JP6848292B2 - Transport pallets, parts supply equipment and transport methods - Google Patents

Description

The present invention relates to a transfer technique for electronic components, and more particularly to a transfer technique using a transfer pallet.

Information devices and communication devices are becoming smaller and more sophisticated, and electronic boards such as wiring boards and semiconductor devices used in information devices and communication devices are becoming finer and higher in density. Further, with the miniaturization and the increase in density, the members mounted on electronic substrates such as wiring boards and semiconductor devices are also miniaturized. Further, in order to suppress characteristic fluctuations and increase the density, high position accuracy may be required when mounting a fine member on an electronic substrate.

When transporting electronic components to be mounted on an electronic board, a transport pallet with an adhesive sheet attached to the upper surface may be used as a method for positioning and holding the components to be transported. In such a transport pallet, the electronic component can be positioned and held by attaching the adhesive sheet on the upper surface and arranging the electronic component on the adhesive sheet. However, in order to prevent misalignment during transportation, it may be difficult to remove the electronic components when the adhesive strength of the adhesive sheet is increased. Therefore, it is desirable that there is a technology that can easily pick up electronic components at the time of mounting while reliably fixing the electronic components being transported regardless of the adhesive strength of the adhesive sheet, and related technologies have been developed. ing. As a technique for facilitating pick-up at the time of mounting while reliably fixing such an electronic component during transportation, for example, a technique such as Patent Document 1 is disclosed.

Patent Document 1 relates to a component supply device that conveys electronic components mounted on a tape. In Patent Document 1, in a place where vibration or the like may occur when the electronic component mounted on the tape is conveyed in the horizontal direction, a magnet that moves in the same direction as the electronic component is used to lower the electronic component on the lower surface side. A directional force is applied to bring it into close contact with the bottom surface. Further, when the adhesion to the bottom surface is released, the height of the magnet is lowered so that the distance between the magnet and the electronic component becomes long, so that the adhesion is released and the component can be taken out. Patent Document 1 states that parts can be taken out satisfactorily while preventing the parts from being disturbed or coming out.

Japanese Unexamined Patent Publication No. 10-163684

However, the technique of Patent Document 1 is not sufficient in the following points. In Patent Document 1, the magnet is moved horizontally together with the transport tape to bring the electronic component into close contact with the bottom surface, and the magnet is moved downward at the component take-out portion to release the close contact. Therefore, the technique of Patent Document 1 requires a mechanism for moving the magnet together with the portion for transporting the electronic component on the transporting device side. Therefore, in the technique of Patent Document 1, when it is desired to take out and move only the portion to be transported such as a transport pallet, the electronic component cannot be fixed to the bottom surface without the magnet on the transport device side. Further, in order to stabilize the fixed state, it is necessary that an electronic component on the transport pallet exists near the magnet on the transport device side. Therefore, when transporting the transport pallet, there may be restrictions on the position and handling of the transport pallet. However, when transporting electronic components using a transport pallet, it is desirable that the transport pallet alone can be freely transported. Therefore, the technique of Patent Document 1 is not sufficient as a technique for fixing an electronic component on a transport pallet, stably transporting the electronic component, and easily picking up the electronic component at the transport destination.

In order to solve the above problems, it is an object of the present invention to obtain a transport pallet capable of easily picking up electronic components while securely fixing and stably transporting the electronic components.

In order to solve the above problems, the transport pallet of the present invention includes a plate, a magnetic material, and an adjusting unit. The plate is made of a non-magnetic material and holds electronic components on the first surface. The magnetic material is provided on the second surface side of the plate 1 opposite to the first surface, and is attracted to the electronic component by magnetic force. By changing the distance between the second surface and the magnetic material, the adjusting unit changes the force applied to the electronic component in the first surface direction by the magnetic force.

The transport method of the present invention holds an electronic component on the first surface of a plate made of a non-magnetic material. In the transport method of the present invention, the electronic component is fixed to the first surface by a force attracted by a magnetic force between the magnetic body and the electronic component provided on the second surface side opposite to the first surface of the plate. In the transport method of the present invention, by changing the distance between the second surface and the magnetic material, the force applied to the electronic component in the first surface direction by the magnetic force is changed.

According to the present invention, it is possible to easily pick up an electronic component while securely fixing the electronic component and stably transporting the electronic component.

It is a figure which shows the outline of the structure of the 1st Embodiment of this invention. It is a figure which shows the outline of the structure of the 2nd Embodiment of this invention. It is a figure which shows the structure of the transport pallet of the 2nd Embodiment of this invention. It is a figure which shows the example of the structure of the component supply apparatus of the 2nd Embodiment of this invention. It is a figure which shows the state of the intermediate process in the 2nd Embodiment of this invention. It is a figure which shows the state of the intermediate process in the 2nd Embodiment of this invention. It is a figure which shows the state of the intermediate process in the 2nd Embodiment of this invention. It is a figure which shows the state of the intermediate process in the 2nd Embodiment of this invention. It is a figure which shows the state of the intermediate process in the 2nd Embodiment of this invention. It is a figure which shows the state of the intermediate process in the 2nd Embodiment of this invention. It is a figure which shows the state of the intermediate process in the 2nd Embodiment of this invention. It is a figure which shows the example of another structure of the 2nd Embodiment of this invention. It is a figure which shows the example of another structure of the 2nd Embodiment of this invention. It is a figure which shows the outline of the structure of the 3rd Embodiment of this invention. It is a figure which shows the use state of the transport pallet of the structure of 3rd Embodiment of this invention. It is a figure which shows the outline of the structure of the 4th Embodiment of this invention. It is a figure which shows the outline of the structure of the 5th Embodiment of this invention. It is a figure which shows the outline of the structure of the 6th Embodiment of this invention. It is a figure which shows the outline of the structure of the 7th Embodiment of this invention. It is a figure which shows the example of the operation state in 7th Embodiment of this invention. It is a figure which shows the example of another structure of this invention. It is a figure which shows the example of another structure of this invention. It is a figure which shows the example of another structure of this invention.

(First Embodiment)
The first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows an outline of the configuration of the transport pallet of the present embodiment. The transport pallet of the present embodiment includes a plate 1, a magnetic material 2, and an adjusting unit 3. The plate 1 is made of a non-magnetic material and holds electronic components on the first surface. The magnetic body 2 is provided on the second surface side opposite to the first surface of the plate 1, and is attracted to the electronic component by magnetic force. By changing the distance between the second surface and the magnetic body 2, the adjusting unit 3 changes the force applied to the electronic component in the first surface direction by the magnetic force.

Since the transport pallet of the present embodiment includes the magnetic body 2 on the second surface side of the plate 1, the electronic component is fixed to the first surface of the plate 1 with a force that attracts the magnetic body 2 and the magnetic force. Can be done. Further, in the adjusting unit 3, the distance between the second surface and the magnetic body 2 is changed, and the force applied to the electronic component in the first surface direction by the magnetic force is changed, so that the electronic component is subjected to the first surface. The fixed state can be released. Therefore, by using the transport pallet of the present embodiment, it is possible to obtain a stable fixing of the electronic components during transport and a configuration in which the transport pallet can be easily picked up by the transport pallet alone. As a result, by using the transport pallet of the present embodiment, the electronic components can be easily picked up while the electronic components are securely fixed and stably transported.

(Second embodiment)
A second embodiment of the present invention will be described in detail with reference to the drawings. FIG. 2 shows an outline of the configuration of the parts transfer system of the present embodiment.

The parts transfer system of the present embodiment includes a transfer pallet 10 and a parts supply device 20. Further, the electronic component 30 is held on the transport pallet 10. The transport pallet 10 includes a top plate 11, an adhesive sheet 12, a magnetic material 13, and a leaf spring 14. Further, the parts supply device 20 includes a transport pallet holding unit 21, a magnetic force adjusting unit 22, and a pickup unit 23.

In the component transfer system of the present embodiment, the electronic component 30 is fixed on the transfer pallet 10 and transferred between the devices, and the electronic component 30 is picked up from the transfer pallet 10 by the component supply device 20 to mount a circuit board or the like. It is for use in. The electronic component 30 is fixed on the top plate 11 by the magnetic force acting between the electronic component 30 and the magnetic body 13 of the transport pallet 10 and the adhesive force of the adhesive sheet 12.

The configuration of the transport pallet 10 will be described. FIG. 3 shows the configuration of the transport pallet 10 of the present embodiment.

The top plate 11 holds the electronic component 30 on the upper surface. The top plate 11 is made of a non-magnetic material. Since the top plate 11 is made of a non-magnetic material, the top plate 11 does not affect the force acting by the magnetic force between the electronic component 30 and the magnetic material 13. The top plate 11 of this embodiment is made of aluminum. The top plate 11 may be formed of another non-magnetic material such as copper. When heat resistance is required, the top plate 11 is formed using, for example, gold. Further, the top plate 11 of the present embodiment corresponds to the plate 1 of the first embodiment.

The adhesive sheet 12 has adhesive strength and is formed on the upper surface of the top plate 11. The adhesive sheet 12 fixes the electronic component 30 with adhesive force. The adhesive strength of the adhesive sheet 12 is set so that the electronic component 30 can be easily removed when the electronic component 30 is picked up. The pressure-sensitive adhesive sheet 12 is formed by using, for example, silicone rubber. The pressure-sensitive adhesive sheet 12 may be made of a material other than silicone rubber.

The magnetic body 13 is formed by a magnet. The magnetic body 13 applies a downward force to the electronic component 30 by a force that attracts the magnetic substance contained in the electronic component 30 by a magnetic force. The height of the magnetic body 13 changes, that is, the position in the vertical direction when the leaf spring 14 elastically deforms due to the applied external force. When no external force is applied, the electronic component 30 receives an upward force due to the elastic force of the leaf spring 14, and therefore exists at the uppermost portion, that is, at a position where the upper surface of the electronic component 30 is in contact with the top plate 11. Further, the magnetic body 13 of the present embodiment corresponds to the magnetic body 2 of the first embodiment.

When the leaf spring 14 is elastically deformed, the leaf spring 14 applies an upward force to the electronic component 30 by elasticity. Further, the leaf spring 14 is elastically deformed downward by an external force. As long as it is a spring that elastically deforms, a spring having another configuration may be used instead of the leaf spring. Further, the leaf spring 14 of the present embodiment corresponds to the adjusting unit 3 of the first embodiment.

The configuration of the component supply device 20 will be described. FIG. 4 shows an outline of the configuration of the component supply device 20 of the present embodiment.

The transport pallet holding unit 21 is a mounting stage for setting the transport pallet 10 on the parts supply device 20. The transport pallet holding unit 21 holds the transport pallet 10 so that the plane of the transport pallet 10 is horizontal. Further, the transport pallet holding portion 21 holds the outer peripheral portion of the transport pallet 10. In the example of FIG. 2, the transport pallet holding portion 21 holds the bottom surface of the outer peripheral portion of the transport pallet 10 from below, but the transport pallet 10 may be held by another configuration. Good.

The magnetic force adjusting unit 22 applies a downward external force to the magnetic body 13 and the leaf spring 14. The magnetic force adjusting unit 22 changes the amount of elongation of the leaf spring 14 by moving in the vertical direction, and adjusts the length of the leaf spring 14 in the height direction. When the magnetic force adjusting unit 22 applies an external force to the leaf spring 14, the distance between the lower surface of the top plate 11 and the magnetic body 13 changes, and the distance between the electronic component 30 and the magnetic body 13 changes.

The pickup unit 23 has a function of picking up the electronic component 30 from the transport pallet 10 and transporting the electronic component 30 onto a circuit board or the like on which the electronic component 30 is mounted. The pickup unit 23 of the present embodiment is composed of a transfer arm and a vacuum suction unit attached to the transfer arm. The pickup unit 23 holds and picks up the electronic component 30 on the transport pallet 10 by vacuum suction, and transports the electronic component 30 to a unit in which a circuit board or the like is set. The holding of the electronic component 30 may be performed by a method other than vacuum suction.

The electronic component 30 has a magnetic member inside. As the member of the magnetic material existing inside the electronic component 30, for example, a lead frame formed of an alloy containing a magnetic material such as iron corresponds to the member. Further, the entire electronic component 30 may be a magnetic material.

The operation of the parts transfer system of this embodiment will be described.

First, the operation when the electronic component 30 is placed on the upper surface of the transport pallet 10 will be described. When the operation of mounting the electronic component 30 on the upper surface of the transport pallet is started, the transport pallet 10 is set in the device for mounting the electronic component 30. FIG. 5 shows a state in which the transport pallet 10 is set in the transport pallet holding unit 41, which is a unit for setting the transport pallet 10 of the device for mounting the electronic component 30.

When the electronic component 30 is placed on the upper surface of the transport pallet 10, the upper surface of the magnetic body 13 is in contact with the lower surface of the top plate 11. That is, since no external force is applied to the magnetic body 13 and the leaf spring 14, the magnetic body 13 is held at the uppermost portion by the leaf spring 14.

The electronic component 30 is placed on the upper surface of the adhesive sheet 12 formed on the top plate 11 of the transport pallet 10 with vacuum tweezers or the like. FIG. 6 shows a state in which the electronic component 30 is placed on the adhesive sheet 12 of the transport pallet 10. When the electronic component 30 is placed on the upper surface of the adhesive sheet 12 on the top plate 11, the electronic component 30 is attracted downward by the magnetic force of the magnetic body 13. Therefore, the electronic component 30 is fixed to the upper surface side of the top plate 11.

When the electronic component 30 is fixed to the upper surface side of the top plate 11, the transport pallet 10 is transported to the component supply device 20. When transported to the parts supply device 20, the transport pallet 10 is set in the transport pallet holding unit 21. FIG. 7 shows a state when the transport pallet 10 holding the electronic component 30 on the upper surface is set in the transport pallet holding portion 21 of the component supply device 20.

When the transfer pallet 10 is set in the transfer pallet holding unit 21, the magnetic force adjusting unit 22 applies a downward force to the magnetic body 13. That is, the magnetic force adjusting unit 22 pulls down the magnetic body 13 so that the leaf spring 14 extends downward. The magnetic force adjusting unit 22 is lowered to a height at which the force that the electronic component 30 is attracted by the magnetic force of the magnetic body 13 disappears. FIG. 8 shows a state in which the magnetic force adjusting unit 22 moves downward, the leaf spring 14 extends downward, and the position of the magnetic body 13 is lowered. When the magnetic force adjusting unit 22 is pulled down, the electronic component 30 is fixed to the top plate 11 only by the adhesive force of the adhesive sheet 12 because the downward force of the magnetic body 13 does not work.

When the magnetic body 13 is pulled down by the magnetic force adjusting unit 22, the pick-up unit 23 picks up the electronic component 30 from the transfer pallet 10. FIG. 9 shows a state in which the pickup unit 23 picks up the electronic component 30. When the electronic component 30 is picked up, the magnetic body 13 is lowered to a position where the magnetic force does not reach the electronic component 30, so that the pickup unit 23 can easily pick up the electronic component 30.

When the electronic component 30 is picked up, the pickup unit 23 conveys the electronic component 30 onto a circuit board or the like on which the electronic component 30 is mounted. FIG. 10 shows a state in which the electronic component 30 has been transported and the pickup unit 23 does not hold anything.

When the pickup unit 23 picks up the electronic component 30 from the top plate 11 and conveys it, the magnetic force adjusting unit 22 releases the state of holding the magnetic body 13. When the magnetic body 13 is no longer held by the magnetic force adjusting portion 22, the leaf spring 14 pushes the magnetic body 13 upward by an elastic force. FIG. 11 shows a state in which the magnetic body 13 is raised by the elastic force of the leaf spring 14, and the upper surface of the magnetic body 13 and the lower surface of the top plate 11 are in contact with each other.

When the leaf spring 14 pushes up the magnetic body 13 to the uppermost position, that is, the position where the upper surface of the magnetic body 13 and the lower surface of the top plate 11 are in contact with each other, the transport pallet 10 is removed from the transport pallet holding portion 21, and the member stocker or the like is removed. It is stored in.

When the leaf spring 14 pushes up the magnetic body 13 to the uppermost position, that is, the position where the upper surface of the magnetic body 13 and the lower surface of the top plate 11 are in contact with each other, an electronic component placed on the upper surface of the adhesive sheet 12 on the top plate 11. 30 can be fixed by the magnetic force of the magnetic body 13. That is, the transport pallet 10 can be used again as a transport jig on which the electronic component 30 is placed.

In the above description, after the electronic component 30 is released from the fixed state to the top plate 11 by magnetic force, the puck-up portion 23 is performing an operation of attracting the electronic component 30, but the fixed state is released after the attraction. You may.

In the above description, an example in which the electronic component 30 having a magnetic body is fixed and conveyed by using the magnetic body 13 formed of a magnet has been described. Instead of such a configuration, an electronic component 31 formed of a magnetic material such as ferrite or a magnet is fixed to and conveyed to the top plate 11 by a force that attracts the magnetic material 15 on the lower surface side of the top plate 11. May be good. FIG. 12 shows a transfer jig and an electronic component for transporting an electronic component 31 formed of a magnet, which is fixed to the top plate 11 by a force attracting a magnetic body 15 such as iron on the lower surface side of the top plate 11. The configuration of 31 is schematically shown.

Further, in the transport pallet 10 of the present embodiment, the adhesive sheet 12 is formed on the upper surface of the top plate 11, but the adhesive sheet 12 may not be formed. FIG. 13 shows a configuration in the case where the adhesive sheet 12 is not formed on the transport pallet in the present embodiment. Even if there is no adhesive sheet 12, the electronic component 30 is fixed to the upper surface of the top plate 11 by a force acting on a magnetic force with the magnetic body 13, so that the electronic component 30 can be stably conveyed while simplifying the configuration. can do.

Further, in the present embodiment, the electronic component 30 is picked up in a state where the force attracted by the magnetic force does not act between the electronic component 30 and the magnetic body 13, but the child component 30 and the magnetic component 30 are magnetic to the extent that the pickup is not affected. The force that the body 13 attracts may remain.

In the parts supply system of the present embodiment, since the magnetic body 13 is provided on the bottom surface side of the transport pallet 10, the transport pallet 10 can be transported with the electronic component 30 securely fixed on the top plate 11. it can. Therefore, the electronic components 30 do not shift or fall off when the transport pallet 10 is transported.

Further, in the component supply device of the present embodiment, when the electronic component 30 is picked up from the transport pallet 10 in the component supply device 20, the distance between the electronic component 30 and the magnetic body 13 is widened to weaken the magnetic force of the electronic component 30. The fixed state to the top plate 11 is released. Therefore, the operation of picking up the electronic component 30 from the transport pallet 10 can be easily performed.

In the component supply system of the present embodiment, after the electronic component 30 has been picked up, the position of the magnetic body 13 is returned to the state of being in contact with the bottom surface of the top plate 11 by the elastic force of the leaf spring 14. Therefore, the transport pallet 10 of the present embodiment can be used again for transporting the electronic component 30. Therefore, by using the transport pallet 10 of the present embodiment, the operation of reliably transporting and picking up the electronic component 30 can be repeatedly performed without complicating the device configuration. From the above, the component supply system of the present embodiment can easily pick up electronic components while securely fixing and stably transporting the electronic components.

(Third Embodiment)
A third embodiment of the present invention will be described in detail with reference to the drawings. FIG. 14 shows the configuration of the transport pallet 50 of the present embodiment. The transport pallet 50 of the present embodiment includes a top plate 51, a recess 52, a magnetic body 53, and a leaf spring 54.

FIG. 15 shows a state in which the electronic component 30 is placed on the top plate 51 of the transport pallet 50. The configuration of the electronic component 30 is the same as that of the second embodiment. The transport pallet 10 of the second embodiment holds the electronic component 30 on the adhesive sheet 12 provided on the upper surface of the flat top plate 11, but the transport pallet 50 of the present embodiment has the top plate 51. The electronic component 30 is held by the recess 52 formed in the pallet.

The configuration of the transport pallet 50 will be described. The configuration and function of the magnetic body 53 and the leaf spring 54 of the present embodiment are the same as those of the parts of the same name in the second embodiment.

The top plate 51 holds the electronic component 30 in the recess 52 formed on the upper surface. The top plate 51 is made of a non-magnetic material. The top plate 51 is made of the same material as the top plate 11 of the second embodiment.

The recess 52 is formed at a position on the upper surface of the top plate 51 on which the electronic component 30 is placed. That is, a magnetic material 53 is provided at a position opposite to the recess 52 and the top plate 51. The transport pallet 50 of the present embodiment can maintain the horizontal position of the electronic component 30 by the step between the bottom surface of the recess 52 and the top plate 51. The step between the bottom surface of the recess 52 and the top plate 51 is set to a depth that is not affected by the side surface when the electronic component 30 is picked up.

The transport pallet 50 of the present embodiment can be used in the parts supply system in the same manner as the transport pallet 10 of the second embodiment. That is, the transport pallet 50 of the present embodiment can be used in place of the transport pallet 10 in the parts supply system of the second embodiment. The transport pallet 50 of the present embodiment is transported to the component supply device in a state where the electronic component 30 is fixed to the recess 52 on the upper surface of the top plate 51.

By using the transport pallet 50 of the present embodiment in the parts supply system, the same effect as that of the second embodiment can be obtained. Further, in the transport pallet 50 of the present embodiment, since the electronic component 30 is fixed to the top plate 51 at the position of the recess 52, it is possible to prevent the electronic component 30 from being displaced or falling off without using an adhesive sheet. it can. Further, in the transport pallet 50 of the present embodiment, since the adhesive force due to the adhesive sheet does not exist, the electronic component 30 can be picked up more easily.

(Fourth Embodiment)
A fourth embodiment of the present invention will be described in detail with reference to the drawings. FIG. 16 shows the configuration of the transport pallet 60 of the present embodiment. In FIG. 16, the electronic component 30 is provided on the transport pallet 60. The configuration of the electronic component 30 is the same as that of the second embodiment. The transport pallet 60 of the present embodiment includes a top plate 61, a convex portion 62, a magnetic body 63, and a leaf spring 64.

The transport pallet 10 of the second embodiment holds the electronic component 30 on the adhesive sheet 12 provided on the upper surface of the flat top plate 11, but the transport pallet 60 of the present embodiment has the top plate 51. It is characterized in that the electronic component 30 is held between the convex portions 62 formed on the surface.

The configuration of the transport pallet 60 will be described. The configuration and function of the magnetic body 63 and the leaf spring 64 of the present embodiment are the same as those of the parts of the same name in the second embodiment.

The top plate 61 holds the electronic component 30 by a convex portion 62 formed on the upper surface. The top plate 61 is made of a non-magnetic material. The top plate 61 is made of the same material as the top plate 11 of the second embodiment.

The convex portion 62 is formed so as to surround the outer periphery near the bottom surface of the electronic component 30 at a position where the electronic component 30 is placed on the upper surface of the top plate 61. Therefore, in the transport pallet 60 of the present embodiment, the horizontal position of the electronic component 30 can be maintained between the convex portions 62. The height of the convex portion 62 is set to a depth that is not affected by the side surface when the electronic component 30 is picked up. The convex portion 62 is formed of a non-magnetic material like the top plate 61. The materials of the top plate 61 and the convex portion 62 may be the same or different.

The transport pallet 60 of the present embodiment can be used in the parts supply system in the same manner as the transport pallet 60 of the second embodiment. That is, the transport pallet 60 of the present embodiment can be used in place of the transport pallet 60 in the parts supply system of the second embodiment. The transport pallet 60 of the present embodiment is transported to the component supply device in a state where the electronic component 30 is fixed between the convex portions 62 on the upper surface of the top plate 61.

By using the transport pallet 60 of the present embodiment in the parts supply system, the same effect as that of the second embodiment can be obtained. Further, in the transport pallet 60 of the present embodiment, since the electronic component 30 is fixed to the top plate 61 at the position of the convex portion 62, the electronic component 30 can be prevented from being displaced or dropped without using an adhesive sheet. Can be done. Further, in the transport pallet 60 of the present embodiment, since the adhesive force due to the adhesive sheet does not exist, the electronic component 30 can be picked up more easily.

(Fifth Embodiment)
A fifth embodiment of the present invention will be described in detail with reference to the drawings. FIG. 17 shows the configuration of the transport pallet 70 of the present embodiment. In FIG. 17, the electronic component 30 is provided on the transport pallet 70. The configuration of the electronic component 30 is the same as that of the second embodiment. The transport pallet 70 of the present embodiment includes a top plate 71, an adhesive sheet 72, a magnetic material 73, and a slide mechanism 74.

In the transport pallet 10 of the second embodiment, the position of the magnetic body 13 in the height direction is adjusted by the leaf spring 14, but in the transport pallet 70 of the present embodiment, the height of the magnetic body 73 is adjusted by the slide mechanism 74. It is characterized by adjusting the position of the direction.

The configuration of the transport pallet 70 will be described. The configurations and functions of the top plate 71, the adhesive sheet 72, and the magnetic material 73 of the present embodiment are the same as those of the parts of the same name in the second embodiment.

The slide mechanism 74 can adjust the position of the magnetic body 73 in the height direction. The adjustment of the position of the magnetic body 73 in the height direction of the present embodiment is performed by moving the entire slide mechanism 74 with respect to the top plate 71. The position of the magnetic body 73 in the height direction may be adjusted so that the magnetic body 73 moves up and down according to the vertical rail provided as the slide mechanism 74.

The transport pallet 70 of the present embodiment can be used in the parts supply system in the same manner as the transport pallet 70 of the second embodiment. In the parts supply system of the second embodiment, when used in place of the transport pallet 70, the parts supply device controls the slide mechanism 74 to move the magnetic body 73 up and down.

By using the transport pallet 70 of the present embodiment in the parts supply system, the same effect as that of the second embodiment can be obtained. Further, in the transport pallet 70 of the present embodiment, the distance between the electronic component 30 and the magnetic body 73 is controlled by the slide mechanism 74, so that the distance between the electronic component 30 and the magnetic body 73 can be controlled more accurately. .. Therefore, it becomes easier to control the force that the electronic component 30 and the magnetic body 73 attract by the magnetic force, and it becomes possible to cope with the case where the characteristics and the amount of the magnetic material contained in the electronic component 30 are different.

(Sixth Embodiment)
A sixth embodiment of the present invention will be described in detail with reference to the drawings. FIG. 18 shows the configuration of the transport pallet 80 of the present embodiment. In FIG. 18, the electronic component 30 is provided on the transport pallet 80. The configuration of the electronic component 30 is the same as that of the second embodiment. The transport pallet 80 of the present embodiment includes a top plate 81, an adhesive sheet 82, a magnetic material 83, and a clip 84.

In the transport pallet 10 of the second embodiment, the magnetic body 13 is held below the top plate 11 by the leaf spring 14, but in the transport pallet 80 of the present embodiment, the magnetic body 83 is clipped to the top plate 81. It is characterized in that it is held at a position in contact with the bottom surface of the.

The configuration of the transport pallet 80 will be described. The configurations and functions of the top plate 81, the adhesive sheet 82, and the magnetic material 83 of the present embodiment are the same as those of the parts of the same name in the second embodiment.

The clip 84 holds the magnetic body 83 on the bottom surface of the top plate 81 by sandwiching the top plate 81 and the magnetic body 83 in a state of being integrated from the horizontal direction. The clip 84 sandwiches the top plate 81 and the magnetic material 83 between two opposite sides of the top plate 81, for example. Further, when the magnetic body 83 is separated from the top plate 81, the fixing of the top plate 81 and the magnetic body 83 is released by removing the clip 84 from the top plate 81 and the magnetic body 83.

The transport pallet 80 of the present embodiment can be used in the parts supply system in the same manner as the transport pallet 80 of the second embodiment. When the transport pallet 80 of the present embodiment is used, the parts supply device has a mechanism for attaching and detaching the clip 84 from the top plate 81 and a mechanism for holding the bottom surface side of the magnetic body 83. When picking up the electronic component 30, the component supply device removes the clip 84 from the top plate 81 while holding the bottom surface of the magnetic body 83, and lowers the magnetic body 83. When the magnetic body 83 is lowered to a position where a force attracted by the magnetic force is not generated between the electronic component 30 and the magnetic body 83, the component supply device picks up the electronic component 30. When the electronic component 30 is picked up from the top plate 81, the magnetic body 83 is returned to a position where it comes into contact with the top plate 81, and the top plate 81 and the magnetic body 83 are fixed by the clip 84. The transport pallet 80 to which the top plate 81 and the magnetic body 83 are fixed by the clip 84 is returned from the component supply device to the member stocker or the like, and is used again for transport.

By using the transport pallet 80 of the present embodiment in the parts supply system, the same effect as that of the second embodiment can be obtained. Further, in the transport pallet 80 of the present embodiment, since the top plate 81 and the magnetic body 83 are fixed by the clip 84, the position of the magnetic body 83 does not shift due to vibration or impact during transport. Therefore, by using the transport pallet 80 of the present embodiment, the transport pallet 80 can be transported in a state where the electronic component 30 is more reliably fixed to the top plate 81.

(7th Embodiment)
A seventh embodiment of the present invention will be described in detail with reference to the drawings. FIG. 19 shows an outline of the configuration of the parts supply system of the present embodiment. The parts supply system of the present embodiment includes a transport pallet 10 and a parts supply device 90. Further, the electronic component 30 is held on the transport pallet 10. In the second embodiment, the transport pallet 10 is set so that the plane of the top plate 11 of the transport pallet 10 is horizontal, but in the present embodiment, the plane of the top plate 11 of the transport pallet 10 is in the horizontal direction. It is characterized by having an angle with respect to.

The transport pallet 10 and the electronic component 30 of the present embodiment are the same as those of the second embodiment, respectively.

The parts supply device 90 includes a transport pallet holding unit 91, a magnetic force adjusting unit 92, and a pickup unit 93.

The transport pallet holding portion 91 is a mounting portion for setting the transport pallet 10 in the parts supply device 90. The transport pallet holding unit 91 holds the transport pallet 10 at a predetermined angle so that the position of the plane of the transport pallet 10 does not shift. The predetermined angle is set based on the design of the component supply device 90.

The magnetic force adjusting unit 92 applies an external force to the leaf spring 14 in a direction away from the top plate 11. The magnetic force adjusting unit 92 changes the elongation amount of the leaf spring 14 by moving in the direction perpendicular to the plane direction of the top plate 11, and adjusts the elongation amount of the leaf spring 14. When the magnetic force adjusting unit 92 applies an external force to the leaf spring 14, the distance between the lower surface of the top plate 11 and the magnetic body 13 changes, and the distance between the electronic component 30 and the magnetic body 13 changes.

The pickup unit 93 has a function of picking up the electronic component 30 from the transport pallet 10 and transporting the electronic component 30 onto a circuit board or the like on which the electronic component 30 is mounted. The pickup unit 93 of the present embodiment is composed of a transfer arm and a vacuum suction unit attached to the transfer arm. The pickup unit 93 holds and picks up the electronic component 30 on the transport pallet 10 by vacuum suction, and transports the electronic component 30 to a unit in which a circuit board or the like is set. The pickup of the electronic component 30 may be based on another method.

The operation of the parts supply system of this embodiment will be described. The operation until the electronic component 30 is fixed to the transfer pallet 10 and set in the transfer pallet holding unit 91 of the component supply device 90 is the same as that of the second embodiment.

When the transport pallet 10 is set on the transport pallet holding portion 91, the magnetic force adjusting portion 92 applies a force to the magnetic body 13 in a direction away from the top plate 11. The magnetic force adjusting unit 92 moves the magnetic body 13 to a position where the force attracted by the magnetic force of the magnetic body 13 to the electronic component 30 is weakened to a predetermined force. The magnetic force adjusting unit 92 moves the magnetic body 13 to a position where the magnetic force acts to the extent that the electronic component 30 on the top plate 11 does not fall off.

When the magnetic force adjusting unit 92 separates the magnetic body 13 from the top plate 11, the electronic component 30 is fixed to the top plate 11 by the force due to the weak magnetic force between the magnetic force 13 and the adhesive force of the adhesive sheet 12. Become.

When the magnetic body 13 is separated from the top plate 11 by the magnetic force adjusting unit 92, the pickup unit 93 picks up the electronic component 30 from the transfer pallet 10. When the pickup unit 93 picks up the electronic component 30 from the top plate 11 and conveys it, the magnetic force adjusting unit 92 releases the state of holding the magnetic body 13. When the magnetic body 13 is no longer held by the magnetic force adjusting portion 92, the leaf spring 14 moves the magnetic body 13 to a position where it comes into contact with the top plate 11 by an elastic force. When the leaf spring 14 pushes up the magnetic body 13 to a position where it comes into contact with the top plate 11, the transport pallet 10 is removed from the transport pallet holding portion 91 and stored in a member stocker or the like.

In the above description, after the electronic component 30 is released from being fixed to the top plate 11 by magnetic force, the pickup unit 93 operates to hold the electronic component 30, but the pickup unit 93 attracts the electronic component 30 and the like. The fixed state may be released after holding with.

Further, the transport pallet 10 of the present embodiment may be configured not to include the adhesive sheet 12. In such a configuration, the distance between the electronic component 30 and the magnetic body 13 is set so that the electronic component 30 does not fall off from the top plate 11.

By using it in the parts supply system of the present embodiment, the same effect as that of the second embodiment can be obtained. Further, in the present embodiment, when the electronic component 30 is picked up, the distance between the electronic component 30 and the magnetic body 13 is controlled so that a force attracted by the magnetic force remains between the electronic component 30 and the magnetic body 13. Therefore, in the present embodiment, even if the top plate 11 of the transport pallet 10 is not installed so as to be horizontal, the electronic component 30 does not fall off or is misaligned, and can be easily mounted on the transport pallet 10. It will be possible to pick up. As a result, in the parts supply system of the present embodiment, the degree of freedom in device design is improved.

The configurations of the second to seventh embodiments may be used in combination with each other. For example, the configuration of the transport pallet having the uneven structure of the third or fourth embodiment may be applied to the structure of the transport pallet of the fifth to seventh embodiments, respectively.

In the second to seventh embodiments, examples are shown in which the transport pallets each hold one electronic component, but the transport pallet may be configured to hold a plurality of electronic components at the same time. FIG. 21 shows the configuration when the two electronic components 30 are held in the configuration of the transport pallet 10 of the second embodiment. By providing the magnetic material 13 at a position corresponding to the plurality of electronic components 30 as shown in FIG. 21, the electronic components 30 can be conveyed and picked up in the same manner as in the second embodiment.

FIG. 22 shows an example in which one magnetic body 13 is formed so as to exist entirely below the plurality of electronic components 30. Even in the configuration as shown in FIG. 22, the electronic component 30 can be conveyed and picked up in the same manner as in the second embodiment. FIG. 23 shows a configuration in which a leaf spring 14 is provided for each magnetic material 13. With the configuration as shown in FIG. 23, since a large elastic force is not required for each leaf spring 14, the elastic force of the leaf spring 14 can be appropriately selected even if the number of magnetic bodies 13 increases.

Further, in the configurations shown in FIGS. 21, 22 and 23, the number of the electronic component 30 and the magnetic body 13 may be three or more. Further, the configurations shown in FIGS. 21, 22 and 23 can be similarly applied to the third to seventh embodiments.

1 Plate 2 Magnetic material 3 Adjusting part 10 Conveying pallet 11 Top plate 12 Adhesive sheet 13 Magnetic material 14 Leaf spring 15 Magnetic material 20 Parts supply device 21 Conveying pallet holding part 22 Magnetic force adjusting part 23 Picking up part 30 Electronic parts 31 Electronic parts 41 Conveying Pallet holding part 50 Transport pallet 51 Top plate 52 Recessed 53 Magnetic material 54 Leaf spring 60 Transport pallet 61 Top plate 62 Convex part 63 Magnetic material 64 Leaf spring 70 Transport pallet 71 Top plate 72 Adhesive sheet 73 Magnetic material 74 Slide mechanism 80 Transport pallet 81 Top plate 82 Adhesive sheet 83 Magnetic material 84 Clip 90 Parts supply device 91 Transport pallet holding part 92 Magnetic force adjustment part 93 Pickup part

Claims (10)

A plate made of non-magnetic material that holds electronic components on the first surface,
A magnetic material provided on the second surface side of the plate opposite to the first surface and attracted to the electronic component by magnetic force.
By changing the distance between the second surface and the magnetic material in a direction away from the magnetic body, the force in the first surface direction applied to the electronic component by the magnetic force is fixed to the first surface by the electronic component. An adjustment unit that weakens the force to start transporting the electronic component in the state of being
A transport pallet characterized by being provided with. The first aspect of claim 1, wherein the adjusting portion is formed by a spring, and the spring is formed so that an elastic force of the spring in the direction of the second surface is applied to the magnetic body. Transport pallet. The transport pallet according to claim 1, wherein the adjusting unit has a slide mechanism for moving the magnetic material in a direction perpendicular to the second surface. The transport pallet according to any one of claims 1 to 3, wherein the plate has a convex portion or a concave portion formed at a position on the first surface for holding the electronic component. The transport pallet according to any one of claims 1 to 4, wherein an adhesive layer is formed at least in a region of the first surface of the plate for holding the electronic component. A pallet holding means for holding the transport pallet according to any one of claims 1 to 5.
A magnetic force adjusting means for controlling the adjusting portion of the transport pallet to change the distance between the magnetic body and the second surface to adjust the magnetic force acting between the electronic component and the magnetic body.
A transport means that picks up and transports the electronic component on the transport pallet, and
With
When the electronic component is held on the first surface of the transport pallet, the magnetic force adjusting means controls the adjusting unit in a direction that reduces the force acting between the electronic component and the magnetic body. The transport device is characterized in that when the position of the magnetic body is moved and the force acting between the electronic component and the magnetic body is reduced, the transport means picks up and transports the electronic component. 6. The sixth aspect of the present invention is that, when the electronic component is picked up and conveyed, the magnetic force adjusting means controls the adjusting unit so that the second surface and the magnetic material are in contact with each other. The carrier described. Hold the electronic component on the first surface of a plate made of non-magnetic material,
The electronic component is fixed to the first surface by a force attracted by a magnetic force between the magnetic material provided on the second surface side of the plate opposite to the first surface and the electronic component.
By changing the distance between the second surface and the magnetic material in a direction away from the magnetic body, the force in the first surface direction applied to the electronic component by the magnetic force is fixed to the first surface by the electronic component. A transport method characterized in that the force at which the transport of the electronic component can be started is weakened in this state. The position of the magnetic material is moved in a direction that reduces the force acting between the electronic component and the magnetic material.
The transport method according to claim 8, wherein when the force acting between the electronic component and the magnetic material is reduced, the electronic component is picked up and transported. When moving the position of the magnetic material in a direction that reduces the force acting between the electronic component and the magnetic material, the spring attached between the plate and the magnetic material is elastically deformed.
The transport method according to claim 9, wherein when the pick-up of the electronic component is completed, the position of the magnetic material is returned to the direction of the plate by the elastic force of the spring.

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