JPH09199577A - Suction equipment of semiconductor package, mounting method of semiconductor package and its equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable suitable picking-up when the surface of a semiconductor package is not flat, by arranging a plurality of suction heads, and providing all of them with valves capable of opening and closing a flow of air. SOLUTION: In a sucking equipment sucking a multichip module(MCM) 1 constituted of a plurality of semiconductor components 4 and passive components, a plurality of suction heads are arranged, and valves 16 capable of opening and closing a flow of air are arranged on all the sucking heads. When a gap is generated between the MCM 1 and the suction heads, air is not made to flow into a suction pump by closing the valves 16. For example, in the state that the suction pump is not operated, a sucking equipment shown in a figure is brought into contact with the MCM 1. Then the suction pump is operated and made to suck the MCM 1, the valve 16 is closed by the flow of air in a sucking collet 2 wherein a suction pad 10 is not perfectly brought into contact with sealing resin 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package suction device, a semiconductor package mounting method, and a device therefor.

[0002]

2. Description of the Related Art Conventionally, techniques in such a field include:
For example, there is one disclosed in (1) Japanese Utility Model Laid-Open No. 5-72386. (1) FIG. 3 is a configuration diagram of such a conventional semiconductor package suction device. As shown in this figure, 11 is a cylinder block. Inside this cylinder block 11, a sliding plate 12 and a spring 14 are built in. A pipe 13 is connected to the sliding plate 12, and the tip of the pipe 13 is connected. Is provided with a suction pad 10.

The cylinder block 11 is provided with a tube 18 connected to a suction pump to form a flow path of air from the suction pump to the suction pad 10. The suction pad 10 is brought into contact with the surface of the IC 19 while sucking air with the suction pump, and the IC 19 is lifted by the suction force.
At that time, the spring 14 serves to buffer the contacting force.

(2) FIG. 4 is an explanatory view of a conventional semiconductor package mounting method. The adsorbing device has the same configuration as that shown in FIG. 3, and the same reference numerals are given and the description thereof is omitted. While sucking air with a suction pump, the suction pad 10 is brought into contact with the surface of the multi-chip module (MCM) 21, and the MCM 21 is lifted by suction force. At that time, the spring 14 serves to buffer the contacting force.

The MCM 21 mounts a plurality of semiconductor chips, resistors and capacitors on a wiring board 21-1, and protects the components with a cap 21-3. Reference numeral 21-2 is a bump such as solder, which is connected to the pad 25 of the circuit board 24. MCM2 picked up by adsorption device
1 is a bump 2 corresponding to the pad 25 on the circuit board 24
It is mounted so that 1-2 is mounted. Then, it is reflowed and the MCM 21 and the circuit board 24 are electrically and mechanically connected by melting the bump 21-2.

[0006]

However, the above-described conventional semiconductor package suction device has a problem that the semiconductor package cannot be sucked unless the surface of the semiconductor package is flat. The semiconductor package includes a form called a multi-chip module (hereinafter abbreviated as MCM).
The MCM is a functional module in which a plurality of semiconductor chips and parts such as resistors and capacitors are mounted on a substrate made of plastic, ceramic or the like, and in the form of covering the mounted parts with a sealing resin from the viewpoint of protection and reliability of the mounted parts. There is.

In the structure of the conventional adsorption device having this form, the surface of the MCM is not flat due to the unevenness of the sealing resin, so that the MCM cannot be picked up.
Further, since a plurality of semiconductor chips, resistors, capacitors, and other components are mounted on the MCM, the area and weight of the semiconductor package are larger than those of a semiconductor package composed of a single semiconductor chip, which makes the pickup easier. It will be difficult.

Further, in the above-mentioned conventional semiconductor package mounting method, the bumps of the MCM can be connected to other than the pads on the corresponding circuit board due to the positional deviation during mounting or during reflow after mounting. There is a nature. A first object of the present invention is to eliminate the conventional problems and to provide a semiconductor package suction device capable of appropriately picking up even when the surface of the semiconductor package is not flat.

A second object of the present invention is to eliminate the problems of the prior art, eliminate the positional deviation during mounting or during reflow after mounting, and mount accurately on the corresponding pads on the circuit board. It is an object of the present invention to provide a semiconductor package mounting method and a device therefor.

[0010]

In order to achieve the above object, the present invention [1] is a semiconductor package suction device for sucking a multi-chip module composed of a plurality of semiconductor components and passive components, Adsorption heads are arranged, and a valve that can open and close the flow of air is arranged in all of the adsorption heads. When a gap is created between the multi-chip module and the adsorption head, the valves are closed and air is supplied to the suction pump. Is designed so that it does not flow in.

As described above, a plurality of suction points between the semiconductor package and the suction pad are provided, and even if there is a point that cannot be sufficiently sucked, the suction point can be sucked at another semiconductor package and the suction device. Therefore, even if the surface of the semiconductor package has irregularities, it is possible to properly pick up a semiconductor package on which a plurality of semiconductors and passive components are mounted.

[2] In a method of mounting a semiconductor package on a circuit board using a semiconductor package suction device that suctions a multi-chip module composed of a plurality of semiconductor components and passive components, a pickup in which the end of the multi-chip module is pinched. A step of picking up the multi-chip module using a jig, a step of aligning the mounting position of the multi-chip module using the pins of the pick-up jig, fixing at the time of joining, and a step of re-flowing together with the pick-up jig. The process of removing the pins from the circuit board is performed.

Therefore, it is possible to prevent mounting deviation during mounting of the semiconductor package and during reflow, and it is possible to mount the semiconductor package on the circuit board with high reliability. [3] In a device for mounting a semiconductor package on a circuit board using a semiconductor package adsorption device that adsorbs a multi-chip module including a plurality of semiconductor components and passive components, a pickup jig for pinching the end of the multi-chip module with a pin. An adsorption device for adsorbing the upper surface of the pickup jig and a circuit board having a positioning through hole with which the pin engages are provided.

Therefore, the semiconductor package is sandwiched by the pins and picked up, and the semiconductor package is mounted on the circuit board together with the pins. At this time, the pins are inserted into the through holes on the circuit board to be mounted. Since the reflow is performed in this state and then the pin is pulled out, it is possible to reliably prevent misalignment during mounting of the semiconductor package and during reflow.

[4] In the semiconductor package mounting apparatus described in [3], the pickup jig has a jig base material, four guide holes formed in the jig base material, and each of the guides. A pin guided in the hole, a pair of moving plates having a loose hole for moving the pin, and a tension spring provided between the pair of moving plates are provided.

Therefore, it is possible to reliably pick up the semiconductor package, and it is possible to reliably prevent misalignment during mounting of the semiconductor package and during reflow.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a state before a multi-chip module is sucked by a semiconductor package suction device according to a first embodiment of the present invention, and FIG. 2 is a state in which a multi-chip module is sucked by the semiconductor package suction device. FIG. Here, the semiconductor package to be sucked will be described.

As shown in these figures, 1 is an MCM, which is a bare chip IC (hereinafter simply referred to as IC) on the circuit board 3.
4) is mounted, and IC4 by wire 5
To the wire bonding pad 6 on the circuit board 3. Reference numeral 7 is a bump such as solder, which electrically and mechanically connects the circuit board 3 and a circuit board (not shown) on which the MCM 1 is mounted. 8 is a sealing resin for protecting the IC 4. Reference numeral 9 is a dam for preventing the resin from protruding from the circuit board 3 when the sealing resin is coated.

Next, the operation of this adsorption device will be described. The same components as those in FIG. 3 are designated by the same reference numerals, and the description thereof will be omitted. In the adsorption device shown in FIG.
The suction collet 2 having the valve 5 and the valve 16 is inserted into the cylinder block head 17 in a lattice pattern, and a plurality of suction points of the suction device for picking up the semiconductor package are provided.

Therefore, as shown in FIG. 1, the adsorption device of the present invention is brought closer to the MCM 1. At this point, the suction pad 10 is not in contact with the MCM 1 and the suction pump is not operating. Therefore, the valve 16 is arranged in a tilted state but in an open state. Next, as shown in FIG. 2, when the suction pad 10 contacts the surface of the sealing resin 8 of the MCM 1, the movement of the suction device is stopped. Next, the suction pump is operated to suck the MCM1. Then MC
Since the surface of M1 is uneven on the surface of the sealing resin 8, for the specific suction collet 2 (here, the second suction collet 2 from the left side of the drawing), the surfaces of the suction pad 10 and the sealing resin 8 are sufficient. Do not touch. At this time, since the air to be sucked flows without resistance, suction cannot be performed by the other suction collet 2 in which the suction pad 10 and the sealing resin 8 are sufficiently in contact with each other. Therefore, with respect to the suction collet 2 in which the suction pad 10 and the sealing resin 8 are not sufficiently in contact with each other, the valve 16 arranged at an inclination is tilted by the flow of air, and the valve 16
Is closed. Therefore, the flow of air can be prevented and the MCM 1 can be picked up by another adsorption collet 2.

As described above, according to the first embodiment, a plurality of suction points of the semiconductor package and the suction pad are provided, and even if there is a point that cannot be sufficiently sucked, the other semiconductor package and the suction device. Therefore, even if the surface of the semiconductor package has irregularities, it is possible to properly pick up a semiconductor package on which a plurality of semiconductors and passive components are mounted.

Next, a second embodiment of the present invention will be described. 5 is a mounting process diagram of a semiconductor package showing a second embodiment of the present invention, FIG. 6 is a configuration diagram of a pickup jig used in the mounting process, and FIG. 6A is a side view of the pickup jig. FIG. 6B is a rear view of the pickup jig. As shown in FIG. 5, 21 is an MCM, 22 is a pickup jig, and 23 is a suction device. 24 is MC
A circuit board on which M is mounted, 25 is a mounting pad on the circuit board, and 26 is a through hole provided in the circuit board.

Now, the pickup jig 22 will be described. As shown in FIG. 6, 22-1 is a jig base material, 22
Reference numeral -2 is a pin, which is provided with four pins and is used when picking up the MCM 21 while sandwiching the four sides of the end of the circuit board 21-1 of the MCM 21. Reference numeral 22-3 is a moving plate that moves the pin 22-2, and has a play hole 22-6. 22
-4 is a guide hole that determines the moving range of the pin 22-2. 22-5 is a tension spring for pulling together the two moving plates 22-3.

First, as shown in FIG. 5A, the MCM 2 with the pickup device 23 holding the pickup jig 22 is held.
Get closer to 1. At this time, the four pins 22-2 are MCM
The movable plate 22-3 is spread outwardly against the tension spring 22-5 so as to sandwich 21. Pickup jig 2
When 2 reaches a position where the MCM 21 can be picked up, the force pulling the moving plate 22-3 outward is loosened, and the MCM 21 is pinched and lifted by the pin 22-2 by the force of the tension spring 22-5. Lifted MCM2
1 is carried to the top of the circuit board 24.

Next, as shown in FIG. 5B, positioning through holes 26, which correspond to the positions of the four pins 22-2 and which engage with the pins, are previously formed in the circuit board 24, and MC
The pin 22-2 is inserted into the through hole 26 when the M21 is mounted on the circuit board 24. After the MCM 21 is mounted on the circuit board 24, the suction device 23 and the pickup jig 22 are separated and reflow is performed to electrically and mechanically connect the MCM 21 and the circuit board 24.

After that, as shown in FIG. 5C, the pickup jig 22 is removed from the circuit board 24. in this way,
According to the second embodiment, the semiconductor package is picked up by sandwiching the semiconductor package with four pins, and the semiconductor package is mounted together with the pins. At this time, the pins are inserted into the through holes on the circuit board to be mounted. Reflow in this state, then pull out the pin. By this method, it is possible to prevent misalignment during mounting of the semiconductor package and during reflow.

Further, although the BGA package is described in the above embodiment, the present invention can be applied to other semiconductor packages such as QFP. It should be noted that the present invention is not limited to the above embodiment, and various modifications can be made based on the gist of the present invention, and these are not excluded from the scope of the present invention.

[0028]

As described above, according to the present invention, the following effects can be obtained. (1) According to the invention described in claim 1, a plurality of suction points are provided between the semiconductor package and the suction pad, and even if there is a point that cannot be sufficiently sucked among the suction points, another semiconductor package and the suction device are connected. Since the suction can be performed at the suction point, even if the surface of the semiconductor package has irregularities, it is possible to properly pick up the semiconductor package on which a plurality of semiconductors and passive components are mounted.

(2) According to the second aspect of the invention, it is possible to prevent misalignment during mounting of the semiconductor package and during reflow, and to mount the semiconductor package on the circuit board with high reliability. it can. (3) According to the invention of claim 3, the semiconductor package is sandwiched by the pins and picked up, and the semiconductor package is mounted on the circuit board together with the pins. At this time, the pins are inserted into the through holes on the circuit board to be mounted. I reflowed in this state and then I tried to pull out the pin,
It is possible to reliably prevent misalignment during mounting of the semiconductor package and during reflow.

(4) According to the fourth aspect of the present invention, the semiconductor package can be reliably picked up, and mounting misalignment at the time of mounting the semiconductor package and at the time of reflow can be reliably prevented.

[Brief description of drawings]

FIG. 1 is a diagram showing a state before a multi-chip module is sucked by a semiconductor package suction device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a state in which a multi-chip module is suctioned by the semiconductor package suction device of the first embodiment of the present invention.

FIG. 3 is a configuration diagram of a conventional semiconductor package suction device.

FIG. 4 is an explanatory diagram of a conventional semiconductor package mounting method.

FIG. 5 is a mounting process diagram of a semiconductor package showing a second embodiment of the present invention.

FIG. 6 is a configuration diagram of a pickup jig used in a semiconductor package mounting process of a second embodiment of the present invention.

[Explanation of symbols]

 1,21 Multi-chip module (MCM) 2 Adsorption collet 3,21-1,24 Circuit board 4 Bare chip IC 5 Wire 6 Wire bonding pad 7,21-2 Bump 8 Sealing resin 9 Dam 10 Adsorption pad 11 Cylinder block 12 Sliding Moving plate 13,15 Pipe 14 Spring 16 Valve 17 Cylinder block head 21-3 Cap 22 Pickup jig 22-1 Jig base material 22-2 pin 22-3 Moving plate for moving pin 22-4 Pin moving range Guide hole to be determined 22-5 Extension spring 22-6 Loose hole 23 Adsorption device 25 Mounting pad on circuit board 26 Through hole

Claims (4)

[Claims] 1. A suction device for a semiconductor package, which adsorbs a multi-chip module comprising a plurality of semiconductor components and passive components, wherein a plurality of suction heads are arranged, and an air flow can be opened and closed in all of the suction heads. A suction device for a semiconductor package, characterized in that a valve is arranged, and when a gap is created between the multi-chip module and the suction head, the valve is closed to prevent air from flowing to a suction pump. 2. A method of mounting a semiconductor package on a circuit board using a semiconductor package suction device for sucking a multi-chip module comprising a plurality of semiconductor components and passive components, wherein (a) the multi-chip module end is pinned. A step of picking up the multi-chip module using a sandwiching pickup jig; (b) a step of aligning the mounting position of the multi-chip module using the pins of the pickup jig; And a step of removing the pins from the circuit board together with the pickup jig later. 3. An apparatus for mounting a semiconductor package on a circuit board using a semiconductor package adsorption device for adsorbing a multi-chip module composed of a plurality of semiconductor components and passive components, wherein (a) the multi-chip module end is pinned. A semiconductor package mounting device including a pickup jig for sandwiching, (b) a suction device for sucking the upper surface of the pickup jig, and (c) a circuit board having a through hole for positioning in which the pin engages. . 4. The device for mounting a semiconductor package according to claim 3, wherein the pickup jig is a jig base material.
Four guide holes formed in the jig base material, a pin guided in each guide hole, a pair of moving plates having loose holes for moving the pins, and provided between the pair of moving plates. An extension device for a semiconductor package.