JP3152077B2 - Solder ball transfer device and solder ball suction method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball transfer apparatus for transferring a solder ball to a work (an electronic component such as a substrate or a ball grid array) and a method for attracting a solder ball.

[0002]

2. Description of the Related Art In recent years, a solder ball transfer device that collectively adsorbs and transfers a plurality of solder balls to a work such as an electronic component or a substrate has been put to practical use. FIG. 6 is a view for explaining the operation of a conventional solder ball transfer device.

In FIG. 6, reference numeral 1 denotes a ball pool for accommodating a large number of solder balls 2, and an upper portion thereof is opened so that a suction head 3 can enter and exit. Here, the suction head 3 has a plurality of suction holes 3a on the lower surface so that a plurality of solder balls 2 can be suctioned and transferred to a work at a time. One suction hole 3a is designed on the assumption that one solder ball 2 is originally sucked.

[0004]

However, since the suction head 3 actually descends into the ball pool 1 while pressing the solder ball 2, the solder ball 2 adheres to the bottom surface of the suction head 3 as shown in FIG. In some cases, a plurality of solder balls 2 are aggregated in one suction hole 3a and adsorbed in a tuft shape. If the solder balls 2 are transferred to a work as they are, the solder balls 2 are mounted on unnecessary portions. There was a problem that it would.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a solder ball transfer apparatus and a solder ball suction method capable of reliably transferring a required number of solder balls.

[0006]

According to the present invention, there is provided a solder ball transfer device, comprising: a positioning table for positioning a work;
A ball reservoir for storing a large number of solder balls, a plurality of suction holes for sucking and holding the solder balls from the ball reservoir, a suction head for attaching and detaching the solder balls and mounting the solder balls on the work, and a ball for the suction head moving means for moving between the reservoir and the work, when the suction head to adsorb the solder balls, and a relative moving means for relatively moving the suction head and the ball reservoir in the horizontal direction, and before
The ball reservoir supplies gas from below to remove solder balls.
That having a blow means to float.

[0007]

With the above arrangement, when the suction head sucks the solder ball from the ball pool, the relative moving means is operated to relatively move the suction head and the ball pool in the horizontal direction. Here, the solder ball that is most strongly attracted to the suction hole moves together with the suction head, but the solder ball that is aggregated in a tuft around the suction hole and the solder ball that adheres to the bottom surface of the suction head are balls. With the ball in the pool, it moves relatively to the suction head in the horizontal direction and separates from the bottom surface of the suction head. Thereafter, the suction head is raised, and only the solder balls sucked into the suction holes are taken out of the ball pool and transferred to the work.

[0008]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a solder ball transfer device according to one embodiment of the present invention, and FIGS. 2 to 5 are operation explanatory diagrams of the solder ball transfer device according to one embodiment of the present invention.

In FIG. 1, a positioning table A is provided on a base 11. Among them, 12 is a Y table driven by a Y motor 13, and 14 is an X motor 15
An X-table 16 driven by the X-axis is a holder provided on the X-table 14 for holding a work 17. That is, X
By operating the motor 15 and the Y motor 13, the work 17 is positioned at a predetermined position.

A ball pool B is provided beside the positioning table A. Among them, 18 is a ball case which has an opening at an upper part and accommodates a plurality of solder balls 19 in a multi-layered shape, and a vent hole 18a having a smaller diameter than the solder balls 19 is opened at the lower surface of the ball case 18. .
Reference numeral 20 denotes an outer cylinder that surrounds the ball case 18 from the outside, and the inner space S communicates with the ventilation hole 18a. A blowing means E is connected to a lower portion of the internal space S of the outer cylinder 20. Among them, 22 is a blower for blowing out an inert gas (for example, N ₂ gas) or dry air, and 21 is a valve for opening and closing the passage of the gas blown out by the blower 22. Here, when the blower 22 is operated and the valve 21 is opened, gas is discharged upward through the layer of the solder ball 19 through the internal space S and the ventilation hole 18a. In this embodiment, since the blow-up means E is provided, the gas is fed into the layer of the solder ball 19 so that the solder ball 1
A gas can be interposed between the solder balls 9 to create a state in which the solder balls 19 are microscopically floated. Accordingly, when the head body 26 is inserted into the solder ball 19 as described later,
The solder balls 19 can escape without exerting an excessive force on the periphery of the head body 26. As a result, the solder ball 19 is not deformed even when the head body 26 is inserted. Further, since it is possible to prevent the adjacent solder balls 19 from aggregating, the solder balls 19 are connected to a plurality of solder balls 1.
9 and can be handled in a state of being separated one by one, and solder balls 19 are one-to-one with suction holes 26a.
It is easy to correspond to. Since the valve 21 is provided, the gas can be blown out only when necessary, and the layer of the solder ball 19 can be efficiently fluidized by eliminating waste of gas consumption.

Reference numeral C denotes a suction head for transferring the solder balls 19, and 26 is a head body having a hollow inside and connected to a suction device 24 via a pipe 25. On the lower surface of the head body 26, suction holes 26a corresponding to the arrangement and the number of the solder balls 19 to be transferred to the work 17 are provided.
(See FIG. 2) is open. 30 is the head body 26
Is a support block fixed to the lower part.

D is a moving means for reciprocating the suction head C between the ball reservoir B and the work 17. Among them, 31 is a support frame extending in the Y direction, 32 is a feed screw mounted on the support frame 31, and 33 is a feed screw 32
Is a Y motor for rotating. Numeral 34 denotes a moving plate having a nut portion screwed to the feed screw 32 on the back surface, and numeral 35 denotes a vertical guide rail provided on the moving plate 34, and the support block 30 slides on the guide rail 35. Freely engaged. Reference numeral 36 denotes a vertical feed screw pivotally supported by the moving plate 34, 37 denotes a Z motor for rotating the feed screw 36, and 38 denotes a feed nut portion screwed to the feed screw 36 and fixed to the support block 30. That is, by driving the Z motor 37, the suction head C can be raised and lowered, and by driving the Y motor 33,
The suction head C can be moved in the left-right direction in FIG. In the present embodiment, the Y motor 33, the feed screw 32, and the nut part also serve as relative moving means. That is, when the head main body 26 is in the layer of the solder balls 19, the head main body 26 is relatively moved with respect to the ball pool B by alternately operating the Y motor 33 in the forward and reverse directions. Of course, the present invention is not limited to such a configuration. Relative moving means may be provided separately from the moving means D. Alternatively, the head body 26 may be stationary and the ball pool B may be reciprocated. No problem.

Next, referring to FIGS. 2 to 5, each step of the method for adsorbing solder balls according to the present embodiment will be described. First, as shown in FIG. 2, when the head main body 26 is lowered as shown by an arrow N1, the valve 21 is opened, and the space S, the vent 18
The gas is blown up into the layer of the solder ball 19 through a. As a result, the solder balls 19 are fluidized and can move freely up, down, left, and right.

Next, as shown in FIG. 3, the head body 26 is further lowered and inserted into the layer of the fluidized solder balls 19. At this time, most of the solder balls 19 escape around the head main body 26 as indicated by an arrow N2. The solder ball 19 just below the head body 26 is
6 will be slightly pushed down. At this time, some solder balls 19 adhere to the bottom surface of the head main body 26. When the insertion operation of the head main body 26 is completed,
The valve 21 is closed to minimize wasteful gas consumption.

Next, as shown by an arrow N3 in FIG. 4, the Y motor 33 is operated to move the head body 26 relative to the ball case 18 of the ball pool B in the horizontal direction. Then, the solder balls 19 aggregated in one suction hole 26a
Of the suction holes 26a, only one of the solder balls 19, which is most strongly adsorbed to the suction hole, is adsorbed to the central portion of the suction hole 26a.
6a is closed. As a result, the suction of the other solder balls 19 is released. The solder ball 19 sucked in the suction hole 26a moves in the horizontal direction together with the suction head 26, but the solder ball 19 adhering to the lower surface of the suction head 26 is removed from the other solder balls 19 in the ball pool B. As a result, horizontal movement is hindered, and the suction head 26 is separated from a portion adhering to the bottom surface. As a result, the attached solder balls 19 are not attached.

Next, as shown by an arrow N4 in FIG. 5, the head body 26 is raised, and only the solder balls 19 sucked into the suction holes 26a are taken out from the ball pool B to complete the suction operation. After that, for example, the operation of recognizing the suction state of the solder ball 19 is performed, and then the work is transferred to the work 17.

[0017]

According to the present invention, there is provided a solder ball transfer device comprising: a positioning table for positioning a work; a ball pool for storing a large number of solder balls; and a plurality of suction holes for sucking and holding the solder balls from the ball pool. A suction head for attaching and detaching the solder ball and mounting the solder ball on the work,
Moving means for moving the suction head between the ball pool and the work, and relative moving means for relatively moving the suction head and the ball pool in the horizontal direction when the suction head sucks the solder ball ; and The ball pool
Blows the solder balls by supplying gas from below.
As they may have a top section, it is possible to prevent the solder ball is attached to the bottom surface of the suction head, transfers only to ensure the work solder balls necessary number adsorbed to the suction hole.

[Brief description of the drawings]

FIG. 1 is a front view of a solder ball transfer device according to an embodiment of the present invention.

FIG. 2 is an explanatory view of the operation of the solder ball transfer device in one embodiment of the present invention.

FIG. 3 is an explanatory view of the operation of the solder ball transfer device according to one embodiment of the present invention.

FIG. 4 is a diagram illustrating the operation of the solder ball transfer device according to one embodiment of the present invention.

FIG. 5 is an explanatory diagram of an operation of the solder ball transfer device according to one embodiment of the present invention.

FIG. 6 is an operation explanatory view of a conventional solder ball transfer device.

[Explanation of symbols]

 17 Work 19 Solder ball A Positioning table B Ball pool C Suction head D Moving means (relative moving means) E Blowing means

Claims (3)

(57) [Claims] A work table for positioning a work, a ball pool for storing a large number of solder balls, and a plurality of suction holes for sucking and holding the solder balls from the ball pool; A suction head for mounting a solder ball on the head, a moving means for moving the suction head between the ball pool and the work, and horizontally moving the suction head and the ball pool when the suction head suctions the solder ball. Relative movement means for relatively moving in the direction , and the ball pool, from below
An apparatus for transferring solder balls, comprising blowing means for supplying gas to float the solder balls. 2. The solder ball transfer device according to claim 1, further comprising gas blowing means for intermittently blowing gas into said ball pool. 3. A step of blowing gas to a ball pool for storing a large number of solder balls to float the solder balls, and a step of lowering a suction head having suction holes for sucking the solder balls into the ball pool. And a step of moving the suction head relatively to the ball pool in the horizontal direction, and a step of lifting the suction head from the ball pool.