JP4041267B2 - Substrate transport apparatus and substrate transport method - Google Patents

Substrate transport apparatus and substrate transport method Download PDF

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Publication number
JP4041267B2
JP4041267B2 JP2000196542A JP2000196542A JP4041267B2 JP 4041267 B2 JP4041267 B2 JP 4041267B2 JP 2000196542 A JP2000196542 A JP 2000196542A JP 2000196542 A JP2000196542 A JP 2000196542A JP 4041267 B2 JP4041267 B2 JP 4041267B2
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substrate
support
electronic component
support mechanism
arm body
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JP2002012319A (en
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本 眞 一 荻
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2000196542A priority Critical patent/JP4041267B2/en
Priority to PCT/JP2001/009604 priority patent/WO2003037576A1/en
Priority to US10/480,924 priority patent/US7367601B2/en
Priority to TW090127546A priority patent/TWI226302B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、液晶パネルに代表されるフラットパネルディスプレイ等を製造するための部品実装装置に係り、とりわけ、工程間でガラス基板等を受け渡すための基板搬送装置および基板搬送方法に関する。
【０００２】
【従来の技術】
従来から、液晶パネルに代表されるフラットパネルディスプレイ等を製造するための部品実装装置として、フィルム状に形成された電子部品（ＦＰＣ（flexible printed circuit）やＣＯＦ（chip on film）、ＴＣＰ（tape carrier package）等）をガラス基板上に実装する部品実装装置が知られている。
【０００３】
図６はこのような部品実装装置により電子部品が実装されたガラス基板の一例を示す図である。図６に示すように、ガラス基板２１は、大きさの異なる２種類の基板２１ａ，２１ｂが貼り合わされてなり、その外周の表裏両面（上部基板２１ａの下面および下部基板２１ｂの上面）に複数の電子部品２２が実装されている。
【０００４】
ここで、このようにして電子部品２２が実装されたガラス基板２１は、図７(a)(b)に示すような基板搬送装置３０により工程間で受け渡される。図７(a)(b)に示すように、基板搬送装置３０は、上下および左右に移動可能なアーム本体３１と、アーム本体３１の下面に設けられガラス基板２１の上面を吸着して支持する複数の吸着パッド３２とを有し、これら各吸着パッド３２によりガラス基板２１を支持した状態でガラス基板２１（電子部品２２が実装されたガラス基板２１）を工程間で搬送するようになっている。
【０００５】
ところで、近年、フラットパネルディスプレイで用いられるガラス基板は非常に大型化してきており、それに伴ってガラス基板上に実装される電子部品も大型化してきている。すなわち、ガラス基板上に実装される電子部品として、外形寸法が大きく、かつプリント基板や放熱板等が接続された電子部品も用いられるようになってきている。このため、このような電子部品が実装されたガラス基板を図７(a)(b)に示すような基板搬送装置３０により搬送すると、電子部品２２がガラス基板２１から自重により垂れ、他のユニットとの干渉や搬送時の振動等により加えられる衝撃により電子部品２２が搬送途中で落下するおそれがある（図７(a)）。また、搬送時に加えられる振動により電子部品２２がガラス基板２１にぶつかり、ガラス基板２１を破損してしまうおそれもある（図７(b)）。
【０００６】
そこで、フラットパネルディスプレイ等で用いられる大型のガラス基板を搬送する場合には、図８に示すように、電子部品２２が実装されたガラス基板２１をトレイ３３上に載置し、トレイ３３ごと搬送アームまたは搬送ステージにより搬送する方法が用いられるのが一般的である。
【０００７】
【発明が解決しようとする課題】
しかしながら、大型のガラス基板を搬送するためのトレイ３３は大型でかつ重量があるので、トレイ３３を人手により交換することが難しく、トレイ３３用のハンドリング機構（トレイ３３を下流工程から上流工程に戻す機構）を別に設ける必要がある。このため、装置の設置面積やコストが増大するという問題がある。また、フラットパネルディスプレイの品種（すなわちガラス基板の寸法）ごとにトレイを準備する必要があるので、ランニングコストが増大するという問題がある。
【０００８】
本発明はこのような点を考慮してなされたものであり、電子部品が実装された基板の搬送を、電子部品の落下や基板の破損等を生じさせることなく安価かつ確実に行うことができる基板搬送装置および基板搬送方法を提供することを目的とする。
【０００９】
【課題を解決するための手段】
本発明は、アーム本体と、前記アーム本体に取り付けられ、基板を上方から支持する第１支持機構と、前記アーム本体に取り付けられ、前記基板上に実装された複数の電子部品を上方から支持する第２支持機構とを備え、第１支持機構は、基板に対応してその上方に配置され、基板の上面を吸着して支持する複数の第１支持部材を有し、第２支持機構は、各電子部品に対応してその上方に配置され、電子部品の上面を吸着して支持する複数の第２支持部材を有し、第２支持機構の第２支持部材は、上方から見た場合に、第１支持機構の第１支持部材の周縁方向外方に位置し、第２支持機構の第２支持部材の下面は、水平方向から見た場合に、第１支持機構の第１支持部材の下面よりも下方に位置していることを特徴とする基板搬送装置を提供する。
また、本発明は、アーム本体と、前記アーム本体に取り付けられ、基板を上方から支持する第１支持機構と、前記アーム本体に取り付けられ、前記基板上に実装された複数の電子部品を上方から支持する第２支持機構とを備え、第１支持機構は、基板に対応してその上方に配置され、基板の上面を吸着して支持する複数の第１支持部材を有し、第２支持機構は、各電子部品に対応してその上方に配置され、電子部品の上面を吸着して支持する複数の第２支持部材を有し、第２支持機構の第２支持部材は、上方から見た場合に、第１支持機構の第１支持部材の周縁方向外方に位置し、第２支持機構の第２支持部材の各々には、当該第２支持部材をアーム本体に対して昇降させる昇降機構が設けられ、前記第２支持部材の下面は、昇降機構によって降下されたときに、水平方向から見た場合に、第１支持機構の第１支持部材の下面よりも下方に位置していることを特徴とする基板搬送装置を提供する。
また、本発明は、アーム本体と、前記アーム本体に取り付けられ、基板を上方から支持する第１支持機構と、前記アーム本体に取り付けられ、前記基板上に実装された複数の電子部品を支持する第２支持機構とを備え、第１支持機構は、基板に対応してその上方に配置され、基板の上面を吸着して支持する複数の第１支持部材を有し、第２支持機構は、各電子部品に対応してその上方に配置され、電子部品の下面を支持する複数の第２支持部材を有し、第２支持機構の第２支持部材は、上方から見た場合に、第１支持機構の第１支持部材の周縁方向外方に位置し、第２支持機構の第２支持部材は、電子部品が実装された基板を搬送するときに、各電子部品をその下面側であって基板と反対側の周縁外方から支持することを特徴とする基板搬送装置を提供する。
【００１０】
なお、本発明においては、各第１支持部材および各第２支持部材は前記アーム本体上にてその取付位置が調整可能となっていることが好ましい。また、前記各第２支持部材または前記各第１支持部材と前記アーム本体との間には前記各電子部品との接触時に前記各電子部品に加えられる衝撃を吸収する衝撃緩衝機構が設けられていることが好ましい。さらに、前記各第２支持部材は各第２支持部材に対応する電子部品を吸着する状態が選択的に制御されるよう構成されていることが好ましい。
【００１１】
本発明は、電子部品が実装された基板を第１位置から第２位置へ搬送する基板搬送方法において、第１位置に位置付けられた前記基板に向けて上方からアーム本体を下降させる工程と、前記アーム本体に取り付けられた前記基板を上方から支持する第１支持機構の複数の第１支持部材にて前記基板を吸着して支持するとともに、前記アーム本体に取り付けられた前記基板に実装された前記電子部品を上方から支持する第２支持機構の複数の第２支持部材にて前記電子部品を吸着して支持する工程と、前記アーム本体を上下方向および水平方向に移動させることにより前記電子部品が実装された基板を第２位置に位置付ける工程と、前記第１支持機構による前記基板の支持を解除するとともに、前記第２支持機構による前記電子部品の支持を解除する工程とを含み、第２支持機構の第２支持部材が電子部品を吸着して支持する工程において、当該第２支持部材は、上方から見た場合に、第１支持機構の第１支持部材の周縁方向外方の位置であって、その下面が、水平方向から見た場合に、第１支持機構の第１支持部材の下面よりも下方の位置において、電子部品を吸着して支持することを特徴とする基板搬送方法を提供する。
【００１２】
本発明によれば、基板の上方に配置されたアーム本体に、基板を上方から支持する第１支持機構と、基板上に実装された複数の電子部品を上方から支持する第２支持機構とを設けているので、電子部品が実装された基板の搬送時に電子部品が基板から自重により垂れることを防止することができ、電子部品が実装された基板の搬送を、電子部品の落下や基板の破損等を生じさせることなく安価かつ確実に行うことができる。
【００１３】
また、本発明によれば、アーム本体上にて各第１支持部材および各第２支持部材の取付位置を調整可能とすることにより、基板または電子部品の寸法および位置に応じてアーム本体上にてその取付位置を調整することができ、このため製造対象となるフラットパネルディスプレイの品種ごとに最適な搬送を実現することができる。
【００１４】
さらに、本発明によれば、各第２支持部材とアーム本体との間に、各第２支持部材が電子部品と接触したときに各電子部品に加えられる衝撃を吸収する衝撃緩衝機構が設けられているので、各第２支持部材が電子部品と接触したときに各電子部品に対して不要な衝撃および負荷が加えられることを防止することができる。
【００１５】
【発明の実施の形態】
以下、図面を参照して本発明の実施の形態について説明する。図１(a)(b)は本発明による基板搬送装置の一実施の形態を説明するための図である。ここで、図１(a)は本実施の形態に係る基板搬送装置を示す正面図、図１(b)は図１(a)に示す基板搬送装置により搬送される電子部品付きのガラス基板を示す平面図である。
【００１６】
図１(a)(b)に示すように、本実施の形態に係る基板搬送装置１０は、電子部品２２が実装されたガラス基板２１を工程間で受け渡すためのものである。なお、搬送対象となるガラス基板２１は、大きさの異なる２種類の基板２１ａ，２１ｂが貼り合わされてなり、その外周の表裏両面（上部基板２１ａの下面および下部基板２１ｂの上面）に複数の電子部品２２が実装されている。
【００１７】
図１(a)(b)に示すように、基板搬送装置１０は、ガラス基板２１の上方に配置されるとともに上下および左右に移動可能なアーム本体１１を備えている。アーム本体１１には、ガラス基板２１を上方から支持する第１支持機構として、ガラス基板２１に対応してその上方に配置され、ガラス基板２１の上面を吸着して支持する複数のガラス基板用吸着パッド（第１支持部材）１２が設けられている。また、アーム本体１１には、ガラス基板２１上に実装された複数の電子部品２２を上方から支持する第２支持機構として、各電子部品２２に対応してその上方に配置され、電子部品２２の上面を吸着して支持する電子部品用吸着パッド（第２支持部材）１３が設けられている。なお、各ガラス基板用吸着パッド１２および各電子部品用吸着パッド１３は吸着系統（図４の符号１６ａ〜１６ｄ参照）を介して真空源（図４の符号１８参照）に接続されている。
【００１８】
このうち、各ガラス基板用吸着パッド１２には、アーム本体１１に対する相対位置を調整する調整機構（図示せず）が設けられており、ガラス基板２１の寸法（縦横の幅および厚さ）および位置に応じてアーム本体１１上にてその取付位置（縦横の位置および高さ）を調整することができるようになっている。また、各電子部品用吸着パッド１３には、アーム本体１１に対する相対位置を調整する調整機構（図示せず）が設けられており、電子部品２２の寸法（縦横の幅および厚さ）および位置に応じてその取付位置（縦横の位置および高さ）を調整することができるようになっている。さらに、各電子部品用吸着パッド１３には、これら各電子部品用吸着パッド１３が電子部品２２と接触したときに電子部品２２に加えられる衝撃を吸収するばね（衝撃緩衝機構）１５が設けられている。
【００１９】
なお、各電子部品用吸着パッド１３には、各電子部品用吸着パッド１３での電子部品２２の支持状況（電子部品２２の有無）を検出するセンサ（図示せず）を設けるようにしてもよく、これにより電子部品２２の落下等による製造不良を効果的に検出することができる。
【００２０】
次に、図２(a)(b)(c)(d)(e)により、このような構成からなる本実施の形態の作用について説明する。なおここでは、基板搬送装置１０により、電子部品２２が実装されたガラス基板２１（以下単に「ガラス基板２１」ともいう）を前工程から次工程へ受け渡す場合を例に挙げて説明する。
【００２１】
まず、アーム本体１１を左方向に移動させることにより、基板搬送装置１０を基板受取位置へ移動させる（図２(a)）。なおこのとき、前工程の基板搬送ステージ４１は、ガラス基板２１を載置した状態で基板受渡位置（第１位置）まで移動している。
【００２２】
この状態で、アーム本体１１を下方向に移動させることにより、基板搬送装置１０を下降させ、アーム本体１１に取り付けられた全てのガラス基板用吸着パッド１２および電子部品用吸着パッド１３を吸着状態（稼働状態）としてガラス基板２１および電子部品２２を吸着して支持する（図２(b)）。
【００２３】
その後、アーム本体１１を上方向および右方向に移動させることにより、基板搬送装置１０を上昇させた後、次工程の基板受渡位置（第２位置）へ移動させる（図２(c)）。なおこのとき、次工程の基板搬送ステージ４２は、基板受取位置まで移動している。
【００２４】
続いて、アーム本体１１を下方向に移動させることにより、基板搬送装置１０を下降させ、次工程の基板搬送ステージ４２上にガラス基板２１を載置する（図２(d)）。
【００２５】
その後、アーム本体１１に取り付けられた全てのガラス基板用吸着パッド１２および電子部品用吸着パッド１３を非吸着状態（非稼働状態）としてガラス基板２１および電子部品２２を外した後、アーム本体１１を上方向に移動させることにより、基板搬送装置１０を上昇させる（図２(e)）。
【００２６】
このように本実施の形態によれば、ガラス基板２１の上方に配置されたアーム本体１１に、ガラス基板２１を上方から支持するガラス基板用吸着パッド１２と、ガラス基板２１上に実装された複数の電子部品２２を上方から支持する複数の電子部品用吸着パッド１２とを設けているので、電子部品２２が実装されたガラス基板２１の搬送時に電子部品２２がガラス基板２１から自重により垂れることを防止することができ、電子部品２２が実装されたガラス基板２１の搬送を、電子部品２２の落下やガラス基板２１の破損等を生じさせることなく安価かつ確実に行うことができる。
【００２７】
また、本実施の形態によれば、アーム本体１１上にて各ガラス基板用吸着パッド１２および各電子部品用吸着パッド１３の取付位置が調整可能となっているので、ガラス基板２１または電子部品２２の寸法（縦横の幅および厚さ）および位置に応じてアーム本体１１上にてその取付位置（縦横の位置および高さ）を調整することができ、このため製造対象となるフラットパネルディスプレイの品種ごとに最適な搬送を実現することができる。
【００２８】
さらに、本実施の形態によれば、各電子部品用吸着パッド１３とアーム本体１１との間に、各電子部品用吸着パッド１３が電子部品２２と接触したときに各電子部品２２に加えられる衝撃を吸収するばね（衝撃緩衝機構）１５が設けられているので、各電子部品用吸着パッド１３が電子部品２２と接触したときに各電子部品２２に対して不要な衝撃および負荷が加えられることを防止することができる。
【００２９】
なお、上述した実施の形態においては、電子部品２２が実装されたガラス基板２１を搬送するときにアーム本体１１に設けられた電子部品用吸着パッド１３を全て稼働させているが、これに限らず、製造対象となるフラットパネルディスプレイの品種に応じて各電子部品用吸着パッド１３の吸着状態（稼働状態）を選択的に制御し、電子部品２２が存在しない位置または支持が必要でない位置に対応する電子部品用吸着パッド１３を非吸着状態（非稼働状態）としてもよい。具体的には例えば、図３に示すように、複数の電子部品用吸着パッド１３のそれぞれに当該電子部品用吸着パッドを昇降させる駆動機構１４を設け、制御装置（図示せず）により各電子部品用吸着パッド１３を支持位置または待避位置のいずれかに移動させるようにするとよい。また、図４に示すように、真空源１８と各電子部品用吸着パッド１３との間に複数の吸着系統１６ａ〜１６ｄを設け、真空電磁弁１７により吸着系統を切り替えるようにしてもよい。なお、図４においては、ガラス基板２１の辺ごとに吸着系統を一つずつ割り当てているが、これに限らず、各電子部品用吸着パッド１３のそれぞれに１系統ずつ割り当てることも可能である。なお、各電子部品用吸着パッド１３の選択情報は、製造対象となるフラットパネルディスプレイの品種情報とともに保持しておき、制御装置（図示せず）を介して電子部品用吸着パッド１３の吸着状態を自動的に制御するようにしてもよい。
【００３０】
また、上述した実施の形態においては、各電子部品２２の上面を電子部品用吸着パッド１３により吸着して支持しているが、これに限らず、図５に示すように、電子部品用支持アーム１９により各電子部品２２をその下面側から支持するようにしてもよい。
【００３１】
さらに、上述した実施の形態においては、電子部品用吸着パッド１３にばね１５を設けているが、これに限らず、ガラス基板用吸着パッド１２に同様の機構を設けることも可能である。
【００３２】
なお、上述した実施の形態においては、フラットパネルディスプレイで用いられるガラス基板を例に挙げて説明したが、これに限らず、任意の基板に対して適用することが可能である。
【００３３】
【発明の効果】
以上説明したように本発明によれば、電子部品が実装された基板の搬送を、電子部品の落下や基板の破損等を生じさせることなく安価かつ確実に行うことができる。
【図面の簡単な説明】
【図１】本発明による基板搬送装置の一実施の形態を示す図。
【図２】図１に示す基板搬送装置により工程間でガラス基板を受け渡す様子を示す図。
【図３】図１に示す基板搬送装置の変形例を示す図。
【図４】図１に示す基板搬送装置の他の変形例を示す図。
【図５】図１に示す基板搬送装置のさらに他の変形例を示す図。
【図６】電子部品が実装されたガラス基板を示す図。
【図７】従来の基板搬送装置の一例を示す図。
【図８】従来の基板搬送装置の他の例を示す図。
【符号の説明】
１０ 基板搬送装置
１１ アーム本体
１２ ガラス基板用吸着パッド（第１支持部材）
１３ 電子部品用吸着パッド（第２支持部材）
１４ 駆動機構
１５ ばね（衝撃緩衝機構）
１６ａ〜１６ｄ 吸着系統
１７ 真空電磁弁
１８ 真空源
１９ 電子部品用支持アーム
２１ ガラス基板
２１ａ 上部基板
２１ｂ 下部基板
２２ 電子部品[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus for manufacturing a flat panel display or the like typified by a liquid crystal panel, and more particularly to a substrate transfer apparatus and a substrate transfer method for transferring a glass substrate or the like between processes.
[0002]
[Prior art]
Conventionally, as a component mounting apparatus for manufacturing a flat panel display represented by a liquid crystal panel, an electronic component (FPC (flexible printed circuit), COF (chip on film), TCP (tape carrier) formed as a film is used. There is known a component mounting apparatus for mounting a package) on a glass substrate.
[0003]
FIG. 6 is a view showing an example of a glass substrate on which electronic components are mounted by such a component mounting apparatus. As shown in FIG. 6, the glass substrate 21 is formed by bonding two types of substrates 21a and 21b having different sizes, and a plurality of glass substrates 21 are provided on the front and back surfaces of the outer periphery (the lower surface of the upper substrate 21a and the upper surface of the lower substrate 21b). An electronic component 22 is mounted.
[0004]
Here, the glass substrate 21 on which the electronic component 22 is mounted in this way is transferred between processes by a substrate transfer device 30 as shown in FIGS. 7 (a) and 7 (b). As shown in FIGS. 7 (a) and 7 (b), the substrate transfer device 30 adsorbs and supports an arm main body 31 that can be moved vertically and horizontally, and an upper surface of the glass substrate 21 that is provided on the lower surface of the arm main body 31. A plurality of suction pads 32 are provided, and the glass substrate 21 (the glass substrate 21 on which the electronic component 22 is mounted) is transported between processes while the glass substrate 21 is supported by the suction pads 32. .
[0005]
By the way, in recent years, glass substrates used in flat panel displays have become very large, and accordingly, electronic components mounted on the glass substrate have also become large. That is, as an electronic component mounted on a glass substrate, an electronic component having a large external dimension and connected with a printed board, a heat sink, or the like has been used. For this reason, when the glass substrate on which such electronic components are mounted is conveyed by the substrate conveying device 30 as shown in FIGS. 7A and 7B, the electronic component 22 hangs down from the glass substrate 21 due to its own weight, and other units. There is a possibility that the electronic component 22 may fall during the transportation due to the impact caused by the interference with the vibration or the vibration during the transportation (FIG. 7A). Further, the electronic component 22 may collide with the glass substrate 21 due to vibration applied during transportation, and the glass substrate 21 may be damaged (FIG. 7B).
[0006]
Therefore, when transporting a large glass substrate used in a flat panel display or the like, as shown in FIG. 8, the glass substrate 21 on which the electronic component 22 is mounted is placed on the tray 33, and the entire tray 33 is transported. Generally, a method of carrying by an arm or a carrying stage is used.
[0007]
[Problems to be solved by the invention]
However, since the tray 33 for transporting a large glass substrate is large and heavy, it is difficult to manually replace the tray 33, and the handling mechanism for the tray 33 (the tray 33 is returned from the downstream process to the upstream process). It is necessary to provide a separate mechanism. For this reason, there exists a problem that the installation area and cost of an apparatus increase. Further, since it is necessary to prepare a tray for each type of flat panel display (that is, the size of the glass substrate), there is a problem that running cost increases.
[0008]
The present invention has been made in consideration of such points, and can transport a substrate on which an electronic component is mounted inexpensively and reliably without causing the electronic component to drop or the substrate to be damaged. It is an object to provide a substrate transfer apparatus and a substrate transfer method.
[0009]
[Means for Solving the Problems]
The present invention provides an arm body, a first support mechanism attached to the arm body and supporting a substrate from above, and a plurality of electronic components mounted on the arm body and mounted on the substrate from above. A second support mechanism, the first support mechanism is disposed above and corresponding to the substrate, and has a plurality of first support members that adsorb and support the upper surface of the substrate. A plurality of second support members that are disposed above and correspond to each electronic component and that support the upper surface of the electronic component by suction, and the second support member of the second support mechanism is viewed from above. The lower surface of the second support member of the second support mechanism is located on the outer periphery in the peripheral direction of the first support member of the first support mechanism, and the bottom surface of the first support member of the first support mechanism is viewed from the horizontal direction. Providing a substrate transfer device that is located below the lower surface That.
The present invention also provides an arm body, a first support mechanism attached to the arm body and supporting the substrate from above, and a plurality of electronic components attached to the arm body and mounted on the substrate from above. A second support mechanism for supporting the first support mechanism, the first support mechanism being disposed above and corresponding to the substrate, and having a plurality of first support members that adsorb and support the upper surface of the substrate. Has a plurality of second support members that are disposed above and correspond to each electronic component and that support the upper surface of the electronic component by suction, and the second support member of the second support mechanism is viewed from above. In this case, an elevating mechanism that is positioned outward in the peripheral direction of the first support member of the first support mechanism, and that raises and lowers the second support member relative to the arm body on each of the second support members of the second support mechanism. The lower surface of the second support member is provided by an elevating mechanism. When it is lowered, when viewed from the horizontal direction, to provide a substrate transfer apparatus is characterized in that located below the lower surface of the first support member of the first support mechanism.
The present invention also provides an arm main body, a first support mechanism that is attached to the arm main body and supports the substrate from above, and a plurality of electronic components that are attached to the arm main body and mounted on the substrate. A second support mechanism, the first support mechanism is disposed above and corresponding to the substrate, and has a plurality of first support members that adsorb and support the upper surface of the substrate. Corresponding to each electronic component, it has a plurality of second support members that are disposed above and support the lower surface of the electronic component, and the second support member of the second support mechanism is the first when viewed from above. located circumferentially outwardly of the first support member of the support mechanism, the second support member of the second support mechanism, when the transport of the substrate on which electronic components are mounted, a the lower surface of each electronic component substrate transport, characterized in that the support from the periphery outside of the substrate opposite To provide a location.
[0010]
In the present invention, it is preferable that the mounting positions of the first support members and the second support members can be adjusted on the arm body. In addition, an impact buffering mechanism is provided between each of the second support members or each of the first support members and the arm body to absorb an impact applied to each of the electronic components when in contact with each of the electronic components. Preferably it is. Furthermore, it is preferable that each of the second support members is configured to selectively control a state of sucking an electronic component corresponding to each second support member .
[0011]
The present invention provides a substrate transport method for transporting a substrate on which an electronic component is mounted from a first position to a second position, a step of lowering an arm main body from above toward the substrate positioned at a first position, The substrate mounted on the substrate attached to the arm body is supported by adsorbing and supporting the substrate by a plurality of first support members of a first support mechanism that supports the substrate attached to the arm body from above. The electronic component is supported by adsorbing and supporting the electronic component with a plurality of second support members of a second support mechanism that supports the electronic component from above, and the arm body is moved in the vertical and horizontal directions. Positioning the mounted substrate at the second position, releasing the support of the substrate by the first support mechanism, and releasing the support of the electronic component by the second support mechanism. Look including a step of, in the step of the second support member of the second support mechanism is supported by suck the electronic component, the second support member, when viewed from above, the first support of the first support mechanism The electronic component is adsorbed and supported at a position outside the peripheral direction of the member, the lower surface of which is lower than the lower surface of the first support member of the first support mechanism when viewed from the horizontal direction. A substrate carrying method is provided.
[0012]
According to the present invention, the arm main body disposed above the substrate includes the first support mechanism that supports the substrate from above, and the second support mechanism that supports the plurality of electronic components mounted on the substrate from above. Because it is provided, it is possible to prevent the electronic component from drooping from the substrate due to its own weight when transporting the substrate on which the electronic component is mounted. It can be carried out inexpensively and reliably without causing the above.
[0013]
In addition, according to the present invention, the mounting position of each first support member and each second support member can be adjusted on the arm body, so that the position can be adjusted on the arm body according to the size and position of the substrate or the electronic component. The mounting position can be adjusted, so that optimum conveyance can be realized for each type of flat panel display to be manufactured.
[0014]
Furthermore, according to the present invention, an impact buffering mechanism is provided between each second support member and the arm body to absorb an impact applied to each electronic component when each second support member comes into contact with the electronic component. Therefore, it is possible to prevent an unnecessary impact and load from being applied to each electronic component when each second support member comes into contact with the electronic component.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 (a) and 1 (b) are diagrams for explaining an embodiment of a substrate transfer apparatus according to the present invention. Here, FIG. 1 (a) is a front view showing the substrate transfer apparatus according to the present embodiment, and FIG. 1 (b) is a glass substrate with electronic components transferred by the substrate transfer apparatus shown in FIG. 1 (a). FIG.
[0016]
As shown in FIGS. 1A and 1B, the substrate transport apparatus 10 according to the present embodiment is for transferring a glass substrate 21 on which an electronic component 22 is mounted between processes. The glass substrate 21 to be transferred is formed by bonding two types of substrates 21a and 21b having different sizes, and a plurality of electrons are provided on both front and back surfaces (the lower surface of the upper substrate 21a and the upper surface of the lower substrate 21b). A component 22 is mounted.
[0017]
As shown in FIGS. 1 (a) and 1 (b), the substrate transport apparatus 10 includes an arm main body 11 that is disposed above the glass substrate 21 and is movable up and down and left and right. As a first support mechanism for supporting the glass substrate 21 from above, the arm body 11 is disposed above and corresponding to the glass substrate 21, and adsorbs a plurality of glass substrates that adsorb and support the upper surface of the glass substrate 21. A pad (first support member) 12 is provided. The arm body 11 is disposed above the arm body 11 as a second support mechanism for supporting the plurality of electronic components 22 mounted on the glass substrate 21 from above, corresponding to each electronic component 22. An electronic component suction pad (second support member) 13 that sucks and supports the upper surface is provided. Each glass substrate suction pad 12 and each electronic component suction pad 13 are connected to a vacuum source (see reference numeral 18 in FIG. 4) via a suction system (see reference numerals 16a to 16d in FIG. 4).
[0018]
Among these, each glass substrate suction pad 12 is provided with an adjustment mechanism (not shown) for adjusting the relative position with respect to the arm body 11, and the dimensions (width and thickness) of the glass substrate 21 and the position thereof. Accordingly, the mounting position (vertical and horizontal position and height) can be adjusted on the arm main body 11. Each electronic component suction pad 13 is provided with an adjustment mechanism (not shown) for adjusting the relative position with respect to the arm body 11, so that the size (width and thickness) of the electronic component 22 can be adjusted. Accordingly, the mounting position (vertical and horizontal positions and height) can be adjusted. Furthermore, each electronic component suction pad 13 is provided with a spring (impact buffering mechanism) 15 that absorbs an impact applied to the electronic component 22 when each electronic component suction pad 13 comes into contact with the electronic component 22. Yes.
[0019]
Each electronic component suction pad 13 may be provided with a sensor (not shown) for detecting the support status of the electronic component 22 on each electronic component suction pad 13 (presence / absence of the electronic component 22). As a result, it is possible to effectively detect a manufacturing defect caused by dropping of the electronic component 22 or the like.
[0020]
Next, the operation of the present embodiment having such a configuration will be described with reference to FIGS. 2 (a), (b), (c), (d), and (e). Here, a case will be described as an example where the substrate transport apparatus 10 transfers the glass substrate 21 on which the electronic component 22 is mounted (hereinafter also simply referred to as “glass substrate 21”) from the previous process to the next process.
[0021]
First, the arm main body 11 is moved to the left to move the substrate transfer device 10 to the substrate receiving position (FIG. 2A). At this time, the substrate transport stage 41 in the previous process has moved to the substrate delivery position (first position) with the glass substrate 21 placed thereon.
[0022]
In this state, by moving the arm body 11 downward, the substrate transfer device 10 is lowered, and all the glass substrate suction pads 12 and the electronic component suction pads 13 attached to the arm body 11 are in the suction state ( As the operating state), the glass substrate 21 and the electronic component 22 are sucked and supported (FIG. 2B).
[0023]
Thereafter, the arm main body 11 is moved upward and to the right to raise the substrate transfer apparatus 10 and then to the substrate delivery position (second position) in the next process (FIG. 2 (c)). At this time, the substrate transport stage 42 in the next process has moved to the substrate receiving position.
[0024]
Subsequently, by moving the arm body 11 downward, the substrate transfer apparatus 10 is lowered, and the glass substrate 21 is placed on the substrate transfer stage 42 in the next process (FIG. 2D).
[0025]
Thereafter, all the glass substrate suction pads 12 and the electronic component suction pads 13 attached to the arm main body 11 are set in a non-suction state (non-operating state), and the glass substrate 21 and the electronic component 22 are removed. By moving it upward, the substrate transfer apparatus 10 is raised (FIG. 2 (e)).
[0026]
As described above, according to the present embodiment, the arm main body 11 disposed above the glass substrate 21 is provided with the glass substrate suction pad 12 that supports the glass substrate 21 from above, and the plurality of substrates mounted on the glass substrate 21. Since the electronic component 22 is provided with a plurality of suction pads 12 for supporting the electronic component 22 from above, the electronic component 22 is suspended from the glass substrate 21 by its own weight when the glass substrate 21 on which the electronic component 22 is mounted is transported. The glass substrate 21 on which the electronic component 22 is mounted can be transported inexpensively and reliably without causing the electronic component 22 to drop or the glass substrate 21 to be damaged.
[0027]
Further, according to the present embodiment, the mounting positions of the glass substrate suction pads 12 and the electronic component suction pads 13 on the arm body 11 can be adjusted, so that the glass substrate 21 or the electronic component 22 can be adjusted. The mounting position (vertical and horizontal position and height) can be adjusted on the arm main body 11 according to the dimensions (vertical and horizontal width and thickness) and position, and for this reason, the type of flat panel display to be manufactured Optimal conveyance can be realized for each.
[0028]
Furthermore, according to the present embodiment, an impact applied to each electronic component 22 when each electronic component suction pad 13 contacts the electronic component 22 between each electronic component suction pad 13 and the arm body 11. Since the spring (impact buffering mechanism) 15 that absorbs water is provided, when each electronic component suction pad 13 comes into contact with the electronic component 22, an unnecessary impact and load are applied to each electronic component 22. Can be prevented.
[0029]
In the above-described embodiment, all the electronic component suction pads 13 provided on the arm body 11 are operated when the glass substrate 21 on which the electronic component 22 is mounted is transported. The suction state (operating state) of each electronic component suction pad 13 is selectively controlled according to the type of flat panel display to be manufactured, and corresponds to a position where the electronic component 22 does not exist or a position where support is not required. The electronic component suction pad 13 may be in a non-suction state (non-operating state). Specifically, for example, as shown in FIG. 3, each of the plurality of electronic component suction pads 13 is provided with a drive mechanism 14 for raising and lowering the electronic component suction pads, and each electronic component is controlled by a control device (not shown). The suction pad 13 may be moved to either the support position or the retracted position. Further, as shown in FIG. 4, a plurality of suction systems 16 a to 16 d may be provided between the vacuum source 18 and each electronic component suction pad 13, and the suction systems may be switched by the vacuum electromagnetic valve 17. In FIG. 4, one suction system is assigned to each side of the glass substrate 21. However, the present invention is not limited to this, and one system can be assigned to each of the electronic component suction pads 13. Note that the selection information of each electronic component suction pad 13 is held together with the type information of the flat panel display to be manufactured, and the suction state of the electronic component suction pad 13 is determined via a control device (not shown). You may make it control automatically.
[0030]
In the above-described embodiment, the upper surface of each electronic component 22 is sucked and supported by the electronic component suction pad 13. However, the present invention is not limited to this, and as shown in FIG. Each electronic component 22 may be supported from the lower surface side by 19.
[0031]
Furthermore, in the embodiment described above, the spring 15 is provided on the electronic component suction pad 13, but the present invention is not limited thereto, and a similar mechanism can be provided on the glass substrate suction pad 12.
[0032]
In the above-described embodiment, the glass substrate used in the flat panel display has been described as an example. However, the present invention is not limited to this and can be applied to any substrate.
[0033]
【The invention's effect】
As described above, according to the present invention, the board on which the electronic component is mounted can be transported inexpensively and reliably without causing the electronic part to drop or the board to be damaged.
[Brief description of the drawings]
FIG. 1 is a diagram showing an embodiment of a substrate transfer apparatus according to the present invention.
FIG. 2 is a view showing a state in which a glass substrate is delivered between processes by the substrate transfer apparatus shown in FIG. 1;
FIG. 3 is a view showing a modified example of the substrate transfer apparatus shown in FIG. 1;
FIG. 4 is a view showing another modification of the substrate transfer apparatus shown in FIG. 1;
FIG. 5 is a view showing still another modified example of the substrate transfer apparatus shown in FIG. 1;
FIG. 6 is a view showing a glass substrate on which electronic components are mounted.
FIG. 7 is a diagram illustrating an example of a conventional substrate transfer apparatus.
FIG. 8 is a view showing another example of a conventional substrate transfer apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Substrate conveyance apparatus 11 Arm main body 12 Suction pad for glass substrates (first support member)
13 Electronic component suction pad (second support member)
14 Drive mechanism 15 Spring (impact buffer mechanism)
16a to 16d Adsorption system 17 Vacuum solenoid valve 18 Vacuum source 19 Support arm 21 for electronic component Glass substrate 21a Upper substrate 21b Lower substrate 22 Electronic component

Claims (9)

アーム本体と、
前記アーム本体に取り付けられ、基板を上方から支持する第１支持機構と、
前記アーム本体に取り付けられ、前記基板上に実装された複数の電子部品を上方から支持する第２支持機構とを備え、
第１支持機構は、基板に対応してその上方に配置され、基板の上面を吸着して支持する複数の第１支持部材を有し、
第２支持機構は、各電子部品に対応してその上方に配置され、電子部品の上面を吸着して支持する複数の第２支持部材を有し、
第２支持機構の第２支持部材は、上方から見た場合に、第１支持機構の第１支持部材の周縁方向外方に位置し、
第２支持機構の第２支持部材の下面は、水平方向から見た場合に、第１支持機構の第１支持部材の下面よりも下方に位置していることを特徴とする基板搬送装置。The arm body,
A first support mechanism attached to the arm body and supporting the substrate from above;
A second support mechanism attached to the arm body and supporting a plurality of electronic components mounted on the substrate from above;
The first support mechanism has a plurality of first support members that are disposed above and corresponding to the substrate, and suck and support the upper surface of the substrate.
The second support mechanism has a plurality of second support members that are disposed above and correspond to each electronic component, and suck and support the upper surface of the electronic component,
The second support member of the second support mechanism is located outward in the peripheral direction of the first support member of the first support mechanism when viewed from above,
The substrate transport apparatus, wherein the lower surface of the second support member of the second support mechanism is positioned below the lower surface of the first support member of the first support mechanism when viewed from the horizontal direction. アーム本体と、
前記アーム本体に取り付けられ、基板を上方から支持する第１支持機構と、
前記アーム本体に取り付けられ、前記基板上に実装された複数の電子部品を上方から支持する第２支持機構とを備え、
第１支持機構は、基板に対応してその上方に配置され、基板の上面を吸着して支持する複数の第１支持部材を有し、
第２支持機構は、各電子部品に対応してその上方に配置され、電子部品の上面を吸着して支持する複数の第２支持部材を有し、
第２支持機構の第２支持部材は、上方から見た場合に、第１支持機構の第１支持部材の周縁方向外方に位置し、
第２支持機構の第２支持部材の各々には、当該第２支持部材をアーム本体に対して昇降させる昇降機構が設けられ、
前記第２支持部材の下面は、昇降機構によって降下されたときに、水平方向から見た場合に、第１支持機構の第１支持部材の下面よりも下方に位置していることを特徴とする基板搬送装置。The arm body,
A first support mechanism attached to the arm body and supporting the substrate from above;
A second support mechanism attached to the arm body and supporting a plurality of electronic components mounted on the substrate from above;
The first support mechanism has a plurality of first support members that are disposed above and corresponding to the substrate, and suck and support the upper surface of the substrate.
The second support mechanism has a plurality of second support members that are disposed above and correspond to each electronic component, and suck and support the upper surface of the electronic component,
The second support member of the second support mechanism is located outward in the peripheral direction of the first support member of the first support mechanism when viewed from above,
Each of the second support members of the second support mechanism is provided with a lifting mechanism that lifts and lowers the second support member relative to the arm body.
The lower surface of the second support member is positioned below the lower surface of the first support member of the first support mechanism when viewed from the horizontal direction when lowered by the lifting mechanism. Substrate transfer device. アーム本体と、
前記アーム本体に取り付けられ、基板を上方から支持する第１支持機構と、
前記アーム本体に取り付けられ、前記基板上に実装された複数の電子部品を支持する第２支持機構とを備え、
第１支持機構は、基板に対応してその上方に配置され、基板の上面を吸着して支持する複数の第１支持部材を有し、
第２支持機構は、各電子部品に対応してその上方に配置され、電子部品の下面を支持する複数の第２支持部材を有し、
第２支持機構の第２支持部材は、上方から見た場合に、第１支持機構の第１支持部材の周縁方向外方に位置し、
第２支持機構の第２支持部材は、電子部品が実装された基板を搬送するときに、各電子部品をその下面側であって基板と反対側の周縁外方から支持することを特徴とする基板搬送装置。The arm body,
A first support mechanism attached to the arm body and supporting the substrate from above;
A second support mechanism attached to the arm body and supporting a plurality of electronic components mounted on the substrate;
The first support mechanism has a plurality of first support members that are disposed above and corresponding to the substrate, and suck and support the upper surface of the substrate.
The second support mechanism has a plurality of second support members that are disposed above and correspond to each electronic component and support the lower surface of the electronic component,
The second support member of the second support mechanism is located outward in the peripheral direction of the first support member of the first support mechanism when viewed from above,
The second support member of the second supporting mechanism, when the transport of the substrate on which electronic components are mounted, characterized in that for supporting the electronic components from the periphery outward of the opposite side of the substrate a the lower side Substrate transfer device. 前記第１支持部材は前記アーム本体上にてその取付位置が調整可能となっていることを特徴とする請求項１乃至３のいずれかに記載の基板搬送装置。  4. The substrate transfer apparatus according to claim 1, wherein the mounting position of the first support member is adjustable on the arm body. 前記各第１支持部材と前記アーム本体との間には前記基板との接触時に前記基板に加えられる衝撃を吸収する衝撃緩衝機構が設けられていることを特徴とする請求項１乃至３のいずれかに記載の基板搬送装置。  4. An impact buffering mechanism for absorbing an impact applied to the substrate when contacting the substrate is provided between the first support member and the arm body. The board | substrate conveyance apparatus of crab. 前記各第２支持部材は前記アーム本体上にてその取付位置が調整可能となっていることを特徴とする請求項１乃至３のいずれかに記載の基板搬送装置。  4. The substrate transfer apparatus according to claim 1, wherein the mounting position of each of the second support members is adjustable on the arm body. 5. 前記各第２支持部材と前記アーム本体との間には前記各電子部品との接触時に前記各電子部品に加えられる衝撃を吸収する衝撃緩衝機構が設けられていることを特徴とする請求項１乃至３のいずれかに記載の基板搬送装置。  2. An impact buffering mechanism is provided between each of the second support members and the arm main body to absorb an impact applied to the electronic components when contacting the electronic components. 4. The substrate transfer apparatus according to any one of claims 1 to 3. 前記第２支持機構は前記各電子部品に対応して配置された第２支持部材を有し、これら各第２支持部材は対応する電子部品を吸着する状態が選択的に制御されるよう構成されていることを特徴とする請求項１乃至３のいずれかに記載の基板搬送装置。  The second support mechanism has a second support member disposed corresponding to each electronic component, and each of the second support members is configured to selectively control a state of attracting the corresponding electronic component. The substrate transfer apparatus according to claim 1, wherein the substrate transfer apparatus is provided. 電子部品が実装された基板を第１位置から第２位置へ搬送する基板搬送方法において、
第１位置に位置付けられた前記基板に向けて上方からアーム本体を下降させる工程と、
前記アーム本体に取り付けられた前記基板を上方から支持する第１支持機構の複数の第１支持部材にて前記基板を吸着して支持するとともに、前記アーム本体に取り付けられた前記基板に実装された前記電子部品を上方から支持する第２支持機構の複数の第２支持部材にて前記電子部品を吸着して支持する工程と、
前記アーム本体を上下方向および水平方向に移動させることにより前記電子部品が実装された基板を第２位置に位置付ける工程と、
前記第１支持機構による前記基板の支持を解除するとともに、前記第２支持機構による前記電子部品の支持を解除する工程とを含み、
第２支持機構の第２支持部材が電子部品を吸着して支持する工程において、当該第２支持部材は、上方から見た場合に、第１支持機構の第１支持部材の周縁方向外方の位置であって、その下面が、水平方向から見た場合に、第１支持機構の第１支持部材の下面よりも下方の位置において、電子部品を吸着して支持することを特徴とする基板搬送方法。In a substrate transport method for transporting a substrate on which electronic components are mounted from a first position to a second position,
Lowering the arm body from above toward the substrate positioned at the first position;
The substrate attached to the arm body is supported by adsorbing and supporting the substrate by a plurality of first support members of a first support mechanism for supporting the substrate from above, and mounted on the substrate attached to the arm body. Adsorbing and supporting the electronic component by a plurality of second support members of a second support mechanism for supporting the electronic component from above;
Positioning the board on which the electronic component is mounted at a second position by moving the arm body in the vertical direction and the horizontal direction;
Releasing the support of the substrate by the first support mechanism, and releasing the support of the electronic component by the second support mechanism,
In the step in which the second support member of the second support mechanism sucks and supports the electronic component, the second support member is located outwardly in the peripheral direction of the first support member of the first support mechanism when viewed from above. A substrate transport, wherein the electronic component is sucked and supported at a position below the lower surface of the first support member of the first support mechanism when the lower surface is viewed from the horizontal direction. Method.
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