JPH08112671A - Transfer device and transfer method for solder ball - Google Patents
Transfer device and transfer method for solder ballInfo
- Publication number
- JPH08112671A JPH08112671A JP5125295A JP5125295A JPH08112671A JP H08112671 A JPH08112671 A JP H08112671A JP 5125295 A JP5125295 A JP 5125295A JP 5125295 A JP5125295 A JP 5125295A JP H08112671 A JPH08112671 A JP H08112671A
- Authority
- JP
- Japan
- Prior art keywords
- ball
- suction
- suction head
- solder
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半田ボールをワーク
（基板又はボールグリッドアレイなどの電子部品）に移
載する半田ボールの移載装置および移載方法に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball transfer device and transfer method for transferring a solder ball onto a work (a substrate or an electronic component such as a ball grid array).
【０００２】[0002]
【従来の技術】近年電子部品や基板などのワークに、複
数の半田ボールを一括して移載する半田ボールの移載装
置が提案されている。図５は従来の半田ボールの移載装
置の動作説明図である。2. Description of the Related Art In recent years, a solder ball transfer device has been proposed which transfers a plurality of solder balls to a work such as an electronic component or a substrate all at once. FIG. 5 is an operation explanatory view of a conventional solder ball transfer device.
【０００３】図中、１は多数の半田ボール２を収納する
ボール溜りであり、その上部は吸着ヘッド３が出入りで
きるように開口されている。ここで、吸着ヘッド３は一
度に複数個の半田ボール２を真空吸着してピックアップ
し、次いでワークの上方で真空吸着状態を解除してワー
クに移載できるように、その下面に複数個の吸引孔４が
マトリクス状に開孔されている。ここで、１つの吸引孔
４は１ケの半田ボール２を真空吸着することを前提に設
計される。In the figure, reference numeral 1 is a ball reservoir for accommodating a large number of solder balls 2, and an upper portion thereof is opened so that an adsorption head 3 can come in and out. Here, the suction head 3 vacuum-sucks and picks up a plurality of solder balls 2 at a time, then releases the vacuum suction state above the work and transfers a plurality of suction balls to the lower surface of the work. The holes 4 are opened in a matrix. Here, one suction hole 4 is designed on the assumption that one solder ball 2 is vacuum-sucked.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、実際に
は図５に示すように、吸引孔４には、１個の半田ボール
（符号イを付している）２以外にも、その近傍に余分な
半田ボール（符号ロを付している）２が不要に真空吸着
されたり、吸着ヘッド３の底面に余分な半田ボール（符
号ハを付している）２が付着したりすることがあり、こ
のままではワークの不要な箇所に余分な半田ボール
（ロ、ハ）２が移載されてしまう。However, in practice, as shown in FIG. 5, in addition to one solder ball (denoted by reference numeral a) 2 in the suction hole 4, an extra space is provided in the vicinity thereof. The unnecessary solder balls (denoted by the symbol B) 2 may be unnecessarily vacuum-adsorbed, or the extra solder balls (denoted by the symbol C) 2 may adhere to the bottom surface of the suction head 3. If this is left as it is, the extra solder balls (b, c) 2 are transferred to unnecessary portions of the work.
【０００５】また吸着ヘッド３の移動中に半田ボール２
が落下しないようにするため、吸着ヘッド３の吸引圧を
高くすることが望ましいが、従来の半田ボールの移載装
置において吸引圧を高くすると、吸着ヘッド３の吸引孔
４に半田ボール２が過度に強く真空吸着され、ワークへ
の移載時に真空吸着状態を解除しても半田ボール２が吸
着ヘッド３から脱落せず、その結果ワークに対する移載
ミスを生じるという事態となることがあった。このよう
に従来の半田ボールの移載装置では、半田ボールの半田
溜りからのピックアップ動作やワークへの移載動作の信
頼性が低いという問題点を有していた。Further, while the suction head 3 is moving, the solder balls 2
It is desirable to increase the suction pressure of the suction head 3 in order to prevent the solder ball 2 from falling. However, when the suction pressure is increased in the conventional solder ball transfer device, the solder ball 2 is excessively absorbed in the suction hole 4 of the suction head 3. In some cases, the solder balls 2 are strongly vacuum-sucked, and even if the vacuum suction state is released during transfer to the work, the solder balls 2 do not fall off from the suction head 3, resulting in a transfer error for the work. As described above, the conventional solder ball transfer device has a problem that the reliability of the pick-up operation of the solder ball from the solder pool and the transfer operation of the solder ball to the work is low.
【０００６】そこで本発明は、半田ボールのピックアッ
プミスや移載ミスを解消し、確実に半田ボールをワーク
に移載できる半田ボールの移載装置および移載方法を提
供することを目的とする。SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a solder ball transfer device and transfer method capable of eliminating a solder ball pickup error and a transfer error and reliably transferring a solder ball onto a work.
【０００７】[0007]
【課題を解決するための手段】本発明の半田ボールの移
載装置は、ワークを位置決めする位置決めテーブルと、
多数の半田ボールを収納するボール溜りと、半田ボール
を真空吸着する吸引孔が複数個形成された吸着ヘッド
と、吸着ヘッドをボール溜りとワークとの間を移動させ
る移動手段と、吸着ヘッドに上下動作を行わせる上下動
手段と、吸着ヘッドに真空吸着された半田ボールに振動
を与える振動付与手段とを備えた。A solder ball transfer device according to the present invention includes a positioning table for positioning a work,
A ball reservoir for storing a large number of solder balls, a suction head having a plurality of suction holes for vacuum-sucking the solder balls, a moving means for moving the suction head between the ball reservoir and the work, and a suction head for moving up and down. The vertical movement means for performing the operation and the vibration applying means for vibrating the solder balls vacuum-adsorbed by the adsorption head are provided.
【０００８】また吸着ヘッドをボール溜りに対して上下
動作を行わせることにより、この吸着ヘッドの下面に形
成された複数個の吸引孔に半田ボールを真空吸着してピ
ックアップし、次いで吸着ヘッドをワークの上方へ相対
的に移動させ、そこで吸着ヘッドに再度上下動作を行わ
せるとともに、真空吸着状態を解除することにより、吸
引孔に真空吸着された半田ボールをワークに移載するよ
うにした半田ボールの移載方法であって、吸着ヘッドが
上下動作を行ってボール溜りの半田ボールを真空吸着し
てピックアップする際に、吸着ヘッドを振動付与手段に
より振動させるようにした。Further, by causing the suction head to move up and down with respect to the ball pool, the solder balls are vacuum-sucked and picked up by a plurality of suction holes formed in the lower surface of the suction head, and then the suction head is used as a workpiece. By moving the suction head again up and down, and releasing the vacuum suction state, so that the solder balls vacuum sucked in the suction holes are transferred to the workpiece. In the transfer method, the suction head is vibrated by the vibration applying means when the suction head moves up and down to vacuum-pick up the solder balls in the ball pool.
【０００９】[0009]
【作用】上記構成により、吸着ヘッドがボール溜りの半
田ボールを真空吸着してピックアップする際、振動付与
手段を作動させる。ここで、吸引孔に直接吸着された半
田ボールの近傍に余分な真空吸着されている半田ボール
や吸着ヘッドの底面に余分に付着している半田ボール
は、真空吸着力は弱く落下しやすいので、この振動によ
り、所期の位置の半田ボール（すなわち、吸引孔に直接
真空吸着されている半田ボール）のみ吸着ヘッドに真空
吸着されてピックアップされることになり、その他の余
分の半田ボールは吸着ヘッドから脱落してボール溜りに
落下するので、ピックアップミスを解消できる。With the above structure, when the suction head vacuum-sucks and picks up the solder balls in the ball pool, the vibration applying means is operated. Here, the extra solder balls that have been vacuum-sucked in the vicinity of the solder balls that have been directly sucked into the suction holes and the solder balls that have excessively adhered to the bottom surface of the suction head have a weak vacuum suction force and tend to fall. Due to this vibration, only the solder balls at the desired position (that is, the solder balls directly vacuum-sucked in the suction holes) are vacuum-sucked by the suction head to be picked up, and other extra solder balls are sucked by the suction head. Since it falls off from and falls into the ball pool, you can eliminate pickup mistakes.
【００１０】一方、吸着ヘッドがワークに半田ボールを
移載する場合、振動付与手段を作動させることにより、
吸引孔に直接強く真空吸着されたすべての半田ボールを
吸着ヘッドから強制的に脱落させてワークに確実に移載
することができる。On the other hand, when the suction head transfers the solder balls to the work, by operating the vibration applying means,
It is possible to forcibly drop all the solder balls that have been strongly vacuum-sucked directly into the suction holes from the suction head and transfer them securely to the work.
【００１１】[0011]
【実施例】次に図面を参照しながら本発明の実施例を説
明する。図１は本発明の一実施例における半田ボールの
移載装置の正面図、図２〜図４は本発明の一実施例にお
ける半田ボールの移載装置の動作説明図である。Embodiments of the present invention will now be described with reference to the drawings. 1 is a front view of a solder ball transfer device according to an embodiment of the present invention, and FIGS. 2 to 4 are operation explanatory views of the solder ball transfer device according to an embodiment of the present invention.
【００１２】図１において、基台１１上には位置決めテ
ーブルＡが設けられている。このうち、１２はＹモータ
１３により駆動されるＹテーブル、１４はＸモータ１５
により駆動されるＸテーブル、１６はＸテーブル１４上
に設けられワーク１７を保持するホルダである。即ちＸ
モータ１５、Ｙモータ１３を作動することにより、ワー
ク１７が所定位置に位置決めされる。本実施例のワーク
１７は基板である。In FIG. 1, a positioning table A is provided on the base 11. Of these, 12 is a Y table driven by a Y motor 13 and 14 is an X motor 15
The X table 16 driven by is a holder which is provided on the X table 14 and holds the work 17. That is, X
The work 17 is positioned at a predetermined position by operating the motor 15 and the Y motor 13. The work 17 in this embodiment is a substrate.
【００１３】また位置決めテーブルＡの横にはボール溜
りＢが配設されている。このうち、１８は上部が開口さ
れ、内部に複数の半田ボール１９を多層状に収納するボ
ールケースであり、ボールケース１８の下面には半田ボ
ール１９よりも小径の通気孔１８ａが開けられている。
２０はボールケース１８を外側から囲み、内部空間Ｓが
通気孔１８ａに連通する外筒である。外筒２０の内部空
間Ｓの下部にはガス供給手段Ｅが接続されている。この
うち、２２は不活性ガス（例えばＮ2ガス）又は乾燥空
気を吹出すブロワ、２１はブロワ２２が吹出すガスの通
路を開閉するバルブである。A ball pool B is arranged beside the positioning table A. Of these, 18 is a ball case having an open top and a plurality of solder balls 19 housed therein in a multi-layered manner. A vent hole 18a having a diameter smaller than that of the solder balls 19 is formed in the lower surface of the ball case 18. .
Reference numeral 20 is an outer cylinder that surrounds the ball case 18 from the outside, and the internal space S communicates with the ventilation hole 18a. Gas supply means E is connected to the lower portion of the internal space S of the outer cylinder 20. Of these, 22 is a blower that blows out an inert gas (for example, N 2 gas) or dry air, and 21 is a valve that opens and closes the passage of the gas blown by the blower 22.
【００１４】ここでブロワ２２を作動しバルブ２１を開
くと、内部空間Ｓ、通気孔１８ａを介してガスが半田ボ
ール１９の層を通過して上方へ放出される。本実施例で
は、ガス供給手段Ｅを設けたので、半田ボール１９の層
へガスを送り込むことにより、半田ボール１９を浮遊・
流動化させた状態を生成し、半田ボール１９同士が凝集
しないようにすることができる。即ち、半田ボール１９
を１個１個完全にばらばらにした状態で取扱うことがで
き、半田ボール１９を吸引孔２８ａに１対１に対応させ
易くなっている。なお半田ボールを浮遊・流動化させる
方法としては、半田ボールを収納するボールケース１８
を振動器４０により振動させてもよい。When the blower 22 is operated and the valve 21 is opened, gas passes through the layer of the solder balls 19 and is discharged upward through the internal space S and the vent holes 18a. In this embodiment, since the gas supply means E is provided, the gas is sent to the layer of the solder balls 19 to float the solder balls 19.
It is possible to generate a fluidized state and prevent the solder balls 19 from aggregating with each other. That is, the solder ball 19
The solder balls 19 can be handled in a completely separated state, and the solder balls 19 can be easily associated with the suction holes 28a one to one. As a method for floating and fluidizing the solder balls, a ball case 18 for housing the solder balls is used.
May be vibrated by the vibrator 40.
【００１５】Ｃは半田ボール１９を移載する吸着ヘッド
であり、このうち２６は内部が空洞になっており、吸引
装置２４に配管２５を介して接続されたヘッド本体であ
る。２８はヘッド本体２６に防振ゴム２７を介して弾性
を持って固定された吸着パットである。吸着パッド２８
の下面にはワーク１７に移載すべき半田ボール１９の配
置、個数に対応した吸引孔２８ａがマトリクス状に複数
個開けられている（図２も参照）。２９は吸着パッド２
８に取付けられた振動付与手段としての振動子、３０は
ヘッド本体２６が下部に固着された支持ブロックであ
る。即ち吸着パッド２８の吸引孔２８ａに半田ボール１
９を真空吸着し振動子２９を作動させると、各々の吸引
孔２８ａに１個づつ吸着された半田ボール１９を除く余
分な半田ボール１９を落下させることができる。防振ゴ
ム２７は、振動子２９の振動がヘッド本体２６に伝達さ
れて、ヘッド本体２６側ががたつくのを防止する。Reference numeral C denotes a suction head on which the solder balls 19 are transferred, and 26 of these is a head body having a hollow interior and connected to the suction device 24 through a pipe 25. Reference numeral 28 denotes a suction pad elastically fixed to the head body 26 via a vibration-proof rubber 27. Suction pad 28
A plurality of suction holes 28a corresponding to the arrangement and number of the solder balls 19 to be transferred to the work 17 are formed in a matrix on the lower surface of the substrate (see also FIG. 2). 29 is a suction pad 2
A vibrator serving as vibration applying means attached to the reference numeral 8 and a support block 30 to which the head main body 26 is fixedly attached to the lower portion. That is, the solder ball 1 is inserted into the suction hole 28a of the suction pad 28.
When 9 is vacuum-sucked and the oscillator 29 is operated, the extra solder balls 19 except the solder balls 19 sucked one by one in each suction hole 28a can be dropped. The vibration-proof rubber 27 prevents the vibration of the vibrator 29 from being transmitted to the head body 26 and rattling the head body 26 side.
【００１６】Ｄは吸着ヘッドＣをボール溜りＢとワーク
１７との間を往復移動させる移動手段である。このう
ち、３１はＹ方向に延びる支持フレーム、３２は支持フ
レーム３１に軸架される送りねじ、３３は送りねじ３２
を回転させるＹモータである。３４は図示していないが
裏面に送りねじ３２に螺合するナット部を備えた移動
板、３５は移動板３４に設けられた垂直なガイドレール
であり、上記支持ブロック３０がガイドレール３５にス
ライド自在に係合している。３６は移動板３４に軸支さ
れた垂直な送りねじ、３７は送りねじ３６を回転させる
Ｚモータ、３８は送りねじ３６に螺合し、かつ支持ブロ
ック３０に固定された送りナット部である。即ち、Ｚモ
ータ３７を駆動することにより、吸着ヘッドＣを昇降さ
せることができ、Ｙモータ３３を駆動することにより、
吸着ヘッドＣを図１において左右方向に移動させること
ができる。D is a moving means for moving the suction head C back and forth between the ball reservoir B and the work 17. Of these, 31 is a support frame extending in the Y direction, 32 is a feed screw mounted on the support frame 31, and 33 is a feed screw 32.
Is a Y motor for rotating the. Although not shown, 34 is a moving plate having a nut portion on the back surface which is screwed into the feed screw 32, and 35 is a vertical guide rail provided on the moving plate 34. The support block 30 slides on the guide rail 35. It is freely engaged. Reference numeral 36 is a vertical feed screw pivotally supported by the moving plate 34, 37 is a Z motor for rotating the feed screw 36, and 38 is a feed nut portion screwed onto the feed screw 36 and fixed to the support block 30. That is, by driving the Z motor 37, the suction head C can be moved up and down, and by driving the Y motor 33,
The suction head C can be moved in the left-right direction in FIG.
【００１７】次に図２〜図４を参照しながら本実施例の
半田ボールの移載装置の動作を説明する。まず図１にお
いて、Ｙモータ３３を駆動して吸着ヘッドＣをボール溜
りＢの上方へ移動させる。そこでＺモータ３７を駆動し
て吸着ヘッドＣをボールケース１８の内部へ向って下降
させ、図２において鎖線で示すように吸着パット２８の
下面をボールケース１８内の半田ボール１９の層中に若
干沈み込ませ、次いでＺモータ３７を逆回転させて吸着
ヘッドＣを上昇させる。すると、半田ボール１９は吸着
パッド２８の吸引孔２８ａに真空吸着されてピックアッ
プされる。Next, the operation of the solder ball transfer device of this embodiment will be described with reference to FIGS. First, in FIG. 1, the Y motor 33 is driven to move the suction head C above the ball pool B. Then, the Z motor 37 is driven to lower the suction head C toward the inside of the ball case 18, and the lower surface of the suction pad 28 is slightly moved into the layer of the solder balls 19 in the ball case 18 as shown by the chain line in FIG. Then, the Z motor 37 is rotated in the reverse direction to raise the suction head C. Then, the solder balls 19 are vacuum sucked and picked up by the suction holes 28 a of the suction pads 28.
【００１８】さてこの場合、図２に示すように吸着パッ
ド２８の吸引孔２８ａ付近に余分の半田ボール（符号ロ
を付している）１９が吸着されていたり、吸着パッド２
８の底面に余分な半田ボール（符号ハを付している）１
９に付着したりすることがある。そこでこのとき図３に
示すように振動子２９を作動させ、吸着パッド２８を振
動させる。すると、吸引孔２８ａに直接強く吸着された
半田ボール（符号イを付している）１９のみが真空吸着
された状態を保ち、その他の半田ボール（ロ、ハ）１９
は真空吸着力は弱いので落下してボール溜りＢに回収さ
れる。In this case, as shown in FIG. 2, an extra solder ball (denoted by reference numeral B) 19 is adsorbed in the vicinity of the suction hole 28a of the suction pad 28, or the suction pad 2
An extra solder ball on the bottom of 8 (marked with C) 1
9 may be attached. Therefore, at this time, as shown in FIG. 3, the vibrator 29 is operated to vibrate the suction pad 28. Then, only the solder balls (denoted by a) 19 that are strongly attracted directly to the suction holes 28a remain in the vacuum attracted state, and the other solder balls (b, c) 19 are retained.
Has a weak vacuum suction force, and falls and is collected in the ball pool B.
【００１９】また図２において、吸着パッド２８が鎖線
で示す位置まで沈み込む際には、バルブ２１を開いてガ
スをボールケース１８内へ吹き出し、ボールケース１８
内の半田ボール１９を浮遊・流動化させれば、ボールケ
ース１８内の半田ボール１９はばらばらの状態となり、
１個づつ吸引孔２８ａに真空吸着されやすい。また鎖線
で示す位置まで沈み込んだ後、吸着パッド２８が実線で
示す位置まで上昇して半田ボール１９をピックアップす
る際には、Ｙモータ３３を正逆駆動して、吸着ヘッドＣ
を横方向Ｎに若干（数ｍｍ程度）往復移動させる。する
と、吸引孔２８ａ以外に弱い力で余分に付着した半田ボ
ール（ロ、ハ）１９は振り落され（図３参照）、吸引孔
２８に直接しっかり真空吸着された半田ボール（イ）１
９のみが最後まで真空吸着されてピックアップされるこ
ととなる。Further, in FIG. 2, when the suction pad 28 sinks to the position shown by the chain line, the valve 21 is opened to blow the gas into the ball case 18, and the ball case 18 is opened.
If the solder balls 19 inside are floated and fluidized, the solder balls 19 inside the ball case 18 will be in a disjointed state,
The suction holes 28a are easily vacuum-adsorbed one by one. When the suction pad 28 moves up to the position shown by the solid line and picks up the solder ball 19 after sinking to the position shown by the chain line, the Y motor 33 is driven forward and backward to move the suction head C.
Is moved back and forth slightly in the lateral direction N (about several mm). Then, the solder balls (b, c) 19 excessively attached to the suction holes 28a with a weak force are shaken off (see FIG. 3), and the solder balls (a) 1 firmly vacuum-adsorbed directly to the suction holes 28a.
Only 9 will be vacuum-adsorbed and picked up to the end.
【００２０】このようにボールケース１８内の半田ボー
ル１９を浮遊・流動化させるガス供給手段Ｅや、吸着ヘ
ッドＣをボールケース１８に対して横方向へ移動させる
横方向移動手段Ｄを設けることにより、吸着ヘッドＣの
下面に余分な半田ボール１９が付着するのをより効果的
に防止してピックアップミスを解消できる。なお本実施
例では、吸着ヘッドＣをボール溜り部Ｂと位置決めテー
ブルＡの間を往復移動させる移動手段Ｄである送りねじ
３２、Ｙモータ３３などが横方向移動手段Ｄを兼務して
いるが、要は吸着ヘッドＣをボール溜りＢに対して相対
的に横方向に移動させればよいものであり、例えばボー
ル溜りＢを吸着ヘッドＣに対して横方向に移動させても
よい。As described above, by providing the gas supply means E for floating and fluidizing the solder balls 19 in the ball case 18 and the lateral movement means D for laterally moving the suction head C with respect to the ball case 18. Further, it is possible to more effectively prevent the extra solder ball 19 from adhering to the lower surface of the suction head C and eliminate the pickup error. In this embodiment, the feed screw 32, the Y motor 33, etc., which is the moving means D for reciprocating the suction head C between the ball reservoir B and the positioning table A, also serves as the lateral moving means D. The point is that the suction head C may be moved in the lateral direction relative to the ball pool B. For example, the ball pool B may be moved in the lateral direction with respect to the suction head C.
【００２１】さて、半田ボール１９をピックアップした
吸着ヘッドＣは、次に図４に示すようにワーク１７の上
方へ移動する。そしてそこで吸着ヘッドＣは下降してそ
の下面の半田ボール１９をワーク１７の上面の電極１７
ａ上に着地させ、次いで半田ボール１９の真空吸着状態
を解除して上昇することにより、半田ボール１９を電極
１７ａ上に移載する。この場合、図４において破線で示
すように、半田ボール１９が電極１７ａに移載されず
に、吸着パッド２８の下面に付着残存したままになって
移載ミスを生じることがある。そこで矢印Ｎ１で示すよ
うに移載動作を終了して吸着ヘッドＣを上昇させようと
する際、振動子２９を作動し吸着パッド２８を振動させ
る。すると半田ボール１９は吸着バッド２８の下面から
確実に脱落して電極１７ａに移載される。なお上述した
振動子２９の作動の際、吸着パッド２８が振動するが、
ヘッド本体２６と吸着パッド２８との間には防振ゴム２
７が介装されており、振動子２９を作動してもヘッド本
体２６側ががたついて移動手段Ｄの移動精度が低下する
などのトラブルを生じるおそれはない。Now, the suction head C picking up the solder balls 19 moves to above the work 17 as shown in FIG. Then, the suction head C descends and the solder balls 19 on the lower surface of the suction head C move to the electrodes 17 on the upper surface of the work 17.
The solder ball 19 is transferred onto the electrode 17a by landing on the surface a and then lifting the solder ball 19 by releasing the vacuum suction state. In this case, as shown by the broken line in FIG. 4, the solder ball 19 may not be transferred to the electrode 17a, but may remain attached to the lower surface of the suction pad 28 and cause a transfer error. Therefore, when the transfer operation is finished and the suction head C is to be raised as indicated by the arrow N1, the vibrator 29 is operated to vibrate the suction pad 28. Then, the solder ball 19 is surely dropped from the lower surface of the suction pad 28 and transferred onto the electrode 17a. The suction pad 28 vibrates during the operation of the vibrator 29 described above.
A vibration proof rubber 2 is provided between the head body 26 and the suction pad 28.
Even if the vibrator 29 is operated, there is no fear that the head main body 26 rattles and the moving accuracy of the moving means D is deteriorated.
【００２２】[0022]
【発明の効果】以上説明したように本発明によれば、吸
着ヘッドがボール溜りの半田ボールを真空吸着してピッ
クアップする際に、余分な半田ボールが吸着ヘッドの下
面に付着してピックアップされることはなく、１つの吸
引孔に確実に１個の半田ボールを真空吸着してピックア
ップできる。また吸着ヘッドが半田ボールをワークに移
載する場合も、半田ボールを確実に吸着ヘッドの下面か
ら脱落させてワークに移載することができる。As described above, according to the present invention, when the suction head picks up the solder balls in the ball pool by vacuum suction, extra solder balls are attached to the lower surface of the suction head and picked up. Therefore, one solder ball can be reliably sucked into one suction hole by vacuum suction and picked up. Further, even when the suction head transfers the solder balls to the work, the solder balls can be reliably dropped from the lower surface of the suction head and transferred to the work.
【図１】本発明の一実施例における半田ボールの移載装
置の正面図FIG. 1 is a front view of a solder ball transfer device according to an embodiment of the present invention.
【図２】本発明の一実施例における半田ボールの移載装
置の動作説明図FIG. 2 is an operation explanatory diagram of a solder ball transfer device according to an embodiment of the present invention.
【図３】本発明の一実施例における半田ボールの移載装
置の動作説明図FIG. 3 is an operation explanatory diagram of a solder ball transfer device according to an embodiment of the present invention.
【図４】本発明の一実施例における半田ボールの移載装
置の動作説明図FIG. 4 is an operation explanatory view of the solder ball transfer device in the embodiment of the present invention.
【図５】従来の半田ボールの移載装置の動作説明図FIG. 5 is an operation explanatory view of a conventional solder ball transfer device.
１７ ワーク １９ 半田ボール ２８ａ 吸引孔 ２９ 振動子 Ａ 位置決めテーブル Ｂ ボール溜り Ｃ 吸着ヘッド Ｄ 移動手段（横方向移動手段） Ｅ ガス供給手段 17 Workpiece 19 Solder Ball 28a Suction Hole 29 Transducer A Positioning Table B Ball Reservoir C Suction Head D Moving Means (Horizontal Moving Means) E Gas Supply Means
Claims (9)
と、多数の半田ボールを収納するボール溜りと、半田ボ
ールを真空吸着する吸引孔が複数個形成された吸着ヘッ
ドと、この吸着ヘッドを前記ボール溜りと前記ワークと
の間を移動させる移動手段と、前記吸着ヘッドに上下動
作を行わせる上下動手段と、前記吸着ヘッドに真空吸着
された半田ボールに振動を与える振動付与手段とを備え
たことを特徴とする半田ボールの移載装置。1. A positioning table for positioning a work, a ball reservoir for accommodating a large number of solder balls, a suction head having a plurality of suction holes for vacuum-sucking the solder balls, and the suction head serving as the ball reservoir. A moving means for moving the workpiece and the work; a vertical moving means for moving the suction head up and down; and a vibration applying means for vibrating the solder ball vacuum-sucked by the suction head. Solder ball transfer device.
り、半田ボールを流動化させるガス供給手段を有するこ
とを特徴とする請求項１記載の半田ボールの移載装置。2. The solder ball transfer device according to claim 1, further comprising gas supply means for fluidizing the solder ball by supplying gas to the ball reservoir.
ルを流動化させる振動付与手段を有することを特徴とす
る請求項１又は２記載の半田ボールの移載装置。3. The solder ball transfer device according to claim 1, further comprising vibration applying means for applying vibration to the ball reservoir to fluidize the solder ball.
上下動作を行わせて、前記吸引孔に半田ボールを真空吸
着する際に、前記吸着ヘッドを前記ボール溜りに対して
相対的に横方向に移動させる横方向移動手段を備えたこ
とを特徴とする請求項１記載の半田ボールの移載装置。4. When the suction head is moved up and down with respect to the ball pool so that the solder ball is vacuum-sucked into the suction hole, the suction head moves in a lateral direction relative to the ball pool. 2. The solder ball transfer device according to claim 1, further comprising a lateral movement means for moving the solder ball to the above.
することを特徴とする請求項４記載の半田ボールの移載
装置。5. The solder ball transfer device according to claim 4, wherein the moving means also serves as the lateral moving means.
を行わせることにより、この吸着ヘッドの下面に形成さ
れた複数個の吸引孔に半田ボールを真空吸着してピック
アップし、 次いで前記吸着ヘッドをワークの上方へ相対的に移動さ
せ、そこで前記吸着ヘッドに再度上下動作を行わせると
ともに、真空吸着状態を解除することにより、前記吸引
孔に真空吸着された半田ボールをワークに移載するよう
にした半田ボールの移載方法であって、 前記吸着ヘッドが上下動作を行って前記ボール溜りの半
田ボールを真空吸着してピックアップする際に、前記吸
着ヘッドを振動付与手段により振動させることを特徴と
する半田ボールの移載方法。6. A solder ball is vacuum-sucked and picked up by a plurality of suction holes formed in the lower surface of the suction head by moving the suction head up and down with respect to the ball pool. Is relatively moved above the work, the suction head is again moved up and down, and the vacuum suction state is released so that the solder balls vacuum sucked in the suction holes are transferred to the work. The method of transferring a solder ball according to claim 1, wherein the suction head is vibrated by a vibration applying unit when the suction head moves up and down to vacuum-pick up the solder ball in the ball pool. And solder ball transfer method.
記吸着ヘッドが横方向移動手段により前記ボール溜りに
対して相対的に横方向へ移動することを特徴とする請求
項６記載の半田ボールの移載方法。7. The solder according to claim 6, wherein when the suction head is moved up and down, the suction head is moved laterally by the lateral movement means relative to the ball reservoir. How to transfer the ball.
記ボール溜りにガスを供給してその内部の半田ボールを
流動化させることを特徴とする請求項６又は７記載の半
田ボールの移載方法。8. The solder ball transfer according to claim 6, wherein when the suction head moves up and down, a gas is supplied to the ball reservoir to fluidize the solder balls therein. How to put.
を行わせることにより、この吸着ヘッドの下面に形成さ
れた複数個の吸引孔に半田ボールを真空吸着してピック
アップし、 次いで前記吸着ヘッドをワークの上方へ相対的に移動さ
せ、そこで前記吸着ヘッドに再度上下動作を行わせると
ともに、真空吸着状態を解除することにより、前記吸引
孔に真空吸着された半田ボールをワークに移載するよう
にした半田ボールの移載方法であって、 前記吸引孔に吸着された半田ボールをワークに移載する
際に前記吸着ヘッドを振動させることを特徴とする半田
ボールの移載方法。9. A suction ball is vacuum-sucked and picked up by a plurality of suction holes formed in the lower surface of the suction head by moving the suction head up and down with respect to the ball pool. Is relatively moved above the work, the suction head is again moved up and down, and the vacuum suction state is released so that the solder balls vacuum sucked in the suction holes are transferred to the work. The solder ball transfer method according to claim 1, wherein the suction head is vibrated when the solder ball sucked in the suction holes is transferred to a work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05125295A JP3211613B2 (en) | 1994-08-25 | 1995-03-10 | Transfer method of solder ball |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20063694 | 1994-08-25 | ||
| JP6-200636 | 1994-08-25 | ||
| JP05125295A JP3211613B2 (en) | 1994-08-25 | 1995-03-10 | Transfer method of solder ball |
Related Child Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24486198A Division JP3211783B2 (en) | 1994-08-25 | 1998-08-31 | Transfer method of solder ball |
| JP24486098A Division JP3173471B2 (en) | 1994-08-25 | 1998-08-31 | Solder ball transfer device and transfer method |
| JP24485898A Division JP3211781B2 (en) | 1994-08-25 | 1998-08-31 | Transfer method of solder ball |
| JP24485998A Division JP3211782B2 (en) | 1994-08-25 | 1998-08-31 | Transfer method of solder ball |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08112671A true JPH08112671A (en) | 1996-05-07 |
| JP3211613B2 JP3211613B2 (en) | 2001-09-25 |
Family
ID=26391783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05125295A Expired - Lifetime JP3211613B2 (en) | 1994-08-25 | 1995-03-10 | Transfer method of solder ball |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3211613B2 (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998033210A1 (en) * | 1997-01-24 | 1998-07-30 | Unisys Corporation | Vibrating template method of placing solder balls on the i/o pads of an integrated circuit package |
| JPH11102934A (en) * | 1997-07-14 | 1999-04-13 | Motorola Inc | Air blow solder ball loading system for micro ball grid array |
| US6056190A (en) * | 1997-02-06 | 2000-05-02 | Speedline Technologies, Inc. | Solder ball placement apparatus |
| US6065201A (en) * | 1997-04-25 | 2000-05-23 | Matsushita Electric Industrial Co., Ltd. | Method of transferring conductive balls onto work piece |
| US6107181A (en) * | 1997-09-08 | 2000-08-22 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
| US6170737B1 (en) | 1997-02-06 | 2001-01-09 | Speedline Technologies, Inc. | Solder ball placement method |
| JP2001068840A (en) * | 1999-06-24 | 2001-03-16 | Asuriito Fa Kk | Device and method for mounting ball |
| US6320158B1 (en) | 1998-01-29 | 2001-11-20 | Fujitsu Limited | Method and apparatus of fabricating perforated plate |
| KR100406449B1 (en) * | 1997-12-30 | 2004-01-24 | 앰코 테크놀로지 코리아 주식회사 | Flux dotting apparatus of ball bumping system for manufacturing semiconductor package |
| US6916731B2 (en) | 1999-04-23 | 2005-07-12 | Nippon Steel Corporation | Ball transferring method and apparatus |
| KR100525850B1 (en) * | 1998-01-30 | 2005-11-02 | 시부야 코교 가부시키가이샤 | Solder ball mounting device and method for setting a position and degree of vacuum of a sucking head |
| KR100535182B1 (en) * | 1999-02-25 | 2005-12-09 | 삼성전자주식회사 | Apparatus for attaching solder ball |
| EP0964442A4 (en) * | 1997-01-30 | 2006-11-08 | Nippon Steel Corp | Ball arranging substrate for forming bump, ball arranging head, ball arranging device, and ball arranging method |
| US7285486B2 (en) | 2001-01-12 | 2007-10-23 | Nippon Steel Materials Co., Ltd. | Ball transferring method and apparatus |
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-
1995
- 1995-03-10 JP JP05125295A patent/JP3211613B2/en not_active Expired - Lifetime
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998033210A1 (en) * | 1997-01-24 | 1998-07-30 | Unisys Corporation | Vibrating template method of placing solder balls on the i/o pads of an integrated circuit package |
| EP2256793A1 (en) * | 1997-01-30 | 2010-12-01 | Nippon Steel Corporation | Ball-arranging substrate for forming bumps, ball-arranging head, ball-arranging apparatus and method for arranging balls |
| EP0964442A4 (en) * | 1997-01-30 | 2006-11-08 | Nippon Steel Corp | Ball arranging substrate for forming bump, ball arranging head, ball arranging device, and ball arranging method |
| US6056190A (en) * | 1997-02-06 | 2000-05-02 | Speedline Technologies, Inc. | Solder ball placement apparatus |
| US6170737B1 (en) | 1997-02-06 | 2001-01-09 | Speedline Technologies, Inc. | Solder ball placement method |
| US6065201A (en) * | 1997-04-25 | 2000-05-23 | Matsushita Electric Industrial Co., Ltd. | Method of transferring conductive balls onto work piece |
| SG85094A1 (en) * | 1997-04-25 | 2001-12-19 | Matsushita Electric Ind Co Ltd | Method of transferring conductive balls onto work piece |
| JPH11102934A (en) * | 1997-07-14 | 1999-04-13 | Motorola Inc | Air blow solder ball loading system for micro ball grid array |
| US6107181A (en) * | 1997-09-08 | 2000-08-22 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
| US6432806B1 (en) | 1997-09-08 | 2002-08-13 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
| KR100406449B1 (en) * | 1997-12-30 | 2004-01-24 | 앰코 테크놀로지 코리아 주식회사 | Flux dotting apparatus of ball bumping system for manufacturing semiconductor package |
| US6320158B1 (en) | 1998-01-29 | 2001-11-20 | Fujitsu Limited | Method and apparatus of fabricating perforated plate |
| KR100525850B1 (en) * | 1998-01-30 | 2005-11-02 | 시부야 코교 가부시키가이샤 | Solder ball mounting device and method for setting a position and degree of vacuum of a sucking head |
| KR100535182B1 (en) * | 1999-02-25 | 2005-12-09 | 삼성전자주식회사 | Apparatus for attaching solder ball |
| US6916731B2 (en) | 1999-04-23 | 2005-07-12 | Nippon Steel Corporation | Ball transferring method and apparatus |
| US7066377B2 (en) | 1999-06-24 | 2006-06-27 | Athlete Fa Corporation | Ball mounting method |
| US7077305B1 (en) | 1999-06-24 | 2006-07-18 | Athlete Fa Corporation | Ball loading apparatus |
| US7240822B2 (en) | 1999-06-24 | 2007-07-10 | Athlete Fa Corporation | Ball mounting method |
| JP2001068840A (en) * | 1999-06-24 | 2001-03-16 | Asuriito Fa Kk | Device and method for mounting ball |
| US7285486B2 (en) | 2001-01-12 | 2007-10-23 | Nippon Steel Materials Co., Ltd. | Ball transferring method and apparatus |
| CN115229458A (en) * | 2022-06-13 | 2022-10-25 | 昆山讯腾智能装备制造有限公司 | Ball mounting apparatus and method |
| CN115229458B (en) * | 2022-06-13 | 2024-04-02 | 昆山讯腾智能装备制造有限公司 | Ball mounting apparatus and method |
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