JP3351246B2 - Mounting device for conductive balls - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball mounting apparatus used in a process for manufacturing a work with bumps.

[0002]

2. Description of the Related Art As a method of manufacturing a work with bumps such as flip chips, a method using conductive balls is known (for example, Japanese Patent Application Laid-Open No. 61-242759). In this method, by causing the mounting head to perform a lowering / elevating operation above the container in which the conductive balls are stored, the conductive balls are vacuum-sucked into suction holes formed on the lower surface of the mounting head, and are picked up. Next, the mounting head is moved above the work, where the mounting head is again lowered and raised to mount the conductive balls on the pads of the work.

FIG. 4 is an explanatory view of a conductive ball pickup operation of a conventional conductive ball mounting apparatus as disclosed in the above-mentioned publication, and FIG. 4 (a) shows a state before a mounting head is lowered. FIG. 4B shows a state where the mounting head is lowered. In the figure, 1 is a conductive ball, 2 is a container in which the conductive ball 1 is stored, and 3 is a mounting head. A mesh 4 is stretched horizontally inside the container 2, and the conductive balls 1 are stored on the mesh 4. Gas is fed into the lower part of the container 2, and when the gas blows up (see arrow),
The conductive balls 1 on the mesh 4 are fluidized so that the mounting head 3 can easily vacuum-adsorb the conductive balls 1 into suction holes formed in a large number on the lower surface thereof. As means for fluidizing the conductive balls 1, in addition to the above gases, means for vibrating the container 2 and the like are also known.

Next, the operation will be described. As shown in FIG. 4 (a), the mounting head 3 arrives above the container 2 and then descends as shown in FIG. 4 (b) to be embedded in the layer of the conductive ball 1. Next, the mounting head 3 ascends and picks up the conductive ball 1 by sucking it in a suction hole on the lower surface thereof. Thereafter, the mounting head 3 moves above the work, and performs the lowering / upward operation again to mount the conductive ball 1 on the pad of the work.

[0005]

As shown in FIG. 4B, the mounting head 3 is buried in a layer of the conductive ball 1 and vacuum-adsorbs the conductive ball 1. In this case, the mounting head 3 The conductive ball 1 immediately below the bottom 3 is vacuum-sucked, and the bottom corner K
The conductive ball 1 (in the area indicated by the broken line) is not vacuum-sucked. Therefore, there is a problem that most of the conductive balls 1 at the bottom corner K stay in the bottom corner K for a long period of time and gradually deteriorate. Since the deteriorated conductive ball 1 must be appropriately collected and discarded, it is wasteful in cost.
In addition, a part of the deteriorated conductive ball 1 may move right below the mounting head 3 due to the fluidization, be picked up by the mounting head 3 and mounted on a work. There is also a problem that the work on which the ball 1 is mounted becomes a defective product.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a conductive ball mounting device which can prevent the conductive balls from remaining and deteriorating at the bottom corner of the container.

[0007]

SUMMARY OF THE INVENTION The present invention provides a container for storing conductive balls, a work positioning portion, a mounting head, and a moving device for moving the mounting head between the container and the work positioning portion. A table, and up-down movement means for causing the mounting head to perform an up-down operation, and causing the mounting head to perform a descending / upward operation above the container, and to transfer the conductive balls stored in the container to the mounting head. The conductive ball is picked up by vacuum suction on the lower surface, and then the mounting head is moved above the positioning portion of the work, where the lowering and raising operations are performed again to mount the conductive ball on the work. A mounting device, wherein two upper and lower sheets are provided inside the container in which the conductive balls are stored.
To store conductive balls on the upper mesh
So as to provide a tapered surface portion having a tapered surface with a downward slope toward the center at the bottom corner on the upper mesh ,
The lower surface of the mounting head is buried in a layer of the conductive ball while feeding a gas for fluidizing the conductive ball into the container, and the conductive ball is picked up. Preferably, the tapered surface portion is an elastic body.

[0008]

According to the present invention, since no conductive ball exists on the tapered surface at the bottom corner, the conductive ball does not accumulate and deteriorate there. In addition, since the conductive balls on the tapered surface are likely to flow toward the center of the container, that is, directly below the mounting head, the conductive balls in the container can be relatively evenly picked up by the mounting head.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side view of a conductive ball mounting device according to an embodiment of the present invention, FIG. 2 is a perspective view of a container provided in the conductive ball mounting device, and FIG. 3 is mounting of the conductive ball. It is sectional drawing of the container provided in the apparatus.

In FIG. 1, a container 5 is placed on a base 4. The conductive balls 1 are stored in the container 5. Vibration means for vibrating the container 5 and gas supply means for feeding gas into the container 5 are provided inside the base 4 to fluidize the conductive balls 1 in the container 5.

In FIG. 1, reference numeral 10 denotes a work, which is positioned on a clamper 11 by a clamp. The clamper 11 is supported by a column 13 erected on a base 12. The clamper 11, the base 12, and the support 13
This is the positioning part. Reference numeral 22 denotes a mounting head.
The mounting head 22 is held below the box 23. A motor 24 is provided above the box 23. The box 23 has built-in vertical movement means such as a feed screw driven by a motor 24.
When 4 is driven, the mounting head 22 moves up and down. The mounting head 22 is connected to a pneumatic unit (not shown), and when the pneumatic unit is driven, the conductive balls 1 are vacuum-adsorbed and held in suction holes (not shown) on the lower surface of the mounting head 22. The conductive ball 1 is dropped by releasing the vacuum suction state.

The box 23 is held on a horizontally long moving table 26. The moving table 26 has a built-in feed screw mechanism. When the motor 27 is driven to operate the feed screw mechanism, the mounting head 22 is moved to the container
And the workpiece 10 in the horizontal direction.

Next, a container for storing conductive balls will be described with reference to FIGS. The upper and lower two meshes 6 and 7 are horizontally stretched inside the container 5, and the conductive balls 1 are stored on the upper mesh 6. A tapered surface portion 8 is provided at a bottom corner on the mesh 6. The upper surface of the tapered surface portion 8 is a tapered surface 8a having a downward slope toward the center of the container 5. Tapered surface 8
Is made of an elastic body so that the conductive ball 1 is not damaged even if it slides. A pipe 9 is provided on the side of the container 5, and a gas for fluidizing the conductive balls 1 on the mesh 6 is supplied through the pipe 9.

This conductive ball mounting device is configured as described above, and the operation will be described next. In FIG. 1, the mounting head 22 moves above the container 5, and performs a lowering / upward operation so that the conductive ball 1 is vacuum-adsorbed and picked up on the lower surface thereof. FIG. 3 (a)
FIG. 3B shows a state in which the mounting head 22 has arrived above the container 5, and FIG. 3B shows a state in which the mounting head 22 has descended and the lower surface thereof has been embedded in the layer of the conductive ball 1. . As shown in the figure, the mounting head 22 descends and is embedded in the layer of the conductive balls 1, and then the mounting head 22 ascends by vacuum-suctioning the conductive balls 1 into the suction holes on the lower surface. With the ascent operation, the conductive ball 1
Slightly flows on the tapered surface 8a.

The mounting head 22 having picked up the conductive ball 1 as described above is mounted on the work 10 in FIG.
Move up. Then, the mounting head 22 descends to land the conductive ball 1 on the electrode of the work 10. Next, the vacuum suction state of the conductive ball 1 is released and the mounting head 2 is released.
If 2 is raised, the conductive ball 1 is mounted on the electrode of the work 10. Work 1 on which conductive ball 1 is mounted
0 is sent to a heating furnace (not shown), and the conductive balls 1 are melted and solidified by heating to form bumps.

[0016]

According to the present invention, since there is no conductive ball on the tapered surface at the bottom corner, the conductive ball does not accumulate in the tapered surface and is not deteriorated. Since the balls easily flow toward the center of the container, that is, directly below the mounting head, the mounting head can relatively evenly pick up the conductive balls in the container. In addition, by making the tapered surface part an elastic body,
The conductive balls in sliding contact can be prevented from being damaged.

[Brief description of the drawings]

FIG. 1 is a side view of a conductive ball mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a container provided in the conductive ball mounting device according to one embodiment of the present invention.

FIG. 3 is a cross-sectional view of a container provided in the conductive ball mounting device according to one embodiment of the present invention.

FIG. 4 is an explanatory view of a conductive ball pickup operation of a conventional conductive ball mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conductive ball 5 Container 8 Tapered surface part 8a Tapered surface 22 Mounting head 24 Motor 26 Moving table

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-9-275109 (JP, A) JP-A-7-153765 (JP, A) JP-A 8-66766 (JP, A) JP-A 8- 162455 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60 311 H01L 21/60 B23P 21/00 305 B65G 53/18

Claims (2)

(57) [Claims] 1. A container for storing conductive balls, a work positioning part, a mounting head, a moving table for moving the mounting head between the container and the work positioning part, and Up and down moving means for performing an operation, wherein the mounting head descends above the container.
The lifting operation is performed to pick up the conductive balls stored in the container by vacuum suction on the lower surface of the mounting head, and then move the mounting head above the positioning portion of the work, where it is lowered and raised again. What is claimed is: 1. A conductive ball mounting apparatus for mounting conductive balls on a workpiece by performing an operation, wherein upper and lower meshes are provided inside said container in which conductive balls are stored by providing upper and lower meshes.
Make sure that conductive balls are stored on the
At the bottom corner on the upper surface, a tapered surface having a tapered surface with a downward slope toward the center is provided. A conductive ball mounting device, wherein the conductive ball is picked up by being embedded in the conductive ball. 2. The conductive ball mounting apparatus according to claim 1, wherein said tapered surface portion is made of an elastic body.