WO2015182347A1

WO2015182347A1 - Component mounting apparatus

Info

Publication number: WO2015182347A1
Application number: PCT/JP2015/063330
Authority: WO
Inventors: 真希夫亀田; 渡辺　昭夫; 主山　修二
Original assignee: ヤマハ発動機株式会社
Priority date: 2014-05-30
Filing date: 2015-05-08
Publication date: 2015-12-03
Also published as: CN106465578B; JP2015226037A; JP6280817B2; CN106465578A

Abstract

A component mounting apparatus (1) mounts a component (D) on a substrate (P) having a hole (47). The component mounting apparatus (1) is provided with: a fixing means (33) that aligns and fixes the substrate (P); a holding means (40) that inserts a lead (41) of the component into the hole (47) by holding the lead-attached component (D) and moving down; a bending member (44) that bends the lead (41) of the component by pressing, to the lead, a sloped surface (49) formed on an upper portion of the bending member, said lead having been inserted into the substrate fixed by means of the fixing means (33); and a lift means (20), which relatively brings up the bending member (44) with respect to the substrate, and which presses the sloped surface (49) to the lead (41) of the component.

Description

Component mounting device

The present invention relates to a component mounting apparatus for holding a component by a holding unit and mounting the component on a substrate.

For example, Patent Document 1 discloses a technique in which a lead of an electronic component is inserted into a hole formed in the printed board and the electronic component is mounted on the printed board.

However, the conventional technique mainly uses an apparatus for mounting electronic components on paste solder printed on a pattern (land) on the surface of a substrate. In this apparatus, when the lead is inserted into the hole formed in the substrate, the lead is prevented from being removed from the substrate. The device does not even bend the inserted lead.

In order to bend the lead inserted into the board and prevent the easily inserted component from being pulled out, a special mechanism called anvil as shown in Patent Document 2, for example, must be used. It was. This anvil employs a mechanism that bends the lead by, for example, pressing the nail against the lead and then pressing it horizontally. However, this mechanism has a complicated structure and is expensive. In particular, it is difficult to further add such a mechanism in a so-called chip mounter that includes a mechanism that simply moves down to place the held component on the substrate.

JP 2011-258875 A JP-A-2-132899

An object of the present invention is to realize, with a simple mechanism, an operation of bending a component lead into a hole formed in the substrate so that the component does not easily come off the substrate.

A component mounting apparatus according to an aspect of the present invention is a component mounting apparatus that mounts a component on a board having a hole, and holds and lowers the fixing means for positioning and fixing the board. Accordingly, the holding means for inserting the lead of the component into the hole and the lead of the component inserted into the board fixed to the fixing means are bent by pressing the inclined surface formed on the upper portion thereof. A bending member; and elevating means for raising the bending member relative to the substrate and pressing the inclined surface against the lead of the component.

The objects, features and advantages of the present invention will become more apparent from the following detailed description and the accompanying drawings.

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a side view of the board positioning portion in the electronic component mounting apparatus. FIG. 3 is a side view of the substrate positioning portion. FIG. 4 is a control block diagram related to component mounting in the electronic component mounting apparatus. FIG. 5 is a side view of the substrate positioning portion in which bending jig pins are provided on the backup table. FIG. 6 is a side view showing a state in which the bending jig pin bends the lead of the electronic component held by the holding claw. FIG. 7 is a timing chart for raising and lowering the gripping claws and the backup table for bending the lead of the component.

Hereinafter, an embodiment of the present invention will be described with respect to an electronic component mounting apparatus 1 (component mounting apparatus) that mounts an electronic component D on a printed circuit board P as a substrate, with reference to FIGS. 1 and 2. The electronic component mounting apparatus 1 includes a transport device 2 that transports each printed circuit board P, component supply devices 3A and 3B that are disposed on the front side and the back side of the device main body and supply electronic components, and a drive source. A pair of beams 4A, 4B that can move in one direction (reciprocate in the Y direction) and a mounting head 6 that can be moved separately by each drive source in the direction along each of the beams 4A, 4B are provided. Yes.

The transport apparatus 2 includes a supply conveyor 2A, a positioning unit 2B that positions and fixes the printed circuit board P, and a discharge conveyor 2C. The supply conveyor 2A conveys each printed board P received from the upstream to the positioning unit 2B. An electronic component D is mounted on each substrate P positioned by the positioning device in each positioning unit 2B. Then, the board | substrate P is conveyed by the discharge conveyor 2C, and is conveyed by the downstream apparatus after that.

The component supply devices 3A and 3B include a component supply unit 8 that is arranged at the back side position and the near side position of the transport device 2 and arranged in parallel on the feeder bases of the cart bases 7A and 7B that are mounting bases. Each cart base 7A, 7B is detachably disposed on the apparatus main body via a connector so that the tip of the component supply side of the component supply unit 8 faces the conveyance path of the printed circuit board P. When each cart base 7A, 7B is properly attached to the apparatus main body, power is supplied to the component supply unit 8 mounted on the cart base 7A, 7B. When the connection tool is released and the operator pulls the handle, the cart bases 7A and 7B can be moved by the casters provided on the lower surface.

Beams 4A and 4B are a pair of front and rear members that are long in the X direction. The beams 4A and 4B are driven by a Y drive motor 15 (see FIG. 4) which is a linear motor, and a slider fixed to each beam slides along a pair of left and right guides. Move in the Y direction individually. The Y drive motor 15 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 9A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. Composed.

The beams 4A and 4B are each provided with a mounting head 6 that moves along the guide in the longitudinal direction (X direction) by an X drive motor 16 (see FIG. 4) that is a linear motor. The X drive motor 16 includes a pair of front and rear stators fixed to the beams 4A and 4B, and a mover provided on the mounting head 6 between the stators.

Each mounting head 6 is provided inside each beam 4A, 4B so as to face each other. The rear mounting head 6 can take out the electronic component D from the component supply unit 8 of the corresponding rear component supply device 3 </ b> A and can be mounted on the printed circuit board P on the transport device 2. The mounting head 6 on the near side can take out the electronic component D from the corresponding component supply device 3B on the near side and mount it on the printed circuit board P.

Each mounting head 6 is movably attached to the beams 4A and 4B via an attachment member 6C. The mounting head 6 is provided with a plurality of suction nozzles 5 as component holders at a predetermined interval. The suction nozzle 5 can be moved up and down by a nozzle raising / lowering motor 17 (see FIG. 4), and can be rotated by a θ drive motor 18 (see FIG. 4). The suction nozzle 5 takes out the electronic component D from the component supply unit 8 and mounts the extracted electronic component D on the printed circuit board P.

The component supply unit 8 includes a tape feeding mechanism and a cover tape peeling mechanism. The tape feeding mechanism includes a sprocket that intermittently feeds the storage tape of the electronic component D. The storage tape is composed of a carrier tape that stores the electronic component D and a cover tape that covers the carrier tape, and is sequentially fed out while being wound around a supply reel that is rotatably mounted on the cart bases 7A and 7B. The storage tape has feed holes opened at predetermined intervals, and the teeth of the sprocket are fitted into the feed holes. The tape feed mechanism rotates the sprocket by a predetermined angle by a feed motor, and intermittently feeds the storage tape to the component suction / extraction position of the electronic component D. The cover tape peeling mechanism peels the cover tape from the carrier tape just before the suction take-out position by driving the peeling motor. The component supply unit 8 peels the cover tape by the cover tape peeling mechanism, and sequentially supplies the electronic components D loaded in the carrier tape storage portion to the component suction and extraction position.

Instead of the component supply unit 8 described above, a tray in which the electronic components D are arranged at predetermined intervals in the XY directions may be placed on the component supply device 3A. In this case, the mounting head 6 takes out the electronic component D from the tray and mounts it on the printed circuit board P.

Each component recognition camera 10 images the electronic component D sucked and held by each suction nozzle 5 provided in each mounting head 6 from below before mounting on the printed circuit board P.

The electronic component mounting apparatus 1 further includes a monitor 30 having a touch panel switch. The operator can perform operations such as starting and stopping the operation of the electronic component mounting apparatus 1 by pressing various touch panel switches displayed on the monitor 30.

2 and 3 are side views of the board positioning portion in the electronic component mounting apparatus 1. FIG. As shown in this board positioning portion, the printed board P is placed on the belt 32 attached to the

conveyors

2A and 2B, conveyed, and positioned and fixed by a clamp lever 33 (fixing means). The printed circuit board P is pressed against the chute top surface 34 by being lifted by the clamp lever 33, and is fixed after being positioned in the height direction and the XY direction.

The clamp lever 33 is driven by the air cylinder 35 (see FIG. 4) and moves up and down to raise and lower the printed circuit board P. The lower surface of the printed circuit board P is supported by backup pins 38 erected on the backup table 37. The backup pin 38 supports the printed circuit board P so that the printed circuit board P does not warp downward when the electronic component D is mounted. The backup table 37 is moved up and down by the backup table lift motor 20 (lifting means). The printed circuit board P is placed on the belt 32 when the clamp lever 33 is lowered and the backup table 37 is lowered. When the backup pin 38 and the clamp lever 33 are further lowered, they are separated from the printed circuit board P.

The suction nozzle 5 provided in the mounting head 6 sucks and mounts the electronic component D on the printed circuit board P fixed as shown in FIG.

Next, the electrical configuration of the electronic component mounting apparatus 1 will be described based on the control block diagram of FIG. The electronic component mounting apparatus 1 includes a control device 25 that performs overall control of operations related to mounting of the electronic component D. The control device 25 uses the mounting coordinate information including the X direction, the Y direction, and the angular position in the printed circuit board P in order of the mounting step number of the electronic component D (each mounting order), the arrangement number information of each component supply unit 8, and the like. A storage unit (storage device) that stores mounting data, component placement position data related to a component ID for each placement number of the component supply unit 8, component library data including size data and thickness data of the electronic component D, and the like. ing.

The control device 25 is configured to rotate the suction nozzle 5 via the drive circuit 39 based on the various data stored in the storage unit, the X drive motor 16 serving as the movement drive source of the mounting head 6, and the Y drive. The drive of the motor 15 and the nozzle raising / lowering motor 17 which raises / lowers the suction nozzle 5 is controlled. The control device 25 also controls the backup table lift motor 20 that lifts and lowers the backup table 37. The nozzle raising / lowering motor 17 is a servo motor and performs position control and speed control of the output shaft based on position information from a built-in encoder. Further, the magnitude of the load applied to the servo motor can also be detected from the magnitude of the current flowing through the motor.

The control device 25 recognizes the image of the electronic component D sucked by the suction nozzle 5 picked up by the component recognition camera 10. By this processing, a positional deviation or the like of the electronic component D with respect to the suction nozzle 5 is recognized.

FIG. 5 is a side view of the board positioning portion when the electronic component D with the leads 41 is mounted on the printed board P. FIG. Instead of the suction nozzle 5 that holds the electronic component D by vacuum suction, the mounting head 6 is attached with a gripping claw 40 (holding means) that holds the left and right side surfaces of the electronic component D. The suction nozzle 5 and the gripping claws 40 can be exchanged. The electronic component D provided with the lead 41 is gripped by the gripping claws 40, and the lead 41 is inserted into the hole 47 (see FIG. 6) formed in the printed circuit board P. The lifting / lowering of the gripping claws 40 attached instead of the suction nozzle 5 is also executed by the nozzle lifting / lowering motor 17. The opening and closing of the gripping claws 40 can be controlled by, for example, executing vacuum suction of the suction nozzle 5 and releasing it.

As shown in FIG. 5, when the lead 41 is inserted into the hole 47 (see FIG. 6) in which the electronic component D with the lead 41 is drilled in the printed circuit board P (see FIG. 6), the jig plate 47 is It is disposed below the printed circuit board P. Bending jig pins 44 (bending members) for bending the leads 41 are erected on the jig plate. The jig plate 46 is positioned and fixed on the backup plate 37. The jig plate 46 (bending jig pin 44) also moves up and down as the backup plate 37 is moved up and down by the backup table lifting motor 20. That is, the backup table elevating motor 20 which is a mechanism for elevating the backup pin 38 is used as the elevating means for moving the bending jig pin 44 up and down.

Hereinafter, the removal and mounting operation of the electronic component D will be described. When the operator presses the operation start switch portion of the touch panel switch of the operation unit (not shown), the printed board P is carried from the upstream device to the board positioning portion of the electronic component mounting apparatus 1 and the positioning operation of the printed board P is performed by the positioning mechanism. Executed.

The control device 25 follows the XY coordinate position to be mounted on the printed circuit board P stored in the storage unit, the rotation angle position about the vertical axis, the mounting data in which the arrangement number, and the like are specified, and the like. The suction nozzle 5 of each mounting head 6 is controlled so as to suck and take out the electronic component D to be mounted from each component supply unit 8. Every time each of the plurality of suction nozzles 5 of the mounting head 6 moves to and stops at the component supply position of the component supply unit 8 that supplies the electronic component D to be taken out, the electronic component D is taken out by the suction nozzle 5.

The electronic component D held by all the suction nozzles 5 in the same mounting head 6 is moved onto the component recognition camera 10 by the movement of the mounting head 6 in the horizontal direction. All the electronic components D held by the plurality of suction nozzles 5 are imaged by the recognition camera 10 and the horizontal position recognition with respect to the mounting head 6 is performed. The electronic component D sucked by the suction nozzle 5 is sequentially mounted at the position where the printed circuit board P is to be mounted by correcting the positional deviation grasped by the position recognition.

When all the electronic components D specified in the mounting data are mounted on the printed circuit board P, the control device 25 controls the air cylinder 35 and the backup table lifting motor 20 to lower the clamp lever 33 and the backup table 37. As a result, as shown in FIG. 3, the printed circuit board P is transferred onto the belt 32 and is conveyed in the downstream direction by the movement of the belt 32. When the next printed board P is conveyed from the upstream by the belt 32 and reaches the positioning position, the control device 25 raises the backup table 37 and the clamp lever 33. By this operation, the next printed circuit board P is fixed as shown in FIG.

Next, a case where the electronic component D with the lead 41 is taken out from the component supply device 3A by the mounting head 6 provided with the gripping claws 40 will be described. In this case, as shown in FIG. 5, a jig plate 46 in which bending jig pins 44 are erected is fixed in advance on the backup table 37. The standing position in the XY direction of the bending jig pin 44 is set so as to be directly below the hole 47 into which the lead 41 is inserted. Also, the rotational position around the vertical is positioned and fixed so that the inclination direction of the inclined surface 49 described later is directed in the direction in which the lead 41 is bent.

The bending jig pin 44 (pin member) is long in the vertical direction, and has a distal end portion having an inclined surface 49 formed by being obliquely cut with respect to the longitudinal direction, and a base end portion on the opposite side. The bending jig pin 44 is erected so that the longitudinal direction is in the vertical direction. That is, the base end portion is attached to the upper surface of the jig plate 46 so as to be oriented in a direction perpendicular to the jig plate 46 and the backup table 37. The bending jig pin 44 may have a cylindrical shape or a prism shape with a square or rectangular cross section.

FIG. 5 shows an example in which the inclined surface 49 cut at the tip of the bending jig pin 44 has an inclination of about 45 degrees with respect to the vertical direction, but when viewed from the side as shown in FIG. It is preferable that the angle formed by the long side surface in the vertical direction and the inclined surface 49 is slightly larger than 45 degrees. Not limited to this, the inclined surface 49 may be a flat surface having a predetermined gradient with respect to the horizontal direction. The inclined surface 49 is linear (that is, a flat surface) when viewed from the side, but may be a curved surface that curves upward or downward. Alternatively, it may have a polygonal line shape in which the gradient changes in the middle of the inclined surface.

Since the lead 41 is usually a metal, it is preferable that the bending jig pin 44 in contact with the lead 41 is a metal harder than the lead 41. As described above, the bending jig pin 44 has a shape having an inclined surface 49 that is cut obliquely and chamfered at the tip. The tip portion may be further cut in the horizontal direction to form a portion whose upper end is a horizontal plane, and an obliquely chamfered surface (inclined surface) may be positioned next to the horizontal plane.

When the worker attaches the jig plate 46 to the backup table 37 when performing the operation of mounting the electronic component D with the lead 41, the printed board P is transported from the upstream side, for example, hits a regulation pin. Stop in contact.

Next, air is supplied to the air cylinder 35 according to a command from the control device 25, the clamp lever 33 is raised, the printed circuit board P is lifted, pressed against the chute top surface 34, and fixed. At this time, as shown in FIG. 5, the backup table 37 is in a lowered position, and the bending jig pin 44 is separated from the back surface (lower surface) of the printed circuit board P.

6 (a) to 6 (d) are side views sequentially showing a process in which the bending jig pin 44 bends the lead 41 of the electronic component D held by the holding claws 40. FIG. FIG. 6A schematically shows the entire structure of the gripping claw 40. The gripping claw 40 includes a chuck portion 401, a push plate 402, a lifting member 403, and a spring 404. The chuck portion 401 is a member that grips a side portion of the electronic component D, and changes its posture between a gripping posture that is pressed against the side portion and a release posture that is separated from the side portion. The push plate 402 has a pressing surface on which the upper surface of the electronic component D abuts and can press the electronic component D. The elevating member 403 is a member that is moved up and down by the nozzle elevating motor 17. The spring 404 is interposed between the upper surface of the push plate 402 and the lower surface of the elevating member 403.

Subsequent to the above, based on the mounting data, the electronic component D with the lead 41 is taken out from the component supply devices 3A and 3B in the same manner as described above, held between the gripping claws 40, and conveyed. As shown in FIG. 6A, the electronic component D stops at the position specified by the mounting data of the printed circuit board P. When the mounting head 6 stops in this way, the lead 41 is positioned immediately above the hole 47 of the printed circuit board P. Further, the bending jig pin 44 erected on the jig plate 46 is located directly below the hole 47 and away from the printed board P.

Next, the control of the control device 25 controls the drive of the nozzle elevating motor 17 and the backup table elevating motor 20 so that the gripping claws 40 and the backup table 37 elevate as shown in the timing chart of FIG. However, when the first leaded electronic component D to be mounted on the printed circuit board P is mounted, the initial height position of the backup table 37 is a lowered position, which is different from FIG.

First, the gripping claw 40 that grips the electronic component D starts to descend from the mounting head 6 from the state of FIG. More specifically, both the side surfaces of the electronic component D with the lead 41 directed vertically downward are sandwiched between the chuck portions 401, and the elevating member 403 is connected to the push plate 402 while the upper surface of the electronic component D is in contact with the push plate 402. As a result, the electronic component D is lowered together with the chuck portion 401 and the push plate 402. By this descending, the lead 41 of the electronic component D enters the hole 47. When the gripping claws 40 are further lowered, the leads 41 are further lowered in the holes 47, and the electronic component D is lowered to a position where the bottom surface of the main body is pressed against the upper surface of the printed circuit board P (FIG. 6B). )). The diameter of the lead 41 is substantially the same as the diameter of the hole 47, and even if there is sliding resistance when the lead 41 passes through the hole 47, the nozzle elevating motor 17 has a driving force against this. The lead 41 can be press-fitted.

At this time, in order to detect that the lead 41 has been inserted into the hole 47 without being caught, the control device 25 commands the lowering of the gripping claws 40 and determines whether or not the gripping claws 40 are lowered to the position as commanded. Is monitored based on the output of an encoder (not shown). When it is detected that the tip of the lead 41 is inserted into the hole 41 and reaches a specific position lowered by a predetermined distance, it is determined that the lead 41 is correctly inserted into the hole 41. If it is not detected that the specific position has been reached after a predetermined time from the command, it can be determined that the lead 41 is not properly inserted into the hole 41. At this time, the driving force of the nozzle lifting / lowering motor 17, that is, the force applied to the gripping claws 40, is preferably limited to a small force that does not cause the lead 41 to bend. When it is determined that the lead 41 does not enter the hole 47 and the electronic component D cannot be lowered, the control device 25 stops the lowering of the nozzle lifting motor 17 and stops the operation of the electronic component mounting device 1, for example.

After the electronic component D is lowered to a position where the bottom surface of the main body of the electronic component D comes into contact with the upper surface of the printed circuit board P, the control device 25 further lowers the gripping claw 40 (elevating member 403) to slightly push the push plate 402. The electronic component D is pressed against the printed circuit board P via A driving force that lowers the lifting member 403 with respect to the mounting head 6 is applied to the push plate 402 via a spring 404. The spring 404 contracts, and the position of the electronic component D in the height direction remains unchanged, and only the elevating member 403 is lowered by the pushing amount. The spring 404 allows the elevating member 403 to be lowered by the pushing amount and absorbs the descending amount of the elevating member 403. Such a pushing operation by compressing the spring 404 is the same operation as the case where the electronic component D not having the lead 41 is mounted on the printed circuit board P coated with paste solder. .

6B, the backup table 46 is in the lowered position, and the bending jig pin 44 is separated downward from the lead 41. As shown in FIG. The nozzle lifting / lowering motor 17 is a servo motor and presses the electronic component D downward with the gripping claws 40. The control device 25 controls the driving force so as to keep the output position (rotational position) of the nozzle lifting / lowering motor 17 constant so as not to change the height position of the gripping claws 40. Specifically, the control device 25 controls the driving force by controlling the motor current according to the load so that the rotor of the nozzle elevating motor 17 is in the rotational position as commanded by feedback of position information from the encoder. To do. Furthermore, it is possible to control the speed and acceleration of the output shaft of the nozzle lifting / lowering motor 1 obtained from the position information from the encoder.

When the electronic component D reaches the printed circuit board P, the spring 404 that allows further pressing of the electronic component D by the gripping claws 40 may not be provided. In this case, the control device 25 stops the lowering of the gripping claws 40 at a position where the bottom surface of the main body of the electronic component D is in contact with the printed circuit board P, and maintains the position based on the monitoring of the encoder. The driving force may be servo controlled. At this time, it is detected that the bottom of the main body of the electronic component D is in contact (landing) with the printed circuit board P using a sensor, and the nozzle lifting / lowering motor 17 is stopped at this position and controlled so as to hold this height position. May be.

Next, after the gripping claw 40 has been lowered and maintained in its position for a predetermined time (after the time measured by the rising start timer), the control device 25 lifts the backup table 37 by driving the backup table lifting / lowering motor 20. Let Thereby, the bending jig pin 44 rises toward the lead 41 (relative rise of the bending member with respect to the substrate). The lead 41 of the electronic component D in a state of being pressed from above by the gripping claw 40 (push plate 402) is pressed against an inclined surface formed at the upper end of the bending jig pin 44. When the bending jig pin 44 is further raised, the lower end of the lead 41 is bent outward along the inclined surface 49 of the bending jig pin 44 along with the raising. The lead 41 is bent with the opening position of the hole 47 on the lower end surface of the printed circuit board P, that is, the lower end position of the hole 47 as a fulcrum. The position of the bending fulcrum does not change depending on the raised position of the bending jig pin 44 because the electronic component D is pressed from above by the push plate 402. For this reason, the lead 41 is easily bent.

In this way, with the lower end position of the hole 47 as a fulcrum, the lead 41 is pushed and bent outwardly along the inclination of the inclined surface 49 of the bending jig pin 44 as shown in FIG. Mounting on the printed circuit board P is performed. The leads are bent horizontally along the gradient of the inclined surface 49 of the bending jig pin 44, that is, at an angle of about 45 degrees with respect to the bottom surface of the printed circuit board P. Therefore, vibration is generated when the belt 32 of the printed circuit board P is conveyed. Even so, it can be avoided that the lead 41 is pulled out from the hole 47 and the electronic component D falls. Alternatively, even if the printed circuit board P is inverted 180 degrees and the electronic component D faces downward, the electronic component D is not easily dropped off. If the slope of the inclined surface 49 of the bending jig pin 44 is smaller than 45 degrees with respect to the bottom surface of the printed circuit board P, and the lead 41 is bent along this angle, the electronic component D can be further prevented from coming out.

In the middle of the bending of the lead 41, the pressing force of the bending jig pin 44, that is, the driving force of the backup table lifting motor 20 that pushes up the backup table 37, the force in the direction of bending the lead 41 and the electronic component via the lead 41. It is distributed to the force that pushes up D. The control device 25 causes the nozzle elevating motor 17 to apply a driving force (holding force) to the gripping claws 40 so that the height position of the gripping claws 40 can be maintained with respect to the force that pushes up the electronic component D. Control. For this reason, the electronic component D is not pushed up. Therefore, the height position of the lead 41 does not change, and the position of the fulcrum where the lead 41 is bent does not change.

When the electronic component D reaches the printed circuit board P, the spring 404 that allows further pushing of the elevating member 403 can be somewhat compressed by the pushing force from the bending jig pin 44. As a result, even if the electronic component D slightly rises, if the change in the position of the bending fulcrum of the lead 41 is small, the influence on the operation of bending the lead 41 is small.

The amount of displacement of the spring 404 is usually small. Therefore, the pressing position of the bending jig pin 44 immediately reaches a limit position such as compression of the spring 404, and the spring 404 is not displaced any further. Thereafter, the height position of the gripping claw 40, that is, the height of the lead 41 of the electronic component D can be prevented from changing by the holding force of the nozzle lifting motor 17, and the position of the bending fulcrum of the lead 41 can be maintained. Alternatively, when the gripping claw 40 (elevating member 403) is further lowered after the electronic component D comes into contact with the printed circuit board P, the elevating member 403 is lowered and stopped to a position where the spring 404 is compressed to the limit. Also good. In this case, the force generated when the spring 404 is compressed to the limit is smaller than the driving force that can be generated by the nozzle elevating motor 17, and is set to be small so as not to damage the electronic component D. The

By limiting the driving force of the nozzle raising / lowering motor 17 to a predetermined force, the electronic component D is damaged when an excessive force is applied to the electronic component D due to a phenomenon that the lead 41 does not bend normally. You can prevent it from happening. The force that pushes up the electronic component D by the driving force of the backup table elevating motor 20 becomes stronger than the driving force of the nozzle elevating motor 17 thus limited, and the electronic component D floats and the gripping claws 40 rise. Can occur. Assuming such a case, an embodiment in which the raising of the gripping claw 40 is detected from the output of the encoder of the nozzle lifting motor 17 to stop the drive of the backup table lifting motor 20 and to notify the operator of this state is illustrated. can do.

In the above-described case, the backup table elevating motor 20 does not need to be a servo motor, but a servo motor may be employed to control the driving force and monitor the position. If this driving force is also controlled by using the backup table elevating motor 20 as a servomotor, the force applied to the electronic component D can be controlled to the extent that it is not damaged. Alternatively, the bending jig pin 44 can be configured to be movable up and down with respect to the jig plate 46 via a spring. In this case, when the backup table 37 is raised, the lead 41 contacts the inclined surface 49 while the bending jig pin 44 is pushed up by the spring force. Thereby, the lead 41 is bent.

When the backup table 37 rises to a position where the upper end portion of the bending jig pin 44 substantially contacts the lower end surface of the printed circuit board P, the control device 25 stops the rise of the backup table 37 as shown in FIG. . After that, the chuck portion 401 of the gripping claw 40 is opened in the horizontal direction, and the holding, that is, holding of the electronic component D is released. Thereafter, after a predetermined time (mounting and stopping time in FIG. 7) has elapsed, the control device 25 drives the nozzle lifting / lowering motor 17 to raise the gripping claws 40.

Next, the control device 25 starts the descent of the backup table 37 prior to the mounting operation (lowering operation) of the next electronic component D with leads, and stops the backup table 37 at the lowering position before starting the lowering of the next electronic component D. (FIG. 6 (d)). The mounting operation of the next electronic component D is also performed in the same manner as described above.

In the electronic component mounting apparatus 1, when mounting of all the electronic components D specified in the mounting data to be mounted on the printed circuit board P is completed, the backup table 37 is lowered and the clamp lever 33 is lowered. . The printed circuit board P is placed on the belt 32 and conveyed to a downstream apparatus by the movement of the belt 32.

In addition, this embodiment was demonstrated about the case where a servomotor is used as the nozzle raising / lowering motor 17. FIG. Alternatively, a pulse motor or the like that does not monitor the position by the encoder may be used as the nozzle lifting / lowering motor 17 to execute the above-described operation. Alternatively, an air cylinder may be used. In that case, the gripping claw 40 is lowered and the lead 41 is inserted into the hole 47, and the air cylinder is stopped in a state where the lead 41 protrudes from the lower end surface of the printed board P for a predetermined length. It is only necessary that the cylinder be fixed so that the height position is held with a force larger than the pushing-up force from below. In this state, the bending jig pins 44 are pushed up by driving the backup table lifting motor 20 from below, so that the leads 41 can be bent without changing the height position of the electronic component D.

By controlling the stop position of the nozzle raising / lowering motor 17, the lead 41 is not inserted into the hole 47 of the printed circuit board P, and the body bottom surface of the electronic component D is floated from the upper surface of the printed circuit board P. That is, the lead 41 may be bent by pushing up the bending jig pin 44. Even in this case, since the fulcrum position of the bending of the lead 41 does not change, the lead 41 can be easily bent. In addition, by variously changing the stop position of the gripping claws 40 for each part D, it is possible to execute the clinching of the lead 41 at a desired position.

The holding means for holding the electronic component D with the lead and inserting the lead 41 into the hole 47 of the printed circuit board P is the suction nozzle 5 that vacuum-sucks the electronic component D even if it is not the gripping claw 40 of this embodiment. There may be. In this case, the lead 41 can be bent similarly. However, when the electronic component D is sandwiched and held by the gripping claw 40 from the lateral direction, the horizontal displacement when the electronic component D is inserted into the hole 47 and pushed in is more than when the suction nozzle 5 is held only by vacuum suction. It is advantageous to avoid.

In the above embodiment, the backup table 37 on which the bending jig pin 44 is mounted is raised and the bending jig pin 44 is pressed against the lead 41. Instead of this, the printed circuit board P may be lowered and the upper inclined surface 49 of the bending jig pin 44 may be pressed against the lead 41 and bent. That is, it is only necessary that the bending jig pin 44 can be raised relative to the printed circuit board P. In this case, the gripping claws 40 need to be lowered while pressing the component D against the substrate P together with the substrate P. That is, the bending jig pin 44 and the substrate P may be brought relatively close to each other so that the inclined surface 49 is pressed against the lead 41.

It is desirable that the electronic component mounting apparatus 1 can mount an electronic component that does not have the lead 41 to be inserted into the hole 47 together with the electronic component D with a lead on the printed circuit board P. In this case, the backup pin 38 is also erected on the backup table 37 provided with the jig plate 46 on which the bending jig pin 44 is erected. In this embodiment, the electronic component D with a lead is mounted on the printed circuit board P, and another electronic component that is mounted on the surface of the printed circuit board P without the lead 41 is sucked or held by the suction nozzle 5. It can be held by the nail 40 and attached to the same substrate surface of the printed circuit board P.

Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

As described above, according to the present invention, the operation of bending the lead of the component into the hole formed in the substrate so that the component does not easily come off the substrate can be realized with a simple mechanism. Can do.

Claims

A component mounting apparatus (1) for mounting a component (D) on a substrate (P) having a hole (47),
Fixing means (33) for positioning and fixing the substrate (P);
Holding means (40) for inserting the lead (41) of the component into the hole (47) by holding and lowering the component (D) with lead;
A bending member (44) that bends the lead (41) of the component inserted into the substrate fixed to the fixing means (33) by pressing an inclined surface (49) formed on the lead (41);
A component mounting apparatus comprising: elevating means (20) for raising the bending member (44) relative to the substrate and pressing the inclined surface (49) against the lead (41) of the component.
In the component mounting apparatus according to claim 1,
A backup pin (38) for supporting the substrate so that the substrate (P) does not warp downward when the component (D) is mounted;
A component mounting apparatus in which a mechanism for raising and lowering the backup pin (38) is used as the elevating means (20).
In the component mounting apparatus according to claim 2,
A backup table (37) disposed below the substrate (P) and provided with the backup pins (38);
The bending member (44) is positioned and fixed on the backup table (37) when the leaded component (D) is mounted.
The elevating means (20) is a component mounting apparatus that elevates and lowers the backup table (37).
In the component mounting apparatus according to any one of claims 1 to 3,
The bending member (44) is composed of a pin member that is long in the vertical direction, and the inclined surface (49) is formed by cutting the tip of the pin member obliquely with respect to the longitudinal direction of the pin member. A component mounting device that is a surface.
In the component mounting apparatus according to any one of claims 1 to 4,
The elevating means (20) bends the lead by relatively raising the bending member (44) in a state where the holding means (40) presses a component having the lead inserted into the substrate from above. Component mounting device.
In the component mounting apparatus according to any one of claims 1 to 5,
The component mounting apparatus further comprising a servo motor (17) for moving the holding means (40) up and down.
In the component mounting apparatus according to claim 5,
The elevating means includes a first motor (20) for elevating and lowering the bending member (44),
The component mounting device further includes:
A second motor (17) for raising and lowering the holding means (40);
A control device (25) for controlling driving of the first motor (20) and the second motor (17),
The control device (25)
A driving force is generated in the second motor (17) to form a state where the component is pressed from above, and the first motor (20) is operated to raise the bending member (44),
The driving force of the second motor (17) is controlled so as to maintain the height position of the holding means (40) with respect to the pushing force applied to the component (D) via the lead (41) by the ascent. , Component mounting device.
In the component mounting apparatus according to claim 1,
The component mounting device (1) is a component mounting device capable of mounting a component that does not have a lead to be inserted into the hole on the substrate.