body moves backward to take out the DIP component from the component supply position. At this time, the pushing member is set at the retracted position. And after a head unit moves and a head is arrange | positioned on the target position, an extrusion member advances and displaces to an operation position. At this time, as described above, each lead row tip of the DIP component is bent at an interval corresponding to the lead insertion hole between the two holding plates, so that each lead is inserted into the lead insertion hole as the DIP component is pushed out between the two holding plates. As a result, the DIP part is inserted into the target position. After the insertion, the DIP component is held at the target position by the spring back of each lead.

  In this component insertion device, a holding tool is configured to be detachable from the head main body, and a plurality of types in which at least one of the interval between the holding plates, the width of the holding plate, and the tip shape of the push member is different It is preferable that one tool selected from the holding tools is attached to the head body.

According to this configuration, it is possible to cope with a plurality of types of DIP parts by exchanging the holding tool as necessary. In this case, for example, the head main body is provided with a power transmission member that is driven to move back and forth in the same direction as the head main body, while the holding tool is provided with a biasing means that biases the push-out member backward. In a state where the holding tool is mounted on the head main body and the power transmission member is retracted, the pushing member can be held at the retracted position by the biasing force of the biasing means. 3). According to this configuration, when the power transmission member on the head main body side is driven forward, the pushing member of the holding tool is pushed forward by this, and conversely, when the power transmission member is driven backward, the pushing is performed by the biasing force of the biasing means. The member will retreat. Therefore, it is possible to drive the pushing member with a relatively simple configuration while having a configuration in which the holding tool can be replaced as described above.

In the component insertion device as described above, further comprising detecting means for detecting the presence or absence of said extruded member in the operative position, interpolation DIP component on the basis of the detection result by the detecting means and the driving state of the extrusion member It is preferable to include a determination unit that determines whether or not the wear is good (claim 4).

  According to this configuration, it is possible to detect an insertion failure of the DIP component. For example, a DIP part having a bent lead is incompletely inserted because the pitch between leads is not uniform. In this case, even if the pushing member is in the forward drive state, the pushing member is actually in the operating position. In such a case, the determination means determines that the insertion is poor.

  In addition to the DIP component head, it is more preferable that a component suction head for holding the component by negative pressure suction is mounted on the head unit.

  According to this configuration, a component having no lead other than the DIP component can be sucked, conveyed and mounted by the component suction head, thereby improving the functionality of the component insertion device. Can do.

  On the other hand, the surface mounter of the present invention is a surface mounter that transports a component supplied in a component supply unit onto a substrate positioned at a mounting work position and mounts the component at a predetermined position on the substrate. The component insertion device according to any one of claims 1 to 5 is provided as means for transporting and mounting a component on a substrate (claim 6).

  According to this surface mounter, when the mounted component is a DIP component, the DIP component is taken out from the component supply unit and the DIP component is mounted on the component board in accordance with the above-described operation by the DIP component head. Done. Accordingly, the DIP component can be transported from the component supply unit onto the substrate and properly inserted, and after the insertion, it is possible to prevent the DIP component from falling off the substrate by the spring back action of the lead.

  The component testing apparatus according to the present invention is a component testing apparatus for carrying out various tests by conveying a component supplied in a component supplying unit to a testing unit, and conveying and setting the component from the component supplying unit to the testing unit. The component insertion device according to any one of claims 1 to 5 is provided (claim 7).

  According to this component testing apparatus, when the test target component is a DIP component, the DIP component is taken out from the component supply unit and the DIP component is set in the socket of the test device as described above by the DIP component head. Is performed according to various operations. Therefore, the DIP component can be conveyed from the component supply unit to the test apparatus and various tests can be appropriately performed, and the DIP component can be reliably prevented from falling off from the socket or the like.

In the component insertion device according to claims 1 to 5, as described above, the DIP component is inserted between the pair of holding plates, and the DIP component is held and conveyed by the elastic force due to the bending of the lead at that time. At the time of insertion to the target position, the DIP component is pushed out between the two holding plates by the pushing member provided between the two holding plates and is inserted into the target position. A wide clearance is not required around the DIP parts, and leads are shaped in advance using a forming device (before conveyance so that the interval between the lead rows corresponds to the lead insertion hole at the target position). There is no need to plastically deform each lead. Moreover, after the insertion to the target position, the lead springs back to prevent the DIP component from dropping from the target position.

  Therefore, it is possible to properly take out and insert the DIP component even in a narrow place, and it is possible to automatically insert the lead into the board or socket without plastic deformation in advance, and the DIP component after insertion Can be effectively prevented from falling off.

  Further, according to the surface mounting machine according to claim 6 and the component testing apparatus according to claim 7, since the component inserting apparatus as described above is provided, the above-described mounting operation or component testing operation is performed in the above-described manner. Such effects can be obtained.

  The best embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 schematically shows a surface mounter according to the present invention (a surface mounter to which a component inserting device according to the present invention is applied). As shown in the figure, on a base 1 of a surface mounter (hereinafter abbreviated as a mounter), a printed board transporting conveyor 2 is arranged, and the printed circuit board 3 is transported on the conveyor 2 to a predetermined level. It stops at the mounting work position.

  A component supply unit 4 is disposed on one side of the conveyor 2. The component supply unit 4 is provided with a plurality of rows of tape feeders 4a and stick feeders 4b.

  Each tape feeder 4a is configured such that small chip components such as transistors and capacitors are accommodated at predetermined intervals, and the held tape is led out from the reel and guided to the component extraction position, which will be described later. As the components are taken out by the head unit 6, the tape is intermittently fed out.

  On the other hand, each stick feeder 4b is configured to hold a stick containing DIP parts such as DIP-ICs in a row in an inclined posture and guide the parts to the part extraction position along the stick. Thus, the DIP parts are sequentially supplied to the part take-out position by their own weight as the parts are taken out. Each stick feeder 4b is configured to supply the DIP component to the component extraction position, for example, with the leads aligned in the X-axis direction.

  Above the base 1, a head unit 6 for component mounting is provided. The head unit 6 is movable over the component supply unit 4 and the printed circuit board 3 positioned at the mounting work position, and is in the X-axis direction (direction parallel to the conveyor 2) and the Y-axis direction (perpendicular to the conveyor 2). Direction).

That is, on the base 1, a pair of fixed rods 7 extending in the Y-axis direction, and a pair of ball screw shafts 8 provided along the fixed rods 7 and driven to rotate by a Y-axis servo motor 9, respectively. The head unit support member 11 is movably supported by the rod 7 in a state of straddling both the fixed rods 7, and a pair of nut portions 12 provided on the support member 11 are respectively connected to the ball screw shaft 8. Are screwed together. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 6 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of both Y-axis servo motors 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. It has become.

  A plurality of mounting heads are mounted on the head unit 6. In the present embodiment, five mounting heads that are elongated in the vertical direction are mounted. Specifically, three first heads 20 for mounting small chip parts mainly supplied by the tape feeder 4a and two second heads for mounting DIP parts supplied by the stick feeder 4b. The heads 21 are arranged in a line in the X-axis direction.

  Although not shown, the first head 20 is a type of head (component suction head) that has a suction nozzle at the tip (lower end) and holds the chip component by negative pressure suction using the suction nozzle. On the other hand, as shown in FIG. 2, the second head 21 has a holding tool 23 (hereinafter abbreviated as a tool 23) at the tip (lower end), and a DIP component between a pair of holding plates 25 provided on the tool 23. This is a head (DIP component head) that is held by inserting the.

  The heads 20 and 21 are supported so as to be able to move (elevate) in the Z-axis direction and rotate around the R-axis (center axis) with respect to the frame 6a of the head unit 6, and ascend / descend drive using a servo motor as a drive source. It is adapted to be driven by means and rotational drive means.

  Specifically, the second head 21 will be described as an example. As shown in FIG. 2, the second head 21 is detachably attached to a shaft member 22 (head body) extending in the vertical direction and a tip (lower end) thereof. The tool 23 is supported by the frame 6 a of the head unit 6 via a support member 40. The support member 40 is rotatably supported by the frame 6 a via a bearing 42, and a gear 41 is integrally provided at an upper portion thereof, and the shaft member 22 is inserted into the support member 40. The shaft member 22 can move relative to the support member 40 in the axial direction (Z-axis direction), and cannot be rotated relative to the support member 40 (rotation around the R axis). With this configuration, the second head 21 is supported with respect to the head unit 6 in a state in which the second head 21 can move (elevate) in the Z-axis direction and rotate around the R-axis (center axis).

  The frame 6a is provided with a movable frame 44 that is movable along a fixed rail 45 in the vertical direction, and the upper end portion of the shaft member 22 is fixed to the movable frame 44 via a holder 43. A ball screw shaft 47 driven by a Z-axis servomotor 46 is provided on the frame 6 a in parallel with the shaft member 22, and the movable frame 44 is screwed to the ball screw shaft 47 via a nut member 48. . The frame 6 a is provided with an R-axis servomotor 50 and a drive gear 52 that is driven to rotate by this, and this gear 52 meshes with the gear 41 of the support member 40. That is, the movable frame 44 and the shaft member 22 (second head 21) fixed to the movable frame 44 are moved integrally in the Z-axis direction by the operation of the Z-axis servomotor 46, while the support member is driven by the operation of the R-axis servomotor 50. 40 and the shaft member 22 (second head 21) are integrally rotated around the R axis. In addition, although illustration is abbreviate | omitted, the raising / lowering drive means and rotation drive means of the 1st head 20 are also the structures similar to the above.

  The suction nozzle (not shown) of the first head 20 is well known in this type of mounting machine and has a shape suitable for suction of chip components supplied by the tape feeder 4a.

On the other hand, the tool 23 of the second head 21 has a cylindrical tool body 32 as shown in FIG.
A pair of holding plates 34 for holding the DIP component is provided at the tip (lower end) thereof. These holding plates 34 are assembled to the tool body 32 in a state parallel to the ascending / descending direction (Z-axis direction) of the second head 21 and facing the Y-axis direction. The holding plates 34 are fixed at intervals. Specifically, the holding plate 34 is slightly wider than the package width of a DIP component of a specific size (the length in the direction perpendicular to the direction in which the leads are arranged), and between the holding plates 34. When a DIP part of a specific size is inserted, the lead of each lead row of the DIP part opened in the shape of “C” bends inward, and the distance between the lead rows corresponds to the through hole (lead insertion hole) of the printed circuit board 3 The distance between the holding plates 34 is set so that the DIP component is held between the holding plates 34 by the elastic force generated by the bending of the lead. Note that the width of each holding plate 34 (the length in the direction perpendicular to the paper surface in FIG. 3) is set to be equal to or slightly larger than the length of the DIP component of the specific size (the dimension in the lead arrangement direction). ing. Tapers 34a are respectively formed at the front ends of the opposing surfaces of the holding plates 34 so that the DIP parts can be smoothly inserted between the holding plates 34 from the package side.

  Between both holding plates 34 of the tool 23, a pusher 36 (extrusion member) for extruding DIP parts is further provided. The pusher 36 is a shaft-like member provided between the holding plates 34 and extending in the vertical direction. The pusher 36 penetrates the tool main body 32 in the vertical direction and is supported by the tool main body 32 so as to be displaceable in the axial direction. As shown in the figure, the pusher 36 is formed with a flange 36 a at the upper end portion, and an E-ring 37 is attached to the lower portion of the tool main body 32, thereby preventing the pusher 36 from coming off from the tool main body 32. A compression spring 38 is inserted between the flange 36 a and the upper end surface of the tool main body 32, and the elastic force (biasing force) of the compression spring 38 is applied to the tool main body 32. The pusher 36 is biased upward.

  As shown by the solid line in FIG. 3, the pusher 36 is located between the holding plates 34 and a retracted position where an insertion space for the DIP parts is formed at the tip (lower end) portion, and an operating position (same as the same). (Position indicated by a one-dot chain line in the figure) is provided so as to be able to move up and down (advance and retreat), and is driven by driving means using an air cylinder as a driving source.

  The driving means will be described in detail with reference to FIGS. 2 and 3. The shaft member 22 has a double shaft structure having an operating shaft 27 (power transmission member) that can be displaced in the axial direction. is doing. The front end (lower end) of the operating shaft 27 faces the pusher 36, while the rear end (upper end) of the operating shaft 27 protrudes upward from the shaft member 22 and is fixed downward to the frame 6a. It is connected to the tip of the rod 30a of the cylinder 30. A flange member 28 is further fixed to the upper end portion of the operating shaft 27, and a compression spring 29 is inserted into a portion between the flange member 28 and the holder 43. Thus, the operating shaft 27 is urged upward with respect to the shaft member 22. That is, when the air cylinder 30 is in the operation stop state, the operating shaft 27 is pushed up by the elastic force of the compression spring 29 and held in the raised (retracted) position, while the pusher 36 of the tool 23 is also in the compression spring 38. The pusher 36 is pushed up by the elastic force, and as a result, the pusher 36 is held at the retracted position in contact with the operating shaft 27 from below (see FIG. 3). When the air cylinder 30 is switched to the operating state (rod protruding drive state), the operating shaft 27 is pushed down to the lowering (forward) position against the resilient force of the compression spring 29 and the pusher 36 is moved accordingly. It is pushed down by the operating shaft 27 against the elastic force of the compression spring 38, and as a result, the pusher 36 is displaced to the operating position.

Note that a movable plate 62 (see FIG. 2) that is displaced in the Z-axis direction integrally with the operating shaft 27 is externally fitted to the shaft member 22 above the tool 23 in the second head 21. The movable plate 62 is for detecting a mounting error of the DIP component. As will be described in detail later, the mounting plate 62 is detected based on a change in the detection state of the sensor 60 described later due to the displacement of the plate 62. It has become.

  The tool 23 of the second head 21 is configured to be attachable to and detachable from the head main body 22 and is exchanged with a tool 23 having a different interval and width of the holding plate 34 as necessary. That is, as shown in FIG. 4, a mounting recess 24 that opens downward for mounting the tool 23 is formed at the tip of the shaft member 22, and the tool body 32 is inserted into the recess 24 to insert the tool body 32 into the tool. 23 is configured to be attached to the shaft member 22.

  On the side wall of the mounting recess 24, there is provided a positioning rigid sphere 25 that is elastically displaceable in a direction orthogonal to the shaft member 22 by the elastic force of the compression spring 26. As described above, the tool When the main body 32 is inserted into the mounting recess 24, the hard sphere 25 is fitted and pressed into a recess 32 a formed on the peripheral surface of the tool main body 32, and as a result, the tool 23 is held at the lower end of the shaft member 22. . When a downward external force is applied to the tool 23 mounted on the shaft member 22 in this way, the tool body 32 is pulled from the mounting recess 24 while the rigid ball 25 is pushed back against the elastic force of the compression spring 26. As a result, the tool 23 is removed from the shaft member 22. As shown in FIG. 5, a notch 34b is formed at one end in the width direction of each holding plate 34. When the tool is attached or detached, a shutter member 75 of a tool stocker 72, which will be described later, is provided with this notch 34b. The tool 23 is constrained by being inserted into.

  Here, the tool 23 of the second head 21 has been described. However, the suction nozzle of the first head 20 is also configured to be detachable from the shaft member 22, and the suction nozzle having a different nozzle tip shape or the like as necessary. It is to be exchanged with. Further, the structure for detaching the suction nozzle from the shaft member 22 is configured in the same manner as the tool 23, and the suction nozzle is inserted into the mounting recess of the shaft member 22 and is provided on the inner wall surface of the mounting recess so as to be elastically displaceable. The hard sphere is configured to be fitted to the suction nozzle. Since the first head 20 does not need to drive the tool 23 (pusher 36) unlike the second head 21, the operating shaft 27, the air cylinder 30 and the like are not provided.

  As shown in FIG. 1, the head unit 6 is further provided with a board recognition camera 19 for recognizing an image of the printed board 3 positioned at the mounting work position, and detection means for detecting the position of the pusher 36. Is provided.

  The substrate recognition camera 19 images a fiducial mark written on the printed circuit board 3, and is composed of, for example, a camera provided with a CCD area sensor, and is attached downward to the frame 6a.

  The detecting means indirectly detects whether or not the pusher 36 is displaced to the operating position when the air cylinder 30 is in an operating state, and is provided corresponding to the second head 21. Yes.

  2 and 7, the head unit 6 includes a shaft member 55 (hereinafter referred to as a sensor supporting shaft member 55) corresponding to each second head 21 in addition to the shaft member 22 and parallel to the shaft member 22. , Referred to as sensor shaft 55). The sensor shaft 55 is supported by the frame 6a so as to be movable in the Z-axis direction via a support member 56 while penetrating the frame 6a in the vertical direction, and an upper end portion is fixed to the movable frame 44. ing. As a result, the sensor shaft 55 moves in the Z-axis direction integrally with the shaft member 22 via the movable frame 44.

  A sensor unit 57 and a connecting member 64 are sequentially provided from the distal end side at the distal end (lower end) portion of the sensor shaft 55.

  The sensor unit 57 is fixed to the sensor shaft 55 and includes a detection piece 58 and a sensor 60 such as a reflective photosensor capable of detecting the detection piece 58. As shown in FIG. 7, the detection piece 58 is a vertically elongated member having a U-shaped connecting portion 58 a at the upper end and a detected portion 58 b at the lower end, and swings through the fulcrum shaft 59. The weight balance is set so that it can be supported and swings counterclockwise (counterclockwise in FIG. 5), and the sensor 60 is provided so as to detect the detected portion 58b of the detection piece 58. ing.

  On the other hand, the connecting member 64 is provided so as to be movable in the Z-axis direction along the sensor shaft 55 and is integrally connected to the movable plate 62 of the second head 21. The connection member 64 is provided with an engagement piece 65 protruding in a direction orthogonal to the sensor shaft 55, and the engagement piece 65 is inserted into the connection portion 58 a of the detection piece 58.

  In a state where the air cylinder 30 is stopped and the operating shaft 27 is held at the raised position (a state where the pusher 36 is at the retracted position), the movable plate 62 and the engagement piece 65 are used to As shown by the solid line in FIG. 7, the detection piece 58 is held in a substantially upright posture, whereby the detected portion 58b faces the sensor 60 and the sensor 60 is in the detection state, while the air cylinder 30 is in the operating state. When switched and the operating shaft 27 is pushed down to the lowered position (when the pusher 36 moves forward to the operating position), the engagement piece 65 is lowered integrally with the movable plate 62. As a result, the two-dot chain line in FIG. Thus, the detection piece 58 is swung counterclockwise so that the detected portion 58b is just removed from the sensor 60 and the sensor 60 is in a non-detection state.

  That is, the sensor 60 is configured to be in a non-detection state only when the operating shaft 27 is completely displaced to the lowered position (only when the pusher 36 is completely displaced to the operating position). If the pusher 36 is not completely moved to the operating position when it is in an incompletely mounted state, the operating shaft 27 is also incompletely lowered, and as a result, the detected portion 58b is detected by the sensor 60. Will be maintained. Therefore, the operation state of the air cylinder 30 and the detection state of the sensor 60 are compared. When the sensor 60 is in the detection state even though the air cylinder 30 is in the operation state, an insertion error has occurred in the DIP component. Can be determined. Note that such an insertion error determination is performed in a control device described later. That is, in this embodiment, this control device functions as the determination means of the present invention.

  Returning to FIG. 1, on the opposite side of the component supply unit 4 on the base 1 with the conveyor 2 interposed therebetween, a component recognition unit 74 for further imaging the component adsorbed by the first head 20; A nozzle stocker 70 for holding the replacement suction nozzle and a tool stocker 72 for holding the replacement tool 23 are also arranged.

  The component recognition unit 74 includes, for example, three types of cameras and illumination devices each having a CCD line sensor with different resolutions and angles of view, and the head unit 6 moves on the component recognition unit 74 to change the first. A part adsorbed to one head 20 is imaged from below by a camera suitable for the type of the part.

Although not shown in detail, the tool stocker 72 has a plurality of storage holes arranged in a line in the X-axis direction, and holds the replacement tool 23 inserted into the storage holes from the front end side ( Storage). As shown in FIG. 6, a shutter member 75 having an opening 75a corresponding to the storage hole and sliding in the X-axis direction by the operation of the actuator is provided above the tool stocker 72. The member 75 is inserted into the storage hole in a state of passing through the opening 75a. The tool 23 is attached to and detached from (replaced with) the second head 21 in accordance with the sliding displacement of the shutter member 75. More specifically, when exchanging the tool 23, the tool 23 is inserted into the empty space of the storage hole as the second head 21 descends in a state where the opening 75 of the shutter member 75 and the insertion hole coincide with each other. Thereafter, the shutter member 75 slides and the second head 21 moves up. As shown by the two-dot chain line in FIG. 6, the opening edge of the shutter member 75 is inserted into the notch 34 b of both holding plates 34, and the tool 23 is engaged with the shutter member 75. Restrained by the tool stocker 72. As a result, the tool 23 is pulled out from the second head 21 (shaft member 22) and held in the storage hole. Then, after the second head 21 is moved into the storage hole in which the tool 23 to be replaced is stored, a new tool 23 is attached to the second head 21 (shaft member 22) as the second head 21 descends. The After that, the shutter member is reset and the second head 21 is raised, so that the tool 23 is pulled out from the storage hole through the opening 75a in a state where a new tool 23 is mounted on the second head 21. It has become.

  The nozzle stocker 70 basically has the same configuration as the tool stocker 72, and the attachment / detachment operation of the suction nozzle with respect to the first head 20 (shaft member 22) is similar to the attachment / detachment operation of the tool 23 of the second head 21. Done. In the attaching / detaching operation of the suction nozzle, although not shown, a hook portion is formed on the suction nozzle, and the opening edge portion of the shutter member is engaged with the hook portion, whereby the suction nozzle is moved from the first head 20. Is to be pulled out.

  By the way, although not shown, in the mounting machine, a well-known CPU that executes a logical operation, a ROM that stores various programs for controlling the CPU in advance, and various data are temporarily stored during operation of the apparatus. A control device composed of a RAM or the like is provided, and the servo motors 9, 15 and the like are configured to be comprehensively controlled by this control device so that the mounting operation is performed according to an operation program stored in advance. ing. Hereinafter, the mounting operation based on the control of the control device will be described.

  When the mounting operation is started in this mounting machine, first, the head unit 6 moves to the component supply unit 4 and components are sequentially taken out from the feeders 4a and 4b as the heads 20 and 21 are lowered and raised. Thereafter, the head unit 6 moves from the component supply unit 4 onto the printed circuit board 3 positioned at the mounting work position. During this movement, when the head unit 6 passes over the component recognition unit 74, the suction state of the component held by the first head 20 is recognized, and the target position is reset when a suction deviation occurs. Is done.

  When the head unit 6 reaches the printed circuit board 3, the first components are mounted on the printed circuit board 3 as the heads 20 and 21 are moved downward and upward. Thereafter, the head unit 6 is sequentially moved to the mounting position and the remaining components are moved. The suction component is mounted on the printed circuit board 3.

  When all the components are mounted on the printed circuit board 3 in this way, the head unit 6 is reset on the component supply unit 4, and thereafter, the head unit 6 reciprocates between the component supply unit 4 and the printed circuit board 3. If necessary, the head unit 6 exchanges the suction nozzle and the tool 23 via the nozzle stocker 70 or the tool stocker 72, whereby a predetermined number and types of components are sequentially mounted on the printed circuit board 3. The Rukoto.

  In the series of mounting operations as described above, the mounting operation of the DIP component by the second head 21 is performed as follows. Hereinafter, a description will be given with reference to FIG.

In taking out the DIP part from the stick feeder 4b, first, as shown in FIG. 8A, the second head 21 is set above the DIP part 80 supplied to the part taking-out position. At this time, the pusher 36 of the tool 23 is set at the retracted position, whereby a holding space for the DIP component 80 is formed at the tip of the holding plate 34. When both holding plates 34 of the tool 23 do not face the width direction of the DIP component 80, the orientation of the tool 23 is changed by rotating the second head 21 around the R axis.

  Next, the second head 21 is lowered. When the second head 21 is lowered in this manner, the DIP component 80 is inserted between the holding plates 34 from the package 81 side, and the lead 82 of each lead row bends inward with this insertion. Each lead 82 bends along the inner surfaces of both holding plates 34 so that the distance between the holding plates 34 corresponds to the through hole 3a of the printed circuit board 3. As shown in FIG. When completely inserted between the holding plates 34, the DIP component 80 is held between the holding plates 34 by the elastic force caused by the bending of each lead 82. At this time, since the taper 34 a is formed at the front end of the opposing surface of the both holding plates 34 of the tool 23, the DIP component 80 is smoothly inserted into the both holding plates 34 without the shoulder portions of the leads 82 being caught. .

  When the DIP component 80 is held by the second head 21 in this way, the second head 21 is raised, and thereby the DIP component 80 is taken out from the stick feeder 4b.

  On the other hand, when mounting the DIP component 80 on the printed circuit board 3, first, the second head 21 is positioned above the mounting position of the printed circuit board 3 so that the lead 82 of the DIP component 80 and the through hole 3 a of the printed circuit board 3 correspond to each other. After the setting, as shown in FIG. 8C, the second head 21 is lowered to a position where the tip of the tool 23 abuts on the printed circuit board 3 or a position close thereto.

  Next, the pusher 36 advances from the retracted position to the operating position. When the pusher 36 moves forward in this way, the DIP component 80 is pushed down along the holding plate 34 by the pusher 36, and each lead 82 is inserted into the through hole 3a along with this depression.

  Then, as shown in FIG. 8D, when the pusher 36 is completely displaced to the operating position, for example, the lower surface of the DIP component 80 comes into contact with the printed circuit board 3 and the lead 82 inserted into the through hole 3a springs back. The DIP component 80 is held on the printed circuit board 3 by the elastic force. Thereafter, the pusher 36 is reset to the retracted position, and the second head 21 is raised, whereby the mounting of the DIP component 80 on the printed circuit board 3 is completed.

  When the DIP component 80 is mounted on the printed circuit board 3, for example, as shown in FIG. 8E, the lead 82 is bent without being inserted into the through hole 3a. As a result, the DIP component 80 is inserted incompletely. It may be in a state. In this case, the pusher 36 is incompletely lowered, and the detection piece 58 (the detected portion 58b) of the detection means is continuously detected by the sensor 60 even though the air cylinder 30 is operating. It becomes a state. Therefore, in this case, it is determined that the insertion error has occurred in the control device, and for example, that fact is displayed on a monitor (not shown) to notify the operator.

As described above, this mounting machine is provided with the second head 21 dedicated to the DIP component, which is provided with the tool 23 having the pair of holding plates 34 fixed at the tip, at the tip, and holds both as described above. A DIP component is inserted between the plates 34 to hold and convey the DIP component with an elastic force caused by bending of the leads, and when the printed circuit board 3 is inserted, a pusher 36 provided between the two holding plates 34 is used. Since it is configured to extrude and insert the DIP component onto the printed circuit board 3, it is possible to sufficiently handle ultra-high-density mounting with respect to the production of the printed circuit board that involves mounting the DIP component. Machine (or printed circuit board production system including mounting machine) can be simplified, reduced in cost, productivity can be improved, and production quality can be further improved.

  That is, since the second head 21 is configured to insert and hold the DIP component between the pair of holding plates 34 having a fixed interval, it is required around the DIP component when mounted on the printed circuit board 3. The clearance is only the thickness of the holding plate 34, and a wide clearance is not required. For example, the clearance required around the DIP component is significantly smaller than that in which the DIP component is mechanically held and conveyed by a chuck-type mounting head. Accordingly, it is possible to sufficiently cope with ultra-high density mounting.

  Further, the leads are bent so that the interval between the lead rows becomes an interval corresponding to the through hole of the printed circuit board 3 and the DIP component is held by the elastic force. At the time of mounting, the DIP component is held by the pusher 36 while maintaining the interval. Is inserted into the printed circuit board 3 so that the leads are shaped in advance using a forming device (each lead is plastically deformed before conveyance so that the interval between the lead rows corresponds to the through hole). There is no. Therefore, compared with the conventional device of this type that requires advance lead shaping work with a forming device, the device configuration can be simplified and reduced in cost because the forming device is unnecessary, and the number of work steps can be reduced. As much as possible, the mounting process can be performed more efficiently.

  In addition, after the DIP component is inserted into the printed circuit board 3, each lead is spring-backed as described above, and each lead is pressed against the inner surface of the through hole, and the DIP component is held on the printed circuit board 3 by this pressure contact force. The Rukoto. Therefore, it is possible to effectively prevent the DIP component from falling off the printed circuit board 3 due to vibrations accompanying the conveyance to the next process, thereby improving the production quality of the printed circuit board 3. In particular, in this mounting machine, not only can the DIP parts be prevented from falling off after mounting, but also when a DIP part insertion failure (see FIG. 8 (e)) occurs, this is determined as described above. Therefore, it is possible to prevent the occurrence of a situation in which the printed circuit board 3 is unloaded in the next process while the insertion failure of the DIP component has occurred. 3 production quality can be improved.

  Further, in this mounting machine, the second head 21 is configured so that the tool 23 can be attached and detached, and can be replaced with the tool 23 in the tool stocker 72 as necessary. There is also an effect that a larger number of different types of DIP parts can be mounted on a single mounting machine.

  The surface mounting machine described above is the best embodiment of the surface mounting machine according to the present invention (the surface mounting machine to which the component inserting device according to the present invention is applied), and the specific configuration thereof is Modifications can be made as appropriate without departing from the scope of the invention.

  For example, in the embodiment, the tool 23 is configured to be replaceable in the second head 21 for mounting the DIP component. However, when the types of DIP components to be mounted are limited, the tool 23 is not necessarily replaceable. do not have to. In this case, the holding plate 34 is directly fixed to the tip (lower end) of the nozzle shaft 22 and the operation shaft 27 is used as a pusher as it is, that is, the DIP component is directly extruded at the tip of the operation shaft 27. That's fine.

In the embodiment, from the state where the DIP component is mounted on the printed circuit board 3 (see FIG. 8D), the pusher 36 is first reset to the retracted position and then the second head 21 is raised. The reset operation of the pusher 36 and the raising operation of the second head 21 may be performed simultaneously. Further, the advance / retreat stroke of the pusher 36 is set so that the tip (lower end) of the pusher 36 and the tip of the holding plate 34 are substantially flush with each other at the operating position, and at the time of mounting, from the state shown in FIG. First, the second head 21 is raised, and then the timing is shifted. Specifically, the pusher 36 may be reset when the tip of the holding plate 34 reaches the upper surface height of the DIP component. According to this, since the DIP component can be surely pushed out between the holding plates 34, it is possible to effectively prevent the situation where the DIP component once mounted is accidentally pulled out as the second head 21 is raised. Can be prevented.

  In the second head 21 of the embodiment, both holding plates 34 of the tool 23 are provided in parallel to each other. However, these holding plates 34 do not necessarily have to be parallel, for example, the tip side is somewhat tapered. It may be provided so as to be. In short, the two holding plates 34 are arranged and set so that when the DIP component is inserted between the two holding plates 34, the interval between at least the tips of each lead row is the interval corresponding to the through hole. Just do it.

  Although not described in detail in the embodiment, the tip (lower end surface) shape of the pusher 36 in the tool 23 may be appropriately configured to a shape suitable for pushing down the DIP component. For example, it may be a circle, an ellipse, or a rectangle. Further, the tip of the pusher 36 may be provided in a shape corresponding to the package shape of the DIP component so that the entire package of the DIP component can be pressed down uniformly. According to this, the DIP component held between the holding plates 34 can be pushed down more straightly, so that the DIP component can be more reliably and appropriately inserted into the printed board 3.

  In the above embodiment, an example in which the present invention is applied to a surface mounter has been described. However, the present invention can also be applied to, for example, a component testing apparatus that performs various tests on a DIP component. Although not shown in the figure, for example, it has a movable head unit on which a component suction head is mounted, and the component placed at the component supply position is suctioned with negative pressure by the head and conveyed to the test apparatus. An apparatus for performing various tests by inserting components into a test socket provided in a test apparatus is known. In this type of component test apparatus, the first embodiment of the present invention is used in place of the component adsorption head. The same as the two heads 21 may be applied. According to the component testing apparatus having such a configuration, the DIP components can be formed without using the forming device to shape the leads in advance (the leads are plastically deformed so that the interval between the lead rows becomes the interval corresponding to the socket). It can be transported from the component supply position to the test apparatus and inserted into the test socket. Therefore, it becomes possible to test a DIP component without providing a forming device or a lead shaping process using the forming device.

It is a top view which shows the surface mounter which concerns on this invention (surface mounter with which the component insertion apparatus which concerns on this invention is applied). It is a longitudinal cross-sectional view of the head unit which shows the structure of a 2nd head. It is a longitudinal cross-sectional view which shows the front-end | tip part (holding tool) of a 2nd head. It is a longitudinal cross-sectional view of the 2nd head for demonstrating the attachment or detachment structure of the holding tool. It is A arrow directional view of FIG. 3 which shows the structure of the holding tool. It is a plane cross-sectional schematic diagram which shows the tool stocker and the tool for holding accommodated in this. It is a schematic diagram which shows the detection piece and sensor which comprise the detection means which detects the insertion mistake of DIP components. It is sectional drawing which showed mounting operation | movement of the DIP component by a 2nd head. ((A), (b) is taking-out operation | movement of DIP component from a stick feeder, (c), (d) is DIP component to a printed circuit board.) (E) shows a state in which a DIP component insertion error has occurred).

3 Printed circuit board 3a Through hole (lead insertion hole)
4 Component supply unit 6 Head unit 20 First head (component adsorption head)
21 Second head (head for DIP parts)
22 Shaft member (head body)
23 Holding tool 34 Holding plate 36 Pusher 80 DIP parts 81 Package 82 Lead

Claims (7)

A head unit for a DIP component that can hold a DIP component having lead rows on two opposite side surfaces of the package and that can be moved, and a DIP component supply position by the DIP component head A component insertion device comprising a control means for controlling the drive of the head unit to be taken out from and transported to a target position and inserted,
The DIP component head has a head body that is driven forward and backward with respect to the head unit, and a DIP component holding tool provided at the tip of the head body,
The holding tool includes a pair of holding plates arranged in a state of being opposed to each other in a direction orthogonal to the advancing / retreating direction of the head main body and having a fixed interval, and is provided between the holding plates and has the same moving direction as the head main body. An extrusion member that is driven back and forth in the direction,
In the pair of holding plates, when a DIP component is inserted between the holding plates, each lead bends so that at least the tip portion of each lead row has an interval corresponding to the lead insertion hole at the target position, and the lead due to bending The distance is set so that the DIP component is held between both holding plates by elastic force,
The pushing member has a retracted position for forming a space in which the DIP component can be inserted between the two holding plates, and an operating position for advancing from this position to push the DIP component held in the space from between the holding plates. Configured to be able to move forward and backward
When the DIP component is held from the component supply position, the control means arranges the pushing member at the retracted position, and the DIP component is inserted between the holding plates from the package side and the thickness of the package When the DIP component head is controlled so that the lead row is completely inserted between the two holding plates in the direction, and the DIP component is inserted into the target position, After the holding tool is arranged at a position where the holding plate comes into contact or close to the holding plate, the DIP component is pushed out from between the two holding plates only by driving the pushing member, and is inserted into the target position. Component insertion device. In the component insertion apparatus according to claim 1,
A holding tool is configured to be attachable to and detachable from the head body, and is selected from a plurality of types of holding tools in which at least one of the interval between the holding plates, the width dimension of the holding plate, and the tip shape of the pushing member is different. A component insertion device, wherein one tool is configured to be mounted on the head body. In the component insertion apparatus according to claim 2,
The head main body is provided with a power transmission member that is driven to advance and retreat in the same direction as the head main body, while the holding tool is provided with a biasing means that biases the push-out member in the rear direction.
The pushing tool is held at the retracted position by the urging force of the urging means in a state where the holding tool is attached to the head body and the power transmission member is retracted. The component insertion device. In the component mounting apparatus according to any one of claims 1 to 3,
It and a determination means for performing a detection means for detecting the presence or absence of said extruded member in the operative position, the insertion quality determination of DIP component on the basis of the detection result by the detecting means and the driving state of the extrusion member The component insertion device characterized by this. In the component insertion apparatus in any one of Claims 1 thru | or 4,
Apart from the DIP component head, a component insertion device for mounting a component suction head for holding a component by negative pressure suction is mounted on the head unit. In a surface mounter that transports a component supplied in a component supply unit onto a substrate positioned at a mounting work position and mounts it on a predetermined position on the substrate,
A surface mounting machine comprising the component insertion device according to any one of claims 1 to 5 as means for transporting and mounting a component on a substrate from the component supply unit. In a component testing apparatus for carrying out various tests by transporting a component supplied in a component supply unit to a test means,
A component testing apparatus comprising the component insertion device according to claim 1 as means for conveying and setting a component from the component supply unit to a testing unit.

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