JP3189690B2 - Mounting device for conductive balls - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball mounting apparatus used in a process of manufacturing a work with bumps.

[0002]

2. Description of the Related Art In a process of manufacturing a work having a bump such as a flip chip, a method using a conductive ball such as a solder ball is known as a method of forming a pump (protruding electrode) on an electrode of the work. According to this method, a conductive ball provided in a conductive ball supply unit is vacuum-sucked to a suction hole formed on a lower surface of a mounting head, picked up, and mounted on an electrode of a work such as a substrate. ing. According to such a method, a large number of conductive balls can be collectively mounted on a work, and thus there are advantages such as high productivity.

[0003]

In recent years, conductive balls have been miniaturized, and some of them have a diameter of 300 μm or less. On the other hand, the upper surface of a work such as a substrate on which conductive balls are mounted has warpage, and the upper surface is not a completely flat surface. The mounting head aligns the conductive balls vacuum-adsorbed on the lower surface with the electrodes of the work, releases the vacuum suction state, and mounts the conductive balls on the electrodes. In this case, all the conductive balls cannot land on the electrodes, and the vacuum suction is released in a state where they are raised above the electrodes (the gap between the conductive balls and the electrodes of the work). Will fall naturally on the electrode,
As a result, the conductive balls are not correctly mounted on the electrodes,
There is a problem that the electrode is easily displaced from the electrode.

Accordingly, the present invention provides a conductive ball mounting apparatus capable of correctly mounting a large number of conductive balls vacuum-adsorbed on a lower surface of a mounting head on an electrode of a work even if the upper surface of the work is warped. The purpose is to provide.

[0005]

For this purpose, the present invention provides a method for picking up a conductive ball provided in a conductive ball supply section by vacuum suction on a lower surface of a mounting head, and picking up a work piece positioned at a positioning section. An apparatus for mounting a conductive ball to be mounted on an electrode, wherein the mounting head includes:
A suction unit for vacuum-sucking a conductive ball on a lower surface of the suction tool, comprising: a main body that is vacuum-suctioned by vacuum suction means; and a suction tool that is swingably mounted on an opening formed on the lower surface of the main body. Was formed.

[0006]

According to the present invention, when the mounting head is lowered to mount the conductive balls vacuum-adsorbed on the suction holes on the lower surface of the suction tool on the electrodes of the work, the upper surface of the work is warped. Even if there is, the suction tool can be swung along the upper surface of the work, so that all the conductive balls can be surely landed on the electrodes of the work and mounted correctly.

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a conductive ball mounting apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the mounting head, and FIG. 3 is a cross-sectional view of a suction tool of the mounting head.

In FIG. 1, reference numeral 11 denotes a work, which is mounted on a guide rail 13. The guide rail 13
It is a positioning part for clamping and positioning the work 11. On the upper surface of the work 11, a large number of electrodes 12 on which the solder balls 1 as conductive balls are mounted are formed. On the side of the guide rail 13, a supply part 14 for the solder ball 1, a light source 15 for detecting a pickup error, and a container 16 as a flux storage part are provided.
Reference numeral 17 denotes a squeegee for smoothing the liquid level of the flux. The supply unit 14 is composed of a box, in which the solder balls 1 are provided.
Is stored.

The mounting head 3 is located above the guide rail 13.
0 is provided. The mounting head 30 is a lifting unit 4
0 is mounted on a guide rail 41 provided on the front surface of the vehicle. When the motor 42 provided on the upper surface of the lifting unit 40 is driven, the mounting head 30 moves up and down along the guide rail 41. The elevating unit 40 moves in the X direction along the guide shaft 21. Both ends of the guide shaft 21 are connected to a guide shaft 23 via a slider 22.
Move in the Y direction. That is, the guide shafts 21 and 23 are moving means for moving the mounting head 30 in the X direction and the Y direction. A description of a power system for moving the mounting head 30 along the guide shafts 21 and 23 is omitted.

Next, the structure of the mounting head 30 will be described with reference to FIGS. In FIG. 2, reference numeral 31 denotes a box as a main body. A plurality of openings 32 are formed on the lower surface of the box 31. A holding frame 33 is mounted on the lower surface. Opening 3 opened in holding frame 33
4, a box-shaped suction tool 35 is fitted. The suction tool 35 is located immediately below the opening 32. The work 11 of the present embodiment is a multi-chamfered substrate, and therefore, the suction tool 35 includes a plurality of boxes 31 according to the number of chamfers.
It is attached to the lower surface of.

A collar 36 projects from the suction tool 35, and an elastic body 37 is interposed between the collar 36 and the lower surface of the box 31. Therefore, the suction tool 35
Can slightly swing (see arrow N in FIG. 3) while compressing the elastic body 37. A plurality of suction holes 38 for vacuum-sucking the solder ball 1 are formed on the lower surface of the suction tool 35. In FIG. 2, a tube 39 is connected to the box 31. The tube 39 is connected to vacuum suction means (not shown). Therefore, when the vacuum suction means is driven, the solder balls 1 are vacuum-sucked into the suction holes 38.

The conductive ball mounting device is constructed as described above, and its operation will be described below. In FIG. 1, the mounting head 30 moves above the supply unit 14, and performs a lowering / upward operation there, thereby causing the suction tool 35 to move.
The solder ball 1 is vacuum-sucked into the suction hole 38 of (1) and picked up. Next, the mounting head 30 moves above the container 16, and performs the lowering and raising operations again there, and
Flux 2 is adhered to the lower surface of.

Next, the mounting head 30 moves above the work 11 and performs a descending operation to land the solder ball 1 on the electrode 12 of the work 11. FIG. 3 shows the state at this time. The upper surface of the work 11 is warped, so that the left solder ball 1 lands on the electrode 12 in FIG.
There is a gap G because it cannot land on 2. However, the lowering of the mounting head 30 causes the suction tool 3
5 swings in the direction of the arrow N following the upper surface of the work 11 while compressing the elastic body 37, and
Can land on the electrode 12 (see the solder ball 1 shown by a chain line). This swing operation is performed independently for each suction tool. Then, when the mounting head 30 is lifted after releasing the vacuum suction state of the solder balls 1, all the solder balls 1 are mounted on the electrodes 12 of the work 11. The work 11 on which the solder balls 1 are mounted as described above is sent to the next step.

[0014]

According to the present invention, when the mounting head is lowered to mount the conductive balls vacuum-adsorbed on the suction holes on the lower surface of the suction tool on the electrodes of the work, the upper surface of the work is warped. However, since the suction tool can be swung along the upper surface of the work, all the conductive balls can be reliably landed on the electrodes of the work and mounted correctly.

[Brief description of the drawings]

FIG. 1 is a perspective view of a conductive ball mounting device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a mounting head of the conductive ball mounting apparatus according to one embodiment of the present invention.

FIG. 3 is a sectional view of a suction tool of a mounting head of the conductive ball mounting apparatus according to one embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder ball 11 Work 12 Electrode 14 Solder ball supply part 30 Mounting head 31 Box (body) 32 Opening 35 Suction tool 37 Elastic body 38 Suction hole

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 H01L 21/60 311

Claims (1)

(57) [Claims] 1. A conductive ball provided in a conductive ball supply section, which is vacuum-adsorbed to a lower surface of a mounting head, picked up, and mounted on an electrode of a work positioned at a positioning section. Wherein the mounting head includes a main body that is vacuum-suctioned by vacuum suction means, and a suction tool that is swingably mounted in an opening formed in the lower surface of the main body. A conductive ball mounting apparatus, wherein a suction hole for vacuum-sucking the conductive ball is formed on a lower surface of the conductive ball.