JP2002012319A - Substrate conveying device and substrate conveying method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate conveying device for reliably conveying a substrate mounted with electric parts at a low cost without dropping the electric parts and damaging the substrate. SOLUTION: This substrate conveying device 10 is provided with a vertically and horizontally movable arm body 11. A plurality of glass substrate suction pads 12 for sucking and supporting the upper surface of a glass substrate 21, and a plurality of electronic part suction pads 13 arranged above and facing respective electronic parts 22 and sucking and supporting the upper surfaces of the electronic parts 22 are attached to the arm body 11. Respective suction pads 12, 13 are connected to a vacuum source through a suction system. Adjusting mechanisms for adjusting the relative position in relation to the arm body 11 is provided on respective suction pads 12, 13, and the attaching positions can be adjusted on the arm body 11 according to the size and the position of the glass substrate 21 or the electronic parts 22. Springs 15 for absorbing impact applied to the electronic parts 22 when respective suction pads 13 are brought into contact with the electronic parts 22 is provided on respective suction pads 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for manufacturing a flat panel display or the like represented by a liquid crystal panel, and more particularly to a substrate transport apparatus and a substrate for transferring a glass substrate between processes. It relates to a transport method.

[0002]

2. Description of the Related Art Conventionally, as a component mounting apparatus for manufacturing a flat panel display represented by a liquid crystal panel, an electronic component (FPC) formed in a film shape has been used.
(Flexible printed circuit) or COF (chip on fil
m), a component mounting apparatus that mounts a TCP (tape carrier package) on a glass substrate is known.

FIG. 6 is a view showing an example of a glass substrate on which electronic components are mounted by such a component mounting apparatus. As shown in FIG. 6, the glass substrate 21 has two different sizes.
Various types of substrates 21a and 21b are attached to each other, and a plurality of electronic components 22 are mounted on the front and rear surfaces (the lower surface of the upper substrate 21a and the upper surface of the lower substrate 21b) on the outer periphery.

Here, the glass substrate 21 on which the electronic components 22 are mounted is transferred between processes by a substrate transfer device 30 as shown in FIGS. 7 (a) and 7 (b). Fig. 7 (a)
As shown in (b), the substrate transfer device 30 includes an arm main body 31 movable vertically and horizontally and a plurality of suction pads 32 provided on the lower surface of the arm main body 31 to adsorb and support the upper surface of the glass substrate 21. And each of these suction pads 3
2 while supporting the glass substrate 21 by the glass substrate 2
1 (glass substrate 21 on which electronic components 22 are mounted) is transported between processes.

[0005] In recent years, glass substrates used in flat panel displays have become extremely large, and accordingly, electronic components mounted on the glass substrates have also become large. That is, as an electronic component mounted on a glass substrate, an electronic component having a large outer dimension and connected to a printed board, a heat radiating plate, or the like has been used. Therefore, when the glass substrate on which such electronic components are mounted is transported by the substrate transport device 30 as shown in FIGS. 7A and 7B, the electronic component 22 hangs down from the glass substrate 21 by its own weight, and other units There is a possibility that the electronic component 22 may drop during the transportation due to interference with the electronic component 22 or vibration applied during the transportation (FIG. 7A). Also,
The electronic component 22 may collide with the glass substrate 21 due to the vibration applied during the transportation, and may damage the glass substrate 21 (FIG. 7B).

Therefore, when a large glass substrate used in a flat panel display or the like is transported, FIG.
As shown in FIG. 2, the glass substrate 2 on which the electronic component 22 is mounted
In general, a method of mounting the tray 1 on a tray 33 and transporting the tray 33 together with a transport arm or a transport stage is used.

[0007]

However, since the tray 33 for transporting a large glass substrate is large and heavy, it is difficult to replace the tray 33 manually, and a handling mechanism (tray) for the tray 33 is required. 33
It is necessary to separately provide a mechanism for returning from the downstream process to the upstream process. For this reason, there is a problem that the installation area and cost of the apparatus increase. Further, since it is necessary to prepare a tray for each type of flat panel display (that is, the size of the glass substrate), there is a problem that the running cost increases.

The present invention has been made in view of the above points, and a board on which electronic components are mounted can be transported at a low cost and reliably without causing the electronic components to fall or the board to be damaged. It is an object of the present invention to provide a substrate transfer apparatus and a substrate transfer method that can perform the method.

[0009]

According to the present invention, there is provided an arm body disposed above a substrate, a first support mechanism mounted on the arm body and supporting the substrate from above, and mounted on the arm body. And a second support mechanism for supporting a plurality of electronic components mounted on the substrate from above.

In the present invention, the first support mechanism and the second support mechanism each include a plurality of first support members arranged corresponding to the substrate. It is preferable that the mounting position of the two support members be adjustable on the arm body. An impact buffering mechanism is provided between each of the second support members or each of the first support members and the arm body to absorb an impact applied to each of the electronic components at the time of contact with each of the electronic components. Is preferred. Further, each of the second
Preferably, the support member is configured such that its operating state is selectively controlled.

The present invention also relates to a board transfer method for transferring a board on which electronic components are mounted from a first position to a second position, wherein the arm body is lowered from above toward the board positioned at the first position. Making the electronic component mounted on the substrate attached to the arm body from above, while supporting the substrate with a first support mechanism that supports the substrate attached to the arm body from above, A step of supporting the electronic component by a second supporting mechanism that supports the electronic component, a step of positioning the substrate on which the electronic component is mounted at a second position by moving the arm body in a vertical direction and a horizontal direction; Releasing the support of the substrate by the first support mechanism and releasing the support of the electronic component by the second support mechanism. To provide a delivery method.

According to the present invention, the first support mechanism for supporting the board from above and the second support for supporting a plurality of electronic components mounted on the board from above are provided on the arm body disposed above the board. With the mechanism, it is possible to prevent the electronic component from dripping from the substrate by its own weight when the substrate on which the electronic component is mounted is transported, and to prevent the electronic component from being transported when the electronic component is dropped. Inexpensive and reliable operation can be performed without damaging the substrate.

According to the present invention, the mounting positions of the first support members and the second support members can be adjusted on the arm main body, so that the arm can be adjusted according to the size and position of the board or the electronic component. The mounting position can be adjusted on the main body, so that optimal transport can be realized for each type of flat panel display to be manufactured.

Further, according to the present invention, a shock buffer mechanism between each second support member and the arm body for absorbing a shock applied to each electronic component when each second support member comes into contact with the electronic component. Is provided, it is possible to prevent unnecessary impact and load from being applied to each electronic component when each second support member comes into contact with the electronic component.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1A and 1B are views for explaining an embodiment of the substrate transfer apparatus according to the present invention. Here, FIG. 1 (a) is a front view showing a substrate transfer device according to the present embodiment, and FIG. 1 (b) shows a glass substrate with electronic components transferred by the substrate transfer device shown in FIG. 1 (a). FIG.

As shown in FIGS. 1A and 1B, a substrate transfer apparatus 10 according to the present embodiment transfers a glass substrate 21 on which electronic components 22 are mounted between processes. The glass substrate 21 to be transported is formed by laminating two types of substrates 21a and 21b having different sizes, and a plurality of electronic substrates are provided on both front and rear surfaces of the outer periphery (the lower surface of the upper substrate 21a and the upper surface of the lower substrate 21b). The component 22 is mounted.

As shown in FIGS. 1A and 1B, the substrate transfer device 1
Numeral 0 is provided with an arm body 11 which is arranged above the glass substrate 21 and which can move up and down and left and right.
The arm main body 11 has a plurality of glass substrate suctions disposed as a first support mechanism for supporting the glass substrate 21 from above, corresponding to the glass substrate 21 and adsorbing and supporting the upper surface of the glass substrate 21. Pad (first support member) 1
2 are provided. Further, the arm body 11 is disposed above and corresponding to each of the electronic components 22 as a second support mechanism for supporting the plurality of electronic components 22 mounted on the glass substrate 21 from above. Electronic component suction pad (second support member) 13 for sucking and supporting the upper surface
Is provided. In addition, each glass substrate suction pad 1
2 and a suction pad 13 for each electronic component are provided by a suction system (FIG. 4).
Are connected to a vacuum source (see reference numeral 18 in FIG. 4) through reference numerals 16a to 16d.

Of these, each glass substrate suction pad 12
Is provided with an adjusting mechanism (not shown) for adjusting a relative position with respect to the arm main body 11. The adjustment mechanism is provided on the arm main body 11 in accordance with the size (width and thickness of the glass substrate 21) and the position thereof. Mounting position (vertical and horizontal position and height)
Can be adjusted. Each electronic component suction pad 13 is provided with an adjusting mechanism (not shown) for adjusting a relative position with respect to the arm main body 11, so that the size (length and width and thickness) and position of the electronic component 22 can be adjusted. Depending on its mounting position (vertical and horizontal position and height)
Can be adjusted. Further, each of the electronic component suction pads 13 has a spring (impact buffering mechanism) that absorbs an impact applied to the electronic component 22 when the electronic component suction pad 13 comes into contact with the electronic component 22.
15 are provided.

Each electronic component suction pad 13 has
A sensor (not shown) may be provided to detect the state of support of the electronic component 22 by each electronic component suction pad 13 (presence or absence of the electronic component 22).
2 can be effectively detected as a manufacturing defect due to a drop or the like.

Next, referring to FIGS. 2A, 2B, 2C, 2D and 2E, the operation of this embodiment having such a configuration will be described. Here, the case where the glass substrate 21 on which the electronic component 22 is mounted (hereinafter, also simply referred to as “glass substrate 21”) is transferred from the previous process to the next process by the substrate transfer device 10 will be described as an example.

First, the substrate transfer device 10 is moved to the substrate receiving position by moving the arm body 11 to the left (FIG. 2A). At this time, the substrate transfer stage 41 in the previous process has moved to the substrate delivery position (first position) with the glass substrate 21 placed thereon.

In this state, by moving the arm body 11 downward, the substrate transfer device 10 is lowered, and all the suction pads 12 for glass substrates and the suction pads 13 for electronic components attached to the arm body 11 are removed. The glass substrate 21 and the electronic component 22 are set as the suction state (operation state).
Is adsorbed and supported (FIG. 2 (b)).

Thereafter, by moving the arm body 11 upward and to the right, the substrate transfer device 10 is raised, and then moved to the substrate transfer position (second position) in the next step (FIG. 2C). ). At this time, the substrate transport stage 42 in the next process has moved to the substrate receiving position.

Subsequently, the substrate transfer device 10 is lowered by moving the arm main body 11 downward, and the glass substrate 21 is placed on the substrate transfer stage 42 in the next step (FIG. 2 (d)).

Thereafter, all the glass substrate suction pads 12 and electronic component suction pads 13 attached to the arm body 11 are brought into a non-sucking state (non-operating state), and the glass substrate 21 and the electronic parts 22 are removed. Body 1
1 is moved upward, the substrate transfer device 10
Is raised (FIG. 2 (e)).

As described above, according to the present embodiment, the glass substrate suction pad 1 supporting the glass substrate 21 from above is attached to the arm body 11 disposed above the glass substrate 21.
2 and a plurality of electronic components 2 mounted on the glass substrate 21
Electronic device suction pads 12 for supporting electronic components 2 from above
Is provided, it is possible to prevent the electronic component 22 from dropping from the glass substrate 21 by its own weight when the glass substrate 21 on which the electronic component 22 is mounted is transferred, and the glass substrate 21 on which the electronic component 22 is mounted can be prevented. Transport the electronic components 2
2 can be performed inexpensively and reliably without causing the glass substrate 21 to fall or the glass substrate 21 to be damaged.

Further, according to the present embodiment, the mounting position of each glass substrate suction pad 12 and each electronic component suction pad 13 can be adjusted on the arm main body 11, so that the glass substrate 21 or the Arm body 11 according to the dimensions (width and thickness in the vertical and horizontal directions) and position of electronic component 22
The mounting position (vertical and horizontal position and height) can be adjusted above, so that optimal transport can be realized for each type of flat panel display to be manufactured.

Further, according to the present embodiment, when each of the electronic component suction pads 13 comes into contact with the electronic component 22 between the electronic component suction pad 13 and the arm body 11, the electronic component 22 is attached to the electronic component 22. Since the spring (shock buffering mechanism) 15 for absorbing the applied shock is provided, unnecessary shock and load are applied to each electronic component 22 when each electronic component suction pad 13 comes into contact with the electronic component 22. Can be prevented.

In the above-described embodiment, the electronic component suction pad 1 provided on the arm body 11 when the glass substrate 21 on which the electronic component 22 is mounted is carried.
However, the present invention is not limited to this, and the suction state (operating state) of each electronic component suction pad 13 is selectively controlled in accordance with the type of flat panel display to be manufactured, and the electronic component 22 is controlled. The suction pad 13 for an electronic component corresponding to a position where no is present or a position where support is not required may be set to a non-suction state (non-operation state). Specifically, for example, as shown in FIG. 3, a drive mechanism 14 for raising and lowering the electronic component suction pads is provided for each of the plurality of electronic component suction pads 13, and each electronic component is controlled by a control device (not shown). The suction pad 13 for use may be moved to either the support position or the retreat position. As shown in FIG. 4, the vacuum source 18 and the suction pad 13 for each electronic component are used.
And a plurality of adsorption systems 16a to 16d may be provided between them, and the adsorption system may be switched by the vacuum solenoid valve 17. In FIG. 4, one suction system is assigned to each side of the glass substrate 21. However, the present invention is not limited to this.
It is also possible to assign one system to each of the electronic component suction pads 13. Note that the selection information of each electronic component suction pad 13 is held together with the type information of the flat panel display to be manufactured, and the suction state of the electronic component suction pad 13 is controlled via a control device (not shown). Control may be performed automatically.

Further, in the above-described embodiment, the upper surface of each electronic component 22 is sucked and supported by the electronic component suction pad 13. However, the present invention is not limited to this, and as shown in FIG. Each electronic component 22 by the support arm 19
May be supported from the lower surface side.

Further, in the above embodiment,
Although the spring 15 is provided on the electronic component suction pad 13,
However, the present invention is not limited to this, and it is also possible to provide a similar mechanism on the suction pad 12 for a glass substrate.

In the above-described embodiment, a glass substrate used in a flat panel display has been described as an example. However, the present invention is not limited to this and can be applied to any substrate.

[0033]

As described above, according to the present invention, the board on which the electronic components are mounted can be transported inexpensively and reliably without causing the electronic components to fall or the board to be damaged.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of a substrate transfer device according to the present invention.

FIG. 2 is a view showing a state where a glass substrate is transferred between processes by a substrate transfer device shown in FIG. 1;

FIG. 3 is a diagram showing a modification of the substrate transfer device shown in FIG.

FIG. 4 is a view showing another modified example of the substrate transfer device shown in FIG. 1;

FIG. 5 is a view showing still another modified example of the substrate transfer device shown in FIG. 1;

FIG. 6 is a view showing a glass substrate on which electronic components are mounted.

FIG. 7 is a diagram showing an example of a conventional substrate transfer device.

FIG. 8 is a diagram showing another example of a conventional substrate transfer device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate transfer apparatus 11 Arm main body 12 Suction pad for glass substrates (1st support member) 13 Suction pad for electronic components (2nd support member) 14 Drive mechanism 15 Spring (impact buffering mechanism) 16a-16d Suction system 17 Vacuum electromagnetic valve Reference Signs List 18 vacuum source 19 support arm for electronic component 21 glass substrate 21a upper substrate 21b lower substrate 22 electronic component

Claims (7)

[Claims] An arm body; a first support mechanism attached to the arm body to support the board from above; and a plurality of electronic components mounted to the arm body and mounted on the board from above. And a second support mechanism for performing the operation. 2. The first support mechanism has a first support member arranged corresponding to the substrate, and the position of the first support member can be adjusted on the arm body. The substrate transfer device according to claim 1, wherein: 3. The first support mechanism has a plurality of first support members arranged corresponding to the substrate, and a contact between the first support member and the arm body is provided between the first support member and the arm body. 2. The substrate transfer apparatus according to claim 1, further comprising an impact buffering mechanism for absorbing an impact applied to said substrate at times. 4. The second support mechanism has a second support member arranged corresponding to each of the electronic components, and the position of each of the second support members can be adjusted on the arm body. The substrate transfer device according to claim 1, wherein 5. The electronic device according to claim 1, wherein the second support mechanism has a second support member arranged corresponding to each of the electronic components, and a second support member disposed between the second support member and the arm body. 2. The substrate transfer device according to claim 1, further comprising an impact buffering mechanism that absorbs an impact applied to each of the electronic components at the time of contact. 6. The second support mechanism has a second support member arranged corresponding to each of the electronic components, and each of the second support members is configured to selectively control an operation state thereof. 2. The substrate transfer device according to claim 1, wherein: 7. A board transfer method for transferring a board on which electronic components are mounted from a first position to a second position, wherein the arm body is lowered from above toward the board positioned at the first position. While supporting the substrate with a first support mechanism that supports the substrate from above attached to the arm body,
A step of supporting the electronic component by a second support mechanism that supports the electronic component mounted on the board attached to the arm body from above, by moving the arm body vertically and horizontally. Positioning the substrate on which the electronic component is mounted at a second position; and releasing the support of the substrate by the first support mechanism and releasing the support of the electronic component by the second support mechanism. A substrate transfer method characterized by the above-mentioned.